Temperature control system and control method for grinding fluid supply equipment

Abstract

The invention relates to a temperature control system and method for grinding fluid supply equipment. The temperature control system comprises a main pipeline, a temperature controller, a relay control unit, a PLC and a PC terminal. The main pipeline is connected with a pipeline of grinding fluid supply equipment and is of a flat structure, and a flowmeter and a thermometer are arranged at the front end and the rear end of the main pipeline respectively. The temperature controller comprises a semiconductor arranged on the main pipeline, heat dissipation fins arranged on the semiconductor and a modular fan arranged on the heat dissipation fins. The relay control unit is connected with the temperature controller, the PLC is connected with the flowmeter and the thermometer, and the PC terminal is connected with the relay control unit and the PLC. A traditional capillary tube is replaced by the main pipeline of the flat structure, the semiconductor is adopted as a cooling medium, and the air cooling mode of the modular fan and the cooling fins is combined, so that the phenomenon that the purity is damaged due to direct contact of cooling water and grinding liquid is avoided, and the heat exchange efficiency is improved by increasing the contact area of the main pipeline and the semiconductor.

Description

Technical Field

[0001] The present invention relates to the technical field of grinding liquid supply equipment, and in particular to a temperature control system and a control method for grinding liquid supply equipment. Background Art

[0002] Currently, polishing fluid supply equipment in the semiconductor industry often uses capillaries as the heat exchange mechanism. The polishing fluid flows through the tubes, while external cooling water flushes the outer walls of the capillaries to remove heat. To improve heat transfer efficiency, the capillaries are often very thin, which allows corrosive cooling water to easily intrude and compromise the purity of the polishing fluid. Furthermore, the long-term pressure differential between the inside and outside of the capillaries can easily damage and leak, affecting not only the quality of the chemicals but also posing safety risks in the factory. Furthermore, capillaries are non-standard products, requiring manual welding and fusion installation, making accurate processing and testing difficult and posing assembly and quality risks. Summary of the Invention

[0003] The purpose of the present invention is to provide a temperature control system and control method for grinding liquid supply equipment. By replacing the traditional capillary with a flat main line and using semiconductors as the cooling medium, combined with a modular fan plus heat sink fins air cooling method, it not only avoids the direct contact between cooling water and grinding liquid to destroy the purity, but also improves the heat exchange efficiency by increasing the contact area between the main line and the semiconductor. At the same time, the main line has a thick wall thickness, so that the grinding liquid flowing in the main line will not be disturbed by external factors, thereby ensuring the quality of the grinding liquid; through the PC terminal and the relay control unit's real-time data calculation and dynamic adjustment of the opening number and position of the temperature controller, accurate temperature preheating / precooling and full-process monitoring are achieved, thereby improving the safety and stability of the supply equipment.

[0004] To achieve the above object, according to a first aspect of the present invention, a temperature control system for a polishing liquid supply device is provided, comprising:

[0005] A main pipeline is connected to the pipeline of the grinding liquid supply device, the main pipeline is a flat structure, and a flow meter and a thermometer are respectively provided at the front and rear ends of the main pipeline;

[0006] A temperature controller comprising a semiconductor disposed on the main pipe, a heat dissipation fin disposed on the semiconductor, and a modular fan disposed on the heat dissipation fin;

[0007] a relay control unit connected to the thermostat;

[0008] A PLC controller connected to the flow meter and the thermometer;

[0009] A PC terminal is connected to the relay control unit and the PLC controller.

[0010] Optionally, the temperature controller further includes a base plate and a semiconductor base provided on the main line, the base plate and the semiconductor base define a receiving cavity for clamping the main line, and the heat dissipation fins are provided on the semiconductor base.

[0011] Optionally, a heat dissipation groove is provided on a side of the semiconductor base facing the heat dissipation fins, and the semiconductor is arranged in the heat dissipation groove and in contact with the main pipe.

[0012] Optionally, two ends of the main pipeline are provided with butt-jointed circular pipes for connecting to pipelines of a grinding liquid supply device.

