Intelligent heat dissipation control system of control cabinet
Through components such as sensor arrays, eddy current fans and variable guide plates, combined with phase change material layers and semiconductor cooling sheets, an intelligent heat dissipation control system for the control cabinet is realized, which solves the problems of low efficiency and high energy consumption of traditional heat dissipation systems and improves heat dissipation efficiency and equipment reliability.
Patent Information
- Application Number
- CN202510788187.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-13
- Publication Date
- 2025-09-05
AI Technical Summary
Traditional control cabinet cooling systems have low efficiency and high energy consumption, and are unable to effectively cope with complex working conditions, affecting the reliability and life of electronic equipment.
By using components such as sensor arrays, eddy current fans, variable guide plates, phase change material layers and semiconductor cooling sheets, combined with a core control unit and a predictive model, intelligent monitoring and directional heat dissipation can be achieved, optimizing the startup and energy consumption management of the heat dissipation equipment.
It improves heat dissipation efficiency, reduces energy consumption, enhances the thermal stability and reliability of the system, reduces equipment failure rate, and ensures the safety of electronic equipment.
Smart Images

Figure CN120603189A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of control cabinets, and in particular to an intelligent heat dissipation control system of a control cabinet. Background Art
[0002] In the field of control cabinet technology, heat dissipation has always been one of the key technical difficulties. Traditional control cabinet cooling systems usually use simple fan cooling or natural convection cooling methods, which have problems such as low heat dissipation efficiency, high energy consumption, and inability to effectively cope with complex working conditions. At present, with the continuous increase in electronic equipment inside the control cabinet and the continuous improvement in power density, traditional heat dissipation methods can no longer meet the heat dissipation needs, resulting in excessively high temperatures inside the control cabinet, affecting the reliability and life of the electronic equipment.
[0003] Currently, a Chinese patent with authorization announcement number CN118232210B discloses a heat dissipation assembly for a power system control cabinet, which includes a control cabinet, an air guide unit arranged on the side and top of the control cabinet for air supply and exhaust, a movable end of a bidirectional drive mechanism abutting the inner wall of the control cabinet, a unidirectional drive mechanism connected to a sleeve rod in the bidirectional drive mechanism, an air transmission system installed on the bidirectional drive mechanism, and the air transmission system is also connected to the air guide unit and moves synchronously with the movement of the bidirectional drive mechanism and the unidirectional drive mechanism, and the free end of the elastic scraper mechanism abuts against a scraper in the housing to facilitate dust cleaning.
[0004] Although this control cabinet heat dissipation component can accurately adjust the air cooling position when the heat-generating components inside the control cabinet are in working condition, achieve efficient heat dissipation, and avoid uneven heat dissipation, and at the same time, can automatically remove dust from the air entering the control cabinet and automatically clean the dust in the air to prevent dust from accumulating on the surface of the heat-generating components, the heat dissipation component still has the defects of excessive power consumption and inability to realize intelligent monitoring and control means.
[0005] Therefore, designing an efficient and intelligent control cabinet cooling system has become an urgent problem to be solved. Summary of the Invention
[0006] In view of the above situation, in order to overcome the defects of the prior art, the purpose of the present invention is to provide an intelligent heat dissipation control system for a control cabinet. The above technical purpose is achieved through the following technical solutions: An intelligent heat dissipation control system for a control cabinet, comprising: A control cabinet body, wherein the inner wall of the control cabinet body is provided with a sensor array, and the sensor array is composed of temperature sensors. An independent cold air zone is provided at the bottom end of the control cabinet body, and a vortex fan is provided inside the cold air zone. The air duct of the vortex fan faces the interior of the control cabinet body. A variable guide plate is also provided at the bottom end of the control cabinet body, and the variable guide plate is provided at the upper end position of the cold air zone. Directional control blocks driven by a motor are provided at both ends of the variable guide plate, and the directional control block drives the variable guide plate to rotate so as to adjust its orientation angle. A motor driver is provided on the motor, and a core control unit is connected to the motor driver and the temperature sensor.
[0007] Furthermore, side wall heat dissipation vents are provided on the side walls of the control cabinet body.
[0008] Furthermore, a phase change material layer is provided between the cabinet wall interlayers of the control cabinet body, and the phase change material layer is filled with paraffin-graphene composite material.
[0009] Furthermore, the interior of the control cabinet is also provided with an assembly temperature sensor, an assembly humidity sensor, and a cabinet electrical current sensor. The assembly temperature sensor, assembly humidity sensor, and cabinet electrical current sensor are connected to the core control unit. The core control unit is equipped with a prediction model. After inputting the historical 72-hour temperature sequence, load current fluctuation, and ambient temperature and humidity, the prediction model can output the temperature prediction value for the next 10 minutes.
