Method and system for machining small holes in transparent hard and brittle material and intelligent terminal

Abstract

The invention relates to a method and system for machining small holes in a transparent hard and brittle material and an intelligent terminal, and relates to the technical field of laser machining. Searching a corresponding concentric circumference scanning track from a preset track database based on the punching diameter; acquiring laser parameters and galvanometer parameters; searching a corresponding period distribution diagram from a preset parameter database based on the galvanometer parameters; calculating pulse interval time based on the pulse repetition frequency; determining jump time based on the pulse interval time and the period distribution diagram; adjusting the laser parameter based on the jump time to obtain an actual laser parameter; and performing a vector dotting process on the perforated material. The laser drilling device has the advantages that the jumping time is set, so that each pulse falls within the moving stable period of the galvanometer, and the laser drilling stability is improved.

Description

Technical Field

[0001] The present invention relates to the field of laser processing, and in particular to a method, system and intelligent terminal for processing small holes in transparent hard and brittle materials. Background Art

[0002] In the field of precision machining, for transparent, hard and brittle materials with high hardness and high melting point, such as glass, quartz, and sapphire, the use of traditional drilling methods such as mechanical drilling has certain limitations. It is easy to cause irregular punching edges and serious surface chipping, which affects the strength and performance of the material. In addition, the aperture of the processed small holes is large, which is not suitable for processing small holes with a diameter of less than 2mm.

[0003] Laser processing technology is a non-contact, low-heat-damage, and flexible precision processing technology. It can process a wide range of materials, can obtain holes with a large aspect ratio, and can be easily connected to a computer for automated control. Therefore, laser processing technology is considered an effective way to achieve efficient and precise hole making in brittle materials. For the preparation of high aspect ratio through holes in transparent hard and brittle materials, nanosecond laser processing is generally used, and now it is usually combined with a galvanometer for processing. When using a galvanometer for processing, the reflector inside the galvanometer is deflected by a certain angle under the drive of the motor, so that the light spot reflected by the reflector moves to the specified position for processing.

[0004] Regarding the aforementioned technologies, the movement of the galvanometer mirror is not a one-step process. Based on the relationship between the galvanometer mirror's displacement and time, the movement of the galvanometer mirror can be divided into three periods: motion, fluctuation, and stability. Since the laser's output is independent of the galvanometer mirror's movement and the laser emits light periodically at a certain frequency, the laser's light output may appear during both the motion and fluctuation periods of the galvanometer mirror's movement, causing fluctuations and unevenness in the spot position, affecting processing quality. Summary of the Invention

[0005] In order to improve the problem that laser light may appear during the movement and fluctuation period of the galvanometer movement, thereby causing fluctuation and unevenness of the light spot position and affecting the processing quality, the present invention provides a method, system and intelligent terminal for processing small holes in transparent hard and brittle materials.

[0006] In a first aspect, the present invention provides a method for machining small holes in transparent hard and brittle materials, which adopts the following technical solution:

[0007] A method for machining small holes in transparent hard and brittle materials, comprising:

[0008] Obtaining punching material information of the punching material, wherein the punching material information includes punching thickness, punching diameter, and material type;

[0009] Based on the punching diameter, the corresponding concentric circular scanning trajectory is found from the preset trajectory database;

[0010] Acquiring laser parameters and galvanometer parameters, wherein the laser parameters include a pulse repetition frequency and the galvanometer parameters include a scanning speed;

[0011] Based on the galvanometer parameters, the corresponding period distribution diagram is found from the preset parameter database;

[0012] Calculate the pulse interval based on the pulse repetition frequency;

[0013] Determine jump time based on pulse interval time and period distribution diagram;

[0014] Adjusting the laser parameters based on the jump time to obtain actual laser parameters;

[0015] Performing a vector dotting process on the punched material, the vector dotting process comprising:

[0016] The galvanometer is controlled to move according to the galvanometer parameters and the concentric circular scanning trajectory, and the laser source is controlled to pulse according to the actual laser parameters.

[0017] By adopting the above technical solution, by determining the parameters of the laser and the galvanometer, and then determining the jump time, each pulse falls within the stable period of the galvanometer movement, thereby improving the stability of laser drilling, effectively improving the position accuracy of laser punching, reducing the occurrence of edge collapse, making the punched points continuous and uniform, and improving the drilling quality.

[0018] Optionally, before executing the vector dotting process, the process further includes:

[0019] Based on the material category, the corresponding refractive index is found from the preset material database;

[0020] The total number of processing layers is calculated based on the refractive index, drilling thickness and preset moving layer spacing;

[0021] Determining a first clustering layer and a second clustering layer based on the total number of processed layers, wherein the first clustering layer is the layers other than the top layer, and the second clustering layer is the top layer;

[0022] Get the current number of layers to be punched;

[0023] When the current layer number is the first cluster layer, a galvanometer scanning process is performed, the galvanometer scanning process including:

[0024] Calculate the current relative spacing based on the current number of layers, refractive index, perforation thickness, and preset incident angle and incident height;

[0025] Control the two galvanometer mirrors to focus according to the current relative spacing, perform scanning laser processing according to the galvanometer parameters and concentric circular scanning trajectory, control the laser source to pulse according to the laser parameters, and then control the galvanometer to move relatively close according to the moving layer spacing, so that the laser focus moves to the layer above the current layer and updates the current layer number;

[0026] When the current layer is the second clustering layer, a vector dotting process is performed.

[0027] By adopting the above technical solution and taking a layered processing process from bottom to top, the generated residues and plasma will fall from the lower surface of the through hole and will not hinder the subsequent laser beam, thereby improving the processing efficiency of the drilling.

[0028] Optionally, also include:

[0029] Perform ultrasonic cleaning on the punched material before starting the galvanometer scanning process and vector dotting process;

[0030] The punched material is dried after completing the ultrasonic cleaning process.

