Method and system for detecting clamping state of substrate

Abstract

The invention relates to the field of semiconductor manufacturing, and provides a substrate clamping state detection method and system, and the method comprises the steps: a master station transmits a set value to a slave station; after the main station confirms that the substrate reaches the bearing table, the clamping assembly is controlled to clamp the outer edge of the substrate; in each acquisition period, the slave station acquires an acquisition value output by an analog quantity sensing module located at the outer edge of the substrate through N parallel channels; the slave station transmits the acquired value to the master station; the slave station compares the collected value with a set value based on a specified judgment method to obtain a judgment result; when the judgment result is not the over-clamping state and the fragment state, the slave station continues to execute the next collection period; when the judgment result is the over-clamping state or the fragment state, the clamping assembly is controlled to reset after a preset time period; the master station obtains the judgment result and calculates the difference value between the collection value and the set value; controlling the rotating speed of the bearing platform or updating the set value according to the difference value. The method is used for improving the data acquisition and processing speed when the clamping state of the substrate is detected.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a method and system for detecting a substrate clamping state. Background Art

[0002] Related art methods that use analog position sensors to detect the substrate clamping status rely on PLCs for data acquisition, typically requiring at least 50 microseconds per acquisition cycle. Due to the difficulty of data processing, additional hardware equipment is often required, limiting the speed of data acquisition and processing. Monitoring and feedback on the substrate clamping status are slow. Without effective and real-time monitoring of the substrate status, continued processing despite substrate anomalies can ultimately lead to more severe contamination or damage to the system, potentially rendering the entire system unusable.

[0003] Therefore, a method and system for detecting the clamping state of a substrate are urgently needed to improve the above-mentioned problem. Summary of the Invention

[0004] The object of the present invention is to provide a method and system for detecting the clamping state of a substrate, wherein the method is used to improve the data acquisition and processing speed when detecting the clamping state of a substrate.

[0005] According to a first aspect of an embodiment of the present application, a method for detecting a clamping state of a substrate is provided, comprising: a master station transmitting a set value to a slave station; the set value is used to determine whether a currently acquired clamping state of the substrate is an over-clamping state or a fragmented state; after the master station confirms that the substrate has reached a carrier, controlling the clamping assembly to clamp the outer edge of the substrate; in each acquisition cycle, the slave station acquires an acquisition value output by an analog sensor module located at the outer edge of the substrate through N parallel channels, where N is a positive integer; the slave station transmits the acquisition value to the master station; the slave station compares the acquisition value with the set value based on a specified determination method to obtain a determination result; if the determination result is neither an over-clamping state nor a fragmented state, the slave station proceeds to the next acquisition cycle; if the determination result is an over-clamping state or a fragmented state, controlling the clamping assembly to reset after a preset period of time; the master station acquires the determination result, and when the determination result is an over-clamping state or a fragmented state, controlling the carrier to stop rotating; calculating a difference between the acquisition value and the set value; and controlling the rotation speed of the carrier or updating the set value based on the difference.

[0006] In one embodiment, the master station is configured as a programmable logic controller (PLC); the slave station is configured as a microcontroller unit (MCU); the programmable logic controller and the microcontroller unit perform bidirectional data exchange through a slave station control chip.

[0007] In one embodiment, the slave control chip outputs an interrupt signal each time, so that the slave completes a data exchange with the slave control chip via the serial peripheral interface. The interrupt frequency of the interrupt signal is set by the master station.

[0008] In one embodiment, the set value is set as the output voltage threshold of the analog sensor module; the determination method is set as a determination function, the input value of the determination function is the acquisition value, and the output value of the determination function is the determination result.

[0009] In one embodiment, the judgment method is configured such that when the input is a collection value greater than or equal to the set value, the output judgment result is an over-clamping state or a fragmented state, and when the input is a collection value less than the set value, the output judgment result is neither an over-clamping state nor a fragmented state; or the judgment method is configured such that when the input is a collection value greater than or equal to the set value, the output judgment result is neither an over-clamping state nor a fragmented state, and when the input is a collection value less than the set value, the output judgment result is an over-clamping state or a fragmented state.

