Design method and device of multilayer printed circuit board, electronic equipment and storage medium

Abstract

The invention relates to the technical field of PCB design, and provides a design method and device of a multi-layer printed circuit board, electronic equipment and a storage medium. According to the method, design requirements for the multilayer printed circuit board are received through a visual control so as to generate a preset printed circuit board design document corresponding to the format of third-party software, and the printed circuit board design document comprises lamination information of the multilayer printed circuit board; identifying the printed circuit board design document line by line to obtain lamination information corresponding to each line; adding the lamination information corresponding to each row into an initial lamination information file corresponding to the printed circuit board design software to obtain a target lamination information file; and importing the target lamination information file into the printed circuit board design software to complete the design of the multi-layer printed circuit board. According to the application, the lamination information of the printed circuit board design document is identified, so that the printed circuit board design text is quickly converted into the target lamination information file which can be identified by the printed circuit board design software.

Description

Technical Field

[0001] This application relates to the technical field of PCB design, and in particular, to a design method, device, electronic device, and storage medium for a multi-layer printed circuit board. Background Art

[0002] In the design of printed circuit boards (PCBs), due to the wiring density and project design requirements, multi-layer PCBs are usually designed. Especially for the PCBs in an automatic test equipment (ATE), the number of layers is dozens. Due to issues such as design rules and signal layer attribute definitions involved in the stack-up information in the printed circuit board design software, it is very difficult to quickly add or modify the stack-up information in the PCB. Summary of the Invention

[0003] In view of this, embodiments of this application provide a design method, device, electronic device, and storage medium for a multi-layer printed circuit board to solve the problem in the prior art that directly generating a target stack-up information file by the printed circuit board design software results in low design efficiency.

[0004] In the first aspect of the embodiments of this application, a design method for a multi-layer printed circuit board is provided. The method includes: receiving a design requirement for a multi-layer printed circuit board through a visualization control to generate a printed circuit board design document corresponding to the format of a preset third-party software, where the printed circuit board design document includes the stack-up information of the multi-layer printed circuit board; performing line-by-line recognition on the printed circuit board design document to obtain the stack-up information corresponding to each line; adding the stack-up information corresponding to each line to the initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file; and importing the target stack-up information file into the printed circuit board design software to complete the design of the multi-layer printed circuit board.

[0005] In the second aspect of the embodiments of this application, a design device for a multi-layer printed circuit board is provided. The device includes: a document generation module, configured to receive a design requirement for a multi-layer printed circuit board through a visualization control to generate a printed circuit board design document corresponding to the format of a preset third-party software, where the printed circuit board design document includes the stack-up information of the multi-layer printed circuit board; a document recognition module, configured to perform line-by-line recognition on the printed circuit board design document to obtain the stack-up information corresponding to each line; a document conversion module, configured to add the stack-up information corresponding to each line to the initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file; and an information import module, configured to import the target stack-up information file into the printed circuit board design software to complete the design of the multi-layer printed circuit board.

[0006] In a third aspect of the embodiments of the present application, an electronic device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the above method are implemented.

[0007] In a fourth aspect of the embodiments of the present application, a computer-readable storage medium is provided. The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the above method are implemented.

[0008] The beneficial effects of the embodiments of the present application compared with the prior art are as follows: In the embodiments of the present application, the design requirements for a multi-layer printed circuit board are received through a visualization control to generate a printed circuit board design document corresponding to the format of a pre-set third-party software. The printed circuit board design document includes the stack-up information of the multi-layer printed circuit board. The printed circuit board design document is recognized line by line to obtain the stack-up information corresponding to each line. The stack-up information corresponding to each line is added to the initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file. The target stack-up information file is imported into the printed circuit board design software to complete the design of the multi-layer printed circuit board. The present application recognizes the stack-up information of the printed circuit board design document to accurately and quickly convert the printed circuit board design text into a target stack-up information file recognizable by the printed circuit board design software, thereby improving the design efficiency of the multi-layer printed circuit board and avoiding the problem of low design efficiency caused by manually configuring the stack-up structure layer by layer through the printed circuit board design software to generate the target stack-up information file. Secondly, in the present application, the design requirements for the multi-layer printed circuit board are received through the visualization control to generate a printed circuit board design document, which improves the receiving efficiency of the design requirements. In addition, the printed circuit board design document generated in the present application is a document in the format corresponding to the third-party software, enabling the user to quickly adjust the content in the printed circuit board design document by utilizing the convenience of operating the third-party software, further accelerating the design process and avoiding the problem of low design efficiency caused by directly generating the printed circuit board design document by the printed circuit board design software because the printed circuit board design software itself cannot perform copy, paste, and batch operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0010] Figure 1 It is a schematic flowchart of a method for designing a multi-layer printed circuit board provided by an embodiment of the application; Figure 2 It is a basic schematic diagram of a visualization control provided by an embodiment of the present application; Figure 3 It is a basic schematic diagram of the content in a printed circuit board design document provided by an embodiment of the present application; Figure 4 It is a basic schematic diagram of the content in another printed circuit board design document provided by an embodiment of the present application; Figure 5 It is a flowchart of a design method for another multilayer printed circuit board provided by an embodiment of the present application; Figure 6 It is a flowchart of a design method for yet another multilayer printed circuit board provided by an embodiment of the present application; Figure 7 It is a flowchart of a design method for still another multilayer printed circuit board provided by an embodiment of the present application; Figure 8 It is a flowchart of a design method for an alternative multilayer printed circuit board provided by an embodiment of the present application; Figure 9 It is a structural schematic diagram of a design device for a multilayer printed circuit board provided by an embodiment of the present application; Figure 10 It is a structural schematic diagram of an electronic device provided by an embodiment of the present application. Detailed implementation manners

