Optical signal transmission device

Abstract

The invention relates to an optical signal transmission device. The optical signal transmission device comprises an optical transmitter and an optical receiver. The optical transmitter and the optical receiver are connected through an optical fiber, the optical transmitter comprises a laser and a silicon optical chip, and the laser is used for outputting multiple paths of optical signals to be transmitted to the silicon optical chip; the silicon optical chip is used for carrying out modulation and wave combination processing on multiple paths of optical signals to be transmitted and transmitting the processed optical signals to the optical receiver through an optical fiber; and the optical receiver is used for performing photoelectric conversion on the processed optical signal to generate an electric signal corresponding to the optical signal to be transmitted. According to the invention, the silicon optical chip is directly adopted to realize modulation and wave combination processing at the same time instead of adopting semiconductor chips such as a laser chip for modulation and then adopting an independently arranged wave combiner for wave combination, so that the optical transceiver module can be arranged more ingeniously, the integrity of optical signal transmission can be ensured, and the optical signal transmission efficiency is improved. And the optical signal transmission performance can be improved.

Description

Technical Field

[0001] This application relates to the field of communication technologies, and particularly to an optical signal transmission device. Background Art

[0002] With the development of communication technologies, optical communication technologies have been widely applied in various fields due to their large communication capacity, low loss, and other characteristics. When information is transmitted through optical fibers, various types of optical signal transmission devices have emerged, such as optical transceiver modules. An optical transceiver module includes a transmitting end and a receiving end. The transmitting end is used to convert an electrical signal into an optical signal, and the receiving end is used to convert an optical signal into an electrical signal.

[0003] Currently, the demand for realizing optical signal transmission using an 8-channel single-wavelength 100 Gb / s optical transceiver module is increasing day by day. However, the current 800G optical transceiver module has problems with poor optical signal transmission performance. Summary of the Invention

[0004] Based on this, it is necessary to provide an optical signal transmission device that can improve the optical signal transmission performance in view of the above technical problems.

[0005] In a first aspect, this application provides an optical signal transmission device, which includes: an optical transmitter and an optical receiver; the optical transmitter and the optical receiver are connected by an optical fiber. The optical transmitter includes a laser and a silicon photonics chip.

[0006] The laser is configured to output multiple channels of optical signals to be transmitted to the silicon photonics chip.

[0007] The silicon photonics chip is configured to perform modulation and multiplexing processing on the multiple channels of optical signals to be transmitted, and transmit the processed optical signals to the optical receiver through the optical fiber.

[0008] The optical receiver is configured to perform photoelectric conversion on the processed optical signals to generate electrical signals corresponding to the optical signals to be transmitted.

[0009] In one embodiment, the silicon photonics chip includes a modulator and a multiplexer; the output end of the laser is connected to the input end of the modulator, the output end of the modulator is connected to the input end of the multiplexer, and the output end of the multiplexer is connected to the optical receiver through the optical fiber.

[0010] The modulator is configured to perform amplitude modulation on the multiple channels of optical signals to be transmitted.

[0011] The multiplexer is configured to perform signal multiplexing on the amplitude-modulated multiple channels of optical signals to obtain the processed optical signals.

[0012] In one embodiment, the optical signal transmission device further includes: a signal source; the signal source is connected to the silicon photonic chip;

[0013] The signal source is used to drive the silicon photonic chip to work.

[0014] In one embodiment, the optical signal transmission device further includes: a digital signal processor; a first input end of the digital signal processor is connected to the signal source, and a first output end of the digital signal processor is connected to the silicon photonic chip; a driver is included in the digital signal processor;

[0015] The digital signal processor is used to process the initial electrical signal output by the signal source to obtain a driving signal;

[0016] The driver is used to drive the silicon photonic chip to work according to the driving signal.

[0017] In one embodiment, the optical receiver includes: a photodiode; an input end of the photodiode is connected to the silicon photonic chip through the optical fiber.