[0031] By adopting the above technical solution, the material is ultrasonically cleaned and dried before executing the two processes, so that there are no impurities on the surface of the material itself, thereby improving the purity and neatness of the material.

[0032] Optionally, the method for determining the jump time based on the pulse interval time and the period distribution diagram includes:

[0033] The period distribution diagram is analyzed to obtain the duration of the movement period, the duration of the fluctuation period, and the duration of the stable period;

[0034] The cycle duration is calculated based on the duration of the movement period, the duration of the fluctuation period, and the duration of the stable period;

[0035] A time difference is determined based on the pulse interval time and the cycle duration, and the time difference is output as the jump time.

[0036] By adopting the above technical solution, the single jump time is calculated directly according to the movement cycle of a galvanometer, without the need for complicated conversion, thus reducing a lot of workload.

[0037] Optionally, an optimization method for determining jump time based on the pulse interval time and period distribution diagram is also included, the method comprising:

[0038] The duration of the unstable period is calculated based on the duration of the movement period and the duration of the fluctuation period;

[0039] Determine the jump time range based on the duration of the unstable period and the duration difference;

[0040] Select any time within the jump time range as the preliminary jump time;

[0041] Determine a single pulse period and a single pulse distribution diagram based on the pulse interval time and the preparatory jump time;

[0042] Determine the number of pulses in a single pulse cycle and the number of cycles in the cycle duration based on the single pulse cycle and the cycle duration;

[0043] Determining a pulse time point where the pulse light falls based on a single pulse distribution diagram having a number of pulses;

[0044] When the pulse time points all fall into the preset stable period, the preparatory jump time is used as the compliance jump time;

[0045] When there is a pulse time point falling into the movement period or the fluctuation period, the preparatory jump time is reselected;

[0046] The jump time that matches the shortest screening time is output as the jump time.

[0047] By adopting the above technical solution, the minimum jump time that meets the requirements can be calculated to make the idle interval in the middle as short as possible, thereby increasing the number of pulses in the same time and improving work efficiency.

[0048] Optionally, an optimization method for determining the number of pulses in a single pulse cycle and the number of cycles in the cycle duration based on the single pulse cycle and the cycle duration is further included, the method comprising:

[0049] Determine the number of stable pulses and the extension time of the stable period based on the pulse interval time and the stable period length;

[0050] The stable period is extended by the stable period extension duration, and then the unstable period duration is output as the jump time.

[0051] By adopting the above technical solution, the stable period can be extended and the jump time only exists after multiple pulses, thereby ensuring that the pulse is definitely within the stable period and the jump time is minimized.

[0052] Optionally, the method of controlling the galvanometer to move according to the galvanometer parameters and the concentric circular scanning trajectory, and controlling the laser source to pulse according to the actual laser parameters includes:

[0053] The cycle length extended by the stabilization period is defined as the reasonable cycle length;

[0054] Determine the reasonable number of tapping times based on the reasonable cycle length;

[0055] Based on the reasonable number of dotting times, the corresponding dotting spacing is found from a preset reasonable database;

[0056] Get the current circular scanning trajectory;

[0057] Determine the trajectory circumference based on the current circular scanning trajectory;

[0058] Determine the dot coordinates based on the track perimeter and dot spacing;

[0059] Control the galvanometer to move to the dot coordinates in sequence according to the galvanometer parameters, and measure the time during the movement to obtain the accumulated time;

[0060] When moving to the dot coordinates, the laser source is controlled to pulse according to the actual laser parameters;

[0061] After the accumulated time is equal to the reasonable cycle length, the galvanometer is continued to be controlled to move to the dot coordinates in sequence according to the galvanometer parameters, and the accumulated time is obtained during the movement.

[0062] By adopting the above technical solution, when the number of markings in a single galvanometer movement is determined, the marking spacing can be reasonably increased according to the number of markings, reducing the overlap of the heat-affected zone, thereby reducing edge chipping and improving surface quality.

[0063] Optionally, the method for determining the dot coordinates based on the track perimeter and the dot spacing includes:

[0064] Determine the number of dot coordinates and the perimeter margin based on the track perimeter and dot spacing;

[0065] When the circumference margin does not exist, the initial dot coordinates are determined based on the current circular scanning trajectory and the preset initial angle;

[0066] Determine the subsequent dot coordinates based on the initial dot coordinates and dot spacing;

[0067] Output the initial dot coordinates and subsequent dot coordinates as dot coordinates;

[0068] When perimeter margin exists, the required dotting spacing is determined in reverse based on the number of dotting coordinates and the track perimeter;

[0069] Based on the required dotting interval, reverse search the reasonable dotting times from the reasonable database, and define the reasonable dotting times as the required dotting times;

[0070] If the required number of dotting times does not exist, update the number of dotting coordinates and re-determine the required number of dotting times;

[0071] When the required number of checkpoints exists, the reasonable cycle duration is updated based on the required number of checkpoints;

[0072] Determine subsequent dot coordinates based on the initial dot coordinates and the required dot spacing, and define the subsequent dot coordinates as the required subsequent dot coordinates;

[0073] The initial dot coordinates and the required subsequent dot coordinates are output as dot coordinates.

[0074] By adopting the above technical solution, when the dot position is unreasonable, it is checked whether the pulse number of a single point can be adjusted, so that the spacing can be extended, thereby improving the rationality of the dot position setting.

[0075] In a second aspect, the present invention provides a system for processing small holes in transparent hard and brittle materials, which adopts the following technical solution:

[0076] A system for processing small holes in transparent hard and brittle materials, comprising:

[0077] The acquisition module is used to obtain the punching material information, laser parameters, galvanometer parameters, current layer number and current circular scanning trajectory;

[0078] A memory for storing a program for controlling the method for machining small holes in transparent hard and brittle materials as described above;

[0079] The processor loads and executes the program in the memory.

