Chip capacitor end sealing production line based on thick rubber plate

Abstract

The invention discloses a chip capacitor end sealing production line based on a thick rubber plate. The chip capacitor end sealing production line comprises an assembling mechanism, an implanting mechanism, a pressing-in mechanism, a leveling mechanism, a slurry soaking mechanism, a drying mechanism, a cooling and storing mechanism, a plate replacing mechanism, a discharging mechanism and a transferring clamping jaw. The number of the dipping mechanisms, the number of the drying mechanisms and the number of the cooling storage mechanisms are all two, and the assembling mechanism, the implanting mechanism, the pressing-in mechanism, the leveling mechanism, one dipping mechanism, one drying mechanism, one cooling storage mechanism, the plate changing mechanism, the other dipping mechanism, the other drying mechanism, the other cooling storage mechanism and the discharging mechanism are sequentially arranged. The assembling mechanism is used for placing the guide-in plate to the top of the thick rubber plate and forming an assembly. According to the chip capacitor end sealing production line based on the thick rubber plate, full-automatic operation in the end sealing process of the chip capacitor is achieved, the end sealing efficiency of the chip capacitor can be effectively improved, the end sealing precision of the chip capacitor can be improved, and meanwhile the labor cost in the end sealing process can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip capacitor production equipment, and particularly relates to a chip capacitor capping production line based on a thick glue board. Background Art

[0002] In the current technology, the full-automatic capping machine / production line for chip capacitors generally uses a stencil as the carrier for transporting chip capacitors. Specifically, refer to the Chinese utility model patent with the publication number CN218849426U. During the capping process, it is necessary to first stick a glue film on one side of the stencil to seal one end of the stencil holes with the glue film. After the glue film is adhered smoothly, the chip capacitors are implanted into the stencil holes, and hundreds of miniature chip capacitors are adhered to the stencil through the glue film to prevent them from falling off. Then, the other end of the chip capacitors that are not adhered with the glue film is subjected to dipping slurry capping. During the above implantation process, the ends of the adhesive ends of the chip capacitors will be aligned under the action of the glue film. However, due to possible production tolerances of the chip capacitors themselves (such as different lengths, etc.), it is difficult for the ends to be capped on the same stencil to be flush with each other after implantation, resulting in poor dipping consistency of the chip capacitors, which greatly affects the capping quality of the chip capacitors.

[0003] Therefore, in order to ensure the capping quality of chip capacitors, some existing manufacturers have begun to use thick glue boards instead of stencils as the carriers for transporting chip capacitors. The thick glue board is a carrier for fixing chip capacitors by means of silicone clamping. Therefore, to successfully implant the chip capacitors into the board holes of the thick glue board, it is necessary to place a guiding board on the top of the thick glue board. First, the chip capacitors are implanted into the guiding holes of the guiding board by vibration, and then the chip capacitors located in the guiding board are pressed into the board holes of the thick glue board through a pin bed, thereby completing the implantation process of the chip capacitors in the thick glue board.

[0004] Due to the heavy weight of the thick glue board, manual intervention is more or less required throughout the capping process of the chip capacitors, which greatly increases the labor cost during the capping process; in addition, too much manual intervention is not conducive to improving the capping efficiency of the chip capacitors and the capping accuracy of the chip capacitors. Summary of the Invention

[0005] The purpose of the present invention is to provide a chip capacitor capping production line based on a thick glue board, which realizes the full-automatic operation of the chip capacitor capping process, can effectively improve the capping efficiency of the chip capacitors and the capping accuracy of the chip capacitors, and is also conducive to reducing the labor cost during the capping process, so as to overcome the deficiencies in the prior art.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] A patch capacitor capping production line based on a thick rubber plate, comprising an assembly mechanism, an implantation mechanism, a pressing-in mechanism, a leveling mechanism, a dipping mechanism, a drying mechanism, a cooling and storage mechanism, a plate-changing mechanism, a discharging mechanism and a transfer gripper; there are two dipping mechanisms, two drying mechanisms and two cooling and storage mechanisms, and the assembly mechanism, the implantation mechanism, the pressing-in mechanism, the leveling mechanism, one dipping mechanism, one drying mechanism, one cooling and storage mechanism, the plate-changing mechanism, the other dipping mechanism, the other drying mechanism, the other cooling and storage mechanism and the discharging mechanism are arranged in sequence; the assembly mechanism is used for placing an introduction plate on the top of the thick rubber plate to form an assembly; there are multiple transfer grippers, and the transfer grippers are used for gripping and moving the thick rubber plate.

[0008] Preferably, the assembly mechanism includes a thick rubber plate storage rack, an introduction plate storage rack and a plate-taking device; the thick rubber plate storage rack is used for storing thick rubber plates, the introduction plate storage rack is used for storing introduction plates, and the plate-taking device is used for moving the introduction plates.

[0009] Preferably, the implantation mechanism includes a mounting base, a mounting seat, an implantation device, an implantation conveying device and a motor vibration device; the mounting seat is mounted on the top of the mounting base, and the center of the top of the mounting base is rotatably connected to the center of the bottom of the mounting seat through a bearing seat, and the mounting seat swings relative to the mounting base; the implantation device and the implantation conveying device are both mounted above the mounting seat, and the implantation conveying device is located inside the implantation device; the implantation conveying device is used for conveying the assembly to the implantation device, and the conveying direction of the implantation conveying device is parallel to the swinging direction of the mounting seat; the motor vibration device is mounted on the bottom of the mounting seat, and the output end of the motor vibration device is connected to the implantation device, and the motor vibration device is used for driving the implantation device to vibrate relative to the mounting seat; the implantation device includes an implantation chassis, an implantation top plate and an implantation frame which are arranged at intervals from bottom to top in sequence, the implantation chassis and the implantation frame are connected by a vertically extending support column, the implantation top plate is movably arranged between the implantation chassis and the implantation frame, and the conveying surface of the implantation conveying device is located above the implantation top plate; the bottom of the implantation frame includes a placement position and an avoidance position, and the placement position and the avoidance position are connected in sequence along the direction perpendicular to the conveying direction of the implantation conveying device; the placement position is used for placing the patch capacitor to be implanted, and the implantation top plate is used for abutting the introduction plate to be implanted against the avoidance position.

[0010] Preferably, the pressing-in mechanism includes a detection and conveying device, a first cleaning device, a detection device, a pressing-in conveying device, and a needle bed pressing-in device; the detection and conveying device and the pressing-in conveying device are connected end to end in sequence, and the pressing-in conveying device moves up and down relative to the detection and conveying device, and the needle bed pressing-in device is located inside the pressing-in conveying device; the first cleaning device and the detection device are sequentially arranged on the detection and conveying device along the conveying direction of the detection and conveying device, and the detection and conveying device is used for conveying the assembly, the first cleaning device is used for cleaning the upper surface of the assembly, and the detection device is used for detecting whether there is a foreign object on the upper surface of the assembly placed on the detection and conveying device; the needle bed pressing-in device includes an upper platform and a lower platform oppositely arranged in the vertical direction, and the upper platform is located above the lower platform, the upper platform moves up and down relative to the lower platform, the placing surface of the lower platform is within the up and down movement range of the pressing-in conveying device, and the upper platform is used for pressing the chip capacitor in the lead-in board in the assembly into the board holes of the thick glue board.

[0011] Preferably, the leveling mechanism includes a leveling conveying device, a lifting platform, a feeding belt, a flipping device, a lead-in board recycling device, and a leveling device; the leveling conveying device includes a conveying machine frame and a conveying tray, the conveying tray is horizontally movably installed on the top of the conveying machine frame, and the conveying tray is used for holding the thick glue board; the lifting platform, the feeding belt, the flipping device, and the lead-in board recycling device are sequentially arranged opposite to each other from bottom to top at the feeding end of the conveying machine frame, and both the lifting platform and the feeding belt are located at the inner bottom of the conveying machine frame, and both the flipping device and the lead-in board recycling device are arranged on the top of the conveying machine frame; the lifting platform can move up and down relative to the feeding belt and the flipping device, and the lifting platform can penetrate through the feeding belt and the conveying surface of the leveling conveying device; the shape of the conveying tray is U-shaped, a avoiding opening is formed in the middle of the conveying tray, and the avoiding opening is used for avoiding the lifting platform; the leveling device is located in front of the flipping device, and the leveling device includes a leveling clamp and a leveling platform oppositely arranged in the vertical direction, the leveling clamp is located above the conveying machine frame, and the leveling clamp can move up and down relative to the conveying machine frame, the leveling platform is located below the conveying machine frame, and the leveling clamp is used for clamping the thick glue board.

[0012] Preferably, the slurry dipping mechanism includes a slurry dipping device, a transfer conveyor table, a transfer gripper, a pre-drying device, a pre-cooling device, a blanking conveyor table, and a feeding gripper; the transfer conveyor table, the pre-drying device, the pre-cooling device, and the blanking conveyor table are connected end to end in sequence, and the transfer conveyor table moves up and down relative to the pre-drying device, and the blanking conveyor table moves up and down relative to the pre-cooling device; at least two groups of slurry dipping devices are provided, and the feeding ends of all the slurry dipping devices and the blanking conveyor table are within the moving range of the feeding gripper, and the feeding gripper is used to transfer the thick rubber plate between the feeding end of the slurry dipping device and the blanking conveyor table; the discharging ends of all the slurry dipping devices and the transfer conveyor table are within the moving range of the transfer gripper, and the transfer gripper is used to transfer the thick rubber plate between the discharging end of the slurry dipping device and the transfer conveyor table.

[0013] Preferably, the slurry dipping device includes a mounting frame, a slurry pan, a slurry spreading assembly, a dipping fixture, and a feeding tray; the mounting frame includes a support base and a conveying bracket; the support base is erected above the slurry pan, and the slurry pan moves horizontally relative to the support base; the conveying bracket is horizontally extended and installed on the support base, and the extending direction of the conveying bracket is parallel to the moving direction of the slurry pan, and the conveying bracket is located above the slurry pan; the slurry spreading assembly is installed on one side of the support base, and the slurry spreading assembly is located on the top of the slurry pan; the slurry spreading assembly moves up and down relative to the slurry pan, and the slurry spreading assembly is used to spread a slurry layer on the top of the slurry pan; the feeding tray is horizontally movably installed on the conveying bracket; the dipping fixture is vertically movably installed on the support base, and the upper limit of the movement of the dipping fixture is above the conveying bracket, and the lower limit of the movement of the dipping fixture is above the slurry pan.

[0014] Preferably, the cooling and storage mechanism includes a cooling cover, a lifting device, a cold air delivery head, and a circulation fan; openings are provided at both the bottom and the top of the cooling cover, the lifting device is arranged inside the cooling cover, and the inlet of the lifting device protrudes from the bottom of the cooling cover, and the lifting device is used to convey the thick rubber plate vertically upward; the cold air delivery head is communicated with the cooling cover, and the air inlet end of the cold air delivery head is connected to a cold air source; the circulation fan is installed between the cooling cover and the lifting device, and the circulation fan is located below the cold air delivery head.

[0015] Preferably, the board changing mechanism includes a needle bed conveying device, a partition frame clamping device, a new board clamping device, a new board conveying device, and a flattening device; the needle bed conveying device includes a first conveying track and a transfer platform, and the transfer platform is horizontally movably installed on the first conveying track; the transfer platform includes a platform mounting seat for placing a thick rubber board and a mesh board, and the mesh board is installed above the platform mounting seat through spring expansion and contraction; a plurality of ejector pins are protrudingly arranged on the upper surface of the platform mounting seat, a plurality of mesh holes are formed in the plate surface of the mesh board, and one ejector pin corresponds to one mesh hole, and the mesh holes are used for the ejector pins to pass through the mesh board; the partition frame clamping device and the new board clamping device are sequentially arranged above the end of the first conveying track along the conveying direction of the transfer platform, the partition frame clamping device is used for clamping a partition frame, the new board clamping device is used for clamping an empty thick rubber board, and the clamps of the partition frame clamping device and the new board clamping device can move up and down relative to the transfer platform; the new board conveying device includes a second conveying track and a support bar, and the support bar is horizontally movably installed on both inner sides of the second conveying track; the feeding end of the second conveying track and the end of the first conveying track are sequentially arranged below the clamp of the new board clamping device from top to bottom, and the clamp of the new board clamping device can pass through the conveying surface of the second conveying track; the flattening device is arranged at the end of the second conveying track, and the flattening device includes a flattening clamp and a flattening platform oppositely arranged in the vertical direction, the flattening clamp is located above the second conveying track, and the flattening clamp can move up and down relative to the second conveying track, the flattening clamp is used for clamping a thick rubber board, and the flattening platform is located below the second conveying track.

