Additive for elargol diffusion preventing agent, prepared elargol diffusion preventing agent and preparation method of elargol diffusion preventing agent

Abstract

The invention provides an additive for an anti-elargol diffusion agent, the prepared anti-elargol diffusion agent and a preparation method, and relates to the field of metal surface treatment. The additive is prepared from 2-aminobenzothiazole, dibenzothiazyl disulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ) and vinyl sorbate according to the weight ratio of (3.5-5): 3.8: (4.3-5): 4.3: (2.6-4). The additive, a film-forming agent, a buffering agent, a wetting agent, a cosolvent, a dispersing agent, a complexing agent, deionized water and the like are jointly prepared into the elargol diffusion preventing agent. The preparation method is simple, the use is convenient, a layer of protective film can be formed on the surface of the silver-plated lead frame after the silver colloid diffusion preventing agent is added, the diffusion of the conductive silver colloid can be effectively prevented, and the anti-discoloration capability of the silver-plated lead frame can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of metal surfaces, and particularly relates to an additive for preventing silver glue diffusion, a prepared silver glue diffusion preventing agent and a preparation method thereof. Background Art

[0002] The lead frame is an important basic material in the electronic information industry. As the chip carrier of integrated circuits, the lead frame plays the role of a bridge connecting the chip and external components, is a key structural component for forming an electrical circuit, and has the functions of fixing the chip and protecting components. When electronic products are packaged, the function of the conductive silver glue is to bond the lead frame and the discrete device to form a conductive path, thereby realizing the interconnection between the lead frame and the discrete device and ensuring the solderability between the lead frame and the discrete device. Thus, the functional integrity and reliability during electronic packaging are ensured.

[0003] Conductive silver glue is an adhesive with conductive properties. It is composed of an epoxy resin matrix, conductive particles and some additives, and it has high electrical conductivity. Therefore, it is mainly used in places where current needs to be transmitted in electronic products to form a conductive path. Conductive silver glue has become an indispensable basic material in microelectronic packaging due to its characteristics such as environmental friendliness, simple process, easy operation, high resolution, and rapid curing at low temperature. It is widely used in fields such as liquid crystal displays (LCDs), light-emitting diodes (LEDs), packaging and bonding of ICs, printed circuit board assemblies (PCBAs), ceramic capacitors, dot matrix blocks, membrane switches, smart cards, etc.

[0004] However, when the conductive silver glue encapsulates the lead frame, the surface roughness of the silver-plated layer of the lead frame is too high, or the surface is contaminated by organic substances such as protective agents. In this case, the epoxy resin component in the conductive silver glue will diffuse along the substrate surface, forming white or yellow imprints (epoxy bleed out, abbreviated as EBO), which will lead to problems such as poor soldering, functional defects, and even soldering short circuits, and the consequences are very serious. Therefore, preventing the diffusion of conductive silver glue is very important for the electronic packaging process.

[0005] The silver glue diffusion preventing agent can effectively solve the above problems. Its function is that the protective layer formed on the substrate can effectively reduce the surface tension of the substrate, thereby effectively preventing the diffusion of conductive silver glue and achieving the purpose of improving the performance and reliability of the circuit board. Summary of the Invention

[0006] In order to improve the anti-diffusion effect of the silver glue diffusion preventing agent and the anti-discoloration effect of the substrate, the present invention provides an additive for preventing silver glue diffusion, a prepared silver glue diffusion preventing agent and a preparation method thereof, to prevent the diffusion of conductive silver glue and the discoloration of the substrate, and thereby ensure the reliability of electronic packaging.

[0007] The present invention is implemented as follows. An additive for preventing silver paste diffusion is composed of 2-aminobenzothiazole, dibenzothiazole disulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate, which are mixed in a weight ratio of (3.5 - 5):3.8:(4.3 - 5):4.3:(2.6 - 4).

