Temperature monitoring method, device, electronic device, storage medium and product

Abstract

The present application relates to a temperature monitoring method, device, electronic device, storage medium and product, and relates to the field of equipment monitoring technology. By collecting the measured temperature sequence at each temperature measuring point on the target device during the monitoring period, the temperature anomaly analysis is performed based on the measured temperature sequence at the temperature measuring point to determine the abnormal temperature index parameters of the temperature measuring point during the monitoring period; based on the abnormal temperature index parameters at the temperature measuring point, the temperature monitoring weights of at least some temperature measuring points in the next monitoring period are adjusted; based on the measured temperature sequence of each temperature measuring point in multiple monitoring periods, and the temperature monitoring weights corresponding to each monitoring period, the temperature analysis of the target device is performed, and the temperature monitoring weights are used to indicate the importance of the measured temperature at the corresponding temperature measuring point in the temperature analysis. The present application can significantly improve the precision and accuracy of the monitoring data in representing the actual temperature state of the device.

Description

Technical Field

[0001] The present application relates to the field of equipment detection technology, and in particular to a temperature monitoring method, device, electronic equipment, storage medium and product. Background Art

[0002] As the core component of a hydro-turbine generator set, the operating temperature of the rotor is directly related to the performance and life of the equipment. However, the temperature of the rotor is affected by many factors, such as load changes, ambient temperature, and rotational speed. Therefore, it is necessary to monitor its temperature.

[0003] However, the existing rotor temperature monitoring has many defects, which makes the monitored temperature data unable to truly reflect the rotor temperature status.

[0004] For example, traditional monitoring methods such as the volt-ampere method can only calculate the average temperature of the rotor coil, and cannot reflect the temperature rise distribution and hot spot conditions. For another example, the thermal resistance method is easily interfered with in a strong electromagnetic field environment, resulting in data distortion. Summary of the Invention

[0005] The embodiments of the present application provide a temperature monitoring method, device, electronic device, storage medium and program product, which are intended to accurately characterize the actual temperature state of the device to at least partially solve the above-mentioned technical problems.

[0006] In order to achieve the above object, according to a first aspect of the present application, a temperature monitoring method is provided, comprising:

[0007] For each temperature measurement point on the target device, a measured temperature sequence at the temperature measurement point is collected during a monitoring period; wherein the plurality of temperature measurement points are determined by a thermal-mechanical coupling simulation model based on the device temperature distribution of the target device under various operating conditions;

[0008] performing temperature anomaly analysis based on the measured temperature sequence at the temperature measuring point to determine abnormal temperature index parameters of the temperature measuring point within the monitoring period;

[0009] Adjusting the temperature monitoring weights of at least some of the temperature measuring points in the next monitoring period based on the abnormal temperature indicator parameters at the temperature measuring points;

[0010] The temperature analysis of the target device is performed based on the temperature sequence measured at each temperature measurement point in multiple monitoring cycles and the temperature monitoring weight corresponding to each monitoring cycle. The temperature monitoring weight is used to indicate the importance of measuring the temperature at the corresponding temperature measurement point in the temperature analysis.

[0011] Optionally, the step of determining each temperature measurement point on the target device includes:

[0012] Obtaining operating condition parameters of the target device under at least one operating condition;

[0013] Obtaining temperature distribution information of the target device according to the operating condition parameters, material parameters, and structural parameters of the target device through a thermal-mechanical coupling simulation model, wherein the temperature distribution information includes temperature distribution information of electromagnetic components of the target device;

[0014] Each temperature measurement point on the target device is determined according to the temperature distribution information.

[0015] Optionally, determining each temperature measurement point on the target device according to the temperature distribution information includes:

[0016] Divide the target device into temperature monitoring areas where temperature measurement points are to be arranged based on the temperature distribution information; wherein the temperature monitoring areas include a first area, a second area, a third area, and a fourth area; the temperature of the measurement points in the first area is greater than a preset temperature threshold; the temperature change rate of the measured temperature in the second area is greater than a preset change rate threshold; the third area is other monitoring areas on the target device except the first and second areas; and the fourth area is an overlapping area between the first and second areas;

[0017] Arrange temperature measurement points on the target device according to the temperature monitoring area.

[0018] Optionally, arranging temperature measurement points on the target device according to the temperature monitoring area includes:

[0019] Obtaining positional correlations between the initial temperature measurement points arranged in the temperature monitoring area according to a measured temperature sequence of the initial temperature measurement points;

[0020] Adjusting the distances between the initial temperature measurement points according to the target area where the initial temperature measurement points are located so that the adjusted position correlations between the initial temperature measurement points satisfy a position correlation range corresponding to the target area;

[0021] The target area includes any one of the first area, the second area, the third area and the fourth area; and the first area, the second area, the third area and the fourth area have corresponding position correlation ranges.

[0022] Optionally, before performing temperature anomaly analysis based on the measured temperature sequence at the temperature measuring point and determining abnormal temperature indicator parameters of the temperature measuring point within the monitoring period, the method further includes:

[0023] obtaining, based on the measured temperature sequence at each of the temperature measurement points, a temperature change trend at the temperature measurement points, and triggering a step of performing a temperature anomaly analysis based on the measured temperature sequence at each of the temperature measurement points when the temperature change trend and / or the measured temperature of at least one of the temperature measurement points meets a preset first abnormality condition; and / or

[0024] obtaining, based on the measured temperature sequence at each of the temperature measurement points and a historical measured temperature sequence under the same operating conditions, a temperature difference between the measured temperature sequence and a temperature average of the historical measured temperature sequence, and triggering a step of performing a temperature anomaly analysis based on the measured temperature sequence at each of the temperature measurement points when the temperature difference meets a preset second anomaly condition; and / or

[0025] Obtain target operating parameters of the target device, and trigger a step of performing temperature anomaly analysis based on the measured temperature sequence at each of the temperature measurement points when the correlation between the target operating parameters and the temperature change trend meets a preset third abnormal condition.

[0026] Optionally, performing temperature anomaly analysis based on the measured temperature sequence at the temperature measuring point to determine an abnormal temperature indicator parameter of the temperature measuring point within the monitoring period includes:

[0027] performing a temperature anomaly analysis based on the measured temperature sequence at each of the temperature measuring points, counting the number of times the temperature change trend and / or the measured temperature meets a preset first anomaly condition, the number of times the temperature difference meets a preset second anomaly condition, and / or the number of times the correlation between the target operating condition parameter and the temperature change trend meets a preset third anomaly condition, at the temperature measuring point, to obtain a total number of anomalies occurring at each of the temperature measuring points;

[0028] The total number of times an abnormality occurs at each of the temperature measurement points is set as the abnormal temperature indicator parameter within the monitoring period.

[0029] Optionally, adjusting the temperature monitoring weights of at least some of the temperature measurement points in the next monitoring period based on the abnormal temperature indicator parameters at the temperature measurement points includes:

[0030] sorting the plurality of temperature measurement points according to the total number of times an anomaly occurs at each of the temperature measurement points;

[0031] Determine at least one temperature measurement point from the sorted plurality of temperature measurement points where the total number of abnormalities is greater than a preset number, and adjust the temperature monitoring weight corresponding to the at least one temperature measurement point in the next monitoring cycle so that the temperature monitoring weight corresponding to the at least one temperature measurement point is reduced.

[0032] Optionally, the method further includes:

[0033] Obtaining actual operating conditions, load status, and environmental information of the target device;

[0034] According to at least one of the actual operating conditions, load status, and environmental information of the environment, the operating parameters of the sensor at the temperature measurement point are adjusted, wherein the operating parameters include the temperature sampling frequency and / or sampling sensitivity of the target device.