[0080] By adopting the above technical solution, by determining the parameters of the laser and the galvanometer, and then determining the jump time, each pulse falls within the stable period of the galvanometer movement, thereby improving the stability of laser drilling, effectively improving the position accuracy of laser punching, reducing the occurrence of edge collapse, making the punched points continuous and uniform, and improving the drilling quality.

[0081] In a third aspect, the present invention provides an intelligent terminal, which adopts the following technical solution:

[0082] An intelligent terminal includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and execute any one of the methods described above.

[0083] By adopting the above technical solution, by determining the parameters of the laser and the galvanometer, and then determining the jump time, each pulse falls within the stable period of the galvanometer movement, thereby improving the stability of laser drilling, effectively improving the position accuracy of laser punching, reducing the occurrence of edge collapse, making the punched points continuous and uniform, and improving the drilling quality.

[0084] In summary, the present invention includes at least one of the following beneficial technical effects:

[0085] 1. By setting the jump time, each pulse falls within the stable period of the galvanometer movement, thereby improving the stability of laser drilling;

[0086] 2. By adopting a bottom-up layered processing process, the generated residue and plasma will fall from the lower surface of the through-hole, without hindering the subsequent laser beam, thus improving the processing efficiency of drilling;

[0087] 3. Reasonably increase the spacing between dots according to the number of dots, reduce the overlap of the heat-affected zone, thereby reducing edge collapse and improving surface quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0088] Figure 1 This is a flow chart of a method for processing small holes in transparent hard and brittle materials in an embodiment of the present application.

[0089] Figure 2 It is a schematic diagram of the concentric circular scanning trajectory in an embodiment of the present application.

[0090] Figure 3 It is a schematic diagram of the galvanometer motion cycle in an embodiment of the present application.

[0091] Figure 4 It is a schematic diagram of the combination of pulse and galvanometer motion cycle in the embodiment of the present application.

[0092] Figure 5 It is a schematic diagram of the combination of a pulse containing a jump time and a galvanometer motion period in an embodiment of the present application.

[0093] Figure 6 This is a flowchart of the steps before executing the vector dotting process in an embodiment of the present application.

[0094] Figure 7 Schematic diagram of laser refraction in an embodiment of the present application.

[0095] Figure 8 It is a flow chart of the steps before punching in an embodiment of the present application.

[0096] Figure 9 This is a flow chart of a method for determining jump time based on pulse interval time and period distribution diagram in an embodiment of the present application.

[0097] Figure 10 This is a flow chart of an optimization method for determining jump time based on pulse interval time and period distribution diagram in an embodiment of the present application.

[0098] Figure 11 It is a flowchart of an optimization method for determining the number of pulses in a single pulse cycle and the number of cycles in a cycle duration based on a single pulse cycle and a cycle duration in an embodiment of the present application.

[0099] Figure 12 This is a schematic diagram of the combination of the pulse and the galvanometer motion period after the stabilization period is extended in an embodiment of the present application.

[0100] Figure 13 It is a flow chart of a method for controlling the galvanometer to move according to the galvanometer parameters and the concentric circular scanning trajectory, and controlling the laser source to pulse according to the actual laser parameters in an embodiment of the present application.

[0101] Figure 14 It is a comparative schematic diagram of the laser spot trajectory in the embodiment of the present application and the laser spot trajectory after the dot spacing is extended.

[0102] Figure 15 This is a flow chart of a method for determining dot coordinates based on track circumference and dot spacing in an embodiment of the present application. DETAILED DESCRIPTION

[0103] The present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0104] The embodiment of the present invention discloses a method for processing small holes in transparent hard and brittle materials. Figure 1 A method for processing small holes in transparent hard and brittle materials comprises:

[0105] Step 100: Obtain punching material information of the punching material.

[0106] Punching material information refers to the material to be punched. This information includes hole thickness, hole diameter, and material category. For example, ultra-clear glass is a type of ultra-transparent, low-iron glass with a light transmittance exceeding 91.5%, approaching the maximum light transmittance of glass. This allows light to penetrate unimpeded, creating a more spacious and bright space. The hole thickness is 9mm, and the hole diameter is 1mm. This example primarily targets transparent, hard, and brittle materials, requiring high-aspect-ratio through-holes. These holes are difficult to machine and prone to surface chipping.

[0107] Step 101: searching for a corresponding concentric circular scanning trajectory from a preset trajectory database based on the punching diameter.

[0108] The concentric circle scanning track is a scanning track for gradually punching holes with a punching diameter, such as Figure 2 As shown, the concentric circle spacing is 0.05mm. The database stores the mapping relationship between the punching diameter and the concentric circle scanning trajectory. After setting the punching diameter, the staff in this field drills holes according to different spacings, and then observes the slag and edge collapse of each punch to make judgments. If there is less slag and the edge collapse length is short, it is considered a good spacing. Then, after comparing multiple spacings, a suitable spacing is obtained, and the corresponding concentric circle scanning trajectory is drawn according to the spacing for recording.

[0109] When the system receives the corresponding punching diameter, it automatically searches the database for the corresponding concentric circular scanning trajectory and outputs it.

[0110] Step 102: Obtain laser parameters and galvanometer parameters.

[0111] Laser parameters are the parameters of the laser light emitted by a laser. The laser used here is a nanosecond laser. Laser parameters include the pulse repetition rate (PRF). The PRF refers to the number of pulses emitted per unit time in a pulsed system. It is typically measured in Hertz (Hz), representing the number of pulses emitted per second. For example, the PRF is 100kHz.

[0112] Galvanometer parameters are the parameters for the deflection of the galvanometer and its internal reflector. Galvanometer parameters include scanning speed. Here, scanning speed primarily refers to the speed at which the galvanometer controls the movement of the laser beam within the processing area. For example, 1000 mm / s.

[0113] Step 103: searching for a corresponding period distribution diagram from a preset parameter database based on the galvanometer parameters.

