Loop heat pipe and electronic equipment

Abstract

The invention provides a loop heat pipe and electronic equipment, relates to the technical field of electronic equipment, and aims at solving the problems that an existing loop heat pipe is long in starting time and low in response speed. The loop heat pipe comprises a shell and a first wick. Wherein an evaporation cavity, a plurality of condensation cavities and a plurality of circulation channels are formed in the shell, the first wick is arranged in the evaporation cavity, each circulation channel is provided with one condensation cavity, and each condensation cavity communicates with the evaporation cavity through the corresponding circulation channel, so that each circulation channel can conduct evaporation condensation circulation. According to the loop heat pipe, on the premise that the size is not changed, the path length of each evaporation and condensation circulation is shortened (equivalently, the length of each circulation channel is shortened), steam can rapidly reach the condensation cavity to be condensed, a liquid working medium obtained through condensation can rapidly flow back into the evaporation cavity, and the evaporation efficiency is improved. Therefore, the starting response speed of the loop heat pipe is accelerated.

Description

Technical Field

[0001] Embodiments of the present application relate to the technical field of electronic devices, and in particular, to a loop heat pipe and an electronic device. Background Art

[0002] With the continuous development of electronic devices (such as mobile phones), people's performance requirements for electronic devices have increased year by year, and the heat generation of some components inside the electronic devices has also been continuously increasing. Therefore, a loop heat pipe is provided inside the electronic device to dissipate heat from components with relatively large heat generation.

[0003] However, the existing loop heat pipe has a long startup time and a slow response speed, resulting in poor heat dissipation effect for the components inside the electronic device. Summary of the Invention

[0004] Embodiments of the present application provide a loop heat pipe and an electronic device, which are used to solve the problems of the existing loop heat pipe having a long startup time and a slow response speed.

[0005] To achieve the above object, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, embodiments of the present application provide a loop heat pipe, which includes a housing and a first wick.

[0007] Wherein, an evaporation chamber, a plurality of condensation chambers and a plurality of circulation channels are formed inside the housing, the first wick is disposed in the evaporation chamber, each circulation channel has a condensation chamber, and each condensation chamber is communicated with the evaporation chamber through the corresponding circulation channel, so that each circulation channel can perform an evaporation-condensation cycle.

[0008] The loop heat pipe provided in the first aspect of the present application forms a plurality of evaporation-condensation cycles in the loop heat pipe by forming a plurality of circulation channels communicated with the evaporation chamber inside the housing and disposing a condensation chamber on each circulation channel. On the premise that the size of the loop heat pipe remains unchanged, it is equivalent to shortening the path length of each evaporation-condensation cycle (equivalent to shortening the length of each circulation channel), so that the vapor flow resistance and the liquid flow resistance of each cycle are both reduced. And because a plurality of circulation channels share one evaporation chamber, when the steam pressure in the evaporation chamber remains unchanged, the steam can quickly reach the condensation chamber for condensation, and the condensed liquid working medium can also quickly flow back to the evaporation chamber, thereby accelerating the startup response speed of the loop heat pipe and improving the circulation heat dissipation efficiency of the loop heat pipe.

[0009] In combination with the first aspect, in a possible implementation, a common channel is further formed inside the housing. The first end of the common channel is communicated with the outlet of the evaporation chamber, and the second end of the common channel is communicated with one end of at least two of the plurality of circulation channels. The other end of the circulation channel is communicated with the inlet of the evaporation chamber. In this way, the steam in the evaporation chamber will first enter the common channel and then be diverted from the common channel to different circulation channels. There is no need to provide a corresponding outlet for each circulation channel on the evaporation chamber, which simplifies the structure of the loop heat pipe and can reduce the production and processing costs.

[0010] In combination with the first aspect, in another possible implementation, the circulation channel includes a vapor phase channel and a liquid phase channel. The first end of the vapor phase channel is communicated with the second end of the common channel, and the second end of the vapor phase channel is communicated with the inlet of the condensation chamber. The first end of the liquid phase channel is communicated with the outlet of the condensation chamber, and the second end of the liquid phase channel is communicated with the inlet of the evaporation chamber. In this way, the steam first flows into the condensation chamber through the common channel and the vapor phase channel in sequence for condensation, and the liquid working medium obtained after condensation then flows back to the evaporation chamber through the liquid phase channel.

[0011] In combination with the first aspect, in another possible implementation, the plurality of circulation channels include a first circulation channel and a second circulation channel, and the plurality of condensation chambers include a first condensation chamber and a second condensation chamber. Among them, the first circulation channel includes a first vapor phase channel and a first liquid phase channel. The first vapor phase channel is communicated between the common channel and the first condensation chamber, and the first liquid phase channel is communicated between the first condensation chamber and the evaporation chamber. The second circulation channel includes a second vapor phase channel and a second liquid phase channel. The second vapor phase channel is communicated between the common channel and the second condensation chamber, and the second liquid phase channel is communicated between the second condensation chamber and the evaporation chamber.

[0012] In this way, two evaporation-condensation cycles are formed in the above loop heat pipe. On the premise that the size of the loop heat pipe remains unchanged, the lengths of the first circulation channel and the second circulation channel are both shorter, so that the vapor flow resistance and the liquid flow resistance in the first circulation channel and the second circulation channel are both reduced. At the same time, since the first circulation channel and the second circulation channel share an evaporation chamber, when the steam pressure in the evaporation chamber remains unchanged, the steam can quickly reach the first condensation chamber and the second condensation chamber for condensation, and the liquid working medium formed by condensation can also quickly flow back to the evaporation chamber (that is, the circulation rate of the working medium in the loop heat pipe is faster), thereby accelerating the start-up response speed of the loop heat pipe and improving the circulation heat dissipation efficiency of the loop heat pipe.

[0013] In combination with the first aspect, in another possible implementation, the evaporation chamber has a first inlet and a second inlet. The first liquid phase channel is communicated with the first inlet, the second liquid phase channel is communicated with the second inlet, and the first inlet and the second inlet are respectively located on both sides of the common channel.

[0014] In combination with the first aspect, in another possible implementation, the first circulation channel and the second circulation channel are respectively arranged on both sides of the common channel. Since the steam releases heat when condensing in the condensation chamber, the heat diffuses outward through the side wall (i.e., the shell) of the condensation chamber, and therefore, the first circulation channel and the second circulation channel are respectively arranged on both sides of the common channel, so as to increase the distance between the first condensation chamber and the second condensation chamber, thereby reducing the influence of the first condensation chamber and the second condensation chamber on each other when dissipating heat outward.

[0015] In combination with the first aspect, in another possible implementation, a first liquid wick is provided at both the first inlet and the second inlet of the evaporation chamber. In this way, on the one hand, the two first liquid wicks can cover the first inlet and the second inlet of the evaporation chamber respectively, thereby preventing the steam in the evaporation chamber from flowing reversely from the first inlet to the first liquid phase channel and from the second inlet to the second liquid phase channel, thereby preventing the reflux of the liquid working medium and thereby reducing the risk of dry burning of the first liquid wick. On the other hand, after the liquid working medium in the liquid phase channel flows back to the evaporation chamber, it can be immediately replenished to the first liquid wick to participate in the next round of evaporation and condensation cycle.

