Solid state disk self-assembled with internal circulation system and heat dissipation method of solid state disk self-assembled with internal circulation system

Abstract

The invention relates to the technical field of heat dissipation of solid state disks, and discloses a solid state disk self-assembled with an internal circulation system and a heat dissipation method of the solid state disk. According to the solid state disk, a detection module analyzes collected sensor data to obtain temperature distribution information; the activation module activates heat pipe working fluid to establish a transmission path; the conduction module guides heat to the condensation section through the heat pipe; the absorption module buffers peak heat by using a phase-change material; the release module dissipates heat to the environment through the heat dissipation fins. Efficient conduction, storage and release of heat in the solid state disk are achieved, the heat dissipation system can adjust the heat dissipation strategy in a self-adaptive mode according to the working load, temperature fluctuation is effectively coped with, and long-term stable operation of equipment is guaranteed.

Description

Technical Field

[0001] This application relates to the technical field of solid - state drive (SSD) heat dissipation, and particularly to a solid - state drive with a self - assembled internal circulation system and its heat dissipation method. Background Art

[0002] With the rapid development of computer technology, solid - state drives (SSDs) have gradually become the mainstream storage devices due to their high - speed data transfer capabilities and reliability. Compared with traditional mechanical hard drives, SSDs do not contain mechanical structures and use flash memory chips to store data, having advantages such as fast read - write speeds, strong shock resistance, and low noise. However, with the increase in data throughput and chip integration, SSDs generate a large amount of heat during high - load operations. Especially when the main control chip, flash memory chip array, and cache module are running at high speeds simultaneously, heat is concentrated and difficult to dissipate, resulting in a rapid temperature rise. Existing SSD heat dissipation technologies mainly include passive heat dissipation methods such as metal - shell heat conduction, heat sink attachment, and external radiators, as well as active heat dissipation methods supplemented by forced air cooling in server environments. These methods can basically meet the heat dissipation requirements in ordinary usage environments and ensure that the device operates within the normal temperature range.

[0003] However, the existing technologies have deficiencies in many aspects. First, traditional heat dissipation structures are difficult to cope with sudden high - load operating states, with obvious temperature fluctuations, affecting the device lifespan and performance stability. Second, conventional heat dissipation systems lack intelligent monitoring and control functions and cannot adaptively adjust heat dissipation strategies according to different operating states, resulting in low heat dissipation efficiency or energy waste. Third, most heat dissipation solutions rely on external heat dissipation structures or environmental conditions, and their effects decrease significantly in usage environments with limited space or poor air circulation. Fourth, existing heat pipe heat dissipation technologies are mostly simple applications, failing to fully utilize the high - efficiency heat transfer characteristics of heat pipes and having insufficiently close integration with advanced heat dissipation technologies such as phase - change materials. In addition, the integration degree of the heat dissipation system and the storage system is not high, increasing the product design complexity and manufacturing cost, which is not conducive to market promotion and application. Summary of the Invention

[0004] This application provides a solid - state drive with a self - assembled internal circulation system and its heat dissipation method, which is used to achieve efficient conduction, storage, and release of internal heat of the solid - state drive by constructing an internal self - assembled circulation system, integrating a heat pipe array, phase - change materials, and a micro - electronic temperature control network, enabling the heat dissipation system to adaptively adjust the heat dissipation strategy according to the workload, effectively coping with temperature fluctuations, and ensuring the long - term stable operation of the device.

[0005] In the first aspect, this application provides a solid - state drive with a self - assembled internal circulation system, including:

[0006] A detection module, configured to detect digital temperature sensor data of a temperature monitoring network system, and obtain temperature distribution information of a heat pipe array structure and a phase change material heat dissipation module;

[0007] An activation module, configured to activate a working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat to obtain a heat transfer path;

[0008] A conduction module, configured to conduct heat in the area around a layered structure heat dissipation substrate to a condensation section through the heat pipe array structure;

[0009] An absorption module, configured to utilize the phase change material heat dissipation module to absorb peak heat during temperature fluctuations to obtain a heat buffering effect;

[0010] A release module, configured to release heat to the external environment via a heat dissipation fin assembly of a peripheral passive heat dissipation structure.

[0011] In a second aspect, the present application provides a heat dissipation method for a solid-state drive self-assembled with an internal flow system, including: detecting digital temperature sensor data of a temperature monitoring network system, and obtaining temperature distribution information of a heat pipe array structure and a phase change material heat dissipation module; activating a working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat to obtain a heat transfer path; conducting heat in the area around a layered structure heat dissipation substrate to a condensation section through the heat pipe array structure; utilizing the phase change material heat dissipation module to absorb peak heat during temperature fluctuations to obtain a heat buffering effect; releasing heat to the external environment via a heat dissipation fin assembly of a peripheral passive heat dissipation structure.

[0012] In the technical solution provided by this application, the solid-state drive with an internal circulation system can obtain the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module in real time by detecting the data of the digital temperature sensors in the temperature monitoring network system, ensuring the accurate perception and rapid response of the system to temperature changes, providing an accurate data basis for the heat dissipation strategy. At the same time, according to the temperature distribution information, the working fluid inside the heat pipe array structure is activated, enabling the working fluid to absorb heat, establishing an efficient heat transfer path, realizing the rapid transfer of heat energy from the high-temperature area to the low-temperature area, greatly improving the heat conduction efficiency, reducing the local hot spot temperature. And through the heat pipe array structure, the heat in the area around the layered structure heat dissipation substrate is conducted to the condensation section, realizing the process of heat transfer to the outside, forming a heat conduction channel, enabling the heat to flow orderly and be timely diverted, avoiding the accumulation of heat around sensitive components, effectively preventing the performance degradation and shortened service life caused by local overheating. In addition, the phase change material heat dissipation module is used to absorb the peak heat during temperature fluctuations, obtaining a heat buffering effect, significantly reducing the impact of temperature fluctuations on the system, smoothing the temperature curve, extending the service life of the device, improving the system stability, especially performing outstandingly under high-load sudden working conditions. The heat is released to the external environment through the heat dissipation fin assembly of the peripheral passive heat dissipation structure, realizing the process of temperature reduction, increasing the heat dissipation area, improving the heat exchange efficiency with the environment, ensuring that the heat can be continuously discharged from the system interior, maintaining the overall temperature balance, reducing the overall working temperature of the solid-state drive. Finally, the central processing unit of the temperature monitoring network system adjusts the heat dissipation process parameters according to the continuous monitoring results, realizing the dynamic control of the internal temperature of the solid-state drive, making the heat dissipation system have intelligent and adaptive characteristics, capable of automatically adjusting the heat dissipation strategy according to different working states, reducing energy consumption while ensuring the heat dissipation effect, and improving the overall efficiency of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the drawings.

[0014] Figure 1 It is a schematic diagram of an embodiment of a solid-state drive with an internal circulation system self-assembled in an embodiment of this application;

[0015] Figure 2 It is a schematic diagram of an embodiment of the heat dissipation method of a solid-state drive with an internal circulation system self-assembled in an embodiment of this application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The embodiments of the present application provide a solid-state drive with a self-assembled internal circulation system and a heat dissipation method thereof. The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims and the above-mentioned drawings of the present application are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments described herein can be implemented in an order different from that illustrated or described herein. In addition, the term "comprising" or "having" and any variation thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily limit to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to the process, method, product or device.

[0017] For ease of understanding, the specific process of the embodiments of the present application will be described below. Please refer to Figure 1 , an embodiment of the solid-state drive with a self-assembled internal circulation system in the embodiments of the present application includes:

[0018] A detection module, configured to detect the digital temperature sensor data of the temperature monitoring network system and obtain the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module;

[0019] An activation module, configured to activate the working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat and obtains a heat transfer path;

[0020] A conduction module, configured to conduct the heat in the area around the layered structure heat dissipation substrate to the condensation section through the heat pipe array structure;

[0021] An absorption module, configured to utilize the phase change material heat dissipation module to absorb the peak heat during temperature fluctuations to obtain a heat buffering effect;

[0022] A release module, configured to release the heat to the external environment via the heat dissipation fin assembly of the peripheral passive heat dissipation structure.

[0023] It can be understood that the execution subject of the present application can be the heat dissipation system of the solid-state drive with a self-assembled internal circulation system, or a terminal or a server. Specifically, it is not limited here. The embodiments of the present application will be described by taking the server as the execution subject as an example.

