TCB thermocompression bonding multi-degree-of-freedom welding head

Abstract

The invention discloses a TCB thermocompression bonding multi-degree-of-freedom welding head, and relates to the technical field of thermocompression bonding, the TCB thermocompression bonding multi-degree-of-freedom welding head comprises a fixed annular plate fixed on equipment, the fixed annular plate is uniformly and rotatably connected with six telescopic pieces, the six telescopic pieces are arranged on the fixed annular plate in pairs, the end parts of the telescopic pieces are rotatably connected with a movable annular plate, and the movable annular plate is fixedly connected with the fixed annular plate. The end portions of the telescopic pieces arranged in pairs are close to the end portions of the adjacent telescopic pieces arranged in pairs, the end portions of the telescopic pieces arranged in pairs are far away from each other, the number of the telescopic pieces is six, the end portions of the two telescopic pieces are close to each other, a pressing head is fixed to the bottom end of the movable annular plate, and a wire outlet hole is formed in the pressing head. An anti-feeding piece for preventing the welding rod from retracting is arranged in the wire outlet hole; the angle of the pressure head can be adjusted through a parallel mechanism formed by the fixed annular plate, the telescopic piece and the movable annular plate, so that the force applied to the pressure head is always overlapped with the normal direction of the electrode surface of the chip, the phenomenon of slippage of the chip is avoided, and the qualification rate of the chip is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of thermocompression bonding, in particular to a TCB thermocompression bonding multi-degree-of-freedom welding head. Background Art

[0002] TCB thermocompression bonding (TCB) is an advanced packaging technology that tightly connects a chip to a substrate or other material by simultaneously applying heat and pressure. This technology achieves a strong connection between materials at a microscopic level, providing stable and reliable electrical and mechanical connections for semiconductor devices. TCB technology is widely used in industries such as integrated circuits, microelectronics, and optoelectronics, and is particularly suitable for high-end chips that require high-precision, high-reliability packaging. The principle of TCB thermocompression bonding is similar to that of traditional diffusion bonding, relying primarily on the effects of heat and pressure.

[0003] When the chip electrode surface is thermally pressed and bonded to the substrate, tilting is likely to occur, causing the bumps between the chip electrode surface and the substrate to not align, affecting subsequent chip use and increasing the defect rate. Summary of the Invention

[0004] The object of the present invention is to provide a TCB thermocompression bonding multi-degree-of-freedom welding head to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the present invention provides the following technical solution: a TCB hot pressing bonding multi-degree-of-freedom welding head, comprising a fixed annular plate fixed on the equipment, and six telescopic parts are evenly connected in rotation on the fixed annular plate. The telescopic parts adopt electric push rods and are controlled by an external controller. They belong to the existing technology and are not described here in detail. The six telescopic parts are arranged in pairs on the fixed annular plate, and the ends of the telescopic parts are rotatably connected to the movable annular plate. The ends of the telescopic parts in the pair are close to the ends of the telescopic parts in the adjacent pair, and the ends of the telescopic parts in the pair are far away from each other. There are six telescopic parts, and the ends of two telescopic parts are close to each other. A pressure head is fixed at the bottom end of the movable annular plate, and a micro-arc is provided on the pressure head for heating. The pressure head tilts itself, but the center point changes after tilting, and the change is compensated by a formula. The formula includes the relationship between the degree of freedom and posture description, coordinate transformation and rotation matrix, branch kinematic constraints and center height and inclination angle.

[0006] As a preferred solution of the TCB hot-compression bonding multi-degree-of-freedom welding head of the present invention, the pressure head is provided with a wire outlet hole, and the wire outlet hole is equipped with an anti-feed plate to prevent the welding rod from retracting. When the molten spherical end of the gold wire is press-welded to the lead terminal on the chip electrode surface, the gold wire will not be squeezed back and cause the gold wire to bend. An auxiliary component is provided in the pressure head at the position corresponding to the anti-feed position, and the pressure head is provided with an anti-return component for preventing the feed rotation.