[0114] The period distribution diagram is a schematic diagram of the motion cycle of the galvanometer. When using the galvanometer for processing, the reflector inside the galvanometer is deflected by a certain angle under the drive of the motor, so that the light spot reflected by the reflector moves to the specified position for processing. However, the movement of the galvanometer is not a one-step process. According to the relationship between the displacement of the galvanometer and time, the movement of the galvanometer can be divided into three periods: motion period, fluctuation period, and stable period. Figure 3 As shown in the figure, first, the motor deflects the mirror in response to the command signal. This phase is called the motion phase. However, due to various factors, the mirror's deflection angle may deviate from the predetermined angle, necessitating fine-tuning to return it to the correct position. This phase is called the fluctuation phase. Finally, the mirror settles into its correct position, and the laser beam, reflected by the mirror, strikes the material surface, completing the laser processing. This phase is called the stabilization phase.

[0115] The database stores the mapping between galvanometer parameters and period distribution diagrams. A technician in this field sets up a small amount of smoke in the laboratory and then observes and records the path of the laser beam in the smoke while moving the galvanometer at different galvanometer parameters. When the system receives the corresponding galvanometer parameters, it automatically searches the database for the corresponding period distribution diagram and outputs it.

[0116] Step 104: Calculate the pulse interval based on the pulse repetition frequency.

[0117] The pulse interval is the time interval between two adjacent pulses. It is calculated as the reciprocal of the pulse repetition frequency.

[0118] Step 105: Determine the jump time based on the pulse interval time and the period distribution diagram.

[0119] The jump time is the delay required to ensure that each pulse falls within the stabilization period of the galvanometer. The method for determining this is described in the subsequent steps and will not be detailed here.

[0120] like Figure 4 As shown, if there is no jump time, the following will occur Figure 4 In the case shown in the figure, some pulses fall into the motion period and the fluctuation period, causing the laser beam to shake or move on the surface of the material, making it impossible to achieve accurate drilling. If the jump time is increased, the following will occur: Figure 5 The situation shown avoids the movement and fluctuation periods of the galvanometer, so that each light-emitting point is always in the stable period of the galvanometer movement, thereby improving the position accuracy of the pulse landing point and making the points produced continuous and uniform.

[0121] Step 106: Adjust the laser parameters based on the jump time to obtain actual laser parameters.

[0122] The actual laser parameters include the jump time. The adjustment method is to insert the frequency corresponding to the jump time into the pulse repetition frequency of the laser light.

[0123] Step 107: Perform a vector dotting process on the punched material.

[0124] The vector dotting process is a process for inserting dots at jump times. The vector dotting process includes:

[0125] Step 1071: Control the galvanometer to move according to the galvanometer parameters and the concentric circular scanning trajectory, and control the laser source to pulse according to the actual laser parameters.

[0126] Here, the two are carried out simultaneously. When the galvanometer moves, the laser source does not emit pulses. When the galvanometer moves and falls into a stable period, the laser source emits pulses to perform dotting.

[0127] Reference Figure 6 , before executing the vector dotting process, it also includes:

[0128] Step 200: Find the corresponding refractive index from a preset material database based on the material category.

[0129] Refractive index describes the degree to which light bends when traveling through different media, reflecting the relative speed of light traveling through them. A database stores a mapping between material categories and refractive indices. This is determined by researchers in this field, combining refractive indices previously measured by numerous scientists and measurements of new materials using the minimum deviation angle method or an Abbe refractometer. When the system receives a corresponding material category, it automatically searches the database for the corresponding refractive index and outputs it.

[0130] Step 201: Calculate the total number of processing layers based on the refractive index, the punching thickness and the preset moving layer spacing.

[0131] The moving layer spacing is the spacing of each horizontal movement. Figure 7 As shown, when a laser beam enters a sample from air, refraction occurs. The relationship between the incident angle θi, the refraction angle θt, and the refractive index n can be expressed by the formula sinθi / sinθt=n. Theoretically, the relative displacement of the galvanometer (the set interlayer spacing) is equal to the distance from point c to point d, i.e., h2, while the actual displacement of the focal position inside the sample is equal to the distance from point a to point b, i.e., h1. By modifying the above formula, we obtain: h1=nh2. When the interlayer spacing is set to Δx and the total number of layers to be processed is P, the actual focal position moves Δx Pn inside the sample. The actual distance the focal position moves is the punching thickness, so the total number of layers to be processed can be deduced in reverse.

[0132] Step 202: Determine a first clustering layer and a second clustering layer based on the total number of processed layers.

[0133] The first cluster layer is the layer except the top layer. The second cluster layer is the top layer. The purpose of dividing into two clusters here is to use different punching processes in different cluster layers.

[0134] Step 203: Get the current number of layers to be punched.

[0135] The current layer number is the layer number currently being drilled. This can be obtained by measuring the depth of the hole that has already been drilled, or by measuring the current focus position of the laser beam.

[0136] Step 204 : Execute a galvanometer scanning process when the current layer is the first clustering layer.

[0137] The galvanometer scanning process is a non-vector dotting process.

[0138] When the current layer number is the first cluster layer, it means that it is not on the upper surface or close to the upper surface, so it is not easy to produce large edge collapse at this time. Therefore, only the non-vector dotting process can be used at this time, but the galvanometer scanning process.

[0139] The galvanometer scanning process includes:

[0140] Step 2041: Calculate the current relative spacing based on the current number of layers, refractive index, perforation thickness, and preset incident angle and incident height.

[0141] The angle of incidence is the angle at which the laser beam enters the sample. The angle of incidence of the laser beam reflected from the mirror is the same as the angle of incidence. The incident height is the height of the laser beam at the time of incidence. Here, it is the height from the top surface of the mirror when reflected from the galvanometer. Both are manually set and the machine is controlled according to the set values.