[0024] Specifically, the detection module collects temperature data through a digital temperature sensor network arranged at key positions of the solid-state drive. The sensors are manufactured using MEMS technology, with small size and high temperature measurement accuracy. They are distributed at positions such as the main control chip, flash memory chip array, DRAM cache module, phase change material module, and heat pipe condensation section, forming fifteen temperature measurement points. The temperature data collected by the sensors is transmitted to the central processing unit through a two-wire digital bus, and after processing, the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module is generated. The activation module judges the temperature states of the eight micro pulsating heat pipes in the heat pipe array according to the temperature distribution information provided by the detection module, and generates a heat pipe activation signal when the temperature reaches the preset threshold. This signal drives the modified alcohol-based compound working fluid inside the micro pulsating heat pipe into the pre-activated state. The pre-activated working fluid is guided to the contact area between the heat pipe evaporation section and the chip, absorbs the heat generated by the heat-generating components on the circuit board, and forms a heat-carrying working fluid. The heat-carrying working fluid is driven by capillary force inside the microchannel core structure and flows along the sintered copper powder microchannel to form a directional fluid, moving towards the condensation zones at both ends of the heat pipe.

[0025] The conduction module is responsible for conducting heat from the surrounding area of the layered structure heat dissipation substrate to the condensation section through the heat pipe array structure. The three-layer materials (high thermal conductivity copper plate, three-dimensional graphene aerogel layer, and nano-ceramic coating) in the layered structure heat dissipation substrate form a heat conduction network, contact the heat-generating components on the circuit board to absorb heat. The absorbed heat is laterally transmitted to the heat pipe array mounting slot through the high thermal conductivity copper plate, and then transmitted to the evaporation section of the heat pipe array. The heat pipe evaporation section transfers the heat to the internal working fluid to form a heat-carrying working fluid. The heat-carrying working fluid is driven by the pressure difference to flow towards both ends inside the heat pipe. At the same time, the lateral copper sheets connecting between the heat pipes form a heat network structure to promote uniform heat distribution. The heat flow is guided to the condensation sections at both ends of the heat pipe, and the heat is transferred to the peripheral heat dissipation structure through the heat conduction copper tube wall and the heat conduction silicone grease layer.

[0026] The absorption module uses the phase change material heat dissipation module to handle the peak heat generated by temperature fluctuations. When the temperature of the solid-state drive exceeds the phase change temperature threshold of the phase change material, a phase change start signal is triggered. This signal causes the porous copper mesh heat conduction structure inside the module to contact the phase change material, forming a heat conduction channel. After the heat is introduced, the temperature of the phase change material reaches the phase change point, and the heat is converted into phase change energy using the latent heat of phase change to achieve the transformation from solid to liquid. The heat released during the phase change process is dispersed and processed through the serpentine microchannel structure inside the module, increasing the heat exchange area to form a state of uniform heat distribution. The carbon nanotube enhancer in the phase change material improves the heat conduction rate, forming an enhanced heat conduction field. Subsequently, the heat is transferred from the phase change material to the aluminum alloy shell and gradually released through the black microhole structure on the shell surface to achieve heat buffering.

[0027] The release module transfers heat to the external environment through the heat dissipation fin assembly of the peripheral passive heat dissipation structure. The heat of the condensing section of the heat pipe is transferred to the copper base of the heat dissipation fin assembly, forming a heat conduction channel through the thermal conductive silicone grease layer. After the heat enters the heat dissipation fin assembly, the heat dissipation area is enlarged by the high thermal conductivity aluminum alloy heat dissipation fins arranged in parallel. The micro-groove structure on the surface of the heat dissipation fins increases the contact area with the air, strengthening the convective heat transfer conditions. The black anodizing treatment of the heat dissipation fins improves the emissivity, forming a combined heat dissipation mechanism of convection and radiation. At the same time, the graphite heat dissipation fins installed on the upper and lower surfaces of the solid-state drive export the heat on the inner surface of the cover plate, forming an auxiliary heat dissipation channel. Finally, the auxiliary heat dissipation channel and the micro heat dissipation holes on the side of the housing form a ventilation network, constructing natural convection driven by the temperature difference inside and outside to complete the release of heat to the external environment.

[0028] For example, when the solid-state drive performs continuous large-file writing operations, the temperature of the main control chip rises rapidly to 65°C. The detection module captures this temperature change in the first instance. The activation module determines that the temperature has exceeded the preset threshold of the working fluid (42°C) and immediately triggers the state change of the working fluid in the heat pipe. The heat carries the working fluid to flow towards the condensing section, and the temperature of the condensing section rises to 50°C accordingly. At the same time, the phase change material module detects that the temperature exceeds the phase change point (55°C) and starts the phase change process, absorbing approximately 35 joules of heat. The peripheral heat dissipation fin assembly diffuses the heat of the condensing section to the air through 35 heat dissipation fins, and the internal temperature gradually stabilizes at 45°C. During the whole process, the central processing unit continuously monitors the temperature changes at various points and dynamically adjusts the heat dissipation parameters to ensure that the hard disk can still maintain an appropriate working temperature under high-load conditions.

[0029] In the embodiment of the present application, the solid-state drive with an internal circulation system can obtain the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module in real time by detecting the digital temperature sensor data of the temperature monitoring network system, ensuring the accurate perception and rapid response of the system to temperature changes, providing an accurate data basis for the heat dissipation strategy. At the same time, according to the temperature distribution information, the working fluid inside the heat pipe array structure is activated, enabling the working fluid to absorb heat, establishing an efficient heat transfer path, realizing the rapid transfer of heat energy from the high-temperature area to the low-temperature area, greatly improving the heat conduction efficiency, and reducing the local hot spot temperature. The heat in the area around the layered structure heat dissipation substrate is conducted to the condensation section through the heat pipe array structure, realizing the process of heat transfer to the outside, forming a heat conduction channel, enabling the heat to flow orderly and be timely diverted, avoiding the accumulation of heat around sensitive components, effectively preventing performance degradation and shortened lifespan caused by local overheating. In addition, the phase change material heat dissipation module is used to absorb the peak heat during temperature fluctuations, obtaining a heat buffering effect, significantly reducing the impact of temperature fluctuations on the system, smoothing the temperature curve, extending the equipment lifespan, and improving system stability, especially performing outstandingly under high-load sudden working conditions. The heat is released to the external environment through the heat dissipation fin assembly of the peripheral passive heat dissipation structure, realizing the process of temperature reduction, increasing the heat dissipation area, improving the heat exchange efficiency with the environment, ensuring that the heat can be continuously discharged from the system interior, maintaining the overall temperature balance, and reducing the overall working temperature of the solid-state drive. Finally, the central processing unit of the temperature monitoring network system adjusts the heat dissipation process parameters according to the continuous monitoring results, realizing the dynamic control of the internal temperature of the solid-state drive, making the heat dissipation system intelligent and adaptive, capable of automatically adjusting the heat dissipation strategy according to different working states, reducing energy consumption while ensuring the heat dissipation effect, and improving the overall efficiency of the system.

[0030] In a specific embodiment, the detection module is used for:

[0031] Transmitting the data collected by the digital temperature sensors at each installation point of the main control chip, the flash chip array, the DRAM cache module, the phase change material module, and the heat pipe condensation section to the central processing unit to obtain the temperature values of fifteen temperature measurement points;

[0032] Processing the temperature values of the fifteen temperature measurement points obtained, collecting all temperature data once per second to obtain real-time temperature monitoring data;

[0033] Analyzing the temperature values of each section of the eight micro pulsating heat pipes in the heat pipe array structure according to the real-time temperature monitoring data to obtain the heat pipe working state data;

[0034] Based on the heat pipe working state data, determining the temperature load distribution in the area corresponding to the heating elements in the heat pipe array structure to obtain the temperature distribution map of the heat pipe array;

[0035] Process the temperature sensor data of the phase change material heat dissipation module, analyze the difference between the current temperature of the phase change material and the phase change point, and obtain the heat absorption state of the phase change material module;

[0036] Integrate and process the temperature distribution map of the heat pipe array and the heat absorption state of the phase change material module, generate the temperature distribution information of the heat dissipation system through the central processing unit, and obtain the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module.

