Rapid temperature change test box for wafer test

Abstract

The invention relates to the technical field of temperature change testing, and provides a rapid temperature change test box for wafer testing, which comprises an experimental device, a test box is installed on one side of the experimental device, a partition device is installed in the middle of the middle of the interior of the test box, and a sliding assembly is sleeved with the partition device. The upper end of the sliding assembly is fixedly connected with a driving device, and the driving device penetrates through the top of the test box and is installed above the test box. The wafer clamp flexibly clamps the wafer, stacking of the wafer during testing is avoided, the wafer is connected with the clamping block through the rotating disc, and the rotating fan rotates along with cold air or hot air, so that hot air or cold air swollen in a temperature change experiment can be conveniently gathered around the wafer and fully and comprehensively contacted with the wafer, the accuracy of the experiment is ensured, and the test efficiency is improved. And meanwhile, the rotating fan drives the wafer clamped by the rotating disc to rotate in the wafer clamp, so that water drops generated by heat release and condensation of air on the surface of the wafer are wiped by the brush strip, and the phenomenon that the test result is easily influenced due to corrosion of the wafer is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature change testing, and in particular to a rapid temperature change test box for wafer testing. Background Art

[0002] Performance testing of products such as wafers and other electronic components requires the use of a rapid temperature change test chamber. The rapid temperature change test chamber can achieve the function of rapid switching between high and low temperatures, so that the parameters and performance of the product will be impacted and changed in high and low temperature environments. The current rapid temperature change test chamber includes relatively independent hot chamber and cold chamber. The hot chamber and the cold chamber are both equipped with independent chamber doors. When the product needs to change its position between the two chambers of the cold chamber and the hot chamber, the test personnel are required to quickly take the product out of one chamber and place it in the other chamber. When taking and placing the product, the doors of the two chambers need to be opened and closed in sequence.

[0003] During the process of changing the product chamber, the product will come into contact with the environment outside the test chamber, causing the product's own temperature to exchange and change with the external environment temperature of the test chamber, thereby affecting the test parameters and reducing the test accuracy of the rapid temperature change test chamber.

[0004] Moreover, when the air in the test chamber changes temperature, the hot air gathers upwards and the cold air sinks, and they cannot fully and comprehensively contact the wafer, thereby reducing the accuracy of the experiment and easily affecting the test results. At the same time, the volume of existing rapid temperature change test equipment is fixed. When the test piece is small, it is easy to cause waste of resources, and an excessively large volume will reduce the efficiency of the device.

[0005] Therefore, we made improvements to this problem and proposed a rapid temperature change test chamber for wafer testing. Summary of the Invention

[0006] The object of the present invention is to provide a rapid temperature change test chamber for wafer testing to solve the problems raised in the above background technology.

[0007] In order to achieve the above-mentioned purpose of the invention, the present invention provides a rapid temperature change test chamber for wafer testing, including an experimental device, a test box is installed on one side of the experimental device, a partition device is installed in the center of the interior of the test box, a sliding assembly is sleeved on the interior of the partition device, the upper end of the sliding assembly is fixedly connected to a driving device, the driving device penetrates the top of the test box and is installed above the test box, a pulling groove for installing a wafer clamp is opened in the middle of the sliding assembly, a plurality of wafer clamps are movably installed inside the pulling groove, and the wafer to be tested is installed inside the wafer clamp.

[0008] As a further solution of the present invention, the test box includes a box body, a refrigeration chamber and a heating chamber are opened inside the box body, the refrigeration chamber and the heating chamber are stacked up and down, a cold air exhaust window is installed on one side of the refrigeration chamber, and a hot air exhaust window is installed on one side of the heating chamber.

[0009] As a further solution of the present invention, the partition device includes four first hydraulic push rods and two partitions. The middle of the four first hydraulic push rods are fixedly connected with a fixing frame, and the fixing frame is fixedly installed in the middle of the side wall of the test box. The four corners of the two partitions are fixedly connected by four first hydraulic push rods. The middle of the two partitions is connected with a connecting pipe, and the connecting pipe is a corrugated cylindrical shape.

[0010] As a further solution of the present invention, the sliding assembly includes a test frame, a baffle is fixedly installed between the pull-out slots in the middle of the test frame, a second hydraulic push rod is fixedly installed in the middle of the baffle, rotating fans are fixedly installed at the upper and lower ends of the second hydraulic push rod, a clamping block is fixedly installed in the middle of the rotating fan, and sliding grooves are provided on both sides of the pull-out slot.

[0011] As a further solution of the present invention, the wafer clamp includes a fixing clamp, which is a hollow disc with an interlayer in the middle, and sliders are provided on both sides of the fixing clamp, and the sliders are slidably installed in the pull-out groove of the sliding component. An upward flip cover is provided on the front side of the fixing clamp, and a hinge is hinged in the middle of the fixing clamp and the flip cover.