[0007] As a preferred solution of the TCB thermocompression bonding multi-degree-of-freedom welding head of the present invention, the fixed annular plate and the movable annular plate are provided with through holes corresponding to the positions of the wire outlet holes.

[0008] As a preferred solution of the TCB hot pressing bonding multi-degree-of-freedom welding head of the present invention, the auxiliary component includes a placement groove opened in the wire outlet hole for placing the anti-feed sheet. Through the use of the placement groove, the anti-feed sheet can be easily rotated into the placement groove without protruding the anti-feed sheet and affecting the output of the gold wire. A recovery elastic part is connected between the middle part of the anti-feed sheet and the placement groove. The recovery elastic part is initially in a stretched state, and the lower part of the anti-feed sheet is in contact with the anti-return component.

[0009] As a preferred solution of the TCB hot pressing bonding multi-degree-of-freedom welding head of the present invention, wherein: the anti-return component includes an arc-shaped gasket arranged below the wire outlet hole, the top of the arc-shaped gasket is connected to a sliding rod corresponding to the anti-feeding position, a limiting groove is provided inside the pressure head corresponding to the lower position of the sliding rod, a limiting ring is fixed at the bottom of the limiting groove for the installation of a reset elastic member, a reset elastic member fixed to the outer side of the lower part of the sliding rod is connected between the limiting ring and the top of the limiting groove, a sliding groove for sliding the upper part of the sliding rod is provided at the top of the limiting groove, the inner diameter of the sliding groove is larger than the diameter of the sliding rod, and the inner diameter of the sliding groove is smaller than the inner diameter of the limiting groove, so as to facilitate the installation of the reset elastic member, and a trigger structure is provided between the top of the sliding rod and the lower part of the anti-feeding position.

[0010] As a preferred solution of the TCB hot-compression bonding multi-degree-of-freedom welding head of the present invention, the trigger structure includes a wedge fixed on a sliding rod for triggering, a resettable first trigger rod is slidably connected to the lower part of the placement groove, the first trigger rod achieves a reset effect through a spring, and the end of the first trigger rod contacts the top of the wedge.

[0011] As a preferred solution of the TCB hot-compression bonding multi-degree-of-freedom welding head of the present invention, a receiving groove for the wedge block to move up and down is provided above the slide groove. The use of the receiving groove can facilitate the up and down movement of the wedge block.

[0012] As a preferred solution of the TCB hot-compression bonding multi-degree-of-freedom welding head of the present invention, the trigger structure further includes a second trigger rod slidably connected to the middle of the placement groove, and the length of the second trigger rod is less than the length of the first trigger rod to prevent the second trigger rod from affecting the rotation effect of the anti-feeding sheet when it is not triggered. A protrusion is fixed to the bottom of the anti-feeding sheet. The length of the protrusion is designed so that when the first trigger rod squeezes the anti-feeding sheet, the protrusion will not contact the gold wire, and when the wedge block contacts the second trigger rod, the protrusion will contact and extrude the welding wire. When the wedge block contacts the second trigger rod, the protrusion will contact and extrude the welding wire.

[0013] As a preferred solution of the TCB thermocompression bonding multi-degree-of-freedom welding head of the present invention, the bump is a triangular block, which is convenient for clamping and cutting the gold wire.

[0014] As an optimal solution for the TCB hot pressing bonding multi-degree-of-freedom welding head of the present invention, a rotating ball is fixed at the bottom of the sliding rod, a rotating groove is opened at the top of the arc-shaped gasket corresponding to the position of the rotating ball, and the bottom of the sliding rod can be tilted and rotated in the rotating groove through the rotating ball.