[0016] Preferably, the unloading mechanism includes an unloading conveying device, a needle bed unloading device, a material loading conveying device, a full material conveying device, an empty material box storage rack, a full material box storage rack, and a material box moving device; the unloading conveying device includes an unloading conveying rack and an unloading platform, the unloading platform is horizontally movably installed on the top of the unloading conveying rack, and the unloading platform is used for holding the thick rubber plate to be unloaded; a blanking port is formed at the bottom of the unloading platform, a blanking notch is formed in the middle of the unloading conveying rack, and the blanking port and the blanking notch are matched with each other; the needle bed unloading device is erected above the unloading conveying rack, the material loading conveying device is arranged below the unloading conveying rack, and the needle bed unloading device, the blanking notch, and the unloading end of the material loading conveying device are arranged in sequence from top to bottom; the needle bed unloading device moves up and down relative to the unloading conveying rack, and the needle bed unloading device is used for pressing the chip capacitor away from the thick rubber plate; the material loading conveying device and the full material conveying device are arranged in parallel, and the empty material box storage rack, the disk changing end of the material loading conveying device, and the feeding end of the full material conveying device are sequentially arranged within the transfer range of the material box moving device, and the discharging end of the full material conveying device is connected to the full material box storage rack; the empty material box storage rack is used for storing a plurality of stacked material boxes, both the material loading conveying device and the full material conveying device are used for conveying the material boxes, and the full material conveying device is further used for conveying the material boxes to the full material box storage rack, and the material box moving device is used for transferring the material boxes.

[0017] The technical solution provided by the present invention may include the following beneficial effects: A chip capacitor capping production line based on a thick rubber plate proposed in this solution realizes the full-automatic operation of the chip capacitor capping process, can effectively improve the capping efficiency of the chip capacitor and improve the capping accuracy of the chip capacitor, and is also beneficial to reducing the labor cost in the capping process to overcome the deficiencies in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of a chip capacitor capping production line based on a thick rubber plate of the present invention. Figure 2 is a schematic structural diagram of an introduction plate and a thick rubber plate in the present invention. Figure 3 is a schematic structural diagram of an implanting mechanism from one perspective in the present invention. Figure 4 is a schematic structural diagram of the implanting mechanism from another perspective in the present invention. Figure 5 is a side view of the implanting mechanism in the present invention. Figure 6 is a partial structural schematic diagram of the implanting mechanism in the present invention. Figure 7 is a schematic working state diagram of the implanting mechanism in the present invention. Figure 8 is a side view of the pressing-in mechanism in the present invention. Figure 9 is a schematic structural diagram of the pressing-in mechanism in the present invention. Figure 10It is a partial structural schematic diagram of the pressing mechanism in the present invention. Figure 11 It is a partial structural schematic diagram of the pressing mechanism in the present invention. Figure 12 It is a side view of the leveling mechanism in the present invention. Figure 13 It is a structural schematic diagram of one perspective of the leveling mechanism in the present invention. Figure 14 It is a structural schematic diagram of another perspective of the leveling mechanism in the present invention. Figure 15 It is a partial structural schematic diagram of the leveling mechanism in the present invention. Figure 16 It is a top view of the slurry dipping mechanism in the present invention. Figure 17 It is a partial structural schematic diagram of one perspective of the slurry dipping mechanism in the present invention. Figure 18 It is a partial structural schematic diagram of another perspective of the slurry dipping mechanism in the present invention. Figure 19 It is a partial structural schematic diagram of the slurry dipping mechanism in the present invention. Figure 20 It is a structural schematic diagram of one perspective of the cooling and storage mechanism in the present invention. Figure 21 It is a structural schematic diagram of another perspective of the cooling and storage mechanism in the present invention. Figure 22 It is a partial structural schematic diagram of the cooling and storage mechanism in the present invention. Figure 23 It is a schematic diagram of the gas flow direction of the cooling and storage mechanism in the present invention. Figure 24 It is a partial structural schematic diagram of the cooling and storage mechanism in the present invention. Figure 25 It is a structural schematic diagram of one perspective of the plate changing mechanism in the present invention. Figure 26 It is a structural schematic diagram of another perspective of the plate changing mechanism in the present invention. Figure 27 It is a partial structural schematic diagram of the plate changing mechanism in the present invention. Figure 28 It is a partial structural schematic diagram of the plate changing mechanism in the present invention. Figure 29 It is a structural schematic diagram of the flattening device in the present invention. Figure 30 It is a plate changing schematic diagram of the plate changing mechanism in the present invention. Figure 31 It is a structural schematic diagram of the unloading mechanism in the present invention. Figure 32 It is a partial structural schematic diagram of the unloading mechanism in the present invention. Figure 33 It is a partial structural schematic diagram of the unloading mechanism in the present invention. Figure 34 It is a partial structural schematic diagram of the unloading mechanism in the present invention. Figure 35 It is a partial structural schematic diagram of the unloading mechanism in the present invention. Detailed implementation manners

[0019] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0020] This technical solution provides a patch capacitor capping production line based on a thick rubber plate, including an assembly mechanism, an implanting mechanism 2, a pressing-in mechanism 3, a leveling mechanism 4, a dipping mechanism 5, a drying mechanism, a cooling and storage mechanism 6, a board-changing mechanism 7, a discharging mechanism 8, and a transfer gripper;

[0021] There are two of the dipping mechanism 5, the drying mechanism, and the cooling and storage mechanism 6, and the assembly mechanism, the implanting mechanism 2, the pressing-in mechanism 3, the leveling mechanism 4, one dipping mechanism 5, one drying mechanism, one cooling and storage mechanism 6, the board-changing mechanism 7, the other dipping mechanism 5, the other drying mechanism, the other cooling and storage mechanism 6, and the discharging mechanism 8 are arranged in sequence;

[0022] The assembly mechanism is used to place the lead-in board 92 on the top of the thick rubber plate 93 to form an assembly;

[0023] There are multiple transfer grippers, and the transfer grippers are used to grip and move the thick rubber plate 93.

[0024] In order to realize the full-automatic operation of the patch capacitor capping process using the thick rubber plate as a carrier, thereby improving the capping efficiency of the patch capacitor and the capping accuracy, and reducing the labor cost during the capping process, this technical solution proposes a patch capacitor capping production line based on a thick rubber plate, as Figure 1 shown, including an assembly mechanism (not shown in the figure) for placing the lead-in board 92 on the top of the thick rubber plate 93 to form an assembly, an implanting mechanism 2 for implanting the patch capacitor to be capped into the lead-in board 92, a pressing-in mechanism 3 for pressing the patch capacitor located on the lead-in board 92 into the thick rubber plate 93, a leveling mechanism 4 for leveling the end (i.e., the first end) of the patch capacitor, a dipping mechanism 5 for dipping the first end of the patch capacitor located on the thick rubber plate 93, a drying mechanism (not shown in the figure), a cooling and storage mechanism 6, a board-changing mechanism 7 for replacing the patch capacitor from the old thick rubber plate 93 to the new thick rubber plate 93 and making the uncapped second end of the patch capacitor protrude from the new thick rubber plate 93, a discharging mechanism 8 for unloading the capped patch capacitor from the thick rubber plate 93, and a transfer gripper (not shown in the figure) for realizing the transfer of the thick rubber plate 93 or the assembly formed by the thick rubber plate 93 and the lead-in board 92 among the above-mentioned mechanisms. Through the setting of the above-mentioned mechanisms, this solution can realize the full-automatic operation of the patch capacitor capping process using the thick rubber plate as a carrier, effectively improve the capping efficiency of the patch capacitor and the capping accuracy, and at the same time is beneficial to reducing the labor cost during the capping process.

[0025] Specifically, the assembly mechanism, implanting mechanism 2, pressing mechanism 3, leveling mechanism 4, first dipping slurry mechanism 5, first drying mechanism, first cooling and storage mechanism 6, board changing mechanism 7, second dipping slurry mechanism 5, second drying mechanism, second cooling and storage mechanism 6 and unloading mechanism 8 of this solution are arranged in sequence along the feeding direction of the chip capacitor 91, so that the chip capacitor end-sealing production line in this solution includes the following working processes: (1) Use the assembly mechanism to place the guiding board 92 on the top of the thick glue board 93 to form an assembly, and then use the transfer gripper to grasp the thick glue board 93 and transfer the assembly to the feeding end of the implanting mechanism 2; (2) Use the implanting mechanism 2 to implant the chip capacitor to be end-sealed into the guiding board 92, and then use the transfer gripper to grasp the thick glue board 93 and transfer the assembled body after implantation to the feeding end of the pressing mechanism 3; (3) Use the pressing mechanism 3 to press the chip capacitor located on the guiding board 92 into the thick glue board 93, and then use the leveling mechanism 4 to make the first end of the chip capacitor protruding from the thick glue board 93 flush, and then use the transfer gripper to grasp the thick glue board 93 and transfer the thick glue board 93 to the feeding end of the dipping slurry mechanism 5; (4) Make the thick glue board 93 implanted with the chip capacitor enter the first group of dipping slurry mechanism 5, drying mechanism and cooling and storage mechanism 6 in sequence, so as to complete the end-sealing of the first end of the chip capacitor; (5) Use the board changing mechanism 7 to replace the chip capacitor from the old thick glue board 93 to the new thick glue board 93, and make the second end of the chip capacitor protrude from the new thick glue board 93, and then use the transfer gripper to grasp the new thick glue board 93 and transfer the thick glue board 93 to the feeding end of the dipping slurry mechanism 5; (6) Make the new thick glue board 93 implanted with the chip capacitor enter the second group of dipping slurry mechanism 5, drying mechanism and cooling and storage mechanism 6 in sequence, so as to complete the end-sealing of the second end of the chip capacitor; (7) Use the unloading mechanism 8 to unload the end-sealed chip capacitor from the thick glue board 93 to obtain the chip capacitor with both ends end-sealed.

[0026] It should be noted that the drying mechanism and transfer gripper of this solution are common structures in the art, and their specific structures will not be elaborated here. Specifically, the drying mechanism of this solution can use the Chinese utility model patent "A drying device for chip capacitor end-sealing" with the publication number of CN221197945U, which is not limited here.

[0027] It needs to be further explained that in order to ensure the assembly and movement stability of the guiding board 92 and the thick glue board 93, generally, positioning blocks (not shown in the figure) are provided on the lower surface of the guiding board 92, and positioning grooves matching the above positioning blocks are provided on the upper surface of the thick glue board 93, as Figure 2 shown, and the guiding holes of the guiding board 92 correspond to the board holes of the thick glue board 93 one by one after assembly.

[0028] Furthermore, the assembly mechanism includes a thick glue board storage rack, a guiding board storage rack 1 and a board taking device;

[0029] The thick rubber plate storage rack is used to store the thick rubber plate 93, the introduction plate storage rack 1 is used to store the introduction plate 92, and the plate taking device is used to move the introduction plate 92.

[0030] In a preferred embodiment of the present technical solution, the assembly mechanism includes a thick rubber plate storage rack (not shown in the figure), an introduction plate storage rack 1, and a plate taking device (not shown in the figure). By moving the introduction plate 92 located in the introduction plate storage rack 1 above the thick rubber plate located in the thick rubber plate storage rack, the assembly of the two can be easily achieved.

[0031] It should be noted that the plate taking device in this solution can be conventional structures such as suction cups and clamping jaws commonly used in the art, and the specific structure thereof will not be elaborated here.

[0032] Furthermore, the implantation mechanism 2 includes a mounting base 21, a mounting seat 22, an implantation device 23, an implantation conveying device 24, and a motor vibration device 25;

[0033] The mounting seat 22 is installed on the top of the mounting base 21, and the center of the top of the mounting base 21 is rotatably connected to the center of the bottom of the mounting seat 22 through a bearing seat, and the mounting seat 22 swings relative to the mounting base 21;

[0034] Both the implantation device 23 and the implantation conveying device 24 are installed above the mounting seat 22, and the implantation conveying device 24 is located inside the implantation device 23; the implantation conveying device 24 is used to convey the assembled body to the implantation device 23, and the conveying direction of the implantation conveying device 24 is parallel to the swinging direction of the mounting seat 22;

[0035] The motor vibration device 25 is installed at the bottom of the mounting seat 22, and the output end of the motor vibration device 25 is connected to the implantation device 23, and the motor vibration device 25 is used to drive the implantation device 23 to vibrate relative to the mounting seat 22;

[0036] The implantation device 23 includes an implantation chassis 231, an implantation top plate 232, and an implantation frame 233 which are sequentially arranged at intervals from bottom to top. The implantation chassis 231 and the implantation frame 233 are connected by vertically extending support columns. The implantation top plate 232 is movably arranged between the implantation chassis 231 and the implantation frame 233, and the conveying surface of the implantation conveying device 24 is located above the implantation top plate 232;

[0037] The bottom of the implanting frame 233 includes a placement position 2331 and an avoidance position 2332, and the placement position 2331 and the avoidance position 2332 are connected in sequence along a direction perpendicular to the conveying direction of the implanting conveying device 24; the placement position 2331 is used for placing the patch capacitor 91 to be implanted, and the implanting top plate 232 is used to abut the guiding plate 92 to be implanted against the avoidance position 2332.