[0037] Specifically, precision digital temperature sensors are installed at key positions of the solid-state drive. The sensors are manufactured using MEMS (Micro-Electro-Mechanical System) technology, with a size of only 1.5 mm × 1.5 mm × 0.4 mm, a temperature measurement range of -20°C to 120°C, an accuracy of ±0.1°C, and a response time of no more than 100 milliseconds. The sensors are arranged with 3 monitoring points on the main control chip, 4 monitoring points on the flash memory chip array, 2 monitoring points on the DRAM cache module, 3 monitoring points on the phase change material module, and 3 monitoring points on the condensation section of the heat pipe, for a total of 15 temperature measurement points, forming a complete temperature monitoring network. During data transmission, all sensors are connected to the central processing unit through a two-wire digital bus. The bus is designed with anti-interference, and the signal line is covered with a copper shielding layer to reduce electromagnetic interference. The central processing unit uses an ultra-low-power microcontroller with a working frequency of 32 megahertz, built-in 512 kilobytes of flash memory and 64 kilobytes of RAM, integrated 12-bit analog-to-digital converter and temperature compensation circuit. The original data collected by the sensors is transmitted to the central processing unit through the bus. The central processing unit receives the digital signal and converts it into the actual temperature value, forming an array of temperature values at fifteen temperature measurement points.

[0038] For the processing of the temperature values at fifteen temperature measurement points, the central processing unit collects all the temperature data once per second according to the preset sampling frequency. The collected temperature data is filtered for outliers to eliminate abnormal readings caused by instantaneous fluctuations of the sensors, and then compared with the data of the previous second to calculate the temperature change rate. The processed data is stored in the RAM of the central processing unit, forming a time-series temperature data stream, which constitutes a real-time temperature monitoring data set. The process of analyzing the temperature values of each section of the eight micro pulsating heat pipes in the heat pipe array structure according to the real-time temperature monitoring data includes data grouping and mapping. The central processing unit extracts the data of the temperature measurement points related to the heat pipes among the 15 temperature measurement points and groups them according to the heat pipe number and position (evaporation section, adiabatic section, condensation section). For the heat pipe sections without directly arranged sensors, the temperature values are calculated by the interpolation algorithm of adjacent temperature measurement points. The temperature profile of each heat pipe is constructed by three key points: the evaporation section temperature, the adiabatic section temperature, and the condensation section temperature, forming the temperature gradient distribution of the heat pipe. The central processing unit judges the temperature difference, heat flow direction of each heat pipe, and whether it reaches the working fluid startup temperature, and generates a data set of the working state of the heat pipe.

[0039] Determining the temperature load distribution in the area corresponding to the heating elements in the heat pipe array structure based on the heat pipe operating state data is achieved through hot spot identification and corresponding analysis. The central processing unit compares the heat pipe operating state data with the layout diagram of the heating elements on the circuit board to identify the temperatures of the heat pipe segments corresponding to heating elements such as the main control chip, flash memory chip array, and DRAM cache module. By analyzing the temperature gradient of the heat pipes above each heating element, the heat load of each area is calculated, and a hot spot distribution map of the heating elements is established. Then, the central processing unit converts the data into a two-dimensional heat distribution matrix and generates a temperature distribution map of the heat pipe array through the built-in heat distribution algorithm, intuitively displaying the hot spot areas and heat flow directions inside the solid-state drive. For the processing of the temperature sensor data of the phase change material heat dissipation module, the central processing unit extracts the data of three temperature measurement points of the phase change material module and calculates the average temperature value of the module. Then, this average temperature value is compared with the preset phase change point temperature (55 °C) of the phase change material to calculate the temperature difference. Based on the temperature difference, the central processing unit evaluates the current state of the phase change material (fully solid state, starting phase change, fully liquid state, etc.) and judges its remaining heat absorption capacity. At the same time, by monitoring the temperature change rate, the saturation time of the phase change material is predicted, and a heat absorption state report of the phase change material module is formed. The central processing unit integrates the temperature distribution map of the heat pipe array with the heat absorption state of the phase change material module to construct the complete temperature distribution information of the heat dissipation system. During the integration process, the central processing unit establishes a heat interaction model between the heat pipe array and the phase change material module, analyzes the heat exchange situation between the two subsystems, including whether the heat pipes transfer heat to the phase change material or whether the phase change material has become a new heat source. Through the data fusion algorithm, the temperature distribution information is generated.

[0040] In a specific embodiment, an activation module is used for:

[0041] Compare the temperature data of the heat pipe array structure in the temperature distribution information with a preset threshold to determine whether the temperatures of the eight micro pulsating heat pipes in the heat pipe array exceed the boiling point of the working fluid, and obtain a heat pipe activation signal;

[0042] Apply a microcurrent preheating treatment to the modified alcohol compound working fluid inside the micro pulsating heat pipe according to the heat pipe activation signal to make the temperature of the working fluid reach a state close to the boiling point, and obtain a pre-activated working fluid;

[0043] Guide the pre-activated working fluid to the contact area between the evaporation section of the heat pipe and the chip, and absorb the heat generated by the heating elements on the circuit board through the gold-plated middle part of the heat pipe to obtain a heat-carrying working fluid;

[0044] Perform capillary force drive on the heat-carrying working fluid in the microchannel core structure to make the working fluid flow through the sintered copper powder microchannel with a pore diameter of 50 microns and a porosity of 75% to obtain a directional fluid;

[0045] Direct the directional fluid flow to the condensation zones at both ends of the heat pipe, increase the heat exchange area through the fish-scale microstructures, enable the working fluid to release heat and change its state to obtain the condensed liquid;

[0046] Apply the combined action of gravity and capillary force to the condensed liquid to make it flow back along the inner wall of the heat pipe to the evaporation section, form an internal circulation loop, and obtain a heat transfer path.

[0047] Specifically, the activation module receives the temperature distribution information from the detection module and extracts the temperature data of the heat pipe array structure therein. The temperature data includes the temperature values of the evaporation section, adiabatic section, and condensation section of eight micro pulsating heat pipes. The activation module compares the temperature data with a pre-set threshold value, which is mainly the pre-set temperature threshold value of 42 °C for the working fluid. The comparison process uses a judgment algorithm to judge the temperature value of each heat pipe one by one. When the evaporation section temperature of any heat pipe exceeds 42 °C, or the average temperature of multiple heat pipes exceeds the threshold value, the activation module will generate a heat pipe activation signal. The heat pipe activation signal is represented in digital form and includes the heat pipe number to be activated and the activation intensity level, and the intensity level is determined according to the temperature difference exceeding the threshold value. According to the generated heat pipe activation signal, the activation module controls the micro-current heating circuit to preheat the modified alcohol-based compound working fluid inside the specified heat pipe. The micro-current heating circuit is arranged near the evaporation section of the heat pipe and heats the working fluid through accurately controlled current. The magnitude of the heating current is dynamically adjusted according to the intensity level in the heat pipe activation signal, generally controlled within the range of 5 - 20 milliamperes to avoid overheating of the working fluid. During the preheating process, the temperature of the working fluid is controlled to be close to but slightly lower than the pre-set threshold value, usually 40 - 41 °C, so that when external heat is introduced, the working fluid can quickly reach the active state. The working fluid after preheating is called the pre-activated working fluid and is in the critical state of efficient heat absorption.

[0048] The pre-activated working fluid will naturally be guided to the contact area between the evaporation section of the heat pipe and the chip. This process mainly relies on the capillary force provided by the capillary structure and the microchannel wick structure inside the heat pipe. The evaporation section of the heat pipe is located in the middle of the heat pipe, and its surface is gold-plated with a thickness of 3 microns. This treatment significantly improves the contact thermal resistance between the heat pipe and the heat-generating components of the circuit board, enhancing the heat conduction efficiency. When the pre-activated working fluid reaches the evaporation section, it will quickly absorb the heat generated by the heat-generating components of the circuit board, causing the temperature to rise, and the working fluid begins to efficiently absorb heat. The heat absorption process is accompanied by a change in the state of the working fluid. Due to the latent heat of phase change, the heat required for the state change is much greater than the heat required to simply raise the temperature of the liquid. After the working fluid absorbs heat, it forms a heat-carrying working fluid, which can effectively absorb heat from the heat source and convert it into flowing thermal energy. After the heat-carrying working fluid is formed, a capillary force driving effect is generated within the microchannel wick structure. The microchannel wick structure is made of sintered copper powder with a pore diameter of 50 microns and a porosity of 75%. This structure not only provides good thermal conductivity but also forms a complex capillary channel network. When the working fluid absorbs heat, the heat-carrying working fluid will naturally move towards both ends of the heat pipe due to the pressure difference, but the movement path is guided by the microchannel structure. Capillary force driving utilizes the force generated by the surface tension of the liquid in small pores, and the calculation formula is F = 2πrσcosθ, where r is the pore diameter, σ is the surface tension of the liquid, and θ is the contact angle. Through this mechanism, the heat-carrying working fluid is guided through the microchannel to form an orderly flow, called the directional fluid. The flow velocity and direction of the directional fluid are jointly determined by the temperature gradient and the magnitude of the capillary force, ensuring that heat can be effectively transferred from the evaporation section to the condensation section.

