Indium phosphide chip packaging device

Abstract

The invention relates to the technical field of chip packaging, in particular to an indium phosphide chip packaging device which comprises a chip clamp, a spot welding head, a hot welding head, a cold welding head, a testing mechanism and a conveying belt, a plurality of supporting frames are sequentially arranged on the outer side of the conveying belt, electric push rods are installed on the supporting frames, and the output ends of the electric push rods are fixedly connected with connecting plates; the conveying belt is arranged to be the chain plate conveying belt, the packaging and positioning mechanism is installed on the fixing block, the packaging and positioning mechanism can position the chip module while conveying the chip module, and meanwhile, when spot welding, hot welding and cold welding packaging are sequentially carried out on indium phosphide chips on the chip module, the chip module can be subjected to spot welding, hot welding and cold welding packaging at the same time; and through mutual cooperation with the press-down cooperation mechanism, the effect of accurately positioning the indium phosphide chip on the chip module during packaging is further realized, the chip module is prevented from deviating from the initial position due to intermittent conveying of the conveyor belt, and the indium phosphide chip packaging efficiency of the chip module is further ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to an indium phosphide chip packaging device. Background Art

[0002] Indium phosphide (InP) chips, due to their material's wide bandgap, emit light at wavelengths in the communications band and are widely used in photonic communications. Currently, when packaging InP chips in existing chip modules, a fixture first attaches the chip to the chip module at a conveyor mechanism. The conveyor mechanism then transports the chip module with the chip to a spot welding station for spot welding. After spot welding is complete, the conveyor mechanism sequentially transports the chip module to hot welding and cold welding stations, completing the InP chip packaging process. However, during the packaging process of the indium phosphide chip of the chip module, the chip module is located on the conveyor belt of the conveying mechanism, and a plurality of raised positions are set on the existing conveyor belt, and the chip module is located between two raised positions on the conveyor belt. However, the width between the two raised positions is greater than the width of the chip module, and the conveyor belt adopts intermittent transmission to match the packaging equipment. This transmission method causes the chip module located on the conveyor belt to be subjected to instantaneous acceleration and deceleration, and the chip module and the indium phosphide chip thereon are subjected to instantaneous force, causing the chip module to deviate from the initial position on the conveyor belt, thereby causing the indium phosphide chip of the chip module to deviate during the spot welding, hot welding and cold welding processes, further affecting the packaging accuracy of the indium phosphide chip of the chip module. To this end, we propose an indium phosphide chip packaging device. Summary of the Invention

[0003] The object of the present invention is to provide an indium phosphide chip packaging device to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an indium phosphide chip packaging device, comprising a chip fixture, a spot welding head, a hot welding head, a cold welding head, a testing mechanism and a conveyor belt, wherein a plurality of support frames are sequentially provided on the outside of the conveyor belt, and an electric push rod is installed on the support frame, the output end of the electric push rod is fixedly connected to a connecting plate, and the plurality of connecting plates respectively support the spot welding head, the hot welding head, the cold welding head and the testing mechanism, the conveyor belt is a chain conveyor belt, and a plurality of fixed blocks are fixedly installed on the chain conveyor belt at equal distances, a packaging positioning mechanism is installed on the side of the fixed block away from the chain conveyor belt, a press-down fitting mechanism is provided on the connecting plate, and the plurality of press-down fitting mechanisms cooperate with the plurality of packaging positioning mechanisms to enable the spot welding head, the hot welding head and the cold welding head to accurately weld and package the indium phosphide chip on the chip module in turn.

