Laser chamber device, gas laser device, and method for manufacturing electronic device

Abstract

A chamber device for laser light is provided with: a chamber which has a conductive chamber main body having an opening in the top wall thereof and an insulating plate for closing the opening, and which is filled with a laser gas in the internal space thereof; a first discharge electrode disposed on the inner space side of the insulating plate; a second discharge electrode disposed in the internal space so as to face the first discharge electrode; a fan that causes the laser gas to flow between the first discharge electrode and the second discharge electrode in a direction perpendicular to the optical axis of the laser light; and a return member that is provided on the upstream side of the flow of the laser gas with respect to the second discharge electrode, electrically connects the second discharge electrode and the chamber main body, and has an end portion on the opposite side from the second discharge electrode side connected to the top wall. The linear part comprises a plurality of linear parts which are arranged in parallel along the optical axis; and a plate-shaped part which is provided on the top wall side of the return member, is connected to the plurality of linear portions, and is inclined so as to be on the downstream side of the laser gas further away from the top wall.

Description

Technical Field

[0001] The present disclosure relates to a laser chamber device, a gas laser device, and a method for manufacturing an electronic device. Background Art

[0002] In recent years, semiconductor exposure equipment has been required to improve resolution as semiconductor integrated circuits become increasingly miniaturized and highly integrated. Consequently, there has been a trend toward shortening the wavelength of light emitted by exposure light sources. For example, gas laser devices used for exposure include KrF excimer lasers, which output laser light with a wavelength of approximately 248 nm, and ArF excimer lasers, which output laser light with a wavelength of approximately 193 nm.

[0003] The spectral line width of the natural oscillation light of KrF excimer laser devices and ArF excimer laser devices is as wide as 350pm to 400pm. Therefore, if the projection lens is made of a material that allows ultraviolet rays such as KrF and ArF lasers to pass through, chromatic aberration may sometimes occur. As a result, the resolution may be reduced. Therefore, it is necessary to narrow the spectral line width of the laser output from the gas laser device to a level where chromatic aberration can be ignored. Therefore, in order to narrow the spectral line width, a narrowing module (Line Narrowing Module: LNM) containing narrowing elements (etalon, grating, etc.) is sometimes provided in the laser resonator of the gas laser device. Hereinafter, a gas laser device with a narrowed spectral line width is referred to as a narrowed gas laser device.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 64-53588

[0007] Patent Document 2: Japanese Patent Application Laid-Open No. 5-243645 Summary of the Invention

[0008] A laser chamber device according to one embodiment of the present invention can excite laser gas by discharge to output laser light. The laser chamber device includes: a chamber including a conductive chamber body having an opening in a top wall and an insulating plate blocking the opening, wherein the interior space is filled with laser gas; a first discharge electrode disposed on the interior space side of the insulating plate; a second discharge electrode disposed opposite the first discharge electrode in the interior space; a fan for flowing the laser gas between the first and second discharge electrodes in a direction perpendicular to the optical axis of the laser light; and a return member disposed upstream of the second discharge electrode in terms of the flow of the laser gas, electrically connecting the second discharge electrode to the chamber body, the end of the return member opposite to the second discharge electrode being connected to the top wall, the return member including: a stepped portion comprising a plurality of linear portions arranged in parallel along the optical axis; and a plate-like portion disposed on the top wall side of the return member, connected to the plurality of linear portions, and inclined so as to move farther from the top wall toward the downstream side of the laser gas.

[0009] A gas laser device according to one embodiment of the present disclosure may include a laser chamber device that excites laser gas by discharge to emit laser light. The laser chamber device includes: a chamber including a conductive chamber body having an opening in a top wall and an insulating plate blocking the opening, wherein the interior space is filled with laser gas; a first discharge electrode disposed on the interior space side of the insulating plate; a second discharge electrode disposed opposite the first discharge electrode in the interior space; a fan that causes the laser gas to flow between the first and second discharge electrodes in a direction perpendicular to the optical axis of the laser light; a return member disposed upstream of the second discharge electrode in a flow of the laser gas, electrically connecting the second discharge electrode to the chamber body, the end of the return member opposite to the second discharge electrode being connected to the top wall, the return member including: a stepped portion comprising a plurality of linear portions arranged in parallel along the optical axis; and a plate-shaped portion disposed on the top wall side of the return member, connected to the plurality of linear portions, and inclined so as to move farther from the top wall toward the downstream side of the laser gas.

[0010] The manufacturing method of an electronic device according to one embodiment of the present disclosure may include the following steps: generating laser light by using a gas laser device having a laser chamber device; outputting the laser light to an exposure device; and exposing the laser light on a photosensitive substrate in the exposure device to manufacture the electronic device, wherein the laser chamber device excites the laser gas by discharge to output the laser light, and the laser chamber device comprises: a chamber including a conductive chamber body with an opening provided on a top wall and an insulating plate blocking the opening, wherein the internal space is filled with laser gas; a first discharge electrode arranged on the internal space side of the insulating plate; a second discharge electrode disposed in the internal space in contact with the first discharge electrode; The first discharge electrode and the second discharge electrode are arranged relative to each other; a fan causes the laser gas to flow between the first discharge electrode and the second discharge electrode in a direction perpendicular to the optical axis of the laser; a return component is arranged at a position closer to the upstream side of the laser gas flow than the second discharge electrode, electrically connecting the second discharge electrode to the chamber body, and the end of the return component on the side opposite to the second discharge electrode is connected to the top wall, the return component includes: a step portion, which includes a plurality of linear portions arranged in parallel along the optical axis; and a plate-like portion, which is arranged on the top wall side of the return component, connected to the plurality of linear portions, and inclined in a manner that the farther away from the top wall, the more downstream the laser gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Hereinafter, several embodiments of the present disclosure will be described with reference to the accompanying drawings, merely as examples.

[0012] Figure 1 This is a schematic diagram showing an example of the overall schematic configuration of an electronic device manufacturing apparatus.

[0013] Figure 2 It is a schematic diagram showing an overall schematic configuration example of a gas laser device according to a comparative example.

[0014] Figure 3 It is a cross-sectional view perpendicular to the optical axis of the laser beam of a chamber device of a comparative example.

[0015] Figure 4 This is a diagram showing a return component.

[0016] Figure 5 It is a diagram showing the flow of gas.

[0017] Figure 6 This is a diagram showing the return member in the first embodiment.

[0018] Figure 7 This is a cross-sectional view of the chamber device according to the first embodiment, taken perpendicularly to the optical axis of the laser beam.

[0019] Figure 8 This is a diagram showing a return member in the second embodiment.