[0035] According to a second aspect of the present application, a temperature monitoring device is provided, comprising:

[0036] an acquisition module configured to acquire, for each temperature measurement point on the target device, a sequence of measured temperatures at the temperature measurement point within a monitoring period; wherein the plurality of temperature measurement points are determined by a thermal-mechanical coupling simulation model based on device temperature distribution of the target device under various operating conditions;

[0037] a determination module, configured to perform temperature anomaly analysis based on the measured temperature sequence at the temperature measurement point, and determine an abnormal temperature index parameter of the temperature measurement point within the monitoring period;

[0038] an adjusting module, configured to adjust the temperature monitoring weights of at least some of the temperature measuring points in a next monitoring cycle based on the abnormal temperature indicator parameters at the temperature measuring points;

[0039] An analysis module is configured to perform a temperature analysis of the target device based on a sequence of temperatures measured at each temperature measurement point over multiple monitoring cycles and a temperature monitoring weight corresponding to each monitoring cycle, wherein the temperature monitoring weight is used to indicate the importance of measuring the temperature at the corresponding temperature measurement point in the temperature analysis.

[0040] In a third aspect, this embodiment further provides an electronic device, comprising a processor and a memory, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the above method.

[0041] In a fourth aspect, this embodiment further provides a computer-readable storage medium, which includes a computer program. When the computer program is run on an electronic device, the computer program is used to enable the electronic device to execute the steps of the above method.

[0042] In the fifth aspect, this embodiment also provides a computer program product, characterized in that it includes a computer program, and the computer program is stored in a computer-readable storage medium; when the processor of an electronic device reads the computer program from the computer-readable storage medium, the processor executes the computer program, so that the electronic device performs the steps of the above method.

[0043] In summary, through the above technical solution, in the embodiment of the present application, each temperature measurement point on the target device can be obtained, and then the measured temperature sequence at the temperature measurement point can be collected during the monitoring cycle, and the temperature anomaly analysis can be performed based on the measured temperature sequence at each temperature measurement point to determine the abnormal temperature index parameter of each temperature measurement point during the monitoring cycle. Based on the abnormal temperature index parameter at each temperature measurement point, the temperature monitoring weight of at least some temperature measurement points in the next monitoring cycle is adjusted. In this way, the temperature of the target device is analyzed based on the measured temperature sequence of each temperature measurement point in multiple monitoring cycles and the temperature monitoring weight corresponding to each monitoring cycle. It can be seen that the present application can arrange measurement points on the target device through a thermal-mechanical coupling simulation model, and optimize the temperature monitoring weight corresponding to the temperature measurement point according to the abnormal situation of the measured temperature sequence collected at the temperature measurement point, so as to achieve the autonomous optimization layout of the temperature measurement point and optimize the collected measured temperature. In this way, in order to solve the problem of characterization distortion caused by the limited number of measurement points and inherent data errors in the existing device temperature monitoring, the present application can significantly improve the precision and accuracy of the monitoring data in representing the actual temperature state of the device, thereby effectively optimizing the device performance.

[0044] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0046] In order to more completely understand the present application and its beneficial effects, the following description will be made with reference to the accompanying drawings, wherein the same reference numerals in the following description represent the same parts;

[0047] Figure 1 This is a first schematic diagram of a temperature monitoring process provided in an exemplary embodiment of the present application;

[0048] Figure 2 is a second schematic diagram of a temperature monitoring process provided in an exemplary embodiment of the present application;

[0049] Figure 3 is a third schematic diagram of a temperature monitoring process provided in an exemplary embodiment of the present application;

[0050] Figure 4 is a schematic diagram of a temperature monitoring device provided in an exemplary embodiment of the present application;

[0051] Figure 5 Schematic diagram of the electronic device provided in an exemplary embodiment of the present application. DETAILED DESCRIPTION

[0052] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0053] As the core component of a hydro-turbine generator set, the operating temperature of the rotor is directly related to the performance and life of the equipment. In many applications, the temperature of the rotor is affected by various factors, such as load changes, ambient temperature, and rotational speed. Therefore, temperature monitoring is essential.

[0054] At the current level of technology, the reliability of monitoring data still faces many challenges. On the one hand, traditional monitoring methods such as the voltammetry method can only calculate the average temperature of the rotor coil and cannot reflect the temperature rise distribution and hot spot conditions. On the other hand, the thermal resistance method is easily interfered with in strong electromagnetic fields, resulting in data distortion. In addition, the infrared temperature measurement method is significantly affected by ambient temperature and rotor surface contamination and is difficult to apply to motors with small air gaps. Although fiber Bragg grating temperature measurement technology has application prospects, its measurement error will increase significantly under high-speed rotation conditions due to factors such as rotational speed and coating thickness. These technical limitations have greatly reduced the reliability of rotor temperature monitoring data, making it difficult to fully meet the monitoring needs for the safe operation of hydro-turbine generators.

[0055] At the same time, the field of online monitoring pays insufficient attention to the reliability verification of the measurement point data itself, which will greatly affect the reliability of the subsequent conclusions based on the analysis of the monitoring data.

[0056] In order to solve the above problems, the present application proposes a temperature monitoring method, device, electronic device, computer-readable storage medium and computer program product, which aims to provide a turbine generator rotor temperature monitoring and redundant measurement point self-diagnosis system based on thermal-mechanical coupling simulation. It can realize scientific point selection before the unit is put into operation, derive a rotor temperature measurement point layout plan, avoid sensor redundancy, and dynamically adjust the measurement point data usage strategy according to the measurement point status after the unit is put into operation to improve the effectiveness of the analysis results.

[0057] Specifically, the temperature monitoring method in the present application can be used for a terminal device, which can be a rotor, such as a turbine generator rotor. In addition, the terminal device in the present application can also be a computer, server and other network devices, without specific limitation.

[0058] Take the terminal device as a turbine generator rotor as an example. Figure 1 As shown, the temperature monitoring method in this application may at least include the following steps:

[0059] S10, acquiring temperature measurement points on the target device and collecting a temperature sequence within a monitoring period; wherein the plurality of temperature measurement points are determined by a thermal-mechanical coupling simulation model based on the device temperature distribution of the target device under various operating conditions;

[0060] In this embodiment, the target device may be a hydro-generator rotor (including a conventional hydro-generator, a fixed-speed generator motor, a variable-speed generator motor, etc.), and the terminal device may obtain various temperature measurement points on the target device. For example, the temperature measurement points on the hydro-generator rotor may be set at the following locations to effectively monitor the rotor temperature:

[0061] (1) Rotor winding

[0062] Inside the winding: embed thermistor or resistance thermometer at the appropriate position of the rotor winding of the constant speed generator motor to directly measure the temperature of the winding; between the upper and lower wire rods of the rotor of the variable speed generator motor, etc.

[0063] Winding surface: Install temperature measuring elements on or near the winding surface to monitor the surface temperature of the winding.

[0064] (2) Rotor core

[0065] In the core slot: Resistance thermometers are buried in the slots of the rotor core to monitor the temperature of the core.

[0066] Core surface: A temperature measuring element is installed on the core surface to monitor the core surface temperature.

[0067] (3) Rotor poles

[0068] Inside the magnetic pole: A temperature measuring element is installed inside or near the rotor magnetic pole to monitor the temperature of the magnetic pole.