[0016] In combination with the first aspect, in another possible implementation, the loop heat pipe further includes a second liquid wick, which is disposed between the two first liquid wicks, and the second liquid wick is connected to the two first liquid wicks. With this arrangement, when the two first liquid wicks are heated unevenly, that is, one of the first liquid wicks has a higher temperature than the other first liquid wick and generates more steam, the liquid working medium in the two first liquid wicks can be adjusted through the second liquid wick, that is, part of the liquid working medium in the first liquid wick with a lower temperature can be supplemented to the first liquid wick with a higher temperature through the second liquid wick, thereby preventing dry burning caused by the lack of liquid working medium in the first liquid wick with a higher temperature.

[0017] In combination with the first aspect, in another possible implementation, along the thickness direction of the loop heat pipe, the thickness of the second wick is less than the thickness of the first wick. This arrangement can prevent the second wick from obstructing the flow of steam in the evaporation chamber.

[0018] In combination with the first aspect, in another possible implementation, the multiple circulation channels include two third circulation channels and two fourth circulation channels, and two common channels are provided, namely a first common channel and a second common channel, and the first ends of the first common channel and the second common channel are both connected to the outlet of the evaporation chamber.

[0019] One ends of the two third circulation channels are both communicated with the second end of the first common channel, and the other ends of the two third circulation channels are both communicated with the inlet of the evaporation chamber.

[0020] One end of each of the two fourth circulation channels communicates with the second end of the second common channel, and the other end of each of the two fourth circulation channels communicates with the inlet of the evaporation chamber.

[0021] In this way, four evaporation-condensation cycles are formed in the above loop heat pipe. On the premise that the size of the loop heat pipe remains unchanged, the lengths of the third circulation channel and the fourth circulation channel are shorter, further reducing the vapor flow resistance and liquid flow resistance in the third circulation channel and the fourth circulation channel. At the same time, since two third circulation channels and two fourth circulation channels share one evaporation chamber, when the steam pressure in the evaporation chamber remains unchanged, the steam can quickly reach the condensation chamber for condensation, and the liquid working medium formed by condensation can also quickly flow back to the evaporation chamber (that is, the circulation rate of the working medium in the loop heat pipe is faster), thereby accelerating the start-up response speed of the loop heat pipe and improving the circulation heat dissipation efficiency of the loop heat pipe.

[0022] Combined with the first aspect, in another possible implementation, the two third circulation channels are distributed on both sides of the first common channel, and the two fourth circulation channels are distributed on both sides of the second common channel.

[0023] Combined with the first aspect, in another possible implementation, the first wick includes a first part and a second part. The first part covers the inlet of the evaporation chamber, and the second part is disposed on the surface of the first part away from the inlet of the evaporation chamber and extends in a direction away from the first part. With this setting, it is possible to prevent steam from flowing reversely from the inlet of the evaporation chamber into the circulation channel and hindering the reflux of the liquid working medium, and thus the risk of dry burning of the first wick can be reduced.

[0024] Combined with the first aspect, in another possible implementation, there are multiple second parts, and the multiple second parts are spaced apart. In this way, it is equivalent to increasing the evaporation surface area of the first wick, so that more bubbles can be generated on the first wick per unit time at the same temperature. After the bubbles burst, steam is formed, which can take away more heat from the first wick.

[0025] Combined with the first aspect, in another possible implementation, the first wick abuts inside the evaporation chamber between the two inner walls distributed in the thickness direction of the loop heat pipe. In this way, the first wick can support the evaporation chamber, and to a certain extent, it can prevent the evaporation chamber from collapsing when the loop heat pipe is squeezed or impacted.

[0026] In combination with the first aspect, in another possible implementation, the first wick further includes a third part, which is disposed on the surface of the first part facing the inlet of the evaporation chamber and extends into the circulation channel. With this arrangement, when the liquid working medium in the circulation channel enters the third part of the first wick, it will quickly return to the first part in the evaporation chamber under the action of the capillary force in the third part, thereby improving the evaporation-condensation cycle efficiency and shortening the startup time of the above loop heat pipe.

[0027] In combination with the first aspect, in another possible implementation, the loop heat pipe further includes a plurality of support members, which are spaced apart along the extension direction of the circulation channel and abut against the inner wall of the circulation channel between the two inner walls distributed in the thickness direction of the loop heat pipe. In this way, by supporting the circulation channel with a plurality of support members, when the above loop heat pipe is squeezed or impacted, etc., it can prevent the circulation channel from collapsing to a certain extent.

[0028] In the second aspect, the present application provides an electronic device, which includes:

[0029] A heating element and the loop heat pipe provided in the first aspect of the present application.

[0030] Wherein, the loop heat pipe is attached to the heating element, and the first wick of the loop heat pipe is filled with a liquid working medium.

[0031] It can be understood that for the beneficial effects that can be achieved by the electronic device described in the above-provided second aspect and any of its possible implementation manners, reference can be made to the beneficial effects in the first aspect and any of its possible implementation manners, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic structural diagram (open state) of the electronic device 01 provided by an embodiment of the present application;

[0033] Figure 2 It is a schematic structural diagram (folded state) of the electronic device 01 provided by an embodiment of the present application;

[0034] Figure 3 For Figure 1 It is a schematic connection diagram of the heating element of the electronic device in [reference] and the loop heat pipe in the related art;

[0035] Figure 4 It is a cross-sectional view of the internal structure of the loop heat pipe in the related art;

[0036] Figure 5 It is a schematic overall structure diagram of a loop heat pipe provided by an embodiment of the present application;

[0037] Figure 6 For Figure 5Explosion schematic diagram of the structure of the middle loop heat pipe;

[0038] Figure 7 For Figure 5 Internal structure sectional view of the middle loop heat pipe;

[0039] Figure 8 Another internal structure sectional view of the loop heat pipe provided by the embodiment of the present application;

[0040] Figure 9 Another explosion schematic diagram of the structure of the loop heat pipe provided by the embodiment of the present application;

[0041] Figure 10 For Figure 9 Internal structure sectional view of the middle loop heat pipe;

[0042] Figure 11 Another internal structure sectional view of the loop heat pipe provided by the embodiment of the present application;

[0043] Figure 12 Overall structure schematic diagram of a first wick provided by the embodiment of the present application;

[0044] Figure 13 Another overall structure schematic diagram of a first wick provided by the embodiment of the present application;

[0045] Figure 14 Another explosion schematic diagram of the structure of the loop heat pipe provided by the embodiment of the present application;

[0046] Figure 15 For Figure 14 Internal structure sectional view of the middle loop heat pipe;

[0047] Figure 16 For Figure 15 Cross-sectional view at B-B in the middle;

[0048] Figure 17 Another internal structure sectional view of the loop heat pipe provided by the embodiment of the present application;

[0049] Figure 18 Another internal structure sectional view of the loop heat pipe provided by the embodiment of the present application;

[0050] Figure 19 Another explosion schematic diagram of the structure of the loop heat pipe provided by the embodiment of the present application;

[0051] Figure 20 For Figure 19 Internal structure sectional view of the middle loop heat pipe;

[0052] Figure 21 For Figure 20 Cross-sectional view at C-C in the middle;

[0053] Figure 22 This is a schematic diagram of the overall structure of a second wick provided by an embodiment of the present application;

[0054] Figure 23 This is a schematic diagram of the overall structure of another second wick provided by an embodiment of the present application;

[0055] Figure 24 This is a schematic diagram of the internal structure of another loop heat pipe provided by an embodiment of the present application.