[0020] Figure 9This is a cross-sectional view of the chamber device according to the second embodiment, taken perpendicularly to the optical axis of the laser beam.

[0021] Figure 10 This is a cross-sectional view of a chamber device according to a modification of the second embodiment, taken perpendicularly to the optical axis of the laser beam.

[0022] Figure 11 This is a cross-sectional view showing a return member in the third embodiment.

[0023] Figure 12 This is a cross-sectional view showing a modified example of the return member in the third embodiment. DETAILED DESCRIPTION

[0024] 1. Description of the electronic device manufacturing apparatus used in the exposure process of the electronic device

[0025] 2. Description of Comparative Examples

[0026] 2.1 Structure

[0027] 2.2 Action

[0028] 2.3 Topics

[0029] 3. Description of Implementation Method 1

[0030] 3.1 Structure

[0031] 3.2 Function and effect

[0032] 4. Description of Implementation Method 2

[0033] 4.1 Structure

[0034] 4.2 Function and effect

[0035] 4.3 Variations

[0036] 5. Description of Implementation Method 3

[0037] 5.1 Structure

[0038] 5.2 Function and effect

[0039] 5.3 Variations

[0040] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The embodiments described below represent several examples of the present disclosure and do not limit the content of the present disclosure. In addition, not all of the structures and actions described in each embodiment are required to be the structures and actions of the present disclosure. In addition, the same reference numerals are attached to the same components, and repeated descriptions are omitted.

[0041] 1. Description of the electronic device manufacturing apparatus used in the exposure process of the electronic device

[0042] Figure 1 Schematic diagram showing an overall schematic configuration example of an electronic device manufacturing apparatus used in an exposure process of an electronic device. Figure 1 As shown, the manufacturing apparatus used in the exposure process includes a gas laser device 100 and an exposure device 200. The exposure device 200 includes an illumination optical system 210 and a projection optical system 220, wherein the illumination optical system 210 has a plurality of mirrors 211, 212, and 213. The illumination optical system 210 illuminates the mask pattern on the mask carrier RT using the laser light incident from the gas laser device 100. The projection optical system 220 performs a reduced projection of the laser light transmitted through the mask so as to form an image on a workpiece (not shown) arranged on the workpiece stage WT. The workpiece is a photosensitive substrate such as a semiconductor wafer coated with a photoresist. The exposure device 200 exposes the workpiece with the laser light reflecting the mask pattern by moving the mask carrier RT and the workpiece stage WT in parallel in synchronization. By transferring the device pattern to the semiconductor wafer using the above-mentioned exposure process, a semiconductor device as an electronic device can be manufactured.

[0043] 2. Description of Comparative Examples

[0044] 2.1 Structure

[0045] A comparative example gas laser device 100 will be described. Note that the comparative examples disclosed herein are methods that the applicant has recognized as being known only to the applicant, and are not examples that the applicant considers to be publicly known.

[0046] Figure 2 : This is a schematic diagram showing an overall schematic configuration example of a gas laser device 100 of a comparative example. The gas laser device 100 is, for example, an ArF excimer laser device using a mixed gas containing argon (Ar), fluorine (F2), and neon (Ne). The gas laser device 100 emits laser light having a central wavelength of approximately 193 nm. Furthermore, the gas laser device 100 may be a gas laser device other than the ArF excimer laser device, for example, a KrF excimer laser device using a mixed gas containing krypton (Kr), F2, and Ne. In this case, the gas laser device 100 emits laser light having a central wavelength of approximately 248 nm. A mixed gas containing Ar, F2, and Ne as a laser medium, or a mixed gas containing Kr, F2, and Ne as a laser medium is sometimes referred to as a laser gas.

[0047] like Figure 2As shown, the gas laser device 100 includes a housing 110, a laser oscillator 130 disposed within the interior of the housing 110, a monitoring module 160, an aperture 170, and a laser processor 190 as its main components. In the following description, the left side of the paper, along the direction of laser travel, is sometimes referred to as the front side, the right side of the paper as the rear side, the upper side of the paper as the top side, and the lower side of the paper as the bottom side.

[0048] The laser oscillator 130 mainly includes a laser cavity device 101, a charger 141, a narrowband module 145, an output coupling mirror 147, and a pulse compression circuit 150. In the following description, the laser cavity device 101 is sometimes referred to as the cavity device 101. Figure 2 , the internal structure of the chamber device 101 in a cross section along the optical axis of the laser light is shown.

[0049] Figure 3 1 is a cross-sectional view of the chamber device 101 perpendicular to the optical axis of the laser. The chamber device 101 includes a discharge chamber 131. The discharge chamber 131 surrounds an internal space in which light is generated by excitation of the laser medium in the laser gas by discharge described later. Figure 2 、 Figure 3 As shown, the discharge chamber 131 of the chamber apparatus 101 of this embodiment includes a chamber body 131M and an electrical insulating plate 135 as a cover. The chamber body 131M is made of a conductive material such as nickel-plated aluminum or nickel-plated stainless steel.

[0050] An opening 131H is provided in the top wall 131U of the chamber body 131M. This opening 131H is blocked by an electrically insulating plate 135. Specifically, a metal seal 133 is placed within a groove 132 formed on the upper surface of the chamber body 131M. The electrically insulating plate 135 presses against the metal seal 133, thereby flattening it. Thus, the metal seal 133 seals the space between the chamber body 131M and the electrically insulating plate 135. Thus, the chamber body 131M and the electrically insulating plate 135, when combined, surround the interior space of the discharge chamber 131. This interior space is filled with laser gas.

[0051] The electrical insulating plate 135 is made of an insulator. Examples of materials for the electrical insulating plate 135 include alumina ceramics, which have low reactivity with F₂ gas. Furthermore, the electrical insulating plate 135 only needs to have electrical insulating properties. Examples of materials for the electrical insulating plate 135 include resins such as phenolic resin and fluororesin, as well as quartz and glass.

[0052] Within the interior of the discharge chamber 131, a first discharge electrode 134a and a second discharge electrode 134b are spaced apart and face each other, with their respective longitudinal directions aligned along a predetermined direction serving as the laser's optical axis. In this example, the first discharge electrode 134a is located directly above the second discharge electrode 134b. The first and second discharge electrodes 134a and 134b are electrodes used to excite the laser medium through glow discharge. In this example, the first discharge electrode 134a serves as the cathode, and the second discharge electrode 134b serves as the anode.