[0015] Compared with the prior art, the beneficial effect achieved by the present invention is that: through the parallel mechanism composed of a fixed annular plate, a telescopic part and a movable annular plate, the angle of the pressure head can be adjusted so that the force applied on the pressure head always coincides with the normal of the chip electrode surface, which will not cause the chip to slip, thereby ensuring the chip qualification rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 This is a schematic diagram of the three-dimensional structure of a TCB thermal compression bonding multi-degree-of-freedom welding head according to the present invention; Figure 2 This is another three-dimensional structural diagram of a TCB thermal compression bonding multi-degree-of-freedom welding head according to the present invention; Figure 3 This is a side view of a TCB thermal compression bonding multi-degree-of-freedom welding head according to the present invention; Figure 4 This is a patented TCB hot pressing bonding multi-degree-of-freedom welding head Figure 3 Schematic diagram of the half-section structure along AA; Figure 5 This is a schematic diagram of the structure of a TCB thermal compression bonding multi-degree-of-freedom welding head anti-return component of the patent of this invention; Figure 6 This is a schematic diagram of the installation structure of a TCB hot-compression bonding multi-degree-of-freedom welding head reset elastic member of the present invention; Figure 7 This is a patented TCB hot pressing bonding multi-degree-of-freedom welding head Figure 5 Schematic diagram of the enlarged structure at point B in the middle.

[0017] In the accompanying drawings: 100, fixed annular plate; 200, telescopic parts; 300, moving the annular plate; 400, pressure head; 500, anti-film feed; 600, auxiliary component; 601, placement slot; 602, recovery elastic member; 700, anti-return assembly; 701, arc-shaped gasket; 702, limiting groove; 703, sliding rod; 704, limiting ring; 705, resetting elastic member; 706, sliding groove; 707, wedge block; 708, receiving groove; 709, trigger structure; 7091, first trigger rod; 7092, second trigger rod; 7093, bump. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] See also Figure 1-Figure 3 The present invention provides a technical solution: a TCB hot compression bonding multi-degree-of-freedom welding head, comprising a fixed annular plate 100 fixed on the equipment, and six telescopic parts 200 are evenly connected and rotated on the fixed annular plate 100. The telescopic parts 200 can adopt an electric push rod, which belongs to the existing technology and is not described in detail here. The six telescopic parts 200 are arranged in pairs on the fixed annular plate 100, and the ends of the telescopic parts 200 are rotatably connected to the movable annular plate 300. The ends of the telescopic parts 200 arranged in pairs are close to the ends of the telescopic parts 200 arranged in pairs, and the ends of the telescopic parts 200 arranged in pairs are far away from each other. There are six telescopic parts 200, and the ends of two telescopic parts 200 are close to each other. The fixed annular plate 100, the six telescopic parts 200 and the movable annular plate 300 form a parallel mechanism, which can rotate with multiple degrees of freedom. A pressure head 400 is fixed at the bottom end of the movable annular plate 300. The pressure head 400 has a heating function, such as micro-arc heating, which belongs to the existing technology and is not described in detail here.

[0020] During use, when the chip electrode surface is attached to the substrate, the pressure head 400 performs hot pressing bonding. When a gap is generated between the chip electrode surface and the substrate, the pressure head 400 can be adjusted through the parallel mechanism so that the force applied on the pressure head 400 always coincides with the normal direction of the chip electrode surface. It can be adjusted with multiple degrees of freedom without causing inconsistency between the force direction and the displacement direction, which would cause the chip electrode surface to slip. When the parallel mechanism adjusts the pressure head 400 to the same deflection angle as the chip electrode surface, it tilts itself, but the center point changes after tilting, and the change is compensated by the following formula: 1. Degrees of freedom and posture description The parallel mechanism usually allows the upper platform to translate along the Z axis (height Z) and rotate around the X axis (pitch angle θx) and Y axis (roll angle θy). The center coordinates are usually (0, 0, Z) (assuming that the X and Y translations are constrained), and the posture is described by θx and θy; 2. Coordinate transformation and rotation matrix The posture of the parallel mechanism is represented by a combination of rotation matrices around the X-axis and the Y-axis. The rotation order is generally around the X-axis first and then around the Y-axis. The rotation matrix is: R=RY(θy)·Rx(θx) in: Rx(θx)= , RY(θy)=

[0021] 3. Branch chain kinematic constraints Each branch is connected to the base (the point where the telescopic member 200 is connected) at point A i and parallel mechanism point B i , after rotation, B i The coordinates in the base coordinate system are: B i '=R·B i +[0, 0, Z] T The length change of the telescopic member 200 satisfies:

[0022] Among them L i The length of the telescopic member is 200.