[0018] In one embodiment, the optical receiver further includes: a demultiplexer; an input end of the demultiplexer is connected to the silicon photonic chip through the optical fiber, and an output end of the demultiplexer is connected to an input end of the photodiode;

[0019] The demultiplexer is used to demultiplex the received processed optical signal to obtain a plurality of optical signals to be converted, and transmit the plurality of optical signals to be converted to the photodiode.

[0020] In one embodiment, the demultiplexer includes a Z-shaped optical path multiplexing module and a lens;

[0021] The Z-shaped optical path multiplexing module is used to demultiplex the processed optical signal to obtain the plurality of optical signals to be converted;

[0022] The lens is used to couple the plurality of optical signals to be converted to the photodiode.

[0023] In one embodiment, the optical signal transmission device further includes a circuit board and a spacer. The silicon photonic chip is bonded to the first side of the circuit board through a gold wire. The spacer is arranged on the second side of the circuit board, and the optical receiver is arranged on a side of the spacer away from the circuit board.

[0024] In one embodiment, the optical receiver further includes: a signal amplifier, and an output end of the photodiode is connected to the signal amplifier.

[0025] In one embodiment, the optical signal transmission device further includes an optical fiber repeater, which is disposed between the silicon photonic chip and the optical receiver.

[0026] The above optical signal transmission device includes: an optical transmitter and an optical receiver; the optical transmitter and the optical receiver are connected by an optical fiber. The optical transmitter includes a laser and a silicon photonic chip. The laser is configured to output multiple multiplexed optical signals to be transmitted to the silicon photonic chip; the silicon photonic chip is configured to perform modulation and multiplexing processing on the multiple multiplexed optical signals to be transmitted, and transmit the processed optical signals to the optical receiver through the optical fiber; the optical receiver is configured to perform photoelectric conversion on the processed optical signals to generate an electrical signal corresponding to the optical signal to be transmitted. Since the present application directly uses a silicon photonic chip to simultaneously perform modulation and multiplexing processing, rather than first using a semiconductor chip such as a laser chip for modulation and then using an independently provided multiplexer for multiplexing, therefore, the present application can more ingeniously layout the optical transceiver module, thereby ensuring the integrity of optical signal transmission and further improving the optical signal transmission performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the following will briefly introduce the drawings required for describing the embodiments of the present application or the related art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0028] Figure 1 It is a schematic structural diagram of an optical signal transmission device in one embodiment;

[0029] Figure 2 It is a schematic structural diagram of a silicon photonic chip in one embodiment;

[0030] Figure 3 It is a schematic structural diagram of an optical signal transmission device including a signal source in one embodiment;

[0031] Figure 4 It is a schematic structural diagram of an optical signal transmission device including a digital signal processor in one embodiment;

[0032] Figure 5 It is a schematic structural diagram of an optical signal transmission device including a photodiode in one embodiment;

[0033] Figure 6 It is a schematic structural diagram of an optical signal transmission device including a demultiplexer in one embodiment;

[0034] Figure 7 It is a schematic structural diagram of a demultiplexer in one embodiment;

[0035] Figure 8 Schematic structural diagram of an optical receiver in an embodiment;

[0036] Figure 9 Three-dimensional schematic diagram of an optical signal transmission device in an embodiment;

[0037] Figure 10 Top view of an optical signal transmission device in an embodiment;

[0038] Figure 11 Schematic structural diagram of an optical transmitter in an embodiment;

[0039] Figure 12 Schematic diagram of optical signal transmission in an embodiment.

[0040] Reference numerals are as follows:

[0041] Optical transmitter 1; optical receiver 2; signal source 3; digital signal processor 4; circuit board 5; spacer 6; optical fiber repeater 7; TEC 8; ceramic substrate 9; metal base 10a; sealing cover 10b; gold wire 16; laser 11; silicon photonics chip 12; lens 13; isolator 14; modulator 121; combiner 122; photodiode 21; signal amplifier 22; demultiplexer 23. Detailed implementation manners

[0042] In order to make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above accompanying drawings are intended to cover non-exclusive inclusion.

[0044] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention.

[0045] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0046] In the present invention, unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0048] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only implementation.

