Heat sink and display device including the same

Abstract

The invention relates to a heat sink and a display device including the same. The display device includes: a display panel; and a heat sink under the display panel, in which the heat sink includes: a body including a substrate and fins protruding downward from the substrate and spaced apart from each other; and a heat pipe formed inside the main body and having a path passing through the base and the fins.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0031516, filed on March 5, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Aspects of some embodiments of the present disclosure relate to a heat sink and a display device including the heat sink. Background Art

[0004] High power can be used to increase the brightness of display panels, but this results in increased temperatures. For example, display panels used in head-mounted displays (HMDs) ideally require high heat dissipation performance, along with high resolution and brightness. This is because HMDs can be positioned close to the user's eyes, and the heat generated by the display panel could be fatal to the user. Heat plates, heat sinks, and other heat dissipation components can be used to reduce the temperature of the display panel.

[0005] The above information disclosed in this Background section is only for enhancement of understanding of the background technology and therefore the information discussed in this Background section does not necessarily constitute prior art. Summary of the Invention

[0006] Aspects of some embodiments of the present disclosure include a heat sink having relatively high heat dissipation performance and a display device including the heat sink.

[0007] Features according to the embodiments of the present disclosure are not limited to the above-mentioned features, and other features not mentioned may be more clearly understood by those of ordinary skill in the art using the following description.

[0008] Aspects of some embodiments of the present disclosure include a display device comprising: a display panel; and a heat sink disposed below the display panel. According to some embodiments, the heat sink comprises: a body comprising a base and fins protruding downward from the base and spaced apart from each other; and a heat pipe formed within the body and having a path passing through the base and the fins.

[0009] According to some embodiments, the heat pipe may be a pulsating heat pipe.

[0010] According to some embodiments, the heat pipe may not be connected to an external device or power source.

[0011] According to some embodiments, the fins may be arranged along a first direction, the heat pipe may extend inside each of the fins along a first rotation direction perpendicular (or substantially perpendicular) to the first direction, and the heat pipe may have a spiral structure extending along the first direction.

[0012] According to some embodiments, each of the fins may be a plate fin, and the heat pipe may extend along an edge of each of the fins.

[0013] According to some embodiments, the heat pipe may have an open-loop structure, and one end of the heat pipe may be connected to the other end of the heat pipe through only a single path.

[0014] According to some embodiments, the heat pipe may have a single closed loop structure.

[0015] According to some embodiments, the heat pipe may have a double helix structure extending along the first direction.

[0016] According to some embodiments, the heat pipe may include a first spiral structure passing through odd-numbered fins among the fins and a second spiral structure passing through even-numbered fins among the fins, and the first spiral structure and the second spiral structure may be connected to each other at both ends of the base in the first direction to form a closed loop structure.

[0017] According to some embodiments, the heat pipe may pass through only some of the fins.

[0018] According to some embodiments, in a cross-sectional view, the heat pipe may be on at least two layers separated from each other along a third direction, wherein the fins protrude from the base in a direction opposite to the third direction.

[0019] According to some embodiments, the heat pipes may be on three layers in a cross-sectional view.

[0020] According to some embodiments, the fins may be arranged sequentially along a first direction, and the heat pipe may include: closed loops corresponding to the fins respectively; and first bridges extending in the first direction inside the base and connected to the closed loops, and the closed loops and the first bridges may be integrally formed.

[0021] According to some embodiments, the first bridge may be closer to an edge of the substrate than to a center of the region of the substrate.

[0022] According to some embodiments, the first bridge may be closer to the center of the area of ​​the substrate than to the edge of the substrate.

[0023] According to some embodiments, the heat pipe may further include a second bridge connecting the closed loops at the ends of the fins.

[0024] According to some embodiments, the heat sink may be coupled to the lower surface of the display panel via a heat dissipating adhesive or a single heat dissipating adhesive layer.

[0025] According to some embodiments, the filling rate of the working fluid in the heat pipe may be 40% to 70% (or about 40% to about 70%).

[0026] Aspects of some embodiments of the present disclosure include a heat sink comprising: a body including a base and fins protruding downward from the base and spaced apart from each other; and a heat pipe formed inside the body and having a path passing through the base and the fins.

[0027] According to some embodiments, the fins may be arranged sequentially along a first direction; the heat pipe may extend inside each of the fins along a first rotation direction perpendicular (or substantially perpendicular) to the first direction, and the heat pipe may have a spiral structure extending along the first direction; and the heat pipe may have an open-loop structure.

[0028] Features of other embodiments are included in the detailed description and accompanying drawings.

[0029] A heat sink and a display device according to some embodiments of the present disclosure include a heat pipe that is located on a base and fins (or two layers) and has a structure (e.g., a spiral structure) that completely passes through the heat sink, and heat can be diffused from the display panel more quickly throughout the fins through the heat pipe, and heat can be released to the outside more quickly using all the fins.