[0142] The current relative spacing is the spacing between the two galvanometer lenses that focus the light and reflected light on the current layer. Figure 7 As shown, point a is at the current layer, and the thickness of the current layer is known. Therefore, the spacing within the sample can be calculated using the refraction angle θt and the current thickness. Here, a right triangle is used to determine the hypotenuse by calculating one right-angled side and the angle opposite it. The other right-angled side is then determined using the Pythagorean theorem. The angle of incidence and the incident height then form a right triangle to determine the spacing outside the nutrient. Finally, the spacing within the sample and the spacing outside the nutrient are added to obtain the current relative spacing.

[0143] Step 2042: Control the two galvanometer lenses of the galvanometer to focus according to the current relative spacing, perform scanning laser processing according to the galvanometer parameters and concentric circular scanning trajectory, control the laser source to pulse according to the laser parameters, and then control the galvanometer to move relatively close according to the moving layer spacing, so that the laser focus moves to the layer above the current layer and updates the current layer.

[0144] The two galvanometer mirrors are controlled to focus according to the current relative spacing, so that the focus is on the layer where the current layer is located. Scanning laser processing is performed according to the galvanometer parameters and concentric circular scanning trajectory. The laser source is controlled to pulse according to the laser parameters so that a hole of the punching diameter is melted in this layer. The galvanometer is controlled to move relatively close to each other according to the moving layer spacing, so that the focus of the laser beam is located on the layer above the current layer, and then continue to execute 2041-2042.

[0145] This allows the laser beam to drill the hole from bottom to top. Due to gravity, the resulting debris and plasma will naturally fall from the bottom surface of the through-hole, thus not hindering the subsequent laser beam, that is, there is no plasma shielding effect. Moreover, the verticality of the laser-processed through-hole is very high, with almost no taper.

[0146] Step 205: Execute a vector dotting process when the current level is the second clustering level.

[0147] When it is in the second cluster layer, it means it is at the top, and it is in the pineapple layer, so it is necessary to use a vector dotting process, which can effectively improve the position accuracy of laser dotting and make the dots continuous and uniform.

[0148] Reference Figure 8 , also includes:

[0149] Step 300 : performing an ultrasonic cleaning process on the punched material before starting the galvanometer scanning process and the vector dotting process.

[0150] The core principle of ultrasonic cleaning is the cavitation effect. When ultrasonic waves propagate through a liquid, they generate high-frequency compression and rarefaction waves, which form tiny bubbles within the liquid. These bubbles rapidly expand and collapse under the influence of the sound waves, generating powerful impact forces and high temperatures. This instantaneous high pressure and temperature effectively removes impurities such as dirt, grease, and rust from surfaces.

[0151] Specifically, the sample was immersed in a glass beaker filled with anhydrous ethanol, and then placed in an ultrasonic cleaning machine filled with clean water for ultrasonic cleaning for 2 minutes to remove surface contaminants.

[0152] Step 301: Drying the punched material after completing the ultrasonic cleaning process.

[0153] Use a hot air blower to dry any residual moisture on the surface.

[0154] Reference Figure 9 , the method for determining jump time based on pulse interval time and period distribution diagram includes:

[0155] Step 400: Analyze the period distribution graph to obtain the duration of the movement period, the duration of the fluctuation period, and the duration of the stable period.

[0156] like Figure 3 and Figure 4 As shown in the figure, the duration of the exercise period is the duration of the exercise period, which is Figure 3 The duration of the rising segment in . The duration of the fluctuation period is the duration of the fluctuation period, which is Figure 3 The duration of the period of fluctuation of the curve in is the duration of the stable period, which is Figure 3 The duration of the last horizontal segment in the image. The analysis method is to directly read the corresponding coordinate endpoint.

[0157] Step 401: Calculate the cycle duration based on the duration of the movement period, the duration of the fluctuation period, and the duration of the stable period.

[0158] The cycle duration is the duration of the entire cycle. It is calculated by adding the three together. The purpose of the calculation is to determine how long a cycle is.

[0159] Step 402: Determine a duration difference based on the pulse interval time and the cycle duration, and output the duration difference as the jump time.

[0160] The time difference is the difference between the cycle time and the pulse interval time. The calculation method is to subtract the two. The purpose of using the time difference as the jump time here is to facilitate calculation, because when the difference between the pulse interval time and the time length is equal to the cycle time, it is certain that each time will fall into the stable period. Figure 5 shown.

[0161] Reference Figure 10 , further comprising an optimization method for determining jump time based on the pulse interval time and the period distribution diagram, the method comprising:

[0162] Step 500: Calculate the duration of the unstable period based on the duration of the movement period and the duration of the fluctuation period.

[0163] The duration of the unstable period is the duration of the unstable period, which is the sum of the movement period and the fluctuation period. It is calculated by adding the two.

[0164] Step 501: Determine a jump time range based on the unstable period duration and the duration difference.

[0165] The jump time range is the jump time range. The method of determining here is that the unstable period duration is the minimum jump time value, and the duration difference is the maximum jump time value, thereby forming the jump time range.

[0166] Step 502: Select any time within the jump time range as the preliminary jump time.

[0167] The selection method can be any selection within this jump time range.

[0168] Step 503: Determine a single pulse period and a single pulse distribution diagram based on the pulse interval time and the preparatory jump time.

[0169] The single pulse period is the time required for a single pulse. Figure 5 As shown, it includes a pulse interval time and a preparatory jump time. The calculation method is to add the two. The single pulse distribution diagram is as follows Figure 5 Schematic diagram of the laser light output in the upper half shown.

[0170] It should be noted that there are three pulses in a single pulse cycle, one between the two endpoints and the pulse interval time and the preparatory jump time.

[0171] Step 504: Determine the number of pulses in the single pulse cycle and the number of cycles in the cycle duration based on the single pulse cycle and the cycle duration.

[0172] The number of pulses is the number of times a single pulse occurs. The number of cycles is the number of times a whole cycle occurs.