[0011] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present application. However, those skilled in the art should clearly understand that the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details from interfering with the description of the present application.

[0012] A design method and device for a multilayer printed circuit board according to an embodiment of the present application will be described in detail below with reference to the accompanying drawings.

[0013] Figure 1 It is a flowchart of a design method for a multilayer printed circuit board provided by an embodiment of the present application. As Figure 1 shown, the design method for the multilayer printed circuit board includes: S101. Receive the design requirements for the multilayer printed circuit board through the visualization control to generate a printed circuit board design document corresponding to the format of a pre-set third-party software. The printed circuit board design document includes the stack-up information of the multilayer printed circuit board; S102. Identify each line of the printed circuit board design document to obtain the corresponding stack-up information for each line; S103. Add the stack-up information corresponding to each line to the initial stack-up information file corresponding to the printed circuit board design software to obtain the target stack-up information file; S104. Import the target stack-up information file into the printed circuit board design software to complete the design of the multi-layer printed circuit board.

[0014] Among them, the visualization control is a control provided through a visualization interface. Users can input design requirements for multi-layer printed circuit boards based on this visualization control. Exemplarily, such as Figure 2 shown, Figure 2 is an example of a visualization control provided by this application.

[0015] Among them, the third-party software refers to an external application program other than the printed circuit board design software (non-PCB design software) itself. Exemplarily, the third-party software is text-type software that realizes corresponding functions in text form, such as Excel, Word, Notepad, etc. Since the third-party software has the convenience of copying, pasting, and batch operation, the operability and efficiency of generating printed circuit board design documents can be improved based on the third-party software. Details will be described later and will not be elaborated here.

[0016] The above design requirements are the requirements when the user designs the PCB board. For example, if the PCB board designed by the user requires a 6-layer PCB board, the first layer is TOP, the second layer is L2_GND, the third layer is L3_SIGNAL, the fourth layer is L4_GND, the fifth layer is L5_POWER, and the sixth layer is BOTTOM, then all or part of the requirements when the user designs the PCB board are used as the design requirements.

[0017] In some examples, at least two layer information interfaces are set in the visualization control, and different layer information interfaces correspond to different attribute information, such as Figure 2 shown, in Figure 2 the example, the visualization control is provided with 3 layer information interfaces, namely the GND layer information interface, the power layer information interface, and the signal layer information interface. The attribute information corresponding to the GND layer information interface is the GND layer, the attribute information corresponding to the power layer information interface is the power layer, and the attribute information corresponding to the signal layer information interface is the signal layer.

[0018] Among them, the design requirements for the multilayer printed circuit board are received through the visualization control to generate a printed circuit board design document corresponding to the format of the preset third-party software, including: receiving the layer number information for characterizing the design requirements through the layer information interface included in the visualization control; generating an initial printed circuit board design document according to the received layer number information and the attribute information of the layer information interface corresponding to the received layer number information. Among them, in this application, the design requirements for the multilayer printed circuit board are received through the visualization control to generate a printed circuit board design document, which improves the reception efficiency of the design requirements; in addition, the printed circuit board design document generated in this application is a document in the corresponding format of the third-party software, enabling the user to quickly adjust the content in the printed circuit board design document by utilizing the convenience of operating the third-party software, further improving and accelerating the design process, and avoiding the problem of low design efficiency caused by the inability of the printed circuit board design software itself to perform copy, paste, and batch operations when directly generating the printed circuit board design document.

[0019] Take Figure 2 as an example. Figure 2 It includes a GND layer information interface, a power layer information interface, and a signal layer information interface. The user's design requirements are: the first layer is TOP, the second layer is the GND layer, the third layer is the signal layer, the fourth layer is the GND layer, the fifth layer is the signal layer, the sixth layer is the GND layer, the 7th layer is the power layer, the 8th layer is the power layer, the 9th layer is the GND layer, the 10th layer is the signal layer, the 11th layer is the GND layer, and the 12th layer is BOTTOM. Then the user inputs the layer number information 2, 4, 6, 9, 11 in the GND layer information interface (to represent that the second layer, the fourth layer, the sixth layer, the 9th layer, and the 11th layer in the design requirements are the GND layer), the user inputs the layer number information 7, 8 in the power layer information interface (to represent that the 7th layer and the 8th layer in the design requirements are the power layer), and the user inputs the layer number information 3, 5, 10 in the signal layer information interface (to represent that the third layer, the fifth layer, and the 10th layer in the design requirements are the signal layer).