[0049] Reference to "embodiments" in this document means that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0050] With the development of communication technologies, optical communication technologies have been widely applied in various fields due to their large communication capacity, low loss, and other characteristics. When information is transmitted through optical fibers, various types of optical signal transmission devices have emerged, such as optical transceiver modules. An optical transceiver module includes a transmitting end and a receiving end. The transmitting end is used to convert an electrical signal into an optical signal, and the receiving end is used to convert an optical signal into an electrical signal.

[0051] Currently, with the rapid development of CMOS (Complementary Metal-Oxide-Semiconductor) process silicon photonics, the demand for optical transceiver modules that use 8-channel single-wavelength 100 Gb / s to achieve optical signal transmission is increasing day by day. However, current 800G optical transceiver modules are all products with 800G DR8 multi-fiber MPO (Multi-Fiber Push On connector) interfaces or 800G 2XFR4 4-fiber dual LC (Lucent Connector) interfaces. Since the form factor of current 800G optical transceiver modules needs to follow corresponding protocol standards, the internal structure of current 800G optical transceiver modules is compact, making it difficult to layout 8-channel optical engine components in the limited internal space; and the wavelength division multiplexing of current 800G optical transceiver modules uses an integrated or external method, but using an external MUX (multiplex) method will occupy a large amount of space, which is not conducive to the design of 800G optical transceiver modules. Therefore, the current layout method of 800G optical transceiver modules is not ingenious enough to ensure the integrity of optical signal transmission, so current 800G optical transceiver modules have problems with poor optical signal transmission performance.

[0052] In one embodiment, as Figure 1 shown, an optical signal transmission device is provided, and the optical signal transmission device includes: an optical transmitter 1 and an optical receiver 2; the optical transmitter 1 and the optical receiver 2 are connected by an optical fiber, and the optical transmitter 1 includes a laser 11 and a silicon photonics chip 12,

[0053] The laser 11 is configured to output multiple multiplexed optical signals to be transmitted to the silicon photonics chip;

[0054] The silicon photonics chip 12 is configured to perform modulation and multiplexing processing on the multiple multiplexed optical signals to be transmitted, and transmit the processed optical signals to the optical receiver through the optical fiber;

[0055] The optical receiver 2 is configured to perform photoelectric conversion on the processed optical signals to generate electrical signals corresponding to the optical signals to be transmitted.

[0056] In the embodiment of the present application, the optical signal transmission device includes an optical transmitter 1 and an optical receiver 2. The optical transmitter 1 and the optical receiver 2 are connected by an optical fiber. The optical transmitter 1 includes a laser 11 and a silicon photonics chip 12. The silicon photonics chip 12 is disposed between the laser 11 and the optical receiver 2. Among them, the laser 11 is configured to emit a laser beam, that is, to output multiple multiplexed optical signals to be transmitted to the silicon photonics chip 12. Exemplarily, the laser 11 may include eight DFB (Distributed Feedback Laser) lasers; the silicon photonics chip 12 is configured to perform modulation and multiplexing processing on the multiple multiplexed optical signals to be transmitted, and transmit the processed optical signals to the optical receiver 2 through the optical fiber; the optical receiver 2 is configured to perform photoelectric conversion on the processed optical signals to generate electrical signals corresponding to the multiple multiplexed optical signals to be transmitted. It should be noted that in the embodiment of the present application, the silicon photonics chip is directly used to simultaneously implement modulation and multiplexing processing, rather than first using a semiconductor chip such as a laser chip for modulation and then using an independently arranged multiplexer for multiplexing. In this way, the present application can cleverly layout the optical transceiver module, thereby ensuring the integrity of optical signal transmission.