[0030] The features of the embodiments of the present disclosure are not limited to the contents shown above, and more various effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A perspective view of a display device according to some embodiments is shown.

[0032] Figure 2 Shown Figure 1 A display device worn by a user.

[0033] Figure 3 According to some embodiments, Figure 1 A cross-sectional view of a display device.

[0034] Figure 4 According to some embodiments, the Figure 3 A cross-sectional view of a heat sink in a display device.

[0035] Figure 5 According to some embodiments, Figure 4 A perspective view of the heat sink.

[0036] Figure 6 Shown along Figure 5 The line A-A' intercepts Figure 4 aspects of heat sinking.

[0037] Figure 7 Shown included in Figure 4 Operation of the heat pipe in the heat sink.

[0038] Figure 8 A cross-sectional view showing a comparative example of a display device.

[0039] Figure 9 A perspective view showing a comparative example of a heat sink is shown.

[0040] Figure 10 According to some embodiments, Figure 4 Another perspective view of the heat sink.

[0041] Figure 11 and Figure 12 According to some embodiments, the Figure 3 A cross-sectional view of a heat sink in a display device.

[0042] Figure 13 and Figure 14 According to some embodiments, Figure 4 Another perspective view of the heat sink.

[0043] Figure 15 According to some embodiments, Figure 4 Another three-dimensional image of the heat sink. DETAILED DESCRIPTION

[0044] Hereinafter, aspects of some embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. The following description is intended to provide only sufficient disclosure to enable understanding of the operation of the present invention, and any other disclosure is omitted to avoid blurring the scope of the present invention. In addition, the present invention can be embodied in different forms and is not limited to the embodiments set forth herein. The embodiments described herein are provided to fully describe the purpose of the technical concept of the present invention in detail so that those skilled in the art can easily practice the present invention.

[0045] Throughout the specification, when describing an element as being "connected" to another element, this includes not only "direct connection", but also "indirect connection" through another device between them. The terms used herein are for the purpose of describing specific embodiments and are not intended to limit the scope of the invention. Throughout the specification, unless explicitly described to the contrary, the word "comprising" and variations such as "comprising" or "comprising" will be understood to imply the inclusion of the stated elements, but not to exclude any other elements. For the purposes of this disclosure, "at least one of X, Y and Z" and "at least one selected from the group consisting of X, Y and Z" can be interpreted as any combination of only X, only Y, only Z or two or more of X, Y and Z, for example, such as XYZ, XY, YZ and XZ. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0046] Although the terms first, second, etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another component. Therefore, without departing from the teachings of the present disclosure, the first component discussed below may be referred to as the second component.

[0047] For descriptive purposes, spatially relative terms such as "below," "beneath," "lower," "under," and "above" may be used herein to describe the relationship of one element or feature to another element or feature as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the term "below" can encompass both above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and therefore, the spatially relative descriptors used herein should be interpreted accordingly.

[0048] Hereinafter, a display device according to some embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings related to disclosed embodiments of the present disclosure.

[0049] Figure 1 A perspective view showing a display device according to an embodiment is shown. Figure 1 The display device is applied to a head-mounted display device 2000 (or a virtual reality (VR) device, a mixed reality (MR) device, or an augmented reality (AR) device). The head-mounted display device 2000 may be a wearable electronic device that can be worn on a user's head. Figure 2 Shown Figure 1 A display device worn by a user.

[0050] refer to Figure 1 and Figure 2 The head-mounted display device 2000 may include a head-mounted strap 2100 and a display device storage container 2200. The head-mounted strap 2100 may be connected to the display device storage container 2200. The head-mounted strap 2100 may include a horizontal strap and / or a vertical strap for securing the head-mounted display device 2000 to the user's head. The horizontal strap may be configured to surround the side portion of the user's head, and the vertical strap may be configured to surround the upper portion of the user's head. However, embodiments of the present disclosure are not limited thereto. For example, the head-mounted strap 2100 may be implemented in the form of a glasses frame, a helmet, or the like.

[0051] The display device container 2200 can accommodate at least one display panel (e.g., the first display panel DP1 or the second display panel DP2) and at least one lens (e.g., the left-eye lens LLNS or the right-eye lens RLNS). The at least one display panel (e.g., the first display panel DP1 or the second display panel DP2) emits light. The at least one lens (e.g., the left-eye lens LLNS or the right-eye lens RLNS) is located on (or in the light emission path of) the at least one display panel (e.g., the second display panel DP2 or the first display panel DP1).

[0052] In the display device receiving container 2200, the right-eye lens RLNS may be located between the first display panel DP1 and the user's right eye. In the display device receiving container 2200, the left-eye lens LLNS may be located between the second display panel DP2 and the user's left eye.