[0005] Furthermore, the packaging positioning mechanism includes a support plate, a positioning frame, a positioning member, a connecting member and a pushing member, the support plate is fixedly mounted on a side of the fixed block away from the chain conveyor belt, and a movable groove is provided on a side of the support plate close to the support frame, two positioning frames are provided, one end of the two positioning frames is slidably connected inside the movable groove, and the other ends of the two positioning frames extend to the outside of the support plate, the connecting member is located inside the movable groove, and the connecting member is used to connect the two positioning frames;

[0006] The positioning frame is provided with a moving opening, and the positioning piece is connected to the moving opening, and the two positioning pieces position the chip module relative to each other;

[0007] There are pushing grooves on both sides of the support plate, and there are two pushing members. One end of the two pushing members is connected to the two pushing grooves respectively, and the other end of the pushing member is connected to the movable frame. When the pushing member moves to the downward pressure fitting mechanism, the downward pressure fitting mechanism pushes the positioning frame through the pushing member.

[0008] Furthermore, the connecting member includes a connecting spring, which is located inside the movable groove, and both ends of the connecting spring are fixedly connected to the two positioning frames. The two positioning frames are connected by the provided connecting member.

[0009] Furthermore, the positioning member includes a positioning block, a positioning rod, a limit block and a positioning spring. There are two positioning blocks, and the two positioning blocks slide through the moving opening respectively. The two ends of the positioning spring are fixedly connected to the two positioning blocks. The positioning rod is L-shaped, and the positioning rod is fixedly connected to the positioning block. One end of the positioning rod is fixedly connected to the limit block. The limit block is used to limit the chip module. Through the provided positioning member, the chip module on the support plate is positioned.

[0010] Furthermore, the side of the limiting block close to the chip module is provided with a sloped surface, thereby facilitating the positioning of the chip module by the limiting block.

[0011] Furthermore, the pushing member includes a first pushing block, a second pushing block, a pushing rod, a supporting member and a contact member. The first pushing block is fixedly connected to the positioning frame, and the second pushing block is slidably connected to the outside of the first pushing block. The sides of the first pushing block and the second pushing block that are close to each other are both set as pushing slopes. The contact member is installed on the side of the second pushing block away from the first pushing block. One end of the pushing rod is connected to the second pushing block, and the other end of the pushing rod is connected to the supporting member. The supporting member is connected to the pushing groove, and the positioning frame is pushed by the provided pushing member.

[0012] Furthermore, the support member includes a support spring and a push plate, the support spring is located inside the push groove, one end of the support spring is fixedly connected to the push plate, and the other end of the support spring is fixedly connected to the push plate, the push plate is L-shaped, one end of the push plate is slidingly connected to the push groove, and the other end of the push plate is fixedly connected to the push rod, and the support member is provided to support the push rod.

[0013] Furthermore, the contact piece includes a support block and a contact block, one end of the support block is fixedly connected to the second push block, and the other end of the support block is fixedly connected to the contact block, and the side of the contact block away from the support block is set in an arc shape, and the contact piece is provided to realize the function of connecting the press-fit mechanism.

[0014] Furthermore, both sides of the connecting plate are provided with connecting ends, and an adjustment port is formed between the connecting end and the connecting plate, the press-fit mechanism is connected to the adjustment port, the press-fit mechanism includes an adjusting sleeve, an adjusting bolt, a pressing rod and a pressing block, the adjusting sleeve is slidably sleeved on the outside of the connecting end, and the adjusting sleeve slides through the adjustment port, a threaded hole is provided on the side of the adjusting sleeve away from the connecting end, and the adjusting bolt is threadedly connected to the threaded hole;

[0015] The pressing rod is fixedly mounted on the bottom of the adjusting sleeve, and the pressing block is fixedly mounted on the bottom of the pressing rod, and the package positioning mechanism is pushed by the provided pressing fitting mechanism.

[0016] Furthermore, the pressing block is wedge-shaped, so that the pressing block can push the contact block.

[0017] The present invention has at least the following beneficial effects:

[0018] 1. When the present invention is in use, the conveyor belt is set as a chain conveyor belt, and multiple fixed blocks are fixedly installed at equal distances on the chain conveyor belt, and a packaging positioning mechanism is installed on the fixed blocks. The packaging positioning mechanism can position the chip module while conveying the chip module. At the same time, when the indium phosphide chip on the chip module is spot welded, hot welded and cold welded in sequence, the indium phosphide chip on the chip module is further precisely positioned during packaging by cooperating with the press-fit mechanism, thereby preventing the chip module from deviating from the initial position due to intermittent conveying of the conveyor belt, and further ensuring the indium phosphide chip packaging efficiency of the chip module.

