Device for optimizing photothermal radiation power density of photothermal radiation heating source module

Abstract

The invention relates to a device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, which is characterized in that one or more or one or more layers of films which take a reflecting film as a main body are fully or locally coated on the surface part of a preferentially selected element of a photothermal radiation source module with high accumulation density according to conditions; the photo-thermal radiation power density absorbed by a photo-thermal radiation source module with high accumulation density constructed by a plurality of electro-thermal radiation assemblies is greatly reduced, so that a heat dissipation cooling system of the photo-thermal radiation source module is greatly simplified, and the power loss required for maintaining the normal operation of the photo-thermal radiation source module is greatly reduced. Therefore, the device and the design for improving the overall radiation power density capability are achieved, and the application range of the device and the design which can be applied to heating procedures with wider and higher power density requirements and higher temperature and / or faster temperature rise and fall is greatly expanded.

Description

Technical Field

[0001] The present invention is a device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, involving utilizing one or more and / or one or more layers of reflective film as the main body to cover the surface of the selected components of the high-density photothermal radiation heating source module, so as to significantly reduce the photothermal radiation power density absorbed by the high-density photothermal radiation heating source module constructed by multiple electrothermal conversion assemblies, thereby significantly simplifying the heat dissipation and cooling system of the aforementioned photothermal radiation heating source module and the power consumption required to maintain its normal operation, thereby achieving the device and design of improving its overall radiation power density capability, thereby significantly expanding its applicable scope for heating procedures with wider application, higher power density requirements, higher temperatures and / or faster temperature rise and fall, such as but not limited to the reaction temperature of 1550 degrees Celsius for compound semiconductor silicon carbide epitaxial growth and the gate doping activation temperature of 1700 degrees Celsius for silicon carbide gate doping activation annealing / tempering. Background Art

[0002] Conventional technology regarding the use of photothermal radiation in electrothermal-to-radiative assemblies primarily utilizes light sources for illumination, with a smaller portion being used as heat sources. Photothermal radiation, being the only heat transfer method that does not rely on a medium to transmit thermal energy and / or thermal power, enables heat transfer through air, providing precise heating, rapid temperature rise and fall, and reducing the need for additional heat dissipation from surrounding objects that do not require heating. This significantly reduces energy consumption, making it an indispensable component in specific heating applications, including, but not limited to, the semiconductor manufacturing process equipment industry.

[0003] Conventional technology for electrothermal radiative heating assemblies using photothermal radiation as a heating source typically utilizes high-temperature-resistant, high-photothermal radiation transmittance, and dense, airtight microstructures, including but not limited to quartz and / or alumina glass, as the airtight photothermal radiation-transmitting housing of the electrothermal radiative heating assemblies. This is sufficient for many specific heating applications, such as heating silicon wafers to 1,000 to 1,200 degrees Celsius, and rapidly increasing the temperature of silicon wafers to nearly 1,000 degrees Celsius at a rate of 200 to 250 degrees Celsius per second. Compared to more traditional heat transfer methods such as heat conduction and / or heat convection, conventional technology for electrothermal radiative heating assemblies using photothermal radiation as a heating source cleverly utilizes the speed of light to heat specific objects quickly and efficiently through space without the need for other materials. The advancement in technology and performance is truly remarkable.

[0004] However, the aforementioned conventional technology is still unable to meet the process temperatures of 1,500 to 1,550 degrees Celsius required for silicon carbide epitaxial deposition and the even higher process temperatures of 1,700 to 1,750 degrees Celsius required for silicon carbide gate doping activation annealing. The reason for this is that if a high-density photothermal radiation heating source module for an electrothermal-to-radiative assembly with higher heating temperature capabilities is to be produced, it must have an airtight photothermal radiation-transmitting shell that is resistant to high temperatures and has high photothermal radiation reflectivity in specific areas. The current conventional technology clearly needs to be significantly improved. In addition, the photothermal radiation absorption rate of the peripheral components of the electrothermal-to-radiative assembly is too high, which leads to a sharp increase in the complexity and cost of the heat dissipation system of the photothermal radiation heating source module, which has already created severe technical barriers for the related industry to apply to applications in higher temperature ranges and faster heating and cooling speeds. Summary of the Invention

[0005] In view of the aforementioned technical deficiencies that need improvement in the prior art, the present invention proposes a novel and effective method for improving the device for optimizing the radiation power density of an electrothermal-to-radiative assembly. This method aims to achieve an optimal local photothermal radiation reflectivity that is comparable to the optimized airtight photothermal radiation transmission shell of the conventional electrothermal-to-radiative assembly, while also having the ability to efficiently and precisely converge photothermal radiation and better suppress the dissipation of photothermal radiation power density. Furthermore, through an integrated novel design, the complexity and cost of the surrounding heat dissipation system are effectively reduced, thereby further expanding the industrial application scope to meet the requirements of higher temperature ranges and faster temperature rise and fall.

[0006] The electrothermal-to-radiative assembly referred to in the present invention refers to a component that can convert electrical energy into thermal energy, and then use the blackbody radiation principle to radiate the photothermal radiation power density to become a photothermal radiation heating source that can be used for heat transfer via photothermal radiation. The component is hermetically protected by an airtight photothermal radiation-transmitting housing so that it can operate normally in a standard operating environment. The electrothermal-to-radiative assembly includes, but is not limited to, tungsten filament lamps, halogen tungsten filament lamps, carbon fiber infrared lamps, molybdenum filament lamps, tantalum carbide filament lamps, etc.

[0007] To achieve the aforementioned and other objectives, the present invention hereby proposes in detail a novel design of a device that can optimize the radiation power density of an electrothermal-to-radiative assembly, including but not limited to an airtight photothermal radiation transmission shell of the electrothermal-to-radiative assembly, and an airtight cavity that needs to be airtightly coupled to provide a photothermal radiation transmission window that can transmit photothermal radiation with high quality, and systematically integrates it into a device that can better achieve the aforementioned, including but not limited to, a photothermal radiation heating source module that can optimize the radiation power density of the electrothermal-to-radiative assembly, so as to effectively reduce the complexity and cost of its surrounding heat dissipation system, thereby further expanding the industrial application scope of application requirements of higher temperature ranges and faster temperature rise and fall. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 Shown is a cross-sectional schematic diagram of an electrothermal radiation assembly that is approximately hollow and spherical.

[0009] Figure 2 Shown is a schematic cross-sectional view of an electrothermal radiation assembly that is approximately hollow ellipsoidal in shape.