[0010] In one embodiment, the slave station obtains the collected value output by the analog sensor module through analog-to-digital conversion; the slave station obtains the set value and the determination method through direct memory access.

[0011] In one embodiment, the analog sensing module includes N sensors; in each acquisition cycle, the N sensors are used to output the corresponding acquisition values; when the output channels of the N sensors and the determination method are in a solidified state, the master station only transmits the set value to the slave station; when the output channels of the N sensors and the determination method are released from the solidified state, the master station transmits the set value and the determination method to the slave station.

[0012] In one embodiment, after each acquisition cycle, the acquired value is further subjected to filtering processing; the acquisition cycle is set to a range of 20 to 50 microseconds.

[0013] According to a second aspect of an embodiment of the present application, a system for detecting the clamping state of a substrate is provided, which is used for the method described in any one of the first aspects, including: a carrier for carrying a substrate; the carrier connected to a clamping assembly; the clamping assembly for clamping the outer edge of the substrate; an analog sensing module arranged around the outer edge of the substrate for detecting the analog quantity of N acquisition points at the outer edge of the substrate to obtain an acquisition value, where N is a positive integer; a slave station for analog data acquisition and processing; in each acquisition cycle, the slave station is also used to obtain the acquisition value output by the analog sensing module through N parallel channels, and the slave station is also used to transmit the acquisition value to the master station; the slave station is also used to compare the acquisition value with the set value based on a specified judgment method to obtain a judgment result; the judgment result is not an over-clamping state. When the substrate is in the over-clamped state and not in the fragmented state, the slave station is used to continue to execute the next acquisition cycle; when the judgment result is the over-clamped state or the fragmented state, the clamping component is controlled to reset after a preset period of time; the master station is used to control the clamping component to clamp the outer edge of the substrate after confirming that the substrate has arrived at the carrier; it is also used to pass the set value to the slave station; the set value is used to judge whether the currently acquired substrate clamping state is the over-clamped state or the fragmented state; the master station is used to obtain the judgment result, and when the judgment result is the over-clamped state or the fragmented state, the carrier is controlled to stop rotating; the difference between the acquisition value and the set value is calculated; the rotation speed of the carrier is controlled or the set value is updated according to the difference.

[0014] In one embodiment, the analog sensing module is electrically connected to the slave station; the slave station integrates an analog-to-digital conversion module and a storage module; the analog-to-digital conversion module is used to convert the analog quantity into a digital quantity acquisition value; the storage module is used to store the acquisition value; and the slave station is used to directly access the acquisition value in the storage module.

[0015] In one embodiment, the master station is configured as a programmable logic controller; the slave station is configured as a microcontroller; the programmable logic controller and the microcontroller are commonly connected to a slave station control chip, and the slave station control chip is used for bidirectional data interaction between the programmable logic controller and the microcontroller.

[0016] In one embodiment, the analog quantity sensing module includes a Hall sensor or a position sensor.

[0017] Compared to existing technologies, the present invention offers the advantage of faster data acquisition and processing speeds, achieved by transmitting collected values ​​through parallel channels and resetting the clamping assembly after a preset period. This enables the system to accurately monitor and provide feedback on the substrate clamping status in a shorter time, improving substrate processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The figure is a flow chart showing a method for detecting a substrate clamping state according to an exemplary embodiment.

[0019] Figure 2 is a wireframe diagram of a system for detecting a substrate clamping state according to an exemplary embodiment.

[0020] Figure 3 FIG1 is a top view of a clamping assembly clamping a substrate according to an exemplary embodiment.

[0021] Figure 4 FIG. 1 is a side view showing a clamping assembly clamping a substrate according to an exemplary embodiment.

[0022] Figure 5 FIG1 is a side view of a clamping assembly in an over-clamping state according to another exemplary embodiment.

