Chip radiator for Loongson 3A6000 processor

Abstract

The invention relates to the technical field of chip radiators, in particular to a chip radiator for a Loongson 3A6000 processor. The heat dissipation device comprises a heat conduction device and a heat dissipation device, the heat conduction device comprises a heat conductor and a fixing body, and the heat conductor comprises a heat conduction structure and a plurality of heat dissipation fins arranged on the heat conduction structure. According to the invention, when the rotating speed of the speed regulation fan is increased and the downward pressure applied to the wall surface of the guide cavity during air flowing is greater than the elastic force of the spring, the middle clamping plate is pressed downwards to drive the regulation and control plate to move downwards along the heat dissipation fins, and the distance from the heat conduction plate to the bottom end of the regulation and control plate is reduced, so that the air circulation sectional area of the air guide channel is reduced; therefore, the flow rate of air flowing out of the air guide channel is further increased, air flow in the case can be promoted, air circulation conditions in the case can be improved, virtuous circular flow of the air in the case can be formed, cooling of the processor is further facilitated, and the problem that the processor is damaged due to overheating or the performance of the processor is reduced is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip radiators, and more specifically, to a chip radiator for LoongArch 3A6000 processors. Background Art

[0002] LoongArch 3A6000 is a new generation of general-purpose processor independently developed and controllable in China. Its main function is to provide high-performance computing capabilities to meet the needs of various complex application scenarios. LoongArch 3A6000 is the first product of the fourth-generation microarchitecture of LoongArch. Its significant improvements in performance, security, and ecological compatibility mark that domestic CPU technology has reached the international advanced level.

[0003] With the iterative update of devices, the integration of high-performance processors such as LoongArch 3A6000 is getting higher and higher, and the heat generation also increases accordingly. Overheating is the main reason for the performance degradation and frequent failures of electronic devices. In order to effectively control the device temperature to ensure the stability of the device during high-load operation, for example, CN104282639A involves a radiator suitable for dissipating heat from a processor chip. The radiator includes a base and parallel and spaced fins vertically fixed to the base of the radiator. The heat dissipation method of this radiator is passive air-cooled heat dissipation, using cold air flow passing through the ventilation holes of the radiator to exchange heat with the fins. However, the heat dissipation effect of this passive heat dissipation method is limited by the natural air flow rate. The processor and the motherboard are generally fixedly arranged in a closed chassis. The space inside the chassis is limited, which limits the size of the radiator. And due to the unsmooth air flow inside and outside the chassis, the air flow rate inside the chassis is relatively low, resulting in relatively low heat dissipation efficiency, especially in high-temperature or high-load working environments. Summary of the Invention

[0004] The purpose of the present invention is to improve the heat dissipation efficiency of the radiator in a closed environment to avoid problems such as damage or performance degradation of the processor due to overheating.

[0005] The object of the present invention is to provide a chip radiator for LoongArch 3A6000 processors, which actively accelerates air flow, improves the heat conduction efficiency of the radiator, and guides the air flow to form a circulating air flow, thereby improving the heat dissipation efficiency.

[0006] To achieve the above object, the present invention provides a chip radiator for LoongArch 3A6000 processors, including a heat conduction device and a heat dissipation device arranged on the heat conduction device. The heat conduction device includes a heat conductor and a fixing body. The heat conductor includes a heat conduction structure and a plurality of heat dissipation fins arranged on the heat conduction structure;

[0007] The heat dissipation device includes a speed-regulating fan and a regulating body elastically connected to the bottom of the speed-regulating fan. The speed-regulating fan is fixedly arranged at the top of the heat conduction structure. The speed-regulating fan is electrically connected to the main board. The bottom of the regulating body is inserted and matched with the top of the heat dissipation fins. The space formed by enclosing above the heat conduction structure, below the regulating body and adjacent heat dissipation fins is an air guiding channel. The regulating body is used to guide the air flow blown out by the speed-regulating fan into the air guiding channel.