[0020] Continuing with the above example, after receiving the layer number information for characterizing the design requirements through the layer information interface included in the visualization control, this application will also generate an initial printed circuit board design document according to the received layer number information and the attribute information of the layer information interface corresponding to the received layer number information. The format of this initial printed circuit board design document is also supported by the third-party software. Specifically, this application will splice and process the received layer number information and the attribute information of the layer information interface corresponding to the received layer number information according to a preset splicing method, and then generate an initial printed circuit board design document.

[0021] In some examples, taking the splicing method as directly splicing the layer number information and the attribute information as an example, assuming the layer number information is 2 and the attribute information is GND, they are directly combined into 2GND; for another example, taking the splicing method as adding a separator between the layer number information and the attribute information and adding L as an identifier before the layer number information as an example, assuming the layer number information is 2, the attribute information is GND, and the separator is _, then after splicing according to the above splicing method, it is L2_GND. For another example, taking the splicing method as adding a separator between the layer number information and the attribute information and adding L as an identifier before the layer number information as an example, if the user inputs the layer number information 2, 4, 6, 9, 11 in the GND layer information interface, the user inputs the layer number information 7, 8 in the power supply layer information interface, and the user inputs the layer number information 3, 5, 10 in the signal layer information interface, then the initial printed circuit board design document formed by this application is Figure 3 as shown

[0022] In some examples, the top layer (TOP layer) and the last layer (BOTTOM layer) are automatically generated without user operation; in some examples, the top layer and the last layer can also be generated by the user through interactive controls, which will not be elaborated here.

[0023] In some examples, this application can directly use this initial printed circuit board design document as the final printed circuit board design document.

[0024] In some examples, this application can also receive a modification instruction for the initial printed circuit board design document through a third-party software, and modify the attribute information in the initial printed circuit board design document based on the modification instruction to obtain the printed circuit board design document. It can be understood that since the attribute information in the initial printed circuit board design document generated by the interactive control is a common name, the user can modify the information in the initial printed circuit board design document according to actual needs to generate the final printed circuit board design document, such as Figure 4 as shown Figure 4 for adjusting the information in Figure 3 to obtain the printed circuit board design document.

[0025] Among them, since the third-party software has the convenience of copying, pasting, and batch operation, the operability and efficiency of generating the printed circuit board design document can be improved based on the third-party software.

[0026] In some examples, the visualization control provided by this application is also provided with a layer number interface, which is used to receive the total number of layers in the design requirements. For example, as Figure 2 shown Figure 2 the visualization control shown in Figure 2The input box corresponding to the number of layers corresponds to the interface of that layer. If the user inputs 6 through the layer interface, it indicates that there are 6 lines of stack-up information in the generated printed circuit board design document.

[0027] In some examples, the present application also verifies whether the number of layers received by the layer interface is valid (for example, the received number of layers can only be an integer and is invalid when it is not an integer; for another example, the received number of layers can only be a positive number and is invalid when it is a negative number; for yet another example, the received number of layers should be within a certain range and is invalid outside that range). When the number of layers received by the layer interface is valid, it also checks whether the layer information received based on that layer interface is complete (for example, the received number of layers is 12, but the total number of subsequent received layer information fails to reach 12. For example, the user inputs layer information 2, 4, 6 in the GND layer information interface, and the user inputs layer information 3, 5, 10 in the signal layer information interface, then the layer information of 7, 8, 9, 11 is missing (the first layer and the last layer are automatically generated, so the layer information of 1 and 12 does not need to be filled in), and an error message needs to be reported to remind the user to re-enter (or supplement) the input.

[0028] Continuing with the above example, the present application will specifically illustrate the implementation of the above visual control in combination with the following example.

[0029] 1. Interface creation part.

[0030] In the __init__ method, the main window is created and the title is set. An input box is provided for the user to input the number of layers. There is a "Add layer information" button, and clicking it will call the add_layer_info_entry method to add a group of input boxes for inputting layer name, function, and attributes. There is also an "OK" button, and clicking it will call the generate_excel method to generate an Excel file.

[0031] 2. Add layer information part: The add_layer_info_entry method is used to create a new group of input boxes, including input boxes for name, function, and attributes, and store the references to these input boxes in the self.layers list.

[0032] 3. Generate Excel file part: The generate_excel method first verifies whether the number of layers input by the user is valid. Then it checks whether the number of input layer information matches the number of layers. Then it traverses each group of input boxes, obtains the information input by the user, and performs a completeness check. Finally, this information is organized into a DataFrame and saved as an Excel file. If an error occurs during the saving process, a corresponding error message box will pop up.