[0069] Magnetic pole surface: A temperature measuring element is installed on the magnetic pole surface to monitor the surface temperature of the magnetic pole.

[0070] The above merely lists possible locations of temperature measurement points and does not impose any specific limitation thereto.

[0071] Among them, the temperature measurement points in the embodiment of the present application can be determined by a thermal-mechanical coupling simulation model based on the device temperature distribution of the target device under various operating conditions. For example, in this embodiment, a thermal-mechanical coupling simulation model of a hydro-generator rotor can be established, and the geometric structure, material properties, operating condition parameters, etc. of the rotor can be input, and then the simulation can be run to obtain multiple temperature measurement points. The subsequent embodiments will be explained in detail and will not be repeated here.

[0072] Furthermore, a measured temperature sequence at each temperature measuring point may be collected during the monitoring period. The measured temperature sequence may include temperatures at multiple measuring points. In addition, this embodiment does not specifically limit the specific duration of the monitoring period, such as 30 seconds.

[0073] S20, performing temperature anomaly analysis based on the measured temperature sequence at the temperature measuring point, and determining abnormal temperature index parameters of the temperature measuring point within the monitoring period;

[0074] In this embodiment, after obtaining the measured temperature sequence at each temperature measurement point, the terminal device may perform temperature anomaly analysis based on the measured temperature sequence at each temperature measurement point to determine abnormal temperature index parameters of each temperature measurement point within the monitoring period.

[0075] It can be understood that in this embodiment, the abnormal temperature indicator parameters may specifically include: when the terminal device performs temperature anomaly analysis based on the measured temperature sequence at the temperature measurement point, the abnormal temperature indicator parameters such as the number of abnormalities in the rotor temperature at the temperature measurement point, which are counted, the frequency, the degree of abnormality, etc.

[0076] S30, adjusting the temperature monitoring weights of at least some of the temperature measuring points in the next monitoring cycle based on the abnormal temperature indicator parameters at the temperature measuring points;

[0077] In this embodiment, the terminal device may adjust the temperature monitoring weights of at least some of the temperature measurement points in the next monitoring cycle based on the abnormal temperature indicator parameters at each temperature measurement point.

[0078] It can be understood that in this embodiment, multiple temperature measurement points can be arranged on the rotor, and a measurement temperature sequence is collected at each temperature measurement point. If the measured temperature collected at the temperature measurement point is abnormal, in order not to affect the subsequent rotor performance analysis, the proportion of the abnormal measured temperature in the subsequent analysis can be reduced. That is, the temperature monitoring weight in this embodiment can be used to indicate the importance of the measured temperature at the corresponding temperature measurement point in the temperature analysis.

[0079] Furthermore, for the at least some of the temperature measurement points mentioned above, this embodiment does not limit the number of these temperature measurement points, which may be one or more, and does not limit the type of temperature measurement, for example, they may be temperature measurement points where abnormalities occur and / or temperature measurement points where no abnormalities occur.

[0080] Specifically, for example, if the terminal device detects that the measured temperatures collected at some temperature measurement points are abnormal, the temperature monitoring weights of some temperature measurement points can be adjusted to reduce the proportion of the measured temperatures collected at these temperature measurement points in the subsequent system performance analysis.

[0081] S40, performing a temperature analysis of the target device based on a temperature sequence measured at each temperature measurement point in a plurality of monitoring cycles and a temperature monitoring weight corresponding to each monitoring cycle, wherein the temperature monitoring weight is used to indicate the importance of measuring the temperature at the corresponding temperature measurement point in the temperature analysis.

[0082] In this embodiment, after determining the measured temperature sequence of each temperature measurement point in multiple monitoring cycles and the temperature monitoring weight corresponding to each monitoring cycle, the terminal device can analyze the temperature of the target device based on the measured temperature sequence of each temperature measurement point in multiple monitoring cycles and the temperature monitoring weight corresponding to each monitoring cycle. In this way, the terminal device can protect the motor from damage, optimize motor performance, diagnose and warn faults, and improve the level of operation monitoring.

[0083] In this way, in the embodiment of the present application, each temperature measurement point on the target device can be obtained, and then the measured temperature sequence at the temperature measurement point can be collected during the monitoring cycle. Based on the measured temperature sequence at each temperature measurement point, a temperature anomaly analysis is performed to determine the abnormal temperature index parameter of each temperature measurement point during the monitoring cycle. Based on the abnormal temperature index parameter at each temperature measurement point, the temperature monitoring weight of at least some temperature measurement points in the next monitoring cycle is adjusted. In this way, the temperature of the target device is analyzed based on the measured temperature sequence of each temperature measurement point in multiple monitoring cycles and the temperature monitoring weight corresponding to each monitoring cycle. It can be seen that compared with the existing technology that solves the problem of characterization distortion caused by the limited number of measurement points and inherent data errors in the temperature monitoring of existing equipment, the present application can arrange measurement points on the target device through a thermal-mechanical coupling simulation model and optimize the temperature monitoring weight corresponding to the temperature measurement point based on the abnormality of the measured temperature sequence collected at the temperature measurement point. This can not only achieve autonomous optimization of the layout of the temperature measurement points, ensure the scientific nature of the temperature measurement point layout, but also optimize the collected measured temperatures, thereby significantly improving the precision and accuracy of the monitoring data in representing the actual temperature state of the equipment, thereby effectively optimizing equipment performance.

[0084] In one embodiment, the steps of determining each temperature measurement point on the target device described in this application are as follows: Figure 2 As shown, this may include:

[0085] S50, obtaining operating parameters of the target device under at least one operating condition;

[0086] S60, obtaining temperature distribution information of the target device according to the operating parameters, material parameters, and structural parameters of the target device through a thermal-mechanical coupling simulation model, wherein the temperature distribution information includes temperature distribution information of an electromagnetic component of the target device;

[0087] S70: Determine temperature measurement points on the target device according to the temperature distribution information.

[0088] In this embodiment, the terminal device can obtain the operating parameters of the target device under different typical operating conditions, such as electrical parameters, mechanical parameters (such as the speed, vibration and swing of the turbine generator), hydraulic parameters (net head, flow, guide vane opening, etc.), and thermal parameters (such as the temperature of components such as rotor windings, iron cores, bearings, etc., temperature rise limits, etc.).

[0089] The operating condition parameters, rotor material parameters (such as material properties), and structural parameters (such as the rotor's geometric structure, etc.) can then be input into a pre-built thermal-mechanical coupling simulation model to obtain the temperature distribution information of the target device predicted by the thermal-mechanical coupling simulation model. The temperature distribution information may include the temperature conditions at different locations inside and on the surface of the rotor during operation. For example, the temperature distribution information can describe the temperature changes at different locations of the rotor (such as the rotor winding, iron core, magnetic poles, etc.), as well as the temperature change trends over time.

[0090] The construction process of the thermal-mechanical coupling simulation model in this embodiment can refer to the construction process based on the existing finite element analysis software, and will not be repeated here.

[0091] Then, the terminal device can obtain each temperature measurement point on the target device according to the temperature distribution information of the rotor.

[0092] In one embodiment, in the above S70, "determining each temperature measurement point on the target device according to the temperature distribution information", such as Figure 3 As shown, this may include:

[0093] S701: Divide the target device into temperature monitoring areas where temperature measurement points are to be arranged based on the temperature distribution information; wherein the temperature monitoring areas include a first area, a second area, a third area, and a fourth area; the temperature of the measurement points in the first area is greater than a preset temperature threshold; the temperature change rate of the measured temperature in the second area is greater than a preset change rate threshold; the third area is other monitoring areas on the target device other than the first and second areas; and the fourth area is an overlapping area between the first and second areas;

[0094] S702: Arrange temperature measurement points on the target device according to the temperature monitoring area.