[0053] The image output from the first display panel DP1 may be displayed to the user's right eye through the right-eye lens RLNS. The right-eye lens RLNS may refract light from the first display panel DP1 to guide it to the user's right eye. The right-eye lens RLNS may perform an optical function to adjust the viewing distance between the first display panel DP1 and the user's right eye.

[0054] The image output from the second display panel DP2 can be displayed to the user's left eye through the left-eye lens LLNS. The left-eye lens LLNS can refract light from the second display panel DP2 to guide it to the user's left eye. The left-eye lens LLNS can perform an optical function to adjust the viewing distance between the second display panel DP2 and the user's left eye.

[0055] At the same time, Figure 1 and Figure 2 , the display device is applied to a head-mounted display device 2000 requiring high heat dissipation performance, but the present invention is not limited thereto. For example, the display device can be applied to computing systems that provide image display functions, such as portable computers, mobile phones, smartphones, tablet personal computers (PCs), smart watches, watch phones, portable multimedia players (PMPs), navigation systems, and ultra-mobile personal computers (UMPCs).

[0056] Figure 3 According to some embodiments, Figure 1 A cross-sectional view of a display device.

[0057] refer to Figure 3 The head-mounted display device 2000 (or wearable electronic device or display device) may include a front container CASE_F, a rear container CASE_R, a display panel DP, a lens LNS, a processor PU, and a heat sink HS.

[0058] Front container CASE_F and rear container CASE_R can be configured Figure 1 The display device container 2200 is shown. The processor PU may be installed or fixed in the front container CASE_F, and the display panel DP, lens LNS, and heat sink HS may be installed or fixed in the rear container CASE_R. However, this is merely an example, and embodiments of the present disclosure are not limited thereto. For example, the processor PU may be installed in the rear container CASE_R.

[0059] The display panel DP displays an image. For example, the display panel DP can display an image in the third direction DR3. The display panel DP can be implemented as a self-luminous display panel, such as an organic light-emitting display panel. In this case, the display panel DP can include organic light-emitting diodes, inorganic light-emitting diodes, and quantum dot / well light-emitting diodes. However, the display panel DP is not limited thereto. For example, the display panel DP can be implemented as a non-luminous display panel, such as a liquid crystal display panel.

[0060] The lens LNS may be located on the display panel DP. For example, the lens LNS may include an optical lens having a pancake-shaped cross-section. In embodiments, the lens LNS may include a multi-channel lens having sub-regions with different optical properties. In this case, each display panel DP outputs an image corresponding to a sub-region of the multi-channel lens, and the output image may pass through the sub-region and be viewed by the user.

[0061] The processor PU can perform various tasks and calculations. In embodiments, the processor PU may include an application processor, a graphics processor, a microprocessor, a central processing unit (CPU), and the like. For example, the processor PU is mounted on a mainboard MB, which may be electrically connected to the display panel DP via a flexible printed circuit board (FPC). The driver circuit for driving the display panel DP may be mounted on the mainboard MB and / or the flexible printed circuit board (FPC). For example, the driver circuit includes a timing controller, a data driver, and the like, and may be implemented as an integrated circuit (IC).

[0062] The heat plate HP can be located between the processor PU and the front container CASE_F. The heat plate HP can dissipate heat generated by the processor PU, and the dissipated heat can be discharged to the outside through the front container CASE_F, convection, or radiation. The heat plate HP can be attached to the processor PU using an adhesive ADH (or adhesive layer), and can also be attached to the front container CASE_F using the adhesive ADH. The adhesive ADH may include a thermal interface material (TIM).

[0063] The heat sink HS is located below the display panel DP. The heat sink HS may be fixed to the rear container CASE_R. The heat sink HS may be in direct or indirect thermal contact with the display panel DP and may absorb heat from the display panel DP to dissipate the heat. The heat sink HS may include aluminum, copper, or the like having high thermal conductivity.

[0064] Figure 4 According to some embodiments, the Figure 3 For better understanding and ease of description, the heat sink in the display device is shown in FIG. Figure 4 A display panel DP is further shown in FIG. Figure 5 According to some embodiments, Figure 4 A perspective view of the heat sink. Figure 6 Shown along Figure 5 The line A-A' intercepts Figure 4 aspects of heat sinking.

[0065] refer to Figures 4 to 6 The heat sink HS can be coupled to the lower surface of the display panel DP via an adhesive ADH. The adhesive ADH can be a heat dissipation adhesive or a single heat dissipation adhesive layer. For example, the adhesive ADH can include a thermal interface material (TIM). A TIM is a filler material that fills the small gap between a heat source and a heat sink, providing an effective thermal connection from the heat source to the heat sink. The adhesive ADH including the TIM fills the small gap between the display panel DP and the heat sink HS, and at least a portion of the heat sink HS can directly contact the display panel DP.

[0066] The heat sink HS may include a body BD and a heat pipe FP (or flow path). That is, the heat pipe FP may be embedded in the heat sink HS.

[0067] The body BD may include a base BS and fins FN.