[0008] A silver paste diffusion inhibitor, according to mass percentage, comprises the following components: a film-forming agent 0.7% - 1.5%, a buffer 0.3% - 1.5%, a wetting agent 1% - 2.5%, a co-solvent 2% - 3%, a dispersant 0.5% - 1.5%, the additive in Claim 1 0.5% - 3%, a complexing agent 0.1% - 1%, and the balance is deionized water.

[0009] The film-forming agent is one or more of A187, KH-550, KH-560, trimethylsiloxysilicate, acrylic resin, dimethylsiloxane copolymer, acrylate, ammonium octyl acrylate copolymer, polyvinyl alcohol (PVA), acrylic copolymer, polyvinyl acetate, polyacrylate emulsion, hyaluronic acid, polyglyceryl-2 isostearate, polyglyceryl-3 isostearate, and polydimethylsiloxane.

[0010] The buffer is one or more of tris-(hydroxymethyl)aminomethane, N,N-dihydroxyethylglycine, 3-(cyclohexylamine)-1-propanesulfonic acid, 3-morpholinopropanesulfonic acid, N-tris(hydroxymethyl)methyl-3-aminopropanesulfonic acid, N-(2-hydroxyethyl)piperazine-N'-3-propanesulfonic acid, 3-(N-morpholino)-2-hydroxypropanesulfonic acid, 4-hydroxyethylpiperazineethanesulfonic acid, and piperazine-N,N-bis(2-ethanesulfonic acid).

[0011] The wetting agent is one or more of OFX-0190, OFX-0193, polyether-modified silicone oil, ethanol, propylene glycol, glycerol, dimethyl sulfoxide, alkyl sulfates, sulfonates, fatty acid or fatty acid ester sulfates, carboxylic acid soaps, phosphate esters, polyoxyethylene alkylphenol ethers, polyoxyethylene fatty alcohol ethers, and polyoxyethylene polyoxypropylene block copolymers.

[0012] The co-solvent is one or more of p-aminobenzoic acid, dimethyl sulfoxide (DMSO), N,N-dimethylformamide (DMF), N-methylpyrrolidone (NMP), ethylene (2-chloroethyl) ether, bisphenol A polyoxyethylene ether, nonylphenol polyethylene ether, and 4-bromocatechol.

[0013] The dispersant is one or more of tetra - methyl ammonium bromide, sodium silicate, sodium tripolyphosphate, sodium hexametaphosphate, sodium pyrophosphate, tri - ethylhexyl phosphate, sodium dodecyl sulfate, methyl pentanol, cellulose derivatives, polyacrylamide, fatty acid polyethylene glycol ester, polyoxyethylene alkylphenol ether, sorbitan alkylate, polycarboxylate, poly(meth)acrylic acid derivatives, maleic anhydride copolymer.

[0014] The complexing agent is one or more of cyanide, hydroxide, citrate, pyrophosphate, thiosulfate, 1,10 - phenanthroline, citric acid, tartaric acid, oxalic acid, sulfosalicylic acid, triethanolamine, ethylene glycol bis(2 - aminoethyl ether) tetraacetic acid (EGTA), ethylenediamine tetrapropionic acid (EDTP), triethylenetetramine, ethylenediaminetetraacetic acid (EDTA), dimercaprol, sodium dimercaptopropanesulfonate, ammonium fluoride, 8 - hydroxyquinoline, potassium chromate, copper reagent, cyanide, acetylacetone.

[0015] The preparation method of the above silver paste diffusion inhibitor includes the following steps:

[0016] S1. Mix 2 - aminobenzothiazole, dibenzothiazole disulfide, polyvinylpyrrolidone, tert - butylhydroquinone (TBHQ), and vinyl acetate sorbate in a weight ratio of (3.5 - 5):3.8:(4.3 - 5):4.3:(2.6 - 4) to obtain an additive.

[0017] S2. Take a certain amount of deionized water, heat it to 100 °C, then add the film - forming agent, dispersant, complexing agent, and wetting agent, stirring while adding. After mixing evenly, let it stand to room temperature to obtain a solution.