[0008] The main board correspondingly adjusts the rotation speed of the speed-regulating fan according to the temperature of the processor. When the rotation speed of the speed-regulating fan increases, the air flow rate through the regulating body increases, so that the air circulation speed in the air guiding channel increases, accelerating the heat dissipation rate of the heat dissipation fins. And the thrust applied by the air increases, driving the regulating body to move downward to reduce the air circulation cross-sectional area of the air guiding channel, further increasing the air flow rate, promoting the air flow in the chassis, forming a good circular flow of the air in the chassis, which is beneficial to cooling the processor to avoid problems such as damage or performance degradation of the processor due to overheating.

[0009] As a further improvement of this technical solution, the heat conduction structure includes a heat conduction base and conduction columns arranged on the top of the heat conduction base. The bottom of the heat conduction base is in contact with the surface of the processor. The top of the conduction column is fixedly connected with a heat conduction plate, and a plurality of the heat dissipation fins are arranged on the upper surface of the heat conduction plate.

[0010] After the heat of the processor is conducted out by the heat conduction base, the heat is conducted along the conduction columns and the heat conduction plate and then to the heat dissipation fins, and then dissipated outward by the heat dissipation fins.

[0011] As a further improvement of this technical solution, the fixing body includes a pair of fixing plates. The two fixing plates are fixedly connected by a first bolt. The two ends of the fixing plate are fixed to the main board by a second bolt. A fixing sleeve is arranged in the middle of the fixing plate;

[0012] The inner wall of the fixing sleeve is provided with a clamping block, and a clamping groove is correspondingly opened on the outer wall of the conduction column. The clamping block is stuck in the clamping groove.

[0013] A complete ring structure is formed by enclosing with the fixing sleeve to surround the conduction column and clamp the conduction column, realizing the fixation of the heat conduction body and avoiding the deflection of the heat conduction body, thus ensuring the normal use of the radiator.

[0014] As a further improvement of this technical solution, corner rods are arranged at the four corners of the top of the heat conduction plate. The speed-regulating fan includes a cover plate and a speed-regulating fan arranged in the middle of the cover plate. The four corners of the cover plate are connected to the top ends of the corner rods by screws. The speed-regulating fan is electrically connected to the main board;

[0015] The heat dissipation fins are in a spiral structure, and a plurality of the heat dissipation fins are symmetrically arranged about the axis of the speed regulation fan.

[0016] The speed regulation fan drives and accelerates air, so that the air enters the air guide channel through the regulation body. By increasing the air flow rate, the efficiency of the heat dissipation fins dissipating heat is improved. And since the heat dissipation fins are in a spiral structure, the air guide channel is a spiral channel. When the air flows in the spiral channel, due to the action of centrifugal force, the flow rate will increase, thereby realizing the further acceleration of the air, and further improving the efficiency of the heat dissipation fins dissipating heat outward.

[0017] As a further improvement of this technical solution, the regulation body includes a middle clamping plate and a regulation plate located at the bottom of the middle clamping plate. A plate opening is formed in the middle of the regulation plate, and the bottom of the middle clamping plate passes through the plate opening. The middle clamping plate is used to guide the air to pass downward through the heat dissipation fins. The bottom end of the regulation plate is in contact with the heat dissipation fins, and the top end of the regulation plate passes through the middle clamping plate and is elastically connected to the cover plate;

[0018] The middle clamping plate is provided with a guiding cavity penetrating the upper and lower surfaces of the middle clamping plate, and the guiding cavity is a cavity structure with a wider upper part and a narrower lower part;

[0019] The regulation plate is further provided with a receiving groove, the top end of the heat dissipation fin is located in the receiving groove, a positioning rod is provided at the top end of the regulation plate, the top end of the positioning rod passes through the middle clamping plate and the cover plate, and a threaded pin is threadedly connected to the top end of the positioning rod. A spring is sleeved on the surface of the threaded pin, and the threaded pin is connected to the upper surface of the cover plate through the provided spring;

[0020] The inner wall of the narrow end at the bottom of the guiding cavity is provided with a spiral edge, and the rotation direction of the spiral edge is the same as the rotation direction of the heat dissipation fins.