[0033] In some examples, when generating a printed circuit board design document, the printed circuit board design document is recognized to automatically extract stack-up related information, where document recognition includes text parsing, that is, field extraction from structured / semi-structured documents, and document recognition also includes table recognition: if the stack-up information is stored in tabular form, the corresponding relationship between rows and columns is automatically recognized.

[0034] Optionally, the extracted stack-up related information needs to be standardized, such as unifying the thickness unit (mil, mm), unifying the material naming (FR4 vs FR-4), to ensure seamless conversion in the follow-up.

[0035] In the embodiments of the present application, according to the recognized and extracted stack-up information, it is formatted into a dedicated file that can be directly imported by PCB design software, that is, the target stack-up information file; among them, different PCB software (such as Altium, Allegro, PADS) requires different stack-up file formats, for example: XML format (the import format of Altium's Layer Stack Manager), ASCII script format (the stack-up script acceptable to Allegro), proprietary API data (injected directly through the programming interface).

[0036] Optionally, metadata may need to be added during the conversion process, such as layer name numbering rules, media encoding, etc., to ensure that the design software can correctly parse.

[0037] The generated target stack-up information file is imported through the interface provided by the PCB design software. After the import, the PCB design software will automatically apply the stack-up file. After the import is completed, relevant personnel (such as designers) can directly carry out component layout, signal routing, EMI analysis, thermal simulation, etc. in the correctly configured stack-up environment through the PCB design software, greatly improving the design efficiency and accuracy.

[0038] According to the technical solution provided by the embodiments of the present application, a design requirement for a multilayer printed circuit board is received through a visualization control to generate a printed circuit board design document corresponding to a pre-set third-party software format. The printed circuit board design document includes the stack-up information of the multilayer printed circuit board. The printed circuit board design document is recognized line by line to obtain the stack-up information corresponding to each line. The stack-up information corresponding to each line is added to the initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file. The target stack-up information file is imported into the printed circuit board design software to complete the design of the multilayer printed circuit board. The present application recognizes the stack-up information of the printed circuit board design document to accurately and quickly convert the printed circuit board design text into a target stack-up information file recognizable by the printed circuit board design software, thereby improving the design efficiency of the multilayer printed circuit board and avoiding the problem of low design efficiency caused by manually configuring the stack-up structure layer by layer through the printed circuit board design software to generate the target stack-up information file. Secondly, the present application receives the design requirement for the multilayer printed circuit board through the visualization control to generate the printed circuit board design document, improving the receiving efficiency of the design requirement. In addition, the printed circuit board design document generated by the present application is a document in the format corresponding to the third-party software, enabling the user to quickly adjust the content in the printed circuit board design document by utilizing the convenience of operating the third-party software, further accelerating the design process and avoiding the problem of low design efficiency caused by directly generating the printed circuit board design document by the printed circuit board design software because the printed circuit board design software itself cannot perform copy, paste, and batch operations.

[0039] In some embodiments, in order to completely and accurately convert the stack-up information included in the printed circuit board design document into the stack-up information file corresponding to the printed circuit board design software, the present application will recognize the printed circuit board design document line by line to obtain the stack-up information corresponding to each line. Among them, if any line does not contain stack-up information, that line can be skipped and the content of other lines can be recognized continuously.

[0040] In some examples, the present application will add the stack-up information corresponding to each line to the initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file. Specifically, an initial stack-up information file is pre-set in the present application. The initial stack-up information file contains the necessary information required by the printed circuit board design software. After obtaining the stack-up information, it can be added to the initial stack-up information file to generate the target stack-up information file.

[0041] Taking the stack-up information of a certain line recognized as "L3_ USB" as an example, after adding it to the initial stack-up information file, it is as follows: <object type="Conductor"> <attribute name="CDS_LAYER_NAME"> <value Value="L3_USB" / > … (subsequent codes are not shown).

[0042] In another example, the present application adds the stack-up information corresponding to each line to the initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file, including: obtaining a corresponding stack-up template according to the design requirements and the historical design of the multi-layer printed circuit board; modifying the stack-up template according to the stack-up information corresponding to each line to obtain a target stack-up template; adding the target stack-up template to the initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file.

[0043] Among them, obtaining the historical design of the multi-layer printed circuit board, the historical design refers to the data records of the completed and verified multi-layer PCB design projects accumulated in the system, including the stack-up configuration and design parameters of the historical projects. These historical stack-up designs have often passed manufacturing and verification and have high reference value. Therefore, based on the current design requirements, the most matching stack-up template can be selected from the historical designs, such as selecting stack-up templates with performance matching and layer count matching. By calling the historical stack-up template, it is possible to avoid designing the stack-up structure from scratch, accelerate the design process, and at the same time ensure that the template meets manufacturing feasibility and industry best practices.