[0023] 4. Relationship between center height and inclination angle Under the small angle assumption (sinθ≈θ, cosθ≈1), the center height Z and the inclination angle approximately satisfy:

[0024] Wherein Z0 is the initial height of the parallel mechanism when it is horizontal, and r is the distribution radius of the telescopic member 200.

[0025] See also Figure 1 and Figure 4 The pressing head 400 is provided with a wire outlet hole for feeding out the gold wire. The wire outlet hole is equipped with an anti-feed plate 500 for preventing the welding rod from retracting. When the pressing head 400 presses the melted spherical end of the gold wire onto the lead terminal on the chip electrode surface, the gold wire will not be squeezed back and cause the gold wire to bend. An auxiliary component 600 is provided in the pressing head 400 at the position corresponding to the anti-feed plate 500, and an anti-return component 700 for preventing the feed plate 500 from rotating is provided on the pressing head 400.

[0026] During use, when using the lead connection method of hot pressing bonding, after the gold wire is led out from the wire outlet hole on the pressure head 400, the end of the gold wire is melted into a ball by using a micro-arc, and the spherical end is press-welded to the lead terminal on the chip electrode surface by the pressure head 400 to form a first bonding point. During the pressure welding process, the use of the anti-return component 700 can make the anti-feed sheet 500 prevent the gold wire from moving back or the pressure welding from shifting, and will not cause the pressure welding bonding point to be uneven, causing the sphere to deviate from the center of the end, affecting normal use. When the pressure head rises, the anti-feed sheet 500 will not hinder the normal delivery of the gold wire, and will move to the second bonding point at high speed to form an arc, and then form a second point connection under the action of pressure and temperature. The mileage of pressing the pressure head 400 is greater than that of the first bonding point. The gold wire is clamped off by the anti-feed sheet 500, and there is no need to pull off the tail wire, to prevent the second bonding point from being unstable when the tail wire is pulled off.

[0027] See also Figure 1 and Figure 4 The fixed annular plate 100 and the movable annular plate 300 are provided with through holes corresponding to the positions of the wire outlet holes.

[0028] When in use, the through hole can facilitate the transportation of the gold wire.

[0029] See also Figure 3 、 Figure 4 and Figure 6 The auxiliary component 600 includes a placement slot 601 provided in the wire outlet hole for placing the anti-entry sheet 500. By using the placement slot 601, the anti-entry sheet 500 can be easily rotated into the placement slot 601 without causing the anti-entry sheet 500 to protrude and affect the output of the gold wire. A recovery elastic member 602 is connected between the middle part of the anti-entry sheet 500 and the placement slot 601. The recovery elastic member 602 adopts a spring. The initial state of the recovery elastic member 602 is in a stretched state. The lower part of the anti-entry sheet 500 is in contact with the anti-return component 700.

[0030] During use, at the first bonding point, the pressing head 400 squeezes the anti-advance sheet 500 through the anti-return component 700, causing the anti-advance sheet 500 to rotate away from the placement slot 601, thereby squeezing the gold wire so that the gold wire will not shrink back; at the second bonding point, the pressing head 400 presses down a greater distance than the first time, and the pressing head 400 squeezes the anti-advance sheet 500 through the anti-return component 700, thereby clamping the gold wire.