[0068] The base BS has a plate shape having a surface corresponding to one surface of the display panel DP.

[0069] The fins FN protrude downward from the base BS (or protrude in a direction opposite to the third direction DR3). The fins FN have a plate shape extending in the second direction DR2 and may be arranged to be spaced apart from each other along the first direction DR1. For example, each of the fins FN may be a plate fin. The fins FN may be formed integrally with the base BS. Figure 5 Eight fins FN1 to FN8 are shown in FIG, but this is merely an example, and the number of fins FN is not particularly limited.

[0070] The heat pipe FP may be formed within the main body BD. For example, a tubular cavity may be formed within the main body BD, and the cavity may be filled with a working fluid to form the heat pipe FP. The cross-sectional shape of the heat pipe FP (or tube) may be quadrilateral, but embodiments of the present disclosure are not limited thereto. For example, the cross-sectional shape of the heat pipe FP (or tube) may be circular.

[0071] The heat pipe FP has a path passing through the base BS and the fins FN.

[0072] According to some embodiments, the heat pipe FP may be a pulsating heat pipe (PHP). Figure 7 The operation of the heat pipe FP is described in more detail.The heat pipe FP is a passive element and is not connected to an external device or power source.

[0073] According to some embodiments, the heat pipe FP may be located on at least two layers separated from each other along the third direction DR3 in a cross-sectional view. Figure 4 As shown in FIG, the heat pipe FP may be located on a first layer corresponding to the base BS and a second layer corresponding to the fins FN.

[0074] According to some embodiments, the heat pipe FP may extend in a first rotation direction perpendicular to the first direction DR1 inside each of the fins FN, and the heat pipe FP may have a spiral structure extending entirely in the first direction DR1.

[0075] For example, the heat pipe FP may have a spiral structure extending from the first end EP1 toward the second end EP2. The heat pipe FP may extend sequentially within the first fin FN1, outside the base BS, in a direction opposite to the third direction DR3, a direction opposite to the second direction DR2, and the third direction DR3. Thereafter, the heat pipe FP may extend within the base BS in a fourth direction DR4 from one side of the first fin FN1 toward the other side of the second fin FN2. In this manner, the heat pipe FP may sequentially pass through the second fin FN2, the third fin FN3, the fourth fin FN4, the fifth fin FN5, the sixth fin FN6, the seventh fin FN7, and the eighth fin FN8. The heat pipe FP may extend along the edge of each fin FN, but embodiments of the present disclosure are not limited thereto.

[0076] Because the heat pipe FP has a spiral structure, heat transferred from the display panel DP to the heat sink HS (or substrate BS) can be diffused throughout the fins FN and dispersed through all of the fins FN. For example, when heat is concentrated and transferred from the display panel DP to the center portion of the heat sink HS (or substrate BS), the heat can be diffused from the substrate BS in the fourth direction DR4 (or in the second direction DR2 and / or a direction opposite to the second direction DR2) via the heat pipe FP extending in the fourth direction DR4, and the heat can be diffused in the first direction DR1 (and / or a direction opposite to the first direction DR1) via the spiral heat pipe FP. In other words, at least a portion of the heat transferred to the heat sink HS is rapidly distributed throughout the heat sink HS via the heat pipe FP, and the heat can be rapidly dispersed using all of the fins FN of the heat sink HS.

[0077] According to some embodiments, the heat pipe FP may have an open loop structure. In this case, the first end EP1 and the second end EP2 of the heat pipe FP may be connected only by a single path. However, the heat pipe FP is not limited thereto. For example, the heat pipe FP may have a closed loop structure (see Figure 10 As another example, the first end EP1 and the second end EP2 of the heat pipe FP may be connected by a bridge (see Figure 14 FP_B1) connection.

[0078] As described above, the heat sink HS includes the heat pipes FP located on the base BS and the fins FN (or two layers) and having a structure (e.g., a spiral structure) that completely passes through the heat sink HS, and the heat sink HS can diffuse the heat of the display panel DP more quickly throughout the fins FN through the heat pipes FP, and can disperse the heat to the outside more quickly by using all the fins FN.

[0079] Figure 7 Shown included in Figure 4 Operation of the heat pipe in the heat sink.

[0080] refer to Figures 4 to 7 , the working fluid SLG (or liquid plug) is filled in the small diameter tube of the heat pipe FP, and the working fluid SLG and bubbles BB (or vapor bubbles or vapor plugs) are repeatedly formed by capillary force.

[0081] The working fluid SLG pulsates due to pressure changes in the air bubbles BB caused by the heat source HT (e.g., the display panel DP). This causes the working fluid SLG to pulsate and / or circulate in response to the heat. Heat is transferred from the heat source HT to the heat pipe FP (and then, through the body BD, to the low-temperature portion LT (e.g., outside the fins FN)). In other words, the heat pipe FP (or pulsating heat pipe) is a two-phase heat transfer device that transfers heat through the pulsating / circulating motion of the working fluid SLG within a micro-tube.