[0057] In the above optical signal transmission device, the optical signal transmission device includes: an optical transmitter and an optical receiver; the optical transmitter and the optical receiver are connected by an optical fiber. The optical transmitter includes a laser and a silicon photonics chip. The laser is used to output multiple optical signals to be transmitted to the silicon photonics chip; the silicon photonics chip is used to modulate and multiplex the multiple optical signals to be transmitted, and transmit the processed optical signals to the optical receiver through the optical fiber; the optical receiver is used to perform optoelectronic conversion on the processed optical signals to generate electrical signals corresponding to the optical signals to be transmitted. Since this application directly uses a silicon photonics chip to simultaneously perform modulation and multiplexing processing, rather than first using a semiconductor chip such as a laser chip for modulation and then using an independently arranged multiplexer for multiplexing, and the silicon photonics chip has advantages such as higher integration, lower cost, and better waveguide transmission characteristics compared to semiconductor chips, therefore, the embodiments of this application can more skillfully layout the optical transceiver module, thereby ensuring the integrity of optical signal transmission and further improving the optical signal transmission performance.

[0058] In one embodiment, as Figure 2 shown, Figure 2 FIG. is a schematic structural diagram of a silicon photonics chip in an embodiment. The above silicon photonics chip 12 includes a modulator 121 and a multiplexer 122; the output end of the laser 11 is connected to the input end of the modulator 121, the output end of the modulator 121 is connected to the input end of the multiplexer 122, and the output end of the multiplexer 122 is connected to the optical receiver 2 through an optical fiber;

[0059] The modulator 121 is used to perform amplitude modulation on multiple optical signals to be transmitted;

[0060] The multiplexer 122 is used to multiplex the multiple amplitude-modulated optical signals to obtain the processed optical signals.

[0061] In the embodiments of this application, a PIC (Photonic Integrated Circuit) is provided in the silicon photonics chip 12. The silicon photonics chip 12 includes multiple modulators 121 and a multiplexer 122. Exemplarily, Figure 2 the silicon photonics chip 12 in integrates eight modulators 121 and a multiplexer 122 of 8:1 MUX (multiplex). The output ends of each laser 11 are all connected to the input end of the modulator 121 through the Figure 2 corresponding optical fiber on the lower right, the output end of the modulator 121 is connected to the input end of the multiplexer 122, and the output end of the multiplexer 122 is connected to the optical receiver 2 through the Figure 2 optical fiber on the lower left. The modulator 121 is used to perform amplitude modulation on multiple optical signals to be transmitted to obtain multiple amplitude-modulated optical signals; the multiplexer 122 is used to multiplex the multiple amplitude-modulated optical signals to obtain one processed optical signal.

[0062] In this embodiment, by integrating multiple multiplexers and combiners in the silicon photonics chip, the processing of modulation and multiplexing can be directly achieved using the silicon photonics chip, rather than first using a semiconductor chip such as a laser chip for modulation and then using an independently arranged combiner for multiplexing. Therefore, the embodiment of the present application can more ingeniously layout the optical transceiver module, thereby ensuring the integrity of optical signal transmission and further improving the optical signal transmission performance.

[0063] In one embodiment, the above optical signal transmission device further includes: a signal source; the signal source is connected to the silicon photonics chip;

[0064] The signal source is used to drive the silicon photonics chip to work.

[0065] In the embodiment of the present application, as Figure 3 shown, Figure 3 FIG. is a schematic structural diagram of an optical signal transmission device including a signal source in one embodiment. The optical signal transmission device further includes a signal source 3, which can be provided through a gold finger. The signal source 3 is connected to the silicon photonics chip 12. The signal source 3 is used to drive the silicon photonics chip to work. Optionally, the silicon photonics chip can be directly driven by the signal source 3; or, the silicon photonics chip can also be jointly driven by the signal source 3 in combination with a digital signal processor.

[0066] In this embodiment, the optical signal transmission device further includes a signal source, and the signal source is connected to the silicon photonics chip, so the silicon photonics chip can be effectively driven to work through the signal source.

[0067] In one embodiment, the above optical signal transmission device further includes: a digital signal processor; a first input end of the digital signal processor is connected to the signal source, and a first output end of the digital signal processor is connected to the silicon photonics chip; a driver is included in the digital signal processor;

[0068] The digital signal processor is used to process the initial electrical signal output by the signal source to obtain a driving signal;

[0069] The driver is used to drive the silicon photonics chip to work according to the driving signal.