[0031] See also Figure 3 、 Figure 4 、 Figure 5 and Figure 6The anti-return assembly 700 includes an arc-shaped gasket 701 arranged below the outlet hole. The diameter of the arc-shaped gasket 701 is the same as the diameter of the bottom of the pressure head 400. The top of the arc-shaped gasket 701 is connected to the position of the anti-entry piece 500. A sliding rod 703 is connected to the pressure head 400 at a position corresponding to the lower part of the sliding rod 703. A limiting groove 702 is provided inside the pressure head 400 at a position corresponding to the lower part of the sliding rod 703 for sliding the sliding rod 703. A limiting ring 704 is fixed at the bottom of the limiting groove 702 for installing and using the reset elastic member 705. The limiting ring 704 is used for installing and using the reset elastic member 705. A reset elastic member 705 fixed to the outer side of the lower part of the sliding rod 703 is connected between 04 and the top of the limiting groove 702. The reset elastic member 705 adopts a spring. A sliding groove 706 for sliding the upper part of the sliding rod 703 is opened at the top of the limiting groove 702. The inner diameter of the sliding groove 706 is larger than the diameter of the sliding rod 703, and the inner diameter of the sliding groove 706 is smaller than the inner diameter of the limiting groove 702 to facilitate the installation of the reset elastic member 705. A trigger structure 709 is provided between the top of the sliding rod 703 and the lower part of the anti-entry plate 500.

[0032] During pressure welding, at the first bonding point, the arc-shaped gasket 701 squeezes the sphere, and the arc-shaped gasket 701 drives the sliding rod 703 to slide into the limit groove 702 and the slide groove 706, that is, moves upward, and the top of the sliding rod 703 triggers the trigger structure 709, causing the anti-entry plate 500 to rotate toward the outside of the placement groove 601, thereby squeezing the gold wire; at the second bonding point, the extrusion distance of the arc-shaped gasket 701 is greater than the first bonding point, so that the angle of rotation of the anti-entry plate 500 toward the outside of the placement groove 601 is larger than the first bonding point, thereby clamping the gold wire.

[0033] See also Figure 4 、 Figure 6 and Figure 7 The trigger structure 709 includes a wedge 707 fixed on the sliding rod 703 for triggering. The wedge 707 is in the shape of a right triangle. The right angle of the wedge 707 fits on the sliding rod 703. The hypotenuse of the wedge 707 is close to the first trigger rod 7091. The lower part of the placement slot 601 is slidably connected to the resettable first trigger rod 7091. The first trigger rod 7091 achieves the reset effect through a spring, which belongs to the existing technology and will not be repeated here. The end of the first trigger rod 7091 contacts the top of the wedge 707.

[0034] During the formation of the first bonding point, the sliding rod 703 moves upward, and the sliding rod 703 drives the wedge block 707 to move upward as well. The wedge block 707 squeezes the first trigger rod 7091, and the first trigger rod 7091 moves toward the anti-entry plate 500, thereby causing the anti-entry plate 500 to rotate toward the outside of the placement groove 601, so that the anti-entry plate 500 clamps the gold wire and prevents the gold wire from shrinking.

[0035] See also Figure 5 and Figure 6A receiving groove 708 for the wedge block 707 to move up and down is provided above the slide groove 706. By using the receiving groove 708, the wedge block 707 can be easily moved up and down.

[0036] See also Figure 4 、 Figure 6 and Figure 7 The trigger structure 709 also includes a second trigger rod 7092 slidably connected to the middle of the placement slot 601. The second trigger rod 7092 achieves a reset effect through a spring. The length of the second trigger rod 7092 is less than the length of the first trigger rod 7091 to prevent the second trigger rod 7092 from affecting the rotation effect of the anti-feed sheet 500 when it is not triggered. A protrusion 7093 is fixed to the bottom of the anti-feed sheet 500. The protrusion 7093 is a triangular block, which is convenient for clamping the gold wire. The length of the protrusion 7093 is less than the thickness of the anti-feed sheet 500. The length of the protrusion 7093 is designed so that when the first trigger rod 7091 squeezes the anti-feed sheet 500, the protrusion 7093 will not contact the gold wire. When the wedge block 707 contacts the second trigger rod 7092, the protrusion 7093 will contact and squeeze the welding wire.

[0037] After the second bonding point is formed, the sliding rod 703 moves upward to drive the wedge block 707 to squeeze the second trigger rod 7092, causing it to move toward the anti-entry plate 500, causing the anti-entry plate 500 to rotate toward the outside of the placement groove 601, with a larger rotation angle than the first bonding point, thereby being able to cut the gold wire.