[0053] The second discharge electrode 134b is supported by a conductive ground plate 137 and electrically connected to the ground plate 137. Spacers 187 are fixed to both sides of the second discharge electrode 134b in a direction perpendicular to its longitudinal direction. The spacers 187 are made of a conductive material and are electrically connected to the ground plate 137 and the second discharge electrode 134b. Examples of materials for the spacers 187 include porous nickel metal, which has low reactivity with laser gas. A return member 300a is connected to the side of one spacer 187 opposite the second discharge electrode 134b, and a return member 300b is connected to the side of the other spacer 187 opposite the second discharge electrode 134b. The return members 300a and 300b are conductive members. Therefore, the return members 300a and 300b are electrically connected to the second discharge electrode 134b. The end of the return member 300a on the side opposite the second discharge electrode 134b is connected to the side adjacent to the opening 131H in the ceiling 131U of the chamber body 131M. The end of the return member 300b on the side opposite the second discharge electrode 134b is connected to the side adjacent to the opening 131H in the ceiling 131U of the chamber body 131M, opposite to the side connected to the return member 300a. Therefore, the return members 300a and 300b electrically connect the second discharge electrode 134b to the chamber body 131M. The chamber body 131M is electrically connected to the ground. Therefore, the second discharge electrode 134b is electrically connected to the ground via the spacer 187, the grounding plate 137, the return members 300a and 300b, and the chamber body 131M. The return members 300a and 300b are preferably made of a material that is less likely to chemically react with the laser gas. Examples of such conductive materials include copper and nickel.

[0054] The first discharge electrode 134a is fixed to the surface of the electrical insulating plate 135 located on the inner space side of the discharge chamber 131 via a current introduction terminal 157, for example, formed by a bolt. Therefore, the first discharge electrode 134a is insulated from the chamber body 131M. The current introduction terminal 157 is electrically connected to the pulse compression circuit 150 and other circuit components, ensuring electrical continuity between the pulse compression circuit 150 and the first discharge electrode 134a.

[0055] The charger 141 is a DC high-voltage power source that supplies electrical energy to the pulse compression circuit 150. A switch 151 is electrically connected to the charger 141 and controlled by the laser processor 190. When the switch 151 is switched from off to on, electrical energy from the charger 141 is supplied to the pulse compression circuit 150. The pulse compression circuit 150 generates a pulsed high voltage based on the electrical energy stored in the charger 141 and applies this high voltage to the first discharge electrode 134a.

[0056] When a high voltage is applied to the first discharge electrode 134a, a discharge occurs between the second discharge electrode 134b and the first discharge electrode 134a due to the potential difference between the first discharge electrode 134a and the second discharge electrode 134b. The energy from this discharge excites the laser medium within the discharge chamber 131, and the excited laser medium emits light when it transitions to a ground state.

[0057] A preionization electrode 180 is provided on the ground plate 137 to the side of the second discharge electrode 134b via a spacer 187 and an end of the return member 300a. The preionization electrode 180 includes a dielectric tube 181, a preionization inner electrode 183, and a preionization outer electrode 185.

[0058] The dielectric tube 181 is disposed longitudinally along the length of the second discharge electrode 134b and is, for example, a cylindrical tube. The dielectric tube 181 is made of, for example, alumina ceramic or sapphire. The preionization inner electrode 183 is rod-shaped and disposed within the dielectric tube 181, extending longitudinally along the tube. The preionization inner electrode 183 is made of, for example, copper or brass. The preionization outer electrode 185 is disposed between the dielectric tube 181 and the second discharge electrode 134b, extending longitudinally along the tube 181, and secured to a spacer 187. The end of the preionization outer electrode 185 contacts the outer circumference of the dielectric tube 181. However, at least a portion of the end of the preionization outer electrode 185 may not contact the outer circumference of the dielectric tube 181, as long as the corona discharge described below is generated.

[0059] The preionization inner electrode 183 is electrically connected to the pulse compression circuit 150 via a preionization capacitor (not shown). The preionization outer electrode 185 is electrically connected to the second discharge electrode 134b via the ground plate 137 and to the chamber body 131M via the ground plate 137 and return members 300a and 300b. Therefore, the preionization outer electrode 185 is electrically connected to the ground line. By applying a high voltage from the pulse compression circuit 150 to the preionization inner electrode 183 and the preionization outer electrode 185, a corona discharge is generated near the end of the preionization outer electrode 185. This corona discharge helps stabilize the glow discharge generated between the first discharge electrode 134a and the second discharge electrode 134b.

[0060] A stabilizer 138a is provided on the side surface of the ground plate 137 on the side where the return member 300a is provided. Furthermore, a guide 138b is provided on the lower surface of the ground plate 137 on the side where the return member 300b is provided. Stabilizer 138a and guide 138b are components that regulate the flow of the laser gas so that it flows in the appropriate direction.

[0061] A cross-flow fan 149 and a heat exchanger 148 are disposed on the side of the discharge chamber 131 opposite to the second discharge electrode 134b, relative to the ground plate 137. The space in the discharge chamber 131 where the cross-flow fan 149 and the heat exchanger 148 are disposed communicates with the space between the second discharge electrode 134b and the first discharge electrode 134a. The heat exchanger 148 is disposed next to the cross-flow fan 149 and is a radiator connected to a pipe (not shown) through which a cooling medium flows. Figure 2 As shown, the cross flow fan 149 is connected to a motor 149a disposed outside the discharge chamber 131 and rotates by the rotation of the motor 149a. As the cross flow fan 149 rotates, the laser gas filled into the inner space of the discharge chamber 131 is rotated as shown in FIG. Figure 3 The laser gas circulates as indicated by the arrows. Specifically, crossflow fan 149 causes the laser gas to flow between first discharge electrode 134a and second discharge electrode 134b in a direction approximately perpendicular to the laser optical axis. This flow of laser gas allows return member 300a to be positioned upstream of the laser gas, while return member 300b is positioned downstream of the laser gas. At least a portion of the circulating laser gas passes through heat exchanger 148 to regulate its temperature.

[0062] Laser gas is supplied from a laser gas supply source (not shown) through a pipe (not shown). The laser gas in the discharge chamber 131 is passed through a halogen filter to remove F2 gas, and then exhausted into the housing 110 through a pipe (not shown) by an exhaust pump (not shown).

[0063] A pair of windows 139a and 139b are provided on the wall of the discharge chamber 131. Window 139a is located at one end of the discharge chamber 131 in the direction of laser light travel, while window 139b is located at the other end in the same direction. Windows 139a and 139b sandwich the space between the first discharge electrode 134a and the second discharge electrode 134b. Windows 139a and 139b can also be tilted to form a Brewster angle with respect to the direction of laser light travel to suppress laser light reflection. As described later, the oscillating laser light is emitted outside the discharge chamber 131 through windows 139a and 139b. As described above, a pulsed high voltage is applied between the first discharge electrode 134a and the second discharge electrode 134b by the pulse compression circuit 150, resulting in pulsed laser light.