[0010] Furthermore, the core control unit further includes an adaptive alarm module. In the adaptive alarm module, when the predicted temperature T_pred satisfies: T pred >0.8×T max +0.2×ΔT aging (1) When the warning is triggered, T max is the rated maximum temperature of the equipment, ΔT aging is the aging compensation coefficient based on the capacitor ESR value.
[0011] Furthermore, a semiconductor refrigeration plate is provided inside the control cabinet body, and an edge controller is provided in the core control unit. The edge controller performs dynamic threshold control and calculates the temperature change rate dT / dt. When dT / dt>2℃ / min and the temperature>50℃, the semiconductor refrigeration plate is started.
[0012] In summary, the present invention has the following beneficial effects: (1) The present invention achieves precise monitoring of the internal temperature of the control cabinet and directional heat dissipation by providing a sensor array, a vortex fan, and a variable deflector, effectively improving heat dissipation efficiency. The variable deflector can be adjusted within an angle range of 30° to 60°. In conjunction with the sensor array, the airflow can be directed to cover the high-temperature area, achieving directional heat dissipation.
[0013] (2) The use of phase change material layer to fill the cabinet wall interlayer can absorb peak heat and delay the temperature rise of the control cabinet body under extreme working conditions, thereby enhancing the thermal stability of the system.
[0014] (3) It is equipped with a prediction model that can predict the temperature changes in the next 10 minutes in advance and start the cooling equipment in advance to avoid damage to the equipment caused by excessive temperature, thereby improving the reliability and safety of the system.
[0015] (4) The adaptive alarm module in the core control unit can trigger an early warning based on the predicted temperature and aging compensation coefficient, timely discover and deal with potential heat dissipation problems, and reduce the equipment failure rate.
[0016] (5) The system starts the semiconductor refrigeration plate under high dT / dt conditions and relies on passive heat dissipation and air cooling in the cold air zone under normal working conditions. The overall power consumption is greatly reduced, achieving a balance between heat dissipation efficiency and energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application, but do not constitute an improper limitation of the present invention. In the drawings: Figure 1 It is a schematic diagram of the present invention.
[0018] In the figure, 1. Control cabinet body; 2. Temperature sensor; 3. Cold air zone; 301. Eddy current fan; 4. Variable deflector; 401. Directional control block; 402. Motor; 403. Motor driver; 5. Core control unit; 501. Prediction model; 502. Adaptive alarm module; 503. Edge controller; 6. Side wall heat dissipation vent; 7. Phase change material layer; 8. Assembly temperature sensor; 9. Assembly humidity sensor; 10. Cabinet electrical current sensor; 11. Semiconductor cooling plate. DETAILED DESCRIPTION
[0019] The above and other technical contents, features and effects of the present invention are described below with reference to the attached Figure 1 The detailed description of the embodiments will clearly show that the structural contents mentioned in the following embodiments are all based on the accompanying drawings.
[0020] Various exemplary embodiments of the present invention will be described below with reference to the accompanying drawings. Example
[0021] An intelligent heat dissipation control system for a control cabinet, comprising: The control cabinet body 1 has a side wall on which a heat dissipation vent 6 is provided.
[0022] The sensor array is composed of a temperature sensor 2. An independent cold air zone 3 is provided at the bottom of the control cabinet body 1. A vortex fan 301 is provided inside the cold air zone 3. The air duct of the vortex fan 301 faces the inside of the control cabinet body 1. The cold air zone 3 forms a positive pressure air inlet at the bottom of the control cabinet body 1, and establishes a vertical air duct inside the control cabinet body 1. The vortex fan 301 can form a tornado-like airflow, and the heat dissipation efficiency is further improved. The side wall heat dissipation port 6 is a static heat dissipation port. Affected by the vertical air duct inside the control cabinet body 1, part of the heat flows from the side wall heat dissipation port 6 to the outside of the control cabinet body 1.
[0023] A sensor array is provided on the inner wall of the control cabinet body 1, and a variable guide plate 4 is also provided at the bottom end of the control cabinet body 1. The variable guide plate 4 is arranged at the upper end position of the cold air zone 3. Directional control blocks 401 driven by a motor 402 are provided at both ends of the variable guide plate 4. The directional control block 401 drives the variable guide plate 4 to rotate so as to adjust its orientation angle. A motor driver 403 is provided on the motor 402, and a core control unit 5 is connected to the motor driver 403 and the temperature sensor 2.
[0024] The variable deflector 4 can be adjusted within the angle range of 30° to 60°. It controls the motor 402 and the directional control block 401 through the motor driver 403 to achieve specific manipulation. When working with the sensor array, the temperature sensors 2 at various locations inside the control cabinet body 1 detect the temperature values at various locations. When the sensor at a specific location detects that the temperature value at that location exceeds the set value, its signal is transmitted to the core control unit 5. The core control unit 5 uses the motor driver 403 to adjust the angle of the variable deflector 4 to achieve directional airflow covering the high-temperature area, thereby performing directional heat dissipation.