[0038] A rotating ball is fixed at the bottom of the sliding rod 703, and a rotating groove is opened at the top of the arc-shaped gasket 701 corresponding to the position of the rotating ball. The bottom of the sliding rod 703 can be tilted and rotated in the rotating groove through the rotating ball.

[0039] During use, when the arc-shaped gasket 701 is tilted at an angle, the sliding rod 703 will not tilt due to the cooperation between the rotating ball and the rotating groove, and normal use will not be affected.

[0040] Working principle: The first is that the chip electrode surface is attached to the substrate bump. When a gap is generated between the chip electrode surface and the substrate, the parallel mechanism can be used to adjust the pressure head 400 so that the force applied on the pressure head 400 always coincides with the normal of the chip electrode surface. It can be adjusted with multiple degrees of freedom and will not cause inconsistency between the force direction and the displacement direction, resulting in the phenomenon of chip electrode surface slippage. In order to adjust the pressure head 400 to the same deflection angle as the chip electrode surface, the parallel mechanism tilts itself, but the center point changes after tilting, and compensation changes are made. The second method is the French hot-press bonding method for lead connection, which is still in use. When in use, a micro-arc is used to melt the end of the gold wire into a ball, and the ball end is press-welded to the lead terminal on the chip electrode surface by the pressure head 400. The arc-shaped gasket 701 squeezes the ball, and the arc-shaped gasket 701 drives the sliding rod 703 to slide inside the limit groove 702 and the slide groove 706, that is, to move upward. The sliding rod 703 drives the wedge block 707 to move upward as well, and the wedge block 707 squeezes the first trigger rod 7091, and the first trigger rod 7091 moves toward the anti-entry sheet 500, so that the anti-entry sheet 500 rotates toward the outside of the placement groove 601, so that the anti-entry sheet 500 clamps the gold wire and does not cause the gold wire to retract, forming a first bonding point. During the pressure welding process, the anti-entry sheet 500 can prevent the gold wire from moving back or the pressure welding from shifting, which will not cause the pressure welding bonding point to be not round, causing the sphere to deviate from the center of the end, affecting normal use. When the pressure head rises, the anti-entry sheet 500 will not hinder the normal delivery of the gold wire, and will move to the second bonding point at high speed to form an arc. Then, under the action of pressure and temperature, a second point connection is formed, and the mileage of pressing the pressure head 400 is greater than that of the first bonding point. The sliding rod 703 moves upward, driving the wedge block 707 to squeeze the second trigger rod 7092, causing it to move toward the anti-entry sheet 500, causing the anti-entry sheet 500 to rotate toward the outside of the placement slot 601, and the rotation angle is larger than that at the first bonding point, thereby clamping the gold wire.

[0041] It is important to note that the construction and arrangement of the present application, as illustrated in various exemplary embodiments, are illustrative only. Although only a few embodiments are described in detail in this disclosure, those reading this disclosure will readily appreciate that numerous modifications are possible (e.g., variations in the size, dimensions, structure, shape, and proportions of various components, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without materially departing from the novel teachings and advantages of the subject matter described herein. For example, components shown as integrally formed may be constructed from multiple parts or components, the positions of components may be inverted or otherwise altered, and the nature, number, or position of discrete components may be modified or changed. All such modifications are therefore intended to be encompassed within the scope of this invention. The order or sequence of any process or method steps may be altered or resequenced according to alternative embodiments. In the claims, any "means-plus-function" clause is intended to cover structures described herein that perform the recited function, and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes, and omissions may be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the scope of this invention. Therefore, the invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0042] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment may not be described (i.e., those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention).

[0043] It will be appreciated that in the development of any actual embodiment, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will, for those of ordinary skill having the benefit of this disclosure, be a routine undertaking of design, fabrication, and production without undue experimentation.