[0010] Figure 3 The figure shows a cross-sectional view of an electrothermal-to-radiative assembly having a substantially hollow spherical shape and optionally fully or partially covered with a light-heat radiation-transmitting shell having a reflective film as the main body and one or more types and / or one or more layers of coatings.

[0011] Figure 4 The figure shows a cross-sectional view of an electrothermal-radiative assembly having a substantially hollow elliptical sphere, which is optionally fully or partially covered with a light-heat radiation-transmitting shell and has one or more types of films and / or one or more layers of coatings, with a reflective film as the main body.

[0012] Figure 5 Shown is a schematic cross-sectional view of an electrothermal radiation assembly that is approximately hollow cylindrical.

[0013] Figure 6 The figure shows a cross-sectional view of an electrothermal-to-radiative assembly having a substantially hollow cylindrical shape and optionally fully or partially covered with a light-heat radiation-transmitting shell having a reflective film as the main body and one or more types and / or one or more layers of coating films.

[0014] Figure 7 The example exemplifies a cross-sectional schematic diagram of the partial composition of a high-density photothermal radiation heating source module constructed by an approximately hollow cylindrical electrothermal radiation conversion assembly with one or more types and / or one or more layers of coatings having a reflective film as the main body, which is optionally fully or partially covered with a photothermal radiation transmission shell, an electrothermal radiation conversion assembly head cover with one or more types and / or one or more layers of coatings having a reflective film as the main body, which is optionally fully or partially covered with an electrothermal radiation conversion assembly head cover, an electrothermal radiation conversion assembly fixing seat with one or more types and / or one or more layers of coatings having a reflective film as the main body, which is optionally fully or partially covered with an inner side wall of the electrothermal radiation conversion assembly fixing seat, and a photothermal radiation transmission window fixing seat with one or more types and / or one or more layers of coatings having a reflective film as the main body, which is optionally fully or partially covered with a photothermal radiation transmission window fixing seat.

[0015] Figure 8 The present invention exemplifies a plurality of feasible embodiments including but not limited to the examples having a plurality of electrothermal radiators 004 and an electrothermal radiator support frame 005 .

[0016] Figure 9 This is a schematic diagram of the coupling of multiple electrothermal radiation assemblies and a photothermal radiation heating source module fixing base.

[0017] Figure 10 The cross-sectional diagram briefly illustrates a semiconductor high-temperature manufacturing process reaction chamber formed by airtight coupling of a device for optimizing the radiation power density of an electrothermal-radiative assembly according to the present invention and related components such as an airtight reaction chamber.

[0018] Figure 11 The present invention is an explanatory diagram illustrating the plane polar coordinates used in describing the cylindrical object and the Cartesian axial coordinates in the axial, radial and circumferential directions of the cylindrical object.

[0019] Figure 12 This is a schematic diagram illustrating a single electrothermal radiation conversion assembly head cover of the present invention, which is optionally fully or partially covered with one or more types of and / or one or more layers of coatings with a reflective film as the main body, and an electrothermal radiation conversion assembly fixing seat, which is optionally fully or partially covered with one or more types of and / or one or more layers of coatings with a reflective film as the main body, in a plane polar coordinate composite Cartesian coordinate with two parallel plane polar coordinate planes being tangent.

[0020] Figure 13 (a) is a schematic diagram illustrating a single electrothermal-radiative assembly head cover of the present invention which is fully or partially covered with one or more and / or one or more layers of coatings with a reflective film as the main body, and then cut into three equal parts on a plane of plane polar coordinates, with the concave side wall of the original inner wall facing the direction of the sputtering source target material and / or target powder for magnetron sputtering and / or magnetron powder sputtering.

[0021] Figure 13 (b) is a schematic diagram of the P2 polar coordinate plane cross-section of a single electrothermal radiation conversion assembly head cover of the present invention, which is fully or partially covered with one or more types and / or one or more layers of coatings with a reflective film as the main body, and is cut into three equal parts on the plane of the polar coordinate plane and sputter-coated and then assembled.

[0022] Figure 13 (c) is a schematic diagram of a cross-sectional view of the P2 polar coordinate plane of a single electrothermal radiation conversion assembly head cover of the present invention, which is fully or partially covered with one or more types of reflective films and / or one or more layers of coatings, and is cut into three equal parts on the plane of the polar coordinate plane to complete the sputtering coating and assembly.

[0023] Figure 13(d) is a schematic diagram illustrating a single electrothermal-to-radiative assembly fixing seat of the present invention, which is entirely or partially covered with one or more and / or one or more layers of coatings with a reflective film as the main body, and then divided into three equal parts on the plane of the plane polar coordinates, with the concave side wall of the original inner wall facing the direction of the sputtering source target material and / or target powder for magnetron sputtering and / or magnetron powder sputtering.

[0024] Figure 13 (e) is a schematic diagram of a cross-sectional view in the polar coordinate plane of a single electrothermal-to-radiative assembly fixing seat of the present invention, which is divided into three equal parts on a plane of polar coordinates and sputter-coated with one or more types and / or one or more layers of coatings having a reflective film as the main body and an assembly process.

[0025] Figure 13 (f) is a schematic diagram of a cross-sectional view of the polar coordinate plane of the electrothermal radiation conversion assembly fixing seat of the present invention, which is divided into three equal parts on the plane of the polar coordinate plane, and is a P1 polar coordinate plane diagram of the electrothermal radiation conversion assembly fixing seat with one or more and / or one or more layers of coatings with a reflective film as the main body and the inner side wall of the electrothermal radiation conversion assembly fixing seat being fully or partially covered as appropriate. DETAILED DESCRIPTION

[0026] Figure 1 The figure shows a cross-sectional schematic diagram of a hollow, approximately spherical electrothermal radiation conversion assembly, which includes but is not limited to one or more electrothermal radiation conversion bodies 004, a hollow, approximately spherical photothermal radiation transmission shell 002, an internal space 003 of the electrothermal radiation conversion assembly, an airtight port 008 of the photothermal radiation transmission shell, and a power pin 007 partially airtightly coupled thereto. The electrothermal radiation conversion body 004 is built into the internal space 003 of the electrothermal radiation conversion assembly formed by the airtight coupling of the photothermal radiation transmission shell airtight port 008 and the photothermal radiation transmission shell 002. The power pin 007 airtightly coupled to the photothermal radiation transmission shell airtight port 008 can be connected to an external power energy supplier, including but not limited to an external power energy supplier, not explicitly shown in the figure, to perform the function of electrothermal radiation conversion as a photothermal radiation heating source.