[0064] The narrowband module 145 includes a housing 145a, a prism 145b, a grating 145c, and a rotating stage (not shown) disposed in the interior of the housing 145a. The housing 145a has an opening, and the housing 145a is connected to the rear side of the discharge chamber 131 through the opening.

[0065] The prism 145B expands the beam width of the light emitted from the window 139a, causing the light to enter the grating 145c. In addition, the prism 145b reduces the beam width of the reflected light from the grating 145c and causes the light to return to the internal space of the discharge chamber 131 through the window 139a. The prism 145b is supported by a rotating stage and rotated by the rotating stage. The rotation of the prism 145b changes the incident angle of the light relative to the grating 145c, and the wavelength of the light returned from the grating 145c through the prism 145b to the discharge chamber 131 can be selected. Figure 2 , an example in which one prism 145 b is arranged is shown, but at least one prism only needs to be arranged.

[0066] The surface of grating 145C is made of a high-reflectivity material and has multiple grooves spaced at regular intervals. The cross-sectional shape of each groove is, for example, a right triangle. Light incident on grating 145c from prism 145b, when reflected by these grooves, is diffracted in a direction corresponding to its wavelength. Grating 145C is configured by Littrow so that the angle of incidence of light incident on grating 145C from prism 145B matches the diffraction angle of diffracted light of a desired wavelength. As a result, light near the desired wavelength is returned to discharge chamber 131 via prism 145b.

[0067] Output coupling mirror 147 is located within the interior of optical tube 147a, connected to the front side of discharge chamber 131, and faces window 139b. Output coupling mirror 147 transmits a portion of the laser light emitted from window 139b toward monitoring module 160, while reflecting the remaining portion, which returns through window 139b to the interior of discharge chamber 131. Thus, grating 145c and output coupling mirror 147 form a Fabry-Perot laser resonator.

[0068] Monitoring module 160 is disposed on the optical path of the laser light emitted from output coupling mirror 147. Monitoring module 160 includes a housing 161, a beam splitter 163 disposed within the interior of housing 161, and a light sensor 165. Housing 161 has an opening formed therein, and the interior of housing 161 communicates with the interior of optical tube 147a through the opening.

[0069] Beam splitter 163 transmits a portion of the laser light emitted from output coupling mirror 147 toward aperture 170 and reflects the other portion toward the light receiving surface of optical sensor 165. Optical sensor 165 outputs a signal indicating energy E of the laser light incident on the light receiving surface to laser processor 190.

[0070] The laser processor 190 of the present disclosure is a processing device comprising a storage device 190a storing a control program and a CPU (Central Processing Unit) 190B that executes the control program. Laser processor 190 is specifically configured or programmed to perform the various processes included in the present disclosure. Furthermore, laser processor 190 controls the entire gas laser device 100.

[0071] The laser processor 190 exchanges various signals with the exposure processor 230 of the exposure device 200. For example, the laser processor 190 receives signals indicating the emission trigger Tr (described later) and the target energy Et from the exposure processor 230. The target energy Et is the target value for the laser energy used in the exposure process. The laser processor 190 controls the charge voltage of the charger 141 based on the energy E received from the optical sensor 165 and the target energy Et received from the exposure processor 230. By controlling the charge voltage, the laser energy is controlled. Furthermore, the laser processor 190 is electrically connected to the aperture 170 and controls the opening and closing of the aperture 170.

[0072] The light emission trigger Tr is a timing signal used by the exposure processor 230 to cause the laser oscillator 130 to oscillate laser light. It is an external trigger. The light emission trigger Tr can also be defined by a predetermined laser repetition frequency f and a predetermined pulse number P. The laser repetition frequency f is, for example, 100 Hz or higher and 10 kHz or lower.

[0073] Aperture 170 is disposed on the optical path within the interior space of optical tube 171, which communicates with an opening formed in housing 161 of monitoring module 160 on the side opposite to the side connected to optical tube 147a. A purge gas is supplied and filled into the interior spaces of optical tubes 171 and 147a, and the interior spaces of housings 161 and 145a. The purge gas contains an inert gas such as nitrogen (N2). The purge gas is supplied from a purge gas supply source (not shown) through piping (not shown). Furthermore, optical tube 171 communicates with exposure device 200 through an opening in housing 110 and optical tube 500 connecting housing 110 and exposure device 200. Laser light passing through aperture 170 enters exposure device 200.

[0074] The exposure processor 230 of the present disclosure is a processing device including a storage device storing a control program and a CPU that executes the control program. The exposure processor 230 is specially configured or programmed to perform various processes included in the present disclosure. In addition, the exposure processor 230 controls the entire exposure device 200.

[0075] Next, the structure of the return members 300a and 300b will be described.

[0076] In this example, the return members 300a and 300b have the same structure, so only the return member 300a will be described. Figure 4 300a. Figure 4 As shown, the return member 300a is formed by punching and bending a metal plate and includes a plate-shaped first fixing portion 311, a plate-shaped second fixing portion 312, and a stepped portion 320 connecting the first fixing portion 311 and the second fixing portion 312. The thickness of the punched and bent metal plate is, for example, 1.0 mm to 1.2 mm.

[0077] The first fixing portion 311 is a member having a substantially rectangular main surface and is attached to the ceiling wall 131U of the chamber body 131M with its longitudinal direction aligned with the longitudinal direction of the first discharge electrode 134a. The second fixing portion 312 has a shape substantially identical to the first fixing portion 311 and is attached to the spacer 187 with its longitudinal direction aligned with the longitudinal direction of the second discharge electrode 134b.

[0078] The step portion 320 is formed by a plurality of linear portions 321 arranged in parallel. The width of each linear portion 321 is, for example, approximately 1.0 mm. One end of each linear portion 321 is connected to the first fixing portion 311, and the other end is connected to the second fixing portion 312. As described above, in this example, the return component 300a is formed by punching a metal plate, so the connection is not performed by welding or brazing, but is a state of continuous metal phase. Each linear portion 321 is connected to the first fixing portion 311 and the second fixing portion 312, and the plurality of linear portions 321 are arranged in parallel along the length direction of the first discharge electrode 134a and the second discharge electrode 134b, wherein the length direction of the first discharge electrode 134a and the second discharge electrode 134b is along the optical axis of the laser. The width of the gap between adjacent linear portions 321 is, for example, 19.0 mm to 19.5 mm, such as Figure 3 As shown, laser gas can pass through this gap.