[0056] Reference numerals:

[0057] 01, electronic device; 10, display part; 11, upper cover; 12, display screen; 20, keyboard part; 21, keyboard; 22, upper shell; 23, bottom shell; 30, heating element; 40, loop heat pipe in the related art; 41, outer shell; 411, accommodating cavity; 412, condensation channel; 42, wick; 50, loop heat pipe; 51, housing; 511, base; 512, top cover; 52, evaporation cavity; 521, first inner wall; 522, second inner wall; 523, third inner wall; 524, fourth inner wall; 52a, first outlet; 52b, second outlet; 52c, third outlet; 52d, fourth outlet; 52e, first inlet; 52f, second inlet; 52g, fifth outlet; 52h, sixth outlet; 5201, first sub-cavity; 5202, second sub-cavity; 5203, steam storage cavity; 53, condensation cavity; 531, first condensation cavity; 532, second condensation cavity; 533, third condensation cavity; 534, fourth condensation cavity; 541, first common channel; 542, second common channel; 543, third common channel; 55, circulation channel; 551, first circulation channel; 551a, first vapor channel; 551b, first liquid channel; 552, second circulation channel; 552a, second vapor channel; 552b, second liquid channel; 553, third circulation channel; 553a, third vapor channel; 553b, third liquid channel; 554, fourth circulation channel; 554a, fourth vapor channel; 554b, fourth liquid channel; 56, first wick; 561, first part; 562, second part; 563, third part; 57, second wick; 58, support member; 59, steam channel; 60, hinge assembly. Detailed implementation manners

[0058] In order to make the objectives, technical solutions and advantages of the application more clear and understandable, the following further elaborates on the present application in conjunction with embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0059] In the description of the present application, it should be clear that the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "upper", "lower", "horizontal", etc. indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application, rather than meaning that the indicated devices or elements must have a specific orientation or position. Therefore, it should not be construed as a limitation to the present application. The "quantity" should also not be construed as a limitation to the present application.

[0060] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0061] An embodiment of the present application provides an electronic device 01. Specifically, the electronic device 01 can be a portable electronic device or other types of electronic devices. For example, the electronic device 01 can be a laptop computer, a tablet computer, a mobile phone, a wearable device, etc. For the convenience of description below, the example of the electronic device 01 being a laptop computer is used for illustration.

[0062] Please refer to Figure 1 and Figure 2 as shown in Figure 1 FIG. 15 is a schematic structural diagram (open state) of the electronic device 01 provided by an embodiment of the present application, Figure 2 FIG. 17 is a schematic structural diagram (folded state) of the electronic device 01 provided by an embodiment of the present application. As can be seen from the above, in this embodiment, the electronic device 01 is a laptop computer, and the electronic device 01 can have an approximately rectangular plate-like structure. The electronic device 01 can include a display part 10, a hinge assembly 60, a keyboard part 20, and electronic components.

[0063] It can be understood that Figure 1 and Figure 2 only schematically show some components included in the electronic device 01, and the actual shapes, actual sizes, actual positions, and actual structures of these components are not limited by Figure 1 and Figure 2 .

[0064] The above display portion 10 is used to display images, videos, etc. The display portion 10 may include an upper cover 11 and a display screen 12 (English name: panel, also known as a display panel). The display screen 12 is fixed to the upper cover 11. For example, the display screen 12 can be fixed to the upper cover 11 by means of adhesion, snap connection, etc. And the display screen 12 is disposed on one side of the upper cover 11 close to the keyboard portion 20. The upper cover 11 can be made of a metal material (such as aluminum alloy) or a plastic material. Therefore, the present application does not specifically limit the material of the upper cover 11.

[0065] In addition, the above display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0066] The above hinge assembly 60 is used to connect the above display portion 10 and the keyboard portion 20 so that they can rotate relative to each other, thereby realizing the conversion of the electronic device 01 between the folded state and the opened state. When the electronic device 01 is in the folded state (such as Figure 2 the state shown), the display portion 10 and the keyboard portion 20 are buckled with each other, the display screen 12 and the keyboard 21 are disposed opposite to each other, and both the display screen 12 and the keyboard 21 are located between the upper cover 11 and the bottom case 23, so as to effectively protect the display screen 12 and the keyboard 21. In this state, the electronic device 01 forms an approximate plate-like structure, which is convenient to carry.

[0067] The above-mentioned keyboard part 20 is used to edit or perform other operations on the content displayed on the display screen 12. The keyboard part 20 may include a keyboard 21, an upper shell 22, and a bottom shell 23. The keyboard 21 is fixed on the upper shell 22, and the upper shell 22 and the bottom shell 23 are fixedly connected. For example, the upper shell 22 and the bottom shell 23 can be fixed by means such as adhesion, snap connection, screw connection, and welding. A receiving space is formed between the upper shell 22 and the bottom shell 23, and some of the above-mentioned electronic devices are located in this receiving cavity.

[0068] Electronic devices such as a main board, a graphics card, a memory, a CPU (Central Processing Unit), a graphics processing unit (GPU), and a universal flash storage (UFS) are arranged in this receiving space.

[0069] Moreover, the above-mentioned keyboard 21 is electrically connected to the main board, and the display screen 12 and the main board are electrically connected through a flexible connecting member (not shown in the figure), for example, an FPC board (Flexible Printed Circuit), so that the content displayed on the display screen 12 can be edited through the keyboard 21.

[0070] Among them, some of the above-mentioned electronic devices generate heat during operation. These electronic devices that can generate heat can also be called heating elements, and are all called heating elements 30 in the following embodiments. To reduce the risk of damage to the heating element 30 due to heating, the above-mentioned electronic device may further include a loop heat pipe. The loop heat pipe is arranged in the above-mentioned receiving cavity and is attached to the heating element 30. The loop heat pipe is used to dissipate heat from the heating element 30 and lower the temperature.

[0071] Among them, for the convenience of the following description, an XYZ coordinate system is established. The width direction of the loop heat pipe is defined as the X-axis direction, the length direction of the loop heat pipe is defined as the Y-axis direction, and the thickness direction of the loop heat pipe is defined as the Z-axis direction. Among them, the thickness direction of the loop heat pipe is the thickness direction of the above-mentioned electronic device. The length direction of the loop heat pipe can be the length direction of the electronic device, and the width direction of the loop heat pipe is the width direction of the electronic device; or the width direction of the loop heat pipe can be the length direction of the electronic device, and the length direction of the loop heat pipe is the width direction of the electronic device. Therefore, this application does not make special limitations in this regard.

[0072] Please refer to Figure 3 and Figure 4 , Figure 3 For the above Figure 1 is a schematic connection diagram of the heating element 30 of the electronic device 01 and the loop heat pipe 40 in the related art, Figure 4 For Figure 3The figure shows a cross-sectional view of the internal structure of the related-art loop heat pipe 40 (parallel to the XY plane).