[0027] Figure 2The photothermal radiation transmission shell 002 of the electrothermal radiation conversion assembly 001 can be approximately hollow and approximately ellipsoidal, and the internal space 003 of the electrothermal radiation conversion assembly can be used to place an optimized approximately ellipsoidal electrothermal radiation conversion body 004. The shell is airtightly coupled to the photothermal radiation transmission shell airtight port 008, and then the power pin 007, which is partially airtightly coupled to the photothermal radiation transmission shell airtight port 008, is connected in series to the electrothermal radiation conversion body 004 to construct an electrothermal radiation conversion assembly. The power pin 007 is then connected to an external power energy supplier including but not limited to an external power energy supplier not explicitly shown in this figure, so as to perform the function of electrothermal radiation conversion as a photothermal radiation heating element.

[0028] Figure 3 Tie Figure 1 The example is a schematic diagram of an electrothermal radiation conversion assembly formed by one or more and / or one or more layers of coating 006 with a reflective film as the main body, which is optionally fully or partially covered on the outer side wall of a hollow, approximately spherical photothermal radiation transmission shell 002, wherein the one or more and / or one or more layers of coating 006 with a reflective film as the main body, which is optionally fully or partially covered on the photothermal radiation transmission shell, can be preferably coated on the semi-spherical surface of the outer side wall of the hollow, approximately spherical photothermal radiation transmission shell 002 on the side of the power pin 007, in order to regulate the photothermal radiation of the electrothermal radiation conversion assembly 001 by the one or more and / or one or more layers of coating 006 with a reflective film as the main body, which is optionally fully or partially covered on the photothermal radiation transmission shell. The radiation cone angle of the irradiation shell 002 is preferably within a specific limited area, thereby shaping a well-planned and controlled radiation direction and spatial angle range, so that the photothermal radiation of the electrothermal conversion radiation assembly 001 can more accurately and efficiently concentrate the photothermal radiation power density on the heated object, thereby greatly suppressing the common problem in conventional technology that the photothermal radiation of the electrothermal conversion radiation assembly 001 is not heated to the specific range of elements and / or elements due to the failure to meet the novel design of the present invention. Therefore, the conventional technology greatly improves the energy consumption and operating cost of the heat dissipation and cooling system of the electrothermal conversion radiation assembly 001 and / or the photothermal radiation heating source module 010, and / or the complexity of design and processing and the accompanying expensive manufacturing cost and high maintenance cost.

[0029] Figure 4 Tie Figure 2The example is a schematic diagram of an electrothermal radiation conversion assembly formed by one or more and / or one or more layers of coatings with a reflective film as the main body, which are optionally fully or partially covered on the outer side wall of a hollow, approximately ellipsoidal, photothermal radiation transmission shell 002, wherein the one or more and / or one or more layers of coatings with a reflective film as the main body, which are optionally fully or partially covered on the photothermal radiation transmission shell, can be preferably coated on the semi-ellipsoidal surface of the outer side wall of the hollow, approximately ellipsoidal, photothermal radiation transmission shell 002 on the side of the power pin 007, in order to regulate the photothermal radiation of the electrothermal radiation conversion assembly 001 by the one or more and / or one or more layers of coatings 006 with a reflective film as the main body, which are optionally fully or partially covered on the photothermal radiation transmission shell. The radiation cone angle of the irradiation shell 002 is preferably within a specific limited area, thereby shaping a well-planned and controlled radiation direction and spatial angle range, so that the photothermal radiation of the electrothermal conversion radiation assembly 001 can more accurately and efficiently concentrate the photothermal radiation power density on the heated object, thereby greatly suppressing the common problem in conventional technology that the photothermal radiation of the electrothermal conversion radiation assembly 001 is not heated to the specific range of elements and / or elements due to the failure to meet the novel design of the present invention. Therefore, the conventional technology greatly improves the energy consumption and operating cost of the heat dissipation and cooling system of the electrothermal conversion radiation assembly 001 and / or the photothermal radiation heating source module 010, and / or the complexity of design and processing and the accompanying expensive manufacturing cost and high maintenance cost.

[0030] Figure 5 The figure shows a cross-sectional view of a hollow, approximately cylindrical electrothermal radiation conversion assembly, which comprises but is not limited to one or more electrothermal radiation conversion bodies 004, one or more electrothermal radiation conversion body support frames 005, a hollow, approximately cylindrical photothermal radiation transmission shell 002, an inner space 003 of the electrothermal radiation conversion assembly, an airtight port 007 of the photothermal radiation transmission shell, and a power supply pin 008 partially airtightly coupled thereto, which is composed of an electrothermal radiation conversion assembly 001. The electrothermal radiator 004 supported and fixed by the electrothermal radiator support frame 005 of the airtight port 007 is built into the internal space 003 of the electrothermal radiator assembly formed by the airtight coupling of the photothermal radiation transmission shell airtight port 008 and the photothermal radiation transmission shell 002. The power pin 007 airtightly coupled by the photothermal radiation transmission shell airtight port 008 can be connected to an external power energy supplier including but not limited to an external power energy supplier not explicitly shown in this figure, so as to perform the function of electrothermal radiation as a photothermal radiation heating element.

[0031] Figure 6 Tie Figure 5The example is a schematic diagram of an electrothermal radiation conversion assembly formed by one or more and / or one or more layers of coating 006 with a reflective film as the main body, which is optionally fully or partially covered on the outer side wall of a hollow, approximately cylindrical, photothermal radiation transmission shell 002, wherein the one or more and / or one or more layers of coating 006 with a reflective film as the main body, which is optionally fully or partially covered on the photothermal radiation transmission shell, can preferably be coated starting from the side of the outer side wall of the hollow, approximately cylindrical, photothermal radiation transmission shell 002 close to the power pin 007, and can preferably end at the junction of the cylindrical area and the non-cylindrical area of ​​the outer side wall of the hollow, approximately cylindrical, photothermal radiation transmission shell 002, in order to regulate the electrothermal radiation conversion assembly by the one or more and / or one or more layers of coating 006 with a reflective film as the main body, which is optionally fully or partially covered on the photothermal radiation transmission shell. The photothermal radiation of the electrothermal-to-radiation assembly 001 is ultimately transmitted through the photothermal radiation transmission shell 002 at a preferred radiation cone angle within a specific defined area, thereby shaping a well-planned and controlled radiation direction and spatial angle range, so that the photothermal radiation of the electrothermal-to-radiation assembly 001 can more accurately and efficiently concentrate the photothermal radiation power density on the heated object, thereby greatly suppressing the common problem in conventional technology where the electrothermal-to-radiation assembly 001 heats the components and / or specific ranges of the components that are not to be heated due to the failure to meet the novel design of the present invention. This greatly improves the energy consumption and operating costs of the heat dissipation and cooling system of the electrothermal-to-radiation assembly 001 and / or the photothermal radiation heating source module 010, and / or the complexity of design and processing and the accompanying expensive manufacturing costs and high maintenance costs of the conventional technology.