[0021] When the air flows, a downward force is exerted on the wall surface of the guiding cavity. When the rotation speed of the speed regulation fan increases, the downward pressure exerted on the wall surface of the guiding cavity by the air flow is greater than the elastic force of the spring, so that the spring is compressed, and the air flow cross-sectional area of the air guide channel is reduced, thereby further increasing the air flow rate of the air flowing out of the air guide channel, promoting the air flow in the chassis, and improving the air flow condition in the chassis.

[0022] In the present invention, the main board adjusts the rotation speed of the speed regulation fan according to the temperature of the processor. When the rotation speed of the speed regulation fan increases, the air flow rate passing through the regulation body increases, and the thrust exerted by the air on the regulation body increases, thereby driving the regulation body to move downward, reducing the air flow cross-sectional area of the air guide channel, further increasing the air flow rate of the air flowing out of the air guide channel, so that the flowing air can promote the air flow in the chassis, improve the air flow condition in the chassis, and thus avoid the problem that the processor is damaged due to overheating or the performance drops.

[0023] Beneficial effects of the present invention compared with the prior art:

[0024] 1. In the chip radiator for the LoongArch 3A6000 processor, when the rotational speed of the speed-regulating fan increases, the downward pressure exerted by the air flow on the wall surface of the guiding cavity is greater than the elastic force of the spring, causing the middle clamping plate to press down and drive the regulating plate to move downward along the heat dissipation fins. The distance from the heat conduction plate to the bottom end of the regulating plate decreases, so the cross-sectional area of the air flow passage in the air guiding channel decreases, resulting in a further increase in the air flow velocity flowing out of the air guiding channel. This can promote the air flow inside the chassis, improve the air circulation conditions inside the chassis, form a benign circulating flow of the air inside the chassis, and thus further facilitate the cooling of the processor to avoid problems such as damage or performance degradation of the processor due to overheating.

[0025] 2. In the chip radiator for the LoongArch 3A6000 processor, by setting the spiral edge, when the air flows downward along the guiding cavity, it can rotate along the spiral edge to form a spiral air flow, and the spiral direction of the spiral air flow is the same as the rotation direction of the heat dissipation fins, so that when the air flows out from the bottom end of the spiral edge, it can smoothly enter the air guiding channel, reducing the energy loss caused by air flow disorder. Furthermore, after the air flows out through the air guiding channel, it can accelerate the air flow inside the chassis, thereby improving the air circulation conditions inside the chassis and facilitating the further cooling of the processor. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is the overall structural schematic diagram of the present invention;

[0027] Figure 2 is the structural schematic diagram of the heat conduction device of the present invention;

[0028] Figure 3 is the partial sectional view of the disassembled structure of the heat conduction device of the present invention;

[0029] Figure 4 is the structural cooperation diagram of the heat conduction body and the heat dissipation device of the present invention;

[0030] Figure 5 is the structural cooperation diagram of the speed-regulating fan and the heat conduction body of the present invention;

[0031] Figure 6 is the structural cooperation diagram of the heat conduction body, the speed-regulating fan, and the regulating body of the present invention;

[0032] Figure 7 is the partial sectional view of the structural cooperation between the speed-regulating fan and the regulating body of the present invention;

[0033] Figure 8 is the side view air flow direction diagram of the radiator of the present invention;

[0034] Figure 9 is the top view air flow direction diagram of the heat conduction body of the present invention;

[0035] Figure 10 This is a schematic diagram of the regulator activity of the present invention.

[0036] The meanings of the various labels in the figure are as follows:

[0037] 1. Heat conduction device; 11. Heat conductor; 111. Heat conduction base; 112. Conduction column; 1121. Card slot; 113. Heat conduction plate; 1131. Corner rod; 114. Heat dissipation fin; 12. Fixing body; 121. Fixing plate; 122. Fixing sleeve; 1221. Block.