[0044] Compare the stack-up information corresponding to each line with the layers corresponding to the stack-up template to perform modification operations to obtain a target stack-up template. The template not only inherits the mature experience of the historical design but also meets the current design requirements. The modification operations include replacement, that is, if the stack-up information in the printed circuit board design document is inconsistent with the template, the template information is replaced with the stack-up information; insertion, that is, if some special layers (such as EMI shielding layers) are newly added in the printed circuit board design document, a new layer structure is inserted into the stack-up template; deletion: if it is determined according to the stack-up information that there are layers in the stack-up template but not required in the document, the corresponding layers are deleted from the template. Integrate the target stack-up template into the initial stack-up information file according to the file format requirements of the PCB design software. After adding and integrating, a target stack-up information file is formed.

[0045] According to the technical solution provided by the embodiments of the present application, the printed circuit board design document is recognized line by line to obtain the stack-up information corresponding to each line, ensuring that the stack-up information contained in each line is completely and accurately recognized. Subsequently, the stack-up information corresponding to each line in the printed circuit board design document is spliced to obtain the stack-up information corresponding to each line; the stack-up information corresponding to each line is added to the initial stack-up information file corresponding to the printed circuit board design software to obtain the target stack-up information file, thereby ensuring that the stack-up information of the multilayer printed circuit board contained in the printed circuit board design document is converted into the stack-up information file corresponding to the printed circuit board design software.

[0046] In some embodiments, as Figure 5 shown, the line-by-line recognition of the printed circuit board design document includes: S501. Search for the start identifier in the printed circuit board design document, and start line-by-line recognition of the printed circuit board design document starting from the position of the start identifier; S502. During the process of line-by-line recognition of the printed circuit board design document, if the end identifier in the printed circuit board design document is recognized, stop the line-by-line recognition of the printed circuit board design document.

[0047] Specifically, in order to ensure the accuracy of recognition during the process of line-by-line recognition of the printed circuit board design document, the present application will set the start identifier and the end identifier when generating the printed circuit board design document. For example, as Figure 2 shown, use TOP as the start identifier and BOTTOM as the end identifier.

[0048] During the process of line-by-line recognition of the printed circuit board design document, the present application first searches for the start identifier in the printed circuit board design document, and starts line-by-line recognition of the printed circuit board design document starting from the position of the start identifier. That is, all lines before the start identifier will not be recognized, avoiding the problem of invalid recognition caused by recognizing invalid lines, thereby improving the recognition efficiency and achieving the effect of saving system resources.

[0049] During the process of line-by-line recognition of the printed circuit board design document, if the end identifier in the printed circuit board design document is recognized, stop the line-by-line recognition of the printed circuit board design document. That is, all lines after the end identifier will not be recognized, avoiding the problem of invalid recognition caused by recognizing invalid lines, thereby improving the recognition efficiency and achieving the effect of saving system resources.

[0050] Take Figure 2 For example, in this application, TOP is used as the start identifier and BOTTOM is used as the end identifier. Then, the lines before TOP do not need to be recognized, and only the start identifier search action is performed. Then, each line from TOP to BOTTOM is recognized line by line. The lines after BOTTOM do not need to be recognized. On the basis of ensuring that the lamination information contained in each line is recognized completely and accurately, the problem of invalid recognition caused by recognizing invalid lines is avoided, thereby improving the recognition efficiency and achieving the effect of saving system resources.

[0051] And taking Figure 2 as an example, in this application, TOP is used as the start identifier and BOTTOM is used as the end identifier. Then, each line from TOP to BOTTOM is recognized line by line. During this process, one recognized line is one layer of the PCB, ensuring the accuracy of the recognition.

[0052] According to the technical solution provided by the embodiment of this application, the lines before the start identifier do not need to be recognized, and only the start identifier search action is performed. The lines after the end identifier do not need to be recognized, avoiding the problem of invalid recognition caused by recognizing invalid lines, thereby improving the recognition efficiency and achieving the effect of saving system resources.

[0053] In some embodiments, such as Figure 6 shown, the printed circuit board design document is recognized line by line, including: S601. Obtain the generation progress of the printed circuit board design document; S602. After the generation progress of the printed circuit board design document indicates that the printed circuit board design document is generated, automatically recognize the printed circuit board design document line by line.

[0054] Specifically, in order to automatically convert the lamination information of the multi-layer printed circuit board contained in the printed circuit board design document into the corresponding target lamination information file of the printed circuit board design software, this application monitors the generation progress of the printed circuit board design document, and then realizes obtaining the generation progress of the printed circuit board design document in real time (or periodically).

[0055] After the generation progress of the printed circuit board design document indicates that the printed circuit board design document is generated, automatically recognize the printed circuit board design document line by line, thereby realizing the automatic processing of the printed circuit board design document and avoiding the problem of low efficiency caused by manual operation.