[0032] Figure 7 So Figure 6The example is a cross-sectional diagram of the partial composition of a high-density photothermal radiation heating source module structure 037 constructed by an electrothermal radiation conversion assembly 001 with a reflective film as the main body and one or more and / or one or more layers of coating 006, which is approximately hollow cylindrical and optionally fully or partially covered with a photothermal radiation transmission shell, in combination with an electrothermal radiation conversion assembly head cover 029 and a photothermal radiation transmission window 034. Among them, the electrothermal radiation conversion assembly head cover 029 can be optimally selected to cover its inner side wall with a fully or partially covered photothermal radiation transmission shell. The inner wall of the electrothermal radiation conversion assembly head cover is provided with one or more and / or one or more layers of coating 032 with a reflective film as the main body, and in the area adjacent to the photothermal radiation transmission window 034 and the area adjacent to the photothermal radiation transmission shell airtight port 008 of the electrothermal radiation conversion assembly fixing seat 028, a fluid channel is preferably opened, such as the cooling fluid channel port 030 of the electrothermal radiation conversion assembly fixing seat in the figure, so that the cooling fluid flows from the outside of the electrothermal radiation conversion assembly head cover through the gap between the photothermal radiation transmission shell and the electrothermal radiation conversion assembly fixing seat and then is discharged by the electrothermal radiation conversion assembly. The cooling fluid 033 flowing out of the cooling fluid channel of the electrothermal conversion radiation assembly fixing seat can achieve the purpose of cooling and dissipating heat more quickly and evenly. In addition, the outer side of the electrothermal conversion radiation assembly head cover 029 together with the outer side wall of the electrothermal conversion radiation assembly fixing seat 028 can be preferably planned and arranged between the cooling fluid 038 flowing through the outer side wall of the electrothermal conversion radiation assembly fixing seat and the photothermal radiation heating source module structure 037 so that a larger amount of cooling and dissipating heat can be preferably modulated when necessary to achieve a faster and For the purpose of uniform cooling and heat dissipation, the inner side wall of the electrothermal conversion radiation assembly fixing seat 028 can be preferably covered with one or more and / or one or more layers of coatings with a reflective film as the main body, which can cover the inner side wall of the electrothermal conversion radiation assembly fixing seat in whole or in part as appropriate, so that the power density of the photothermal radiation radiated by the high temperature of the main body of the shell 002 when the electrothermal conversion radiation assembly 001 is powered on and radiated due to the black body radiation principle can be greatly reduced and dissipated to the photothermal radiation heating source module structure 037 (not explicitly shown in Figure 7 , please see Figure 10 ), this method can effectively limit the degree of photothermal radiation power density that is commonly dissipated to the photothermal radiation heating source module structure, thereby greatly simplifying the overall photothermal radiation heating source module structure with a view to the complexity of the heat dissipation system and / or greatly reducing its cost. From another perspective, it can also relatively speaking greatly expand the scope of application of the electrothermal-to-radiation assembly 001 in the field of photothermal radiation heating sources.

[0033] Figure 8 The electrothermal radiation assembly 001 is provided with a plurality of electrothermal radiation bodies 004 and an electrothermal radiation body support frame 005, which may include but is not limited to Figure 8 Several possible embodiments are shown.

[0034] Figure 9 The example is given in which a plurality of high-density electrothermal conversion assemblies 001 are used to project photothermal radiation onto a nearly circular surface for heat transfer in the form of thermal radiation. When the photothermal radiation power density is coupled to the photothermal radiation heating source module fixing seat 009, it is preferred to take into account the cost-effectiveness of the photothermal radiation power density distribution, including but not limited to the uniformity of the photothermal radiation power density and / or the processing cost and efficiency of the heat dissipation system. Figure 9 The following are possible embodiments.

[0035] Figure 10 This example demonstrates that the electrothermal radiation conversion assembly 001 of the present invention is fixed to the electrothermal radiation conversion assembly fixing seat 028 originally installed on the electrothermal radiation conversion assembly head cover 029 to complete the process of its installation on the photothermal radiation heating source module structure 037. Next, the photothermal radiation transmission window fixing seat 042 is used to fasten one or more photothermal radiation transmission windows 034 by fastening the photothermal radiation heating source module structure and the photothermal radiation transmission window fixing seat with the fastening element 040 and providing the photothermal radiation transmission window fixing seat and the photothermal radiation transmission window with airtight fastening. The sealing element 046 In the photothermal radiation heating source module structure 037, the photothermal radiation transmission window fixing seat 042 can be airtightly fixed to the airtight reaction chamber 048 through the fastening element 041 for fastening the photothermal radiation transmission window fixing seat and the airtight reaction chamber and the sealing element 043 for providing airtight fastening between the photothermal radiation transmission window fixing seat and the airtight reaction chamber, thereby making the airtight reaction chamber 048 airtightly coupled to the pre-airtightly coupled photothermal radiation transmission window fixing seat 042 and one or more photothermal radiation transmission windows 034 to form a complete airtight reaction chamber 000 with photothermal radiation as the heating source.

[0036] The aforementioned airtight reaction chamber 000 with photothermal radiation as a heating source basically includes but is not limited to an airtight reaction chamber 011 and a photothermal radiation heating source module 010 .

[0037] Among them, the photothermal radiation heating source module 010 basically includes but is not limited to one or more electrothermal radiation conversion assemblies 001, preferably one or more electrothermal radiation conversion assembly head covers 029, one or more electrothermal radiation conversion assembly fixing seats 028, one or more photothermal radiation heating source module structures 037, one or more photothermal radiation transmission windows 034, preferably one or more fastening elements 040 for fastening the photothermal radiation heating source module structure and the photothermal radiation transmission window fixing seat, preferably one or more sealing elements 046 for providing airtight fastening between the photothermal radiation transmission window fixing seat and the photothermal radiation transmission window, and a photothermal radiation heating source module fixing seat 009.