[0019] 2. The packaging and positioning mechanism of the present invention can transport and position chip modules of different sizes, while ensuring the packaging accuracy of the indium phosphide chips on the chip modules without affecting the placement and removal of the chip modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 For the present invention Figure 1 Schematic diagram of the enlarged structure of area A in the middle;

[0022] Figure 3 It is a side view of the overall structure of the present invention;

[0023] Figure 4 This is a schematic diagram of the electric push rod structure of the present invention;

[0024] Figure 5 For the present invention Figure 4 Schematic diagram of the enlarged structure of the middle B area;

[0025] Figure 6 This is a schematic structural diagram of the connecting plate of the present invention;

[0026] Figure 7 This is a schematic diagram of the chain conveyor belt structure of the present invention;

[0027] Figure 8 This is a schematic diagram of the support plate structure of the present invention;

[0028] Figure 9 This is a structural diagram of the synchronization plate of the present invention;

[0029] Figure 10 This is a schematic structural diagram of the second pushing block of the present invention;

[0030] Figure 11 This is a schematic diagram of the push plate structure of the present invention.

[0031] In the figure: 1- chip fixture; 11- spot welding head; 12- hot welding head; 13- cold welding head; 14- testing mechanism; 2- conveyor belt; 21- chain plate conveyor belt; 3- support frame; 31- electric push rod; 4- connecting plate; 41- connecting end; 42- adjusting port; 5- fixed block; 6- package positioning mechanism; 61- support plate; 611- moving groove; 612- pushing groove; 62- positioning frame; 621- moving port; 63- positioning member; 631- positioning block; 632- positioning rod; 633- limiting block; 6331- ramp surface; 634- positioning spring; 64- connecting Parts; 641-connecting spring; 65-pushing member; 651-first pushing block; 652-second pushing block; 653-pushing rod; 654-support member; 6541-support spring; 6542-pushing plate; 655-contact member; 6551-support block; 6552-contact block; 7-press-fit mechanism; 71-adjusting sleeve; 72-adjusting bolt; 73-pressing rod; 74-pressing block; 8-pressing plate; 81-synchronizing plate; 82-first pressing block; 83-connecting frame; 84-second pressing block; 85-sliding rod; 86-sliding sleeve; 87-buffer spring. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] Example 1

[0034] See also Figures 1 to 4 , an indium phosphide chip packaging device, including a chip fixture 1, a spot welding head 11, a hot welding head 12, a cold welding head 13, a testing mechanism 14 and a conveyor belt 2. In this embodiment, the testing mechanism 14 is an existing mechanism that can test the indium phosphide chip on the chip module after the package is completed. For this reason, no further details are given. A plurality of support frames 3 are sequentially provided on the outer side of the conveyor belt 2, and an electric push rod 31 is installed on the support frame 3. The output end of the electric push rod 31 is fixedly connected to a connecting plate 4, and the plurality of connecting plates 4 respectively support the spot welding head 11, the hot welding head 12, the cold welding head 13 and the testing mechanism 14;

[0035] See also Figures 4 and 5 and Figures 7 to 11, the conveyor belt 2 is a chain conveyor belt 21, and a plurality of fixed blocks 5 are fixedly installed at equal distances on the chain conveyor belt 21, and a packaging positioning mechanism 6 is installed on the side of the fixed block 5 away from the chain conveyor belt 21, and the packaging positioning mechanism 6 includes a support plate 61, a positioning frame 62, a positioning member 63, a connecting member 64 and a pushing member 65. The support plate 61 is fixedly installed on the side of the fixed block 5 away from the chain conveyor belt 21, and a movable groove 611 is provided on the side of the support plate 61 close to the support frame 3. There are two positioning frames 62, one end of the two positioning frames 62 is slidably connected to the inside of the movable groove 611, and the other ends of the two positioning frames 62 extend to the outside of the support plate 61, and the connecting member 64 is located inside the movable groove 611. In this embodiment, the positioning frame 62 is U-shaped, and the connecting member 64 is used to connect the two positioning frames 62;