[0079] The first fixing portion 311 is bent between each linear portion 321, so that the length direction of each linear portion 321 is not parallel to the width direction of the first fixing portion 311. Furthermore, the second fixing portion 312 is bent between each linear portion 321, so that the length direction of each linear portion 321 is not parallel to the width direction of the second fixing portion 312. Furthermore, the width direction of the first fixing portion 311 and the width direction of the second fixing portion 312 are not parallel to each other, for example, forming an angle of approximately 90 degrees.

[0080] 2.2 Action

[0081] Next, the operation of the gas laser device 100 according to the comparative example will be described.

[0082] Before the gas laser device 100 emits laser light, purge gas is filled from a purge gas supply source (not shown) into the interior spaces of the optical tubes 147a, 171, and 500, and the interior spaces of the housings 145a and 161. Furthermore, laser gas is supplied from a laser gas supply source (not shown) into the interior space of the discharge chamber 131. During the supply of laser gas, the laser processor 190 controls the motor 149a to rotate the crossflow fan 149. The rotation of the crossflow fan 149 circulates the laser gas within the interior space of the discharge chamber 131. At this time, the gap between the chamber body 131M and the electrically insulating plate 135 is sealed by the metal seal 133, preventing the laser gas from leaking outside the discharge chamber 131.

[0083] The laser gas passes through the cross flow fan 149 as Figure 3 The laser gas circulates as shown by the arrows. At this time, the laser gas passes between the linear portions 321 of the return member 300a, which is located upstream of the first and second discharge electrodes 134a, 134b in terms of the laser gas flow. The laser gas then passes between the first and second discharge electrodes 134a, 134b, and between the linear portions 321 of the return member 300b, which is located downstream of the first and second discharge electrodes 134a, 134b in terms of the laser gas flow.

[0084] When the laser processor 190 receives a signal indicating the target energy Et and a signal indicating the emission trigger Tr from the exposure processor 230, it controls the gas laser device 100 to emit laser light. Upon receiving the signal indicating the target energy Et, the laser processor 190 closes the aperture 170 and activates the charger 141. Furthermore, the laser processor 190 turns on the switch 151 of the pulse compression circuit 150. This causes current from the charger 141 to flow through the pulse compression circuit 150, applying a pulsed high voltage to the first discharge electrode 134a via the current introduction terminal 157 for a short period of time. Furthermore, the timing of applying the high voltage between the preionization inner electrode 183 and the preionization outer electrode 185 is slightly earlier than the timing of applying the high voltage between the first discharge electrode 134a and the second discharge electrode 134b. When the high voltage is applied between the preionization inner electrode 183 and the preionization outer electrode 185, a corona discharge occurs near the ends of the dielectric tube 181 and the preionization outer electrode 185, emitting ultraviolet light. When ultraviolet light is irradiated on the laser gas between the first and second discharge electrodes 134a, 134b, the laser gas between the first and second discharge electrodes 134a, 134b is pre-ionized. After pre-ionization, as described above, when a high voltage is applied between the first and second discharge electrodes 134a, 134b, a main discharge occurs between the first and second discharge electrodes 134a, 134b. At this time, because the multiple linear portions 321 of the return members 300a, 300b are aligned along the length of the second discharge electrode 134b, the main discharge can be prevented from becoming uneven along the lengths of the first and second discharge electrodes 134a, 134b.

[0085] This main discharge causes the laser medium contained in the laser gas between the first discharge electrode 134a and the second discharge electrode 134b to enter an excited state. When the laser medium returns to its ground state, it emits light. This light resonates between the grating 145c and the output coupling mirror 147, and is amplified each time it passes through the discharge space within the discharge chamber 131, causing laser oscillation. A portion of the resonant laser light passes through the output coupling mirror 147 as pulsed laser light and travels toward the beam splitter 163.

[0086] A portion of the laser light that has reached beam splitter 163 is reflected by beam splitter 163 and received by optical sensor 165. Optical sensor 165 measures the energy E of the received laser light and outputs a signal indicating the energy E to laser processor 190. Laser processor 190 controls the charging voltage so that the difference ΔE between energy E and target energy Et falls within an allowable range. Once the difference ΔE falls within the allowable range, laser processor 190 transmits a reception preparation completion signal indicating that reception preparation of light emission trigger Tr has been completed to exposure processor 230.

[0087] Upon receiving the reception preparation completion signal, the exposure processor 230 transmits a light emission trigger Tr to the laser processor 190. When the laser processor 190 opens the aperture 170 in synchronization with the reception of the light emission trigger Tr, the laser light that has passed through the aperture 170 enters the exposure device 200. This laser light is, for example, a pulsed laser light having a central wavelength of 193 nm.

[0088] 2.3 Topics

[0089] Figure 5 1 is a diagram showing in detail the flow of the laser gas. The first discharge electrode 134a is located in the inner space of the discharge chamber 131. Figure 5 As shown, part of the laser gas may have difficulty flowing, generating stagnation S and vortex V. In this case, part of the laser gas separates, causing the flow rate of the laser gas to decrease, making the main discharge unstable, and possibly reducing the stability of the laser light emitted from the gas laser device 100.

[0090] Therefore, in the following embodiments, a laser chamber device 101 and a gas laser device 100 capable of emitting stable laser light are exemplified.

[0091] 3. Description of Implementation Method 1

[0092] Next, the laser chamber apparatus 101 according to Embodiment 1 will be described. Components identical to those described above are denoted by the same reference numerals, and duplicate descriptions will be omitted unless otherwise noted. In some drawings, for ease of illustration, portions of components may be omitted or simplified. For identical components, only some reference numerals may be assigned, while others may be omitted.

[0093] 3.1 Structure

[0094] Figure 6 1 is a diagram showing a return member 300a in this embodiment. Figure 7 FIG is a cross-sectional view of the chamber device 101 of this embodiment perpendicular to the optical axis of the laser. Figure 6As shown, the return part 300a of this embodiment differs from the return part 300a of the comparative example in that it includes a plate-shaped portion 330. In addition, the return part 300b has the same structure as the comparative example. The plate-shaped portion 330 is provided on the top wall 131U side of the return part 300a, and is a flat plate-shaped component whose main surfaces 331a and 331b are roughly rectangular in shape. The main surface 331a faces the upstream side of the laser gas, and the main surface 331b faces the downstream side of the laser gas. The side surface of one side of the plate-shaped portion 330 along the longitudinal direction is connected to the first fixing portion 311. Therefore, the longitudinal direction of the plate-shaped portion 330 is along the longitudinal direction of the first discharge electrode 134a. The side surface of the other side of the plate-shaped portion 330 along the longitudinal direction is connected to the plurality of linear portions 321.