[0023] Description of reference numerals in the figures: 2. Substrate; 3. Clamping assembly; 4. Carrying platform; 11. Analog sensor module; 12. Slave station; 121. First microcontroller unit; 122. Second microcontroller unit; 13. Slave station control chip; 14. Master station; 15. Slave station storage chip. DETAILED DESCRIPTION

[0024] Unless otherwise defined, the technical terms or scientific terms used in this specification shall have the ordinary meanings understood by persons having ordinary skills in the technical field to which the present invention belongs. The specific embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be noted that in the specific description of these embodiments, for the sake of a concise description, this specification cannot provide a detailed description of all the features of the actual embodiments. Without departing from the spirit and scope of the present invention, those skilled in the art may modify and replace the embodiments of the present invention, and the resulting embodiments are also within the scope of protection of the present invention.

[0025] like Figure 1As shown, the first embodiment of the present application provides a method for detecting the clamping state of a substrate, comprising: a master station transmits a set value to a slave station; the set value is used to determine whether the currently acquired clamping state of the substrate is an over-clamping state or a fragmented state; after the master station confirms that the substrate has reached the carrier, the clamping assembly is controlled to clamp the outer edge of the substrate; in each acquisition cycle, the slave station obtains the acquisition value output by the analog sensor module located at the outer edge of the substrate through N parallel channels, where N is a positive integer; the slave station transmits the acquisition value to the master station; the slave station compares the acquisition value with the set value based on a specified determination method to obtain a determination result; when the determination result is neither an over-clamping state nor a fragmented state, the slave station continues to execute the next acquisition cycle; when the determination result is an over-clamping state or a fragmented state, the clamping assembly is controlled to reset after a preset period of time; the master station obtains the determination result, and when the determination result is an over-clamping state or a fragmented state, the carrier stops rotating; calculates the difference between the acquisition value and the set value; and controls the rotation speed of the carrier or updates the set value according to the difference.

[0026] In one implementation, within the same collection cycle, the number of the collection values ​​acquired by the master station is n, where n is an integer less than or equal to N.

[0027] In some specific embodiments, N is set to 8, and the collection values ​​of the 8 parallel channels correspond to the same judgment results by default. In other specific embodiments, when there are differences in the collection values ​​of the 8 parallel channels, the judgment results are unified as over-clamping state or fragmentation state. The over-clamping state refers to the tilting or sliding state caused by abnormal clamping mechanism, debugging teaching deviation, and abnormal manipulator during the substrate processing process. The over-clamping state will affect the quality of the substrate and the subsequent process steps. The fragmentation state refers to the situation in which the substrate is cracked or broken due to improper clamping, excessive mechanical stress or other reasons during the substrate processing process. The fragmentation state not only affects the quality of the current process step, but also causes equipment damage and other safety hazards.

[0028] It is worth noting that this embodiment achieves faster data acquisition and processing speeds by transmitting collected values ​​through parallel channels and resetting the clamping assembly after a preset period of time. This enables the system to accurately monitor and provide feedback on the substrate clamping status in a shorter time, which helps improve substrate processing efficiency.

[0029] In one embodiment, when the carrier plate is in a specific position, the difference between the collected value and the judgment value can be determined to determine whether it is reasonable, thereby preventing risks in advance. In some examples, when the difference exceeds a threshold, the carrier plate's rotation speed is controlled to decrease to prevent debris from flying off the carrier plate and causing safety issues.

[0030] In other examples, when the speed of the carrier is lower than the first speed, the collected value is assumed to be undistorted, and the master station generates a reasonable set value based on the collected value. This example can reduce the difficulty of system assembly and adjustment and reduce the requirements for mechanical structure consistency.

[0031] In some further examples, when the speed of the carrier platform exceeds a second speed, which is higher than the first speed, it is assumed that the collected values ​​are distorted, and that the time interval between the collected values ​​obtained by the master station is greater than the time interval between the collected values ​​obtained by the slave station. The master station fits the collected values ​​to obtain a periodically varying waveform. If the collected values ​​obtained by the master station do not conform to the waveform, the carrier platform's rotation speed is controlled to decrease to prevent debris from flying off the carrier platform and causing safety issues.