[0073] Specifically, the related-art loop heat pipe 40 may include a housing 41 and a wick 42. An accommodation cavity 411 and a condensation channel 412 are formed inside the housing 41. The inlet and outlet of the accommodation cavity 411 are respectively arranged at its opposite ends. One end of the condensation channel 412 communicates with the outlet of the accommodation cavity 411, and the other end of the condensation channel 412 communicates with the inlet of the accommodation cavity 411. The wick 42 is arranged in the accommodation cavity 411, and the wick 42 is filled with a liquid working medium. At least a partial area of the vertical projection of the heating element 30 in the XY plane overlaps with the wick 42, that is, the heating element 30 is attached to the position on the housing 41 corresponding to the wick 42.

[0074] When the related-art loop heat pipe 40 is heated, the liquid working medium in the wick 42 rapidly vaporizes to form steam. The steam flows out of the outlet of the accommodation cavity 411 and enters the condensation channel 412 under the drive of heat diffusion, and then gradually condenses into a liquid and releases heat during the process of flowing along the condensation channel 412. The heat diffuses to the outside through the housing 41. The liquid working medium in the condensation channel 412 then returns to the wick 42 in the accommodation cavity 411 by the steam pressure. Such a cycle can effectively dissipate heat and cool down the heating element 30.

[0075] However, only one evaporation-condensation cycle can be formed in the related-art loop heat pipe 40 ( Figure 4 The dotted arrow in the figure is the circulation direction of the working medium). The efficiency of cyclic heat dissipation is relatively low. Moreover, in order to condense the steam as much as possible, the condensation channel 412 in the related-art loop heat pipe 40 is set to be relatively long. After the steam pressure is lost along the way through the condensation channel 412, only a small amount can provide the circulation power for the condensed liquid working medium, resulting in a relatively long establishment time for the entire cycle, that is, the start-up time of the related-art loop heat pipe 40 is relatively long and the response speed is slow, thus causing poor heat dissipation effect.

[0076] To solve the above problems, an embodiment of the present application provides a loop heat pipe 50. Refer to Figure 5 and Figure 6 as shown. Figure 5 The figure shows a schematic diagram of the overall structure of a loop heat pipe 50 provided by an embodiment of the present application. Figure 6 is Figure 5 a schematic exploded view of the structure of the loop heat pipe 50 in the figure. Wherein, the loop heat pipe 50 may include a housing 51 and a first wick 56. An evaporation cavity 52, a plurality of condensation cavities 53 and a plurality of circulation channels 55 are formed inside the housing 51. The first wick 56 is arranged in the evaporation cavity 52.

[0077] In some embodiments, the above-mentioned housing 51 may include a top cover 512 and a base 511. The top cover 512 and the base 511 are snap-fitted to form the above-mentioned evaporation chamber 52, condensation chamber 53, and circulation channel 55. In this way, the structure of the housing 51 is relatively simple, facilitating production and processing and reducing costs.

[0078] The material of the housing 51 can be a metal with a relatively high thermal conductivity and structural strength, such as copper or stainless steel. The top cover 512 and the base 511 can be connected by laser welding, arc welding, or other welding methods.

[0079] On this basis, each of the above-mentioned circulation channels 55 has a condensation chamber 53, and each condensation chamber 53 is communicated with the evaporation chamber 52 through the corresponding circulation channel 55 (equivalent to both ends of each circulation channel 55 being communicated with the evaporation chamber 52 respectively), so that each circulation channel 55 can carry out an evaporation-condensation cycle.

[0080] In this way, multiple evaporation-condensation cycles can be formed in the loop heat pipe 50. On the premise that the size of the loop heat pipe 50 remains unchanged, it is equivalent to shortening the path length of each evaporation-condensation cycle (equivalent to shortening the length of each circulation channel 55), enabling the steam to quickly reach the condensation chamber 53 for condensation, and the condensed liquid working medium can also quickly flow back to the evaporation chamber 52, thereby accelerating the start-up response speed of the loop heat pipe 50 and improving the circulation heat dissipation efficiency of the loop heat pipe 50.

[0081] It should be noted that the outlet of the evaporation chamber 52 can be one or multiple, as long as each outlet of the evaporation chamber 52 can be communicated with at least one circulation channel 55. Similarly, the inlet of the evaporation chamber 52 can be one or multiple, as long as each inlet of the evaporation chamber 52 can be communicated with at least one circulation channel 55.

[0082] The shape of the evaporation chamber 52 can be a regular shape such as a cuboid, prism, cylinder, or other irregular shapes. This application does not make special limitations on this.

[0083] In addition, this application does not make special limitations on the positions of the respective circulation channels 55 relative to the evaporation chamber 52. For example, multiple circulation channels 55 can be located on the same side of the evaporation chamber 52, symmetrically distributed on both sides of the evaporation chamber 52, or spaced around the evaporation chamber 52.

[0084] The lengths and structures of multiple circulation channels 55 in the same loop heat pipe 50 can be the same or different, and those skilled in the art can reasonably set them according to the actual scenario. The following are all examples given on the premise that the lengths of multiple circulation channels 55 in the same loop heat pipe 50 are the same and the structures are consistent.

[0085] The circulation channel 55 may include a vapor-phase channel and a liquid-phase channel. The first end of the vapor-phase channel communicates with the outlet of the evaporation chamber 52, and the second end of the vapor-phase channel communicates with the inlet of the condensation chamber 53. The first end of the liquid-phase channel communicates with the outlet of the condensation chamber 53, and the second end of the liquid-phase channel communicates with the inlet of the evaporation chamber 52.

[0086] Among them, the vapor-phase channel is mainly for the circulation of steam, and the liquid-phase channel is mainly for the circulation of the liquid working medium formed in the condensation chamber 53. It can be understood that there may still be some unevaporated liquid working medium in the vapor-phase channel. There may also be some steam that has not been fully condensed in the liquid-phase channel.

[0087] In some embodiments, there are two circulation channels 55, namely the first circulation channel 551 and the second circulation channel 552. There are two condensation chambers 53, namely the first condensation chamber 531 and the second condensation chamber 532.

[0088] The first circulation channel 551 includes a first vapor-phase channel 551a and a first liquid-phase channel 551b. The first vapor-phase channel 551a is connected between the outlet of the evaporation chamber 52 and the inlet of the first condensation chamber 531, and the first liquid-phase channel 551b is connected between the outlet of the first condensation chamber 531 and the inlet of the evaporation chamber 52.

[0089] The second circulation channel 552 includes a second vapor-phase channel 552a and a second liquid-phase channel 552b. The second vapor-phase channel 552a is connected between the outlet of the evaporation chamber 52 and the inlet of the second condensation chamber 532, and the second liquid-phase channel 552b is connected between the outlet of the second condensation chamber 532 and the inlet of the evaporation chamber 52.

[0090] For example, please refer to Figure 7 as shown in Figure 7 is Figure 5 a cross-sectional view of the internal structure of the middle loop heat pipe 50 (parallel to the XY plane). In this loop heat pipe 50, the first circulation channel 551 and the second circulation channel 552 are located on the same side of the evaporation chamber 52 along the X-axis direction. The first condensation chamber 531 and the second condensation chamber 532 are respectively arranged on the first circulation channel 551 and the second circulation channel 552.

[0091] The evaporation chamber 52 is in the shape of a cuboid, having a first inner wall 521 and a second inner wall 522 parallel to the YZ plane, a third inner wall 523 and a fourth inner wall 524 parallel to the XZ plane, and a fifth inner wall and a sixth inner wall (not shown in the figure) parallel to the XY plane.