[0038] 2. Heat dissipation device; 21. Speed regulation fan; 211. Cover plate; 212. Speed regulation fan; 22. Regulator; 221. Middle clamping plate; 2211. Guide cavity; 2212. Spiral edge; 222. Regulation plate; 2221. Plate opening; 2222. Accommodation groove; 2223. Positioning rod; 2224. Threaded pin; 2225. Spring. Specific embodiments

[0039] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0040] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0041] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, the purpose of this embodiment is to provide a chip radiator for the LoongArch 3A6000 processor, including a heat conduction device 1 and a heat dissipation device 2 provided on the heat conduction device 1;

[0042] The heat conduction device 1 includes a heat conductor 11 and a fixing body 12 for fixing the heat conductor 11 on the main board. The heat conductor 11 includes a heat conduction structure and a plurality of heat dissipation fins 114 arranged on the heat conduction structure. The bottom end of the heat conduction structure is in contact with the processor to absorb the heat of the processor;

[0043] The heat dissipation device 2 includes a speed-regulating fan 21 and a regulating body 22 elastically connected to the bottom of the speed-regulating fan 21. The speed-regulating fan 21 is fixedly arranged at the top end of the heat conduction structure. The speed-regulating fan 21 is electrically connected to the main board. The bottom of the regulating body 22 is inserted and matched with the top of the heat dissipation fin 114. The space formed by enclosing above the heat conduction structure, below the regulating body 22 and adjacent heat dissipation fins 114 is an air guiding channel. The regulating body 22 is used to guide the air flow blown out by the speed-regulating fan 21 into the air guiding channel.

[0044] The heat of the processor is absorbed by the heat conduction structure, and then the heat conduction structure conducts the heat to the heat dissipation fins 114. The speed-regulating fan 21 blows air so that the air enters one end of the air guiding channel downward through the regulating body 22, and the air then takes away the heat of the heat dissipation fins 114 through the air guiding channel to prevent the processor from overheating. The main board will adjust the rotation speed of the speed-regulating fan 21 according to the processor temperature. When the temperature in the chassis is high or the processor is in a high-load state, etc., resulting in a relatively high temperature of the processor, the rotation speed of the speed-regulating fan 21 increases, and the air flow rate through the regulating body 22 increases, so that the air flow rate in the air guiding channel increases, which can accelerate the heat dissipation rate of the heat dissipation fins 114, thereby improving the heat dissipation effect; at the same time, since the air flow rate through the regulating body 22 increases, the thrust exerted by the air on the regulating body 22 increases, which in turn drives the regulating body 22 to move downward against the elastic force, reducing the cross-sectional area of the air flow in the air guiding channel, thereby further increasing the air flow rate flowing out of the air guiding channel, so that the outflowing air can promote the air flow in the chassis, improve the air flow conditions in the chassis, and form a good circulating flow of the air in the chassis, which is further beneficial to cooling the processor to avoid problems such as damage or performance degradation of the processor due to overheating.

[0045] The above structure is disclosed as follows:

[0046] When dissipating heat, it is first necessary to export the heat of the processor, such as Figure 3As shown, the heat-conducting structure includes a heat-conducting base 111 and a conduction column 112 arranged on the top of the heat-conducting base 111. The bottom of the heat-conducting base 111 contacts the surface of the processor. Here, in order to maximize the heat extraction of the processor, the size of the heat-conducting base 111 is set to be slightly larger than the size of the processor. For example, the size of the Loongson 3A6000 processor is 35mm*35mm, and the size of the heat-conducting base 111 is not less than 35mm*35mm, and the gap between the heat-conducting base 111 and the contact surface of the processor is filled with thermal grease, thereby ensuring sufficient contact between the surface of the processor and the heat-conducting base 111, which can maximize the heat extraction of the processor. A heat-conducting plate 113 is fixedly connected to the top of the conduction column 112, and the upper surface of the heat-conducting plate 113 is provided with Multiple heat dissipation fins 114, the fixed body 12 includes a pair of fixed plates 121, the two fixed plates 121 are fixedly connected by a first bolt, and the two ends of the fixed plates 121 are fixed to the mainboard by a second bolt. A fixing sleeve 122 is provided in the middle of the fixing plate 121. When the two fixing plates 121 are fixedly connected, the two fixing sleeves 122 are combined to form a complete annular structure, thereby surrounding the conductive column 112, clamping the conductive column 112, and achieving the fixation of the heat conductor 11, which can ensure that the heat-conducting base 111 always maintains contact with the surface of the processor. After the heat of the processor is discharged by the heat-conducting base 111, the heat is conducted along the conductive column 112 and the heat-conducting plate 113 to the heat dissipation fins 114, and then dissipated outward by the heat dissipation fins 114.