[0070] In the embodiment of the present application, as Figure 4 shown, Figure 4 FIG. is a schematic structural diagram of an optical signal transmission device including a digital signal processor in one embodiment. The optical signal transmission device further includes a digital signal processor 4 (Digital Signal Processor, DSP). A first input end of the digital signal processor 4 is connected to the signal source 3, and a first output end of the digital signal processor 4 is connected to the silicon photonics chip 12. A driver (Silicon Photonics Driver, Figure 4(not shown in the figure). The digital signal processor 4 is used to process the initial electrical signal output by the signal source 3 to obtain a driving signal, and send the driving signal to the driver integrated in the digital signal processor 4. Thus, the driver is used to drive the silicon optical chip 12 to work according to the driving signal.

[0071] In this embodiment, the optical signal transmission device further includes a digital signal processor, and a driver is integrated in the digital signal processor. In this way, not only can the layout volume of the optical signal transmission device be further reduced, but also the initial electrical signal output by the signal source can be processed by the digital signal processor to obtain a more stable driving signal, so that the driver integrated in the digital signal processor can be used to drive the silicon optical chip to work according to the driving signal.

[0072] In one embodiment, as Figure 5 shown, Figure 5 FIG. is a schematic structural diagram of an optical signal transmission device including a photodiode in one embodiment. The above-mentioned optical receiver 2 includes: a photodiode 21; the input end of the photodiode 21 is connected to the silicon optical chip 12 through an optical fiber.

[0073] In one of the embodiments, in combination with Figure 5 shown, the optical receiver 2 further includes: a signal amplifier 22, and the output end of the photodiode 21 is connected to the signal amplifier 22.

[0074] In the embodiment of the present application, the optical receiver 2 includes a photodiode 21 (PD, Photo-Diode) and a signal amplifier 22. Among them, the input end of the photodiode 21 is connected to the silicon optical chip 12 through an optical fiber, and the output end of the photodiode 21 is connected to the input end of the signal amplifier 22. The photodiode 21 is used to perform photoelectric conversion on the processed optical signal to obtain an electrically converted signal, and transmit the electrically converted signal to the signal amplifier 22. The signal amplifier 22 is used to amplify the electrically converted signal to generate an electrical signal corresponding to the optical signal to be transmitted. Among them, the signal amplifier 22 may include, but is not limited to, a transimpedance amplifier (TIA, Transimpedance Amplifier), etc.

[0075] In this embodiment, the optical receiver includes a photodiode and a signal amplifier. Through the mutual cooperation of the photodiode and the signal amplifier, the processed optical signal can be subjected to photoelectric conversion and signal amplification, so as to generate an electrical signal corresponding to the optical signal to be transmitted.

[0076] In one embodiment, as Figure 6 shown, Figure 6Schematic diagram of the structure of an optical signal transmission device including a demultiplexer in an embodiment. The above optical receiver 2 further includes: a demultiplexer 23; the input end of the demultiplexer 23 is connected to the silicon photonic chip 12 through an optical fiber, and the output end of the demultiplexer 23 is connected to the input end of the photodiode 21;

[0077] The demultiplexer 23 is configured to demultiplex the received processed optical signal to obtain multiple optical signals to be converted, and transmit the multiple optical signals to be converted to the photodiode 21.

[0078] In an embodiment of the present application, the optical receiver 2 further includes a demultiplexer 23. The input end of the demultiplexer 23 is connected to the silicon photonic chip 12 through an optical fiber, and the output end of the demultiplexer 23 is connected to the input end of the photodiode 21. The demultiplexer 23 is configured to demultiplex one received processed optical signal to obtain multiple optical signals to be converted, and transmit the multiple optical signals to be converted to the photodiode 21.

[0079] In one embodiment, the above demultiplexer 23 includes a Z-shaped optical path multiplexing module and a lens;

[0080] The Z-shaped optical path multiplexing module is configured to demultiplex the processed optical signal to obtain multiple optical signals to be converted;

[0081] The lens is configured to couple the multiple optical signals to be converted to the photodiode.