[0032] In one embodiment, the master station is configured as a programmable logic controller; the slave station is configured as a micro control unit; the programmable logic controller and the micro control unit perform bidirectional data exchange via a slave station control chip.

[0033] In some other specific embodiments, the master station is configured as a master station of an industrial Ethernet, including Ethernet for Control Automation Technology (EtherCAT). The slave station control chip is configured as an industrial automation Ethernet slave station control chip (EtherCAT Slave Controller, ESC).

[0034] It is worth noting that, in other embodiments, the slave station can implement data interaction with the master station through other bus technologies such as Profinet, ModbusTcp, EthernetIP, Profibus and other protocols.

[0035] In one embodiment, the slave control chip outputs an interrupt signal each time, causing the slave to complete a data exchange with the slave control chip via a serial peripheral interface (SPI). The interrupt frequency of the interrupt signal is set by the master.

[0036] In some examples, the product of the interrupt frequency and the acquisition period is M, where M is a positive integer. In some specific embodiments, M is 1, meaning that the slave control chip outputs an interrupt signal once after each acquisition period. In this example, an interrupt is triggered immediately after each acquisition period, ensuring timely data transmission and processing, and enabling real-time detection of substrates in high-speed motion.

[0037] In some embodiments, a timer interrupt mechanism is used to control the interrupt frequency and the sampling period to ensure that each channel can accurately collect the sampled value at 20 kHz.

[0038] In one embodiment, the set value is set as the output voltage threshold of the analog sensor module; the determination method is set as a determination function, the input value of the determination function is the acquisition value, and the output value of the determination function is the determination result.

[0039] In some specific embodiments, the judgment method is configured such that when the input is a collection value greater than or equal to the set value, the output judgment result is an over-clamping state or a fragmented state; and when the input is a collection value less than the set value, the output judgment result is neither an over-clamping state nor a fragmented state.

[0040] In other specific embodiments, the judgment method is configured such that when the input is a collection value greater than or equal to the set value, the output judgment result is neither an over-clamping state nor a fragmented state; and when the input is a collection value less than the set value, the output judgment result is an over-clamping state or a fragmented state.

[0041] In some further specific embodiments, after each acquisition cycle, the acquired values ​​are further subjected to filtering processing; and the range of the acquisition cycle is set to be 20 to 50 microseconds.

[0042] In some examples, the method for filtering the collected values ​​is averaging filtering, and the collection period is set to 20 microseconds. In other examples, the collection period is set to 50 microseconds. In still other examples, the collection period is set to 35 microseconds.

[0043] In some further specific embodiments, the filtered collected value ActValue is compared with the set value SetValue, and a determination result Trig is given in combination with the determination method Dir, as shown in the following table.

[0044]

[0045] The two columns on the left represent the set values ​​and judgment methods transmitted from the PLC to the MCU, while the two columns on the right represent the collected values ​​and judgment results transmitted from the MCU to the PLC. The judgment method in rows 3 and 4 of the table is True. When the collected value is less than the set value, the judgment result is False, indicating that the device is neither over-clamped nor fragmented. When the collected value is greater than the set value, the judgment result is True, indicating that the device is either over-clamped or fragmented.

[0046] The judgment method for rows 5 and 6 in the table is False. When the collected value is less than the set value, the judgment result is True, indicating an over-clamping state or a fragmented state; when the collected value is greater than the set value, the judgment result is False, indicating neither an over-clamping state nor a fragmented state.

[0047] In one embodiment, the slave station acquires the value output by the analog sensor module through analog-to-digital conversion; the slave station also acquires the set value and the determination method through direct memory access (DMA). This arrangement improves data acquisition efficiency. Using DMA reduces the number of interrupts triggered by data transmission, further reducing system overhead and improving system stability and reliability.

[0048] In one embodiment, the analog sensing module includes N sensors; during each acquisition cycle, the N sensors are configured to output corresponding acquired values. When the output channels of the N sensors and the determination method are fixed, the master station only transmits the set value to the slave station. In this embodiment, when the output channels of the N sensors and the determination method are fixed, the system configuration is fixed, and the master station only needs to transmit the set value to the slave station. This approach simplifies the communication process and reduces the amount of data transmitted.