[0025] A phase change material layer 7 is provided between the cabinet wall interlayers of the control cabinet body 1. The phase change material layer 7 is filled with paraffin-graphene composite material. The phase change material layer 7 can absorb peak heat and delay the temperature rise of the control cabinet body 1 under extreme working conditions.
[0026] The interior of the control cabinet body 1 is also provided with an assembly temperature sensor 8, an assembly humidity sensor 9, and a cabinet electrical current sensor 10. The assembly temperature sensor 8, the assembly humidity sensor 9, and the cabinet electrical current sensor 10 are connected to the core control unit 5. The core control unit 5 is equipped with a prediction model 501. After inputting the historical 72-hour temperature sequence, load current fluctuation, and ambient temperature and humidity, the prediction model 501 can output the temperature prediction value for the next 10 minutes and start the cooling equipment in advance.
[0027] The core control unit 5 further includes an adaptive alarm module 502. In the adaptive alarm module 502, when the predicted temperature Tpred satisfies: Tpred>0.8×Tmax+0.2×ΔTaging (1) , where Tmax is the rated maximum temperature of the device and ΔTaging is the aging compensation coefficient based on the capacitor ESR value.
[0028] A semiconductor refrigeration plate 11 is also provided inside the control cabinet body 1, and an edge controller 503 is provided in the core control unit 5. The edge controller 503 performs dynamic threshold control and calculates the temperature change rate dT / dt. When dT / dt>2℃ / min and the temperature>50℃, the semiconductor refrigeration plate 11 is started. Energy consumption optimization is performed here, and high-energy semiconductor refrigeration means are only started under high dT / dt conditions. Daily heat dissipation relies on passive heat dissipation and air cooling in the cold air zone 3, and the overall power consumption is greatly reduced.
[0029] The above is a further detailed description of the present invention in combination with specific implementation methods, and it cannot be determined that the specific implementation of the present invention is limited to this; for technical personnel in the technical fields to which the present invention belongs and related technical fields, based on the technical solution ideas of the present invention, the expansion and replacement of operating methods and data should all fall within the scope of protection of the present invention.
Claims
1. An intelligent heat dissipation control system for a control cabinet, characterized in that: include: A control cabinet body (1) is provided with a sensor array on the inner wall of the control cabinet body (1), the sensor array being composed of a temperature sensor (2), an independent cold air zone (3) being provided at the bottom end of the control cabinet body (1), an eddy current fan (301) being provided inside the cold air zone (3), an air duct of the eddy current fan (301) being directed toward the inside of the control cabinet body (1), a variable guide plate (4) being provided at the bottom end of the control cabinet body (1), the variable guide plate (4) being provided at the upper end position of the cold air zone (3), directional control blocks (401) driven by a motor (402) being provided at both ends of the variable guide plate (4), the directional control block (401) driving the variable guide plate (4) to rotate so as to adjust its orientation angle, a motor driver (403) being provided on the motor (402), a core control unit (5) being connected to the motor driver (403) and the temperature sensor (2).
2. The intelligent heat dissipation control system for a control cabinet according to claim 1, characterized in that: Side wall heat dissipation openings (6) are provided on the side walls of the control cabinet body (1).
3. The intelligent heat dissipation control system for a control cabinet according to claim 1, characterized in that: A phase change material layer (7) is provided between the cabinet wall interlayers of the control cabinet body (1), and the phase change material layer (7) is filled with paraffin-graphene composite material.
4. The intelligent heat dissipation control system for a control cabinet according to claim 1, characterized in that: The control cabinet body (1) is further provided with an assembly temperature sensor (8), an assembly humidity sensor (9), and a cabinet electrical current sensor (10). The assembly temperature sensor (8), the assembly humidity sensor (9), and the cabinet electrical current sensor (10) are connected to the core control unit (5). The core control unit (5) is equipped with a prediction model (501). After inputting a historical 72-hour temperature sequence, load current fluctuations, and ambient temperature and humidity, the prediction model (501) can output a temperature prediction value for the next 10 minutes.
5. The intelligent heat dissipation control system for a control cabinet according to claim 4, characterized in that: The core control unit (5) further includes an adaptive alarm module (502). In the adaptive alarm module (502), when the predicted temperature T_pred satisfies: Tpred>0.8×Tmax+0.2×ΔTaging (1) , where Tmax is the rated maximum temperature of the device and ΔTaging is the aging compensation coefficient based on the capacitor ESR value.
6. The intelligent heat dissipation control system for a control cabinet according to claim 5, characterized in that: A semiconductor cooling plate (11) is further provided inside the control cabinet body (1), and an edge controller (503) is provided in the core control unit (5). The edge controller (503) performs dynamic threshold control and calculates the temperature change rate dT / dt. When dT / dt>2°C / min and the temperature>50°C, the semiconductor cooling plate (11) is started.
Citation Information
Patent Citations
A heat dissipation component for a power system control cabinet
CN118232210B
Cited By
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CN121038247A
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