[0018] S3. Add the additive, cosolvent, and buffer to the solution in sequence, stirring while adding. After dissolving evenly, make up the amount of deionized water to obtain the silver paste diffusion inhibitor.

[0019] The advantages and technical effects of the present invention are as follows:

[0020] (1) The silver paste diffusion inhibitor of the present invention can effectively prevent the diffusion of conductive silver paste and improve the anti - discoloration ability of the silver - plated lead frame.

[0021] (2) The silver paste diffusion inhibitor of the present invention forms a protective film on the surface of the lead frame by chemical adsorption, which can effectively prevent the oxidation rate of the lead frame and improve the corrosion resistance of the silver - plated layer, thereby enhancing the stability and durability of the silver - plated layer.

[0022] (3) The additive in the silver paste diffusion inhibitor of the present invention and the preparation method of the silver paste diffusion inhibitor are simple, convenient to use and environmentally friendly. Description of the Drawings

[0023] Figure 1is the metallographic morphology after curing with conductive silver paste on silver-plated copper sheets (a. without anti-silver paste diffusion treatment, b. with anti-silver paste diffusion treatment);

[0024] Figure 2 is the scanning electron microscope micro-surface morphology of silver-plated copper sheets after treatment with an anti-silver paste diffusing agent (a. scanning electron microscope at 300 times magnification, b. scanning electron microscope at 10.0k times magnification). Detailed implementation manners

[0025] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific implementation manners described herein are only used to explain the present invention and are not used to limit the present invention.

[0026] The additive in the anti-silver paste diffusing agent of the present invention, the additive in the anti-silver paste diffusing agent, is composed of 2-aminobenzothiazole, dibenzothiazole disulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate in a weight ratio of (3.5 - 5):3.8:(4.3 - 5):4.3:(2.6 - 4).

[0027] Among them, 2-aminobenzothiazole and dibenzothiazole disulfide have an enhancing effect on anti-silver paste diffusion; polyvinylpyrrolidone can increase the viscosity of the solvent, making the solvent in a uniform and stable suspension state or emulsion state; tert-butylhydroquinone (TBHQ) and vinyl sorbate can effectively prevent the photo-thermal decomposition and oxidative decomposition of the prepared solvent, etc., and improve the system stability of the anti-silver paste diffusing agent.

[0028] Another object of the present invention is to provide an anti-silver paste diffusing agent, which includes the following components by mass percentage: film-forming agent 0.7% - 1.5%, buffer 0.3% - 1.5%, wetting agent 1% - 2.5%, co-solvent 2% - 3%, dispersant 0.5% - 1.5%, additive 0.5% - 3%, complexing agent 0.1% - 1%, and the balance is deionized water.

[0029] Further, the film-forming agent includes one or more of A187 (γ-glycidyl / glyceryl etheroxypropyltrimethoxysilane), KH-550 (γ-aminopropyltriethoxysilane), KH-560 (γ-(2,3-epoxypropoxy)propyltrimethoxysilane), BTSE (1,2-bis(triethoxysilyl)ethane), trimethylsiloxysilicate, acrylic resin, dimethylsiloxane copolymer, acrylate, ammonium octyl acrylate copolymer, polyvinyl alcohol (PVA), acrylic copolymer, polyvinyl acetate, polyacrylate emulsion, hyaluronic acid, polyglycerol-2 isostearate, polyglycerol-3 isostearate, and polydimethylsiloxane.

[0030] Preferably, the film-forming agent is KH-550 (γ-aminopropyltriethoxysilane).

[0031] Further, the buffer is one or more of tris-(hydroxymethyl)aminomethane, N,N-dihydroxyethylglycine, 3-(cyclohexylamino)-1-propanesulfonic acid, 3-morpholinopropanesulfonic acid, N-tris(hydroxymethyl)methyl-3-aminopropanesulfonic acid, N-(2-hydroxyethyl)piperazine-N'-3-propanesulfonic acid, 3-(N-morpholino)-2-hydroxypropanesulfonic acid, 4-hydroxyethylpiperazineethanesulfonic acid, piperazine-N,N-bis(2-ethanesulfonic acid).