[0049] When the N sensor output channels and the determination method are unfixed, the master station transmits the set values ​​and determination method to the slave stations. This approach provides greater flexibility, allowing the determination logic to be dynamically adjusted according to different application scenarios and adapt to changing working environments.

[0050] like Figure 2As shown, the second embodiment provides a detection system for the clamping state of the substrate 2, which is used for the method described in any one of the above embodiments, including: a carrier 4 for carrying the substrate 2; the carrier 4 is connected to a clamping component 3; the clamping component 3 is used to clamp the outer edge of the substrate 2; an analog sensor module 11 is arranged around the outer edge of the substrate 2, and is used to detect the analog quantity of N collection points at the outer edge of the substrate 2 to obtain a collection value, where N is a positive integer; a slave station 12 is used for analog data collection and processing; in each collection cycle, the slave station 12 is also used to obtain the collection value output by the analog sensor module 11 through N parallel channels, and the slave station 12 is also used to transmit the collection value to the master station 14; the slave station 12 is also used to compare the collection value with the set value based on a specified judgment method to obtain a judgment result; the judgment result is not When it is in the over-clamping state and not in the fragmented state, the slave station 12 is used to continue to execute the next acquisition cycle; when the judgment result is the over-clamping state or the fragmented state, the clamping component 3 is controlled to reset after a preset period of time; the master station 14 is used to control the clamping component 3 to clamp the outer edge of the substrate 2 after confirming that the substrate 2 reaches the carrier 4, and is also used to pass the set value to the slave station 12; the set value is used to determine whether the clamping state of the currently collected substrate 2 is the over-clamping state or the fragmented state; the master station 14 is used to obtain the judgment result, and when the judgment result is the over-clamping state or the fragmented state, the carrier is controlled to stop rotating; the difference between the acquisition value and the set value is calculated; the rotation speed of the carrier is controlled or the set value is updated according to the difference.

[0051] like Figure 3 As shown, in some examples, the clamping assembly 3 includes at least three clamping pins or claws. The carrier 4 is connected to a spindle motor (not shown); the spindle motor is electrically connected to the slave station 12. Based on instructions from the slave station 12, the spindle motor drives the carrier 4, the clamping assembly 3, and the substrate 2 to rotate relative to the analog sensor module 11. The maximum speed of the spindle motor is 2500 RPM. The pulse width of the signal output by the analog sensor module 11 is 3° / R, and the required sampling frequency is at least 10 kHz.

[0052] In one embodiment, the analog sensing module 11 is electrically connected to the slave station 12; the slave station 12 is integrated with an analog-to-digital conversion module and a storage module; the analog-to-digital conversion module is used to convert the analog quantity into a digital quantity acquisition value; the storage module is used to store the acquisition value; the slave station 12 is used to directly access the acquisition value in the storage module.

[0053] In some specific embodiments, the analog-to-digital conversion module is configured as an analog-to-digital converter (ADC); and the storage module is configured as a memory.

[0054] In one embodiment, the master station 14 is configured as a programmable logic controller; the slave station 12 is configured as a microcontroller; the programmable logic controller and the microcontroller are commonly connected to a slave station control chip 13, and the slave station control chip 13 is used for bidirectional data interaction between the programmable logic controller and the microcontroller.

[0055] In some specific embodiments, the slave station 12 is configured as one micro control unit. In other specific embodiments, the slave station 12 is configured as two micro control units, including a first micro control unit 121 and a second micro control unit 122 electrically connected to each other.