[0082] Water, Freon, methanol, ethanol, etc. are used as the working fluid SLG, and the filling rate of the working fluid SLG may be 50% (or approximately 50%). For example, in order to promote pulsation / circulation of the working fluid SLG, the heat pipe FP (or micropipe) may be filled with 40% to 70% (or approximately 40% to approximately 70%) of the working fluid SLG.

[0083] Figure 8 A cross-sectional view showing a comparative example of a display device. Figure 8 A comparative example of a display device applied to a head-mounted display device 2000_C is shown.

[0084] refer to Figure 8 , a head mounted display device 2000_C according to a comparative example includes a display panel DP, a heat plate HP, and a heat sink HS_C1.

[0085] The heat sink HS_C1 according to the comparative example does not include a heat pipe, and thus, the heat plate HP is located between the display panel DP and the heat sink HS_C1 .

[0086] The heat plate HP is attached to a lower portion of the display panel DP using an adhesive ADH and may dissipate heat generated from the display panel DP.

[0087] The heat sink HS_C1 according to the comparative example is attached to the lower portion of the heat plate HP by using an adhesive ADH, and may absorb heat dissipated by the heat plate HP to discharge the heat to the outside.

[0088] While the heat plate HP is used to dissipate heat, the thermal conductivity of the heat plate HP, made of a single material, is only a few hundred W / m K, and there are limitations to dissipating (and dissipating) heat using only the heat plate HP. For example, the thermal conductivity of aluminum is approximately 234 W / m K, and the thermal conductivity of copper is approximately 386 W / m K. Specifically, because the display panel DP used in the head-mounted display device 2000_C has high resolution and high brightness, and generates a large amount of heat in a small area, it is difficult to reduce the temperature of the display panel DP (and the head-mounted display device 2000_C) using only the stacked structure of the heat plate HP and the heat sink HS_C1.

[0089] Figure 9 A perspective view showing a comparative example of a heat sink is shown.

[0090] refer to Figure 4 and Figure 9 , the heat sink HS_C2 according to the comparative example may include a heat pipe FP_C.

[0091] Each heat pipe FP_C is located inside each fin FN and may have a closed-loop structure within each fin FN. Each heat pipe FP_C is independent and physically separate from the heat pipes FP_C formed in adjacent fins. For example, the heat pipe FP_C formed in the first fin FN1 is not connected to the heat pipe FP_C formed in the second fin FN2.

[0092] For example, when heat is concentrated and transferred from the display panel DP to the central portion of the heat sink HS_C2, the heat is diffused through the heat pipes FP_C inside the third to sixth fins FN3 to FN6, and at least the heat pipes FP_C inside the first and eighth fins FN1 and FN8 may not directly participate in the heat transfer. Figure 5 Compared with the heat sink HS, the heat can spread slowly Figure 9 The heat sink HS_C2 diffuses.

[0093] (Table 1)

[0094] Table 1 shows the power consumption of a display device (e.g., a display panel DP (see Figure 4 The first case CASE1 is a display device that does not use a heat sink, and the second case CASE2 is a display device that uses a heat sink. Figure 8 The third case CASE3 of the display device of the comparative example heat sink HS_C1 (and heat plate HP) is applied according to Figure 9 The heat sink HS_C2 of the comparative example is used for the display device, and the fourth case CASE4 is applied Figure 4 and Figure 5 In the second to fourth cases CASE2 to CASE4, the display panel DP is located on the central portion of the heat sink HS_C1, HS_C2 or HS.

[0095] As shown in Table 1, based on the same power consumption (eg, power consumption of 3 W, 10 W, and 15 W, respectively), the temperature decreases in the order of a first case CASE1, a second case CASE2, a third case CASE3, and a fourth case CASE4.

[0096] For example, when power consumption is 3 W, the temperature in the fourth case, CASE4, decreases by 1.0°C to 7.1°C (or approximately 1.0°C to approximately 7.1°C) compared to the other cases, CASE1 to CASE3. When power consumption is 10 W, the temperature in the fourth case, CASE4, decreases by 2.9°C to 26.7°C (or approximately 2.9°C to approximately 26.7°C) compared to the other cases, CASE1 to CASE3. When power consumption is 15 W, the temperature in the fourth case, CASE4, decreases by 4.2°C to 39.7°C (or approximately 4.2°C to approximately 39.7°C) compared to the other cases, CASE1 to CASE3.

[0097] As power consumption increases, the temperature in case 4 can be reduced more significantly than in cases 1 to 3. At 10W power consumption, the temperature in case 4 is 2.9°C (approximately 8.8%) lower than that in case 3. And at 15W power consumption, the temperature in case 4 is 4.2°C (approximately 11.0%) lower than that in case 3.

[0098] As described above, the heat pipe FP (see Figure 4 and Figure 5 )'s heat sink HS has higher heat dissipation performance.