[0049] The directional fluid is guided to the condensation areas at both ends of the heat pipe. The condensation areas are located at both ends of the heat pipe, each extending 10 mm beyond the substrate, forming an area in contact with the external heat dissipation structure. The surface of the condensation area is processed with fish-scale microstructures, with a microstructure depth of 20 microns and a width of 30 microns. This special structure significantly increases the heat dissipation area and improves the heat exchange efficiency. When the heat-carrying working fluid reaches the condensation area, due to the lower temperature, the working fluid begins to release heat and change its state. The heat release process is transferred to the external heat dissipation structure through the heat pipe wall, realizing the external discharge of heat. The working fluid after releasing heat becomes the condensed liquid and accumulates on the inner wall of the condensation section of the heat pipe.

[0050] Under the combined action of gravity and capillary force, the condensed liquid flows back along the inner wall of the heat pipe to the evaporation section. The gravity action mainly occurs when the heat pipe is in a horizontal or inclined state, while the capillary force is the continuous driving force provided by the micro-porous wick structure. The magnitude of the capillary force is inversely proportional to the pore diameter of the micro-pores. Therefore, a small pore diameter of 50 microns can generate a large enough capillary force to ensure the effective reflux of the liquid. The liquid reflux establishes a liquid circulation path from the condensation section to the evaporation section, which, together with the previous fluid flow, forms a complete internal circulation loop. The circulation loop constitutes a continuously operating heat transfer path that can continuously absorb heat from the heat source and transfer it to the heat dissipation area, realizing the efficient diversion of the internal heat of the solid-state drive.

[0051] In a specific embodiment, the conduction module is used for:

[0052] Correspondingly contact the heat conduction network formed by the three-layer structure of the high thermal conductivity copper plate, three-dimensional graphene aerogel layer and nano-ceramic coating in the layered structure heat dissipation substrate with the heat-generating components on the circuit board, and absorb heat through the high thermal conductivity efficiency of the contact surface to obtain the heat load distribution of the heat dissipation substrate;

[0053] Conduct hierarchical conduction on the heat load distribution of the heat dissipation substrate, and laterally transfer the heat to the heat pipe array installation groove through the high thermal conductivity copper plate to obtain the heat source input at the heat pipe slot opening;

[0054] Transfer the heat source input at the heat pipe slot opening to the evaporation section of the heat pipe array, and transfer the heat to the internal working fluid through the 30-mm-long heat pipe evaporation section to obtain the heat-carrying working fluid;

[0055] Drive the heat-carrying working fluid inside the heat pipe under a pressure difference, and distribute the heat through the heat network structure formed by connecting two transverse copper sheets in the heat pipe to obtain a uniformly distributed heat flow;

[0056] Guide the uniformly distributed heat flow to the condensation section formed by extending 10 mm at each end of the heat pipe, and transfer the heat through the heat-conducting copper tube wall of the condensation section to obtain the temperature field on the outer surface of the condensation section;

[0057] Based on the temperature field on the outer surface of the condensation section, conduct heat conduction on the contact surface between the condensation section of the heat pipe and the copper base, and transfer the heat to the peripheral heat dissipation structure through the 0.05-mm-thick contact layer formed by thermal grease to obtain the conduction path for heat to be transported outwards.

[0058] Specifically, the conduction module uses a layered structure heat dissipation substrate to contact with the heat-generating components of the circuit board, forming a heat conduction channel. The layered structure heat dissipation substrate is composed of three layers of materials: the bottom layer is a high thermal conductivity copper plate with a thickness of 2 mm, and its surface is treated by electroplating nickel to form a smooth contact surface; the middle layer is a three-dimensional graphene aerogel layer with a thickness of 4 mm, and its thermal conductivity is as high as 2000 W / (m·K), which is much higher than that of traditional metal materials; the top layer is a nano-ceramic coating with a thickness of 1 mm, which has excellent thermal conductivity and insulation. These three layers of materials are closely combined to form an overall heat conduction network. When the heat dissipation substrate contacts with the heat-generating components on the circuit board, it quickly absorbs heat through the high thermal conductivity efficiency of the contact surface. The contact area is the 80 mm × 50 mm area of the main control circuit board installation area, and the contact thermal resistance is reduced by a high-elasticity thermal conductive gasket. After the heat is introduced into the heat dissipation substrate, a specific distribution pattern is formed. According to the position and heat amount of the heat-generating components, a heat load distribution map is formed on the surface of the substrate.

[0059] After receiving the heat load, the heat dissipation substrate starts to conduct heat in a hierarchical manner. Hierarchical heat conduction refers to the process of orderly guiding heat according to the size and distribution position of the heat load. The 2-mm-thick high thermal conductivity copper plate plays a key role in the heat dissipation substrate. Its thermal conductivity is about 400 W / (m·K), which can quickly transfer heat horizontally. The heat diffuses inside the copper plate, flowing from the high-temperature area to the low-temperature area, and finally concentrating and transferring to 8 heat pipe array installation grooves processed on the surface of the substrate. The installation groove is 3 mm wide and 2.5 mm deep, and the adjacent heat pipe grooves are spaced 8 mm apart, forming a regularly arranged heat concentration channel. The heat conduction in the copper plate follows Fourier's law of heat conduction, and the heat flux density is proportional to the temperature gradient. During the horizontal conduction process, the heat is conducted up and down through the three-dimensional graphene aerogel layer and horizontally through the high thermal conductivity copper plate, and converges at the heat pipe slot opening, forming the heat source input at the heat pipe slot opening.

[0060] The heat source input at the heat pipe slot opening is directly transferred to the evaporation section of the heat pipe array installed in the slot. The heat pipe array is composed of 8 micro pulsating heat pipes. Each heat pipe is made of oxygen-free copper pipe with an outer diameter of 3 mm and an inner diameter of 2.2 mm, and the total length is 100 mm. The heat pipes are tightly combined with the substrate heat pipe slots through high thermal conductivity epoxy resin. The thermal conductivity of the epoxy resin reaches 8 W / (m·K), and the filling thickness is controlled within 0.1 mm to ensure effective heat transfer. The surface of the contact area between the middle part of the heat pipe and the chip is treated by gold plating, with a thickness of 3 microns. The length of this area is 30 mm, which is called the evaporation section. The evaporation section directly absorbs the heat from the heat pipe slot opening and transfers the heat to the internal working fluid. The working fluid is a modified alcohol compound, the state transition point is 42 °C, and the filling ratio is 50%. When the heat is introduced into the evaporation section, the temperature of the working fluid rises, reaches and exceeds the transition point, and starts to absorb heat. The heat absorption process changes the state of the working fluid, converting thermal energy into the kinetic energy of the fluid, forming a heat-carrying working fluid.

[0061] The heat-carrying working fluid is driven by the pressure difference inside the heat pipe and begins to move along the axial direction of the heat pipe. Since the temperature of the evaporation section of the heat pipe is high and the temperature of the condensation section is low, the pressure in the evaporation section is greater than that in the condensation section. This pressure difference drives the fluid to flow from the high-pressure area to the low-pressure area. Two transverse copper sheets are arranged in the heat pipe. The thickness of the copper sheet is 0.5 mm and the width is 3 mm, connecting 8 heat pipes into a network structure. This thermal network structure promotes the uniform distribution of heat among the heat pipe arrays. When the load of a certain heat pipe is too high, the transverse copper sheet transfers part of the heat to the heat pipes with lower loads, balancing the temperature distribution of the entire array. Through this heat redistribution mechanism, the originally concentrated heat flow is evenly dispersed, forming a more uniform heat flow distribution, reducing the load pressure on a single heat pipe, and improving the efficiency and stability of the overall heat dissipation system. The uniformly distributed heat flow continues to flow along the axial direction of the heat pipe and finally reaches the condensation section formed by extending 10 mm at both ends of the heat pipe. The condensation section is located outside the edge of the heat dissipation substrate and is in direct contact with the external heat dissipation structure. When the heat-carrying working fluid reaches the condensation section, it begins to release heat and change its state due to the temperature drop. The heat is transferred out through the heat-conducting copper tube wall of the condensation section. The thickness of the copper tube wall is 0.4 mm and the thermal conductivity is about 400 W / (m·K). The surface of the condensation section is processed with fish-scale microstructures. The depth of the microstructures is 20 μm and the width is 30 μm, increasing the heat dissipation area and heat conduction efficiency. The heat transfer process forms a temperature field on the outer surface of the condensation section. The temperature field shows a gradient distribution decreasing from the inside to the outside. The temperature near the heat pipe inside is higher, and the temperature in contact with the air outside is lower.