[0095] In the present embodiment, as in the comparative example, the return part 300a is formed by punching and bending a metal plate. Therefore, the plate-like portion 330 is made of the same material as the return part 300a described in the comparative example. In addition, no welding mark or brazing mark is formed at the connection between the plate-like portion 330 and the first fixing portion 311, and the plate-like portion 330 and the first fixing portion 311 are seamlessly connected. Here, seamlessly connected is synonymous with continuously formed. In the present embodiment, as in the comparative example, the first fixing portion 311 is fixed to the top wall 131U, so the first fixing portion 311 can be understood as a connecting plate portion connected to the top wall 131U. In addition, the plate-like portion 330 is seamlessly connected to the linear portion 321. In addition, in Figure 7 In FIG. 3 , for easy understanding, the boundary between the plate-shaped portion 330 and the linear portion 321 is shown.

[0096] The connection between the first fixing portion 311 and the plate-shaped portion 330 is bent, and the plate-shaped portion 330 is tilted so that the further away from the top wall 131U, the more downstream the laser gas. As described above, in this embodiment, the plate-shaped portion 330 is flat, so the tilt direction of the plate-shaped portion 330 is fixed and is independent of the distance from the top wall 131U. The width direction of the plate-shaped portion 330 is θ relative to the direction perpendicular to the main surface of the first fixing portion 311. 1A The angle with respect to the width direction of the first fixing portion 311 is θ 1B Since the sum of all angles is 90 degrees, θ 1A and θ 1B is an acute angle. It can be θ 1A <θ 1B ,θ 1A >θ 1B and θ 1A =θ 1BHere, let the width of the plate-like portion 330 be D, and let the vertical distance from the top wall 131U to the lowest position of the first discharge electrode 134a be L. In this case, it is preferable to satisfy the following formula (1).

[0097] D×cosθ 1A ≤L···(1)

[0098] By satisfying equation (1), when the first discharge electrode 134a is viewed from the downstream side of the laser gas flow in a direction perpendicular to the direction from the first discharge electrode 134a toward the second discharge electrode 134b, the plate-shaped portion 330 is obscured by the first discharge electrode 134a. Furthermore, depending on the thickness of the plate-shaped portion 330, even when equation (1) is satisfied, the plate-shaped portion 330 may be visible below the first discharge electrode 134a within a range smaller than the thickness of the plate-shaped portion 330. However, this is within the margin of error, and such a state can be understood as the plate-shaped portion 330 being obscured by the first discharge electrode 134a. In other words, if equation (1) is satisfied, the plate-shaped portion 330 can be considered obscured by the first discharge electrode 134a.

[0099] In addition, the following formula (2) may also be satisfied.

[0100] D×cosθ 1A <L···(2)

[0101] 3.2 Function and effect

[0102] In the laser chamber apparatus 101 of this embodiment, the return member 300a, positioned upstream of the second discharge electrode 134b in the laser gas flow, includes a stepped portion 320 comprising multiple linear portions 321 arranged parallel to the optical axis; and a plate-shaped portion 330, located on the top wall 131U side of the return member 300a and connected to the linear portions 321. The plate-shaped portion 330 is tilted so that the further away from the top wall 131U the return member 300a is, the more downstream the laser gas flow becomes. This plate-shaped portion 330 straightens the laser gas flow, thereby suppressing stagnation and eddy currents in the laser gas flow. This reduces the decrease in the laser gas flow rate and prevents instability in the main discharge. Consequently, the laser chamber apparatus 101 of this embodiment enables stable laser emission. Furthermore, the area surrounding the first discharge electrode 134a is susceptible to affecting the inductance of the discharge circuit and is subject to significant potential fluctuations. Therefore, placing a new component around the first discharge electrode 134a would affect the inductance of the discharge circuit, potentially reducing efficiency. However, in this embodiment, by using a portion of the already-placed return member 300a as the plate-shaped portion 330 for rectification, the effect on the inductance of the discharge circuit can be minimized compared to a case where the plate-shaped portion 330 is located at a position separate from the return member 300a. Therefore, despite the addition of a new rectification component, a reduction in efficiency can be minimized.

[0103] In the return member 300a of this embodiment, the inclination direction of the plate-shaped portion 330 is constant regardless of the distance from the top wall 131U. Therefore, the plate-shaped portion 330 can be formed from a flat plate, which reduces costs compared to a case where the plate-shaped portion 330 is curved.

[0104] In the return member 300a of this embodiment, the side surfaces of the plate portion 330 are connected to the linear portion 321. Therefore, the thickness of the return member 300a can be reduced compared to a case where the main surfaces 331a and 331b of the plate portion 330 are connected to the linear portion 321.

[0105] In the return member 300a of this embodiment, the plate-like portion 330 is seamlessly connected to the linear portion 321. Therefore, the plate-like portion 330 can be formed simultaneously with the linear portion 321 by punching. Therefore, the return member 300a can be manufactured at a low cost. Furthermore, if welding marks, brazing marks, or other similar connection marks remain at the connection between the plate-like portion 330 and the linear portion 321, these connection marks extend between the linear portion 321 and could potentially act as resistance to the flow of the laser gas. However, by eliminating the seam between the plate-like portion 330 and the linear portion 321, as in this embodiment, the generation of such resistance can be suppressed.

[0106] In the return member 300a of this embodiment, the plate-shaped portion 330 is seamlessly connected to the first fixing portion 311, which serves as the connecting plate portion. Therefore, the first fixing portion 311 and the plate-shaped portion 330 can be formed by bending a metal plate comprising the first fixing portion 311 and the plate-shaped portion 330. Consequently, the return member 300a can be manufactured at a lower cost than when the plate-shaped portion 330 is welded or brazed to the first fixing portion 311.

[0107] In the return member 300a of this embodiment, when the first discharge electrode 134a is viewed from the downstream side of the laser gas flow in a direction perpendicular to the direction from the first discharge electrode 134a toward the second discharge electrode 134b, the plate-shaped portion 330 is shielded by the first discharge electrode 134a. In other words, the above-mentioned equation (1) is satisfied. Therefore, compared to a case where the plate-shaped portion 330 extends from the first discharge electrode 134a, the plate-shaped portion 330 is less likely to obstruct the flow of the laser gas.

[0108] 4. Description of Implementation Method 2

[0109] Next, the laser chamber apparatus 101 according to Embodiment 2 will be described. Components identical to those described above are denoted by the same reference numerals, and duplicate descriptions will be omitted unless otherwise noted. In some drawings, for ease of illustration, portions of components may be omitted or simplified. For identical components, only some reference numerals may be assigned, while others may be omitted.

