Diamond micro-powder surface nickel plating device based on semiconductor wafer production

Abstract

The invention relates to the technical field of diamond micro-powder processing, and discloses a diamond micro-powder surface nickel plating device based on semiconductor wafer production, the diamond micro-powder surface nickel plating device comprises a reaction tank, an adjustable turbulent flow mechanism and an adjustable stirring mechanism, and further comprises a top cover installed at the top of the reaction tank in a threaded mode, and an adjusting mechanism is fixedly installed at the top of the top cover; a mixer is fixedly mounted at the bottom of the top cover; the adjustable turbulent flow mechanism is composed of two mounting frames, a rotating ring and four angle adjusting assemblies. According to the technical scheme, the adjustable turbulent flow mechanism and the adjustable stirring mechanism are synchronously driven through the adjusting mechanism, the angle of an adjusting paddle in the adjustable stirring mechanism and the angle of a spoiler in the adjustable turbulent flow mechanism are synchronously adjusted according to the requirements of different nickel plating stages, and a multi-dimensional circulating flow field is formed through cooperation of the angle of the paddle and the angle of the spoiler; and the nickel plating requirements of different stages are met, and the dispersity of the diamond micro-powder and the uniformity of a plating layer are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of diamond micropowder processing, and in particular to a nickel plating device for the surface of diamond micropowder based on semiconductor wafer production. Background Art

[0002] In the precision processing of semiconductor wafer production, diamond micropowder, as an efficient and excellent abrasive, is widely used in the grinding and polishing steps of wafers; diamond micropowder, with its high hardness and good cutting performance, is a key material for achieving high-precision processing; nickel plating on the surface of diamond micropowder can significantly improve the wear resistance and corrosion resistance of diamond micropowder, and can also effectively improve its adsorption and dispersion performance, so that diamond micropowder shows better stability and efficiency in the grinding and polishing process.

[0003] A chemical nickel plating device for the surface of diamond micropowder with the publication number of CN107761080A has solved the technical drawbacks that it is difficult to reach the dispersion requirements for the stirring speed of the plating solution and the powder in the reaction barrel, and diamond particles are likely to accumulate under the stirring blade, resulting in adhesion and affecting the quality of the wire saw. In the process of implementing the present invention, the inventor found that there are at least the following problems in the prior art: The existing nickel plating device for the surface of diamond micropowder based on semiconductor wafer production cannot dynamically adjust the shear force and the distribution of the shear force field according to the nickel plating requirements of diamond micropowder. Since a low-shear-force environment is required in the nucleation stage on the surface of diamond micropowder and a high-shear-force environment is required after the nucleation period, the existing nickel plating device can only provide a fixed shear stress and flow path. The fixed shear stress and flow path result in that in the nucleation stage on the surface of diamond micropowder, too high shear force will cause violent collision of diamond micropowder, resulting in the shedding of unbonded particles and causing coating defects, and too low shear force cannot effectively disturb the plating solution, resulting in aggregation of micropowder due to too low flow rate, causing uneven coating thickness and nodulation phenomena, and unable to meet the requirements of shear stress and flow field strength in different stages during the nickel plating process, thus resulting in problems of insufficient coating quality and uniformity.

[0004] Therefore, the above technical problems need to be solved. Summary of the Invention

[0005] In order to overcome the deficiencies of the prior art, the present invention provides a nickel plating device for the surface of diamond micropowder based on semiconductor wafer production to solve the problems that the shear force and the distribution of the shear force field cannot be dynamically adjusted according to the nickel plating requirements of diamond micropowder, and the single shear force intensity and shear force field of the stirring paddle lead to uneven coating thickness and nodulation phenomena, affecting the uniformity of nickel plating of diamond micropowder.