[0038] In the prior art, the implanting device used in the end-capping process of the patch capacitor generally uses an electromagnet to achieve the vibration implantation of the product. However, since the electromagnet generates a magnetic field by the flow of current in the wire, this magnetic field can attract or repel other magnetic materials. That is to say, the electromagnet may cause a resonance phenomenon in the structures of other magnetic materials in the implanting mechanism 2.

[0039] Therefore, in order to avoid the resonance phenomenon of the electromagnet in the structures of other magnetic materials in the implanting mechanism 2, and thus prevent unnecessary vibrations from being generated in the structures of other magnetic materials, the structure of the implanting mechanism 2 is optimized in this solution, such as Figures 3 - 7 As shown, it includes a mounting base 21, a mounting seat 22, an implanting device 23, an implanting conveying device 24, and a motor vibration device 25. This solution uses the motor vibration device 25 to replace the electromagnet in the prior art to achieve the vibration implantation of the patch capacitor. Since the motor vibration device 25 is driven by a motor and its output end is only connected to the implanting device 23, therefore, during the implanting process, after the vibration is applied to the implanting device 23, the patch capacitor located in the implanting device 23 can be driven to vibrate, and combined with the swinging action of the mounting seat 22, the effective implantation of the patch capacitor on the guiding plate 92 can be achieved. It should be noted that since the vibration of the motor vibration device 25 directly acts on the implanting device 23 through mechanical connection and the amplitude of the vibration is very small, the resonance phenomenon between structures can be effectively avoided, and the service life of the mechanism can be prolonged.

[0040] Specifically, the implantation process of the implantation mechanism 2 in this solution includes the following steps: (1) Use the implantation delivery device 24 to deliver the assembly formed by the guiding plate 92 and the thick glue plate 93 above the implantation top plate 232 of the implantation device 23; at the same time, feed the patch capacitor to be implanted into the placement position 2331 of the implantation frame 233; (2) The implantation top plate 232 moves upward and pushes up the assembly located on the implantation delivery device 24, so that the guiding plate 92 in the assembly abuts against the avoidance position 2332; (3) Swing the mounting seat 22 relative to the mounting base 21, and at the same time use the motor vibration device 25 to drive the implantation device 23 to vibrate relative to the mounting seat 22, so that the patch capacitor located in the placement position 2331 enters the avoidance position 2332 and is vibrated and implanted into the guiding holes of the guiding plate 92; (4) After the implantation is completed, the motor vibration device 25 is turned off and the mounting seat 22 is reset; then the implantation top plate 232 is moved downward, and the assembly implanted with the patch capacitor is dropped back to the conveying surface of the implantation delivery device 24, and finally conveyed to the next process by the implantation delivery device 24.

[0041] It should be noted that the implantation delivery device 24 used in this solution is a conventional delivery device in the art, and specifically may be a conveyor belt, which is not limited herein.

[0042] Preferably, the motor vibration device 25 includes a rotating motor 251, a transmission rod 252 and a driving rod 253; the rotating motor 251 is installed at the bottom of the mounting seat 22;

[0043] The transmission rod 252 is rotatably connected to the output end of the rotating motor 251, and the end of the transmission rod 252 is rotatably connected to the end of the driving rod 253;

[0044] The top end of the driving rod 253 passes through the mounting seat 22 and is fixedly connected to the implantation chassis 231.

[0045] Specifically, the motor vibration device 25 in this solution is powered by the rotating motor 251, and the vibration is transmitted to the implantation chassis 231 of the implantation device 23 by the transmission rod 252 and the driving rod 253 that are rotatably connected to each other. The structure is simple and the volume is compact, which can effectively prevent the vibration from being transmitted to other unnecessary mechanisms.

[0046] Preferably, the implantation device 23 further includes a limiting rod 234, and the limiting rod 234 is movably installed on the front side of the implantation chassis 231 up and down, and the limiting rod 234 can extend out and retract from the conveying surface of the implantation delivery device 24.

[0047] In a preferred embodiment of the present technical solution, through the arrangement of the limiting rod 234, the positioning and conveying of the assembly can be achieved on the premise that the implant delivery device 24 does not stop, thereby avoiding the frequent start and stop of the implant delivery device 24, which has adverse effects on mechanical performance, service life, energy consumption, maintenance cost and other aspects.

[0048] Preferably, the implant device 23 further includes a slider 235, and the slider 235 is prominently installed on both sides of the bottom of the implant chassis 231;

[0049] On both sides of the top of the mounting seat 22, there are prominently provided slide rails 221, and the extending direction of the slide rails 221 is parallel to the conveying direction of the implant delivery device 24;

[0050] The slider 235 is slidably connected to the slide rail 221.

[0051] In another preferred embodiment of the present technical solution, the implant device 23 is mounted on the top of the mounting seat 22 through the cooperation of the slider 235 and the slide rail 221. On the premise of the stable installation of the implant device 23 on the top of the mounting seat 22, sufficient vibration space can be provided for the slight vibration of the implant device 23 relative to the mounting seat 22, thereby ensuring the implant effect of the implant device 23.

[0052] Preferably, at least two groups of implant devices 23 are provided, and the two groups of implant devices 23 are arranged side by side along the conveying direction of the implant delivery device 24;

[0053] The implant delivery device 24 is located inside the two groups of implant devices 23;

[0054] There are two driving rods 253. The two ends of the transmission rod 252 are respectively rotatably connected to the ends of the two driving rods 253. The top end of one driving rod 253 passes through the mounting seat 22 and is fixedly connected to the implant chassis 231 of one implant device 23, and the top end of the other driving rod 253 passes through the mounting seat 22 and is fixedly connected to the implant chassis 231 of the other implant device 23.

[0055] In order to improve the implant efficiency of the implant mechanism 2, this solution can also be provided with at least two groups of implant devices 23 on the top of the mounting seat 22, and the two groups of implant devices 23 can share a group of implant delivery devices 24 and a group of motor vibration devices 25, so as to improve the implant efficiency of the implant mechanism 2 on the premise of not additionally increasing equipment costs.

[0056] Preferably, the upper surface of the implant chassis 231 is prominently provided with a U-shaped border 2311, and the border 2311 is arranged close to the edge of the implant chassis 231;

[0057] The end of the implant chassis 231 is recessed inwardly to form a material receiving groove 2312, and the opening of the peripheral edge 2311 faces the material receiving groove 2312;

[0058] The placing position 2331 and the material receiving groove 2312 are respectively located on both sides of the swing axis of the mounting seat 22.

[0059] In addition, in this solution, a peripheral edge 2311 for preventing the chip capacitors from scattering to other parts of the implant mechanism 2 is further provided on the upper surface of the implant chassis 231, so that during the vibration of the implant, the chip capacitors falling from the placing position 2331 are always located on the upper surface of the implant chassis 231 and are recycled by the material receiving groove 2312 during the swinging process of the mounting seat 22, which facilitates the collection of products and avoids waste of products.

[0060] Furthermore, the pressing mechanism 3 includes a detection and conveying device 31, a first cleaning device 32, a detection device 33, a pressing and conveying device 34, and a needle bed pressing device 35;

[0061] The detection and conveying device 31 and the pressing and conveying device 34 are connected end to end in sequence, and the pressing and conveying device 34 moves up and down relative to the detection and conveying device 31, and the needle bed pressing device 35 is located inside the pressing and conveying device 34;

[0062] The first cleaning device 32 and the detection device 33 are sequentially arranged on the detection and conveying device 31 along the conveying direction of the detection and conveying device 31. The detection and conveying device 31 is used to convey the assembly, the first cleaning device 32 is used to clean the upper surface of the assembly, and the detection device 33 is used to detect whether there are foreign objects on the upper surface of the assembly placed on the detection and conveying device 31;

[0063] The needle bed pressing device 35 includes an upper platform 351 and a lower platform 352 which are oppositely arranged in the vertical direction, and the upper platform 351 is located above the lower platform 352. The upper platform 351 moves up and down relative to the lower platform 352. The placing surface of the lower platform 352 is within the range of the up and down movement of the pressing and conveying device 34. The upper platform 351 is used to press the chip capacitor 91 in the lead-in plate 92 of the assembly into the plate holes of the thick glue plate 93.

[0064] During the capping process of the chip capacitor, manual confirmation and intervention are often required multiple times before and after the process of pressing the chip capacitor located in the introduction board 92 into the board holes of the thick glue board 93 through the bed of needles. This is because the pressing of the bed of needles is a mechanical hard pressing driven by a motor. If the chip capacitor located in the introduction board 92 has an inclined implantation position, or even fails to be implanted and rolls and stays on the surface of the introduction board 92, during the pressing process of the bed of needles, it may cause situations such as product deformation, needle breakage of the bed of needles, blockage of the introduction holes / board holes, and damage to the introduction board / thick glue board.

[0065] To avoid the occurrence of the above situations, this technical solution proposes a pressing mechanism 3, as Figures 8 - 11 shown, including a detection and conveying device 31, a first cleaning device 32, a detection device 33, a pressing and conveying device 34, and a bed-of-needles pressing device 35. Before using the bed-of-needles pressing device 35 to press the chip capacitor located in the introduction board 92 into the board holes of the thick glue board 93, this solution first cleans the upper surface of the assembly through the first cleaning device 32, so as to remove the products that are not implanted in the introduction holes and / or the products that are obliquely inserted into the introduction holes on the surface of the introduction board 92; then it detects whether there are foreign objects on the upper surface of the assembly through the detection device 33 to ensure the smooth progress of the subsequent pressing process.

[0066] Specifically, the pressing process of the pressing mechanism 3 in this solution includes the following steps: (1) Use the detection and conveying device 31 to convey the assembly formed by combining the introduction board 92 and the thick glue board 93 to the first cleaning device 32, and use the first cleaning device 32 to clean the upper surface of the assembly; (2) Use the detection and conveying device 31 to convey the assembly to below the detection device 33, and detect whether there are foreign objects on the upper surface of the assembly through the detection device 33; (3) Use the detection and conveying device 31 to continue to convey the assembly forward, and make the conveying surface of the pressing and conveying device 34 move to be flush with the conveying surface of the detection and conveying device 31, and the pressing and conveying device 34 catches the assembly; (4) Use the pressing and conveying device 34 to convey the assembly to directly above the lower platform 352, and then the pressing and conveying device 34 moves downward, so that the assembly located on the pressing and conveying device 34 is placed on the placing surface of the lower platform 352; (5) The upper platform 351 moves downward relative to the lower platform 352, and presses the chip capacitor 91 located in the introduction board 92 in the assembly into the board holes of the thick glue board 93 through the upper platform 351; (6) After the pressing is completed, the upper platform 351 resets upward, and at the same time the pressing and conveying device 34 resets upward and makes the assembly leave the placing surface of the lower platform 352. Finally, the pressing and conveying device 34 conveys the assembly to the next process.

[0067] It should be noted that the detection and conveying device 31 and the pressing and conveying device 34 used in this solution are conventional conveying devices in the art, and can specifically be conveying belts, which are not limited herein.

[0068] Preferably, the detection device 33 includes a detection platform 331 and a displacement detection probe;

[0069] The detection platform 331 is located above the detection conveying device 31, and the detection platform 331 moves up and down relative to the detection conveying device 31;

[0070] A plurality of displacement detection probes are provided, and the plurality of displacement detection probes are embedded in the detection platform 331. The displacement detection probes are used to detect whether there are foreign objects on the upper surface of the assembly placed on the detection conveying device 31.

[0071] In this embodiment, the displacement detection probe (not shown in the figure) is used to detect whether there is a product or other impurities on the surface of the introduction plate 92. Based on the data fed back by the displacement detection probe, problems can be discovered in a timely manner, and an alarm can be given in time when problems occur, so that the corresponding staff can handle them. When the subsequent product is pressed in, the probability of product deformation, needle bed needle breakage, introduction hole / plate hole blockage, introduction plate / thick rubber plate bad plate and other situations can be effectively reduced.

[0072] It should be noted that the displacement detection probe used in this solution is a common sensor in the art, and specifically can be a capacitive displacement sensor, which is not limited herein.

[0073] Preferably, the pressing mechanism 3 further includes a detection limit block 36, and the detection limit block 36 is located on the front side of the detection device 33;

[0074] The detection limit block 36 is movably mounted up and down inside the detection conveying device 31, and the detection limit block 36 can extend out and retract from the conveying surface of the detection conveying device 31.