[0036] The positioning frame 62 is provided with a moving opening 621, and the positioning member 63 is connected to the moving opening 621, and the two positioning members 63 position the chip module relative to each other;

[0037] Both sides of the support plate 61 are provided with a push groove 612, and two push members 65 are provided. One end of the two push members 65 is connected to the two push grooves 612 respectively, and the other end of the push member 65 is connected to the movable frame. When the push member 65 moves to the press-fit mechanism 7, the press-fit mechanism 7 pushes the positioning frame 62 through the push member 65;

[0038] The connecting member 64 includes a connecting spring 641 , which is located inside the movable groove 611 , and the two ends of the connecting spring 641 are fixedly connected to the two positioning brackets 62 ;

[0039] The positioning member 63 includes a positioning block 631, a positioning rod 632, a limiting block 633, and a positioning spring 634. Two positioning blocks 631 are provided, and the two positioning blocks 631 slide through the movable opening 621 respectively. The two ends of the positioning spring 634 are fixedly connected to the two positioning blocks 631. The positioning rod 632 is L-shaped and fixedly connected to the positioning block 631. One end of the positioning rod 632 is fixedly connected to the limiting block 633. The limiting block 633 is used to limit the chip module. The side of the limiting block 633 close to the chip module is provided with a sloped surface 6331.

[0040] In this embodiment, the positioning spring 634 is in a compressed state, so that when the two limit blocks 633 between the positioning frames 62 position the chip module, due to the reverse elastic force of the positioning spring 634, the two further limit blocks 633 press against the two ends of the chip module. At the same time, due to the setting of the positioning spring 634 and the reverse elastic force of the connecting spring 641 between the two positioning frames 62, chip modules of different lengths and widths can be positioned.

[0041] See also Figures 9 to 11 The pushing member 65 includes a first pushing block 651, a second pushing block 652, a pushing rod 653, a supporting member 654 and a contact member 655. The first pushing block 651 is fixedly connected to the positioning frame 62, and the second pushing block 652 is slidably connected to the outer side of the first pushing block 651. The sides of the first pushing block 651 and the second pushing block 652 that are close to each other are both set as pushing inclined surfaces. The contact member 655 is installed on the side of the second pushing block 652 away from the first pushing block 651. One end of the pushing rod 653 is connected to the second pushing block 652, and the other end of the pushing rod 653 is connected to the supporting member 654. The supporting member 654 is connected to the pushing groove 612.

[0042] The support member 654 includes a support spring 6541 and a push plate 6542. The support spring 6541 is located inside the push groove 612. One end of the support spring 6541 is fixedly connected to the push plate 6542, and the other end of the support spring 6541 is fixedly connected to the push plate 6542. The push plate 6542 is L-shaped. One end of the push plate 6542 is slidably connected to the push groove 612, and the other end of the push plate 6542 is fixedly connected to the push rod 653.

[0043] The contact member 655 includes a support block 6551 and a contact block 6552. One end of the support block 6551 is fixedly connected to the second push block 652, and the other end of the support block 6551 is fixedly connected to the contact block 6552. The side of the contact block 6552 away from the support block 6551 is arranged in an arc shape.

[0044] Specific implementation process: When the indium phosphide chip of the chip module is packaged, the chip module is first placed on the support plate 61 at one end of the chain conveyor 21 by a robot. At this time, the four limit blocks 633 on the support plate 61 limit the chip module to each other through the slope surface 6331 thereon. Then, as the chain conveyor 21 is driven, the chain conveyor 21 is further driven through the fixed block 5 and the support plate 61 thereon to drive the chip module on the support plate 61 to move to the position of the chip fixture 1. The chip fixture 1 places the indium phosphide chip in the chip slot of the chip module. Subsequently, the chip module is intermittently transported by the chain conveyor 21 so that it is welded and packaged in sequence at the spot welding, hot welding and cold welding positions. Subsequently, the chip module behind the indium phosphide chip is tested by the testing mechanism 14. After the test is completed, it is transported to the picking station along with the chain conveyor 21, and the robot removes the packaged chip module.