[0082] In an embodiment of the present application, as Figure 7 shown, Figure 7 Schematic diagram of the structure of a demultiplexer in an embodiment. Among them, Figure 7 Figure a in is the front view of a demultiplexer in an embodiment, Figure 7 Figure b in is the top view of a demultiplexer in an embodiment. The above demultiplexer 23 (i.e., the DEMUX component, De-Multiplexer) includes a 1:8 Z-shaped optical path multiplexing module (ZBLOCK), a lens, a CLENS component, a mirror, and a base. The mirror, the lens, the Z-shaped optical path multiplexing module (ZBLOCK), and the CLENS component are connected in sequence, and the lens, the Z-shaped optical path multiplexing module (ZBLOCK), and the CLENS component are all arranged on one side of the base. The CLENS component is connected to the LC adapter through an optical fiber. The Z-shaped optical path multiplexing module is configured to demultiplex the processed optical signal to obtain multiple optical signals to be converted, and the lens is configured to couple the multiple optical signals to be converted to the photodiode 21.

[0083] In this embodiment, since the demultiplexer adopts the 1:8 ZBLOCK method, the layout volume of the optical signal transmission device can be further reduced.

[0084] In one embodiment, as Figure 8As shown, Figure 8 FIG. Figure 8 is a schematic structural diagram of an optical receiver in an embodiment. The above optical signal transmission device further includes a circuit board 5 and a spacer 6. The silicon optical chip 12 is bonded to the first side of the circuit board 5 through a gold wire, the spacer 6 is disposed on the second side of the circuit board 5, and the optical receiver 2 is disposed on the side of the spacer 6 away from the circuit board 5.

[0085] Exemplarily, Figure 8 FIG. a in Figure 8 is a left view of the optical receiver in an embodiment, Figure 8 and FIG. b in Figure 8 is a right view of the optical receiver in an embodiment. In the embodiments of the present application, since the silicon optical chip 12 occupies a large space on the circuit board 5 (Printed Circuit Board, PCB), the silicon optical chip 12 can be bonded to the circuit board 5 through a gold wire, and the gold wire 16 can be cleared by the spacer 6. In this way, not only can the silicon optical chip 12 be prevented from being affected by the optical splitter 23 in the optical receiver 2, but also the reliability of the optical path can be improved.

[0086] In an embodiment, the above optical signal transmission device further includes an optical fiber repeater, and the optical fiber repeater is disposed between the silicon optical chip and the optical receiver.

[0087] In the embodiments of the present application, the above optical signal transmission device further includes an optical fiber repeater, and the optical fiber repeater is disposed between the silicon optical chip and the optical receiver. The optical fiber repeater is used to transmit the processed optical signal output by the silicon optical chip to the optical receiver through an optical fiber. Among them, exemplarily, the optical fiber repeater may include, but is not limited to, any one of a multi-fiber push-on connector (MPO, Multi-Fiber Push On connector), an LC adapter, etc.

[0088] In this embodiment, by providing the optical fiber repeater between the silicon optical chip and the optical receiver, the stable transmission of the processed optical signal can be ensured.

[0089] In an alternative embodiment, as Figures 9 - 11 shown, Figure 9 FIG. Figure 9 is a three-dimensional schematic diagram of an optical signal transmission device in an embodiment, Figure 10 FIG. Figure 10 is a top view of an optical signal transmission device in an embodiment, Figure 11 FIG. Figure 11 is a schematic structural diagram of an optical transmitter. The above optical signal transmission device includes an optical transmitter 1, an optical receiver 2, a signal source 3 ( Figures 9 - 11 not shown in Figures 9 - 11 ), a digital signal processor 4, a circuit board 5, a spacer 6, an optical fiber repeater 7, a TEC (Thermo Electric Cooler, semiconductor cooler) 8, a ceramic substrate 9, a metal base 10a, a sealing cover 10b, a gold wire 16 ( Figures 9 - 11(not shown in the figure), where the optical transmitter 1 includes a laser 11, a silicon photonics chip 12, a lens 13, and an isolator 14. The silicon photonics chip 12 includes a modulator 121 and a multiplexer 122. The connection relationships and specific introductions of the above components can be referred to the above embodiments and will not be elaborated here. In addition, Figure 10 each device in Figure 9 has been numbered, so Figure 10 there is no repeated marking in