[0056] According to the technical solution provided by the embodiments of the present application, obtain the generation progress of the printed circuit board design document; after the generation progress of the printed circuit board design document indicates that the generation of the printed circuit board design document is completed, automatically perform line-by-line recognition on the printed circuit board design document. This solution realizes the automated processing of the printed circuit board design document and avoids the problem of low efficiency caused by manual operation.

[0057] In some examples, such as Figure 7 shown, before generating the printed circuit board design document in the format corresponding to the pre-set third-party software by receiving the design requirements for the multi-layer printed circuit board through the visualization control, the method further includes: S701. Determine the line number information based on the design requirements; S702. When the line number information is greater than the pre-set line number threshold, issue a format reminder, where the format reminder is used to prompt the user to input format information; S703. Receive the format information output by the user in response to the format reminder, where the format information is used to indicate the generation format of the stack-up information.

[0058] Specifically, the line number information represents the total number of layers of the PCB board to be designed in the design requirements, that is, if there is a layer number interface set in the visualization control, the line number information is the layer number received by the layer number interface.

[0059] When the line number information is greater than the pre-set line number threshold, issue a format reminder, where the format reminder is used to prompt the user to input format information; receive the format information output by the user in response to the format reminder, where the format information is used to indicate the generation format of the stack-up information (the generation format of the stack-up information is the splicing method of splicing the layer number information and the attribute information), so that relevant personnel (such as designers) can flexibly set the splicing method according to actual needs.

[0060] For example, the user can set the splicing method as: directly splice the layer number information and the attribute information; for another example, the user can set the splicing method as: add a separator between the layer number information and the attribute information and then splice, and add L as an identifier before the layer number information.

[0061] Taking the splicing method as directly splicing the layer number information and the attribute information as an example, assuming the layer number information is 2 and the attribute information is GND, they are directly combined into 2GND; for another example, taking the splicing method as adding a separator between the layer number information and the attribute information and adding L as an identifier before the layer number information as an example, assuming the layer number information is 2, the attribute information is GND, and the separator is _, then after splicing according to the above splicing method, it is L2_GND. For another example, taking the splicing method as adding a separator between the layer number information and the attribute information and adding L as an identifier before the layer number information as an example, the user inputs the layer number information 2, 4, 6, 9, 11 in the GND layer information interface, the user inputs the layer number information 7, 8 in the power layer information interface, and the user inputs the layer number information 3, 5, 10 in the signal layer information interface.

[0062] According to the technical solution provided by the embodiment of the present application, the row number information is determined based on the design requirements; when the row number information is greater than a preset row number threshold, a format reminder is issued, and the format reminder is used to prompt the user to input format information; the format information output by the user in response to the format reminder is received, and the format information is used to indicate the generation format of the stack-up information. The above steps enable relevant personnel to add more data processing logics in this loop according to actual needs.

[0063] In some examples, as Figure 8 shown, the method further includes: S801. Receive a design modification instruction for a multi-layer printed circuit board through a third-party software to modify the printed circuit board design document to obtain a new printed circuit board design document; S802. Complete the design of the multi-layer printed circuit board based on the new printed circuit board design document.

[0064] Specifically, when relevant personnel need to modify the stack-up information of a multi-layer printed circuit board, they can also receive a design modification instruction for the multi-layer printed circuit board through a third-party software to modify the printed circuit board design document to obtain a new printed circuit board design document.

[0065] Then complete the design of the multi-layer printed circuit board based on the new printed circuit board design document. Specifically, first identify the new printed circuit board design document to convert the stack-up information of the multi-layer printed circuit board included in the new printed circuit board design document into a new target stack-up information file corresponding to the printed circuit board design software; import the new target stack-up information file into the printed circuit board design software to complete the design of the multi-layer printed circuit board.

[0066] According to the technical solution provided by the embodiments of the present application, a design modification instruction for a multilayer printed circuit board is received through a third-party software, thereby realizing the convenience of copying, pasting, and batch operation of the third-party software, achieving the effect of quickly modifying the stack-up information, and further enhancing the operability and efficiency of modifying the generation of the printed circuit board design document. Subsequently, the design of the multilayer printed circuit board is completed according to the new printed circuit board design document, which also improves the design efficiency of the multilayer printed circuit board.

[0067] Any combination of the above optional technical solutions can form an optional embodiment of the present application, which will not be elaborated herein one by one.

[0068] The following is an embodiment of the device of the present application, which can be used to execute the method embodiment of the present application. For the details not disclosed in the embodiment of the device of the present application, please refer to the method embodiment of the present application.

[0069] This embodiment also provides a device for designing a multilayer printed circuit board, as Figure 9 shown. The device includes: A document generation module 901, configured to receive a design requirement for a multilayer printed circuit board through a visualization control to generate a printed circuit board design document corresponding to a pre-set format of a third-party software. The printed circuit board design document includes stack-up information of the multilayer printed circuit board; A document recognition module 902, configured to recognize each line of the printed circuit board design document to obtain the stack-up information corresponding to each line; A document conversion module 903, configured to add the stack-up information corresponding to each line to an initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file; An information import module 904, configured to import the target stack-up information file into the printed circuit board design software to complete the design of the multilayer printed circuit board.