[0044] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A TCB thermocompression bonding multi-degree-of-freedom welding head, characterized in that: The invention comprises a fixed annular plate (100) fixed on the equipment, six telescopic members (200) being evenly rotatably connected to the fixed annular plate (100), the six telescopic members (200) being arranged in pairs on the fixed annular plate (100), the ends of the telescopic members (200) being rotatably connected to a movable annular plate (300), the ends of the telescopic members (200) being arranged in pairs being close to the ends of the telescopic members (200) being arranged in pairs, and the ends of the telescopic members (200) being arranged in pairs being far away from each other, the number of the telescopic members (200) being six, the ends of two of the telescopic members (200) being close to each other, and a pressure head (400) being fixed to the bottom end of the movable annular plate (300).

2. The TCB thermocompression bonding multi-degree-of-freedom welding head according to claim 1, characterized in that: The pressure head (400) is provided with a wire outlet hole, wherein an anti-feeding piece (500) for preventing the welding rod from retracting is built into the wire outlet hole; an auxiliary component (600) is provided in the pressure head (400) at a position corresponding to the anti-feeding piece (500); and an anti-returning component (700) for preventing the anti-feeding piece (500) from rotating is provided on the pressure head (400).

3. The TCB thermocompression bonding multi-degree-of-freedom welding head according to claim 2, characterized in that: The fixed annular plate (100) and the movable annular plate (300) are provided with through holes corresponding to the positions of the wire outlet holes.

4. The TCB thermocompression bonding multi-degree-of-freedom welding head according to claim 2, characterized in that: The auxiliary component (600) comprises a placement groove (601) provided in the wire outlet hole for placing the anti-entry sheet (500), a recovery elastic member (602) being connected between the middle portion of the anti-entry sheet (500) and the placement groove (601), the recovery elastic member (602) being in a stretched state in an initial state, and the lower portion of the anti-entry sheet (500) being in contact with the anti-return component (700).

5. The TCB thermocompression bonding multi-degree-of-freedom welding head according to claim 4, characterized in that: The anti-return assembly (700) comprises an arc-shaped gasket (701) arranged below the wire outlet hole, a sliding rod (703) is connected to the top of the arc-shaped gasket (701) at a position corresponding to the anti-feeding plate (500), a limiting groove (702) is provided inside the pressure head (400) at a position corresponding to the lower part of the sliding rod (703), a limiting ring (704) is fixed at the bottom of the limiting groove (702), a reset elastic member (705) fixed to the outer side of the lower part of the sliding rod (703) is connected between the limiting ring (704) and the top of the limiting groove (702), a sliding groove (706) for the upper part of the sliding rod (703) to slide is provided through the top of the limiting groove (702), and a trigger structure (709) is provided between the top of the sliding rod (703) and the lower part of the anti-feeding plate (500).

6. The TCB thermocompression bonding multi-degree-of-freedom welding head according to claim 5, characterized in that: The trigger structure (709) includes a wedge (707) fixed on the sliding rod (703) for triggering, and a resettable first trigger rod (7091) is slidably connected to the lower part of the placement groove (601), and the end of the first trigger rod (7091) contacts the top of the wedge (707).

7. The TCB thermocompression bonding multi-degree-of-freedom welding head according to claim 5, characterized in that: A receiving groove (708) for the wedge block (707) to move up and down is provided above the sliding groove (706).

8. The TCB thermocompression bonding multi-degree-of-freedom welding head according to claim 5, characterized in that: The trigger structure (709) further includes a second trigger rod (7092) slidably connected to the middle of the placement groove (601), and a protrusion (7093) is fixed to the bottom of the anti-feed plate (500). When the wedge block (707) contacts the second trigger rod (7092), the protrusion (7093) contacts and squeezes the welding wire.

9. The TCB thermocompression bonding multi-degree-of-freedom welding head according to claim 8, characterized in that: The protrusion (7093) is a triangular block.

10. The TCB thermocompression bonding multi-degree-of-freedom welding head according to claim 5, characterized in that: A rotating ball is fixed to the bottom of the sliding rod (703), and a rotating groove is provided at the top of the arc-shaped gasket (701) corresponding to the position of the rotating ball. The bottom of the sliding rod (703) can be tilted and rotated in the rotating groove through the rotating ball.

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