[0173] The determination method here is that the single pulse period multiplied by the number of pulses is equal to the period length multiplied by the number of periods, and then both are selected as the smallest positive integers that meet the requirements of the equation.

[0174] Step 505: Determine the pulse time point where the pulse light falls based on the single pulse distribution diagram whose number is the pulse number.

[0175] like Figure 5 As shown, the pulse time point is the time point where the pulse light is located, that is, Figure 5 The time point represented by the arrow in the middle can be determined by the distribution time diagram.

[0176] Step 506: When the pulse time points all fall into the preset stable period, the preparation jump time is used as the compliance jump time.

[0177] Here, the time range of each stable period can be counted, and then the pulse time point and the time range can be matched. If the pulse time point successfully matches one of the time ranges, it means that the preparatory jump time meets the requirements and is used as the compliant jump time.

[0178] Step 507: Reselect the preparatory jump time when there is a pulse time point falling into the motion period or the fluctuation period.

[0179] If there is a pulse time point that falls into the motion period or the fluctuation period, it means that the preparatory jump time does not meet the requirements, then a new preparatory jump time is selected and steps 502 to 507 are executed again.

[0180] Step 508: Filter the shortest matching jump time and output it as the jump time.

[0181] It should be noted here that before filtering, steps 502 to 507 are performed on all times within the jump time range, and then step 508 is performed.

[0182] Reference Figure 11 , further comprising an optimization method for determining the number of pulses in a single pulse cycle and the number of cycles in the cycle duration based on the single pulse cycle and the cycle duration, the method comprising:

[0183] Step 600: Determine the number of stable pulses and the extended duration of the stable period based on the pulse interval time and the duration of the stable period.

[0184] The number of stable pulses is the number of pulses that can be generated within the stable period according to the pulse interval. It is calculated by dividing the stable period by the pulse interval and rounding up. The extended stable period is the time it needs to be extended if the stable period is a multiple of the pulse interval. It is calculated by adding one to the number of stable pulses and multiplying it by the pulse interval, minus the stable period. Figure 12 As shown, the middle section is the extended time. When the stable period is extended, after the jump time, the pulse is pulsed according to the number of stable pulses plus one, so that each time can fall steadily into the stable period.

[0185] Step 601: Extend the stable period according to the stable period extension duration, and then output the unstable period duration as the jump time.

[0186] By controlling the pause time of the galvanometer and extending the stable period, the laser can emit light multiple times within the same stable period, thus achieving repeated dotting at one position.

[0187] Reference Figure 13 The method of controlling the galvanometer to move according to the galvanometer parameters and the concentric circular scanning trajectory, and controlling the laser source to pulse according to the actual laser parameters includes:

[0188] Step 700: Define the period length extended according to the extended period of the stable period as a reasonable period length.

[0189] Step 701: Determine a reasonable number of marking times based on a reasonable cycle duration.

[0190] The reasonable number of dot counts is the number of dot counts within a reasonable cycle when the stable period is extended. This can be determined by determining the number of downward arrows from the image.

[0191] Step 702: searching for a corresponding dotting spacing from a preset reasonable database based on the reasonable dotting times.

[0192] The dot spacing is the spacing between the dots that form the holes. When the laser is drilling, the laser spot trajectory is not an ideal circle, but a polygon with very short sides, such as Figure 14 As shown on the left. There is a corner delay at the corner of the polygon, that is, the galvanometer pauses longer here, so the number of pulses at the corner is greater, and the temperature difference between adjacent spots is greater, which aggravates the formation of edge collapse. In summary, due to the superposition of various factors mentioned above, when processing close to the upper surface, the material thickness is thinner and the strength is lower, which is particularly prone to serious edge collapse at the edge of the through hole, resulting in poor processing quality. Therefore, at this time, the spacing between the two dot positions can be appropriately increased to reduce the overlap of the heat-affected zone, thereby reducing edge collapse and improving surface quality. Figure 14 Shown on the right.

[0193] The database stores a mapping between the appropriate number of dotting times and dotting spacing. A technician in this field will perform dotting at the same location using different dotting times and spacings, observing edge collapse and hole formation. If edge collapse is reduced and holes are formed more smoothly, the corresponding dotting spacing will be recorded. Once the system receives the appropriate number of dotting times, it automatically searches the database for the corresponding dotting spacing and outputs it.

[0194] Step 703: Obtain the current circular scanning trajectory.

[0195] The current circular scanning track is the track being scanned. Figure 2 The acquisition method can be either automatic recording after completing a trajectory or determination based on which circular curve the laser beam focus is on in the diagram.

[0196] Step 704: Determine the trajectory circumference based on the current circular scanning trajectory.

[0197] The track circumference is the circumference of the current circular scanning track. It can be determined by directly measuring the corresponding diameter.

[0198] Step 705: Determine the dot coordinates based on the track perimeter and the dot spacing.

[0199] The dot coordinates are the locations where the laser dot is to be placed during the stabilization period. This can be determined by selecting an arbitrary point as the starting point, then scanning the track around the current circle. The next point is the point that is the dot spacing away from the starting point, and then the points that are the dot spacing away from the previous point are all the dot coordinates until the system returns to the starting point.

[0200] Step 706: Control the galvanometer to move to the dot coordinates in sequence according to the galvanometer parameters, and measure the time during the movement to obtain the accumulated time.

[0201] The cumulative time is the time from the last dot coordinate to the last move. The purpose of timing is to ensure that the stable period can be extended.

[0202] Step 707: After moving to the dot coordinate, control the laser source to pulse according to the actual laser parameters.

[0203] This is also equivalent to the laser source being in the jump time when the front galvanometer moves.

[0204] Step 708: After the accumulated time is equal to the reasonable cycle length, continue to control the galvanometer to move to the dot coordinates in sequence according to the galvanometer parameters, and measure the accumulated time during the movement.