[0006] To solve the above technical problems, the basic technical solution proposed by the present invention is: A device for nickel plating the surface of diamond micropowder produced based on semiconductor wafers comprises a reaction tank, an adjustable spoiler mechanism and an adjustable stirring mechanism, and also comprises a top cover threadedly mounted on the top of the reaction tank, an adjusting mechanism is fixedly mounted on the top of the top cover, and a mixer is fixedly mounted on the bottom of the top cover; the adjustable spoiler mechanism consists of two mounting frames, a rotating ring, and four angle adjustment components, the four angle adjustment components are distributed in a ring shape at equal intervals on the outer side of the top of the rotating ring, and the outer side of the rotating ring is transmission-connected with the four angle adjustment components through a linkage slider; the adjustable stirring mechanism is rotationally mounted inside the mixer, and the top of the adjustable stirring mechanism is transmission-connected with the adjusting mechanism; the adjustable spoiler mechanism and the adjustable stirring mechanism are synchronously driven by the adjusting mechanism, the flow pattern and shear force field distribution of the fluid are dynamically adjusted by the adjustable stirring mechanism, the spoiler angle is adjusted by the adjustable spoiler mechanism, the flow path and speed of the plating solution are changed, and a multi-dimensional circulating flow field can be formed by the coordination of the adjustable spoiler mechanism and the adjustable stirring mechanism.

[0007] Preferably, the adjustable stirring mechanism consists of a driven bevel gear, a transmission rod, an adjusting rod, an adjustable angle stirring paddle and a shaft rod sleeve, wherein the driven bevel gear is fixedly mounted on the top of the transmission rod, the shaft rod sleeve is fixedly mounted on the bottom of the transmission rod, the adjusting rod is movably mounted inside the transmission rod, a spline rod is fixedly mounted on the top of the outer side of the adjusting rod, a spline groove corresponding to the spline rod is opened inside the driven bevel gear, the adjusting rod is connected with the spline groove bayonet pin inside the driven bevel gear through the spline rod, so that the driven bevel gear drives the adjusting rod to rotate synchronously, and at the same time does not affect the telescopic movement of the adjusting rod inside the transmission rod, and a shaft frame is fixedly mounted on the bottom end of the adjusting rod, and the bottom end of the adjusting rod is movably connected with the adjustable angle stirring paddle through the shaft frame, and the telescopic adjusting rod adjusts the angle of the adjustable angle stirring paddle through the shaft frame, wherein the adjustable angle stirring paddle consists of a universal shaft rod, a mounting shaft seat and a paddle blade, the top of the universal shaft rod is rotatably connected to the bottom of the mounting shaft seat, and the paddle blade is fixedly mounted on one side of the mounting shaft seat.

[0008] Preferably, the two mounting frames are rotatably installed with limit rollers inside, the two mounting frames are movably installed on both sides of the swivel through the limit rollers, and the two mounting frames are respectively fixedly installed on both sides of the outer wall of the adjustable spoiler mechanism, a second gear is rotatably installed on one side inside one of the mounting frames, a second rack is fixedly installed on the outer side of the swivel, and the second rack is meshingly connected with the second gear.

[0009] Preferably, the angle adjustment assembly consists of a slide member, a rotating shaft rod and a spoiler, and the slide member is fixedly installed on one end of the rotating shaft rod, and the spoiler is fixedly installed on the other end of the rotating shaft rod. One end of the rotating shaft rod extends to the interior of the mixer and is movably connected to the inner wall of the mixer.

[0010] Preferably, the adjusting mechanism consists of a slide frame, a first gear, a telescopic frame, a servo motor, a first bevel gear and a second bevel gear, wherein a slide frame is provided with a slide slot on the front and rear sides of the slide frame, and a slide rod corresponding to the slide slot is fixedly installed on the front and rear sides of the telescopic frame, and the slide rod extends into the slide slot and is movably connected, the telescopic frame is movably installed inside the slide frame through the slide rod and the slide slot, and the bottom of the telescopic frame extends to the inside of the top cover, and the bottom of the telescopic frame is connected to the top of the adjusting rod through a rotating shaft, and the first rack is fixedly installed on the inner wall of one side of the telescopic frame, the first gear is rotatably installed inside the slide frame through a shaft rod, the first gear is meshed with the first rack, the servo motor is fixedly installed on one side of the slide frame, and the output end of the servo motor is fixedly connected to one side of the first gear through the shaft rod, the first bevel gear is fixedly connected to the other side of the first gear through the shaft rod, the first bevel gear is meshed with the second bevel gear, and the bottom of the second bevel gear is transmission connected to the second gear through the shaft rod.