[0070] In some examples, at least two layer information interfaces are at least set in the visualization control, and different layer information interfaces correspond to different attribute information; the document generation module 901 is further configured to receive layer number information representing the design requirement through the layer information interfaces included in the visualization control; generate an initial printed circuit board design document according to the received layer number information and the attribute information of the layer information interface corresponding to the received layer number information; receive a modification instruction for the initial printed circuit board design document through a third-party software, and modify the attribute information in the initial printed circuit board design document based on the modification instruction to obtain the printed circuit board design document.

[0071] In some examples, the document conversion module 903 is further configured to obtain a corresponding stack-up template according to the design requirements and the historical design of the multi-layer printed circuit board; modify the stack-up template according to the stack-up information corresponding to each line to obtain a target stack-up template; and add the target stack-up template to the initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file.

[0072] In some examples, the document conversion module 903 is further configured to search for a start identifier in the printed circuit board design document, and perform line-by-line recognition on the printed circuit board design document starting from the position of the start identifier; during the process of performing line-by-line recognition on the printed circuit board design document, if the end identifier in the printed circuit board design document is recognized, stop performing line-by-line recognition on the printed circuit board design document.

[0073] In some examples, the document conversion module 903 is further configured to obtain the generation progress of the printed circuit board design document; and automatically perform line-by-line recognition on the printed circuit board design document after the generation progress of the printed circuit board design document indicates that the printed circuit board design document is generated.

[0074] In some examples, the document generation module 901 is further configured to determine the line number information based on the design requirements; in the case where the line number information is greater than a pre-set line number threshold, issue a format reminder, where the format reminder is used to prompt the user to input format information; and receive the format information output by the user in response to the format reminder, where the format information is used to indicate the generation format of the stack-up information.

[0075] In some examples, the apparatus is further configured to: receive a design modification instruction for the multi-layer printed circuit board through a third-party software to modify the printed circuit board design document to obtain a new printed circuit board design document; and complete the design of the multi-layer printed circuit board based on the new printed circuit board design document.

[0076] According to the technical solution provided by the embodiment of the present application, a visualization control is used to receive the design requirements for a multi-layer printed circuit board, so as to generate a printed circuit board design document corresponding to the format of a preset third-party software. The printed circuit board design document includes the stack-up information of the multi-layer printed circuit board. The printed circuit board design document is recognized line by line to obtain the stack-up information corresponding to each line. The stack-up information corresponding to each line is added to the initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file. The target stack-up information file is imported into the printed circuit board design software to complete the design of the multi-layer printed circuit board. By recognizing the stack-up information of the printed circuit board design document, the present application accurately and quickly converts the printed circuit board design text into a target stack-up information file recognizable by the printed circuit board design software, thereby improving the design efficiency of the multi-layer printed circuit board and avoiding the problem of low design efficiency caused by manually configuring the stack-up structure layer by layer through the printed circuit board design software to generate the target stack-up information file. Secondly, the present application uses a visualization control to receive the design requirements for a multi-layer printed circuit board and generate a printed circuit board design document, which improves the receiving efficiency of the design requirements. In addition, the printed circuit board design document generated by the present application is a document in the format corresponding to the third-party software, enabling the user to quickly adjust the content in the printed circuit board design document by utilizing the convenience of operating the third-party software, further accelerating the design process and avoiding the problem of low design efficiency caused by directly generating the printed circuit board design document by the printed circuit board design software because the printed circuit board design software itself cannot perform copy, paste, and batch operations.

[0077] Figure 10 is a schematic diagram of the electronic device 10 provided by the embodiment of the present application. As Figure 10 shown, the electronic device 10 of this embodiment includes: a processor 1001, a memory 1002, and a computer program 1003 stored in the memory 1002 and executable on the processor 1001. When the processor 1001 executes the computer program 1003, the steps in the above-mentioned various method embodiments are implemented. Alternatively, when the processor 1001 executes the computer program 1003, the functions of each module / unit in the above-mentioned various device embodiments are implemented.

[0078] The electronic device 10 may be a desktop computer, a notebook, a palm computer, a cloud server, and other electronic devices. The electronic device 10 may include, but is not limited to, the processor 1001 and the memory 1002. Those skilled in the art can understand that Figure 10 merely an example of the electronic device 10, which does not constitute a limitation on the electronic device 10, and may include more or fewer components than shown in the figure, or different components.

[0079] The processor 1001 may be a central processing unit (CPU), or other general-purpose processor, digital signal processor (DSP), application specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic device, discrete gate or transistor logic device, discrete hardware component, etc.