[0045] See also Figures 3 to 6 A press-fit mechanism 7 is provided on the connecting plate 4, and multiple press-fit mechanisms 7 cooperate with multiple packaging positioning mechanisms 6 to enable the spot welding head 11, hot welding head 12, and cold welding head 13 to accurately weld and package the indium phosphide chip on the chip module in turn.

[0046] A connecting end 41 is provided on both sides of the connecting plate 4, and an adjustment port 42 is formed between the connecting end 41 and the connecting plate 4. A press-fit mechanism 7 is connected to the adjustment port 42. The press-fit mechanism 7 includes an adjustment sleeve 71, an adjustment bolt 72, a press rod 73 and a press block 74. The adjustment sleeve 71 is slidably sleeved on the outside of the connecting end 41 and slides through the adjustment port 42. A threaded hole is provided on the side of the adjustment sleeve 71 away from the connecting end 41, and the adjustment bolt 72 is threadedly connected to the threaded hole.

[0047] The lower pressing rod 73 is fixedly mounted on the bottom of the adjusting sleeve 71, and the lower pressing block 74 is fixedly mounted on the bottom of the lower pressing rod 73. The lower pressing block 74 is wedge-shaped.

[0048] In this embodiment, the adjusting sleeve 71 is slidably sleeved on the outside of the connecting end 41, and the adjusting bolt 72 is adjusted to lock it with the connecting end 41. Then, the position of the adjusting sleeve 71 relative to the connecting end 41 can be adjusted according to the size of the chip module. After adjusting the adjusting sleeve 71, the position of the pressing rod 73 and the pressing block 74 relative to the contact block 6552 is further adjusted. Therefore, according to chip modules of different sizes, when the chip module moves to the position of the two pressing blocks 74 at a work station along with the support plate 61, the pressing block 74 can adjust its pressing position and pressing strength according to chip modules of different sizes, thereby further ensuring that chip modules of different sizes can be stably transported and accurately packaged.

[0049] Specific implementation process: Further, when the chip module with the indium phosphide chip is sequentially conveyed to the spot welding head 11 or the hot welding head 12 or the cold welding head 13 or the testing mechanism 14 along with the chain plate conveyor 21, the chain plate conveyor 21 is suspended. At this time, as the electric push rod 31 operates, the connecting plate 4 is moved downward. When the connecting plate 4 moves downward, the welding head or the hot welding head 12 or the cold welding head 13 or the testing head is driven to continuously move downward onto the indium phosphide chip, thereby realizing the welding packaging or testing between the indium phosphide chip and the chip module;

[0050] As the connecting plate 4 moves downward, the pressing block 74 is driven downward by the pressing rod 73, and the two pressing blocks 74 first contact the two contact blocks 6552 on the support plate 61. Since the pressing block 74 is wedge-shaped, as the moving block moves downward, it continuously pushes the contact block 6552. While pushing the contact block 6552, the second pushing block 652 moves relative to the first pushing block 651. Since the first pushing block 651 and the second pushing block 652 are in contact with each other, the contact block 6552 is pushed downward. There are pushing inclined surfaces between each other, so at this time, the two first pushing blocks 651 on the support plate 61 move toward each other, and at this time, the two positioning frames 62 move toward each other. While the two positioning frames 62 move toward each other, the four limit blocks 633 on the two positioning frames 62 are used to further limit and fix the four corners of the chip module until the welding head or hot welding head 12 or cold welding head 13 or test head stops moving downward, and the chip module is accurately positioned, further ensuring the packaging accuracy of the chip module.