[0011] Preferably, a driving motor is fixedly installed on one side inside the top cover, and a driving bevel gear is fixedly installed on the output end of the driving motor through a shaft rod, the driving bevel gear is meshingly connected with the driven bevel gear, the bottom of the top cover extends to the inside of the reaction tank, and an annular spray mechanism is fixedly installed on the bottom of the top cover.

[0012] The beneficial effects of the present invention are: The technical solution of the present invention synchronously drives the adjustable spoiler mechanism and the adjustable stirring mechanism through the regulating mechanism, synchronously adjusts the adjustable blade angle in the adjustable stirring mechanism and the spoiler angle in the adjustable spoiler mechanism according to the requirements of different nickel plating stages, and forms a multi-dimensional circulating flow field through the cooperation of the blade angle and the spoiler angle to meet the nickel plating requirements of different stages and ensure the dispersion of diamond micropowder and the uniformity of the coating. Specifically, the adjustable angle stirring paddle of the adjustable stirring mechanism can change the angle of the paddle according to the requirements of different nickel plating stages, produce different axial and radial flows, and dynamically adjust the shear stress and shear force distribution, so that the device can provide a low shear force environment in the early stage of diamond micropowder nucleation to avoid losses caused by particle collisions, and increase the shear force after the nucleation period to make the particle suspension and dispersion more uniform, thereby improving the uniformity and quality of the final coating, so that the device can meet the shear stress and shear force distribution requirements of different nickel plating stages, ensure the efficient diffusion of nickel ions in the plating solution and the uniform dispersion of micropowders, reduce the violent collision and particle shedding caused by excessive shear force of diamond micropowder in the nickel plating nucleation stage, and also avoid micropowder aggregation and uneven coating caused by too low shear force after nucleation. The flow direction of the fluid is adjusted by adjusting the four reversible spoilers in the adjustable spoiler mechanism, breaking the laminar flow state, forming cross mixing, promoting the uniform circulation of the fluid inside the reaction tank, reducing the aggregation and agglomeration of diamond micropowder, and thus improving the mixing efficiency of the plating solution and diamond micropowder; According to the requirements of the nickel plating stage, the device utilizes the synergistic effect of the adjustable flow disturbance mechanism and the adjustable stirring mechanism to dynamically adjust the flow path, shear force distribution and intensity of the fluid, form a multi-dimensional circulating flow field, improve the diffusion efficiency of nickel ions in the plating solution and the uniformity of particle suspension, ensure that nickel plating is carried out under the most suitable conditions in each stage, and thus improve the uniformity and density of the nickel coating on the surface of diamond micropowder. Description of the Drawings

[0013] Figure 1 Schematic diagram of the overall structure in the present invention; Figure 2 Schematic diagram of the internal structure of the reaction tank in the present invention; Figure 3 Schematic diagram of the internal structure of the mixer in the present invention; Figure 4 Schematic diagram of the water flow direction of the adjustable-angle stirring paddle in the present invention; Figure 5 Schematic diagram of the internal structure of the top cover in the present invention; Figure 6 Schematic diagram of the transmission connection of the adjusting mechanism with the adjustable flow disturbance mechanism and the adjustable stirring mechanism in the present invention; Figure 7 Schematic diagram of the internal structure of the adjusting mechanism in the present invention; Figure 8 Schematic diagram of the structure of the adjustable flow disturbance mechanism in the present invention; Figure 9 Schematic diagram of the structure of the mounting bracket in the present invention; Figure 10 Schematic diagram of the internal components of the adjustable stirring mechanism in the present invention; Figure 11 Schematic diagram of the internal unfolded structure of the adjustable stirring mechanism in the present invention; Figure 12 Schematic diagram of the structure of the adjustable-angle blade in the present invention; Figure 13 Schematic diagram of the structure of the universal shaft rod in the present invention.