[0032] Preferably, the buffer is a mixture of tris-(hydroxymethyl)aminomethane and N,N-dihydroxyethylglycine in a weight ratio of 2:1.

[0033] Further, the wetting agent is one or more of OFX-0190 (organosilicon polyether copolymer), OFX-0193 (PEG12-polydimethylsiloxane), polyether-modified silicone oil, ethanol, propylene glycol, glycerol, dimethyl sulfoxide, alkyl sulfates, sulfonates, fatty acid or fatty acid ester sulfates, carboxylic acid soaps, phosphates, polyoxyethylene alkylphenol ethers, polyoxyethylene fatty alcohol ethers, polyoxyethylene-polyoxypropylene block copolymers.

[0034] Preferably, the wetting agent is a mixture of OFX-0193 and polyether-modified silicone oil in a weight ratio of 3:1.

[0035] Further, the co-solvent is one or more of p-aminobenzoic acid, dimethyl sulfoxide (DMSO), N,N-dimethylformamide (DMF), N-methylpyrrolidone (NMP), ethylene (2-chloroethyl) ether, bisphenol A polyoxyethylene ether, nonylphenol polyethylene ether, 4-bromocatechol.

[0036] Preferably, the co-solvent is p-aminobenzoic acid.

[0037] Further, the dispersant is one or more of tetramethylammonium bromide, water glass, sodium tripolyphosphate, sodium hexametaphosphate, sodium pyrophosphate, triethylhexyl phosphate, sodium dodecyl sulfate, methyl pentanol, cellulose derivatives, polyacrylamide, guar gum, fatty acid polyethylene glycol esters, polyoxyethylene alkylphenol ethers, sorbitan alkylates, polycarboxylates, poly(meth)acrylic acid derivatives, maleic anhydride copolymers.

[0038] Preferably, the dispersant is tetramethylammonium bromide.

[0039] Further, the complexing agent is one or more of cyanide, hydroxide, citrate, pyrophosphate, thiosulfate, 1,10-phenanthroline, citric acid, tartaric acid, oxalic acid, sulfosalicylic acid, triethanolamine, ethylene glycol bis(2-aminoethyl ether)-N,N,N',N'-tetraacetic acid (EGTA), ethylenediamine tetrapropionic acid (EDTP), triethylenetetramine, ethylenediaminetetraacetic acid (EDTA), dimercaprol, sodium dimercaptopropanesulfonate, ammonium fluoride, 8-hydroxyquinoline, potassium chromate, copper reagent, cyanide, acetylacetone.

[0040] Preferably, the complexing agent is a mixture of ethylenediaminetetraacetic acid (EDTA) and citrate in a weight ratio of 2.5:3.2.

[0041] The present invention also provides a method for preparing the anti-silver paste diffusing agent, comprising the following steps:

[0042] S1. Mix 2-aminobenzothiazole, dibenzothiazole disulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate in a weight ratio of (3.5 - 5):3.8:(4.3 - 5):4.3:(2.6 - 4) to obtain an additive, denoted as A;

[0043] S2. Take a certain amount of deionized water, heat it to 100°C, and then add film-forming agents, dispersants, complexing agents, wetting agents and other reagents while stirring. After mixing evenly, let it stand to room temperature, denoted as solution B;

[0044] S3. Add additive A, cosolvent, and buffer to solution B in sequence while stirring. After dissolving evenly, make up the amount of deionized water to obtain the anti-silver paste diffusing agent.