[0038] Among them, the electrothermal radiation conversion assembly 001 basically includes but is not limited to a photothermal radiation transmission shell 002, an internal space 003 of the electrothermal radiation conversion assembly, one or more electrothermal radiation conversion bodies 004, one or more electrothermal radiation conversion body support frames 005, one or more and / or one or more layers of coatings 006 with a reflective film as the main body that covers all or part of the photothermal radiation transmission shell as appropriate, a power pin 007 and an airtight port 008 of the photothermal radiation transmission shell. Among them, one or more and / or one or more layers of coatings 006 with a reflective film as the main body that covers the photothermal radiation transmission shell in whole or in part, as the case may be, only provide the electrothermal conversion radiation assembly 001 as a photothermal radiation heating source with more excellent quasi-directional photothermal radiation characteristics when the application field requires it, especially when its cylindrical axis is on the opposite side of the power pin 007 and / or the photothermal radiation transmission shell airtight port 008 to use a higher accumulated photothermal radiation power density to perform a heating process with a higher temperature and / or a higher heating temperature rise and fall rate on the heated object, and / or when it is necessary to specifically reduce the photothermal radiation power density emitted by the photothermal radiation transmission shell 002 in a specific area during the heating process of the electrothermal conversion radiation assembly 001, which is especially common in application scenarios where multiple electrothermal conversion radiation assemblies 001 of the photothermal radiation heating source module 010 are configured with extremely high accumulation density.

[0039] Among them, the cooling fluid 039 of the photothermal radiation heating source module 010, which is formed after the cooling fluids flowing through the internal gap of the photothermal radiation heating source module structure are converged, is composed of the cooling fluid 035 flowing through the internal gap of the photothermal radiation heating source module structure, the cooling fluid 038 flowing through the outer wall of the electrothermal conversion radiation assembly fixing seat, and the cooling fluid 033 flowing from the outside of the electrothermal conversion radiation assembly head cover through the gap between the photothermal radiation transmission shell and the electrothermal conversion radiation assembly fixing seat and then flowing out from the cooling fluid channel port of the electrothermal conversion radiation assembly fixing seat. The above-mentioned cooling fluids of each branch flow are converged after performing their specific cooling and heat dissipation cycles.

[0040] Among them, the internal space 003 of the electrothermal conversion assembly of the photothermal radiation heating source module 010 can be filled with, as in conventional technology, substances including but not limited to halogen elements, halide elements, nitrogen, inert gases, oxygen-absorbing substances, and / or hygroscopic substances.

[0041] Among them, other components of the photothermal radiation heating source module 010 have been described in detail in many columns of the embodiments of the present invention, so they will not be repeated here.

[0042] The airtight reaction chamber 011 basically includes but is not limited to an airtight reaction chamber body 048, a substrate 054 carried on a substrate support ring 053 that enters the airtight reaction chamber 011 during the manufacturing process, a paramagnetic drive ring 052 that indirectly drives the substrate support ring 053 to rotate, a bearing 051 that can preferably enable the paramagnetic drive ring 052 to rotate smoothly, a frameless motor rotor 050 that can preferably drive the paramagnetic drive ring 052 to rotate through magnetic force, and a frameless motor rotor 050 that can preferably perform electromagnetic conversion to drive the frameless motor to rotate. The motor 050 is preferably a frameless motor stator 049 fixed to the outer wall of the airtight reaction chamber 048 for rotational motion, one or more non-contact thermometers 058 are preferably selected, and a photothermal radiation reflector 012 is preferably selected on the opposite side of the photothermal radiation heating source module, and one or more fastening elements 041 for fastening the photothermal radiation transmission window fixing seat and the airtight reaction chamber so as to enable the airtight coupling between the airtight reaction chamber 048 and the photothermal radiation heating source module fixing seat 009, and a sealing element 043 for providing airtight fastening between the photothermal radiation transmission window fixing seat and the airtight reaction chamber.

[0043] Among them, the airtight reaction chamber 048 can be preferably provided with one or more carrier gas and / or inert gas and / or purge gas and / or cleaning gas introduction channels 060, and can be preferably provided with one or more carrier gas and / or inert gas and / or purge gas and / or cleaning gas and / or waste gas and / or suspended particle flow exhaust channels 045, so as to preferably generate carrier gas and / or inert gas and / or purge gas and / or cleaning gas and / or waste gas and / or suspended particle flow fields 061 and carrier gas and / or inert gas and / or purge gas and / or cleaning gas and / or waste gas and / or reaction gas and / or suspended particle flow fields 062 in the area adjacent to the photothermal radiation heating source module fixing seat 009 inside the airtight reaction chamber 011, so as to provide the area with an optimized reaction environment for the semiconductor manufacturing process as needed.

[0044] Among them, the airtight reaction chamber 048 is provided with one or more carrier gas and / or inert gas and / or purge gas and / or cleaning gas and / or reaction gas introduction channels 059, and carrier gas and / or inert gas and / or purge gas and / or cleaning gas and / or waste gas and / or suspended particle flow and / or reaction gas exhaust channels 047, which are used to generate carrier gas and / or inert gas and / or purge gas and / or cleaning gas and / or waste gas and / or suspended particle flow and / or reaction gas flow field 055 on the expected reaction surface adjacent to the substrate 054 inside the airtight reaction chamber 011, so as to carry out the set semiconductor manufacturing process.

[0045] The airtight reaction chamber 048 can preferably be provided with one or more non-contact thermometers 058 at the largest surface facing the substrate 054, wherein the central axis 056 of the incident three-dimensional light cone of each non-contact thermometer 058 can be preferably set at the same and / or different angles toward the substrate 054, so that the area enclosed by the circle and / or ellipse formed by the boundary 057 of the incident three-dimensional light cone of the non-contact thermometer and the approximately circular surface of the substrate 054 can be preferably heated by photothermal radiation. The corresponding openings of the photothermal radiation reflector 012 on the opposite side of the source module absorb and sense the photothermal radiation power density in the area enclosed by the aforementioned circle and / or ellipse on the surface of the substrate, thereby performing a non-contact temperature measurement task. When the substrate 054 is driven to rotate, the temperature sensing intervals of the circular and / or elliptical areas then form temperature sensing intervals of various circular and / or annular areas, and through one or more preferred non-contact thermometers 058, a complete non-contact temperature sensing system for the entire surface of the substrate 054 can be formed.

[0046] Among them, the airtight reaction chamber 011 of the airtight reaction chamber 000 with photothermal radiation as the heating source and the photothermal radiation heating source module 010 are airtightly coupled through one or more fastening elements 041 for fastening the photothermal radiation transmission window fixing seat and the airtight reaction chamber and a sealing element 043 for providing airtight fastening between the photothermal radiation transmission window fixing seat and the airtight reaction chamber to form the airtight conditions required for the airtight reaction chamber 000 with photothermal radiation as the heating source.