[0014] Description of the Reference Numerals: 1. Reaction tank; 2. Top cover; 201. Drive motor; 202. Active bevel gear; 203. Annular spray mechanism; 3. Adjustment mechanism; 301. Slide rack; 302. First gear; 303. Telescopic rack; 304. First rack; 305. Servo motor; 306. First bevel gear; 307. Second bevel gear; 4. Mixer; 5. Adjustable spoiler mechanism; 501. Mounting rack; 5011. Limit roller; 502. Rotating ring; 5021. Second rack; 503. Slide member; 504. Rotating shaft rod; 505. Spoiler; 506. Second gear; 6. Adjustable stirring mechanism; 601. Driven bevel gear; 602. Transmission rod; 603. Adjustment rod; 604. Adjustable angle stirring paddle; 6041. Universal shaft rod; 6042. Mounting shaft seat; 6043. Paddle; 605. Shaft sleeve. DETAILED DESCRIPTION

[0015] The following will be combined with the attached Figure 1 To Attachment Figure 13 The technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] A device for nickel plating the surface of diamond micropowder produced based on semiconductor wafers comprises a reaction tank 1, an adjustable spoiler mechanism 5 and an adjustable stirring mechanism 6, and also comprises a top cover 2 threadedly mounted on the top of the reaction tank 1, an adjusting mechanism 3 is fixedly mounted on the top of the top cover 2, and a mixer 4 is fixedly mounted on the bottom of the top cover 2; the adjustable spoiler mechanism 5 is composed of two mounting frames 501, a rotating ring 502, and four angle adjustment components, the four angle adjustment components are distributed in a ring shape at equal intervals on the outer side of the top of the rotating ring 502, and the outer side of the rotating ring 502 is transmission-connected to the four angle adjustment components through a linkage slider; the adjustable stirring mechanism 6 is rotatably mounted inside the mixer 4, and the top of the adjustable stirring mechanism 6 is transmission-connected to the adjusting mechanism 3; the adjustable spoiler mechanism 5 and the adjustable stirring mechanism 6 are synchronously driven by the adjusting mechanism 3, the flow pattern and shear force field distribution of the fluid are dynamically adjusted by the adjustable stirring mechanism 6, the spoiler angle is adjusted by the adjustable spoiler mechanism 5, the flow path and speed of the plating solution are changed, and a multi-dimensional circulating flow field can be formed by the coordination of the adjustable spoiler mechanism 5 and the adjustable stirring mechanism 6; It should be noted that a collection valve is provided at the bottom of the reaction tank 1, which facilitates the collection of the nickel-plated fine powder inside the reaction tank 1. A plating solution circulation mechanism is installed outside the collection valve through a mounting cover. The plating solution circulation mechanism is used to realize the circulation of the plating solution inside the reaction tank 1. By adjusting the angle of the adjustable-angle stirring paddle 604 in the adjustable stirring mechanism 6, the flow pattern and shear force of the fluid are dynamically adjusted, so that the adjustable-angle stirring paddle 604 dynamically adjusts the magnitude of the shear force and the shear force field distribution according to the needs of the diamond micro nickel-plating stage; specifically, by adjusting the angle of the blade 6043 in the adjustable-angle stirring paddle 604, the magnitude of the shear force can be flexibly controlled. A larger angle generates a stronger axial flow, while a smaller angle generates more radial flow, realizing a dynamic change in the shear force distribution, thereby changing the action area and intensity distribution of the shear force; a larger angle of the blade 6043 will increase the relative movement between the fluid and the blade 6043, thereby generating a higher shear stress, which will intensify the fluid shear effect, form turbulence enhancement, and turbulence enhancement can accelerate the migration of nickel ions to the surface of the diamond fine powder and shorten the coating formation time. The driven adjustable spoiler mechanism 5 drives the four angle adjustment components to flip synchronously through the rotating ring 502. The four flipped angle adjustment components use the angle change of the spoiler 505 in the angle adjustment component to force the fluid to change its original flow direction by adjusting the angle of the spoiler 505, so as to achieve the purpose of adjusting the spoiler angle. The spoiler 505 can enhance the axial circulation of the fluid and form a stirring effect of cross mixing. The cross mixing stirring method helps to break the laminar state in the fluid, promote the formation of turbulence, and improve the mixing efficiency; by adjusting the angle of the spoiler 505, the steering angle and range of the fluid can be precisely controlled, so as to optimize the circulation path of the fluid in the barrel, ensure the uniform distribution of the fluid in the barrel, reduce the stirring dead angle, and further improve the mixing effect; by adjusting the angle of the spoiler 505, it can adapt to the stirring process of diamond micro powder nickel plating in different stages. The coordinated action of the adjustable spoiler mechanism 5 and the adjustable stirring mechanism 6 dynamically adjusts the flow path, shear force distribution and intensity of the fluid, forming a multi-dimensional circulating flow field.