[0092] Among them, two outlets and two inlets are provided on the evaporation chamber 52. The two outlets are the first outlet 52a and the second outlet 52b respectively. The first outlet 52a and the second outlet 52b are both located on the second inner wall 522 and are distributed along the Y-axis direction. The two inlets are the first inlet 52e and the second inlet 52f respectively. The first inlet 52e and the second inlet 52f are respectively located on the third inner wall 523 and the fourth inner wall 524.

[0093] One end of the first vapor channel 551a is communicated with the first outlet 52a of the evaporation chamber 52, and the other end of the first vapor channel 551a is communicated with the inlet of the first condensation chamber 531; one end of the first liquid channel 551b is communicated with the outlet of the first condensation chamber 531, and the other end of the first liquid channel 551b is communicated with the first inlet 52e of the evaporation chamber 52.

[0094] One end of the second vapor channel 552a is communicated with the second outlet 52b of the evaporation chamber 52, and the other end of the second vapor channel 552a is communicated with the inlet of the second condensation chamber 532; one end of the second liquid channel 552b is communicated with the outlet of the second condensation chamber 532, and the other end of the second liquid channel 552b is communicated with the second inlet 52f of the evaporation chamber 52.

[0095] In this way, two evaporation-condensation cycles are formed in the loop heat pipe 50 ( Figure 7 The dotted arrows in the figure are the circulation directions of the working fluid). On the premise that the size of the loop heat pipe 50 remains unchanged, the lengths of the first circulation channel 551 and the second circulation channel 552 are both shorter than the length of the condensation channel 412 in the related-art loop heat pipe 40, so that the vapor flow resistance and the liquid flow resistance in the first circulation channel 551 and the second circulation channel 552 are both reduced compared with the condensation channel 412 in the related-art loop heat pipe 40. At the same time, since the first circulation channel 551 and the second circulation channel 552 share the evaporation chamber 52, when the steam pressure in the evaporation chamber 52 remains unchanged, the steam can quickly reach the first condensation chamber 531 and the second condensation chamber 532 for condensation, and the liquid working fluid formed by condensation can also quickly flow back to the evaporation chamber 52 (that is to say, the circulation rate of the working fluid in the loop heat pipe 50 is faster), thereby accelerating the start-up response speed of the loop heat pipe 50 and improving the circulation heat dissipation efficiency of the loop heat pipe 50.

[0096] In some other embodiments, there are four circulation channels 55, which are two third circulation channels 553 and two fourth circulation channels 554 respectively. There are four condensation chambers 53, which are two third condensation chambers 533 and two fourth condensation chambers 534 respectively.

[0097] The third circulation channel 553 includes a third vapor phase channel 553a and a third liquid phase channel 553b. The third vapor phase channel 553a is communicated between the outlet of the evaporation chamber 52 and the inlet of the third condensation chamber 533, and the third liquid phase channel 553b is communicated between the outlet of the third condensation chamber 533 and the inlet of the evaporation chamber 52.

[0098] The fourth circulation channel 554 includes a fourth vapor phase channel 554a and a fourth liquid phase channel 554b. The fourth vapor phase channel 554a is communicated between the outlet of the evaporation chamber 52 and the inlet of the fourth condensation chamber 534, and the fourth liquid phase channel 554b is communicated between the outlet of the fourth condensation chamber 534 and the inlet of the evaporation chamber 52.

[0099] For example, please refer to Figure 8 as shown in Figure 8 is an internal structure sectional view (parallel to the XY plane) of another loop heat pipe 50 provided by the embodiment of the present application. In this loop heat pipe 50, two third circulation channels 553 are located on one side of the evaporation chamber 52 along the X-axis direction, and two fourth circulation channels 554 are located on the other side of the evaporation chamber 52 along the X-axis direction.

[0100] The shape of the evaporation chamber 52 is also a cuboid, having a first inner wall 521 and a second inner wall 522 parallel to the YZ plane, a third inner wall 523 and a fourth inner wall 524 parallel to the XZ plane, and a fifth inner wall and a sixth inner wall (not shown in the figure) parallel to the XY plane.

[0101] Among them, four outlets and two inlets are provided on the evaporation chamber 52. The four outlets are respectively a first outlet 52a, a second outlet 52b, a third outlet 52c and a fourth outlet 52d. Both the first outlet 52a and the second outlet 52b are located on the second inner wall 522 and are distributed along the Y-axis direction. Both the third outlet 52c and the fourth outlet 52d are located on the first inner wall 521 and are distributed along the Y-axis direction. The two inlets are respectively a first inlet 52e and a second inlet 52f. The first inlet 52e is located on the third inner wall 523, and the second inlet 52f is located on the fourth inner wall 524.

[0102] In the two third circulation channels 553, one ends of the two third vapor phase channels 553a are respectively communicated with the third outlet 52c and the fourth outlet 52d of the evaporation chamber 52, and the other ends of the two third vapor phase channels 553a are respectively communicated with the inlets of the two third condensation chambers 533; one ends of the two third liquid phase channels 553b are respectively communicated with the outlets of the two third condensation chambers 533, and the other ends of the two third liquid phase channels 553b are respectively communicated with the first inlet 52e and the second inlet 52f of the evaporation chamber 52.

[0103] In the two fourth circulation channels 554, one ends of the two fourth vapor channels 554a are respectively communicated with the first outlet 52a and the second outlet 52b of the evaporation chamber 52, and the other ends of the two fourth vapor channels 554a are respectively communicated with the inlets of the two fourth condensation chambers 534; one ends of the two fourth liquid channels 554b are respectively communicated with the outlets of the two fourth condensation chambers 534, and the other ends of the two fourth liquid channels 554b are respectively communicated with the first inlet 52e and the second inlet 52f of the evaporation chamber 52.

[0104] In this way, it is equivalent to forming four evaporation-condensation cycles in the loop heat pipe 50 ( Figure 8 the dotted arrows in the figure are the circulation directions of the working medium). On the premise that the size of the loop heat pipe 50 remains unchanged, the lengths of the third circulation channel 553 and the fourth circulation channel 554 are both much smaller than the length of the condensation channel 412 in the related-art loop heat pipe 40, so that the vapor flow resistance and the liquid flow resistance in the third circulation channel 553 and the fourth circulation channel 554 are both greatly reduced compared with the condensation channel 412 in the related-art loop heat pipe 40. At the same time, since the two third circulation channels 553 and the two fourth circulation channels 554 share one evaporation chamber 52, when the steam pressure in the evaporation chamber 52 remains unchanged, the steam can reach the third condensation chamber 533 and the fourth condensation chamber 534 for condensation faster, and the liquid working medium formed by condensation can also flow back to the evaporation chamber 52 faster (that is, the circulation rate of the working medium in the loop heat pipe 50 is faster), thereby further improving the start-up response speed and the circulation heat dissipation efficiency of the loop heat pipe 50.

[0105] On the above basis, a common channel is further formed inside the housing 51. The first end of the common channel is communicated with the outlet of the evaporation chamber 52, and the second end of the common channel is communicated with one ends of at least two of the plurality of circulation channels 55. The other ends of the circulation channels 55 are communicated with the inlet of the evaporation chamber 52.

[0106] When there are two circulation channels 55 in the loop heat pipe 50, only one common channel needs to be provided. When there are more than two circulation channels 55, one or more common channels can be provided, as long as each common channel can be communicated with at least two circulation channels 55.