[0047] Among them, the aforementioned substrate 054 can be a wafer or a base or a base plate or a substrate, and can preferably be a plate-like material that is approximately circular and / or square and / or polygonal. In order to avoid confusion, the relevant descriptions of the present invention are uniformly referred to as substrates.

[0048] Among them, the preferred electrothermal conversion radiation assembly head cover 029 of the photothermal radiation heating source module 010, which may preferably cover the inner side wall of the electrothermal conversion radiation assembly head cover with one or more and / or one or more layers of coating 032 with a reflective film as the main body, may be omitted as appropriate, and the originally predetermined one or more and / or one or more layers of coating 032 with a reflective film as the main body of the preferred electrothermal conversion radiation assembly head cover 029 may be replaced by mirror processing to replace the reflective film part.

[0049] The preferred electrothermal conversion radiation assembly head cover 029 of the photothermal radiation heating source module 010 may be omitted depending on the circumstances and replaced by an extended design of the electrothermal conversion radiation assembly fixing seat 028 .

[0050] The electrothermal conversion assembly fixing seat 028 of the photothermal radiation heating source module 010 may be directly coupled to the photothermal radiation heating source module structure 037 as appropriate.

[0051] Among them, the electrothermal conversion radiation assembly fixing seat 028 of the photothermal radiation heating source module 010 can be directly coupled to the photothermal radiation heating source module structure 037, which can cover the inner wall of the electrothermal conversion radiation assembly fixing seat in whole or in part with one or more and / or one or more layers of coating 031 with a reflective film as the main body, and can cover the inner wall of the electrothermal conversion radiation assembly head cover in whole or in part with one or more and / or one or more layers of coating 032 with a reflective film as the main body, preferably, the reflective film portion can be replaced by mirror finishing on the surface of its substrate as the case may be.

[0052] Figure 11 This diagram illustrates the use of plane polar coordinates combined with Cartesian coordinates in the axial direction of a cylindrical object in the present invention to facilitate understanding of the following embodiments. A represents the axial direction of the cylindrical object's Cartesian coordinates, B represents the radial direction of the cylindrical object in the polar coordinate space plane, and C represents the circumferential direction of the cylindrical object in the polar coordinate space plane.

[0053] Figure 12 The present invention is exemplified by a single electrothermal radiation conversion assembly fixing seat 029 of which one or more and / or one or more layers of coating 031 with a reflective film as the main body and the electrothermal radiation conversion assembly head cover 028 of which one or more and / or one or more layers of coating 032 with a reflective film as the main body and which is optionally partially covered with the electrothermal radiation conversion assembly head cover in the plane polar coordinate composite Cartesian coordinates to be specifically tangent to the inner wall of the electrothermal radiation conversion assembly fixing seat. Schematic diagram of a space plane P1 in the vertical axial direction in which a columnar object of an electrothermal radiation conversion assembly fixing seat, which is entirely or partially covered with one or more types of reflective films and / or one or more layers of coatings and has an inner side wall of the electrothermal radiation conversion assembly fixing seat, is tangent to a space plane P2 in the vertical axial direction in which a columnar object of an electrothermal radiation conversion assembly head cover, which is entirely or partially covered with one or more types of reflective films and / or one or more layers of coatings and has a head cover of the electrothermal radiation conversion assembly, which is specifically tangent to the inner side wall of the electrothermal radiation conversion assembly fixing seat, which is entirely or partially covered with one or more types of reflective films and / or one or more layers of coatings and has a head cover of the electrothermal radiation conversion assembly, is tangent to the inner side wall of the electrothermal radiation conversion assembly fixing seat, which is entirely or partially covered with one or more types of reflective films and / or one or more layers of coatings and has a head cover of the electrothermal radiation conversion assembly,

[0054] Figure 13(a) is an example of a single electrothermal radiation conversion assembly head cover 029 of the present invention being specifically tangent to a columnar object of an electrothermal radiation conversion assembly head cover which is specifically tangent to a columnar object of an electrothermal radiation conversion assembly head cover which is fully or partially covered with a reflective film as a main body and / or one or more types of and / or one or more layers of coatings. After the columnar object is divided into three equal parts in the circumferential direction C, it is placed in a magnetron sputtering device to perform a schematic illustration of the magnetron sputtering coating process on the inner side walls of the electrothermal radiation conversion assembly head cover 029 which are equivalent to the three equal parts. By means of a charged sputtering source, E is endowed with a sweeping and / or scanning function by the adjustable magnetic field M, so that the charged sputtering source E is incident at different angles to collide and bombard the target material T and / or the powder target material Tp, thereby causing the surface of the target material T and / or the powder target material Tp to be collided and bombarded to produce microparticles of the target material T and / or the powder target material Tp to collide with a specific surface of the electrothermal conversion radiation assembly head cover 029, such as the concave side wall of the electrothermal conversion radiation assembly head cover 029 in this example. In short, the electrothermal conversion radiation assembly head cover 029 can actually be divided into multiple ways in the circumferential direction C of the columnar object, and its concave side walls are respectively subjected to the magnetron sputtering coating processing procedure.

[0055] Figure 13 (b) is a schematic cross-sectional diagram of a spatial plane P2 in the vertical axial direction of a cylindrical object of the electrothermal radiation conversion assembly head cover which is specifically tangent to ...

[0056] Figure 13 (c) A schematic cross-sectional diagram of a single electrothermal radiation conversion assembly head cover 029 of the present invention, which is optionally fully or partially covered with one or more and / or one or more layers of coating 032 with a reflective film as the main body, is taken on the plane of the plane polar coordinates and is divided into three equal parts at a specific tangent point in the vertical axial direction to the cylindrical object of the electrothermal radiation conversion assembly head cover which is sputter-coated and assembled, and is optionally fully or partially covered with one or more and / or one or more layers of coating 032 with a reflective film as the main body, clearly confirming the feasibility of the above.