[0013] Optionally, the temperature controller is provided with a quick-plug connector, and the relay control unit is provided with a quick-plug interface, and the quick-plug connector cooperates with the quick-plug interface to connect the temperature controller and the relay control unit.

[0014] According to a second aspect of the present invention, a method for controlling a temperature control system of a polishing liquid supply device is provided, comprising the following steps:

[0015] Controlling the PC terminal to read the data collected by the flow meter and the thermometer from the PLC controller, and importing the data into the relay control unit;

[0016] Controlling the data operation model of the relay control unit to perform data processing;

[0017] The relay control unit is controlled to adjust the operation of the temperature controller according to the data processing result.

[0018] Optionally, the controlling the data operation model of the relay control unit to perform data processing comprises the following steps:

[0019] The data calculation model controlling the relay control unit compares and analyzes the actual temperature and flow rate read from the rear end of the main line with the target temperature and flow rate read from the rear end of the main line;

[0020] According to the actual temperature at the front end and the rear end of the main line, the data calculation model of the relay control unit is controlled to calculate the temperature and heat required to be removed by the thermostat, and then calculate the opening number and position of the thermostat.

[0021] Optionally, controlling the relay control unit to adjust the operation of the thermostat according to the data processing result includes the following steps:

[0022] The relay control unit is controlled to adjust the opening quantity and position of the thermostat to pre-cool or pre-heat the main line at the thermostat installation position.

[0023] The beneficial effects of the present invention are: by replacing the traditional capillary with a flat main line, using semiconductors as the cooling medium, and combining the modular fan plus heat sink fin air cooling method, not only the direct contact between the cooling water and the grinding liquid to destroy the purity is avoided, but also the heat exchange efficiency is improved by increasing the contact area between the main line and the semiconductor. At the same time, the main line has a thick wall thickness, so that the grinding liquid flowing in the main line will not be disturbed by external factors, thereby ensuring the quality of the grinding liquid; through the PC terminal and the relay control unit's real-time data calculation and dynamic adjustment of the opening number and position of the temperature controller, accurate temperature preheating / precooling and full-process monitoring are achieved, thereby improving the safety and stability of the supply equipment.

[0024] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic module diagram of a temperature control system for a polishing liquid supply device according to an embodiment of the present invention;

[0026] Figure 2 This is a first schematic structural diagram of a temperature controller for a temperature control system of a grinding liquid supply device according to an embodiment of the present invention;

[0027] Figure 3 A second schematic structural diagram of a temperature controller for a temperature control system of a polishing liquid supply device according to an embodiment of the present invention;

[0028] Figure 4 This is a schematic flow chart of a control method for a temperature control system of a polishing liquid supply device according to an embodiment of the present invention;

[0029] Figure 5 for Figure 4 Schematic flow chart of step S20;

[0030] In the figure: 1. Main line; 2. Thermostat; 21. Semiconductor; 22. Heat sink fins; 23. Modular fan; 24. Bottom plate; 25. Semiconductor base; 26. Accommodation cavity; 27. Heat sink; 28. Docking pipe; 3. Relay control unit; 4. PLC controller; 5. PC terminal. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0034] See Figures 1 to 3 A temperature control system for a grinding liquid supply device shown in a preferred embodiment of the present application includes a main line 1, a temperature controller 2, a relay control unit 3, a PLC controller 4, and a PC terminal 5. The main line 1 is connected to the pipeline of the grinding liquid supply device. The main line 1 has a flat structure, and a flow meter and a thermometer are respectively provided at the front and rear ends of the main line 1. The temperature controller 2 includes a semiconductor 21 provided on the main line 1, a heat sink fin 22 provided on the semiconductor 21, and a modular fan 23 provided on the heat sink fin 22. The relay control unit 3 is connected to the temperature controller 2, the PLC controller 4 is connected to the flow meter and the thermometer, and the PC terminal 5 is connected to the relay control unit 3 and the PLC controller 4.