[0095] In this embodiment, after obtaining the temperature distribution information predicted by the thermal-mechanical coupling simulation model, the terminal device can divide the temperature monitoring area on the target device into temperature monitoring areas where temperature measurement points are to be arranged according to the temperature distribution information.

[0096] Specifically, for example, by running a simulation on the thermal-mechanical coupling simulation model, temperature distribution information such as the rotor winding and core temperature distribution can be obtained, and then the areas showing higher temperature rise under different typical working conditions can be defined as high-temperature areas (i.e., the first area in this embodiment), and the areas with faster temperature changes can be defined as high-gradient areas (i.e., the second area in this embodiment). The areas to be monitored other than the high-temperature areas and the high-gradient areas are defined as the remaining monitoring areas (i.e., the third area in this embodiment), and the area where the first area and the second area overlap can be defined as the fourth area.

[0097] For example, in this embodiment, the area with a temperature greater than 80°C can be set as a high temperature area. The area with a gradient of >5°C / m is defined as a high gradient area.

[0098] It is understandable that, since the high temperature area and the high gradient area may overlap, in this embodiment, the overlapping area can be set as the fourth area, which is actually the key area of ​​focus.

[0099] Furthermore, the terminal device can arrange multiple temperature measurement points on the target device according to the temperature monitoring area.

[0100] In a specific embodiment, in S702 above, “arranging temperature measurement points on the target device according to the temperature monitoring area” may include:

[0101] Step a, obtaining the position correlation between the initial temperature measurement points arranged in the temperature monitoring area according to the measured temperature sequence of the initial temperature measurement points;

[0102] Step b: adjusting the distances between the initial temperature measuring points according to the target area where the initial temperature measuring points are located, so that the adjusted position correlations between the initial temperature measuring points satisfy the position correlation range corresponding to the target area;

[0103] The target area includes any one of the first area, the second area, the third area and the fourth area; and the first area, the second area, the third area and the fourth area have corresponding position correlation ranges.

[0104] In this embodiment, the initial temperature measurement points arranged in the temperature monitoring area can be predicted based on the above-mentioned thermal-mechanical coupling simulation model, and the terminal device can calculate the measured temperature sequence collected at the initial temperature measurement points to obtain the position correlation between each of the initial temperature measurement points.

[0105] Specifically, for example, position correlation .

[0106] in, is the correlation coefficient between measuring point i and measuring point j; is the temperature sequence of measuring point i (time is from k to k+N), The average value of the temperature series at measurement point i.

[0107] On this basis, the terminal device can adjust the distance between the initial temperature measurement points according to the target area where the initial temperature measurement points are located, so that the position correlation between the adjusted initial temperature measurement points meets the position correlation range corresponding to the target area.

[0108] The target area in this embodiment may include any one of the first area, the second area, the third area and the fourth area, so that the position correlation between the temperature measurement points of each target area is within the corresponding position correlation range.

[0109] Specifically, for example, the terminal device can define the high temperature point in the target area as the position of the measuring point i (ie, the initial temperature measuring point in this embodiment), and adjust the distance between the measuring point j and the measuring point i. , making Within the corresponding position correlation range.

[0110] For temperature measurement points that are both in the high temperature zone and the high gradient zone, there should be a certain correlation between the temperature measurement points. Optionally, .

[0111] In high gradient areas, the temperature measurement points should be arranged more densely. Optionally, the recommended spacing between adjacent measurement points is ≤0.5m.

[0112] In the rest of the monitoring area, the measurement points should have a lower correlation. .

[0113] In one embodiment, the effectiveness of the optimized measurement point layout solution can be verified through experiments, and the measurement point layout can be further optimized based on the experimental verification results.

[0114] Therefore, this embodiment can adjust the positions of temperature measurement points arranged based on the traditional method according to the simulation analysis results to ensure information coverage of key areas and avoid subsequent diagnostic errors that may be caused by inaccurate point selection: 1) The measurement points cover high-temperature areas and high-gradient areas as the main monitoring points, and make the measurement points have a certain correlation to ensure a certain effective information margin; 2) The high-gradient areas are densely arranged; 3) Several measurement points are arranged in the remaining monitoring areas to make the measurement points have low correlation to avoid mutual interference between the measurement points and waste of sensor resources.

[0115] In one embodiment, before the above S20 of “performing temperature anomaly analysis based on the measured temperature sequence at the temperature measuring point to determine abnormal temperature indicator parameters of the temperature measuring point within the monitoring period”, the following steps may also be included:

[0116] S80, obtaining a temperature change trend at each temperature measurement point based on the measured temperature sequence at each temperature measurement point, and triggering a step of performing a temperature anomaly analysis based on the measured temperature sequence at each temperature measurement point when the temperature change trend and / or the measured temperature of at least one temperature measurement point meets a preset first anomaly condition; and / or

[0117] S90, obtaining, based on the measured temperature sequence at each of the temperature measurement points and a historical measured temperature sequence under the same operating conditions, a temperature difference between the measured temperature sequence and a temperature average of the historical measured temperature sequence, and triggering a step of performing a temperature anomaly analysis based on the measured temperature sequence at each of the temperature measurement points if the temperature difference meets a preset second anomaly condition; and / or

[0118] S100, obtaining target operating parameters of the target device, and triggering a step of performing temperature anomaly analysis based on the measured temperature sequence at each of the temperature measurement points when the correlation between the target operating parameters and the temperature change trend meets a preset third abnormality condition.

[0119] In this embodiment, the terminal device may obtain a temperature change trend at each temperature measurement point based on a measured temperature sequence at the temperature measurement point, wherein the temperature change trend may include changes in the measured temperatures collected at the temperature measurement point over a period of time.

[0120] Based on the temperature variation trend, it can be determined whether the measured temperature sequence at the temperature measurement point meets a preset first abnormal condition. The first abnormal condition can include at least a sudden increase in the temperature at the measurement point to or above the upper limit of the range, a sudden drop to the ambient temperature value, or a sharp change up or down, and can also include a temperature difference with adjacent temperatures exceeding a preset range. Thus, if it is detected that the temperature variation trend of at least one temperature measurement point shows a sudden increase in the temperature at the measurement point to or above the upper limit of the range, a sudden drop to the ambient temperature value, or a sharp change up or down, and / or if it is detected that the temperature difference with adjacent temperatures exceeds a preset range, a temperature abnormality analysis step based on the measured temperature sequence at each temperature measurement point can be triggered.

[0121] In addition, the terminal device can also obtain the temperature difference between the measured temperature sequence and the temperature average of the historical measured temperature sequence based on the measured temperature sequence at each temperature measurement point and the historical measured temperature sequence under the same working conditions, and detect whether the temperature difference meets the preset second abnormal condition.

[0122] The preset second abnormal condition may include a temperature difference between a measured temperature in a measured temperature sequence and a temperature average of a historical measured temperature sequence under the same operating conditions exceeding a preset difference range. For example, the preset difference range may be ±15% of the temperature average of a historical measured temperature sequence under the same operating conditions. In this case, if it is detected that the temperature difference between a measured temperature in a measured temperature sequence and a temperature average of a historical measured temperature sequence exceeds the preset difference range, a temperature anomaly analysis step based on the measured temperature sequence at each temperature measurement point may be triggered.