[0017] Such as Figures 10 to 13As shown, the adjustable stirring mechanism 6 is composed of a driven bevel gear 601, a transmission rod 602, an adjusting rod 603, an adjustable-angle stirring paddle 604 and a shaft sleeve 605. Among them, the driven bevel gear 601 is fixedly installed at the top of the transmission rod 602, and the shaft sleeve 605 is fixedly installed at the bottom of the transmission rod 602. The adjusting rod 603 is movably installed inside the transmission rod 602. A spline rod is fixedly installed at the top of the outer side of the adjusting rod 603. A spline groove corresponding to the spline rod is opened inside the driven bevel gear 601. The adjusting rod 603 is connected to the spline groove inside the driven bevel gear 601 through the spline rod by a snap pin, which is convenient for the driven bevel gear 601 to drive the adjusting rod 603 to rotate synchronously, and at the same time does not affect the telescopic movement of the adjusting rod 603 inside the transmission rod 602. A shaft bracket is fixedly installed at the bottom of the adjusting rod 603. The bottom end of the adjusting rod 603 is movably connected to the adjustable-angle stirring paddle 604 through the shaft bracket. The telescopic adjusting rod 603 adjusts the angle of the adjustable-angle stirring paddle 604 through the shaft bracket. Among them, the adjustable-angle stirring paddle 604 is composed of a universal shaft rod 6041, a mounting shaft seat 6042 and a paddle blade 6043. The top of the universal shaft rod 6041 is rotatably connected to the bottom of the mounting shaft seat 6042, and the paddle blade 6043 is fixedly installed on one side of the mounting shaft seat 6042; It should be noted that the mounting shaft seat 6042 is movably connected to the shaft sleeve 605 through a shaft bolt. The adjusting mechanism 3 is used to drive the adjusting rod 603 to expand and contract. The telescopic adjusting rod 603 pulls the adjustable-angle stirring paddle 604 through the shaft bracket to adjust the angle. Specifically, the traction force of the telescopic adjusting rod 603 is transmitted to the universal shaft rod 6041 through the shaft bracket, and the universal shaft rod 6041 pulls the paddle blade 6043 through the mounting shaft seat 6042 movably installed on the shaft sleeve 605 to flip and adjust the angle; The transmission rod 602 transmits power from the driven bevel gear 601 to the adjusting rod 603 and allows the adjusting rod 603 to freely expand and contract inside it. The adjusting rod 603 realizes synchronous rotation through the spline rod and the spline groove inside the driven bevel gear 601, while ensuring that its telescopic function is not affected; the rotating driven bevel gear 601 drives the transmission rod 602 to rotate, realizing the synchronous rotation of the transmission rod 602 and the adjusting rod 603 to drive the adjustable-angle stirring paddle 604 to rotate and stir the plating solution. The plating solution forms a radial gradient flow under the action of the centrifugal force of the stirring. The fine powder moves outward under the centrifugal force. At the same time, the internal circulation of the plating solution generates a shear force, which destroys the agglomerated structure and forces the fine powder particles to be evenly dispersed in the plating solution.