[0051] Example 2

[0052] See also Figures 4 and 5 and Figures 8 and 9 , Example 2 is a further supplementary explanation of Example 1, specifically: a pressing plate 8 is provided on one side of the chip fixture 1, and when the chip fixture 1 moves to the groove of the chip module, it is connected to a synchronous plate 81 through the pressing plate 8, and a first pressing block 82 is fixedly connected to the bottom of the synchronous plate 81, and a connecting frame 83 is fixedly connected to the bottom of the first pressing block 82, and a second pressing block 84 is fixedly connected to the other end of the connecting frame 83. The first pressing block 82 and the second pressing block 84 are both wedge-shaped. The two ends of the bottom of the connecting frame 83 are respectively fixedly connected to a sliding rod 85, and the outer side of the bottom of the sliding rod 85 is slidably sleeved with a sliding sleeve 86. The two sliding sleeves 86 are fixedly mounted on the bracket of the conveyor belt 2, and a buffer spring 87 is sleeved on the outer side of the sliding rod 85. The two ends of the buffer spring 87 are respectively fixedly connected to the connecting frame 83 and the sliding sleeve 86;

[0053] Furthermore, when the chip clamp 1 clamps the indium phosphide chip from the chip supply table to the groove of the chip module, the pressing plate 8 contacts the synchronization plate 81, and while the chip clamp 1 moves downward to place the chip on the groove, the pressing plate 8 moves downward synchronously, and at the same time, the pressing plate 8 squeezes the synchronization plate 81. When the synchronization plate 81 is squeezed and moved downward, the first pressing block 82 and the second pressing block 84 are further moved downward synchronously through the connecting frame 83. When the first pressing block 82 and the second pressing block 84 are moved downward synchronously, the two contact blocks 6552 are pushed, and the two positioning frames 62 are further moved toward each other, further driving multiple limit blocks 633 to further limit and fix the chip module, thereby realizing the precise placement of the indium phosphide chip on the groove of the chip module.

[0054] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0055] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An indium phosphide chip packaging device, comprising a chip fixture (1), a spot welding head (11), a hot welding head (12), a cold welding head (13), a testing mechanism (14) and a conveyor belt (2), wherein a plurality of support frames (3) are sequentially provided on the outer side of the conveyor belt (2), and an electric push rod (31) is installed on the support frame (3), and the output end of the electric push rod (31) is fixedly connected to a connecting plate (4), and the plurality of connecting plates (4) respectively support the spot welding head (11), the hot welding head (12), the cold welding head (13) and the testing mechanism (14), characterized in that: The conveyor belt (2) is a chain conveyor belt (21), and a plurality of fixed blocks (5) are fixedly installed at equal distances on the chain conveyor belt (21), and a packaging positioning mechanism (6) is installed on the side of the fixed block (5) away from the chain conveyor belt (21), and a downward pressure fitting mechanism (7) is provided on the connecting plate (4). The plurality of downward pressure fitting mechanisms (7) cooperate with the plurality of packaging positioning mechanisms (6) to enable the spot welding head (11), the hot welding head (12), and the cold welding head (13) to sequentially accurately weld and package the indium phosphide chip on the chip module.

2. The indium phosphide chip packaging device according to claim 1, characterized in that: The packaging positioning mechanism (6) includes a support plate (61), a positioning frame (62), a positioning member (63), a connecting member (64) and a pushing member (65), wherein the support plate (61) is fixedly mounted on a side of the fixed block (5) away from the chain conveyor belt (21), and a movable groove (611) is provided on a side of the support plate (61) close to the support frame (3), and two positioning frames (62) are provided, one end of the two positioning frames (62) is slidably connected inside the movable groove (611), and the other ends of the two positioning frames (62) extend to the outside of the support plate (61), and the connecting member (64) is located inside the movable groove (611), and the connecting member (64) is used to connect the two positioning frames (62); The positioning frame (62) is provided with a moving opening (621), and the positioning member (63) is connected to the moving opening (621), and the two positioning members (63) position the chip module relative to each other; Both sides of the support plate (61) are provided with a pushing groove (612), and two pushing members (65) are provided. One end of the two pushing members (65) is connected to the two pushing grooves (612) respectively, and the other end of the pushing member (65) is connected to the moving frame. When the pushing member (65) moves to the downward pressure fitting mechanism (7), the downward pressure fitting mechanism (7) pushes the positioning frame (62) through the pushing member (65).