[0123] In a specific embodiment, under steady-state operating conditions, if the temperature of a measuring point deviates from the historical average value of the same operating conditions by a certain range, the corresponding temperature measuring point can be determined to be abnormal, and a step of performing temperature anomaly analysis based on the measured temperature sequence at each temperature measuring point can be triggered. For example, this embodiment can be set to determine that the corresponding temperature measuring point is abnormal when the measured temperature in the above-mentioned measured temperature sequence deviates from the historical temperature average value of the same operating conditions by ±15%. Under non-steady-state operating conditions, if the measured temperature sequence of a certain temperature measuring point is fixed for a long time (for example, for a period of more than 10 minutes), the corresponding temperature measuring point can be determined to be abnormal.

[0124] In addition, the terminal device can also obtain the target operating parameters of the target device, such as the unit excitation current, active power and other key operating parameters.

[0125] Then, the correlation between the target operating condition parameters and the above temperature change trend can be obtained, such as whether there is a strong correlation, weak correlation or anti-correlation between the two.

[0126] Furthermore, the terminal device may determine whether the correlation between the target operating parameter and the temperature change trend meets a preset third abnormal condition, wherein the third abnormal condition may include that the correlation between the target operating parameter and the temperature change trend is weakly correlated or anti-correlated.

[0127] In this way, if the terminal device detects that the correlation between the target operating parameter and the temperature change trend is weak or anti-correlated, it can trigger the step of performing temperature anomaly analysis based on the measured temperature sequence at each temperature measurement point.

[0128] It is understood that in motor operation monitoring, by simultaneously considering multiple key parameters (such as excitation current, active power, rotor temperature, etc.), it is possible to more accurately determine whether the system is abnormal. If there is a weak correlation between the two, it means that the relationship between the changes in these parameters is not obvious. For example, changes in excitation current or active power have little impact on rotor temperature, or changes in rotor temperature cannot be well explained by these parameters. If there is an anti-correlation between the two, it means that these parameters show opposite trends of change. In this embodiment, when a weak correlation or anti-correlation is detected between the two, it can be determined that the measured temperature collected at the temperature measurement point is abnormal.

[0129] In one embodiment, in the above S20, “performing temperature anomaly analysis based on the measured temperature sequence at the temperature measurement point to determine an abnormal temperature indicator parameter of the temperature measurement point within the monitoring period” may include:

[0130] S201, performing a temperature anomaly analysis based on the measured temperature sequence at each of the temperature measuring points, counting the number of times the temperature change trend and / or measured temperature meets a preset first anomaly condition, the number of times the temperature difference meets a preset second anomaly condition, and / or the number of times the correlation between the target operating condition parameter and the temperature change trend meets a preset third anomaly condition, at the temperature measuring point, to obtain a total number of anomalies occurring at each of the temperature measuring points;

[0131] S202: Setting the total number of times an abnormality occurs at each of the temperature measurement points as an abnormal temperature indicator parameter within the monitoring period.

[0132] In this embodiment, the terminal device can comprehensively monitor the abnormal conditions of the measured temperature sequence collected at each temperature measurement point. In combination with the above description, the number of times the temperature change trend and / or the measured temperature meets the preset first abnormal condition, the number of times the temperature difference meets the preset second abnormal condition, and / or the number of times the correlation between the target operating condition parameter and the temperature change trend meets the preset third abnormal condition at the temperature measurement point is counted, and the total number of abnormalities occurring at each temperature measurement point is accumulated.

[0133] The total number of abnormalities occurring at the temperature measurement points can then be set as the abnormal temperature indicator parameter within the monitoring period.

[0134] In this embodiment, setting the total number of abnormalities occurring at the temperature measurement points as the abnormal temperature indicator parameter within the monitoring period is only one possible implementation method, and the type of the abnormal temperature indicator parameter is not specifically limited.

[0135] In one embodiment, in the above S30, “adjusting the temperature monitoring weights of at least some of the temperature measurement points in the next monitoring cycle based on the abnormal temperature indicator parameters at the temperature measurement points” may include:

[0136] S301, sorting the plurality of temperature measurement points according to the total number of times an anomaly occurs at each temperature measurement point;

[0137] S302, determining at least one temperature measuring point from the sorted plurality of temperature measuring points where a total number of abnormalities is greater than a preset number, and adjusting a temperature monitoring weight corresponding to the at least one temperature measuring point in a next monitoring cycle so that the temperature monitoring weight corresponding to the at least one temperature measuring point is reduced.

[0138] In this embodiment, if the total number of abnormalities occurring at each temperature measurement point is set as the abnormal temperature indicator parameter within the monitoring period, the multiple temperature measurement points can be sorted according to the total number of abnormalities occurring at each temperature measurement point.

[0139] In this way, at least one temperature measurement point in which the total number of abnormalities is greater than the preset number can be determined from the sorted multiple temperature measurement points, and the temperature monitoring weight corresponding to the temperature measurement point can be adjusted in the next monitoring cycle so that its temperature monitoring weight is reduced, thereby reducing the impact of the abnormal measurement temperature on subsequent rotor analysis.

[0140] It can be seen that in this embodiment, after the temperature measurement points are arranged, it is still possible to monitor whether there are abnormalities in the measured temperatures at the temperature measurement points, flexibly adjust the weights of the collected measured temperatures, sort them according to indicators such as the number of abnormal records, and reduce the weight of the abnormal measurement point data sequence in subsequent analysis, thereby protecting the motor from damage, optimizing motor performance, fault diagnosis and early warning, and improving the level of operation monitoring.

[0141] In one embodiment, before the above S20, "performing temperature anomaly analysis based on the measured temperature sequence at the temperature measuring point to determine the abnormal temperature index parameter of the temperature measuring point within the monitoring period", the following steps may also be included:

[0142] S110, obtaining actual operating conditions, load status, and environmental information of the target device;

[0143] S120, adjusting operating parameters of a sensor at a temperature measurement point according to at least one of the actual operating condition, the load state, and environmental information of the environment, to obtain a measured temperature sequence at the temperature measurement point, wherein the operating parameters include a temperature sampling frequency and / or a sampling sensitivity of the target device.

[0144] In this embodiment, the terminal device can automatically adjust the sampling frequency and sensitivity of the measuring point according to the actual operating conditions of the rotor (such as speed, load) and environmental conditions (such as temperature, humidity), and can increase the sampling frequency and sensitivity during high-load operation, and reduce the sampling frequency during low-load operation to save energy.

[0145] In another embodiment, this embodiment can also conduct in-depth mining of historical measurement temperature sequences and real-time measurement temperature sequences of redundant measurement points based on big data analysis, establish a measurement point fault feature model, and automatically issue a fault warning and provide specific repair suggestions when abnormal fluctuations in the measurement temperature sequence at the temperature measurement point are detected.