[0205] If the accumulated time is equal to the reasonable cycle length, it means that the dotting coordinate has been completed, and then steps 706 to 708 are continued until the dotting of the current circular scanning track is completed, and then the next circular scanning track is dotted.

[0206] Reference Figure 15 ,The method of determining the dot coordinates based on the trajectory perimeter and the dot spacing includes:

[0207] Step 800: Determine the number of dot coordinates and the circumference margin based on the track circumference and the dot spacing.

[0208] The number of dot coordinates is the number of dot coordinates on the current circular scan track. It is determined by dividing the track circumference by the dot spacing and rounding to the nearest integer. The circumference margin is the remaining margin after calculating the dot spacing. It is determined by subtracting the product of the dot spacing and the number of dot coordinates from the track circumference.

[0209] Step 801 : When the circumference margin does not exist, determine the initial dot coordinates based on the current circular scanning trajectory and a preset initial angle.

[0210] The initial angle is the angle in the initial direction, which can be Figure 14 The upper left point in the right figure can also be a point at a certain angle defined by humans, such as 0°. The initial dot coordinates are the points corresponding to the initial angle. When the perimeter margin does not exist, it means that the track perimeter is just divided by the dot spacing, which means that it is just as Figure 14 The points in the right figure are the same, and the interval between any adjacent points is the dot spacing.

[0211] Step 802: Determine subsequent dot coordinates in sequence based on the initial dot coordinates and dot spacing.

[0212] The subsequent dot coordinates are the dot coordinates determined after the initial dot coordinates. The determination method is to scan the track around the current circle and the point with the dot spacing distance from the initial dot coordinates is the next point, and then the points with the dot spacing distance from the previous point are all the subsequent dot coordinates until the initial dot coordinates are returned.

[0213] Step 803: Output the initial dot coordinates and subsequent dot coordinates as dot coordinates.

[0214] Step 804: When the perimeter margin exists, reversely determine the required dotting spacing based on the number of dotting coordinates and the track perimeter.

[0215] The required dot spacing is the spacing required to ensure that the track perimeter just meets the number of dot coordinates corresponding to the dot coordinates. The method to calculate the cow is to divide the track perimeter by the number of dot coordinates.

[0216] Step 805: Based on the required dotting spacing, reverse search the reasonable dotting times from the reasonable database, and define the reasonable dotting times as the required dotting times.

[0217] The required dotting times are the number of dotting times at the same coordinate that satisfies the required dotting spacing. The establishment of the database was introduced in step 702 and will not be repeated here. When the system receives the required dotting spacing, it automatically reverse searches the database to find the corresponding required dotting times and outputs them.

[0218] Step 806: If the required dotting times do not exist, update the dotting coordinate quantity and re-determine the required dotting times.

[0219] If the required number of dot counts does not exist, it means that there is no corresponding mapping relationship in the database. One reason is that the record has not been made yet, or the record is not made because the required number of dot counts cannot be met. If the required number of dot counts does not exist, it means that the dot coordinates cannot be set according to the required dot spacing. Therefore, the dot coordinate number is updated by subtracting one from the number of dot coordinates.

[0220] Here, steps 800 - 805 are then re-executed.

[0221] Step 807: If the required tapping times exist, update the reasonable cycle duration based on the required tapping times.

[0222] When the required number of dotting times exists, it means that the same coordinate can be dotted according to the required number of dotting times. In this way, the distance between two coordinate points can be set according to the corresponding dotting distance. Therefore, the reasonable cycle length is determined in reverse. The update method is to multiply the required number of dotting times by the pulse interval to obtain the stable period length, and then add the jump time (unstable period length) to obtain the reasonable cycle length.

[0223] Step 808: determining subsequent dot coordinates in sequence based on the initial dot coordinates and the required dot spacing, and defining the subsequent dot coordinates as required subsequent dot coordinates.

[0224] Since it has been determined in step 807 that the required number of dots can be placed, the coordinates of the subsequent dots can be determined directly based on the required dotting spacing. The determination method here is similar to that of step 802 and will not be repeated here.

[0225] Step 809: Output the initial dot coordinates and the required subsequent dot coordinates as dot coordinates.

[0226] Based on the same inventive concept, an embodiment of the present invention provides a system for processing small holes in transparent hard and brittle materials.

[0227] A system for processing small holes in transparent hard and brittle materials, comprising:

[0228] The acquisition module is used to obtain the punching material information, laser parameters, galvanometer parameters, current layer number and current circular scanning trajectory;

[0229] A memory for storing a program for controlling a method for machining small holes in transparent hard and brittle materials;

[0230] The processor loads and executes the program in the memory.

[0231] Based on the same inventive concept, an embodiment of the present invention provides an intelligent terminal including a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed to execute a method for processing small holes in transparent hard and brittle materials.

[0232] Those skilled in the art will clearly understand that for the sake of convenience and brevity, the division of the above-mentioned functional modules is only used as an example for illustration. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working processes of the above-mentioned systems, devices, and units can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0233] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, various improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A method for processing small holes in transparent hard and brittle materials, characterized in that: include: Obtaining punching material information of the punching material, wherein the punching material information includes punching thickness, punching diameter, and material type; Based on the punching diameter, the corresponding concentric circular scanning trajectory is found from the preset trajectory database; Acquiring laser parameters and galvanometer parameters, wherein the laser parameters include a pulse repetition frequency and the galvanometer parameters include a scanning speed; Based on the galvanometer parameters, the corresponding period distribution diagram is found from the preset parameter database; Calculate the pulse interval based on the pulse repetition frequency; Determine jump time based on pulse interval time and period distribution diagram; Adjusting the laser parameters based on the jump time to obtain actual laser parameters; Performing a vector dotting process on the punched material, the vector dotting process comprising: The galvanometer is controlled to move according to the galvanometer parameters and the concentric circular scanning trajectory, and the laser source is controlled to pulse according to the actual laser parameters.