3. The indium phosphide chip packaging device according to claim 2, characterized in that: The connecting member (64) includes a connecting spring (641), the connecting spring (641) is located inside the movable groove (611), and both ends of the connecting spring (641) are fixedly connected to the two positioning frames (62).

4. The indium phosphide chip packaging device according to claim 2, characterized in that: The positioning member (63) includes a positioning block (631), a positioning rod (632), a limiting block (633) and a positioning spring (634). Two positioning blocks (631) are provided. The two positioning blocks (631) slide through the moving opening (621) respectively. The two ends of the positioning spring (634) are fixedly connected to the two positioning blocks (631). The positioning rod (632) is L-shaped, and the positioning rod (632) is fixedly connected to the positioning block (631). One end of the positioning rod (632) is fixedly connected to the limiting block (633). The limiting block (633) is used to limit the chip module.

5. The indium phosphide chip packaging device according to claim 4, characterized in that: The side of the limiting block (633) close to the chip module is provided with a sloped surface (6331).

6. The indium phosphide chip packaging device according to claim 2, characterized in that: The pushing member (65) includes a first pushing block (651), a second pushing block (652), a pushing rod (653), a supporting member (654) and a contact member (655). The first pushing block (651) is fixedly connected to the positioning frame (62), and the second pushing block (652) is slidably connected to the outside of the first pushing block (651). The sides of the first pushing block (651) and the second pushing block (652) that are close to each other are both set as pushing inclined surfaces. The contact member (655) is installed on the side of the second pushing block (652) away from the first pushing block (651). One end of the pushing rod (653) is connected to the second pushing block (652), and the other end of the pushing rod (653) is connected to the supporting member (654). The supporting member (654) is connected to the pushing groove (612).

7. The indium phosphide chip packaging device according to claim 6, characterized in that: The support member (654) includes a support spring (6541) and a push plate (6542), wherein the support spring (6541) is located inside the push groove (612), one end of the support spring (6541) is fixedly connected to the push plate (6542), and the other end of the support spring (6541) is fixedly connected to the push plate (6542), and the push plate (6542) is L-shaped, one end of the push plate (6542) is slidably connected to the push groove (612), and the other end of the push plate (6542) is fixedly connected to the push rod (653).

8. The indium phosphide chip packaging device according to claim 6, characterized in that: The contact member (655) comprises a support block (6551) and a contact block (6552), one end of the support block (6551) is fixedly connected to the second push block (652), and the other end of the support block (6551) is fixedly connected to the contact block (6552), and the side of the contact block (6552) away from the support block (6551) is arranged in an arc shape.

9. The indium phosphide chip packaging device according to claim 1, characterized in that: Both sides of the connecting plate (4) are provided with connecting ends (41), and an adjustment port (42) is formed between the connecting end (41) and the connecting plate (4); the press-fit mechanism (7) is connected to the adjustment port (42); the press-fit mechanism (7) comprises an adjustment sleeve (71), an adjustment bolt (72), a press rod (73) and a press block (74); the adjustment sleeve (71) is slidably sleeved on the outside of the connecting end (41), and the adjustment sleeve (71) slides through the adjustment port (42); a threaded hole is provided on the side of the adjustment sleeve (71) away from the connecting end (41), and the adjustment bolt (72) is threadedly connected to the threaded hole; The lower pressing rod (73) is fixedly mounted on the bottom of the adjustment sleeve (71), and the lower pressing block (74) is fixedly mounted on the bottom of the lower pressing rod (73).

10. The indium phosphide chip packaging device according to claim 9, characterized in that: The lower pressing block (74) is arranged in a wedge shape.

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