[0107] In this way, the steam in the evaporation chamber 52 will first enter the common channel, and then be split from the common channel into different circulation channels 55. In this way, there is no need to provide a corresponding outlet for each circulation channel 55 on the evaporation chamber 52, avoiding the structure of the loop heat pipe 50 from being too complicated in the case of more circulation channels 55, simplifying the structure of the loop heat pipe 50, and being able to reduce the production and processing costs.

[0108] For example, please refer to Figure 9 as shown in Figure 9Another structural explosion diagram of the loop heat pipe 50 provided by the embodiment of the present application. Figure 10 It is Figure 9 The internal structure cross-sectional view (parallel to the XY plane) of the loop heat pipe 50 in Figure 10 The loop heat pipe 50 in Figure 7 is equivalent to adding a first common channel 541 on the basis of the double-cycle loop heat pipe 50 in the foregoing Figure 10 The dotted arrow in Figure 10 is the circulation direction of the working fluid. The first common channel 541 is located between the first circulation channel 551 and the second circulation channel 552. The first inlet 52e and the second inlet 52f of the evaporation chamber 52 are located on both sides of the first common channel 541. It should be noted that the first inlet 52e and the second inlet 52f of the evaporation chamber 52 may be symmetrically arranged with respect to the first common channel 541 or may not be symmetrically arranged.

[0109] At this time, the original first outlet 52a and the second outlet 52b of the evaporation chamber 52 are combined into a fifth outlet 52g. The first end of the first common channel 541 is communicated with the fifth outlet 52g. The first vapor phase channel 551a of the first circulation channel 551 and the second vapor phase channel 552a of the second circulation channel 552 are no longer directly communicated with the outlet of the evaporation chamber 52, but are respectively communicated with the second end of the first common channel 541.

[0110] For another example, please refer to Figure 11 as shown in Figure 11 Another internal structure cross-sectional view (parallel to the XY plane) of the loop heat pipe 50 provided by the embodiment of the present application. Figure 11 The loop heat pipe 50 in Figure 8 is equivalent to adding two common channels on the basis of the four-cycle loop heat pipe 50 in the foregoing Figure 11 The dotted arrow in

[0111] is the circulation direction of the working fluid. The two common channels are the second common channel 542 and the third common channel 543 respectively. The second common channel 542 is located between the two third circulation channels 553, and the third common channel 543 is located between the two fourth circulation channels 554.

[0112] In addition, the original first outlet 52a and second outlet 52b of the evaporation chamber 52 are combined into a fifth outlet 52g. The first end of the third common channel 543 is communicated with the fifth outlet 52g. The fourth vapor channels 554a of the two fourth circulation channels 554 are no longer directly communicated with the outlet of the evaporation chamber 52, but are respectively communicated with the second end of the third common channel 543.

[0113] In some embodiments, the first wick 56 is located at the inlet of the evaporation chamber 52, so that after the liquid working medium in the liquid phase channel flows back into the evaporation chamber 52, it can be immediately replenished into the first wick 56 to participate in the next evaporation and condensation cycle.

[0114] Moreover, the first wick 56 covers the inlet of the evaporation chamber 52, so as to prevent steam from flowing reversely from the inlet of the evaporation chamber 52 into the circulation channel 55 and hindering the backflow of the liquid working medium, thereby reducing the risk of dry burning of the first wick 56.

[0115] For example, please refer back to Figure 10 . Figure 10 In, a first wick 56 is respectively arranged at the first inlet 52e and the second inlet 52f of the evaporation chamber 52. A steam channel 59 is formed between the first wick 56 and the inner wall of the evaporation chamber 52. The fifth outlet 52g of the evaporation chamber 52 is communicated with the steam channel 59. The bubbles generated on the first wick 56 escape from its evaporation surface into the steam channel 59 and form steam after bursting. Since both the first inlet 52e and the second inlet 52f of the evaporation chamber 52 are covered by the first wick 56, the reverse flow of steam into the first liquid phase channel 551b and the second liquid phase channel 552b to hinder the backflow of the liquid working medium is avoided, and the steam can only leave the evaporation chamber 52 from the fifth outlet 52g and enter the first common channel 541.

[0116] Please refer to Figure 12 shown in Figure 12 which is a schematic diagram of the overall structure of a first wick 56 provided by an embodiment of the present application. Wherein, the first wick 56 may include a first part 561 and a second part 562. The first part 561 covers the inlet of the evaporation chamber 52. The second part 562 is arranged on the surface of the first part 561 away from the inlet of the evaporation chamber 52 and extends in a direction away from the first part 561.

[0117] Among them, there are multiple second parts 562, and the multiple second parts 562 are arranged at intervals. Such an arrangement can increase the area of the side wall of the first wick 56 (the side wall of a part of the second parts 562 is the additionally increased area), which is equivalent to increasing the evaporation surface area of the first wick 56. So that at the same temperature, within a unit time, more bubbles formed by the vaporization of the liquid working medium in the first wick 56 can escape from the evaporation surface of the first wick 56 into the steam channel 59. The escaped bubbles burst to form steam. The more bubbles there are, it means that more liquid working medium in the first wick 56 is vaporized, and the more heat absorbed by the loop heat pipe 50 from the heating element 30, and the lower the temperature of the heating element 30.

[0118] Furthermore, the first wick 56 further includes a third part 563. Please refer to Figure 13 、 Figure 14 as shown, Figure 13 which is the overall structural schematic diagram of another first wick 56 provided by the embodiment of the present application, Figure 14 and is the structural explosion schematic diagram of another loop heat pipe 50 provided by the embodiment of the present application (equivalent to replacing the first wick 56 in Figure 9 with the first wick 56 in Figure 13 ). Among them, the third part 563 is arranged on the surface of the first part 561 facing the inlet of the evaporation chamber 52 and extends into the liquid phase channel of the circulation channel 55.

[0119] In this way, when the liquid working medium in the circulation channel 55 enters the third part 563, it will quickly return to the first part 561 under the action of the capillary force in the third part 563, thereby further improving the evaporation and condensation cycle efficiency of the loop heat pipe 50 and shortening the start-up response time of the loop heat pipe 50.

[0120] Regarding the extension length of the third part 563 in the liquid phase channel, it can be adjusted as needed according to the start-up time and circulation efficiency of the loop heat pipe 50, and the present application does not make special limitations. For example, please refer to Figure 15 as shown, Figure 15 which is Figure 14 the internal structural cross-sectional view (parallel to the XY plane) of the loop heat pipe 50 in

[0121] In some embodiments, the first wick 56 abuts between two inner walls distributed along the thickness direction of the loop heat pipe 50 in the evaporation chamber 52. Such an arrangement is equivalent to using the first wick 56 to support the evaporation chamber 52, and can prevent the evaporation chamber 52 from collapsing and causing steam blockage when the loop heat pipe 50 is subjected to extrusion, impact, etc.

[0122] Exemplarily, please refer to Figure 16 as shown Figure 16 is Figure 15 the cross-sectional view at B-B in. In the figure, the thicknesses of the first part 561 and the second part 562 of the first wick 56 in the Z-axis direction are the same. One side surfaces of the first part 561 and the second part 562 are both in contact with the base 511, and the other side surfaces of the first part 561 and the second part 562 are both in contact with the top cover 512, so that the housing 51 and the first wick 56 form a sandwich structure.