[0047] In order to improve the efficiency of heat dissipation of the heat dissipation fins 114, Figure 3 、 Figure 4 、 Figure 5 As shown, corner rods 1131 are provided at the four corners of the top of the heat conducting plate 113, and the speed regulating fan 21 includes a cover plate 211 and a speed regulating fan 212 provided in the middle of the cover plate 211. The four corners of the cover plate 211 are connected to the top of the corner rod 1131 by screws. The speed regulating fan 212 is electrically connected to the main board. The speed regulating fan 212 drives and accelerates the air so that the air enters the air guide channel through the regulating body 22, thereby improving the efficiency of heat dissipation of the heat dissipating fins 114 by increasing the air flow rate. In addition, the speed regulating fan 212 is a fan with adjustable speed. The main purpose is to In order to ensure efficient heat dissipation of the equipment while taking into account energy saving and low noise, the speed-regulating fan 212 is powered by the mainboard, and the processor temperature is detected in real time by a temperature sensor set on the mainboard. When the temperature changes, the speed of the speed-regulating fan 212 is intelligently adjusted by changing the duty cycle of the output signal or changing the power supply voltage of the speed-regulating fan 212. When the temperature rises, the speed of the speed-regulating fan 212 increases, and when the temperature drops, the speed of the speed-regulating fan 212 decreases to ensure that the temperature of the processor is within a safe range, such as 40-80°C.

[0048] In addition, the heat dissipation fins 114 are of a spiral structure, and the plurality of heat dissipation fins 114 are symmetrically arranged about the axis of the speed-regulating fan 212. When the airflow blown out by the speed-regulating fan 212 enters the air guide channel, since the heat dissipation fins 114 are of a spiral structure, the air guide channel is a spiral channel. When the air flows in the spiral channel, the flow velocity will increase due to the action of centrifugal force, thereby achieving further acceleration of the air, thereby further improving the efficiency of the heat dissipation of heat by the heat dissipation fins 114.

[0049] In order to introduce the air blown by the speed-adjustable fan 212 into the air guide channel, Figure 4 、 Figure 6 、 Figure 7 As shown, the structure of the regulator 22 is specifically disclosed below:

[0050] The regulating body 22 includes a middle clamping plate 221 and a regulating plate 222 located at the bottom of the middle clamping plate 221. A plate opening 2221 is opened in the middle of the regulating plate 222, which passes through the upper and lower surfaces. The bottom of the middle clamping plate 221 passes through the plate opening 2221. The middle clamping plate 221 is used to guide air downward through the heat dissipation fins 114. The bottom end of the regulating plate 222 contacts the heat dissipation fins 114. The top of the regulating plate 222 passes through the middle clamping plate 221 and is elastically connected to the cover plate 211. The space above the heat conduction plate 113, below the regulating plate 222 and surrounded by the adjacent heat dissipation fins 114 is the air guide channel. The air blown out by the speed-regulating fan 212 is guided by the middle clamping plate 221, flows downward and enters the inner end of the air guide channel, and then flows out to the outer end along the air guide channel.

[0051] Specifically, the middle splint 221 is provided with a guide cavity 2211 that passes through the upper and lower surfaces of the middle splint 221. The guide cavity 2211 is a cavity structure that is wide at the top and narrow at the bottom. The regulating plate 222 is also provided with a number of accommodating grooves 2222 that is the same as the number of the heat dissipating fins 114. The shape of the accommodating grooves 2222 matches the shape of the heat dissipating fins 114. The top of the heat dissipating fin 114 is located in the accommodating grooves 2222. A positioning rod 2223 is provided at the top of the regulating plate 222. The top of the positioning rod 2223 passes through the middle splint 221 and the cover plate 211. The top of the positioning rod 2223 is threadedly connected with a threaded pin 2224. A spring 2225 is sleeved on the surface of the threaded pin 2224. The threaded pin 2224 is connected to the upper surface of the cover plate 211 through the set spring 2225.