[0099] Figure 10 According to some embodiments, Figure 4 Another perspective view of the heat sink.

[0100] refer to Figure 4 、 Figure 5 and Figure 10 , in addition to the arrangement of heat pipe FP_1, Figure 10 The heat sink HS_1 can be connected with Figure 5 The heat sink HS is the same (or substantially the same) or similar to that of FIG. Therefore, some redundant descriptions will not be repeated.

[0101] The heat sink HS_1 includes a heat pipe FP_1 formed inside the body BD. The heat pipe FP_1 may extend inside each of the fins FN along a first rotation direction perpendicular to the first direction DR1 and may have a double helix structure extending entirely in the first direction DR1.

[0102] For example, the heat pipe FP_1 may include a first spiral structure FP_S1 (or a first sub-heat pipe) and a second spiral structure FP_S2 (or a second sub-heat pipe). The first spiral structure FP_S1 may pass through odd-numbered fins, and the second spiral structure FP_S2 may pass through even-numbered fins.

[0103] For example, the first spiral structure FP_S1 may extend sequentially in a direction opposite to the third direction DR3, a direction opposite to the second direction DR2, and the third direction DR3 within each of the first fin FN1, the third fin FN3, the fifth fin FN5, and the seventh fin FN7. Within the base BS, the first spiral structure FP_S1 may extend from one side of the first fin FN1 to the other side of the third fin FN3 in the fifth direction DR5, from one side of the third fin FN3 to the other side of the fifth fin FN5 in the fifth direction DR5, and from one side of the fifth fin FN5 to the other side of the seventh fin FN7 in the fifth direction DR5.

[0104] For example, the second spiral structure FP_S2 may extend in a direction opposite to the third direction DR3, a direction opposite to the second direction DR2, and the third direction DR3, sequentially inside each of the second fin FN2, the fourth fin FN4, the sixth fin FN6, and the eighth fin FN8. Inside the base BS, the second spiral structure FP_S2 may extend from one side of the second fin FN2 to the other side of the fourth fin FN4 in the fifth direction DR5, from one side of the fourth fin FN4 to the other side of the sixth fin FN6 in the fifth direction DR5, and from one side of the sixth fin FN6 to the other side of the eighth fin FN8 in the fifth direction DR5.

[0105] According to some embodiments, the heat pipe FP_1 may have a single closed loop structure. For example, at both ends of the substrate BS in the first direction DR1 (eg, Figure 5 At the first end EP1 and the second end EP2 of the heat pipe, the first spiral structure FP_S1 and the second spiral structure FP_S2 can be connected to form a closed loop. When the heat pipe FP_1 has a single closed loop structure, the working fluid in the heat pipe FP_1 can circulate. For example, the working fluid in the heat pipe FP_1 can circulate in the order of the first fin FN1, the third fin FN3, the fifth fin FN5, the seventh fin FN7, the eighth fin FN8, the sixth fin FN6, the fourth fin FN4, and the second fin FN2.

[0106] For example, when heat is concentrated and transferred to the central portion of the heat sink HS_1 (or base BS), the first spiral structure FP_S1 passing through the odd-numbered fins can transfer heat to the fifth fin FN5 and the seventh fin FN7, and the second spiral structure FP_S2 passing through the even-numbered fins can transfer heat to the second fin FN2. In other words, the first spiral structure FP_S1 and the second spiral structure FP_S2 can transfer heat in different directions and diffuse the heat more quickly.

[0107] As described above, the heat sink HS_1 includes the heat pipe FP_1 having the double helix structure, and can diffuse heat more quickly and disperse heat through the heat pipe FP_1 .

[0108] At the same time, Figure 10 In the figure, the heat pipe FP_1 is shown as having a single closed loop structure, but the embodiments of the present disclosure are not limited thereto. For example, the first spiral structure FP_S1 and the second spiral structure FP_S2 of the heat pipe FP_1 are not connected or separated, and the heat pipe FP_1 may have two open loop structures.

[0109] In addition, Figure 10 In FIG, the heat pipe FP_1 is shown as having a double helical structure, but is not limited thereto. For example, if each helical structure completely passes through the heat sink HS_1, the heat pipe FP_1 may have three or more helical structures.

[0110] Figure 11 and Figure 12 According to some embodiments, the Figure 3 A cross-sectional view of a heat sink in a display device.

[0111] refer to Figure 3 、 Figure 4 、 Figure 5 、 Figure 11 and Figure 12 , in addition to the arrangement of the heat pipe FP, Figure 11 and Figure 12 Each of the heat sink HS_2 and the heat sink HS_3 can be connected with Figure 4 Therefore, redundant descriptions will not be repeated.

[0112] According to some embodiments, the heat pipe FP of the heat sink HS_2 may pass through only some of the fins FN.