[0057] Figure 13 (d) is a schematic illustration of a single electrothermal radiation conversion assembly fixing seat 028 of the present invention being specifically tangent to a columnar object of the electrothermal radiation conversion assembly fixing seat which is entirely or partially covered with one or more types of reflective films and / or one or more layers of coatings in the spatial plane P1 in the vertical axial direction, and then the columnar object is divided into three equal parts in the circumferential direction C and placed in a magnetron sputtering device to perform a magnetron sputtering coating process on the inner side walls of the electrothermal radiation conversion assembly fixing seat 028 which are equivalent to the three equal parts. By charging The sputtering source E is endowed with a sweeping or scanning function by an adjustable magnetic field, so that the charged sputtering source E is incident at different angles to collide and bombard the target material T and / or the powder target material Tp, thereby causing the surface of the target material T and / or the powder target material Tp to be collided and bombarded to produce microparticles of the target material T and / or the powder target material Tp to collide with a specific surface of the electrothermal conversion radiation assembly fixing seat 028, such as the concave side wall of the electrothermal conversion radiation assembly fixing seat 028 in this example. In short, the electrothermal conversion radiation assembly fixing seat 028 can actually be divided in a plurality of ways in the circumferential direction, and its concave side walls can be subjected to the magnetron sputtering coating processing procedure respectively.

[0058] Figure 13 (e) is a schematic cross-sectional diagram of a spatial plane P1 in the vertical axial direction of a columnar object of the electrothermal radiation conversion assembly fixing seat 028 of the present invention, which is divided into three equal parts on the plane of the polar coordinates and sputter-coated after the inner side wall of the electrothermal radiation conversion assembly fixing seat is covered with one or more and / or one or more layers of coating 031 with a reflective film as the main body as the inner side wall of the electrothermal radiation conversion assembly fixing seat as the whole or part. Herein, a concise diagram is shown, which shows that after being divided into three equal parts and sputter-coated, the inner side wall of the electrothermal radiation conversion assembly head cover as the whole or part can be formed into a nearly perfect one or more and / or one or more layers of coating 031 with a reflective film as the main body as the inner side wall of the electrothermal radiation conversion assembly fixing seat 028.

[0059] Figure 13 (f) A schematic cross-sectional view of the polar coordinate plane of the electrothermal-to-radiative assembly fixing seat of the present invention, which is divided into three equal parts and is completed by sputter coating and assembly, is given as an example of a single electrothermal-to-radiative assembly fixing seat with one or more and / or one or more layers of coatings based on a reflective film as the main body, which is optionally fully or partially covered on the inner side wall of the electrothermal-to-radiative assembly fixing seat of the present invention, clearly demonstrating the feasibility of the above-mentioned.

[0060] In summary, the magnetron sputtering coating process for the inner wall of a cylindrical hollow shell is processed by circumferentially cutting the cylindrical hollow shell to expose its originally annular closed inner wall, thereby almost perfectly overcoming the obstacles of the conventional magnetron sputtering coating technology.

[0061] Description of reference numerals:

[0062] 000: Equipped with an airtight reaction chamber using light and thermal radiation as the heating source.

[0063] 001: Electrothermal radiation conversion assembly.

[0064] 002: Light and heat radiation transmission shell.

[0065] 003: The internal space of the electrothermal radiation assembly.

[0066] 004: Electrothermal radiator.

[0067] 005: Electrothermal radiator support frame.

[0068] 006: Optionally, one or more and / or one or more layers of coatings with a reflective film as the main body covering the entire or partial light and heat radiation transmitting shell.

[0069] 007: Power pin.

[0070] 008: Optical and thermal radiation transmission shell airtight port.

[0071] 009: Photothermal radiation heating source module fixing seat.

[0072] 010: Photothermal radiation heating source module.

[0073] 011: Airtight reaction chamber.

[0074] 012: Photothermal radiation reflector on the opposite side of the photothermal radiation heating source module.

[0075] 028: Electric heat transfer radiation assembly fixing seat.

[0076] 029: Electrothermal radiation conversion assembly hood.

[0077] 030: Cooling fluid channel opening of the electrothermal radiation assembly fixing seat.

[0078] 031: Depending on the circumstances, one or more and / or one or more layers of coatings with a reflective film as the main body covering the entire or partial inner wall of the electrothermal radiation conversion assembly fixing seat.

[0079] 032: Depending on the circumstances, one or more and / or one or more layers of coatings with a reflective film as the main body covering the entire or partial inner wall of the electrothermal radiation conversion assembly head cover.

[0080] 033: The cooling fluid flows from the outside of the electrothermal radiation conversion assembly head cover into the gap between the photothermal radiation transmission shell and the electrothermal radiation conversion assembly fixing seat and then flows out from the cooling fluid channel port of the electrothermal radiation conversion assembly fixing seat.

[0081] 034: Photothermal radiation transmission window

[0082] 035: Cooling fluid flowing through the internal gap of the photothermal radiation heating source module structure.

[0083] 037: Photothermal radiation heating source module structure.

[0084] 038: Cooling fluid flowing through the outer side wall of the electrothermal radiation assembly fixing seat.

[0085] 039: The cooling fluid after the cooling fluids flowing through the internal structure of the photothermal radiation heating source module are divided and converged.

[0086] 040: Fastening elements for fastening the photothermal radiation heating source module structure and the photothermal radiation transmission window fixing seat.

[0087] 041: Fastening element to fasten the light and heat radiation transmission window fixing seat and the airtight reaction chamber.

[0088] 042: Fixing seat for light and heat radiation transmission window.

[0089] 043: Provide a sealing element that can airtightly fasten the light and heat radiation transmission window fixing seat and the airtight reaction chamber.

[0090] 045: Exhaust channel for carrier gas and / or inert gas and / or purge gas and / or cleaning gas and / or waste gas and / or suspended particulate flow.

[0091] 046: Provide a light and heat radiation transmission window fixing seat and a sealing element that can air-tightly fasten the light and heat radiation transmission window.

[0092] 047: Exhaust channel for carrier gas and / or inert gas and / or purge gas and / or cleaning gas and / or waste gas and / or suspended particulate flow and / or reaction gas.

[0093] 048: Airtight reaction chamber.

[0094] 049: Frameless motor stator.

[0095] 050: Frameless motor rotor.

[0096] 051: Bearing.

[0097] 052: Paramagnetic drive ring.

[0098] 053: Substrate support ring.

[0099] 054: substrate.

[0100] 055: Carrier gas and / or inert gas and / or purge gas and / or clean gas and / or exhaust gas and / or suspended particle flow and / or reaction gas flow field.

[0101] 056: Mapping the central axis of the incident stereoscopic light cone of a non-contact thermometer.

[0102] 057: Mapping the incident light cone boundary of a non-contact thermometer.

[0103] 058: Non-contact thermometer.

[0104] 059: Channel for introducing carrier gas and / or inert gas and / or purge gas and / or cleaning gas and / or reaction gas.

[0105] 060: Channel for introducing carrier gas and / or inert gas and / or purge gas and / or cleaning gas.