[0110] 4.1 Structure

[0111] Figure 8 1 is a diagram showing a return member 300a in this embodiment. Figure 9 FIG is a cross-sectional view of the chamber device 101 of this embodiment perpendicular to the optical axis of the laser. Figure 8 、 Figure 9 As shown, the return member 300a of this embodiment differs from the return member 300a of Embodiment 1 in that the main surface 331b on the downstream side of the laser gas in the plate-shaped portion 330 is connected to each linear portion 321. In this embodiment, the plate-shaped portion 330 and the linear portion 321 are connected by welding or brazing.

[0112] In this embodiment, the first fixing portion 311 can also be understood as a connecting plate portion connected to the top wall 131U. In this embodiment, the linear portion 321 is seamlessly connected to the connecting plate portion. Furthermore, in this embodiment, the return member 300a includes a third fixing portion 333 seamlessly connected to the plate-shaped portion 330. The third fixing portion 333 is fixed to the top wall 131U together with the first fixing portion 311.

[0113] In this embodiment, the width of the plate-shaped portion 330 is D, and the vertical distance from the top wall 131U to the lowest position of the first discharge electrode 134a is L. Furthermore, the thickness of the first fixing portion 311 is T. In this embodiment, the following formula (3) is preferably satisfied.

[0114] T+D×cosθ 1A ≤L···(3)

[0115] By satisfying equation (3), the plate-like portion 330 is shielded by the first discharge electrode 134a when observing the first discharge electrode 134a in the same manner as in embodiment 1, as in the case where equation (1) is satisfied in embodiment 1. Furthermore, in this embodiment, the method of considering errors is the same as in embodiment 1.

[0116] In addition, the following formula (4) may also be satisfied.

[0117] T+D×cosθ 1A <L···(4)

[0118] 4.2 Function and effect

[0119] In this embodiment, the downstream main surface 331b of the plate-like portion 330 is connected to the linear portion 321. Therefore, the plate-like portion 330 can simply be connected to the return member 300a of the comparative example. This allows for retrofitting. Furthermore, since the stepped portion 320 and the plate-like portion 330 can be formed separately, manufacturing flexibility is increased. Furthermore, since the main surface connected to the linear portion 321 is the downstream main surface, there are no irregularities on the upstream side, which reduces resistance to the flow of laser gas.

[0120] 4.3 Variations

[0121] Next, a modification of this embodiment will be described. Figure 10 FIG is a cross-sectional view of the chamber device 101 in a modified example of this embodiment, perpendicular to the optical axis of the laser. Figure 10 As shown, the return member 300a of this modification differs from the return member 300a of Embodiment 2 in that the main surface 331a on the upstream side of the laser gas in the plate-shaped portion 330 is connected to each linear portion 321. Therefore, in this modification, the third fixing portion 333 is fixed to the top wall 131U, and the third fixing portion 333 can be understood as a connecting plate portion connected to the top wall 131U. In this modification, the plate-shaped portion 330 and the connecting plate portion are seamlessly connected.

[0122] In the case of this modification, similarly to Embodiment 1, by satisfying Formula (1), the plate-like portion 330 is shielded by the first discharge electrode 134a when observing the first discharge electrode 134a similarly to Embodiment 1. Alternatively, Formula (2) may be satisfied.

[0123] In this variation, the upstream main surface 331a of the plate-like portion 330 is connected to the linear portion 321 , so the plate-like portion 330 serves as a reinforcement for the linear portion 321 in terms of wind pressure applied in the gas flow direction, thereby increasing the rigidity of the return component 300a.

[0124] 5. Description of Implementation Method 3

[0125] Next, the laser chamber apparatus 101 according to Embodiment 3 will be described. Components identical to those described above are denoted by the same reference numerals, and duplicate descriptions will be omitted unless otherwise noted. In some drawings, for ease of illustration, portions of components may be omitted or simplified. For identical components, only some reference numerals may be assigned, while others may be omitted.

[0126] 5.1 Structure

[0127] Figure 11 This is a cross-sectional view of the return member 300a in this embodiment. The return member 300a in this embodiment differs from the return member 300a in Embodiment 1 in that the plate-shaped portion 330 is inclined so that the further away from the top wall 131U, the closer the inclination becomes to the direction from the first discharge electrode 134a to the second discharge electrode 134b. In this embodiment, the plate-shaped portion 330 includes multiple flat portions 330a, 330b, and 330c. In this embodiment, the entire plate-shaped portion 330 is composed of multiple flat portions 330a to 330c. The flat portions 330a, 330b, and 330c are located farther away from the top wall 131U in this order, and their inclinations in this order become closer to the direction from the first discharge electrode 134a to the second discharge electrode 134b. Each flat portion 330a to 330c is formed by bending a metal flat plate. Therefore, the flat plate portion 330a is seamlessly connected to the flat plate portion 330b, and the flat plate portion 330b is seamlessly connected to the flat plate portion 330c.

[0128] The side surface of the flat plate portion 330a opposite to the flat plate portion 330b is a side surface of the plate-shaped portion 330 and is connected to the first fixing portion 311, similarly to the first embodiment. The side surface of the flat plate portion 330c opposite to the flat plate portion 330b is a side surface of the plate-shaped portion 330 and is connected to each linear portion 321, similarly to the first embodiment.

[0129] In this embodiment, similarly to Embodiment 1, when observing the first discharge electrode 134a, it is preferable that the plate-like portion 330 is shielded by the first discharge electrode 134a. The widths and inclinations of the flat plate portions 330a, 330b, and 330c are set in this manner.

[0130] In addition, in the present embodiment, the number of the flat plate portions is set to three, but the number of the plurality of flat plate portions is not particularly limited and may be two or four or more.

[0131] 5.2 Function and effect

[0132] In the return member 300a of this embodiment, the plate-shaped portion 330 is tilted so that the further away from the top wall 131U, the closer the tilt becomes to the direction from the first discharge electrode 134a toward the second discharge electrode 134b. Therefore, compared to the return member 300a of Embodiment 1, the flow of the laser gas can be varied in stages. Consequently, the flow of the laser gas can be rectified with greater precision.

[0133] 5.3 Variations

[0134] Next, a modification of this embodiment will be described. Figure 12 is a cross-sectional view of the return member 300a in this variation. The return member 300a in this variation differs from the third embodiment in that it includes a curved plate portion 330d whose inclination direction gradually changes. In this embodiment, the entire plate portion 330 is composed of the curved plate portion 330d. By configuring the plate portion 330 in this manner, as the plate portion 330 moves away from the top wall 131U, the inclination direction of the plate portion 330 gradually approaches the direction from the first discharge electrode 134a toward the second discharge electrode 134b. Therefore, the flow of the laser gas can be gradually varied. As a result, the flow of the laser gas can be rectified with greater precision than the return member 300a in the third embodiment.