[0075] In a preferred embodiment of this technical solution, through the setting of the detection limit block 36, the positioning and conveying of the assembly can be realized on the premise that the detection conveying device 31 does not stop, thereby avoiding the frequent start and stop of the detection conveying device 31, which has an adverse impact on multiple aspects such as mechanical performance, service life, energy consumption and maintenance cost.

[0076] Preferably, the pressing mechanism 3 further includes a second cleaning device 37. The second cleaning device 37 is located between the detection conveying device 31 and the pressing conveying device 34, and the cleaning surface of the second cleaning device 37 is flush with the conveying surface of the detection conveying device 31;

[0077] The second cleaning device 37 is used to clean the lower surface of the assembly.

[0078] As a more optimal embodiment of the present technical solution, a second cleaning device 37 for cleaning the lower surface of the assembly is further provided between the detection conveying device 31 and the press-in conveying device 34 to further ensure the smooth progress of the press-in step and further avoid situations such as product deformation, needle bed needle breakage, import hole / plate hole blockage, and import plate / thick rubber plate damage.

[0079] Preferably, the first cleaning device 32 includes a first rolling brush 321 and a first material receiving tray 322 that are oppositely arranged in the vertical direction, and the first rolling brush 321 is located above the detection conveying device 31, and the first material receiving tray 322 is located below the detection conveying device 31;

[0080] The second cleaning device 37 includes a second rolling brush 371 and a second material receiving tray 372 that are oppositely arranged in the vertical direction, and the cleaning surface of the second rolling brush 371 is flush with the conveying surface of the detection conveying device 31, and the second material receiving tray 372 is located at the bottom of the second rolling brush 371.

[0081] In this way, it is beneficial to the effective cleaning and collection of products, thus avoiding waste.

[0082] Preferably, the press-in mechanism 3 further includes a press-in limit block 38, and the press-in limit block 38 is located on the front side of the needle bed press-in device 35;

[0083] The press-in limit block 38 is movably installed up and down inside the press-in conveying device 34, and the press-in limit block 38 can extend out and retract from the conveying surface of the press-in conveying device 34.

[0084] In another preferred embodiment of the present technical solution, through the setting of the press-in limit block 38, the positioning and conveying of the assembly can be realized on the premise that the press-in conveying device 34 does not stop, thereby avoiding the frequent start and stop of the press-in conveying device 34, which has an adverse impact on multiple aspects such as mechanical performance, service life, energy consumption, and maintenance cost.

[0085] Preferably, the upper platform 351 includes a platform mounting plate 3511 and a mesh plate 3512, and the mesh plate 3512 is installed below the platform mounting plate 3511 through spring expansion and contraction; a plurality of press needles protrude from the lower surface of the platform mounting plate 3511, and a plurality of through holes are formed in the plate surface of the mesh plate 3512, and one press needle corresponds to one through hole, and the through holes are used for the press needles to pass through the mesh plate 3512.

[0086] Specifically, the upper platform 351 of this solution includes a platform mounting plate 3511 for installing a press needle (not shown in the figure) and a mesh plate 3512 for the press needle to pass through. The upper platform 351 moves downward relative to the lower platform 352. When the upper platform 351 abuts against the assembly and the platform mounting plate 3511 compresses the spring and continues to move downward, the press needle can pass through the through hole and out of the mesh plate 3512, and press the chip capacitor implanted in the guiding plate 92 into the plate hole of the thick glue plate 93, thereby realizing the pressing process.

[0087] To further illustrate, the leveling mechanism 4 includes a leveling conveyor device 41, a lifting platform 42, a feeding belt 43, a flipping device 44, a guiding plate recycling device, and a leveling device 45;

[0088] The leveling conveyor device 41 includes a conveyor frame 411 and a conveyor tray 412. The conveyor tray 412 is horizontally movably mounted on the top of the conveyor frame 411, and the conveyor tray 412 is used for holding the thick glue plate 93;

[0089] The lifting platform 42, the feeding belt 43, the flipping device 44, and the guiding plate recycling device are sequentially arranged opposite to each other from bottom to top at the feeding end of the conveyor frame 411. Both the lifting platform 42 and the feeding belt 43 are located at the inner bottom of the conveyor frame 411, and both the flipping device 44 and the guiding plate recycling device are arranged on the top of the conveyor frame 411;

[0090] The lifting platform 42 can move up and down relative to the feeding belt 43 and the flipping device 44, and the lifting platform 42 can pass through the conveying surfaces of the feeding belt 43 and the leveling conveyor device 42; the shape of the conveyor tray 412 is U-shaped, and an avoidance opening is provided in the middle of the conveyor tray 412, and the avoidance opening is used for avoiding the lifting platform 42;

[0091] The leveling device 45 is located in front of the flipping device 44, and the leveling device 45 includes a leveling clamp 451 and a leveling platform 452 which are oppositely arranged in the vertical direction. The leveling clamp 451 is located above the conveyor frame 411, and the leveling clamp 451 can move up and down relative to the conveyor frame 411. The leveling platform 452 is located below the conveyor frame 411, and the leveling clamp 451 is used for clamping the thick glue plate 93.

[0092] During the capping process of the chip capacitor, in the prior art, generally, the chip capacitor located in the guiding plate 92 is pressed into the plate hole of the thick glue plate 93 through a pin bed, and only the press needle of the pin bed is used to make the end faces of the protruding ends of the chip capacitors implanted in the thick glue plate 93 relatively flush, and no additional leveling step is added.

[0093] However, since there are also tolerances in the needle pressing in the needle bed, and there are slight differences in the clamping force of each board hole in the thick rubber plate 93 on the patch capacitor, it is necessary to level the end face of the patch capacitor in the thick rubber plate 93 before dipping the slurry to ensure the capping quality of the patch capacitor.

[0094] Therefore, this technical solution proposes a leveling mechanism 4, as Figures 12 - 15 shown, which includes a leveling conveying device 41, a lifting platform 42, a feeding belt 43, a flipping device 44, a guide plate recycling device (not shown in the figure), and a leveling device 45.

[0095] Specifically, the leveling process of the leveling mechanism 4 in this solution includes the following steps: (1) Use the feeding belt 43 to convey the assembly transported from the previous process above the lifting platform 42, and at the same time move the conveying tray 412 away from the feeding end of the conveying rack 411; (2) The lifting platform 42 moves upward and lifts the assembly off the conveying surface of the feeding belt 43, and the guide plate recycling device takes away the guide plate 92 located at the top of the assembly, and then the flipping device 44 clamps the remaining thick rubber plate 93 in the assembly; (3) The lifting platform 42 moves downward to reserve sufficient space for the flipping of the flipping device 44, and at the same time move the conveying tray 412 below the flipping device 44, and the flipping device 44 flips the thick rubber plate 93 by 180°; At this time, the end of the patch capacitor 91 to be capped protrudes from the lower surface of the thick rubber plate 93; (4) After the lifting platform 42 moves upward and picks up the thick rubber plate 93, place the thick rubber plate 93 on the top of the conveying tray 412; (5) The conveying tray 412 conveys forward and conveys the thick rubber plate 93 directly above the leveling platform 452; (6) Use the leveling clamp 451 to clamp the thick rubber plate 93, and move the thick rubber plate 93 downward to the top of the leveling platform 452. After the end of the patch capacitor 91 in the thick rubber plate 93 abuts against the upper surface of the leveling platform 452, the ends of the patch capacitors 91 are flush, completing the leveling action.

[0096] It should be noted that the thick rubber plate 93 after the leveling action can be conveyed to the discharging end of the leveling conveying device 41 through the conveying tray 413, which is not limited here. The guide plate recycling device used in this solution can be a manipulator for conveying the guide plate to the guide plate storage rack 1, and a jaw or suction cup for moving the guide plate 92 is installed at the output end of the manipulator, which is not limited here.

[0097] Preferably, the leveling fixture 451 includes a leveling mounting base 4511 and a fixture assembly. The leveling mounting base 4511 is erected directly above the conveyor frame 411, and the leveling mounting base 4511 moves up and down relative to the conveyor frame 411. There are two sets of the fixture assemblies, and the two sets of the fixture assemblies are oppositely arranged on both sides of the bottom of the leveling mounting base 4511. The fixture assembly is used for clamping the thick rubber sheet 93.

[0098] The fixture assembly includes a horizontally extending cylinder 4512, a bottom extending cylinder 4513, and a clamping piece 4514.

[0099] The horizontally extending cylinder 4512 is installed on the edge of the leveling mounting base 4511, and the output end of the horizontally extending cylinder 4512 can move away from and close to the center of the leveling mounting base 4511.

[0100] The output end of the horizontally extending cylinder 4512 is installed with the bottom extending cylinder 4513, and the output end of the bottom extending cylinder 4513 can move up and down relative to the leveling mounting base 4511.

[0101] The output end of the bottom extending cylinder 4513 is installed with the clamping piece 4514.

[0102] In a preferred embodiment of this technical solution, the leveling fixture 451 includes a leveling mounting base 4511 and two sets of fixture assemblies for clamping the thick rubber sheet 93. Among them, the fixture assembly includes a horizontally extending cylinder 4512 and a bottom extending cylinder 4513 that can respectively realize the horizontal movement and vertical movement of the clamping piece 4514. The above two driving structures enable the fixture assembly to flexibly and effectively clamp the thick and heavy rubber sheet 93, ensuring the stable operation of the leveling mechanism 4.

[0103] Preferably, the flipping device 44 includes two sets of flipping components oppositely arranged in the horizontal direction, and the two sets of flipping components are respectively erected on both sides of the conveyor frame 411.

[0104] The flipping component includes a flipping mounting bracket 441, a laterally extending cylinder 442, a flipping motor 443, and a flipping jaw 444.

[0105] The laterally extending cylinder 442 is detachably installed on the conveyor frame 411 through the flipping mounting bracket 441.

[0106] The output end of the laterally extending cylinder 442 can move away from and close to the center of the conveyor frame 411, and the output end of the laterally extending cylinder 442 is installed with the flipping motor 443.

[0107] The output end of the flipping motor 443 is installed on the flipping jaw 444 for clamping the thick rubber sheet 93, and the flipping jaw 444 rotates relative to the conveying rack 411 through the flipping motor 443.

[0108] In another preferred embodiment of the present technical solution, the flipping device 44 includes two sets of flipping components for clamping the thick rubber sheet 93. Among them, the flipping component includes a lateral extension cylinder 442 and a flipping motor 443 that can respectively achieve the horizontal movement and rotation of the flipping jaw 444. The above two driving structures enable the flipping component to flexibly and effectively clamp and flip the relatively heavy thick rubber sheet 93, ensuring the stable operation of the leveling mechanism 4.

[0109] Preferably, the leveling and conveying device 42 further includes a blanking tray 413, which is horizontally movably installed on the top of the conveying rack 411, and the blanking tray 413 is located on the front side of the conveying tray 412.

[0110] In a more optimal embodiment of the present technical solution, the thick rubber sheet 93 after the leveling action can be conveyed to the blanking end of the leveling and conveying device 41 by the blanking tray 413, so that while the leveling mechanism 4 discharges the material after leveling, the conveying tray 412 is used to level the next thick rubber sheet 93, facilitating the improvement of the leveling efficiency of the leveling mechanism 4.

[0111] Preferably, a plurality of support blocks 414 are prominently arranged on the upper surfaces of the conveying tray 412 and the blanking tray 413, and the plurality of support blocks 414 are used to support the thick rubber sheet 93.

[0112] In this way, it is beneficial to the positioning and conveying of the thick rubber sheet 93 and also facilitates the clamping of the thick rubber sheet 93 by other devices.

[0113] Preferably, the leveling mechanism 4 further includes a cleaning device 46, and the cleaning device 46 is located between the flipping device 44 and the leveling device 45;

[0114] The cleaning device 46 includes an upper roller brush 461, a lower roller brush 462 and a product receiving tray 463;

[0115] The upper roller brush 461 is arranged above the conveying rack 411, and the upper roller brush 461 is used to clean the upper surface of the thick rubber sheet 93; the lower roller brush 462 is arranged below the conveying rack 411, and the lower roller brush 462 is used to clean the lower surface of the thick rubber sheet 93;

[0116] The product receiving tray 463 is located directly below the upper roller brush 461 and the lower roller brush 462.

[0117] To further ensure the smooth progress of the leveling step, a cleaning device 46 for cleaning the upper and lower surfaces of the thick glue plate 93 is additionally provided between the flipping device 44 and the leveling device 45 in this solution, so as to prevent abnormal products or impurities remaining on the upper and lower surfaces of the thick glue plate 93 from affecting the end alignment of the chip capacitors.