[0106] 061: Carrier gas and / or inert gas and / or purge gas and / or clean gas and / or exhaust gas and / or suspended particle flow field.

[0107] 062: Carrier gas and / or inert gas and / or purge gas and / or clean gas and / or exhaust gas and / or reaction gas and / or suspended particle flow field.

[0108] A: The axial direction of a cylindrical object.

[0109] B: Radial direction of cylindrical objects.

[0110] C: Circumferential direction of cylindrical objects.

[0111] E: Sputtering source.

[0112] M: Adjustable magnetic field.

[0113] P: The spatial plane of a cylindrical object in the vertical axial direction.

[0114] P1: A spatial plane specifically tangent to the columnar object of the electrothermal radiation conversion assembly fixing seat in the vertical axial direction, which is composed of one or more types of reflective films and / or one or more layers of coatings covering the inner side wall of the electrothermal radiation conversion assembly fixing seat in whole or in part.

[0115] P2: A spatial plane that is specifically tangent to the columnar object in the vertical axial direction of the electrothermal radiation conversion assembly head cover, which is optionally fully or partially covered with one or more types of reflective films and / or one or more layers of coatings of the electrothermal radiation conversion assembly head cover.

[0116] T: target.

[0117] Tp: powder target.

Claims

1. A device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, comprising but not limited to the following elements: One or more electrothermal radiation conversion assemblies, preferably one or more electrothermal radiation conversion assembly head covers, preferably one or more electrothermal radiation conversion assembly fixing seats, one or more photothermal radiation heating source module structures, one or more photothermal radiation transmission windows, one or more fastening elements for fastening the photothermal radiation heating source module structure and the photothermal radiation transmission window fixing seat, one or more sealing elements for providing airtight fastening between the photothermal radiation transmission window fixing seat and the photothermal radiation transmission window, photothermal radiation A heating source module fixing seat, one or more types and / or one or more layers of coatings with a reflective film as the main body that covers the entire or partial light and heat radiation transmission shell, one or more types and / or one or more layers of coatings with a reflective film as the main body that covers the entire or partial inner wall of the electrothermal conversion radiation assembly head cover, one or more types and / or one or more layers of coatings with a reflective film as the main body that covers the entire or partial inner wall of the electrothermal conversion radiation assembly fixing seat, one or more groups of cooling fluid channels and one or more types of cooling fluids.

2. Referring to claim 1, a device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, wherein: One or more electrothermal radiative assemblies, including but not limited to the following elements: One or more electrothermal radiators, one or more electrothermal radiator supports, a hollow photothermal radiation transmission shell, one or more types and / or one or more layers of coatings with a reflective film as the main body that fully or partially covers the photothermal radiation transmission shell, the internal space of the electrothermal radiator assembly and the airtight port of the photothermal radiation transmission shell.

3. Referring to claim 1, a device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, wherein: One or more electrothermal radiation conversion assembly head covers may be preferably fully or partially covered with one or more and or one or more layers of coatings with a reflective film as the main body on the inner side wall of the electrothermal radiation conversion assembly head cover, and the coating may also be mirror-finished on the originally predetermined one or more and or one or more layers of coatings with a reflective film as the main body on the inner side wall of the electrothermal radiation conversion assembly head cover to replace part of the reflective film.

4. Referring to claim 1, a device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, wherein: Optionally, one or more and / or one or more layers of coatings with a reflective film as the main body covering the entire or partial light and heat radiation transmission shell, one or more and / or one or more layers of coatings with a reflective film as the main body covering the entire or partial inner wall of the electrothermal conversion radiation assembly head cover, one or more and / or one or more layers of coatings with a reflective film as the main body covering the entire or partial inner wall of the electrothermal conversion radiation assembly fixing seat, the aforementioned one or more coatings may also be mirror-finished on the originally predetermined one or more and / or one or more layers of coatings with a reflective film as the main body of the preferred electrothermal conversion radiation assembly head cover to replace part of the reflective film therein.

5. Referring to claim 1, a device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, wherein: One or more electrothermal conversion radiation assembly fixing seats may be preferred, and / or one or more electrothermal conversion radiation assembly head covers may be preferred, and / or one or more photothermal radiation heating source module structures may be preferably integrated into the same element as needed.

6. Referring to claim 1, a device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, wherein: The one or more cooling fluids may be one or more liquids or gases as needed.

7. Referring to claim 2, a device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, wherein: The hollow photothermal radiation transmitting shell of one or more electrothermal radiation conversion assemblies can be preferably approximately spherical, approximately ellipsoidal, approximately cylindrical, or a composite shape of one or more of the above shapes as needed.

8. Referring to claim 4, a device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, wherein: Depending on the circumstances, one or more and / or one or more layers of coatings with a reflective film as the main body may fully or partially cover the light and heat radiation transmission shell, one or more and / or one or more layers of coatings with a reflective film as the main body may fully or partially cover the inner wall of the electrothermal conversion radiation assembly head cover, and one or more and / or one or more layers of coatings with a reflective film as the main body may fully or partially cover the inner wall of the electrothermal conversion radiation assembly fixing seat, and the reflective film layer of the aforementioned one or more coatings may be coated by physical vapor deposition and / or magnetron sputtering and / or magnetron powder sputtering.

9. Referring to claim 5, a device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, wherein: One or more electrothermal conversion radiation assembly fixing seats may be preferred, and / or one or more electrothermal conversion radiation assembly head covers may be preferred, and / or one or more photothermal radiation heating source module structures may be preferred, and / or the aforementioned one or more elements may be integrated into the same element as needed, and the material thereof may preferably be a dielectric material.

10. Referring to claim 5, a device for optimizing the photothermal radiation power density of a photothermal radiation heating source module, wherein: One or more preferably electrothermal conversion radiation assembly fixing seats, and / or one or more preferably electrothermal conversion radiation assembly head covers, and / or one or more photothermal radiation heating source module structures can be preferably integrated into the aforementioned multiple types of one or more elements as the same element as needed, which is a 360-degree annular circumferential curved surface surrounded by an axially perpendicular spatial plane, and is divided into multiple blocks by radial straight lines and / or broken lines and / or curves. One or more preferably electrothermal conversion radiation assembly fixing seats, and / or one or more preferably electrothermal conversion radiation assembly head covers, and / or one or more photothermal radiation heating source module structures, and / or can be preferably integrated into the aforementioned multiple types of one or more elements as the same element as needed to perform physical vapor deposition coating and / or magnetron sputtering coating and / or magnetron powder sputtering coating.

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