[0113] refer to Figure 11 For example, the heat pipe FP may only pass through the odd-numbered fins FN (or the even-numbered fins FN). For example, the heat pipe FP may only have reference Figure 10 Described is the first helical structure FP_S1 (or the second helical structure FP_S2).

[0114] According to some embodiments, in a cross-sectional view, the heat pipes FP of the heat sink HS_3 may be located on three layers separated from each other along the third direction DR3 .

[0115] refer to Figure 12For example, the heat pipes FP may be located on a first layer corresponding to the base BS, a second layer corresponding to the portion of the fins FN contacting the base BS, and a third layer corresponding to the ends of the fins FN (ends opposite the third direction DR3). The heat pipes FP may have an open or closed loop structure within each fin FN, and may be completely connected within the base BS. The path of the heat pipes FP within each fin FN is not particularly limited.

[0116] For example, with reference Figure 9 Similar to the heat pipe FP_C described above, the heat pipe FP may have a closed loop structure passing through the second and third layers, the closed loop structure may extend to the first layer (or substrate BS), and may be connected to an adjacent closed loop structure inside the substrate BS.

[0117] As another example, the heat pipe FP may include a third spiral structure extending through the first and third layers (e.g., arranged along the outermost portion of each fin FN) and a fourth spiral structure extending through the first and second layers (e.g., arranged within the third spiral structure). The fourth spiral structure may have a smaller loop than the third spiral structure in the second and third directions DR2 and DR3. The third spiral structure may be separate from or connected to the fourth spiral structure. The third and fourth spiral structures may be connected at any location on the base BS (e.g., at both ends in the first direction DR1).

[0118] Figure 13 and Figure 14 According to some embodiments, Figure 4 Another perspective view of the heat sink.

[0119] refer to Figure 4 、 Figure 13 and Figure 14 , the heat sink HS_4 may include a base BS, fins FN and heat pipes FP_C. As has been referred to Figure 4 The base BS and the fins FN (including the main bodies of the base BS and the fins FN) are described, so redundant descriptions thereof will not be repeated.

[0120] Each heat pipe FP_C may be located inside each of the fins FN. The heat pipe FP_C may include a closed loop structure (or closed loop) corresponding to each of the fins FN.

[0121] According to some embodiments, the heat pipe FP_C (or closed loop structure) may be connected to the first bridge FP_B1 located inside the base BS. The first bridge FP_B1 may be integrally formed with the heat pipe FP_C (or closed loop structure). The first bridge FP_B1 may be included in the heat pipe FP_C.

[0122] For example, the first bridge FP_B1 may extend in the first direction DR1 and may be connected to each heat pipe FP_C (or a closed loop structure).

[0123] According to some embodiments, the first bridge FP_B1 may be located adjacent to an edge of the substrate BS rather than being located adjacent to the center of the area of ​​the substrate BS. Figure 13 For example, the first bridge FP_B1 may be located adjacent to the end of the substrate BS in the second direction DR2. In addition, the first bridge FP_B1 may be located adjacent to the end of the substrate BS in a direction opposite to the second direction DR2.

[0124] According to some embodiments, the first bridge FP_B1 may be located adjacent to the center of the area of ​​the substrate BS rather than adjacent to the edge of the substrate BS. Figure 14 , for example, the first bridge FP_B1 may be located between an end portion of the substrate BS and a center of a region of the substrate BS in the second direction DR2 .

[0125] As described above, the heat pipes FP_C (or closed loop structures) corresponding to each of the fins FN can be connected by the first bridge FP_B1 inside the base BS. Therefore, heat can be spread throughout the fins FN, and the heat spread using all the fins FN can be dispersed to the outside more quickly.

[0126] At the same time, Figure 13 and Figure 14 In the embodiment, the heat sink HS_4 is shown as including two first bridges FP_B1, but is not limited thereto. For example, the heat sink HS_4 may include three or more first bridges FP_B1. For example, the heat sink HS_4 may include Figure 13 The first bridge FP_B1 and Figure 14 The first bridge FP_B1 of both.

[0127] In addition, Figure 13 and Figure 14 , the first bridge FP_B1 extending in the first direction DR1 is shown, but is not limited thereto. For example, at least one first bridge FP_B1 may extend in an oblique direction crossing the first direction DR1 and the second direction DR2.

[0128] exist Figure 13 and Figure 14 In FIG. 1 , a closed loop structure is shown as being located on two layers corresponding to each fin FN in the third direction DR3, but is not limited thereto. For example, as shown in FIG. Figure 11 and Figure 12 As described, the closed loop structure may be located on at least some of the fins FN, or the closed loop structure may be located on three or more layers in the third direction DR3.

[0129] Figure 15According to some embodiments, Figure 4 Another three-dimensional image of the heat sink.

[0130] refer to Figure 13 and Figure 15 , except for the second bridge FP_B2, Figure 15 The heat sink HS_5 can be used with Figure 13 The heat sink HS_4 is the same (or substantially the same) or similar to that of FIG. Therefore, some redundant descriptions will not be repeated.