[0062] Based on the temperature field formed on the outer surface of the condensation section, the heat continues to be transferred outward to the heat sink fin assembly. The condensation section is in direct contact with the copper base, and a thermal grease is applied to the contact surface. The thickness of the thermal grease layer is 0.05 mm and the thermal conductivity is about 5 - 8 W / (m·K). The thermal grease fills the tiny gaps on the contact surface, reducing the contact thermal resistance and improving the heat conduction efficiency. The heat is transferred to the copper base through this contact layer and then dispersed to each heat sink fin of the heat sink fin assembly. In this way, a complete heat conduction path from the heat source to the heat dissipation structure is established, and the heat can continuously conduct from inside the solid-state drive to the external heat dissipation structure and finally dissipate into the environment.

[0063] In a specific embodiment, the absorption module is used for:

[0064] processing the data collected by the temperature monitoring network system, judging whether the temperature of the solid-state drive exceeds the preset threshold of the phase change temperature of the phase change material, and obtaining a phase change start trigger signal;

[0065] transmitting the phase change start trigger signal to the phase change material heat dissipation module, contacting the phase change material through the porous copper mesh heat conduction structure inside the module, and obtaining a heat conduction channel;

[0066] Heat is applied to the phase change material to raise the internal temperature of the phase change material to the phase change point, and the heat is converted into phase change energy through the latent heat of phase change of 200 joules / gram, resulting in a phase change process from solid to liquid;

[0067] The heat released during the phase change process is dispersed through the serpentine microchannel structure inside the module, and the heat exchange area is increased through the channel with a total length of 200 millimeters, resulting in a state of uniform heat distribution;

[0068] Nanotube enhancer-assisted heat transfer treatment is performed on the phase change material in the state of uniform heat distribution, and the heat conduction rate is increased through the nanotube network with a mass fraction of 3%, resulting in an enhanced heat conduction field;

[0069] The heat in the enhanced heat conduction field is transferred from the phase change material to the aluminum alloy housing, and the heat is slowly released to the heat dissipation substrate through the black microporous structure heat dissipation layer on the housing surface, resulting in a heat buffering effect.

[0070] Specifically, the absorption module processes the data collected by the temperature monitoring network system. The data comes from 15 temperature measurement points distributed at key positions of the solid-state drive. The processing process starts with data collection. After the central processing unit receives the data, it screens and extracts the temperature data related to the phase change material module, mainly the temperature data of 3 temperature measurement points of the phase change material module itself and the temperature data of the surrounding area. The central processing unit calculates the average value and change trend of the temperature, and compares it with the preset phase change temperature threshold of 55 °C of the phase change material. The comparison uses a threshold judgment algorithm. When it is detected that the average temperature exceeds the threshold, or the temperature rise rate exceeds the preset value (usually more than 2 °C per second), the central processing unit generates a phase change start trigger signal. This trigger signal contains the start intensity level and start area information, which is used to precisely control the phase change process. The phase change start trigger signal is transmitted to the control circuit of the phase change material heat dissipation module through the internal communication bus. After receiving the signal, the control circuit activates the porous copper mesh heat conduction structure inside the module to make it fully contact with the phase change material. The porous copper mesh is a special structure with a thickness of 0.3 millimeters, a pore diameter of 0.2 millimeters, and an opening rate of 60%, which is distributed between the phase change material and the housing. In the normal state, there is a small gap between the porous copper mesh and the phase change material, restricting heat conduction; when receiving the trigger signal, the position of the copper mesh is adjusted through a micro actuator (such as a shape memory alloy driver or a micro solenoid valve) to make it closely fit the phase change material, forming a heat conduction channel. After the channel is formed, heat can be quickly conducted from the outside to the inside of the phase change material, starting the next heat absorption process.

[0071] After the heat conduction channel is established, the heat from inside the solid-state drive is transferred to the phase change material through this channel. The phase change material is a compound with a special formula, having a phase change temperature of 55 °C, a latent heat of phase change of 200 J / g, a thermal conductivity of 2.5 W / (m·K), and a total filling amount of 5 g. When heat continuously enters, the temperature of the phase change material gradually rises from the initial temperature (usually the ambient temperature of 25 - 30 °C) to a temperature close to the phase change point. This heating process follows the temperature rise formula: ΔT = Q / (m×c), where ΔT is the temperature change, Q is the absorbed heat, m is the material mass, and c is the specific heat capacity. When the temperature reaches the phase change point of 55 °C, the additional input heat no longer causes the temperature to rise but is used for the phase change process to achieve the transformation from solid state to liquid state. This phase change process can absorb a large amount of heat, equivalent to the material absorbing 5 g × 200 J / g = 1000 J of heat while the temperature remains at 55 °C, effectively alleviating temperature fluctuations.

[0072] The heat generated during the phase change process (including the heat transferred from the outside and a small amount of heat released during the phase change process) is dispersed through the serpentine microchannel structure inside the module. The serpentine microchannel is a special structure designed inside the phase change module, with a channel width of 0.5 mm, a depth of 1 mm, and a serpentine distribution. This design makes the total channel length reach 200 mm, greatly increasing the heat exchange area. After the heat enters the phase change material, it is dispersed and conducted through the microchannel network to avoid local overheating. The serpentine design of the microchannel ensures uniform distribution of heat inside the phase change material and prevents the occurrence of hot spots. In this way, the heat is evenly dispersed throughout the volume of the phase change material, forming a state of uniform heat distribution, where each unit volume of the phase change material absorbs a similar amount of heat, maximizing the utilization of the heat capacity of the phase change material. To further improve the heat conduction efficiency, carbon nanotube enhancers are uniformly distributed in the phase change material with a mass fraction of 3%. Carbon nanotubes have an extremely high thermal conductivity (about 2000 - 6000 W / (m·K)) and form a three-dimensional continuous network structure, significantly enhancing the overall thermal conductivity of the phase change material. When the heat is uniformly distributed in the phase change material, the carbon nanotube network acts as a "highway" for heat conduction, accelerating the propagation of heat inside the phase change material. This enhanced heat conduction treatment increases the effective thermal conductivity of the phase change material to 3 - 5 times the original, forming an enhanced heat conduction field. The enhanced heat conduction field is characterized by a fast heat propagation speed and good uniformity, and can more effectively utilize the overall volume of the phase change material to improve the heat absorption efficiency.

[0073] The heat of the enhanced heat conduction field needs to be transferred from the phase change material to the aluminum alloy housing. The aluminum alloy housing has a thickness of 0.3 mm and its surface is anodized to form a black microporous structure, enhancing the radiation heat dissipation capacity. The heat is transferred through the contact surface between the phase change material and the housing, and the transfer rate is controlled by the thermal conductivity of the phase change material and the material-housing contact thermal resistance. After the housing absorbs the heat, it slowly releases the heat through the microporous structure on the surface, mainly through two ways: radiation and natural convection. This design makes the heat release process smooth, and the heat is not released instantaneously to the heat dissipation substrate, but maintained at a relatively stable release rate, thus achieving the heat buffering effect.

[0074] In a specific embodiment, the release module is used for:

[0075] Transfer the heat of the heat pipe condensation section to the copper base of the heat sink fin assembly, and form a heat conduction channel through the thermal conductive silicone grease layer on the contact surface to obtain the initial heat input of the heat sink fin assembly;

[0076] Disperse the initial heat input of the heat sink fin assembly, and conduct the heat from the base to each heat sink through the parallel arranged high thermal conductivity aluminum alloy heat sinks to obtain an extended heat dissipation area;

[0077] Perform surface microstructure treatment on the extended heat dissipation area, and increase the air contact area through the microgroove structure on the surface of the heat sink to obtain enhanced convective heat transfer conditions;

[0078] Combine the enhanced convective heat transfer conditions with the black anodizing treatment on the surface of the heat sink, and enhance the thermal radiation effect through the high emissivity to obtain a composite heat dissipation mechanism;

[0079] Conduct heat transfer on the graphite heat sinks installed on the upper and lower surfaces of the solid state drive, and export the heat on the inner surface of the cover plate through the graphite material with high thermal conductivity to obtain an auxiliary heat dissipation channel;

[0080] Connect the auxiliary heat dissipation channel with the ventilation network formed by the micro heat dissipation holes on the side of the housing, and construct natural convection driven by the internal and external temperature difference through the heat dissipation holes and the trapezoidally distributed air flow channels to achieve the process of temperature reduction.