[0018] As Figures 8 to 9As shown in the figure, limit rollers 5011 are rotatably installed inside both mounting brackets 501. The two mounting brackets 501 are movably installed on both sides of the rotating ring 502 through the limit rollers 5011, and the two mounting brackets 501 are respectively fixedly installed on both sides of the outer wall of the adjustable spoiler mechanism 5. A second gear 506 is rotatably installed on one side inside one of the mounting brackets 501. A second rack 5021 is fixedly installed on the outer side of the rotating ring 502, and the second rack 5021 is meshed and connected with the second gear 506; It should be noted that the mounting bracket 501 restricts the rotation position of the rotating ring 502 through the limit roller 5011 and enables the rotating ring 502 to rotate flexibly. The rotating second gear 506 drives the rotating ring 502 to rotate through the second rack 5021. The rotating rotating ring 502 drives the four angle adjustment components to flip synchronously through the linkage slider.

[0019] As Figure 5 , Figure 8 shown in the figure, the angle adjustment component is composed of a chute member 503, a rotating shaft rod 504, and a spoiler 505. One end of the rotating shaft rod 504 is fixedly installed with the chute member 503, and the other end of the rotating shaft rod 504 is fixedly installed with the spoiler 505. One end of the rotating shaft rod 504 extends into the mixer 4 and is movably connected to the inner wall of the mixer 4; It should be noted that when the rotating rotating ring 502 drives the rotating shaft rod 504 to rotate through the cooperation of the linkage slider and the chute member 503, the rotating rotating shaft rod 504 drives the spoiler 505 to adjust the angle, dynamically adapting to the stirring intensity and fluid mode. By adjusting the angle of the spoiler 505, the flow mode and velocity distribution of the plating solution in the reaction chamber are changed, making the fluid more uniform, reducing the dead zone, and improving the mixing effect of the plating solution.

[0020] As Figures 6 to 7As shown, the adjustment mechanism 3 is composed of a slide frame 301, a first gear 302, a telescopic frame 303, a servo motor 305, a first bevel gear 306 and a second bevel gear 307, wherein the slide frame 301 is provided with slide grooves on the front and rear sides, and the telescopic frame 303 is fixedly installed with slide rods corresponding to the slide grooves on the front and rear sides, and the slide rods extend into the slide grooves and are movably connected, the telescopic frame 303 is movably installed inside the slide frame 301 through the slide rods and the slide grooves, and the bottom of the telescopic frame 303 extends to the inside of the top cover 2, and the bottom of the telescopic frame 303 is connected to the top of the adjustment rod 603 through the rotating shaft, and the telescopic frame 303 is connected to the top of the adjustment rod 603 through the rotating shaft. A first rack 304 is fixedly installed on the inner wall of one side of 03, and the first gear 302 is rotatably installed inside the slide frame 301 through a shaft rod, and the first gear 302 is meshed with the first rack 304. The servo motor 305 is fixedly installed on one side of the slide frame 301, and the output end of the servo motor 305 is fixedly connected to one side of the first gear 302 through a shaft rod, and the first bevel gear 306 is fixedly connected to the other side of the first gear 302 through a shaft rod, and the first bevel gear 306 is meshed with the second bevel gear 307, and the bottom of the second bevel gear 307 is transmission-connected to the second gear 506 through a shaft rod; It should be noted that when the servo motor 305 is powered on, it drives the first gear 302 to rotate through the shaft. The rotating first gear 302 drives the telescopic frame 303 to telescopically move through the meshing first rack 304. The telescopic frame 303 drives the adjustable angle stirring paddle 604 to adjust the angle through the adjusting rod 603, thereby adjusting the shear force and the shear field distribution. At the same time, the rotating first gear 302 drives the first bevel gear 306 to rotate through the shaft, and the rotating first bevel gear 306 drives the meshing second bevel gear 307 to rotate, and the rotating second bevel gear 307 drives the second gear 506 to rotate through the shaft, thereby adjusting the spoiler angle.