2. A method for processing small holes in transparent hard and brittle materials according to claim 1, characterized in that: Before executing the vector dotting process, the following steps are also included: Based on the material category, the corresponding refractive index is found from the preset material database; The total number of processing layers is calculated based on the refractive index, drilling thickness and preset moving layer spacing; Determining a first clustering layer and a second clustering layer based on the total number of processed layers, wherein the first clustering layer is the layers other than the top layer, and the second clustering layer is the top layer; Get the current number of layers to be punched; When the current layer number is the first cluster layer, a galvanometer scanning process is performed, the galvanometer scanning process including: Calculate the current relative spacing based on the current number of layers, refractive index, perforation thickness, and preset incident angle and incident height; Control the two galvanometer mirrors to focus according to the current relative spacing, perform scanning laser processing according to the galvanometer parameters and concentric circular scanning trajectory, control the laser source to pulse according to the laser parameters, and then control the galvanometer to move relatively close according to the moving layer spacing, so that the laser focus moves to the layer above the current layer and updates the current layer number; When the current layer is the second clustering layer, a vector dotting process is performed.

3. A method for processing small holes in transparent hard and brittle materials according to claim 2, characterized in that: Also includes: Perform ultrasonic cleaning on the punched material before starting the galvanometer scanning process and vector dotting process; The punched material is dried after completing the ultrasonic cleaning process.

4. A method for machining small holes in transparent hard and brittle materials according to claim 1, characterized in that: Methods for determining jump time based on pulse interval time and period distribution diagram include: The period distribution diagram is analyzed to obtain the duration of the movement period, the duration of the fluctuation period, and the duration of the stable period; The cycle duration is calculated based on the duration of the movement period, the duration of the fluctuation period, and the duration of the stable period; A time difference is determined based on the pulse interval time and the cycle duration, and the time difference is output as the jump time.

5. A method for machining small holes in transparent hard and brittle materials according to claim 4, characterized in that: Also included is an optimization method for determining jump time based on the pulse interval time and period distribution diagram, the method comprising: The duration of the unstable period is calculated based on the duration of the movement period and the duration of the fluctuation period; Determine the jump time range based on the duration of the unstable period and the duration difference; Select any time within the jump time range as the preliminary jump time; Determine a single pulse period and a single pulse distribution diagram based on the pulse interval time and the preparatory jump time; Determine the number of pulses in a single pulse cycle and the number of cycles in the cycle duration based on the single pulse cycle and the cycle duration; Determining a pulse time point where the pulse light falls based on a single pulse distribution diagram having a number of pulses; When the pulse time points all fall into the preset stable period, the preparatory jump time is used as the compliance jump time; When there is a pulse time point falling into the movement period or the fluctuation period, the preparatory jump time is reselected; The jump time that matches the shortest screening time is output as the jump time.

6. A method for machining small holes in transparent hard and brittle materials according to claim 5, characterized in that: The invention also includes an optimization method for determining the number of pulses in a single pulse cycle and the number of cycles in the cycle duration based on the single pulse cycle and the cycle duration, the method comprising: Determine the number of stable pulses and the extension time of the stable period based on the pulse interval time and the stable period length; The stable period is extended by the stable period extension duration, and then the unstable period duration is output as the jump time.

7. A method for machining small holes in transparent hard and brittle materials according to claim 6, characterized in that: The method of controlling the galvanometer to move according to the galvanometer parameters and the concentric circular scanning trajectory, and controlling the laser source to pulse according to the actual laser parameters includes: The cycle length extended by the stabilization period is defined as the reasonable cycle length; Determine the reasonable number of tapping times based on the reasonable cycle length; Based on the reasonable number of dotting times, the corresponding dotting spacing is found from a preset reasonable database; Get the current circular scanning trajectory; Determine the trajectory circumference based on the current circular scanning trajectory; Determine the dot coordinates based on the track perimeter and dot spacing; Control the galvanometer to move to the dot coordinates in sequence according to the galvanometer parameters, and measure the time during the movement to obtain the accumulated time; When moving to the dot coordinates, the laser source is controlled to pulse according to the actual laser parameters; After the accumulated time is equal to the reasonable cycle length, the galvanometer is continued to be controlled to move to the dot coordinates in sequence according to the galvanometer parameters, and the accumulated time is obtained during the movement.

8. A method for machining small holes in transparent hard and brittle materials according to claim 7, characterized in that: Methods for determining dot coordinates based on track circumference and dot spacing include: Determine the number of dot coordinates and the perimeter margin based on the track perimeter and dot spacing; When the circumference margin does not exist, the initial dot coordinates are determined based on the current circular scanning trajectory and the preset initial angle; Determine the subsequent dot coordinates based on the initial dot coordinates and dot spacing; Output the initial dot coordinates and subsequent dot coordinates as dot coordinates; When perimeter margin exists, the required dotting spacing is determined in reverse based on the number of dotting coordinates and the track perimeter; Based on the required dotting interval, reverse search the reasonable dotting times from the reasonable database, and define the reasonable dotting times as the required dotting times; If the required number of dotting times does not exist, update the number of dotting coordinates and re-determine the required number of dotting times; When the required number of checkpoints exists, the reasonable cycle duration is updated based on the required number of checkpoints; Determine subsequent dot coordinates based on the initial dot coordinates and the required dot spacing, and define the subsequent dot coordinates as the required subsequent dot coordinates; The initial dot coordinates and the required subsequent dot coordinates are output as dot coordinates.

9. A system for processing small holes in transparent hard and brittle materials, characterized in that: include: The acquisition module is used to obtain the punching material information, laser parameters, galvanometer parameters, current layer number and current circular scanning trajectory; A memory for storing a program for a control method for a method for machining small holes in a transparent hard and brittle material according to any one of claims 1 to 8; The processor loads and executes the program in the memory.

10. An intelligent terminal, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executes the method according to any one of claims 1 to 8.

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