[0118] More specifically, the dipping mechanism 5 includes a dipping device 51, a transfer conveyor 52, a transfer gripper 53, a pre-drying device 54, a pre-cooling device 55, a blanking conveyor 56 and a feeding gripper 57;

[0119] The transfer conveyor 52, the pre-drying device 54, the pre-cooling device 55 and the blanking conveyor 56 are connected end to end in sequence, and the transfer conveyor 52 moves up and down relative to the pre-drying device 54, and the blanking conveyor 56 moves up and down relative to the pre-cooling device 55;

[0120] At least two groups of dipping devices 51 are provided, and the loading ends of all the dipping devices 51 and the blanking conveyor 56 are within the moving range of the feeding gripper 57, and the feeding gripper 57 is used to transfer the thick glue plate 93 between the loading end of the dipping device 51 and the blanking conveyor 56; the unloading ends of all the dipping devices 51 and the transfer conveyor 52 are within the moving range of the transfer gripper 53, and the transfer gripper 53 is used to transfer the thick glue plate 93 between the unloading end of the dipping device 51 and the transfer conveyor 52.

[0121] When the existing capping machine dips the chip capacitors, it generally only drives the chip capacitors to press down on the slurry tray once to complete the capping of their ends. In addition, in order to enable the slurry in the slurry tray to effectively adhere to the ends of the chip capacitors during a single pressing process, the slurry used is generally relatively thick.

[0122] Since the capping slurry is relatively thick, it is easy to form an irregular capping layer shape at the ends of the dipped chip capacitors, resulting in air bubbles between the end surfaces of the chip capacitors and the capping layer, causing uneven thickness of the capping layer and poor bonding, thus affecting the capping quality of the chip capacitors. Further, the capping requirement of the chip capacitors is generally to form a straight capping line on the capacitor surface. However, for the chip capacitors capped with a slurry having a relatively high viscosity, the capping lines are generally not straight, and it is easy to generate a sagging phenomenon outside the capping layer, which also affects the capping quality of the chip capacitors.

[0123] In order to enable the slurry to effectively adhere to the ends of the chip capacitors and ensure that the capping layer has the required thickness and a straight capping line, this technical solution proposes a dipping mechanism 5, as Figure 16As shown in the figure, it includes at least two groups of dipping devices 51, a transfer conveyor 52, transfer grippers 53, a pre-drying device 54, a pre-cooling device 55, a discharging conveyor 56 and feeding grippers 57.

[0124] In this solution, at least two groups of dipping devices 51 are introduced into the dipping mechanism 5. During the dipping process of the patch capacitor, the first group of dipping devices 51 can be used to pre-dip the ends of the patch capacitor first, and after drying and cooling through the pre-drying device 54 and the pre-cooling device 55, a pre-dipped layer is formed. Then, the second group of dipping devices 51 is used to formally dip the patch capacitor, thus completing the dipping process of the patch capacitor. At least two dipping processes are realized in the dipping mechanism 5 of this solution. The existence of the pre-dipped layer is beneficial to improving the bonding property between the paste and the patch capacitor during the formal dipping process, ensuring that the surface of the sealing layer of the patch capacitor is flat and the end-sealing line is straight, so as to ensure the end-sealing quality of the patch capacitor. In addition, the two groups of dipping devices 51 in this solution share the same group of pre-drying device 54 and pre-cooling device 55, which is beneficial to reducing the occupied space of the equipment and saving the equipment cost.

[0125] It should be noted that in a specific embodiment, the first group of dipping devices 51 can be used to pre-dip the ends of the patch capacitor one or more times with a relatively thin paste, and then the second group of dipping devices 51 can be used to formally dip the ends of the patch capacitor one or more times with a paste of normal consistency. In another specific embodiment, the same group or multiple groups of dipping devices 51 can also be used to dip the patch capacitor multiple times with a paste of the same thin viscosity. This is not limited here and can be selected according to the end-sealing quality as required. In this solution, multiple dipping processes are realized by using multiple groups of dipping devices 51, which can further improve the end-sealing effect and quality of the patch capacitor.

[0126] It should be further noted that the transfer conveyor 52, transfer grippers 53, pre-drying device 54, pre-cooling device 55, discharging conveyor 56 and feeding grippers 57 used in this solution are all conventional structures in the art, and their specific structures will not be described in detail here. In some specific embodiments, the transfer conveyor 52 and the discharging conveyor 56 of this solution can be liftable conveyor belts, the pre-drying device 54 can be a conventional infrared heating device, and the pre-cooling device 55 can be externally connected to a cold air device. The cold air device is used to convey cold air into the interior of the pre-cooling device, so as to cool the patch capacitor of the thick rubber plate 93.

[0127] Specifically, the dipping process of a specific embodiment of the dipping mechanism 5 in this solution includes the following steps: (1) Use the feeding gripper 57 to load the thick glue board 93 implanted with the chip capacitor 91 to the feeding end of the dipping device 51 of the first group; at this time, the end of the chip capacitor 91 to be dipped protrudes from the lower surface of the thick glue board 93; (2) Use the dipping device 51 of the first group to dip the end of the chip capacitor 91; (3) Make the transfer conveyor 52 move downward, and make the transfer conveyor 52 and the dipping device 51 of the first group at the same height, and then use the transfer gripper 53 to move the thick glue board 93 at the discharging end of the first group of dipping devices 51 to the top of the transfer conveyor 52; (4) Make the transfer conveyor 52 move upward, and make the transfer conveyor 52 and the pre-drying device 54 at the same height, and then use the transfer conveyor 52 to convey the dipped thick glue board 93 into the pre-drying device 54 for drying, and then enter the pre-cooling device 55 for cooling, and then temporarily store it on the discharging conveyor 56 (at this time, the discharging conveyor 56 and the pre-cooling device 55 are at the same height); (5) Make the discharging conveyor 56 move downward, and make the discharging conveyor 56 and the dipping device 51 of the second group at the same height, and use the dipping device 51 of the second group to dip the end of the chip capacitor 91; (6) Repeat steps (3) and (4), so that the chip capacitor 91 after the second dipping is dried and cooled again, and then temporarily stored on the discharging conveyor 56 again, waiting to enter the next process.

[0128] Furthermore, the dipping device 51 includes a mounting frame 511, a slurry pan 512, a slurry spreading assembly 513, a dipping fixture 514, and a loading tray 515;

[0129] The mounting frame 511 includes a support base 5111 and a conveying bracket 5112;

[0130] The support base 5111 is erected above the slurry pan 512, and the slurry pan 512 moves horizontally relative to the support base 5111; the conveying bracket 5112 is horizontally extended and installed on the support base 5111, and the extending direction of the conveying bracket 5112 is parallel to the moving direction of the slurry pan 512, and the conveying bracket 5112 is located above the slurry pan 512;

[0131] The slurry spreading assembly 513 is installed on one side of the support base 5111, and the slurry spreading assembly 513 is located on the top of the slurry pan 512; the slurry spreading assembly 513 moves up and down relative to the slurry pan 512, and the slurry spreading assembly 513 is used to spread a slurry layer on the top of the slurry pan 512;

[0132] The loading tray 515 is horizontally movably installed on the conveying bracket 5112;

[0133] The dipping fixture 514 is movably mounted on the support base 5111 in the vertical direction. The upper limit of the movement of the dipping fixture 514 is above the transfer bracket 5112, and the lower limit of the movement of the dipping fixture 514 is above the slurry pan 512.

[0134] Further, to ensure the smooth and continuous progress of the dipping process, the structure of the dipping device 51 is optimized in this technical solution, such as Figures 17 - 19 shown, including a mounting frame 511, a slurry pan 512, a slurry spreading assembly 513, a dipping fixture 514, and a loading tray 515.

[0135] Specifically, the dipping process of the dipping device 51 in this solution includes the following steps: (1) Use the feeding gripper 57 to load the thick glue board 93 implanted with the chip capacitor 91 onto the loading tray 515 at the loading end of the dipping device 51; at this time, the end of the chip capacitor 91 to be dipped protrudes from the lower surface of the thick glue board 93; (2) Use the loading tray 515 to move the thick glue board 93 below the dipping fixture 514; at the same time, use the slurry spreading assembly 513 to lay a slurry layer on the top of the slurry pan 512, and horizontally move the slurry pan 512 below the dipping fixture 514; (3) After using the dipping fixture 514 to clamp the thick glue board 93 on the loading tray 515, the loading tray 515 returns to its original position; then, the dipping fixture 514 moves downward and contacts the end of the chip capacitor in the thick glue board 93 with the slurry layer on the top of the slurry pan 512; (4) The dipping fixture 514 moves upward, and the loading tray 515 moves below the dipping fixture 514; then, the dipping fixture 514 places the dipped thick glue board 93 back on the loading tray 515, and the loading tray 515 transports the dipped thick glue board 93 to the unloading end of the dipping device 51 to complete the dipping process.

[0136] It should be noted that in a specific embodiment, the slurry spreading assembly 513 in this solution can be a squeegee. After adding the slurry to the slurry pan 512, by cooperating the up-and-down movement of the squeegee with the horizontal movement of the slurry pan 512, a slurry layer with a flat surface and the required thickness can be formed on the slurry pan 512.

[0137] Preferably, the dipping device 51 further includes a defoaming assembly. The defoaming assembly includes a defoaming tray 516 and a defoaming top cover 517, and a negative pressure pipeline is connected to the cover body of the defoaming top cover 517;

[0138] The defoaming tray 516 is horizontally movably mounted on the transfer bracket 5112. The loading tray 515 is located at the loading end of the transfer bracket 5112, and the defoaming tray 516 is located at the unloading end of the transfer bracket 5112;

[0139] The defoaming top cover 517 is installed on the top of the transfer bracket 5112, and the defoaming top cover 517 is located on one side of the support base 5111; the defoaming top cover 517 moves up and down relative to the transfer bracket 5112, and the defoaming top cover 517 is used to cover the defoaming tray 516.

[0140] In the existing capping of chip capacitors, there are mostly small air bubbles inside, which is a shortcoming difficult to avoid in the existing capping technology. The existence of the above small air bubbles directly affects the capping quality of the chip capacitors, thereby affecting the operation of the circuit, and further affecting the quality of electronic products.

[0141] In order to ensure the capping quality of the chip capacitors and avoid the existence of small air bubbles inside their capping layers, the technical solution also adds a defoaming component in the dipping device 51. Specifically, the defoaming component includes a defoaming tray 516 and a defoaming top cover 517. In this solution, the defoaming tray 516 can be used as the feeding carrier of the thick glue board 93 after dipping. After dipping, first move the thick glue board 93 to the lower part of the defoaming top cover 517 through the defoaming tray 516. After using the defoaming top cover 517 to cover the defoaming tray 516, vacuum defoaming is carried out through the negative pressure pipeline (not shown in the figure) arranged at its top, and then the thick glue board 93 is conveyed to the feeding end of the dipping device 51.

[0142] In addition, due to the addition of the defoaming tray 516, the dipping process and the defoaming process of the thick glue board 93 in the dipping device 51 are separated, which is more conducive to accelerating the production beat of the chip capacitors.

[0143] Furthermore, the cooling and storage mechanism 6 includes a cooling cover 61, a jacking device 62, a cold air delivery head 63 and a circulation fan 64; openings are provided at both the bottom and the top of the cooling cover 61. The jacking device 62 is arranged inside the cooling cover 61, and the inlet of the jacking device 62 protrudes from the bottom of the cooling cover 61. The jacking device 62 is used to convey the thick glue board 93 upward in the vertical direction.

[0144] The cold air delivery head 63 is communicated with the cooling cover 61, and the air inlet end of the cold air delivery head 63 is connected to a cold air source.

[0145] The circulation fan 64 is installed between the cooling cover 61 and the jacking device 62, and the circulation fan 64 is located below the cold air delivery head 63.

[0146] In the prior art, due to the heavy weight of the thick glue board, generally, manual handling is carried out between each process in the capping process. At the same time, in order to facilitate the maintenance of the corresponding equipment in each process, a certain distance is generally left between each process. Therefore, the cooling air blown in the end cooling process of the chip capacitor generally does not affect the internal temperature of the baking furnace in the end drying process.

[0147] Shortening the transfer distance between processes is one of the simple and effective measures to improve the capping efficiency of chip capacitors. However, if the distance between the cooling process and the drying process is too close, the cooling air blown out during the end cooling process of the chip capacitor is likely to directly enter the inside of the drying oven from the discharge end of the drying oven, thereby affecting the temperature curve of the drying process and reducing the drying efficiency and quality of the end of the chip capacitor.