[0146] In general, the temperature monitoring method in the embodiment of the present application may at least include the following steps:

[0147] (1) Thermal-mechanical coupling simulation analysis: Based on the thermal-mechanical coupling simulation analysis of the rotor under different typical operating conditions, the temperature distribution of the rotor winding and core is obtained. The areas showing high temperature rise under different typical operating conditions are divided into three categories: high temperature area, high gradient area, and other monitoring areas;

[0148] (2) Optimization of measurement point layout: Based on the simulation analysis results, the positions of temperature measurement points arranged based on the traditional method are adjusted so that: the measurement points cover high temperature areas and high gradient areas, and there is a certain correlation between the measurement points, which serve as the main monitoring points; the high gradient areas are densely arranged; and several measurement points are arranged in the remaining monitoring areas so that there is a low correlation between the measurement points. This avoids mutual interference between measurement points and waste of sensor resources, as well as subsequent diagnostic errors that may be caused by inaccurate point selection;

[0149] (3) Data acquisition, used to collect temperature data of each measuring point in real time;

[0150] (4) Intelligent verification: real-time comparison and verification of collected temperature data, identification of abnormal measurement points and data compensation;

[0151] (5) Dynamic calibration, automatically adjusting the monitoring parameters of the measuring points according to the operating conditions and environmental conditions;

[0152] (6) Fault warning: Based on big data analysis, deep mining of measurement point data is carried out to warn of measurement point failures in advance and provide repair suggestions.

[0153] In this way, the present application can realize the turbine generator rotor temperature monitoring and redundant measurement point self-diagnosis system based on thermal-mechanical coupling simulation, realize scientific point selection before the unit is put into operation, derive the rotor temperature measurement point layout plan, avoid sensor redundancy, and dynamically adjust the measurement point data usage strategy according to the measurement point status after the unit is put into operation to improve the effectiveness of the analysis results.

[0154] Accordingly, the embodiment of the present application also provides a temperature monitoring device, such as Figure 4 As shown, the device may include:

[0155] An acquisition module 1001 is configured to acquire, for each temperature measurement point on the target device, a series of measured temperatures at the temperature measurement point within a monitoring period; wherein the plurality of temperature measurement points are determined by a thermal-mechanical coupling simulation model based on the device temperature distribution of the target device under various operating conditions;

[0156] A determination module 1002 is configured to perform temperature anomaly analysis based on the measured temperature sequence at the temperature measurement point, and determine an abnormal temperature indicator parameter of the temperature measurement point within the monitoring period;

[0157] An adjusting module 1003 is configured to adjust the temperature monitoring weights of at least some of the temperature measuring points in a next monitoring period based on the abnormal temperature indicator parameters at the temperature measuring points;

[0158] The analysis module 1004 is used to perform temperature analysis on the target device based on the temperature sequence measured at each temperature measurement point in multiple monitoring cycles and the temperature monitoring weight corresponding to each monitoring cycle, wherein the temperature monitoring weight is used to indicate the importance of measuring the temperature at the corresponding temperature measurement point in the temperature analysis.

[0159] Optionally, the temperature monitoring device in the present application further includes:

[0160] A parameter acquisition module, configured to acquire operating condition parameters of the target device under at least one operating condition;

[0161] a simulation module, configured to obtain temperature distribution information of the target device based on the operating condition parameters, material parameters, and structural parameters of the target device through a thermal-mechanical coupling simulation model, wherein the temperature distribution information includes temperature distribution information of electromagnetic components of the target device;

[0162] The temperature measurement point determination module is used to determine each temperature measurement point on the target device according to the temperature distribution information.

[0163] Optionally, the temperature measurement point determination module is further configured to:

[0164] Divide the target device into temperature monitoring areas where temperature measurement points are to be arranged based on the temperature distribution information; wherein the temperature monitoring areas include a first area, a second area, a third area, and a fourth area; the temperature of the measurement points in the first area is greater than a preset temperature threshold; the temperature change rate of the measured temperature in the second area is greater than a preset change rate threshold; the third area is other monitoring areas on the target device except the first and second areas; and the fourth area is an overlapping area between the first and second areas;

[0165] Arrange temperature measurement points on the target device according to the temperature monitoring area.

[0166] Optionally, the temperature measurement point determination module is further configured to: obtain position correlations between the initial temperature measurement points arranged in the temperature monitoring area according to a measured temperature sequence of the initial temperature measurement points;

[0167] Adjusting the distances between the initial temperature measurement points according to the target area where the initial temperature measurement points are located so that the adjusted position correlations between the initial temperature measurement points satisfy a position correlation range corresponding to the target area;

[0168] The target area includes any one of the first area, the second area, the third area and the fourth area; and the first area, the second area, the third area and the fourth area have corresponding position correlation ranges.

[0169] Optionally, the temperature monitoring device in the present application further includes:

[0170] a first triggering module configured to obtain a temperature change trend at each temperature measuring point based on a measured temperature sequence at each temperature measuring point, and trigger a step of performing a temperature anomaly analysis based on the measured temperature sequence at each temperature measuring point when the temperature change trend and / or the measured temperature of at least one temperature measuring point meets a preset first abnormality condition; and / or

[0171] a second triggering module, configured to obtain, based on the measured temperature sequence at each of the temperature measurement points and a historical measured temperature sequence under the same operating conditions, a temperature difference between the measured temperature sequence and a temperature mean of the historical measured temperature sequence, and trigger a step of performing a temperature anomaly analysis based on the measured temperature sequence at each of the temperature measurement points if the temperature difference meets a preset second anomaly condition; and / or

[0172] a third trigger module, configured to obtain target operating parameters of the target device, and trigger a step of performing temperature anomaly analysis based on the measured temperature sequence at each of the temperature measurement points when the correlation between the target operating parameters and the temperature change trend meets a preset third abnormal condition.

[0173] Optionally, the determining module 1002 is further configured to:

[0174] performing a temperature anomaly analysis based on the measured temperature sequence at each of the temperature measuring points, counting the number of times the temperature change trend and / or the measured temperature meets a preset first anomaly condition, the number of times the temperature difference meets a preset second anomaly condition, and / or the number of times the correlation between the target operating condition parameter and the temperature change trend meets a preset third anomaly condition, at the temperature measuring point, to obtain a total number of anomalies occurring at each of the temperature measuring points;

[0175] The total number of times an abnormality occurs at each of the temperature measurement points is set as the abnormal temperature indicator parameter within the monitoring period.

[0176] Optionally, the adjustment module 1003 is further configured to:

[0177] sorting the plurality of temperature measurement points according to the total number of times an anomaly occurs at each of the temperature measurement points;

[0178] Determine at least one temperature measurement point from the sorted plurality of temperature measurement points where the total number of abnormalities is greater than a preset number, and adjust the temperature monitoring weight corresponding to the at least one temperature measurement point in the next monitoring cycle so that the temperature monitoring weight corresponding to the at least one temperature measurement point is reduced.

[0179] Optionally, the temperature monitoring module in this application is also used to:

[0180] A parameter acquisition module is used to obtain the actual operating conditions, load status and environmental information of the target device;

[0181] An adjustment module is used to adjust the operating parameters of the sensor at the temperature measurement point according to at least one of the actual operating conditions, load status and environmental information of the environment, wherein the operating parameters include the temperature sampling frequency and / or sampling sensitivity of the target device.

[0182] The specific implementation of the above operations can be found in the previous embodiments and will not be repeated here.

[0183] Accordingly, the embodiment of the present application further provides an electronic device, such as Figure 5 As shown, Figure 5 Schematic diagram of the structure of an electronic device provided in an embodiment of the present application. The electronic device 1100 includes a processor 1101 having one or more processing cores, a memory 1102 having one or more computer-readable storage media, and a computer program stored in the memory 1102 and executable on the processor. The processor 1101 is electrically connected to the memory 1102. Those skilled in the art will understand that the vehicle structure shown in the figure does not constitute a limitation of the vehicle, and may include more or fewer components than shown, or combine certain components, or arrange the components differently.