[0123] In summary, for the loop heat pipe to start and operate, the sum of the capillary forces ∑ΔP cap.max of all the first wicks 56 needs to be greater than or equal to the total flow resistance ΔP total in the loop heat pipe 50. The total flow resistance ΔP total can be divided into the vapor phase flow resistance ΔP v and the liquid phase flow resistance ΔP l . The vapor phase flow resistance ΔP v includes the vapor pressure drop ΔP v1 in the evaporation chamber 52, the sum of the pressure drops ∑ΔP v2 of all the common channels, and the sum of the pressure drops ∑ΔP v3 of all the vapor phase channels. The liquid phase flow resistance ΔP l includes the sum of the pressure drops ∑ΔP l1 of all the condensation chambers 53, the sum of the pressure drops ∑ΔP l2 of all the liquid phase channels, and the sum of the pressure drops ∑ΔP l3 of all the first wicks 56. That is, it can be expressed by the following formula:

[0124] ∑ΔP cap.max ≥ΔP total ;

[0125] ΔP total =ΔP v +ΔP l ;

[0126] ΔP v =ΔP v1 +∑ΔP v2 +∑ΔP v3 ;

[0127] ΔP l =∑ΔP l1 +∑ΔP l2 +∑ΔP l3 .

[0128] In some cases, multiple heating elements 30 in the electronic device 01 are relatively close to each other. Therefore, by appropriately expanding and deforming the evaporation cavity 52, the positive projection of one evaporation cavity 52 on the XY plane can cover the positive projections of the above-mentioned multiple heating elements 30 on the XY plane at the same time. And a plurality of first wicking cores 56 are arranged in the evaporation cavity 52, that is, one first wicking core 56 is correspondingly allocated for each heating element 30 (at least a partial area of the vertical projections of the heating element 30 and the first wicking core 56 in the XY plane overlap each other), and each first wicking core 56 corresponds to an inlet of an evaporation cavity 52. Thus, only one loop heat pipe 50 can be used to dissipate heat from the above-mentioned multiple heating elements 30, that is, the heating element 30 is attached to the position on the housing 51 corresponding to the first wicking core 56.

[0129] In addition, for the part of the side wall of the evaporation cavity 52 close to the heating element that does not fit with the heating element 30, the area of this part can be reduced, thereby saving the material cost of the loop heat pipe 50.

[0130] At this time, the evaporation cavity 52 is regarded as being composed of a steam storage cavity 5203 and multiple sub-cavities. Both the sub-cavities and the steam storage cavity 5203 have inlets and outlets. The outlet of the sub-cavity is communicated with the inlet of the steam storage cavity 5203. The inlet of the sub-cavity is the inlet of the evaporation cavity 52, and the outlet of the steam storage cavity 5203 is the outlet of the evaporation cavity 52. A first wicking core 56 is arranged in each sub-cavity. When in use, each sub-cavity corresponds to and fits a heating element 30. When the loop heat pipe 50 is heated and operates, the steam generated in the multiple sub-cavities will first gather in the steam storage cavity 5203, then enter the common channel from the steam storage cavity 5203, and then enter different circulation channels 55 from the common channel.

[0131] For example, please refer to Figure 17 as shown in Figure 17 which is a cross-sectional view of the internal structure of another loop heat pipe 50 provided by the embodiment of the present application (parallel to the XY plane). Figure 17 The loop heat pipe 50 in Figure 10 is equivalent to the expansion and deformation of the evaporation cavity 52 on the basis of the loop heat pipe 50 in the foregoing Figure 17In the embodiment, the evaporation chamber 52 is composed of a steam storage chamber 5203 and two sub-chambers, and the two sub-chambers are respectively the first sub-chamber 5201 and the second sub-chamber 5202. The steam storage chamber 5203 has two inlets and one outlet, and the two inlets of the steam storage chamber 5203 are respectively arranged at its two ends and are respectively connected to the first sub-chamber 5201 and the second sub-chamber 5202. The width of the steam storage chamber 5203 along the X-axis direction is smaller than the width of the first sub-chamber 5201 and the second sub-chamber 5202 along the X-axis direction, which is equivalent to the evaporation chamber 52 being "dumbbell-shaped". The outlet of the steam storage chamber 5203 is located in the middle (i.e., the fifth outlet 52g of the evaporation chamber 52), the inlet of the first sub-chamber 5201 is the first inlet 52e of the evaporation chamber 52, and the inlet of the second sub-chamber 5202 is the second inlet 52f of the evaporation chamber 52. When in use, the side walls of the first sub-chamber 5201 and the second sub-chamber 5202 are respectively attached to the two heating elements 30.

[0132] For another example, see Figure 18 As shown, Figure 18 A cross-sectional view of the internal structure of another loop heat pipe provided in an embodiment of the present application (parallel to the XY plane). Figure 18 The loop heat pipe 50 in the above Figure 11 The evaporation chamber 52 is expanded and deformed based on the middle loop heat pipe 50. Figure 18 In the embodiment, the evaporation chamber 52 is composed of a steam storage chamber 5203 and two sub-chambers, and the two sub-chambers are respectively the first sub-chamber 5201 and the second sub-chamber 5202. The steam storage chamber 5203 has two inlets and two outlets, and the two inlets of the steam storage chamber 5203 are respectively arranged at its two ends, and are respectively connected to the first sub-chamber 5201 and the second sub-chamber 5202, and the width of the steam storage chamber 5203 along the X-axis direction is smaller than the width of the first sub-chamber 5201 and the second sub-chamber 5202 along the X-axis direction. The two outlets of the steam storage chamber 5203 (i.e., the fifth outlet and the sixth outlet of the evaporation chamber 52) are respectively located on both sides of the middle thereof, and the inlet of the first sub-chamber 5201 is the first inlet 52e of the evaporation chamber 52, and the inlet of the second sub-chamber 5202 is the second inlet 52f of the evaporation chamber 52. When in use, the side walls of the first sub-chamber 5201 and the second sub-chamber 5202 are respectively attached to the two heating elements 30.

[0133] On the basis of the above, the loop heat pipe 50 may further include a second liquid wick 57. The second liquid wick 57 is disposed between the plurality of first liquid wicks 56, and the plurality of first liquid wicks 56 are respectively connected to the second liquid wick 57. When the plurality of first liquid wicks 56 are heated unevenly, the second liquid wick 57 may adjust the liquid working medium in the plurality of first liquid wicks 56 to prevent the first liquid wicks 56 from being dry-burned.

[0134] For example, see Figure 19 and Figure 20 As shown,Figure 19 Another structural explosion diagram of the loop heat pipe provided by the embodiment of the present application Figure 20 is Figure 19 the internal structure cross-sectional view (parallel to the XY plane) of the loop heat pipe in Figure 19 The loop heat pipe 50 in Figure 14 is equivalent to adding a second wick 57 to the loop heat pipe 50 in Figure 19 In

[0135] Figure 21 Figure 21 shown, Figure 20 is the cross-sectional view at C-C in

[0136] Figure 22 Figure 22 Figure 10 shown,

[0137] Figure 23 Figure 23 Figure 17

[0138] ​​​​​​​​In some other embodiments, the second wick 57 may also be laid at the bottom of the evaporation chamber 52, and the first wick 56 is located on the second wick 57. At this time, one side surface of the first wick 56 away from the second wick 57 and one side surface of the second wick 57 away from the first wick 56 are respectively abutted between two inner walls distributed along the thickness direction of the loop heat pipe 50 in the evaporation chamber 52, that is, it is equivalent to using the first wick 56 and the second wick 57 to support the evaporation chamber 52, so as to avoid the evaporation chamber 52 from collapsing due to extrusion or impact of the loop heat pipe 50, resulting in steam blockage.