[0148] Therefore, to solve the above technical problems, this technical solution proposes a cooling and storage mechanism 6, as Figures 20 - 24 shown, including a cooling cover 61, a lifting device 62, a cold air delivery head 63 and a circulation fan 64. Among them, the gas flow direction inside the cooling and storage mechanism 6 is as Figure 23 shown. The cold air delivery head 63 is used to deliver cold air (shown by the hollow arrow) into the inside of the cooling cover 61, so as to cool the thick rubber plate 93 vertically upwardly conveyed inside the cooling cover 61; the circulation fan 64 is used to form a circulating air flow (shown by the solid arrow) at the lower part of the cooling cover 61, and this circulating air flow can play the role of an air curtain, preventing the cold air delivered by the cold air delivery head 63 into the inside of the cooling cover 61 from sinking, so as to avoid loss through the bottom opening of the cooling cover 61 and even affecting the drying process of the previous step, and can also effectively gather the cold air inside the cooling cover 61, thereby improving the cooling efficiency of the end of the chip capacitor.

[0149] Specifically, the operation process of the cooling and storage mechanism 6 in this solution includes the following steps: (1) The thick rubber plate 93 implanted with the chip capacitor 91 enters the cooling and storage mechanism 6 from the bottom of the lifting device 62 and is driven upward by the lifting device 62 into the inside of the cooling cover 61; (2) The cold air is conveyed into the inside of the cooling cover 61 via the cold air delivery head 63, so that the thick rubber plate 93 implanted with the chip capacitor 91 is effectively cooled during the process of being driven upward by the lifting device 62; (3) After cooling, the thick rubber plate 93 implanted with the chip capacitor 91 is discharged from the top of the cooling cover 61 and is moved to the next process by the transfer gripper.

[0150] Preferably, the lifting device 62 includes two conveying components 621 arranged oppositely in the vertical direction, and a conveying gap is left between the two conveying components 621;

[0151] The conveying component 621 includes a vertical conveying frame 6211, a conveyor belt 6212 and a pallet 6213. The conveyor belt 6212 rotates relative to the vertical conveying frame 6211. A plurality of the pallets 6213 are provided, and the plurality of pallets 6213 are installed at intervals on the outside of the conveyor belt 6212, and the pallet 6213 rotates following the rotation of the conveyor belt 6212;

[0152] The conveying directions of the inner conveying sections of the conveyor belts 6212 of the two conveying components 621 are the same and synchronous, and the pallets 6213 of the two conveying components 621 are jointly used to support the thick rubber sheet 93.

[0153] In a preferred embodiment of the present technical solution, the lifting device 62 includes two conveying components 621 arranged oppositely in the vertical direction, and a conveying gap is left between the two conveying components 621 to realize the lifting of the thick rubber sheet 93 in the conveying gap. Specifically, the conveying component 621 of this solution includes a vertical conveying frame 6211, a conveyor belt 6212 and a pallet 6213, and the pallet 6213 for supporting the thick rubber sheet 93 rotates with the rotation of the conveyor belt 6212. When the conveying directions of the inner conveying sections of the conveyor belts 6212 of the two conveying components 621 are synchronously upward, and the thick rubber sheet 93 is placed on the pallets 6213 of the two conveying components 621, the vertical lifting of the thick rubber sheet 93 in the conveying gap can be realized.

[0154] The lifting device 62 of this solution has a simple structure and reliable performance, and can stably realize the lifting of the thick rubber sheet 93 in the vertical direction. Moreover, the lifting device 62 is composed of two symmetrical conveying components 621, which is beneficial to reducing the design cost of the lifting device 62 on the premise of ensuring stable performance.

[0155] Preferably, the conveying component 621 further includes a driving wheel 6214 and a driven wheel 6215. The driving wheel 6214 and the driven wheel 6215 are rotatably installed on the same side of the vertical conveying frame 6211, and the driving wheel 6214 protrudes from the lower part of the vertical conveying frame 6211, and the driven wheel 6215 protrudes from the upper part of the vertical conveying frame 6211;

[0156] The conveyor belt 6212 surrounds the outside of the driving wheel 6214 and the driven wheel 6215, and the rotation of the driving wheel 6214 drives the rotation of the conveyor belt 6212.

[0157] Preferably, one driving wheel 6214, one driven wheel 6215 and one conveyor belt 6212 are a set of lifting parts. The conveying component 621 includes two sets of the lifting parts, and the two sets of the lifting parts are respectively arranged on the opposite sides of the vertical conveying frame 6211;

[0158] The pallets 6213 of the two sets of the lifting parts are jointly used to support one side of the thick rubber sheet 93.

[0159] In this way, there are 4 support points for the thick rubber sheet 93 during the upward movement, which is more beneficial to the stable lifting of the thick rubber sheet 93.

[0160] Preferably, both the driving wheel 6214 and the driven wheel 6215 are sprocket wheels, and the conveyor belt 6212 is a chain.

[0161] In a more optimal embodiment of the present technical solution, the transmission mode of the conveying assembly 621 is preferably chain drive. On the one hand, since there is no elastic sliding and slipping phenomenon in chain drive, it is beneficial to improve its transmission efficiency. On the other hand, it can transmit a large power and has a strong overload capacity, so it can effectively improve the supporting capacity of the conveying assembly 621 for the thick rubber plate 93 with a heavier weight.

[0162] Preferably, the pallet 6213 includes a connecting piece 62131 and a supporting piece 62132, and the connecting piece 62131 and the supporting piece 62132 are perpendicular to each other;

[0163] The connecting piece 62131 is connected to the outer side of the conveyor belt 6212, and the long side of the supporting piece 62132 is integrally formed with the long side of the connecting piece 62131;

[0164] When the pallet 6213 is located inside the conveying gap, the supporting piece 62132 is located on top of the connecting piece 62131.

[0165] In another preferred embodiment of the present technical solution, the pallet 6213 of this solution includes a connecting piece 62131 and a supporting piece 62132. Among them, the connecting piece 62131 is used to connect with the conveyor belt 6212, and the supporting piece 62132 is used to support the thick rubber plate 93, so as to realize the stable conveying of the thick rubber plate 93.

[0166] In addition, since the supporting piece 62132 is located on top of the connecting piece 62131 when the pallet 6213 is located inside the conveying gap, during the blanking process of the thick rubber plate 93, the obstruction of the supporting piece 62132 to the blanking action can be effectively prevented, and the smooth blanking of the thick rubber plate 93 can be realized.

[0167] Furthermore, the plate changing mechanism 7 includes a needle bed conveying device 71, a partition frame clamping device 72, a new plate clamping device 73, a new plate conveying device 74 and a flattening device 75;

[0168] The needle bed conveying device 71 comprises a first conveying track 711 and a transfer platform 712, wherein the transfer platform 712 is horizontally movably mounted on the first conveying track 711; the transfer platform 712 comprises a platform mounting seat 7121 for placing a thick rubber plate 93 and a mesh plate 7122, wherein the mesh plate 7122 is mounted above the platform mounting seat 7121 by means of spring expansion and contraction; a plurality of ejector pins are protrudingly arranged on the upper surface of the platform mounting seat 7121, and a plurality of mesh holes are opened on the plate surface of the mesh plate 7122, and one ejector pin corresponds to one mesh hole, and the mesh hole is used for the ejector pin to pass through the mesh plate 7122;

[0169] The partition frame clamping device 72 and the new plate clamping device 73 are sequentially mounted above the end of the first conveying track 711 along the conveying direction of the transfer platform 712, the partition frame clamping device 72 is used to clamp the partition frame 94, and the new plate clamping device 73 is used to clamp the empty thick rubber plate 93, and the clamps of the partition frame clamping device 72 and the new plate clamping device 73 can both move up and down relative to the transfer platform 712;

[0170] The new board conveying device 74 includes a second conveying track 741 and a support bar 742, and the support bar 742 is horizontally movably installed on both sides of the inside of the second conveying track 741; the feeding end of the second conveying track 741 and the end of the first conveying track 711 are sequentially arranged below the clamp of the new board clamping device 73 from top to bottom, and the clamp of the new board clamping device 73 can pass through the conveying surface of the second conveying track 741;

[0171] The flattening device 75 is arranged at the end of the second conveying track 741. The flattening device 75 includes a flattening clamp 751 and a flattening platform 752 which are arranged opposite to each other in the vertical direction. The flattening clamp 751 is located above the second conveying track 741, and the flattening clamp 751 can move up and down relative to the second conveying track 741. The flattening clamp 751 is used to clamp the thick rubber plate 93, and the flattening platform 752 is located below the second conveying track 741.

[0172] In the prior art, the surface replacement process of the chip capacitor is completed on the same thick rubber board, that is, a needle bed is used to act on the sealed end of the chip capacitor to directly press down from above the plate hole of the thick rubber board, so that the sealed end of the chip capacitor passes through the center of the plate hole of the thick rubber board to the bottom of the thick rubber board, and the unsealed end of the chip capacitor protrudes from the lower surface of the thick rubber board.

[0173] The above-mentioned face-changing steps have the following quality problems: 1. The depth of the holes in the thick rubber plate is 8.9 mm. Due to the characteristic of rubber that "within the same aperture, the elastic force and clamping force of the central rubber are greater than those at the edge", the sealed end of the surface-mounted capacitor is directly pressed down from above the hole in the thick rubber plate and pushed out through the center of the rubber to the lower surface of the thick rubber plate, resulting in excessive friction on the side of the sealed end, which is likely to cause the risk of porcelain exposure at the edges and corners of the surface-mounted capacitor; 2. The diameter of the pins on the pin bed is generally smaller than the diameter of the holes in the thick rubber plate. When the pin tip contacts and presses down on the sealed end of the surface-mounted capacitor, passing from above the hole through the center of the plate to below the hole, due to the large frictional force in the central hole, the sealed end is prone to indentation damage.

[0174] Therefore, in order to reduce the damage to the sealed end of the surface-mounted capacitor during the face-changing process, this technical solution proposes a board-changing mechanism 7, as Figures 25 - 29 shown. Through the downward pressure of the fixture in the new board clamping device 73, the ejector pin of the transfer platform 712 penetrates into the hole of the thick rubber plate 93 (hereinafter referred to as the "old board") implanted with the surface-mounted capacitor 91 and directly acts on the unsealed end of the surface-mounted capacitor 91. After the downward pressure action is reset, the sealed end of the surface-mounted capacitor 91 protruding from the upper surface of the old board is accommodated in the hole of the thick rubber plate 93 (hereinafter referred to as the "new board") in the new board clamping device 73, and the unsealed end protrudes from the lower surface of the new board, thus completing the face-changing step of the surface-mounted capacitor 91, as Figure 30 shown. This solution improves the face-changing step of the surface-mounted capacitor 91 from "same-board face-changing" to "board-changing" to avoid problems such as porcelain exposure at the edges and corners of the surface-mounted capacitor, cracks at the end top, and the surface-mounted capacitor being pressed skew during face-changing, thereby ensuring the sealing quality of the surface-mounted capacitor.

[0175] Furthermore, this solution also adds a flattening device 75 for making the unsealed ends flush after the board-changing step to further ensure the sealing quality of the surface-mounted capacitor.

[0176] Specifically, the board replacement process in the board replacement mechanism 7 of this solution includes the following steps: (1) Place the old board to be replaced on the top of the transfer platform 712. At this time, the sealed end of the chip capacitor 91 protrudes from the upper surface of the old board; (2) Use the transfer platform 712 to move the old board under the partition frame clamping device 72, and use the fixture of the partition frame clamping device 72 to place the partition frame 94 on the top of the old board; (3) Use the transfer platform 712 to move the old board under the new board clamping device 73. At the same time, the fixture of the new board clamping device 73 presses down, and the new board clamped by the fixture abuts against the partition frame 94 until the ejector pin of the transfer platform 712 transfers the chip capacitor 91 to the new board, and the unsealed end of the chip capacitor 91 protrudes from the lower surface of the new board. (4) Use the fixture of the new board clamping device 73 to place the new board on the support bar 742 of the new board conveying device 74. The support bar 742 conveys the new board between the flattening devices 75, and then use the flattening fixture 751 to clamp the new board and press it down so that the unsealed end protruding from the lower surface of the new board abuts against the flattening platform 752 to achieve the leveling of the end. At the same time, use the transfer platform 712 to move the partition frame 94 under the partition frame clamping device 72, and recycle it with the fixture of the partition frame clamping device 72; then use the transfer platform 712 to move the empty old board under the new board clamping device 73, and recycle it with the fixture of the new board clamping device 73. (5) The transfer platform 712 moves to the loading end of the first conveying track 711 and waits for the old board to be replaced on the next surface.

[0177] It should be noted that the fixtures of the partition frame clamping device 72, the new board clamping device 73 and the equalizing flattening fixture 751 in this solution are conventional fixtures in the art. The above fixtures can all realize the clamping and loosening of the clamped object, and the specific structure of the fixture will not be elaborated here.

[0178] Preferably, the flattening fixture 751 and the leveling fixture 451 have the same structure.