[0081] Specifically, the release module transfers the heat from the condensation section of the heat pipe to the copper base of the heat sink fin assembly, and this process is completed through a carefully designed thermal contact interface. The condensation section of the heat pipe is in direct contact with the copper base, and a thermal grease is applied to the contact surface to form a heat conduction channel. The thermal grease is a special thermal interface material with a thickness of 0.05 mm and a thermal conductivity of about 5 - 8 W / (m·K). It can effectively fill the tiny voids on the contact surface and reduce the contact thermal resistance. Heat is conducted through this thin layer to the copper base, and the temperature of the copper base rises accordingly, forming a temperature gradient field with the temperature decreasing from the inside outwards. The temperature of the copper base directly affects the heat dissipation efficiency. Usually, in the working state, the temperature of the base is 5 - 10 °C lower than that of the condensation section of the heat pipe, ensuring a sufficient temperature difference to drive heat transfer. The heat received by the copper base constitutes the initial heat input of the heat sink fin assembly, and the heat input represents the total heat to be dissipated.

[0082] The dispersion of the initial heat input to the heat sink fin assembly is achieved through high - thermal - conductivity aluminum alloy heat sink fins arranged in parallel. The heat sink fin assembly consists of 35 parallel - arranged heat sink fins, each with a thickness of 0.4 mm, a height of 12 mm, and a spacing of 1.2 mm between adjacent fins. The aluminum alloy heat sink fins are die - cast from high - thermal - conductivity aluminum alloy with a thermal conductivity of about 150 - 200 W / (m·K) and a moderate heat capacity. The root of the heat sink fin is in close contact with the copper base. Heat is conducted from the base to the root of the heat sink fin and then along the heat sink fin away from the base. Each heat sink fin obtains heat from the base and dissipates heat to the air, achieving the diffusion of heat. This parallel - arrangement design disperses the heat of the base to multiple heat sink fins, greatly increasing the surface area in contact with the air. The originally concentrated heat is dispersed over an area of 600 - 800 square centimeters, which is dozens of times the area of the original heat source, forming an extended heat dissipation area.

[0083] The surface microstructure treatment of the extended heat dissipation area is achieved by machining micro - groove structures on the surface of the heat sink fins. The micro - groove structure is a special surface treatment process that forms regularly arranged tiny grooves on the surface of the heat sink fins. The groove depth is 0.1 mm, the width is 0.2 mm, and the groove spacing is 0.5 mm. This microstructure treatment has multiple effects: the micro - grooves increase the actual surface area of the heat sink fins, which can theoretically increase the contact area by 30 - 50% compared to a flat surface; secondly, the micro - grooves break the airflow boundary layer on the surface of the heat sink fins, promoting the formation of turbulence and enhancing the convective heat transfer; thirdly, the tiny cavities formed by the micro - grooves can capture more air molecules, increasing the heat exchange opportunities. The convective heat transfer coefficient on the surface of the heat sink fins is significantly improved, forming enhanced convective heat transfer conditions.

[0084] Combining enhanced convective heat transfer conditions with the black anodization treatment on the surface of the heat sink forms a composite heat dissipation mechanism. Anodization is an electrochemical surface treatment process that forms a dense aluminum oxide layer on the surface of aluminum alloy, and black dye is added during the process to make the surface appear black. The black anodized layer has a high emissivity, approximately 0.92, which is much higher than that of the untreated aluminum alloy surface, which is 0.1 - 0.2. The high emissivity means that the heat sink can dissipate heat more effectively by radiation, especially when the surface temperature is high. The combination of convective heat dissipation and radiative heat dissipation forms a dual heat dissipation mechanism. At low temperatures, convective heat dissipation dominates; at high temperatures, the contribution of radiative heat dissipation increases significantly. This composite heat dissipation mechanism enables the heat dissipation system to maintain high efficiency under various operating conditions.

[0085] Thermal conduction of the graphite heat sinks installed on the upper and lower surfaces of the solid-state drive is an auxiliary heat dissipation measure. The graphite heat sink has a thickness of 0.025 mm, a thermal conductivity of 1800 W / (m·K), and covers 80% of the entire surface. Graphite is a material with highly anisotropic thermal conductivity characteristics and excellent thermal conductivity in the planar direction. The graphite heat sink is fixed to the inner surfaces of the upper and lower covers with thermally conductive double-sided tape, and the thickness of the adhesive layer is 0.08 mm. The working principle of the graphite heat sink is to quickly conduct the heat on the inner surface of the cover to the edge area, realizing the lateral diffusion of heat. This process is equivalent to establishing an auxiliary heat dissipation channel inside the solid-state drive, increasing the ways of heat dissipation. The surface of the graphite heat sink is treated with a special process to form a nano-scale protrusion structure. The protrusion height is 5 μm, and the density is 100 per square millimeter. The tiny protrusions significantly enhance the contact with air and the convective heat dissipation effect. Connecting the auxiliary heat dissipation channel with the ventilation network formed by the micro heat dissipation holes on the side of the housing is achieved through a carefully designed air flow path. 100 micro heat dissipation holes are machined on the side of the housing. The diameter of the heat dissipation holes is 0.8 mm, and the distance between holes is 3 mm, showing a trapezoidal distribution, with a higher hole density at the bottom than at the top. This distribution form optimizes the natural convection effect because the characteristic of hot air rising naturally enables the cold air entering from the bottom to effectively carry away heat. A stainless steel dust-proof net is set inside the heat dissipation holes, and the aperture of the dust-proof net is 0.15 mm to prevent dust from entering the hard disk interior. When the internal temperature of the solid-state drive rises, a temperature difference is formed inside and outside, driving cold air to enter from the bottom heat dissipation holes and hot air to discharge from the top heat dissipation holes, forming a natural convection cycle. This natural convection driven by the internal and external temperature difference is a heat dissipation method without external energy input, which is particularly suitable for power-sensitive devices such as solid-state drives. The ventilation network and the auxiliary heat dissipation channel formed by the graphite heat sink work together to continuously transfer the internal heat to the external environment, achieving a continuous reduction in the temperature of the solid-state drive.

[0086] In a specific embodiment, the solid-state drive self-assembled with an internal circulation system further includes a monitoring module, specifically for:

[0087] Store and process the continuous monitoring data of the temperature monitoring network system collected by the central processing unit, record the temperature change trends of each temperature measurement point of the main control chip, flash chip array, DRAM cache module, phase change material module, and heat pipe condensation section, and obtain a temperature history database;

[0088] Analyze and process the data in the temperature history database, calculate the temperature change law of each area of the solid-state drive through the fuzzy neural network algorithm, and obtain a temperature prediction model;

[0089] Based on the temperature prediction model, adjust the working state of the phase change material module, and change the heat absorption capacity of the phase change material by controlling the phase change point with a microcurrent to obtain the dynamic control parameters of the phase change material;

[0090] Monitor and analyze the hard disk workload according to the dynamic control parameters, and adjust the startup timing of the cooling system in different load states through the dynamic power management module to obtain the operation strategy of the cooling system;

[0091] Convert the operation strategy of the cooling system into control instructions, and optimize and adjust the cooling method of the heat dissipation fin assembly through the adaptive temperature control algorithm to obtain a cooling efficiency control scheme;

[0092] Perform feedback regulation on the cooling efficiency control scheme, report the temperature status and the health status of the cooling system to the host through the SMART protocol, and combine the self-diagnosis function to detect the sensor status and abnormal conditions of the cooling system to obtain the dynamic control of the internal temperature of the solid-state drive.