[0045] In the anti-silver paste diffusing agent of the present invention, A187 enhances the interaction force between the coating and the substrate, making the lead frame more wear-resistant, corrosion-resistant and durable. Tris(hydroxymethyl)aminomethane can adjust the pH value of the solvent to keep the solvent in a neutral state. The mixed solvent of OFX-0193 and polyether-modified silicone oil reduces the interfacial tension between the prepared solution and the surface of the silver-plated lead frame, thereby promoting the wetting process of the anti-silver paste diffusing agent on the lead frame. At the same time, tetramethylammonium bromide makes the reagent particles and powders disperse evenly in the solution to form a stable suspension, which has a solubilizing effect. p-Aminobenzoic acid can help other reagents dissolve fully, which has a solubilizing effect. Ethylenediaminetetraacetic acid (EDTA) and citrate can increase the stability of the silver paste and extend its service life.

[0046] By adding this anti-silver paste diffusing agent in the silver-plated lead frame process, the present invention can effectively solve the diffusion of conductive silver paste, prevent the substrate from discoloring, and ensure the reliability of electronic packaging.

[0047] The reagents and raw materials used in the present invention are all commercially available.

[0048] To better understand the technical solution of the present invention, the following describes the technology of the present invention in combination with specific embodiments.

[0049] Example 1

[0050] An anti-silver glue diffusing agent is composed of the following raw materials in weight percentages: additive 1%, film-forming agent 1%, wetting agent 2.5%, dispersant 1.2%, buffer 0.7%, cosolvent 2.5%, complexing agent 0.5%, and the rest is deionized water.

[0051] The film-forming agent is composed of KH-550 (γ-aminopropyltriethoxysilane).

[0052] The buffer is composed of (hydroxymethyl)aminomethane and N,N-dihydroxyethylglycine mixed in a weight ratio of 2:1.

[0053] The wetting agent is composed of OFX-0193 and polyether-modified silicone oil in a weight ratio of 3:1.

[0054] The cosolvent is composed of p-aminobenzoic acid.

[0055] The dispersant is composed of tetramethylammonium bromide.

[0056] The complexing agent is composed of ethylenediaminetetraacetic acid (EDTA) and citrate mixed in a weight ratio of 2.5:3.2.

[0057] The additive is composed of 2-aminobenzothiazole, dibenzothiazole disulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate in a weight ratio of 5:3.8:5:4.3:3.

[0058] The preparation method of the anti-silver glue diffusing agent is as follows:

[0059] S1. Mix 2-aminobenzothiazole, dibenzothiazole disulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate in a weight ratio of (3.5-5):3.8:(4.3-5):4.3:(2.6-4) to obtain an additive, denoted as A;

[0060] S2. Take a certain amount of deionized water, heat it to 100°C, add reagents such as film-forming agent, dispersant, complexing agent, and wetting agent, stir while adding, and let it stand to room temperature after mixing evenly, denoted as solution B;

[0061] S3. Add additive A, cosolvent, and buffer to solution B in sequence, stir while adding, and make up the amount of deionized water after dissolving evenly to obtain the anti-silver glue diffusing agent.

[0062] Comparative Example 1

[0063] Same as Example 1, except that: the additive is composed of 2-aminobenzothiazole, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate in a weight ratio of 5:4.3:4.3:3.

[0064] Comparative Example 2

[0065] Same as Example 1, except that: the additive is composed of 2-aminobenzothiazole and dibenzothiazyl disulfide in a weight ratio of 5:3.8.

[0066] Comparative Example 3

[0067] Same as Example 1, except that: the additive is composed of 2-aminobenzothiazole, dibenzothiazyl disulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate in a weight ratio of 5:3.8:5:4:2.

[0068] Comparative Example 4

[0069] Same as Example 1, except that: the additive is composed of 2-aminobenzothiazole, dibenzothiazyl disulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate in a weight ratio of 3:2:5:4.3:3.

[0070] Comparative Example 5

[0071] Same as Example 1, except that: the additive is composed of 2-aminobenzothiazole, dibenzothiazyl disulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate in a weight ratio of 4:3.8:5:4.3:4.

[0072] Comparative Example 6

[0073] The difference between Comparative Example 6 and Example 1 is that the additive does not contain azoles, and the additive is composed of tert-butyl disulfide, allyl propyl trisulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and sorbyl polyvinyl ester in a ratio of 5:3.8:5:4.3:3.