[0179] Preferably, the bed conveyor device 71 further includes a photoelectric sensor 713. The photoelectric sensor 713 is mounted on the top of the first conveying track 711, and the photoelectric sensor 713 is located between the partition frame clamping device 72 and the new board clamping device 73;

[0180] The photoelectric sensor 713 is used to detect whether there is a chip capacitor 91 remaining on the upper surface of the thick glue board 93.

[0181] In this way, it can be used to detect whether there is a bad ejector pin in the ejector pin of the transfer platform 712, so as to perform maintenance in time.

[0182] Preferably, the board replacement mechanism 7 further includes a first brush 76. The first brush 76 is located between the photoelectric sensor 713 and the new board clamping device 73;

[0183] The first brush 76 is used to clean the upper surface of the thick rubber plate 93.

[0184] Preferably, the plate changing mechanism 7 further includes a second brush 77, which is installed at the bottom of the second conveying track 741, and the second brush 77 is located between the new plate clamping device 73 and the flattening device 75;

[0185] The second brush 77 is used to clean the lower surface of the thick rubber plate 93.

[0186] In order to further ensure the smooth progress of the plate changing step and the flattening step, the first brush 76 and the second brush 77 are additionally provided in the plate changing mechanism 7, so as to prevent abnormal products or impurities staying on the upper and lower surfaces of the thick rubber plate 93 from affecting the plate changing and flattening of the chip capacitors.

[0187] Preferably, the first conveying track 711 and the second conveying track 741 are perpendicular to each other.

[0188] In this way, it is beneficial to make the structure of the plate changing mechanism 7 more compact.

[0189] Preferably, the photoelectric sensor 713 is a transmissive photoelectric sensor.

[0190] Furthermore, the unloading mechanism 8 includes an unloading conveying device 81, a needle bed unloading device 82, a loading conveying device 83, a full material conveying device 84, an empty material box storage rack 85, a full material box storage rack 86 and a material box moving device 87;

[0191] The unloading conveying device 81 includes an unloading conveying rack 811 and an unloading platform 812. The unloading platform 812 is horizontally movably installed on the top of the unloading conveying rack 811, and the unloading platform 812 is used to hold the thick rubber plate 93 to be unloaded; a blanking opening 8121 is formed at the bottom of the unloading platform 812, and a blanking notch 8111 is formed in the middle of the unloading conveying rack 811, and the blanking opening 8121 and the blanking notch 8111 are matched with each other;

[0192] The needle bed unloading device 82 is erected above the unloading conveying rack 811, the loading conveying device 83 is arranged below the unloading conveying rack 811, and the needle bed unloading device 82, the blanking notch 8111 and the unloading end of the loading conveying device 83 are arranged in sequence from top to bottom; the needle bed unloading device 82 moves up and down relative to the unloading conveying rack 811, and the needle bed unloading device 82 is used to press the chip capacitor 91 away from the thick rubber plate 93;

[0193] The material loading and conveying device 83 and the full-material conveying device 84 are arranged in parallel, and the empty material box storage rack 85, the disk-changing end of the material loading and conveying device 83, and the feeding end of the full-material conveying device 84 are sequentially arranged within the transfer range of the material box moving device 87. The discharging end of the full-material conveying device 84 is connected to the full-material box storage rack 86;

[0194] The empty material box storage rack 85 is used to store a plurality of stacked material boxes 95. Both the material loading and conveying device 83 and the full-material conveying device 84 are used to convey the material boxes 95, and the full-material conveying device 84 is also used to convey the material boxes 95 to the full-material box storage rack 86. The material box moving device 87 is used to transfer the material boxes 95.

[0195] In the capping process of the chip capacitor manufacturing process, after the chip capacitors on the capping carrier board complete the capping process, they need to be unloaded into the receiving material box. In common production, there is only one material box installed on the unloader. For this structure of the unloader, the material box can only be manually taken and placed, and only one material box can be replaced each time, and it may need to be replaced 10 - 30 times. This single-material-box unloading method has a small material box capacity and cannot support long-term automatic large-capacity unloading. After the material box receives a certain amount of materials, it is necessary to stop the machine for processing. It is necessary for workers to take away the full material box and replace it with a new material box to continue production, resulting in frequent manual operations, time-consuming and laborious, seriously affecting the operation efficiency of the entire line, and low production efficiency.

[0196] Therefore, in order to achieve non-stop and large-capacity continuous unloading of chip capacitors, the present technical solution proposes a unloading mechanism 8, as Figures 31 - 35 shown, including a unloading conveying device 81, a needle bed unloading device 82, a material loading and conveying device 83, a full-material conveying device 84, an empty material box storage rack 85, a full-material box storage rack 86, and a material box moving device 87. Among them, the empty material boxes 95 can be sequentially transferred among the empty material box storage rack 85, the material loading and conveying device 83, the full-material conveying device 84, and the full-material box storage rack 86, so that the unloading mechanism 8 of this solution can realize the automatic feeding of empty material boxes and the automatic unloading of full material boxes filled with chip capacitors, thereby overcoming the technical defect that the single-material-box unloading method in the prior art has a small material box capacity and cannot support long-term automatic large-capacity unloading.

[0197] Specifically, the unloading process of the unloading mechanism 8 of this solution includes the following steps: (1) The thick rubber plate 93 to be unloaded is rotated from the previous process to the top of the unloading platform 812. At this time, the end of the chip capacitor implanted in the thick rubber plate 93 protrudes from its lower surface, and the blanking port 8121 is used to avoid the above-mentioned chip capacitor; (2) The unloading platform 812 is used to move the thick rubber plate 93 to be unloaded under the needle bed unloading device 82. At the same time, the empty material box 95 is moved from the empty material box storage rack 85 to the disk-changing end of the material loading and conveying device 83 by the material box moving device 87, and the above-mentioned empty material box is conveyed to its unloading end by the material loading and conveying device 83; (3) The needle bed unloading device 82 moves downward relative to the unloading conveying rack 811 and presses the chip capacitor 91 away from the thick rubber plate 93, and the unloaded chip capacitor falls through the blanking gap 8111 into the empty material box at the unloading end of the material loading and conveying device 83; (4) After the empty material box at the unloading end of the above-mentioned material loading and conveying device 83 is filled with chip capacitors (hereinafter referred to as "full material box"), it is conveyed by the material loading and conveying device 83 to its disk-changing end; (5) The full material box is moved from the disk-changing end of the material loading and conveying device 83 to the full material conveying device 84 by the material box moving device 87, and is conveyed by the full material conveying device 84 to the full material box storage rack 86 for storage. At the same time, a new empty material box is moved from the empty material box storage rack 85 to the disk-changing end of the material loading and conveying device 83 by the material box moving device 87 to carry out the next round of unloading and material receiving, and so on in a cycle.

[0198] Preferably, the unloading conveying device 81 further includes a limit frame 813. The limit frame 813 is installed in the middle of the unloading conveying rack 811, and the blanking gap 8111 is opened in the middle of the limit frame 813;

[0199] The material loading and conveying device 83 includes a material loading conveying rack 831, a material loading platform 832 and a material box lifting seat 833. The material loading platform 832 is horizontally movably installed on the top of the material loading conveying rack 831, and the material loading platform 832 is used to hold the material box 95; The material box lifting seat 833 is vertically movably installed at the unloading end of the material loading conveying rack 831, and the material box lifting seat 833 is located directly below the blanking gap 8111;

[0200] The material box lifting seat 833 is used to lift the material box 95 and make the material box 95 abut against the limit frame 813.

[0201] In a preferred embodiment of the present technical solution, the unloading conveying device 81 is further provided with a limiting frame 813, and a cartridge lifting seat 833 for moving the cartridge 95 up and down is provided in the loading conveying device 83. Specifically, when the cartridge 95 is conveyed by the loading platform 832 of the loading conveying device 83 to the unloading end for unloading and receiving materials, the cartridge 95 can be first lifted by the cartridge lifting seat 833 until it abuts against the bottom of the limiting frame 813, thereby effectively shortening the unloading drop distance of the chip capacitor 91 and avoiding adverse effects on the capping quality of the chip capacitor during the unloading process.

[0202] Preferably, the full-material conveying device 84 includes a full-material conveying frame 841 and a blanking pusher 842;

[0203] A plurality of rotatably arranged conveying wheels 8411 are provided on both sides of the top of the full-material conveying frame 841, and the rotation axis of the conveying wheel 8411 is perpendicular to the conveying direction of the full-material conveying device 84;

[0204] The blanking pusher 842 is horizontally movably installed on the top of the full-material conveying frame 841, and the blanking pusher 842 is arranged near the feeding end of the full-material conveying frame 841. The blanking pusher 842 is used to push the full cartridge 95 to the full-cartridge storage rack 86.

[0205] In another preferred embodiment of the present technical solution, the full-material conveying device 84 includes a full-material conveying frame 841 and a blanking pusher 842, and a plurality of rotatably arranged conveying wheels 8411 are provided on both sides of the top of the full-material conveying frame 841. When the full cartridge is moved from the disk-changing end of the loading conveying device 83 to the full-material conveying device 84 by the cartridge moving device 87, by the mutual cooperation of the blanking pusher 842 and the conveying wheels 8411, the full cartridge can be conveniently and simply moved to the full-cartridge storage rack 86, with a simple structure and reliable performance.

[0206] Preferably, the cartridge moving device 87 includes a moving cross beam 871, an empty-cartridge loading jaw 872, and a full-cartridge unloading jaw 873;

[0207] The moving cross beam 871 is installed above the loading conveying device 83 and the full-material conveying device 84, and the extending direction of the moving cross beam 871 is perpendicular to the conveying direction of the loading conveying device 83;

[0208] The empty-cartridge loading jaw 872 and the full-cartridge unloading jaw 873 are both horizontally movably installed on the moving cross beam 871, and the empty-cartridge loading jaw 872 and the full-cartridge unloading jaw 873 can both move up and down relative to the moving cross beam 871;

[0209] The empty cartridge loading gripper 872 is used to transfer the cartridge 95 located on the empty cartridge storage rack 85 to the disk-changing end of the material-carrying conveying device 83, and the full cartridge unloading gripper 873 is used to transfer the cartridge 95 located at the disk-changing end of the material-carrying conveying device 83 to the loading end of the full-material conveying device 84.

[0210] Specifically, in this solution, the cartridge moving device 87 for realizing the movement of the cartridge 95 includes an empty cartridge loading gripper 872 for moving the empty cartridge and a full cartridge unloading gripper 873 for moving the full cartridge. The setting of the two grippers can effectively improve the moving speed of the cartridge 95, and thus improve the replacement efficiency of the cartridge 95.

[0211] It should be noted that the empty cartridge loading gripper 872 and the full cartridge unloading gripper 873 in this solution are conventional fixtures in the art. The above fixtures can all realize the clamping and loosening of the clamped object, and the specific structure of the fixture will not be elaborated here.

[0212] Preferably, the empty cartridge loading gripper 872 and the full cartridge unloading gripper 873 move synchronously, and the empty cartridge storage rack 85 moves up and down relative to the moving cross beam 871.

[0213] As a further optimization of the above embodiment, in order to further improve the replacement efficiency of the cartridge 95, this solution optimizes the structures of the cartridge moving device 87 and the empty cartridge storage rack 85, that is, the empty cartridge storage rack 85 moves up and down relative to the moving cross beam 871, and by its up and down movement, the material-taking surface of the empty cartridge storage rack 85 is made flush with the conveying surfaces of the material-carrying conveying device 83 and the full-material conveying device 84, so that the empty cartridge and the full cartridge can move synchronously, greatly improving the replacement speed of the cartridge 95.

[0214] Preferably, a plurality of storage positions are arranged vertically inside the full cartridge storage rack 86, and the full cartridge storage rack 86 moves up and down relative to the full-material conveying rack 841.

[0215] In a preferred embodiment of this technical solution, a plurality of storage positions are arranged vertically inside the full cartridge storage rack 86, and it can move up and down relative to the full-material conveying rack 841, so that the occupied space of the full cartridge storage rack 86 can be effectively reduced on the premise of realizing the large-capacity storage of the chip capacitors. Further, the up and down movement of the full cartridge storage rack 86 can always make the conveying surface of the full-material conveying device 84 flush with the top of the corresponding storage position, facilitating the full-material conveying device 84 to horizontally convey the full cartridge to the full cartridge storage rack 86 for storage.

[0216] Preferably, a plurality of full cartridge storage racks 86 are provided, and the plurality of full cartridge storage racks 86 are arranged in parallel;

[0217] The full material box storage rack 86 can move horizontally relative to the full material conveying rack 841 , and the moving direction of the full material box storage rack 86 and the extending direction of the full material conveying rack 841 are perpendicular to each other.

[0218] As a better embodiment of the above embodiment, a plurality of full box storage racks 86 are provided and can be horizontally moved relative to the full conveying rack 841 , thereby further increasing the full box storage capacity of the unloading mechanism 8 .