[0021] like Figure 5 As shown, a driving motor 201 is fixedly installed on one side of the top cover 2, and a driving bevel gear 202 is fixedly installed on the output end of the driving motor 201 through a shaft, and the driving bevel gear 202 is meshed and connected with a driven bevel gear 601. The bottom of the top cover 2 extends to the inside of the reaction tank 1, and an annular spray mechanism 203 is fixedly installed on the bottom of the top cover 2; It should be noted that when the driving motor 201 is energized and operates, it drives the driving bevel gear 202 to rotate by means of the shaft rod. The rotating driving bevel gear 202 drives the transmission rod 602 to rotate through the meshing-connected driven bevel gear 601. Moreover, the rotating driven bevel gear 601 drives the adjusting rod 603 to rotate synchronously by means of the spline groove inside it cooperating with the spline rod on the outside of the adjusting rod 603, so that the transmission rod 602 and the adjusting rod 603 cooperate to drive the adjustable-angle stirring paddle 604 to rotate and stir the plating solution; the annular spraying mechanism 203 distributes the plating solution evenly into the reaction tank 1 to maintain the stability of the plating solution composition inside the reaction tank 1.

[0022] Based on the explanations and teachings in the above specification, those skilled in the art to which the present invention pertains can also make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the protection scope of the claims of the present invention. In addition, although some specific terms are used in this specification, these terms are only for convenience of description and do not constitute any limitation to the present invention.

Claims

1. A nickel-plating device for the surface of diamond micropowder produced based on semiconductor wafers, comprising a reaction tank (1), an adjustable flow disturbance mechanism (5) and an adjustable stirring mechanism (6), characterized in that, It also includes a top cover (2) threadedly mounted on the top of the reaction tank (1), an adjustment mechanism (3) fixedly mounted on the top of the top cover (2), and a mixer (4) fixedly mounted on the bottom of the top cover (2); the adjustable spoiler mechanism (5) is composed of two mounting frames (501), a rotating ring (502), and four angle adjustment components, the four angle adjustment components are distributed in a ring shape at equal intervals on the outer side of the top of the rotating ring (502), and the outer side of the rotating ring (502) is transmission-connected to the four angle adjustment components via a linkage slider; the adjustable spoiler mechanism (5) is composed of two mounting frames (501), a rotating ring (502), and four angle adjustment components. The stirring mechanism (6) is rotatably mounted inside the mixer (4), and the top end of the adjustable stirring mechanism (6) is transmission-connected to the regulating mechanism (3); the adjustable flow disturbance mechanism (5) and the adjustable stirring mechanism (6) are synchronously driven by the regulating mechanism (3); the flow pattern and shear force field distribution of the fluid are dynamically adjusted by the adjustable stirring mechanism (6); the flow disturbance angle is adjusted by the adjustable flow disturbance mechanism (5) to change the flow path and speed of the plating solution; and a multi-dimensional circulating flow field can be formed by the coordination of the adjustable flow disturbance mechanism (5) and the adjustable stirring mechanism (6).

2. The nickel-plating device for the surface of diamond micropowder based on semiconductor wafer production according to claim 1, wherein: The adjustable stirring mechanism (6) is composed of a driven bevel gear (601), a transmission rod (602), an adjusting rod (603), an adjustable angle stirring paddle (604), and a shaft sleeve (605), wherein the driven bevel gear (601) is fixedly mounted on the top end of the transmission rod (602), the shaft sleeve (605) is fixedly mounted on the bottom end of the transmission rod (602), the adjusting rod (603) is movably mounted inside the transmission rod (602), a spline rod is fixedly mounted on the top of the outer side of the adjusting rod (603), a spline groove corresponding to the spline rod is formed inside the driven bevel gear (601), and the adjusting rod (603) is connected to the spline groove of the driven bevel gear (601) by a bayonet pin via the spline rod, so that the driven bevel gear (601) can be easily adjusted. 1) driving the adjusting rod (603) to rotate synchronously, while not affecting the telescopic movement of the adjusting rod (603) inside the transmission rod (602); a shaft frame is fixedly installed at the bottom end of the adjusting rod (603); the bottom end of the adjusting rod (603) is movably connected to the adjustable angle stirring paddle (604) through the shaft frame; the telescopically movable adjusting rod (603) adjusts the angle of the adjustable angle stirring paddle (604) through the shaft frame; wherein the adjustable angle stirring paddle (604) is composed of a universal shaft rod (6041), a mounting shaft seat (6042) and a paddle (6043); the top of the universal shaft rod (6041) is rotatably connected to the bottom of the mounting shaft seat (6042); and the paddle (6043) is fixedly installed on one side of the mounting shaft seat (6042).