[0035] According to the solution of the embodiment of the present invention, by replacing the traditional capillary with a flat main line 1 and using a semiconductor 21 as a cooling medium, combined with a modular fan 23 and a heat sink fin 22 air cooling method, not only is the direct contact between the cooling water and the grinding liquid to avoid destroying the purity, but the heat exchange efficiency is also improved by increasing the contact area between the main line 1 and the semiconductor 21. At the same time, the wall thickness of the main line 1 is relatively thick, so that the grinding liquid flowing in the main line 1 will not be disturbed by external factors, thereby ensuring the quality of the grinding liquid; through the PC terminal 5, the real-time data calculation of the relay control unit 3 and the dynamic adjustment of the opening number and position of the temperature controller 2 are realized, accurate temperature preheating / precooling and full process monitoring are achieved, thereby improving the safety and stability of the supply equipment.

[0036] The following is a detailed description with specific embodiments:

[0037] Further, see Figure 2 The temperature controller 2 also includes a base plate 24 and a semiconductor 21 base provided on the main line 1. The base plate 24 and the semiconductor 21 base define a receiving cavity 26 for clamping the main line 1, and the heat dissipation fins 22 are provided on the semiconductor 21 base. A heat dissipation groove 27 is provided on the side of the semiconductor 21 base facing the heat dissipation fins 22. The semiconductor 21 is provided in the heat dissipation groove 27 and in contact with the main line 1. With such a configuration, the position of the main line 1 can be stabilized by the structure of the receiving cavity 26, reducing the risk of loosening caused by vibration or thermal expansion. At the same time, it can ensure that the working surface of the semiconductor 21 is in contact with a large area of ​​the main line 1, maximizing the heat flux density, and guiding the heat to the heat dissipation fins 22 through the peripheral heat dissipation grooves 27 to quickly diffuse, thereby improving the air cooling efficiency.

[0038] Further, see Figure 2 The main line 1 is provided with a docking tube 28 at each end for connecting to the polishing liquid supply equipment. The docking tube 28 allows the main line 1 to be directly connected to conventional piping. This docking tube 28 is highly compatible and facilitates rapid integration with existing polishing liquid supply equipment, reducing modification costs and simplifying on-site installation.

[0039] The thermostat 2 is equipped with a quick-connect connector, and the relay control unit 3 is equipped with a quick-connect interface. The quick-connect connector and quick-connect interface cooperate to connect the thermostat 2 and relay control unit 3. The quick-connect connector and quick-connect interface cooperate to achieve rapid electrical connection and assembly and disassembly. This modular quick-connect design facilitates maintenance and on-site replacement of the thermostat 2, and wiring can be completed without additional tools, improving the maintainability and scalability of the supply equipment.

[0040] See Figure 4 The embodiment of the present invention further provides a method for controlling a temperature control system of a polishing liquid supply device, comprising the following steps:

[0041] Step S10: Control the PC terminal 5 to read the data collected by the flow meter and the thermometer from the PLC controller 4, and import the data into the relay control unit 3;

[0042] Step S20: Control the data operation model of the relay control unit 3 to perform data processing;

[0043] Step S30: controlling the relay control unit 3 to adjust the operation of the thermostat 2 according to the data processing result.

[0044] This control method reads flowmeter and thermometer data from the PLC controller 4 via the PC terminal 5, imports it into the relay control unit 3, calls the data calculation model for processing, and then adjusts the operation of the temperature controller 2 based on the processing results. This process can achieve closed-loop control from data acquisition to execution and adjustment, ensuring the system's real-time response and precise control of the grinding liquid temperature. It should be noted that the relay control unit 3 exchanges data with the PC terminal 5 via optical fiber, relying on the computing power of the PC terminal 5 to operate its data calculation model.

[0045] See Figure 5 , step S20 includes the following steps:

[0046] Step S201: the data calculation model of the control relay control unit 3 compares and analyzes the actual temperature and flow rate read at the rear end of the main line 1 with the target temperature and flow rate at the rear end of the main line 1;

[0047] Step S202: Based on the actual temperatures at the front and rear ends of the main line 1, the data calculation model of the control relay control unit 3 calculates the temperature and heat required to be removed by the thermostat 2, and further calculates the opening quantity and position of the thermostat 2.