[0135] In addition, the plate-shaped portion 330 of the second embodiment and the plate-shaped portion 330 of the modified example of the second embodiment may include multiple flat plate portions 330a, 330b, and 330c like the plate-shaped portion 330 of the present embodiment, or may include a curved plate portion 330d like the plate-shaped portion 330 of the modified example of the present embodiment.

[0136] The above description is not limiting but merely illustrative. Therefore, it is obvious to those skilled in the art that changes can be made to the embodiments of the present disclosure without departing from the scope of the claims. In addition, it is obvious to those skilled in the art that the embodiments of the present disclosure can be used in combination. Unless otherwise specified, the terms used in this specification and claims should be interpreted as "non-restrictive" terms. For example, terms such as "including", "having", "having", and "having" should be interpreted as "not excluding the presence of constituent elements other than the described constituent elements". In addition, the modifier "1" should be interpreted as "at least 1" or "1 or more". In addition, terms such as "at least one of A, B and C" should be interpreted as "A", "B", "C", "A+B", "A+C", "B+C" or "A+B+C", and should also be interpreted as including combinations of them with contents other than "A", "B" and "C".

Claims

1. A laser chamber device that excites laser gas by discharge to output laser light, wherein: The laser chamber device comprises: The chamber includes a conductive chamber body having an opening on a top wall and an insulating plate blocking the opening, wherein the laser gas is filled in the inner space; a first discharge electrode disposed on the inner space side of the insulating plate; a second discharge electrode disposed opposite to the first discharge electrode in the internal space; a fan that causes the laser gas to flow between the first discharge electrode and the second discharge electrode in a direction perpendicular to the optical axis of the laser light; and a return member disposed upstream of the second discharge electrode in the flow of the laser gas, electrically connecting the second discharge electrode to the chamber body, wherein an end of the return member on the side opposite to the second discharge electrode is connected to the top wall; The return member includes: a step portion including a plurality of linear portions arranged in parallel along the optical axis; and a plate-shaped portion provided on the top wall side of the return member, connected to the plurality of linear portions, and inclined so as to be closer to the downstream side of the laser gas as the portion is farther from the top wall.

2. The laser chamber device according to claim 1, wherein: The inclination direction of the plate-shaped portion is formed so that the farther away from the top wall, the closer the inclination direction is to the direction from the first discharge electrode toward the second discharge electrode.

3. The laser chamber device according to claim 2, wherein: The plate-shaped portion includes a plurality of flat plate portions having different inclination directions and connected to each other.

4. The laser chamber device according to claim 2, wherein: The plate-shaped portion includes a curved plate portion whose inclination direction gradually changes.

5. The laser chamber device according to claim 1, wherein: The inclination direction of the plate-shaped portion is constant regardless of the distance from the top wall.

6. The laser chamber device according to claim 1, wherein: The side surface of the plate-shaped portion is connected to the linear portion.

7. The laser chamber device according to claim 6, wherein: The plate-shaped portion is seamlessly connected to the linear portion.

8. The laser chamber device according to claim 6, wherein: The return component includes a connecting plate portion connected to the top wall, The plate-shaped portion is seamlessly connected to the connecting plate portion.

9. The laser chamber device according to claim 1, wherein: The main surface of the plate-shaped portion is connected to the linear portion.

10. The laser chamber device according to claim 9, wherein: The main surface is a main surface on the downstream side of the laser gas.

11. The laser chamber device according to claim 10, wherein: The return component includes a connecting plate portion connected to the top wall, The linear portion is seamlessly connected to the connecting plate portion.

12. The laser chamber device according to claim 9, wherein: The main surface is a main surface on the upstream side of the laser gas.

13. The laser chamber device according to claim 12, wherein: The return component includes a connecting plate portion connected to the top wall, The plate-shaped portion is seamlessly connected to the connecting plate portion.

14. The laser chamber device according to claim 1, wherein: When the first discharge electrode is viewed from the downstream side of the gas flow of the laser gas in a direction perpendicular to the direction from the first discharge electrode toward the second discharge electrode, the plate-shaped portion is shielded by the first discharge electrode.

15. A gas laser device comprising a laser chamber device, wherein the laser chamber device excites laser gas by discharge to output laser light, wherein: The laser chamber device comprises: The chamber includes a conductive chamber body having an opening on a top wall and an insulating plate blocking the opening, wherein the laser gas is filled in the inner space; a first discharge electrode disposed on the inner space side of the insulating plate; a second discharge electrode disposed opposite to the first discharge electrode in the internal space; a fan that causes the laser gas to flow between the first discharge electrode and the second discharge electrode in a direction perpendicular to the optical axis of the laser light; and a return member disposed upstream of the second discharge electrode in the flow of the laser gas, electrically connecting the second discharge electrode to the chamber body, wherein an end of the return member on the side opposite to the second discharge electrode is connected to the top wall; The return member includes: a step portion including a plurality of linear portions arranged in parallel along the optical axis; and a plate-shaped portion provided on the top wall side of the return member, connected to the plurality of linear portions, and inclined so as to be closer to the downstream side of the laser gas as the portion is farther from the top wall.

16. A method for manufacturing an electronic device, wherein: The manufacturing method of the electronic device comprises the following steps: Generating laser light using a gas laser device having a laser chamber device; outputting the laser light to an exposure device; and exposing the laser light on a photosensitive substrate in the exposure device to manufacture an electronic device, The laser chamber device excites laser gas by discharge to output the laser light, and the laser chamber device includes: The chamber includes a conductive chamber body having an opening on a top wall and an insulating plate blocking the opening, wherein the laser gas is filled in the inner space; a first discharge electrode disposed on the inner space side of the insulating plate; a second discharge electrode disposed opposite to the first discharge electrode in the internal space; a fan that causes the laser gas to flow between the first discharge electrode and the second discharge electrode in a direction perpendicular to the optical axis of the laser light; and a return member disposed upstream of the second discharge electrode in the flow of the laser gas, electrically connecting the second discharge electrode to the chamber body, wherein an end of the return member on the side opposite to the second discharge electrode is connected to the top wall; The return member includes: a step portion including a plurality of linear portions arranged in parallel along the optical axis; and a plate-shaped portion provided on the top wall side of the return member, connected to the plurality of linear portions, and inclined so as to be closer to the downstream side of the laser gas as the portion is farther from the top wall.

Images