[0080] The memory 1002 may be an internal storage unit of the electronic device 10. For example, the hard disk or memory of the electronic device 10. The memory 1002 may also be an external storage device of the electronic device 10. For example, a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc. equipped on the electronic device 10. The memory 1002 may also include both the internal storage unit and the external storage device of the electronic device 10. The memory 1002 is used to store computer programs and other programs and data required by the electronic device.

[0081] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the above-mentioned division of each functional unit and module is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiments can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above integrated units can be implemented in the form of hardware or in the form of software functional units.

[0082] If the integrated module / unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, to implement all or part of the processes in the above-described embodiment methods of this application, it can also be completed by a computer program instructing relevant hardware. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, the steps of the above various method embodiments can be implemented. The computer program can include computer program code, and the computer program code can be in the form of source code, object code, executable file, or some intermediate form, etc. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disc, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signal, telecommunication signal, and software distribution medium, etc. It should be noted that the content included in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice within the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable medium does not include electrical carrier signals and telecommunication signals.

[0083] The above embodiments are only used to illustrate the technical solutions of this application, rather than to limit them; although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing various embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of this application, and should all be included within the protection scope of this application.< / attribute> < / object>

Claims

1. A design method for a multi-layer printed circuit board, characterized in that, The method includes: Receiving design requirements for a multilayer printed circuit board through a visualization control to generate a printed circuit board design document corresponding to a preset third-party software format, where the printed circuit board design document includes stack-up information of the multilayer printed circuit board; Identifying each line of the printed circuit board design document to obtain the stack-up information corresponding to each line; Adding the stack-up information corresponding to each line to an initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file; Importing the target stack-up information file into the printed circuit board design software to complete the design of the multilayer printed circuit board.

2. The method according to claim 1, wherein Adding the stack-up information corresponding to each line to the initial stack-up information file corresponding to the printed circuit board design software to obtain the target stack-up information file, including: Obtaining a corresponding stack-up template according to the design requirements and the historical design of the multilayer printed circuit board; Modifying the stack-up template according to the stack-up information corresponding to each line to obtain a target stack-up template; Adding the target stack-up template to the initial stack-up information file corresponding to the printed circuit board design software to obtain the target stack-up information file.

3. The method according to claim 1, characterized in that, Identifying each line of the printed circuit board design document, including: Searching for a start identifier in the printed circuit board design document and starting to identify each line of the printed circuit board design document from the position of the start identifier; During the process of identifying each line of the printed circuit board design document, if the end identifier in the printed circuit board design document is identified, stop identifying each line of the printed circuit board design document.

4. The method according to claim 1, characterized in that, Identifying each line of the printed circuit board design document, including: Obtaining the generation progress of the printed circuit board design document; Automatically identifying each line of the printed circuit board design document after the generation progress of the printed circuit board design document indicates that the printed circuit board design document is generated.

5. The method according to claim 1, characterized in that At least two layer information interfaces are at least set in the visualization control, and different layer information interfaces correspond to different attribute information; receiving design requirements for a multilayer printed circuit board through a visualization control to generate a printed circuit board design document corresponding to a preset third-party software format, including: Receiving layer number information for characterizing the design requirements through the layer information interfaces included in the visualization control; Generating an initial printed circuit board design document according to the received layer number information and the attribute information of the layer information interface corresponding to the received layer number information; Receiving a modification instruction for the initial printed circuit board design document through the third-party software and modifying the attribute information in the initial printed circuit board design document based on the modification instruction to obtain the printed circuit board design document.

6. The method according to claim 1, characterized in that, Before receiving design requirements for a multilayer printed circuit board through a visualization control to generate a printed circuit board design document corresponding to a preset third-party software format, the method further includes: Determining line number information based on the design requirements; When the line number information is greater than a preset line number threshold, a format reminder is issued, and the format reminder is used to prompt the user to input format information; Receive the format information output by the user in response to the format reminder, and the format information is used to indicate the generation format of the stack-up information.

7. The method according to claim 1, characterized in that The method further includes: Receive a design modification instruction for the multi-layer printed circuit board through the third-party software to modify the printed circuit board design document and obtain a new printed circuit board design document; Complete the design of the multi-layer printed circuit board based on the new printed circuit board design document.

8. A design device for a multi-layer printed circuit board, characterized in that, The device includes: A document generation module, configured to receive a design requirement for a multi-layer printed circuit board through a visualization control to generate a printed circuit board design document corresponding to the format of a preset third-party software, where the printed circuit board design document includes stack-up information of the multi-layer printed circuit board; A document recognition module, configured to perform line-by-line recognition on the printed circuit board design document to obtain stack-up information corresponding to each line; A document conversion module, configured to add the stack-up information corresponding to each line to an initial stack-up information file corresponding to the printed circuit board design software to obtain a target stack-up information file; An information import module, configured to import the target stack-up information file into the printed circuit board design software to complete the design of the multi-layer printed circuit board.

9. An electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

Images