[0090] In an exemplary embodiment of the present application, the metal base 10a is cured onto the circuit board 5 through epoxy glue. In the optical transmitter 1, the silicon photonics chip 12 is mounted on the metal base 10a through silver glue, the TEC 8 is eutectic on the metal base 10a, and the 8-channel laser 11 is eutectic on the ceramic substrate 9. Then, the 8-channel laser 11 is bonded to the TEC 8 through silver glue. The light of each laser 11 is adjusted to horizontally polarized light by the lens 13 through the isolator 14 and then coupled to the silicon photonics chip 12. Thus, the modulator 121 integrated in the silicon photonics chip 12 performs amplitude modulation on the coupled horizontally polarized light to obtain 8-channel modulated light. The multiplexer 122 integrated in the silicon photonics chip 12 couples the 8-channel modulated light to the fiber optic repeater 7. Among them, the 8-channel modulated light after coupling is the processed optical signal. In the optical receiver 2, the spacer 6 is mounted on the circuit board 5 through epoxy glue. The 8x100 Gb / s light (i.e., the processed optical signal) is demultiplexed and coupled to the photodiode 21 through the demultiplexer 23. The photodiode 21 and the signal amplifier 22 perform photoelectric conversion processing on the optical signal demultiplexed and coupled to the photodiode 21 to generate an electrical signal corresponding to the optical signal to be transmitted. In addition, a sealing cover 10b can be used to encapsulate the optical signal transmission device, and after the optical signal transmission device is encapsulated, glue can be used to seal and protect the optical signal transmission device.

[0091] In an exemplary embodiment, as Figure 12 shown, Figure 12Schematic diagram of optical signal transmission in an embodiment. The 8-channel PAM4 (4-Level Pulse Amplitude Modulation) electrical signal of 8x100 Gb / s provided by the signal source enters the DSP through the gold finger for signal processing, and the processed 8-channel PAM4 electrical signal is obtained. Thus, the DSP inputs the processed 8-channel PAM4 electrical signal into the silicon photonics chip to drive the silicon photonics chip to work through the 8-channel PAM4 electrical signal. In addition, 8 lasers with wavelengths of 1271 nm to 1341 nm and a wavelength interval of 10 nm provide continuous optical signals to the silicon photonics chip. Thus, the silicon photonics chip converts the 8-channel PAM4 electrical signal and the continuous optical signal into a modulated optical signal by changing the refractive index of the silicon waveguide, and uses the AWG (Arrayed Waveguide Grating) technology integrated in the silicon photonics chip to multiplex the modulated optical signals, so that the multiplexed modulated optical signals can be coupled into a single optical fiber in the LC adapter. After that, the processed optical signal in the single optical fiber can be demultiplexed by a demultiplexer DEMUX into 8 optical signals with wavelengths of 1271 nm to 1341 nm, and the 8 optical signals with wavelengths are coupled into a photodiode PD. Thus, the photodiode performs photoelectric conversion processing on the demultiplexed and coupled optical signal to obtain the converted electrical signal, and the signal amplifier TIA amplifies the converted electrical signal and inputs the 8-channel PAM4 electrical signal obtained after signal amplification into the DSP for processing, and the 8-channel PAM4 electrical signal corresponding to the optical signal to be transmitted can be generated.