[0052] like Figure 8 、 Figure 10As shown, the speed-regulating fan 212 blows the outside air in and flows it downward into the guide chamber 2211. When the air moves downward along the guide chamber 2211, the air flow is accelerated due to the upper wide and lower narrow structure of the guide chamber 2211, and the air exerts a downward force on the wall of the guide chamber 2211 when it flows. After the air reaches the bottom end along the guide chamber 2211, it enters from the inner end of the air guide channel and flows out to the outer end along the air guide channel. At this time, the air flow cross-sectional area of the air guide channel is a. When the speed of the speed-regulating fan 212 increases, the air flow is accelerated, and the flow rate of the air when passing through the air guide channel is accelerated. 1 increases, so that the downward pressure exerted on the wall of the guide cavity 2211 during air flow is greater than the elastic force of the spring 2225, causing the spring 2225 to be compressed. The downward pressure of the middle clamping plate 221 drives the regulating plate 222 to move downward along the heat dissipation fins 114. At this time, the air flow cross-sectional area of the air guide channel is b. Since the distance from the heat conducting plate 113 to the bottom end of the regulating plate 222 is reduced, the air flow cross-sectional area of the air guide channel is reduced. The reduction in the air flow cross-sectional area will further increase the air flow rate out of the air guide channel, so that the air flowing out of the air guide channel can promote the air flow in the chassis and improve the air circulation conditions in the chassis.

[0053] Further, such as Figure 7 、 Figure 9 As shown, a spiral edge 2212 is provided on the inner wall of the narrow end of the bottom of the guide cavity 2211, and the rotation direction of the spiral edge 2212 is consistent with the rotation direction of the heat sink fins 114. By setting the spiral edge 2212, the air can rotate along the spiral edge 2212 to form a spiral airflow when flowing downward along the guide cavity 2211, and the spiral direction of the spiral airflow is consistent with the rotation direction of the heat sink fins 114, so that when the air flows out from the bottom end of the spiral edge 2212, it can enter the air guide channel, reducing the energy loss caused by air flow turbulence, and then after the air flows out through the air guide channel, it can accelerate the flow of air in the chassis, thereby improving the air circulation conditions in the chassis, which is conducive to further cooling the processor.

[0054] It is worth noting that in order to facilitate the combined installation of various components in the present invention, two fixed sleeves 122 are used to form a complete annular structure to wrap the conductive column 112 to ensure that the heat-conducting base 111 is pressed downward against the surface of the processor. The rotation of the speed-regulating fan 212 and the flow of air along the guide cavity 2211, the spiral edge 2212 and the air guide channel will generate a rotational torque. In order to avoid the deflection of the heat conductor 11, a block 1221 is provided on the inner wall of the fixed sleeve 122, and a slot 1121 is correspondingly provided on the outer wall of the conductive column 112. The block 1221 is stuck in the slot 1121. By clamping the conductive column 112 with the fixed sleeve 122, the deflection of the heat conductor 11 can be avoided, thereby ensuring the normal use of the radiator.

[0055] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and the above embodiments and the descriptions in the specification are only preferred examples of the present invention, and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed. The scope of the present invention claimed is defined by the appended claims and their equivalents.

Claims

1. A chip radiator for LoongArch 3A6000 processor, comprising a heat conduction device (1) and a heat dissipation device (2) arranged on the heat conduction device (1), and is characterized in that: The heat conduction device (1) includes a heat conductor (11) and a fixing body (12). The heat conductor (11) includes a heat conduction structure and a plurality of heat dissipation fins (114) arranged on the heat conduction structure; The heat dissipation device (2) includes a speed regulation fan (21) and a regulation body (22) elastically connected to the bottom of the speed regulation fan (21). The speed regulation fan (21) is fixedly arranged at the top of the heat conduction structure. The speed regulation fan (21) is electrically connected to the main board. The bottom of the regulation body (22) is inserted and matched with the top of the heat dissipation fin (114). A space formed by enclosing above the heat conduction structure, below the regulation body (22) and adjacent heat dissipation fins (114) is an air guiding channel. The regulation body (22) is used to guide the air flow blown out by the speed regulation fan (21) into the air guiding channel. When the rotation speed of the speed regulation fan (21) increases, the air flow velocity passing through the regulation body (22) increases, thereby increasing the thrust applied to the regulation body (22), driving the regulation body (22) to move downward, and reducing the air flow cross-sectional area of the air guiding channel to increase the air flow velocity.