[0012] As a further solution of the present invention, a brush strip is provided in the middle of the fixing clamp. The brush strip is in the shape of an elongated strip and is symmetrically arranged on the upper and lower side panels of the fixing clamp.

[0013] As a further solution of the present invention, a rotating disk is rotatably installed in the middle of the upper and lower plates of the fixing clamp, and a card holder is opened in the middle of an outer end surface of the rotating disk, and the card holder and the card block are adapted to be installed.

[0014] As a further solution of the present invention, the driving device includes a screw, which is rotatably connected to the top of the sliding assembly. The middle part of the screw is threadedly connected to a nut, and the nut is connected to an external belt motor.

[0015] The invention provides a rapid temperature change test chamber for wafer testing, which has the following beneficial effects:

[0016] 1. By setting a sliding assembly and a wafer clamp inside the test box, the wafer is flexibly clamped by the wafer clamp to avoid stacking during wafer testing. A rotating disk is set in the middle of the wafer clamp, and the upper end of the rotating disk is connected to the clamping block. The rotating fan is blown by the cold air or hot air inside the test box and rotates between the two wafer clamps, so that the hot air or cold air swollen in the temperature change experiment is gathered around the wafer, and fully and comprehensively contacts the wafer to ensure the accuracy of the experiment. At the same time, the rotating fan drives the wafer clamped by the rotating disk to rotate inside the wafer clamp, so that the water droplets generated by the heat release and condensation of the air on the wafer surface are wiped by the brush strip to prevent the wafer from being corroded and easily affecting the test results.

[0017] 2. A partition device is provided in the middle of the test box to separate the cooling chamber and the heating chamber, thereby dividing the hot and cold areas inside the test box, thereby facilitating rapid switching between high and low temperatures during wafer testing. At the same time, the upper and lower partitions are connected by a first hydraulic push rod and a connecting pipe. The first hydraulic push rod is extended to move the two partitions toward the inside of the cooling chamber and the heating chamber, thereby compressing the space of the cooling chamber and the heating chamber, and adjusting the volume inside the test box. This avoids waste of resources caused by the fixed volume of the equipment when testing smaller parts, thereby improving the utilization efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a schematic diagram of the structure of a rapid temperature change test chamber for wafer testing provided in this application;

[0020] Figure 2 A schematic diagram of the structure of a rapid temperature change test chamber for wafer testing provided in this application;

[0021] Figure 3 This is a schematic diagram of the structure of a partition device of a rapid temperature change test chamber for wafer testing provided by this application;

[0022] Figure 4 A schematic diagram of the structure of a sliding assembly of a rapid temperature change test chamber for wafer testing provided in this application;

[0023] Figure 5 A cross-sectional view of the sliding assembly structure of a rapid temperature change test chamber for wafer testing provided in this application;

[0024] Figure 6A schematic diagram of the structure of a drive device for a rapid temperature change test chamber for wafer testing provided in this application;

[0025] Figure 7 A schematic diagram of the wafer fixture structure of a rapid temperature change test chamber for wafer testing provided in this application;

[0026] Figure 8 for Figure 5 A schematic diagram of the enlarged structure at point A;

[0027] Figure 9 for Figure 7 Schematic diagram of the enlarged structure at point B.

[0028] In the figure: 1. Experimental device; 2. Test box; 21. Box body; 22. Refrigeration chamber; 23. Heating chamber; 24. Hot air exhaust window; 25. Cold air exhaust window; 3. Partition device; 31. Fixed frame; 32. First hydraulic push rod; 33. Partition; 34. Connecting pipe; 4. Sliding assembly; 41. Test frame; 42. Baffle; 43. Slide; 44. Second hydraulic push rod; 45. Rotating fan; 46. Block; 5. Driving device; 51. Screw; 52. Nut; 6. Wafer clamp; 61. Fixed clamp; 62. Slider; 63. Flip cover; 64. Hinge; 65. Rotating disk; 66. Brush bar; 67. Card tray. DETAILED DESCRIPTION

[0029] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention.

[0030] like Figures 1-9 As shown, this embodiment proposes a rapid temperature change test box for wafer testing, including an experimental device 1, a test box 2 is installed on one side of the experimental device 1, a partition device 3 is installed in the center of the interior of the test box 2, a sliding component 4 is sleeved inside the partition device 3, and the upper end of the sliding component 4 is fixedly connected to a driving device 5, which penetrates the top of the test box 2 and is installed above the test box 2, and a pulling groove for installing a wafer clamp 6 is opened in the middle of the sliding component 4, and a plurality of wafer clamps 6 are movably installed inside the pulling groove, and the wafer to be tested is installed inside the wafer clamp 6.