[0184] Processor 1101 is the control center of electronic device 1100. It connects the various components of electronic device 1100 using various interfaces and lines. It executes various functions of electronic device 1100 and processes data by running or loading software programs and / or units stored in memory 1102 and calling data stored in memory 1102, thereby monitoring electronic device 1100 as a whole. Processor 1101 can be a central processing unit (CPU), a graphics processing unit (GPU), a network processor (NP), etc., and can implement or execute the various methods, steps, and logic blocks disclosed in the embodiments of this application.

[0185] In the embodiment of the present application, the processor 1101 in the electronic device 1100 loads instructions corresponding to one or more application processes into the memory 1102 according to the following steps, and the processor 1101 runs the application stored in the memory 1102 to implement various functions, such as:

[0186] For each temperature measurement point on the target device, a measured temperature sequence at the temperature measurement point is collected during a monitoring period; wherein the plurality of temperature measurement points are determined by a thermal-mechanical coupling simulation model based on the device temperature distribution of the target device under various operating conditions;

[0187] performing temperature anomaly analysis based on the measured temperature sequence at the temperature measuring point to determine abnormal temperature index parameters of the temperature measuring point within the monitoring period;

[0188] Adjusting the temperature monitoring weights of at least some of the temperature measuring points in the next monitoring period based on the abnormal temperature indicator parameters at the temperature measuring points;

[0189] The temperature analysis of the target device is performed based on the temperature sequence measured at each temperature measurement point in multiple monitoring cycles and the temperature monitoring weight corresponding to each monitoring cycle. The temperature monitoring weight is used to indicate the importance of measuring the temperature at the corresponding temperature measurement point in the temperature analysis.

[0190] The specific implementation of the above operations can be found in the previous embodiments and will not be repeated here.

[0191] Optional, such as Figure 5As shown, the electronic device 1100 further includes: a touch screen 1103, a radio frequency circuit 1104, an audio circuit 1105, an input unit 1106, and a power supply 1107. Among them, the processor 1101 is electrically connected to the touch screen 1103, the radio frequency circuit 1104, the audio circuit 1105, the input unit 1106, and the power supply 1107 respectively. Those skilled in the art will understand that Figure 5 The vehicle structure shown in the figure does not constitute a limitation to the vehicle, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0192] The touchscreen display 1103 can be used to display a graphical user interface (GUI) and receive user-generated operational commands generated by the GUI. The touchscreen display 1103 may include a display panel and a touch panel. The display panel can be used to display information input by or provided to the user, as well as various graphical user interfaces (GUIs) of the vehicle. These GUIs can be composed of graphics, text, icons, videos, or any combination thereof. Optionally, the display panel can be configured using a liquid crystal display (LCD), an organic light-emitting diode (OLED), or other form. The touch panel can be used to collect user touch operations on or near it (e.g., operations performed on or near the touch panel using a finger, stylus, or any other suitable object or accessory), generate corresponding operational commands, and execute corresponding programs in response to the operational commands. Optionally, the touch panel can include a touch display system and a touch controller. Among them, the touch display system detects the user's touch direction, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch display system, converts it into touch point coordinates, and then sends it to the processor 1101, and can receive commands sent by the processor 1101 and execute them. The touch panel can cover the display panel. When the touch panel detects a touch operation on or near it, it is transmitted to the processor 1101 to determine the type of touch event. The processor 1101 then provides a corresponding visual output on the display panel according to the type of touch event. In an embodiment of the present application, the touch panel and the display panel can be integrated into the touch display screen 1103 to realize input and output functions. However, in some embodiments, the touch panel and the touch panel can be used as two independent components to realize input and output functions. That is, the touch display screen 1103 can also be used as part of the input unit 1106 to realize the input function.

[0193] The RF circuit 1104 may be used to transmit and receive RF signals, thereby establishing wireless communication with network devices or other vehicles through wireless communication, and transmitting and receiving signals with network devices or other vehicles.

[0194] Audio circuit 1105 can be used to provide an audio interface between the user and the vehicle through a speaker and microphone. Audio circuit 1105 converts received audio data into electrical signals and transmits them to the speaker, which then converts them into sound signals for output. The microphone, on the other hand, converts collected sound signals into electrical signals, which are received by audio circuit 1105 and converted into audio data. This audio data is then output to processor 1101 for processing, then transmitted via RF circuit 1104 to, for example, another vehicle, or to memory 1102 for further processing. Audio circuit 1105 may also include an earphone jack to allow communication between an external headset and the vehicle.

[0195] The input unit 1106 may be configured to receive input numbers, character information, or user feature information (such as fingerprint, iris, or facial information), and generate keyboard, mouse, joystick, optical, or trackball signal input related to user settings and function control.

[0196] Power supply 1107 is used to supply power to various components of electronic device 1100. Optionally, power supply 1107 can be logically connected to processor 1101 via a power management device, thereby enabling the power management device to manage charging, discharging, and power consumption. Power supply 1107 can also include one or more DC or AC power supplies, a recharging device, a power failure detection circuit, a power converter or inverter, a power status indicator, and other arbitrary components.

[0197] although Figure 5 Not shown, the electronic device 1100 may further include a camera, a sensor, a wireless fidelity module, a Bluetooth module, etc., which will not be described in detail here.

[0198] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0199] Those skilled in the art will appreciate that all or part of the steps in the various methods of the above embodiments may be accomplished by instructions, or by controlling related hardware through instructions. The instructions may be stored in a computer-readable storage medium and loaded and executed by a processor.

[0200] To this end, an embodiment of the present application provides a computer-readable storage medium storing a plurality of computer programs. The computer programs can be loaded by a processor to execute any one of the temperature monitoring methods provided in the embodiments of the present application. The computer programs can execute the following steps of the temperature monitoring method:

[0201] For each temperature measurement point on the target device, a measured temperature sequence at the temperature measurement point is collected during a monitoring period; wherein the plurality of temperature measurement points are determined by a thermal-mechanical coupling simulation model based on the device temperature distribution of the target device under various operating conditions;

[0202] performing temperature anomaly analysis based on the measured temperature sequence at the temperature measuring point to determine abnormal temperature index parameters of the temperature measuring point within the monitoring period;

[0203] Adjusting the temperature monitoring weights of at least some of the temperature measuring points in the next monitoring period based on the abnormal temperature indicator parameters at the temperature measuring points;

[0204] The temperature analysis of the target device is performed based on the temperature sequence measured at each temperature measurement point in multiple monitoring cycles and the temperature monitoring weight corresponding to each monitoring cycle. The temperature monitoring weight is used to indicate the importance of measuring the temperature at the corresponding temperature measurement point in the temperature analysis.

[0205] The computer-readable storage medium may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0206] Since the computer program stored in the computer-readable storage medium can execute any temperature monitoring method provided in the embodiments of the present application, the beneficial effects that can be achieved by any temperature monitoring method provided in the embodiments of the present application can be achieved. Please refer to the previous embodiments for details and will not be repeated here.

[0207] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware. Furthermore, the present application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0208] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0209] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0210] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0211] In a typical configuration, a computing device includes one or more processors (CPUs), input / output interfaces, network interfaces, and memory.

[0212] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0213] Computer-readable media includes both permanent and non-permanent, removable and non-removable media, and can be implemented using any method or technology for information storage. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change RAM (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic disk storage or other magnetic storage devices, or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer-readable media does not include transitory computer-readable media, such as modulated communication signals and carrier waves.