2. The chip radiator for LoongArch 3A6000 processor according to claim 1, wherein: The heat conduction structure includes a heat conduction base (111) and a conduction column (112) arranged on the top of the heat conduction base (111). The bottom of the heat conduction base (111) is in contact with the surface of the processor. The top of the conduction column (112) is fixedly connected with a heat conduction plate (113). A plurality of the heat dissipation fins (114) are arranged on the upper surface of the heat conduction plate (113).

3. The chip radiator for LoongArch 3A6000 processor according to claim 2, wherein: Corner rods (1131) are arranged at the four corners of the top of the heat conduction plate (113). The speed regulation fan (21) includes a cover plate (211) and a speed regulation fan (212) arranged in the middle of the cover plate (211). The four corners of the cover plate (211) are connected to the top ends of the corner rods (1131) by screws. The speed regulation fan (212) is electrically connected to the main board.

4. The chip radiator for LoongArch 3A6000 processor according to claim 3, wherein: The heat dissipation fins (114) are in a spiral structure, and a plurality of the heat dissipation fins (114) are symmetrically arranged about the axis of the speed regulation fan (212).

5. The chip radiator for LoongArch 3A6000 processor according to claim 3, wherein: The regulation body (22) includes a middle clamping plate (221) and a regulation plate (222) located at the bottom of the middle clamping plate (221). A plate opening (2221) is formed in the middle of the regulation plate (222). The bottom of the middle clamping plate (221) passes through the plate opening (2221). The middle clamping plate (221) is used to guide air to pass downward through the heat dissipation fins (114). The bottom end of the regulation plate (222) is in contact with the heat dissipation fins (114). The top end of the regulation plate (222) passes through the middle clamping plate (221) and is elastically connected to the cover plate (211).

6. The chip radiator for LoongArch 3A6000 processor according to claim 5, wherein: The middle clamping plate (221) is provided with a guiding cavity (2211) penetrating the upper and lower surfaces of the middle clamping plate (221). The guiding cavity (2211) is a cavity structure with a wider upper part and a narrower lower part.

7. The chip radiator for LoongArch 3A6000 processor according to claim 5, wherein: The control board (222) is further provided with a receiving groove (2222), the top end of the heat dissipation fin (114) is located in the receiving groove (2222), a positioning rod (2223) is provided at the top end of the control board (222), the top end of the positioning rod (2223) passes through the middle clamping plate (221) and the cover plate (211), a threaded pin (2224) is threadedly connected to the top end of the positioning rod (2223), a spring (2225) is sleeved on the surface of the threaded pin (2224), and the threaded pin (2224) is connected to the upper surface of the cover plate (211) through the provided spring (2225).

8. The chip radiator for LoongArch 3A6000 processor according to claim 6, wherein: The inner wall of the narrow end at the bottom of the guiding cavity (2211) is provided with a spiral edge (2212), and the rotation direction of the spiral edge (2212) is the same as that of the heat dissipation fin (114).

9. The chip radiator for LoongArch 3A6000 processor according to claim 2, wherein: The fixing body (12) includes a pair of fixing plates (121) arranged in pairs, the two fixing plates (121) are fixedly connected by a first bolt, the two ends of the fixing plate (121) are fixed to the main board by a second bolt, and a fixing sleeve (122) is arranged in the middle of the fixing plate (121).

10. The chip radiator for LoongArch 3A6000 processor according to claim 9, wherein: A clamping block (1221) is arranged on the inner wall of the fixing sleeve (122), a clamping groove (1121) is correspondingly formed on the outer wall of the conduction column (112), and the clamping block (1221) is clamped in the clamping groove (1121).

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