[0092] Based on the above introduction, the embodiments of the present application provide a design and packaging of an 800G QDD (Quad Differential Detection) FR8 optical module based on silicon photonics. It fills the gap for dual-fiber products with medium and short distances at a port rate of 800 Gbps and is applicable to high-speed interconnection in data centers and 5G communication scenarios. The silicon photonics chip in the embodiments of the present application integrates main functional units such as a coupler array, a modulator array, an 8-wavelength multiplexer, and a temperature control array. Therefore, the optical signal transmission device can adopt the integrated silicon photonics chip and packaging technology to achieve a rate of 800 Gb / s for a single optical fiber. It can not only achieve a high-density port design, realize the efficient high-density integration of a multi-wavelength laser array, a multi-channel silicon photonics chip, and a micro-miniature optical component, but also ensure that the optical signal transmission device has the advantages of low power consumption and low cost. In addition, the embodiments of the present application use optical signals with 8 wavelengths of 1271 nm / 1281 nm / 1291 nm / 1301 nm / 1311 nm / 1321 nm / 1331 nm / 1341 nm to achieve wavelength division multiplexing, which can be adapted to the chip design and film system design of CWDM8.

[0093] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in the present application.

[0094] The above embodiments only represent several implementation manners of the present application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. An optical signal transmission device, characterized in that, The optical signal transmission device includes: an optical transmitter and an optical receiver; the optical transmitter and the optical receiver are connected by an optical fiber, and the optical transmitter includes a laser and a silicon photonics chip. The laser is configured to output multiple multiplexed optical signals to be transmitted to the silicon photonics chip. The silicon photonics chip is configured to perform modulation and multiplexing processing on the multiple multiplexed optical signals to be transmitted, and transmit the processed optical signals to the optical receiver through the optical fiber. The optical receiver is configured to perform photoelectric conversion on the processed optical signals to generate electrical signals corresponding to the optical signals to be transmitted.

2. The device according to claim 1, characterized in that, The silicon photonics chip includes a modulator and a multiplexer; the output end of the laser is connected to the input end of the modulator, the output end of the modulator is connected to the input end of the multiplexer, and the output end of the multiplexer is connected to the optical receiver through the optical fiber. The modulator is configured to perform amplitude modulation on the multiple multiplexed optical signals to be transmitted. The multiplexer is configured to perform signal multiplexing on the multiple amplitude-modulated optical signals to obtain the processed optical signals.

3. The device according to claim 1, characterized in that The optical signal transmission device further includes: a signal source; the signal source is connected to the silicon photonics chip. The signal source is configured to drive the silicon photonics chip to operate.

4. The device according to claim 3, characterized in that, The optical signal transmission device further includes: a digital signal processor; a first input end of the digital signal processor is connected to the signal source, and a first output end of the digital signal processor is connected to the silicon photonics chip; the digital signal processor includes a driver. The digital signal processor is configured to process the initial electrical signal output by the signal source to obtain a driving signal. The driver is configured to drive the silicon photonics chip to operate according to the driving signal.

5. The device according to claim 1, characterized in that, The optical receiver includes: a photodiode; an input end of the photodiode is connected to the silicon photonics chip through the optical fiber.

6. The device according to claim 5, characterized in that The optical receiver further includes: a demultiplexer; an input end of the demultiplexer is connected to the silicon photonics chip through the optical fiber, and an output end of the demultiplexer is connected to an input end of the photodiode. The demultiplexer is configured to demultiplex the received processed optical signals to obtain multiple optical signals to be converted, and transmit the multiple optical signals to be converted to the photodiode.

7. The device according to claim 6, characterized in that, The demultiplexer includes a Z-shaped optical path multiplexing module and a lens. The Z-shaped optical path multiplexing module is configured to demultiplex the processed optical signals to obtain the multiple optical signals to be converted. The lens is configured to couple the multiple optical signals to be converted to the photodiode.

8. The device according to claim 7, characterized in that, The optical signal transmission device further includes a circuit board and a spacer. The silicon photonics chip is bonded to the first side of the circuit board by a gold wire, the spacer is disposed on the second side of the circuit board, and the optical receiver is disposed on a side of the spacer away from the circuit board.

9. The device according to claim 5, characterized in that, The optical receiver further includes: a signal amplifier, and an output end of the photodiode is connected to the signal amplifier.

10. The device according to any one of claims 1 to 9, characterized in that, The optical signal transmission device further includes an optical fiber repeater, and the optical fiber repeater is disposed between the silicon photonics chip and the optical receiver.

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