[0056] like Figure 2 、 Figure 4 and Figure 5 As shown, the first microcontroller unit 121 is electrically connected to the analog quantity sensing module 11, and is used to control the clamping assembly 3 to clamp the outer edge of the substrate 2 after confirming that the substrate 2 has reached the carrier 4; in each acquisition cycle, the first microcontroller unit 121 is also used to obtain the acquisition value output by the analog quantity sensing module 11 through N parallel channels, and the first microcontroller unit 121 is also used to transmit the acquisition value to the main station 14; the first microcontroller unit 121 is also used to compare the acquisition value with the set value based on a specified judgment method to obtain a judgment result; when the judgment result is not an over-clamping state and not a fragmented state, the first microcontroller unit 121 is used to continue to execute the next acquisition cycle; when the judgment result is an over-clamping state or a fragmented state, the first microcontroller unit 121 is used to control the clamping assembly 3 to reset after a preset period of time.

[0057] The second micro control unit 122 is electrically connected to the slave station control chip 13 and is configured to transmit the determination result and the collected value to the master station 14 within the preset period.

[0058] In one embodiment, the slave control chip 13 is electrically connected to a slave storage chip 15. In some examples, the slave storage chip 15 is configured as an Electrically Erasable Programmable Read-Only Memory (EEPROM). The slave control chip 13 accesses the EEPROM via an Inter-Integrated Circuit (IIC) protocol.

[0059] In one embodiment, the analog sensing module 11 includes at least one of a Hall sensor, a position sensor, and an image sensor.

[0060] In some specific embodiments, the analog sensing module 11 is configured as a Hall sensor. In other specific embodiments, the analog sensing module 11 is configured as a position sensor. In still other specific embodiments, the analog sensing module 11 is configured as an image sensor. In still other specific embodiments, the analog sensing module 11 includes a Hall sensor or a position sensor.

[0061] In one embodiment, the substrate 2 is configured as a wafer. In another embodiment, the substrate 2 is configured as any high-speed rotating circular object, such as hard disk platters, centrifuge rotors, turbine blade test models, or cutting and grinding tools.

[0062] The master station 14 includes a memory and a processor. It should be noted that the processor in this embodiment can be an integrated circuit chip. During implementation, the steps of the above-described method embodiment can be completed by hardware integrated logic circuits within the processor or by software instructions. The processor can be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic device. The methods, steps, and logic block diagrams disclosed in this embodiment can be implemented or executed. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this embodiment can be directly implemented and executed by a hardware decoding processor or by a combination of hardware and software modules within the decoding processor. The software modules can be located in a storage medium well-known in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, or registers. The storage medium is located in the memory, and the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the above-described method.

[0063] It is understood that the memory in this embodiment may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. The non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate synchronous DRAM (DDR SDRAM), enhanced synchronous DRAM (ESDRAM), synchronous link DRAM (SLDRAM), and direct RAM bus RAM (DR RAM). It should be noted that the memory of the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0064] In the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more, unless otherwise clearly defined.

[0065] The above description of the embodiments is intended to facilitate understanding and application of the present application by those skilled in the art. It will be apparent that those skilled in the art can readily make various modifications to these embodiments and apply the general principles described herein to other embodiments without inventive effort. Therefore, the present application is not limited to the embodiments described herein, and improvements and modifications made by those skilled in the art based on the disclosure of this application without departing from the scope and spirit of this application are within the scope of this application.

Claims

1. A method for detecting a substrate clamping state, characterized in that: include: The master station transmits the set value to the slave station; the set value is used to determine whether the currently acquired substrate clamping state is an over-clamping state or a fragmented state; After the master station confirms that the substrate has arrived at the carrier platform, it controls the clamping assembly to clamp the outer edge of the substrate; in each acquisition cycle, the slave station obtains the acquisition value output by the analog sensor module located at the outer edge of the substrate through N parallel channels, where N is a positive integer; The slave station transmits the collected value to the master station; The slave station compares the collected value with the set value based on a specified determination method to obtain a determination result; When the determination result is neither an over-clamping state nor a fragmentation state, the slave station continues to execute the next acquisition cycle; When the determination result is an over-clamping state or a fragmented state, controlling the clamping assembly to reset after a preset period of time; The main station obtains the determination result, and when the determination result is an over-clamping state or a fragmented state, controls the supporting platform to stop rotating; Calculate the difference between the collected value and the set value; and control the rotation speed of the support platform or update the set value according to the difference.