[0139] In some embodiments, the above-mentioned loop heat pipe 50 further includes a plurality of support members 58, and the plurality of support members 58 are spaced apart along the extending direction of the circulation channel 55, and the support members 58 are abutted within the circulation channel 55 between two inner walls distributed along the thickness direction of the loop heat pipe 50.

[0140] In this way, by supporting the circulation channel 55 with a plurality of support members 58, when the loop heat pipe 50 is subjected to extrusion or impact, etc., the support members 58 can, to a certain extent, prevent the circulation channel 55 from collapsing, resulting in the evaporation and condensation cycle being blocked or interrupted.

[0141] Similarly, a plurality of support members 58 can also be provided in the common channel, and the plurality of support members 58 are spaced apart along the extending direction of the common channel, so as to prevent the common channel from collapsing.

[0142] A plurality of support members 58 can also be provided in the condensation chamber 53, and the plurality of support members 58 are spaced apart in the condensation chamber 53, so as to prevent the condensation chamber 53 from collapsing.

[0143] It can be understood that the support member 58 can be an integral structure with the housing 51 (for example, formed by stamping, casting, etc.) or can be fixedly connected to the housing 51 by means of welding, threaded connection, riveting, bonding, etc.

[0144] The support member 58 can be a columnar structure, a cylindrical structure or a frame structure, or can be other structural forms. The present application does not make special limitations on this. On the premise of playing a supporting role, the influence caused by the flow of steam or liquid working medium is reduced as much as possible.

[0145] Exemplarily, please refer to Figure 24 as shown Figure 24 which is a schematic diagram of the internal structure of another loop heat pipe provided by the embodiment of the present application. Among them, the support member 58 is a columnar structure, and a plurality of support members 58 are provided in the first circulation channel 551, the second circulation channel 552, the first condensation chamber 531, the second condensation chamber 532 and the first common channel 541, and one end of the support member 58 abuts against the top cover 512 (not shown in the figure), and the other end of the support member 58 abuts against the base 511.

[0146] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any one or more embodiments or examples in a suitable manner.

[0147] As described above, it is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed by this application can easily think of changes or substitutions, which should all be covered within the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claimed rights.

Claims

1. A loop heat pipe, characterized in that, Comprising: A housing, inside which an evaporation chamber, a plurality of condensation chambers and a plurality of circulation channels are formed. Each of the circulation channels has one of the condensation chambers, and each of the condensation chambers is communicated with the evaporation chamber through the corresponding circulation channel, so that each of the circulation channels can perform an evaporation-condensation cycle; A first wick, disposed inside the evaporation chamber.

2. The loop heat pipe according to claim 1, characterized in that, A common channel is further formed inside the housing. A first end of the common channel is communicated with an outlet of the evaporation chamber, a second end of the common channel is communicated with one ends of at least two of the plurality of circulation channels, and the other ends of the circulation channels are communicated with an inlet of the evaporation chamber.

3. The loop heat pipe according to claim 2, wherein The circulation channel includes a vapor phase channel and a liquid phase channel. A first end of the vapor phase channel is communicated with the second end of the common channel, a second end of the vapor phase channel is communicated with an inlet of the condensation chamber, a first end of the liquid phase channel is communicated with an outlet of the condensation chamber, and a second end of the liquid phase channel is communicated with an inlet of the evaporation chamber.

4. The loop heat pipe according to claim 3, wherein The plurality of circulation channels include a first circulation channel and a second circulation channel, and the plurality of condensation chambers include a first condensation chamber and a second condensation chamber; The first circulation channel includes a first vapor phase channel and a first liquid phase channel. The first vapor phase channel is communicated between the common channel and the first condensation chamber, and the first liquid phase channel is communicated between the first condensation chamber and the evaporation chamber; The second circulation channel includes a second vapor phase channel and a second liquid phase channel. The second vapor phase channel is communicated between the common channel and the second condensation chamber, and the second liquid phase channel is communicated between the second condensation chamber and the evaporation chamber.

5. The loop heat pipe according to claim 4, characterized in that, The evaporation chamber has a first inlet and a second inlet. The first liquid phase channel is communicated with the first inlet, the second liquid phase channel is communicated with the second inlet, and the first inlet and the second inlet are respectively located on both sides of the common channel.

6. The loop heat pipe according to claim 5, characterized in that, The first circulation channel and the second circulation channel are respectively disposed on both sides of the common channel.

7. The loop heat pipe according to claim 5, characterized in that, The first wick is disposed at both the first inlet and the second inlet of the evaporation chamber.

8. The loop heat pipe according to claim 7, characterized in that, The loop heat pipe further includes a second wick, which is disposed between the two first wicks and is connected to the two first wicks.

9. The loop heat pipe according to claim 8, wherein In the thickness direction of the loop heat pipe, the thickness of the second wick is less than the thickness of the first wick.

10. The loop heat pipe according to claim 2, wherein The plurality of circulation channels include two third circulation channels and two fourth circulation channels. There are two common channels, namely a first common channel and a second common channel. The first ends of the first common channel and the second common channel are both communicated with the outlet of the evaporation chamber; One ends of the two third circulation channels are both communicated with the second end of the first common channel, and the other ends of the two third circulation channels are both communicated with the inlet of the evaporation chamber; One ends of the two fourth circulation channels are both communicated with the second end of the second common channel, and the other ends of the two fourth circulation channels are both communicated with the inlet of the evaporation chamber.

11. The loop heat pipe according to claim 10, characterized in that, The two third circulation channels are distributed on both sides of the first common channel, and the two fourth circulation channels are distributed on both sides of the second common channel.

12. The loop heat pipe according to any one of claims 1 to 11, characterized in that, The first wick includes a first part and a second part. The first part covers the inlet of the evaporation chamber. The second part is disposed on the surface of the first part away from the inlet of the evaporation chamber, and the second part extends in a direction away from the first part.

13. The loop heat pipe according to claim 12, wherein, A plurality of the second parts are provided, and the plurality of second parts are spaced apart.

14. The loop heat pipe according to claim 12 or 13, characterized in that, The first wick abuts within the evaporation chamber, between two inner walls distributed in the thickness direction of the loop heat pipe.

15. The loop heat pipe according to any one of claims 12 to 14, characterized in that, The first wick further includes a third part. The third part is disposed on the surface of the first part facing the inlet of the evaporation chamber and extends into the circulation channel.

16. The loop heat pipe according to any one of claims 1 to 15, characterized in that, The loop heat pipe further includes a plurality of support members. The plurality of support members are spaced apart along the extending direction of the circulation channel, and the support members abut within the circulation channel, between two inner walls distributed in the thickness direction of the loop heat pipe.

17. An electronic device, characterized in that, Comprising a heating element and the loop heat pipe according to any one of claims 1 to 16, the loop heat pipe is attached to the heating element, and the first wick of the loop heat pipe is filled with a liquid working medium.

Images