[0031] The test box 2 includes a box body 21, and a refrigeration chamber 22 and a heating chamber 23 are provided inside the box body 21. The refrigeration chamber 22 and the heating chamber 23 are stacked up and down. A cold air exhaust window 25 is installed on one side of the refrigeration chamber 22, and a hot air exhaust window 24 is installed on one side of the heating chamber 23. The refrigeration chamber 22 and the heating chamber 23 are cooled and heated respectively, so that the wafers that need to undergo rapid temperature change testing can reciprocate between the refrigeration chamber 22 and the heating chamber 23, reducing the time difference of the temperature change process in the middle of the test chamber and increasing the test efficiency of the device.

[0032] The partition device 3 includes four first hydraulic push rods 32 and two partitions 33. The middle of the four first hydraulic push rods 32 is fixedly connected with a fixing frame 31. The fixing frame 31 is fixedly installed in the middle of the side wall of the test box 2. The four corners of the two partitions 33 are fixedly connected by four first hydraulic push rods 32. The middle of the two partitions 33 is connected with a connecting pipe 34. The connecting pipe 34 is a corrugated cylindrical shape. The partition 33 flexibly adjusts the spatial height of the refrigeration chamber 22 and the heating chamber 23, compresses the space of the refrigeration chamber 22 and the heating chamber 23, and adjusts the volume space inside the test box 2, thereby avoiding waste of resources caused by the fixed volume of the equipment when testing smaller parts and improving the utilization efficiency of the device.

[0033] The sliding assembly 4 includes a test frame 41, and a baffle 42 is fixedly installed between the pull-out grooves in the middle of the test frame 41, and a second hydraulic push rod 44 is fixedly installed in the middle of the baffle 42. Rotating fans 45 are fixedly installed at the upper and lower ends of the second hydraulic push rod 44, and a clamping block 46 is fixedly installed in the middle of the rotating fan 45. Slide grooves 43 are provided on both sides of the pull-out groove. The middle part of the sliding assembly 4 reserves installation space for multiple wafer clamps 6 to test multiple wafers. The baffle 42 separates the wafers on the upper and lower sides to avoid mutual influence between the wafers, and when the partition 33 moves to a certain baffle 42 position, it can separate the wafer clamp 6 installed inside the partition device 3 from the wafer clamp 6 outside the partition device 3 to prevent the cold and warm air in the refrigeration chamber 22 and the heating chamber 23 from affecting each other.

[0034] The wafer clamp 6 includes a fixing clamp 61, which is a hollow disc with an interlayer in the middle, and sliders 62 are provided on both sides of the fixing clamp 61. The sliders 62 are slidably installed in the pull-out groove of the sliding component 4. The front side of the fixing clamp 61 is provided with an upward flip cover 63, and a hinge 64 is hinged in the middle of the fixing clamp 61 and the flip cover 63. The flip cover 63 is hinged on one side of the fixing clamp 61. By opening the flip cover 63, the wafer can be taken in and out, which is convenient for fixing the wafer.

[0035] A brush strip 66 is provided in the middle of the fixing clamp 61. The brush strip 66 is long and symmetrical on the upper and lower side panels of the fixing clamp 61. The setting of the brush strip 66 facilitates wiping off the condensed water droplets on the wafer when the wafer rotates with the rotating fan 45, thereby preventing the wafer from being corroded and damaged.

[0036] A rotating disk 65 is rotatably installed in the middle of the upper and lower plates of the fixing clamp 61. A bracket 67 is provided in the middle of one end surface of the outer side of the rotating disk 65. The bracket 67 and the clamping block 46 are adapted to be installed, and the clamping block 46 is clamped into the inside of the bracket 67. When the rotating fan 45 is blown by the hot and cold air, the rotating disk 65 and the wafer clamped by the rotating disk 65 are driven to rotate, so that the wafer is evenly contacted with the hot and cold air, ensuring the uniformity of the wafer test process, and the water droplets on the wafer can be wiped off by the brush bar 66.

[0037] The driving device 5 includes a screw 51, which is rotatably connected to the top of the sliding assembly 4. The middle part of the screw 51 is threadedly connected to a nut 52, and the nut 52 is connected to an external belt motor. The driving device 5 is driven externally to rotate, driving the sliding assembly 4 to slide up and down inside the test box 2, so that the wafer undergoes rapid temperature change.

