Silicon wafer marking method and silicon wafer

By generating QR codes on the surface of the silicon wafer and adjusting laser parameters in real time, the problem of inability to bind information and low efficiency of silicon wafer marking equipment is solved, and efficient and clean silicon wafer coding is achieved.

CN120587684APending Publication Date: 2025-09-05JINKO SOLAR CO LTD
View PDF 6 Cites 0 Cited by

Patent Information

Application Number
CN202510804534.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-16
Publication Date
2025-09-05

AI Technical Summary

Technical Problem

Existing silicon wafer marking equipment cannot achieve the binding of QR codes and silicon wafer information, the marking efficiency is low, and the lack of dust removal mechanisms lead to silicon wafer contamination.

Method used

The fly dynamic marking laser is used to generate a QR code on the surface of the silicon wafer, and the information is restored by decoding the module, combined with the vacuum cleaner module to remove silicon powder, and the central control module adjusts the laser parameters in real time to ensure the coding quality.

Benefits of technology

The binding of silicon wafer QR code and information has been achieved, the marking efficiency and quality have been improved, the pollution of silicon wafers has been reduced, and the accuracy and consistency of coding have been ensured.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120587684A_ABST
    Figure CN120587684A_ABST
Patent Text Reader

Abstract

The invention relates to a silicon wafer marking method and a silicon wafer, and relates to the technical field of marking. The silicon wafer marking method comprises the steps that a silicon wafer is conveyed to the coding module; controlling a code printing module to perform laser etching on the silicon wafer, and generating an identification code on the surface of the silicon wafer; restoring the information of the corresponding silicon wafer carried by the identification code, and transmitting the information to the sorting equipment; the photographing module is used for photographing the silicon wafer and transmitting a picture back to the central control module; the central control module carries out two-dimensional imaging processing on the photo to obtain gray values of the silicon wafer coding area and the non-coding area, and carries out three-dimensional imaging processing on the photo to obtain a depth value; the central control module compares and calculates the gray value and the depth value with a preset depth, and adjusts and sets a laser power value and a pulse width value of the coding module; and outputting the silicon wafer subjected to code printing. The laser power value and the pulse width value of the coding module can be adjusted in real time, and the coding quality is guaranteed.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Differential-lid-separating multi-head laser bottle lid flying marking device

    CN105798465A

  • Solar cell process traceability method

    CN108538757A

  • Semiconductor silicon wafer laser soft lettering method, device, medium and product

    CN118237750A

  • Laser surface treatment method, device and equipment based on visual control

    CN119897607A

  • Anti-fake certification device with laser-marking and multi-encrypting two-dimensional code fingerprint

    CN201662818U