[0214] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0215] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0216] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0217] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A temperature monitoring method, characterized in that: The method is applied to a target device and includes: Divide the target device into temperature monitoring areas where temperature measurement points are to be arranged based on the temperature distribution information of the target device; wherein the temperature monitoring areas include a first area, a second area, a third area, and a fourth area; the temperature of the measurement points in the first area is greater than a preset temperature threshold; the temperature change rate of the measured temperature in the second area is greater than a preset change rate threshold; the third area is other monitoring areas on the target device except the first area and the second area; and the fourth area is an overlapping area between the first area and the second area; Arranging temperature measurement points on the target device according to the temperature monitoring area; For each temperature measurement point on the target device, a measured temperature sequence at the temperature measurement point is collected during a monitoring period; wherein the plurality of temperature measurement points are determined by a thermal-mechanical coupling simulation model based on the device temperature distribution of the target device under various operating conditions; performing temperature anomaly analysis based on the measured temperature sequence at the temperature measuring point to determine abnormal temperature index parameters of the temperature measuring point within the monitoring period; Adjusting the temperature monitoring weights of at least some of the temperature measuring points in the next monitoring period based on the abnormal temperature indicator parameters at the temperature measuring points; The temperature analysis of the target device is performed based on the temperature sequence measured at each temperature measurement point in multiple monitoring cycles and the temperature monitoring weight corresponding to each monitoring cycle. The temperature monitoring weight is used to indicate the importance of measuring the temperature at the corresponding temperature measurement point in the temperature analysis.

2. The temperature monitoring method according to claim 1, characterized in that: Before dividing the temperature monitoring area on the target device to be arranged with temperature measurement points according to the temperature distribution information of the target device, the method further includes: Obtaining operating condition parameters of the target device under at least one operating condition; The temperature distribution information of the target device is obtained through a thermal-mechanical coupling simulation model according to the operating condition parameters, material parameters and structural parameters of the target device, wherein the temperature distribution information includes temperature distribution information of the electromagnetic components of the target device.

3. The temperature monitoring method according to claim 1, wherein: Arranging temperature measurement points on the target device according to the temperature monitoring area includes: Obtaining positional correlations between the initial temperature measurement points arranged in the temperature monitoring area according to a measured temperature sequence of the initial temperature measurement points; Adjusting the distances between the initial temperature measurement points according to the target area where the initial temperature measurement points are located so that the adjusted position correlations between the initial temperature measurement points satisfy a position correlation range corresponding to the target area; The target area includes any one of the first area, the second area, the third area and the fourth area; and the first area, the second area, the third area and the fourth area have corresponding position correlation ranges.

4. The temperature monitoring method according to any one of claims 1 to 3, characterized in that: Before performing temperature anomaly analysis based on the measured temperature sequence at the temperature measuring point and determining the abnormal temperature indicator parameter of the temperature measuring point within the monitoring period, the method further includes: obtaining, based on the measured temperature sequence at each of the temperature measurement points, a temperature change trend at the temperature measurement points, and triggering a step of performing a temperature anomaly analysis based on the measured temperature sequence at each of the temperature measurement points when the temperature change trend and / or the measured temperature of at least one of the temperature measurement points meets a preset first abnormality condition; and / or obtaining, based on the measured temperature sequence at each of the temperature measurement points and a historical measured temperature sequence under the same operating conditions, a temperature difference between the measured temperature sequence and a temperature average of the historical measured temperature sequence, and triggering a step of performing a temperature anomaly analysis based on the measured temperature sequence at each of the temperature measurement points when the temperature difference meets a preset second anomaly condition; and / or Obtain target operating parameters of the target device, and trigger a step of performing temperature anomaly analysis based on the measured temperature sequence at each of the temperature measurement points when the correlation between the target operating parameters and the temperature change trend meets a preset third abnormal condition.

5. The temperature monitoring method according to claim 4, characterized in that: The performing temperature anomaly analysis based on the measured temperature sequence at the temperature measuring point to determine the abnormal temperature index parameter of the temperature measuring point within the monitoring period includes: performing a temperature anomaly analysis based on the measured temperature sequence at each of the temperature measuring points, counting the number of times the temperature change trend and / or the measured temperature meets a preset first anomaly condition, the number of times the temperature difference meets a preset second anomaly condition, and / or the number of times the correlation between the target operating condition parameter and the temperature change trend meets a preset third anomaly condition, at the temperature measuring point, to obtain a total number of anomalies occurring at each of the temperature measuring points; The total number of times an abnormality occurs at each of the temperature measurement points is set as the abnormal temperature indicator parameter within the monitoring period.

6. The temperature monitoring method according to claim 5, characterized in that: The adjusting, based on the abnormal temperature indicator parameters at the temperature measuring points, the temperature monitoring weights of at least some of the temperature measuring points in the next monitoring period includes: sorting the plurality of temperature measurement points according to the total number of times an anomaly occurs at each of the temperature measurement points; Determine at least one temperature measurement point from the sorted plurality of temperature measurement points where the total number of abnormalities is greater than a preset number, and adjust the temperature monitoring weight corresponding to the at least one temperature measurement point in the next monitoring cycle so that the temperature monitoring weight corresponding to the at least one temperature measurement point is reduced.

7. The temperature monitoring method according to claim 1, characterized in that: The method further comprises: Obtaining actual operating conditions, load status, and environmental information of the target device; According to at least one of the actual operating conditions, load status, and environmental information of the environment, the operating parameters of the sensor at the temperature measurement point are adjusted, wherein the operating parameters include the temperature sampling frequency and / or sampling sensitivity of the target device.

8. A temperature monitoring device, characterized in that: Applied to a target device, the temperature monitoring device comprises: an acquisition module, configured to divide the target device into temperature monitoring areas where temperature measurement points are to be arranged based on the temperature distribution information of the target device; wherein the temperature monitoring areas include a first area, a second area, a third area, and a fourth area; the temperature of the measurement points in the first area is greater than a preset temperature threshold; the temperature change rate of the measured temperature in the second area is greater than a preset change rate threshold; the third area is other monitoring areas on the target device other than the first area and the second area; and the fourth area is an overlapping area between the first area and the second area; Arranging temperature measurement points on the target device according to the temperature monitoring area; The acquisition module is further configured to acquire, for each temperature measurement point on the target device, a series of measured temperatures at the temperature measurement point within a monitoring period; wherein the plurality of temperature measurement points are determined by a thermal-mechanical coupling simulation model based on the device temperature distribution of the target device under various operating conditions; a determination module, configured to perform temperature anomaly analysis based on the measured temperature sequence at the temperature measurement point, and determine an abnormal temperature index parameter of the temperature measurement point within the monitoring period; an adjusting module, configured to adjust the temperature monitoring weights of at least some of the temperature measuring points in a next monitoring cycle based on the abnormal temperature indicator parameters at the temperature measuring points; An analysis module is configured to perform a temperature analysis of the target device based on a sequence of temperatures measured at each temperature measurement point over multiple monitoring cycles and a temperature monitoring weight corresponding to each monitoring cycle, wherein the temperature monitoring weight is used to indicate the importance of measuring the temperature at the corresponding temperature measurement point in the temperature analysis.

9. An electronic device, characterized in that: The method comprises a processor and a memory, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor is enabled to perform the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that The method comprises a computer program, and when the computer program is run on an electronic device, the computer program is used to enable the electronic device to execute the method according to any one of claims 1 to 7.

11. A computer program product, characterized in that The method comprises a computer program stored in a computer-readable storage medium; when a processor of an electronic device reads the computer program from the computer-readable storage medium, the processor executes the computer program, so that the electronic device executes any one of the methods described in claims 1 to 7.

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