[0038] Specifically, when the rapid temperature change test chamber for wafer testing is in use: a sliding assembly 4 and a wafer clamp 6 are set inside the test chamber 2, and the wafer clamp is installed inside the wafer clamp 6. The wafer is now subjected to a high-temperature test inside the heating chamber 23, and the rotating fan 45 is blown by the hot air inside the test chamber 2 to drive the wafer to rotate together, so that the wafer is evenly in contact with the hot air, ensuring the uniformity of the wafer testing process. Then the nut 52 is driven to rotate, driving the screw 51 and the sliding assembly 4 to move downward as a whole, so that the sliding assembly 4 moves to the refrigeration chamber 22 for low-temperature testing. The rotating fan 45 is blown by the cold air inside the test chamber 2 and rotates between the two wafer clamps 6, so that the cold air swollen by the temperature change experiment is gathered around the wafer. , making full and comprehensive contact with the wafer, while the rotating fan 45 drives the wafer clamped by the rotating disk 65 to rotate inside the wafer clamp 6, so that the water droplets generated by the heat release and condensation of the air on the wafer surface are wiped by the brush strip 66, preventing the wafer from being corroded and easily affecting the test results; when the number of wafers to be tested is limited, the first hydraulic push rod 32 extends to move the two partitions 33 toward the inside of the refrigeration chamber 22 and the heating chamber 23, compressing the space of the refrigeration chamber 22 and the heating chamber 23, adjusting the volume space inside the test box 2, avoiding the waste of resources caused by the fixed equipment volume when testing smaller parts, and improving the use efficiency of the device. The content not described in detail in this description belongs to the existing technology well known to professional and technical personnel in this field.

[0039] The above embodiments are intended to illustrate the present invention only and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications, or equivalent substitutions of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention and should be encompassed by the scope of the claims of the present invention.

Claims

1. A rapid temperature change test chamber for wafer testing, comprising an experimental device (1), characterized in that: A test box (2) is installed on one side of the experimental device (1), a partition device (3) is installed in the middle of the interior of the test box (2), a sliding component (4) is sleeved inside the partition device (3), the upper end of the sliding component (4) is fixedly connected to a driving device (5), the driving device (5) penetrates the top of the test box (2) and is installed above the test box (2), a drawing slot for installing a wafer clamp (6) is opened in the middle of the sliding component (4), a plurality of wafer clamps (6) are movably installed inside the drawing slot, and the wafer to be tested is installed inside the wafer clamp (6).

2. The rapid temperature change test chamber for wafer testing according to claim 1, characterized in that: The test box (2) comprises a box body (21), a refrigeration chamber (22) and a heating chamber (23) are provided inside the box body (21), the refrigeration chamber (22) and the heating chamber (23) are stacked up and down, a cold air exhaust window (25) is installed on one side of the refrigeration chamber (22), and a hot air exhaust window (24) is installed on one side of the heating chamber (23).

3. The rapid temperature change test chamber for wafer testing according to claim 1, characterized in that: The partition device (3) comprises four first hydraulic push rods (32) and two partitions (33). The middle of the four first hydraulic push rods (32) is fixedly connected to a fixing frame (31). The fixing frame (31) is fixedly installed in the middle of the side wall of the test box (2). The four corners of the two partitions (33) are fixedly connected by the four first hydraulic push rods (32). The middle of the two partitions (33) is connected to a connecting pipe (34), and the connecting pipe (34) is a corrugated cylindrical shape.

4. The rapid temperature change test chamber for wafer testing according to claim 1, characterized in that: The sliding assembly (4) includes a test frame (41), a baffle (42) is fixedly installed between the drawing grooves in the middle of the test frame (41), a second hydraulic push rod (44) is fixedly installed in the middle of the baffle (42), a rotating fan (45) is fixedly installed at both upper and lower ends of the second hydraulic push rod (44), a clamping block (46) is fixedly installed in the middle of the rotating fan (45), and sliding grooves (43) are provided on both sides of the drawing groove.

5. The rapid temperature change test chamber for wafer testing according to claim 1, characterized in that: The wafer clamp (6) includes a fixing clamp (61), which is a hollow disc with an interlayer in the middle, and sliders (62) are provided on both sides of the fixing clamp (61). The sliders (62) are slidably installed in the pull-out groove of the sliding component (4). The front side of the fixing clamp (61) is provided with an upward flip cover (63), and a hinge (64) is hinged in the middle of the fixing clamp (61) and the flip cover (63).

6. The rapid temperature change test chamber for wafer testing according to claim 5, characterized in that: A brush strip (66) is provided in the middle of the fixing clamp (61), and the brush strip (66) is long and symmetrical on the upper and lower side surfaces of the fixing clamp (61).

7. The rapid temperature change test chamber for wafer testing according to claim 5, characterized in that: A rotating disk (65) is rotatably mounted in the middle of the upper and lower plates of the fixing clamp (61), and a card holder (67) is provided in the middle of an outer end surface of the rotating disk (65). The card holder (67) and the card block (46) are adapted for mounting.

8. The rapid temperature change test chamber for wafer testing according to claim 1, characterized in that: The driving device (5) includes a screw (51) which is rotatably connected to the top of the sliding assembly (4); a nut (52) is threadedly connected to the middle of the screw (51); and the nut (52) is connected to an external belt motor.

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