2. The method according to claim 1, characterized in that The master station is configured as a programmable logic controller (PLC); the slave station is configured as a microcontroller (MCU); and the programmable logic controller and the MCU perform bidirectional data exchange via a slave station control chip.

3. The method according to claim 2, characterized in that The slave control chip outputs an interrupt signal each time, so that the slave completes a data exchange with the slave control chip via the serial peripheral interface. The interrupt frequency of the interrupt signal is set by the master station.

4. The method according to claim 1, wherein The set value is set as the output voltage threshold of the analog sensor module; the determination method is set as a determination function, the input value of the determination function is the acquisition value, and the output value of the determination function is the determination result.

5. The method according to claim 1, wherein The determination method is configured to output a determination result of an over-clamping state or a fragmented state when the input is a collection value greater than or equal to the set value, and output a determination result of neither an over-clamping state nor a fragmented state when the input is a collection value less than the set value; Or the judgment method is set to when the input is greater than or equal to the collection value of the set value, the output judgment result is not an over-clamping state and not a fragmented state, and when the input is less than the collection value of the set value, the output judgment result is an over-clamping state or a fragmented state.

6. The method according to claim 1, characterized in that The slave station obtains the collected value output by the analog sensor module through analog-to-digital conversion; The slave station obtains the set value and the determination method by direct memory access.

7. The method according to claim 1, characterized in that The analog sensing module includes N sensors; in each acquisition cycle, the N sensors are used to output the acquired values ​​accordingly; When the output channels of the N sensors and the determination method are in a solidified state, the master station only transmits the set value to the slave station; When the output channels of the N sensors and the determination method are released from the fixed state, the master station transmits the set value and the determination method to the slave station.

8. The method according to claim 1, characterized in that After each acquisition cycle, the acquisition value is filtered; the range of the acquisition cycle is set to 20 to 50 microseconds.

9. A substrate clamping state detection system, used in the method according to any one of claims 1 to 8, characterized in that: include: A carrying platform for carrying a substrate; the carrying platform is connected to a clamping assembly; The clamping assembly is used to clamp the outer edge of the substrate; an analog quantity sensing module, arranged around the outer edge of the substrate, for detecting analog quantities at N collection points at the outer edge of the substrate to obtain collection values, where N is a positive integer; Slave station, used for analog data acquisition and processing; In each acquisition cycle, the slave station is further used to obtain the acquired value output by the analog sensing module through N parallel channels, and the slave station is further used to transmit the acquired value to the master station; The slave station is further configured to compare the collected value with the set value based on a specified determination method to obtain a determination result; When the determination result is neither an over-clamping state nor a fragmentation state, the slave station is used to continue to execute the next acquisition cycle; when the determination result is an over-clamping state or a fragmentation state, the clamping assembly is controlled to reset after a preset period of time; The master station is configured to control the clamping assembly to clamp the outer edge of the substrate after confirming that the substrate has arrived at the carrier, and is also configured to transmit a set value to the slave station; the set value is used to determine whether the currently acquired substrate clamping state is an over-clamped state or a fragmented state; the master station is configured to obtain the determination result, and when the determination result is an over-clamped state or a fragmented state, control the carrier to stop rotating; Calculate the difference between the collected value and the set value; and control the rotation speed of the support platform or update the set value according to the difference.

10. The system according to claim 9, characterized in that The analog sensing module is electrically connected to the slave station; The slave station is integrated with an analog-to-digital conversion module and a storage module; The analog-to-digital conversion module is used to convert the analog quantity into a digital quantity acquisition value; the storage module is used to store the acquisition value; and the slave station is used to directly access the acquisition value in the storage module.

11. The system according to claim 9, wherein: The master station is configured as a programmable logic controller; the slave station is configured as a micro control unit; The programmable logic controller and the micro control unit are commonly connected to a slave control chip, and the slave control chip is used for bidirectional data interaction between the programmable logic controller and the micro control unit.

12. The system according to claim 9, wherein: The analog quantity sensing module includes a Hall sensor or a position sensor.

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