[0074] Test Example 1

[0075] The surface of a copper sheet was silver-plated, and then it was immersed in the solutions of the examples and comparative examples for 20 min respectively, then rinsed with deionized water and dried with nitrogen. After drying, the sample pieces were placed in a thermostatic and humidistatic chamber with the temperature set at 150 °C, the humidity set at 80%, and the time set at 15 min. After 15 min, they were taken out and placed at room temperature, and the color difference was measured and the surface changes of the silver-plated copper sheets were observed after 12 h. Among them, a control group was set up with the same operation steps as above. The results are as follows:

[0076]

[0077] As can be seen from the above, when the ratio of 2-aminobenzothiazole, dibenzothiazole disulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate in the additive is 5:3.8:5:4.3:3, the anti-discoloration performance of the silver paste can be effectively enhanced.

[0078] Meanwhile, in some embodiments, the weight ratio of 2-aminobenzothiazole, dibenzothiazole disulfide, polyvinylpyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate in the additive is between (3.5 - 5):3.8:(4.3 - 5):4.3:(2.6 - 4), and the effect is the same as that of Example 1.

[0079] Moreover, the surface appearance of the silver-plated copper sheet after being soaked in the anti-silver paste diffusing agent of the present invention has no obvious change. Compared with the control group and Comparative Example 6, the surface color difference change range of the silver-plated copper sheets in the examples and the other comparative examples is smaller. This shows that the anti-silver paste diffusing agent of the present invention can effectively prevent the silver sheet from oxidizing and discoloring.

[0080] Test Example 2

[0081] The metallographic microscope morphologies of the control group and the experimental group are as Figure 1 shown. Uneven diffusion phenomenon appears at the contact edge between the conductive silver paste and the silver layer on the silver-plated copper sheet without being treated with the anti-silver paste diffusing agent; the contact edge between the conductive silver paste and the silver layer on the silver-plated copper sheet after being treated with the anti-silver paste diffusion treatment is smooth, and no exudation or diffusion phenomenon appears. The results show that the anti-silver paste diffusing agent of the present invention effectively inhibits the diffusion of the conductive silver paste.

[0082] Furthermore, the surface morphologies of the silver-plated copper sheet before and after being treated with the anti-silver paste diffusing agent are tested by a scanning electron microscope, as Figure 2 shown. It can be seen that at different magnifications, there is no obvious corrosion on the surface of the silver-plated copper sheet after being treated with the anti-silver paste diffusing agent, indicating that the anti-silver paste diffusing agent can enhance the corrosion resistance and stability of the substrate.

[0083] The silver-plated copper sheet treated with the anti-silver paste diffusing agent of the present invention can reduce the phenomenon of surface oxidation and yellowing, and can also effectively prevent the diffusion of the conductive silver paste.

[0084] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An additive for silver paste diffusion prevention agent, characterized in that: The invention is prepared by mixing 2-aminobenzothiazole, dibenzothiazole disulfide, polyvinyl pyrrolidone, tert-butylhydroquinone TBHQ and vinyl sorbate in a weight ratio of (3.5-5):3.8:(4.3-5):4.3:(2.6-4).

2. A silver glue diffusion prevention agent, characterized in that: The anti-silver glue diffusion agent includes the following components in terms of mass percentage: 0.7% to 1.5% of a film former, 0.3% to 1.5% of a buffer, 1% to 2.5% of a wetting agent, 2% to 3% of a cosolvent, 0.5% to 1.5% of a dispersant, 0.5% to 3% of the additive in claim 1, 0.1% to 1% of a complexing agent, and the remainder is deionized water.