[0219] Preferably, the needle bed unloading device 82 includes a needle bed unloading seat 821 and a unloading plate 822, and the unloading plate 822 is installed below the needle bed unloading seat 821 by spring extension; a plurality of pressing needles are protrudingly provided on the lower surface of the needle bed unloading seat 821, and a plurality of through holes are opened on the plate surface of the unloading plate 822, and one pressing needle corresponds to one through hole, and the through hole is used for the pressing needle to pass through the unloading plate 822.

[0220] Preferably, the unloading mechanism 8 further includes a thick rubber sheet recovery device, and the thick rubber sheet recovery device is arranged near the unloading end of the unloading conveying device 81. In one embodiment, the thick rubber sheet recovery device includes a clamp (not shown in the figure) and a thick rubber sheet recovery rack (not shown in the figure), the clamp is used to clamp the unloaded thick rubber sheet 93 to the thick rubber sheet recovery rack, and the thick rubber sheet recovery rack is used to store the thick rubber sheet.

[0221] In another embodiment, the thick rubber sheet recovery device is a thick rubber sheet conveyor line 88, such as Figure 1 As shown, the thick rubber sheet conveyor line 88 is used to convey the unloaded thick rubber sheet 93, and the unloading conveyor device 81, the thick rubber sheet conveyor line 88 and the thick rubber sheet storage rack in the assembly mechanism are connected in sequence. It should be noted that the thick rubber sheet conveyor line 88 of this solution is a conventional conveying device in the art, and its structure is not described in detail here.

[0222] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A chip capacitor capping production line based on a thick rubber plate, characterized in that: It includes an assembly mechanism, an implanting mechanism, a pressing-in mechanism, a leveling mechanism, a dipping slurry mechanism, a drying mechanism, a cooling and storage mechanism, a board-changing mechanism, a discharging mechanism and a transfer gripper; There are two of the dipping slurry mechanism, the drying mechanism and the cooling and storage mechanism, and the assembly mechanism, the implanting mechanism, the pressing-in mechanism, the leveling mechanism, one dipping slurry mechanism, one drying mechanism, one cooling and storage mechanism, the board-changing mechanism, the other dipping slurry mechanism, the other drying mechanism, the other cooling and storage mechanism and the discharging mechanism are arranged in sequence; The assembly mechanism is used to place the lead-in board on the top of the thick glue board to form an assembly; There are multiple transfer grippers, and the transfer grippers are used to grip and move the thick glue board.

2. The chip capacitor end-sealing production line based on a thick rubber plate according to claim 1, wherein: The assembly mechanism includes a thick glue board storage rack, a lead-in board storage rack and a board-taking device; The thick glue board storage rack is used to store the thick glue board, the lead-in board storage rack is used to store the lead-in board, and the board-taking device is used to move the lead-in board.

3. A chip capacitor end-sealing production line based on a thick rubber plate according to claim 1, characterized in that: The implanting mechanism includes a mounting base, a mounting seat, an implanting device, an implanting conveying device and a motor vibration device; The mounting seat is mounted on the top of the mounting base, and the center of the top of the mounting base is rotatably connected to the center of the bottom of the mounting seat through a bearing seat, and the mounting seat swings relative to the mounting base; Both the implanting device and the implanting conveying device are erected above the mounting seat, and the implanting conveying device is located inside the implanting device; the implanting conveying device is used to convey the assembly to the implanting device, and the conveying direction of the implanting conveying device is parallel to the swinging direction of the mounting seat; The motor vibration device is mounted on the bottom of the mounting seat, and the output end of the motor vibration device is connected to the implanting device, and the motor vibration device is used to drive the implanting device to vibrate relative to the mounting seat; The implanting device includes an implanting chassis, an implanting top plate and an implanting frame which are sequentially arranged at intervals from bottom to top. The implanting chassis and the implanting frame are connected by a vertically extending support column. The implanting top plate is movably arranged between the implanting chassis and the implanting frame, and the conveying surface of the implanting conveying device is located above the implanting top plate; The bottom of the implanting frame includes a placing position and an avoidance position, and the placing position and the avoidance position are sequentially connected along the direction perpendicular to the conveying direction of the implanting conveying device; the placing position is used to place the patch capacitor to be implanted, and the implanting top plate is used to abut the lead-in board to be implanted against the avoidance position.

4. A chip capacitor capping production line based on a thick rubber plate according to claim 1, characterized in that: The pressing-in mechanism includes a detection conveying device, a first cleaning device, a detection device, a pressing-in conveying device and a needle bed pressing-in device; The detection conveying device and the pressing-in conveying device are connected end to end in sequence, and the pressing-in conveying device moves up and down relative to the detection conveying device, and the needle bed pressing-in device is located inside the pressing-in conveying device; The first cleaning device and the detection device are sequentially arranged on the detection conveying device along the conveying direction of the detection conveying device, and the detection conveying device is used for conveying the assembly. The first cleaning device is used for cleaning the upper surface of the assembly, and the detection device is used for detecting whether there are foreign objects on the upper surface of the assembly placed on the detection conveying device; The pin bed pressing device includes an upper platform and a lower platform oppositely arranged in the vertical direction, and the upper platform is located above the lower platform. The upper platform moves up and down relative to the lower platform. The placing surface of the lower platform is within the up and down moving range of the pressing conveying device. The upper platform is used for pressing the chip capacitors in the lead-in board of the assembly into the board holes of the thick glue board.

5. A chip capacitor capping production line based on a thick rubber plate according to claim 1, characterized in that: The leveling mechanism includes a leveling conveying device, a lifting platform, a feeding belt, a flipping device, a lead-in board recycling device and a leveling device; The leveling conveying device includes a conveying machine frame and a conveying tray. The conveying tray is horizontally movably installed on the top of the conveying machine frame, and the conveying tray is used for placing the thick glue board; The lifting platform, the feeding belt, the flipping device and the lead-in board recycling device are sequentially arranged opposite to each other at the feeding end of the conveying machine frame from bottom to top. The lifting platform and the feeding belt are both located at the inner bottom of the conveying machine frame, and the flipping device and the lead-in board recycling device are both arranged on the top of the conveying machine frame; The lifting platform can move up and down relative to the feeding belt and the flipping device, and the lifting platform can penetrate through the feeding belt and the conveying surface of the leveling conveying device; The shape of the conveying tray is U-shaped, and an avoidance opening is formed in the middle of the conveying tray, and the avoidance opening is used for avoiding the lifting platform; The leveling device is located on the front side of the flipping device, and the leveling device includes a leveling clamp and a leveling platform oppositely arranged in the vertical direction. The leveling clamp is located above the conveying machine frame, and the leveling clamp can move up and down relative to the conveying machine frame. The leveling platform is located below the conveying machine frame, and the leveling clamp is used for clamping the thick glue board.

6. The chip capacitor end-sealing production line based on a thick rubber sheet according to claim 1, wherein: The dipping mechanism includes a dipping device, a transfer conveying table, a transfer gripper, a pre-drying device, a pre-cooling device, a blanking conveying table and a feeding gripper; The transfer conveying table, the pre-drying device, the pre-cooling device and the blanking conveying table are connected end to end in sequence, and the transfer conveying table moves up and down relative to the pre-drying device, and the blanking conveying table moves up and down relative to the pre-cooling device; There are at least two groups of dipping devices, and the feeding ends of all the dipping devices and the blanking conveying table are within the moving range of the feeding gripper. The feeding gripper is used for realizing the transfer of the thick glue board between the feeding end of the dipping device and the blanking conveying table; The discharging ends of all the dipping devices and the transfer conveying table are within the moving range of the transfer gripper. The transfer gripper is used for realizing the transfer of the thick glue board between the discharging end of the dipping device and the transfer conveying table.

7. A chip capacitor capping production line based on a thick rubber plate according to claim 6, characterized in that: The slurry dipping device comprises a mounting frame, a slurry tray, a slurry spreading assembly, a slurry dipping fixture and a loading tray; The mounting frame includes a support base and a conveying bracket; The support seat is mounted above the paddle disc, and the paddle disc moves horizontally relative to the support seat; the conveying bracket is horizontally extended and installed on the support seat, and the extension direction of the conveying bracket is parallel to the moving direction of the paddle disc, and the conveying bracket is located above the paddle disc; The slurry spreading assembly is installed on one side of the support seat, and the slurry spreading assembly is located on the top of the slurry disc; the slurry spreading assembly moves up and down relative to the slurry disc, and the slurry spreading assembly is used to spread a slurry layer on the top of the slurry disc; The loading tray is horizontally movably mounted on the conveying bracket; The slurry dipping fixture is installed on the support seat so as to be movable up and down, and the upper limit of movement of the slurry dipping fixture is located above the conveying bracket, and the lower limit of movement of the slurry dipping fixture is located above the slurry tray.

8. A chip capacitor capping production line based on a thick rubber sheet according to claim 1, characterized in that: The cooling storage mechanism comprises a cooling hood, a lifting device, a cold air conveying head and a circulating fan; the bottom and the top of the cooling hood are both provided with openings, the lifting device is arranged inside the cooling hood, and the inlet of the lifting device protrudes from the bottom of the cooling hood, and the lifting device is used to convey the thick rubber sheet upward in the vertical direction; The cold air delivery head is connected to the cooling cover, and the air inlet end of the cold air delivery head is connected to a cold air source; The circulating fan is installed between the cooling cover and the lifting device, and the circulating fan is located below the cold air delivery head.

9. A chip capacitor capping production line based on a thick rubber plate according to claim 1, characterized in that: The plate changing mechanism includes a needle bed conveying device, a partition frame clamping device, a new plate clamping device, a new plate conveying device and a flattening device; The needle bed conveying device comprises a first conveying track and a transfer platform, wherein the transfer platform is horizontally movably mounted on the first conveying track; the transfer platform comprises a platform mounting seat for placing a thick rubber plate and a mesh plate, wherein the mesh plate is mounted above the platform mounting seat by means of spring expansion and contraction; a plurality of ejector pins are protrudingly arranged on the upper surface of the platform mounting seat, a plurality of mesh holes are formed on the plate surface of the mesh plate, and one ejector pin corresponds to one mesh hole, wherein the mesh hole is used for the ejector pin to pass through the mesh plate; The partition frame clamping device and the new plate clamping device are sequentially mounted above the end of the first conveying track along the conveying direction of the transfer platform, the partition frame clamping device is used to clamp the partition frame, and the new plate clamping device is used to clamp the empty thick rubber plate, and the clamps of the partition frame clamping device and the new plate clamping device can both move up and down relative to the transfer platform; The new board conveying device comprises a second conveying track and a support bar, wherein the support bar is horizontally movably installed on both sides of the interior of the second conveying track; the loading end of the second conveying track and the end of the first conveying track are sequentially arranged below the clamp of the new board clamping device from top to bottom, and the clamp of the new board clamping device can pass through the conveying surface of the second conveying track; The flattening device is arranged at the end of the second conveying track. The flattening device includes a flattening clamp and a flattening platform which are oppositely arranged in the vertical direction. The flattening clamp is located above the second conveying track, and the flattening clamp can move up and down relative to the second conveying track. The flattening clamp is used for clamping the thick rubber plate, and the flattening platform is located below the second conveying track.

10. A chip capacitor capping production line based on a thick rubber plate according to claim 1, characterized in that: The unloading mechanism includes an unloading conveying device, a needle bed unloading device, a material loading conveying device, a full material conveying device, an empty material box storage rack, a full material box storage rack and a material box moving device; The unloading conveying device includes an unloading conveying rack and an unloading platform. The unloading platform is horizontally movably installed on the top of the unloading conveying rack, and the unloading platform is used for holding the thick rubber plate to be unloaded. A material discharging port is formed at the bottom of the unloading platform, and a material discharging notch is formed in the middle of the unloading conveying rack. The material discharging port and the material discharging notch are matched with each other; The needle bed unloading device is erected above the unloading conveying rack, and the material loading conveying device is arranged below the unloading conveying rack. The needle bed unloading device, the material discharging notch and the discharging end of the material loading conveying device are arranged in sequence from top to bottom. The needle bed unloading device moves up and down relative to the unloading conveying rack, and the needle bed unloading device is used for pressing the chip capacitor away from the thick rubber plate; The material loading conveying device and the full material conveying device are arranged in parallel, and the empty material box storage rack, the disk changing end of the material loading conveying device and the feeding end of the full material conveying device are sequentially arranged within the transfer range of the material box moving device. The discharging end of the full material conveying device is connected with the full material box storage rack; The empty material box storage rack is used for storing a plurality of stacked material boxes. Both the material loading conveying device and the full material conveying device are used for conveying the material boxes, and the full material conveying device is further used for conveying the material boxes to the full material box storage rack. The material box moving device is used for transferring the material boxes.

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