[0093] Specifically, the monitoring module stores and processes the continuous monitoring data of the temperature monitoring network system collected by the central processing unit. The central processing unit is an ultra-low-power microcontroller with a working frequency of 32 megahertz, built-in 512 kilobytes of flash memory and 64 kilobytes of RAM, integrated with a 12-bit analog-to-digital converter and a temperature compensation circuit. The temperature monitoring network system consists of 15 digital temperature sensors distributed at key positions of the solid-state drive: 3 on the main control chip, 4 on the flash chip array, 2 on the DRAM cache module, 3 on the phase change material module, and 3 on the heat pipe condensation section. Each sensor collects temperature data once per second, and the data is transmitted to the central processing unit through a two-wire digital bus. After receiving the data, the central processing unit marks the data with a timestamp and preprocesses it, and then stores it in the built-in non-volatile memory to form a structured temperature history database. The database records the temperature curves and working status of the last 7 days, including the temperature values, temperature change rates, temperature peaks, and durations of each temperature measurement point. The database adopts a circular buffer structure, and new data overwrites the earliest data to ensure the efficient use of storage space. The analysis and processing of the data in the temperature history database are realized through the fuzzy neural network algorithm. The fuzzy neural network algorithm is an intelligent algorithm that combines the advantages of fuzzy logic and neural networks and is suitable for dealing with temperature control problems with uncertainty and non-linear characteristics. The algorithm contains 5 input variables (main control chip temperature, flash chip temperature, phase change material temperature, ambient temperature, and workload), 3 output variables (heat pipe activation intensity, phase change material control parameters, and heat sink adjustment parameters), and 25 fuzzy rules. The algorithm extracts features from the temperature history database, including the temperature change rate, temperature mean, time when the peak temperature appears, etc., and then converts the exact numerical values into fuzzy sets through fuzzification. The fuzzy inference engine calculates the fuzzy output based on the preset rule base, and finally obtains the exact control parameters through defuzzification. At the same time, the neural network part continuously adjusts the weights and membership functions of the fuzzy rules through the backpropagation algorithm, and adaptively optimizes the algorithm according to the actual heat dissipation effect. This process is iterated continuously to analyze the temperature change law of the solid-state drive in different working modes, and finally a temperature prediction model that can predict future temperature changes is formed.

[0094] Adjusting the working state of the phase change material module based on the temperature prediction model is achieved through a precisely controlled microcurrent heating system. The phase change point of the phase change material is 55°C, but in practical applications, the effective phase change temperature of the material can be dynamically adjusted through microcurrent heating. The microcurrent heating system consists of multiple micro heating elements, which are distributed at different positions of the phase change material module, and the power of each heating element is 0.1 - 0.5 watts. The central processing unit calculates the optimal phase change temperature of the phase change material under the current working state according to the output of the temperature prediction model. If a temperature peak is predicted in a short period of time, the phase change point is lowered in advance so that the phase change material can start absorbing heat at a lower temperature; if long-term stable operation is predicted, the phase change point is appropriately increased to extend the effective working time of the phase change material. This dynamic adjustment is achieved by controlling the magnitude and duration of the microcurrent, and the control parameters include current intensity, heating time, and heating area, forming a dynamic control parameter set for the phase change material.

[0095] Monitoring and analyzing the hard disk workload according to the dynamic control parameters is completed by the dynamic power management module. The dynamic power management module monitors the working state of the solid-state drive, including indicators such as read / write rate, command queue depth, and flash chip activity. The indicators are obtained through the status register of the main control chip and sampled every 100 milliseconds. The module combines and analyzes the workload data and temperature data to establish an association model between the workload and the temperature rise rate. Based on this model, the dynamic power management module can predict the temperature change trend under different workloads, and then determine the optimal startup timing of the cooling system. In the low-load state, the startup of the cooling system is delayed to reduce energy consumption; in the high-load state, the cooling system is started in advance to prevent the temperature from being too high. This cooling control strategy based on load prediction forms the operating strategy of the cooling system, including parameters such as startup timing, operating intensity, and duration.

[0096] Converting the operating strategy of the cooling system into control instructions is achieved through an adaptive temperature control algorithm. The adaptive temperature control algorithm is based on the principle of reinforcement learning and transforms the control problem of the cooling system into a decision-making process. The algorithm receives the operating strategy of the cooling system as input and generates specific control instructions, including the working mode of the heat pipe, the state of the phase change material, and the adjustment parameters of the heat sink fin assembly. For the heat sink fin assembly, the control instructions mainly include the start / stop control and intensity adjustment of the active heat dissipation elements (such as micro fans or vibration devices). The adaptive temperature control algorithm continuously adjusts the control parameters according to the real-time temperature feedback, establishes a mapping relationship between the control instructions and the cooling effect, and gradually optimizes the control strategy. Through multiple iterative learning, the algorithm forms an optimal control scheme for different working states, constituting a cooling efficiency control scheme library.

[0097] Feedback regulation of the heat dissipation efficiency control scheme is achieved through a monitoring feedback mechanism. The monitoring module reports the temperature status and the health status of the heat dissipation system to the host through the SMART (Self-Monitoring, Analysis and Reporting Technology) protocol. The SMART protocol is a standard interface for storage devices, allowing the solid-state drive to report its operating status to the host system. The monitoring module encapsulates the temperature data, the operating status of the heat dissipation system, and the abnormal information into SMART data packets and updates them to the host once per second. At the same time, the monitoring module has a built-in self-diagnosis function to regularly detect the status of the sensors and the operating conditions of the components of the heat dissipation system. The self-diagnosis process includes sensor consistency checks, evaluation of the working efficiency of the heat pipes, and monitoring of the status of the phase change materials. When an abnormal situation is detected, the monitoring module will automatically adjust the control strategy to give priority to ensuring the temperature safety of the key components. Through this closed-loop feedback mechanism, the heat dissipation system can dynamically adjust the control parameters according to the actual situation to achieve precise dynamic control of the internal temperature of the solid-state drive.

[0098] The above describes the solid-state drive with an internal circulation system in the embodiments of the present application. Next, the heat dissipation method of the solid-state drive with an internal circulation system in the embodiments of the present application will be described. Please refer to Figure 2 , an embodiment of the heat dissipation method of the solid-state drive with an internal circulation system in the embodiments of the present application includes:

[0099] Detect the digital temperature sensor data of the temperature monitoring network system to obtain the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module;

[0100] Activate the working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat to obtain a heat transfer path;

[0101] Conduct the heat in the area around the hierarchical structure heat dissipation substrate to the condensation section through the heat pipe array structure;

[0102] Utilize the phase change material heat dissipation module to absorb the peak heat during temperature fluctuations to obtain a heat buffering effect;

[0103] Release the heat to the external environment through the heat dissipation fin assembly of the peripheral passive heat dissipation structure.

[0104] Among them, the heat dissipation method of the solid-state drive with an internal circulation system further includes: adjusting the heat dissipation process parameters by the central processing unit of the temperature monitoring network system according to the continuous monitoring results.

[0105] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A solid-state drive with a self-assembled internal circulation system, characterized in that The solid-state drive includes: A detection module, configured to detect the digital temperature sensor data of the temperature monitoring network system, and obtain the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module; An activation module, configured to activate the working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat and obtains a heat transfer path; A conduction module, configured to conduct the heat in the area around the layered structure heat dissipation substrate to the condensation section through the heat pipe array structure; An absorption module, configured to utilize the phase change material heat dissipation module to absorb the peak heat during temperature fluctuations to obtain a heat buffering effect; A release module, configured to release the heat to the external environment via the heat dissipation fin assembly of the peripheral passive heat dissipation structure.

2. The solid-state drive with an internally circulated system according to claim 1, characterized in that, The detection module is configured to: Transmit the data collected by the digital temperature sensors at each installation point of the main control chip, the flash memory chip array, the DRAM cache module, the phase change material module, and the heat pipe condensation section to the central processing unit, and obtain the temperature values of fifteen temperature measurement points; Process the obtained temperature values of the fifteen temperature measurement points, collect all the temperature data once per second, and obtain real-time temperature monitoring data; Analyze the temperature values of each section of the eight micro pulsating heat pipes in the heat pipe array structure according to the real-time temperature monitoring data, and obtain the heat pipe working state data; Determine the temperature load distribution in the area corresponding to the heating element in the heat pipe array structure based on the heat pipe working state data, and obtain the temperature distribution map of the heat pipe array; Process the temperature sensor data corresponding to the phase change material heat dissipation module, analyze the difference between the current temperature of the phase change material and the phase change point, and obtain the heat absorption state of the phase change material module; Integrate and process the temperature distribution map of the heat pipe array and the heat absorption state of the phase change material module, and generate the temperature distribution information of the heat dissipation system through the central processing unit to obtain the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module.