[0048] In the data calculation model, the actual temperatures at the front and rear ends of main line 1 are compared with the target temperature to calculate the required heat removal, and then determine the number and location of thermostats 2 to be opened. This allows dynamic assessment of process requirements, precise allocation of cooling / heating capacity to each thermostat 2, and optimal heat exchange configuration.

[0049] This step S30 includes the following steps:

[0050] The control relay control unit 3 adjusts the opening quantity and position of the thermostat 2 to pre-cool or pre-heat the main line 1 where the thermostat 2 is installed.

[0051] Based on the calculation results, relay control unit 3 adjusts the number of thermostats 2 activated and their installation positions, pre-cooling or pre-heating the corresponding section of main line 1. By proactively intervening in temperature regulation, this system not only shortens the response time to reach the set temperature but also proactively stabilizes the polishing fluid temperature before process fluctuations occur, further improving production efficiency and quality stability.

[0052] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A temperature control system for a grinding liquid supply device, characterized in that: include: A main pipeline is connected to the pipeline of the grinding liquid supply device, the main pipeline is a flat structure, and a flow meter and a thermometer are respectively provided at the front and rear ends of the main pipeline; A temperature controller comprising a semiconductor disposed on the main pipe, a heat dissipation fin disposed on the semiconductor, and a modular fan disposed on the heat dissipation fin; a relay control unit connected to the thermostat; A PLC controller connected to the flow meter and the thermometer; A PC terminal is connected to the relay control unit and the PLC controller.

2. The temperature control system for a grinding liquid supply device according to claim 1, characterized in that: The temperature controller further includes a bottom plate and a semiconductor base arranged on the main pipe. The bottom plate and the semiconductor base define a receiving cavity for clamping the main pipe. The heat dissipation fins are arranged on the semiconductor base.

3. The temperature control system for a grinding liquid supply device according to claim 2, characterized in that: A heat dissipation groove is provided on one side of the semiconductor base facing the heat dissipation fins. The semiconductor is arranged in the heat dissipation groove and contacts the main pipe.

4. The temperature control system for a grinding liquid supply device according to claim 1, characterized in that: Both ends of the main pipeline are provided with butt-jointing circular pipes for connecting with pipelines of grinding liquid supply equipment.

5. The temperature control system for a grinding liquid supply device according to claim 1, characterized in that: The temperature controller is provided with a quick-insert connector, and the relay control unit is provided with a quick-insert interface. The quick-insert connector cooperates with the quick-insert interface to connect the temperature controller and the relay control unit.

6. A control method for a temperature control system of a grinding liquid supply device according to any one of claims 1 to 5, characterized in that: The steps include: Controlling the PC terminal to read the data collected by the flow meter and the thermometer from the PLC controller, and importing the data into the relay control unit; Controlling the data operation model of the relay control unit to perform data processing; The relay control unit is controlled to adjust the operation of the temperature controller according to the data processing result.

7. The control method for the temperature control system of the polishing liquid supply equipment according to claim 6, characterized in that: The data operation model controlling the relay control unit to perform data processing includes the following steps: The data calculation model controlling the relay control unit compares and analyzes the actual temperature and flow rate read from the rear end of the main line with the target temperature and flow rate read from the rear end of the main line; According to the actual temperature at the front end and the rear end of the main line, the data calculation model of the relay control unit is controlled to calculate the temperature and heat required to be removed by the thermostat, and then calculate the opening number and position of the thermostat.

8. The control method for the temperature control system of the grinding liquid supply equipment according to claim 6, characterized in that: The step of controlling the relay control unit to adjust the operation of the thermostat according to the data processing result includes the following steps: The relay control unit is controlled to adjust the opening quantity and position of the thermostat to pre-cool or pre-heat the main line at the thermostat installation position.

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