3. The anti-silver glue diffusion agent according to claim 2, characterized in that: The film-forming agent is one or more of A187, KH-550, KH-560, trimethylsiloxysilicate, acrylic resin, dimethylsiloxane copolymer, acrylate, octyl ammonium acrylate copolymer, polyvinyl alcohol PVA, acrylic acid copolymer, polyvinyl acetate, polyacrylate emulsion, hyaluronic acid, polyglyceryl-2 isostearate, polyglyceryl-3 isostearate, and polydimethylsiloxane.

4. The anti-silver glue diffusion agent according to claim 2, characterized in that: The buffer is one or more of tris-(hydroxymethyl)aminomethane, N,N-dihydroxyethylglycine, 3-(cyclohexylamine)-1-propanesulfonic acid, 3-morpholinepropanesulfonic acid, N-tris(hydroxymethyl)methyl-3-aminopropanesulfonic acid, N-(2-hydroxyethyl)piperazine-N'-3-propanesulfonic acid, 3-(N-morpholinyl)-2-hydroxypropanesulfonic acid, 4-hydroxyethylpiperazineethanesulfonic acid, and piperazine-N,N-di(2-ethanesulfonic acid).

5. The anti-silver glue diffusion agent according to claim 2, characterized in that: The wetting agent is one or more of OFX-0190, OFX-0193, polyether modified silicone oil, ethanol, propylene glycol, glycerol, dimethyl sulfoxide, alkyl sulfates, sulfonates, fatty acids or fatty acid ester sulfates, carboxylic acid soaps, phosphates, polyoxyethylene alkylphenol ethers, polyoxyethylene fatty alcohol ethers, and polyoxyethylene polyoxypropylene block copolymers.

6. The anti-silver glue diffusion agent according to claim 2, characterized in that: The cosolvent is one or more of p-aminobenzoic acid, dimethyl sulfoxide (DMSO), N,N-dimethylformamide (DMF), N-methylpyrrolidone (NMP), ethylene (2-chloroethyl) ether, bisphenol A polyoxyethylene ether, nonylphenol polyethylene ether, and 4-bromocatechol.

7. The anti-silver colloid dispersant according to claim 2, characterized in that: The dispersant is one or more of tetramethylammonium bromide, water glass and sodium tripolyphosphate, sodium hexametaphosphate and sodium pyrophosphate, triethylhexyl phosphoric acid, sodium dodecyl sulfate, methyl amyl alcohol, cellulose derivatives, polyacrylamide, fatty acid polyethylene glycol esters, polyoxyethylene alkylphenol ethers, sorbitol alkylates, polycarboxylates, poly(meth)acrylic acid derivatives, and maleic anhydride copolymers.

8. The anti-silver glue diffusion agent according to claim 2, characterized in that: The complexing agent is one or more of cyanide, hydroxide, citrate, pyrophosphate, thiosulfate, 1,10-phenanthroline, citric acid, tartaric acid, oxalic acid, sulfosalicylic acid, triethanolamine, ethylene glycol diethylaminetetraacetic acid EGTA, ethylenediaminetetrapropionic acid EDTP, triethylenetetraamine, ethylenediaminetetraacetic acid EDTA, dimercaptopropanol, sodium dimercaptopropane sulfonate, ammonium fluoride, 8-hydroxyquinoline, potassium chromate, copper reagent, cyanide, and acetylacetone.

9. The method for preparing the silver paste diffusion preventing agent according to any one of claims 2 to 8, characterized in that: The following steps are involved: S1. Mix 2-aminobenzothiazole, dibenzothiazole disulfide, polyvinyl pyrrolidone, tert-butylhydroquinone (TBHQ), and vinyl sorbate in a weight ratio of (3.5-5):3.8:(4.3-5):4.3:(2.6-4) to obtain an additive; S2. Take a certain amount of deionized water, raise the temperature to 100°C, add film-forming agent, dispersant, complexing agent, and wetting agent, stir while adding, and let stand at room temperature after mixing evenly to obtain a solution; S3. Add additives, co-solvents, and buffers to the solution in sequence, stirring while adding, and after uniform dissolution, add enough deionized water to obtain a silver glue diffusion prevention agent.

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