[0131] The heat pipes FP_C (or closed loop structure) may be connected at the ends of the fins FN through the second bridge FP_B2 . That is, the heat pipes FP_C (or closed loop structure) may be connected outside the base BS rather than inside the base BS.

[0132] Each fin FN may be connected to an adjacent fin via a connection portion BRP at its end in the third direction DR3 and the second direction DR2 (that is, near the edge where the side in the third direction DR3 intersects the side in the second direction DR2). The connection portion BRP may be integrally formed with the fin FN. An opening may be formed between the base BS and the connection portion BRP to allow air to flow between the fins FN in the second direction DR2.

[0133] The second bridge FP_B2 may be formed in the connection portion BRP. The second bridge FP_B2 may be formed integrally with the heat pipe FP_C (or closed loop structure). The second bridge FP_B2 may be included in the heat pipe FP_C.

[0134] exist Figure 15 In the embodiment, the second bridge FP_B2 is shown to be arranged at both ends of the fin FN in the second direction DR2, corresponding to the first bridge FP_B1, but is not limited thereto. Figure 14 Corresponding to the first bridge FP_B1, the second bridge FP_B2 may be positioned adjacent to the center of the area of ​​the base BS rather than adjacent to the edge of the base BS. Figure 13 and Figure 14 Similar to the first bridges FP_B1 described above, the number, arrangement positions, extension directions, etc. of the second bridges FP_B2 may be variously changed.

[0135] While some aspects of the present disclosure have been described above, it should be noted that the disclosed embodiments are provided for illustration only and are not intended to limit the present disclosure. In addition, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the embodiments according to the present disclosure.

Claims

1. Display devices, including: Display panel; as well as a heat sink, beneath the display panel, Wherein, the heat sink comprises: a main body including a base and fins protruding downward from the base and spaced apart from each other; and A heat pipe is formed inside the body and has a path passing through the base and the fins.

2. The display device according to claim 1, wherein The heat pipe is a pulsating heat pipe.

3. The display device according to claim 2, wherein The heat pipe is not connected to external equipment or power supply. The display device according to claim 1 , wherein: The fins are arranged along a first direction, and The heat pipe extends inside each of the fins along a first rotation direction perpendicular to the first direction, and the heat pipe has a spiral structure extending along the first direction.

5. The display device according to claim 4, wherein Each of the fins is a plate fin, and the heat pipe extends along an edge of each of the fins. The display device according to claim 4 , wherein: The heat pipe has an open loop structure, and One end of the heat pipe is connected to the other end of the heat pipe through only a single path.

7. The display device according to claim 4, wherein The heat pipe has a single closed loop structure.

8. The display device according to claim 7, wherein The heat pipe has a double helix structure extending along the first direction.

9. The display device according to claim 8, wherein The heat pipe includes a first spiral structure passing through odd-numbered fins among the fins and a second spiral structure passing through even-numbered fins among the fins, and The first helical structure and the second helical structure are connected to each other at two ends of the base in the first direction to form the closed loop structure.

10. The display device according to claim 1, wherein The heat pipe passes through only some of the fins.

11. The display device according to claim 1, wherein In a cross-sectional view, the heat pipes are on at least two layers separated from each other along a third direction, wherein the fins protrude from the base in a direction opposite to the third direction.

12. The display device according to claim 11, wherein In the cross-sectional view, the heat pipes are on three layers.

13. The display device according to claim 1, wherein The fins are arranged sequentially along a first direction, Wherein, the heat pipe comprises: closed loops, corresponding to the fins respectively; and a first bridge extending in the first direction inside the substrate and connected to the closed loop, and Wherein, the closed loop and the first bridge are formed integrally.

14. The display device according to claim 13, wherein The first bridge is closer to an edge of the substrate than to a center of an area of ​​the substrate.

15. The display device according to claim 13, wherein The first bridge is closer to the center of the area of ​​the substrate than to the edge of the substrate.

16. The display device according to claim 13, wherein The heat pipe also includes a second bridge connecting the closed loop at ends of the fins.

17. The display device according to claim 1, wherein The heat sink is coupled to the lower surface of the display panel by a heat dissipation adhesive or a single heat dissipation adhesive layer.

18. The display device according to claim 1, wherein A filling rate of the working fluid in the heat pipe is in a range of 40% to 70%.

19. Heat sink, including: a main body comprising a base and fins protruding downward from the base and spaced apart from each other; as well as A heat pipe is formed inside the body and has a path passing through the base and the fins.

20. The heat sink according to claim 19, wherein The fins are arranged sequentially along a first direction; wherein the heat pipe extends inside each of the fins along a first rotation direction perpendicular to the first direction, and the heat pipe has a spiral structure extending along the first direction; and Wherein, the heat pipe has an open-loop structure.

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