3. The solid-state drive with an internally circulating system according to claim 1, characterized in that, The activation module is configured to: Compare the temperature data of the heat pipe array structure in the temperature distribution information with a preset threshold, and determine whether the temperature of the eight micro pulsating heat pipes in the heat pipe array exceeds the boiling point of the working fluid to obtain a heat pipe activation signal; Apply a micro current preheating treatment to the modified alcohol compound working fluid inside the micro pulsating heat pipe according to the heat pipe activation signal, so that the temperature of the working fluid reaches a state close to the boiling point to obtain a pre-activated working fluid; Guide the pre-activated working fluid to the contact area between the heat pipe evaporation section and the chip, and absorb the heat generated by the circuit board heating element through the middle part of the heat pipe with gold plating treatment to obtain a heat-carrying working fluid; Perform capillary force driving on the heat-carrying working fluid in the micro pore core structure, so that the working fluid flows through the sintered copper powder micro pore channel with a pore diameter of 50 microns and a porosity of 75% to obtain a directional fluid; Guide the directional fluid to the condensation areas at both ends of the heat pipe, increase the heat exchange area through the fish scale-like micro structure, so that the working fluid releases heat and changes its state to obtain a condensed liquid; Apply a combined action of gravity and capillary force to the condensed liquid to make it flow back to the evaporation section along the inner wall of the heat pipe to form an internal circulation loop and obtain a heat transfer path.

4. The solid-state drive with an internally circulating system according to claim 1, characterized in that, The conduction module is configured to: The heat conduction network formed by the three-layer structure of the high thermal conductivity copper plate, three-dimensional graphene aerogel layer, and nano-ceramic coating in the hierarchical structure heat dissipation substrate is brought into corresponding contact with the heat-generating components on the circuit board. Heat is absorbed through the high thermal conductivity efficiency of the contact surface to obtain the heat load distribution of the heat dissipation substrate. The heat load distribution of the heat dissipation substrate is subjected to hierarchical conduction. The heat is laterally transferred to the heat pipe array installation groove through the high thermal conductivity copper plate to obtain the heat source input at the heat pipe slot opening. The heat source input at the heat pipe slot opening is transferred to the evaporation section of the heat pipe array. The heat is transferred to the internal working fluid through the 30-mm-long heat pipe evaporation section to obtain the heat-carrying working fluid. The heat-carrying working fluid is driven by a pressure difference inside the heat pipe, and heat is distributed through the heat network structure formed by connecting two transverse copper sheets in the heat pipe to obtain a uniformly distributed heat flow. The uniformly distributed heat flow is guided to the condensation section formed by extending 10 mm at each end of the heat pipe. Heat is transferred through the heat-conducting copper tube wall of the condensation section to obtain the temperature field on the outer surface of the condensation section. Based on the temperature field on the outer surface of the condensation section, heat conduction is performed on the contact surface between the heat pipe condensation section and the copper base. Heat is transferred to the peripheral heat dissipation structure through the 0.05-mm-thick contact layer formed by thermal grease to obtain the conduction path for heat to be transported outward.

5. The solid-state drive with an internally circulating system according to claim 1, characterized in that, Absorption module, for: Processing the data collected by the temperature monitoring network system to determine whether the temperature of the solid-state drive exceeds the preset threshold of the phase change temperature of the phase change material, and obtaining a phase change start trigger signal. Transmitting the phase change start trigger signal to the phase change material heat dissipation module, and contacting the phase change material through the porous copper mesh heat conduction structure inside the module to obtain a heat conduction channel. Applying heat to the phase change material to make the internal temperature of the phase change material reach the phase change point, and converting the heat into phase change energy through the latent heat of phase change of 200 J / g to obtain the phase change process from solid to liquid. Dispersing the heat released during the phase change process through the serpentine microchannel structure inside the module, and increasing the heat exchange area through the channels with a total length of 200 mm to obtain a state of uniform heat distribution. Performing heat transfer assisted by a carbon nanotube enhancer on the phase change material in the state of uniform heat distribution, and enhancing the heat conduction rate through the carbon nanotube network with a mass fraction of 3% to obtain an enhanced heat conduction field. Transferring the heat of the enhanced heat conduction field from the phase change material to the aluminum alloy housing, and slowly releasing the heat to the heat dissipation substrate through the black microporous structure heat dissipation layer on the housing surface to obtain a heat buffering effect.

6. The solid-state drive with an internally circulating system according to claim 1, characterized in that, Release module, for: Transferring the heat of the heat pipe condensation section to the copper base of the heat sink fin assembly, and forming a heat conduction channel through the thermal grease layer on the contact surface to obtain the initial heat input of the heat sink fin assembly. Dispersing the initial heat input of the heat sink fin assembly, and conducting the heat from the base to each heat sink through the parallel arranged high thermal conductivity aluminum alloy heat sinks to obtain an extended heat dissipation area. Performing surface microstructure treatment on the extended heat dissipation area, and increasing the air contact area through the microgroove structure on the surface of the heat sink to obtain enhanced convective heat transfer conditions. By combining enhanced convective heat transfer conditions with black anodizing treatment on the heat sink surface, the heat radiation effect is enhanced through high emissivity, resulting in a composite heat dissipation mechanism. Conduct heat conduction to the graphite heat sinks installed on the upper and lower surfaces of the solid-state drive, and conduct heat from the inner surface of the cover through the graphite material with high thermal conductivity to obtain an auxiliary heat dissipation channel; The auxiliary heat dissipation channel is connected to the ventilation network formed by the micro heat dissipation holes on the side of the shell. Natural convection driven by the temperature difference between the inside and outside is constructed through the heat dissipation holes and the trapezoidal air flow channels to achieve the temperature reduction process.

7. The solid-state drive with an internally circulating system as claimed in claim 1, characterized in that, Also includes: The monitoring module is used to adjust the heat dissipation process parameters according to the continuous monitoring results through the central processing unit of the temperature monitoring network system. The monitoring module is specifically used to: The continuous monitoring data of the temperature monitoring network system collected by the central processing unit is stored and processed, and the temperature change trends of each temperature measuring point of the main control chip, flash chip array, DRAM cache module, phase change material module and heat pipe condensation section are recorded to obtain a temperature history database; The data in the temperature history database is analyzed and processed, and the temperature variation pattern of each area of the solid-state drive is calculated using a fuzzy neural network algorithm to obtain a temperature prediction model. The working state of the phase change material module is adjusted based on the temperature prediction model. The heat absorption capacity of the phase change material is changed by controlling the phase change point through micro-current heating to obtain the dynamic control parameters of the phase change material. Monitor and analyze the hard disk workload based on dynamic control parameters, and use the dynamic power management module to adjust the cooling system startup timing under different load conditions to obtain the cooling system operation strategy; The cooling system operation strategy is converted into control instructions, and the cooling method of the cooling fin assembly is optimized and adjusted through the adaptive temperature control algorithm to obtain the cooling efficiency control solution; Feedback adjustment is performed on the heat dissipation efficiency control scheme, and the temperature status and health status of the heat dissipation system are reported to the host through the SMART protocol. Combined with the self-diagnosis function to detect sensor status and heat dissipation system abnormalities, dynamic control of the internal temperature of the solid-state drive is achieved.

8. A heat dissipation method for a solid state drive with a self-assembled internal circulation system, characterized in that, Based on the solid-state hard disk self-assembled with an internal circulation system according to any one of claims 1 to 7, the heat dissipation method of the solid-state hard disk self-assembled with an internal circulation system includes: Detect digital temperature sensor data from the temperature monitoring network system to obtain temperature distribution information of the heat pipe array structure and phase change material heat dissipation module; activating the working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat and obtains a heat transfer path; The heat pipe array structure is used to transfer the heat from the area surrounding the layered structure heat dissipation substrate to the condensation section; The phase change material heat dissipation module absorbs the peak heat during temperature fluctuations to achieve a heat buffer effect; The heat is released to the external environment through the heat dissipation fin assembly of the peripheral passive heat dissipation structure.

9. A heat dissipation method for a solid state drive with an internal circulation system for self-assembly, characterized in that, The heat dissipation method for a solid-state hard disk self-assembled with an internal circulation system further includes: adjusting heat dissipation process parameters according to continuous monitoring results by a central processing unit of a temperature monitoring network system.

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