3. The nickel plating device for the surface of diamond micropowder based on semiconductor wafer production according to claim 1, characterized in that: The two mounting frames (501) are both rotatably mounted with limit rollers (5011) inside, and the two mounting frames (501) are movably mounted on both sides of the rotating ring (502) via the limit rollers (5011), and the two mounting frames (501) are respectively fixedly mounted on both sides of the outer wall of the adjustable spoiler mechanism (5), and a second gear (506) is rotatably mounted on one side inside one of the mounting frames (501), and a second rack (5021) is fixedly mounted on the outer side of the rotating ring (502), and the second rack (5021) is meshingly connected with the second gear (506).

4. A nickel plating device for the surface of diamond micropowder based on semiconductor wafer production according to claim 1, characterized in that: The angle adjustment assembly is composed of a slide member (503), a rotating shaft rod (504) and a spoiler (505), wherein the slide member (503) is fixedly mounted on one end of the rotating shaft rod (504), and the spoiler (505) is fixedly mounted on the other end of the rotating shaft rod (504), and one end of the rotating shaft rod (504) extends into the interior of the mixer (4) and is movably connected to the inner wall of the mixer (4).

5. A nickel plating device for the surface of diamond micropowder based on semiconductor wafer production according to claim 3, characterized in that: The adjustment mechanism (3) is composed of a slide slot frame (301), a first gear (302), a telescopic frame (303), a servo motor (305), a first bevel gear (306) and a second bevel gear (307), wherein the slide slot frame (301) is provided with slide slots on both the front and rear sides, and slide bars corresponding to the slide slots are fixedly installed on both the front and rear sides of the telescopic frame (303), and the slide bars extend into the slide slots and are movably connected, and the telescopic frame (303) is movably installed inside the slide slot frame (301) through the slide bars and the slide slots, and the bottom of the telescopic frame (303) extends to the inside of the top cover (2), and the bottom of the telescopic frame (303) is connected to the top of the adjustment rod (603) through a rotating shaft, and the telescopic frame (303) is connected to the top of the adjustment rod (603) through a rotating shaft, and the telescopic frame (30 3) is fixedly mounted on an inner wall of one side thereof; a first gear (302) is rotatably mounted inside the slideway frame (301) via a shaft; the first gear (302) is meshingly connected to the first gear (304); a servo motor (305) is fixedly mounted on one side of the slideway frame (301); an output end of the servo motor (305) is fixedly connected to one side of the first gear (302) via a shaft; a first bevel gear (306) is fixedly connected to the other side of the first gear (302) via a shaft; the first bevel gear (306) is meshingly connected to the second bevel gear (307); and the bottom of the second bevel gear (307) is transmission-connected to the second gear (506) via a shaft.

6. The nickel plating device for the surface of diamond micropowder based on semiconductor wafer production according to claim 1, characterized in that: A driving motor (201) is fixedly mounted on one side of the interior of the top cover (2); a driving bevel gear (202) is fixedly mounted on the output end of the driving motor (201) via a shaft; the driving bevel gear (202) is meshingly connected with a driven bevel gear (601); the bottom of the top cover (2) extends into the interior of the reaction tank (1); and an annular spray mechanism (203) is fixedly mounted on the bottom of the top cover (2).

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