Phased array antenna system and preparation method thereof

Abstract

The invention discloses a phased array antenna system and a preparation method thereof, which can be applied to the technical field of communication, and the system comprises a quasi-electrostatic modulation layer, a first structure network layer, an adaptive feed system, a radio frequency front end module and a system support module. Wherein the input end of the self-adaptive feed system is connected with the output end of the system support module; the output end of the self-adaptive feed system is connected with the quasi-electrostatic modulation layer and the radio frequency front-end module respectively; the quasi-electrostatic modulation layer is connected with the first structure network layer and is used for correspondingly adjusting the surface impedance of the phased array antenna system according to the voltage control signal; the first structure network is used for modulating the radiation performance and isolation of the phased array antenna; and the radio frequency front-end module is used for sending a corresponding radio frequency signal to the antenna unit according to the beam control signal. Therefore, the charge distribution on the surface of the antenna is dynamically adjusted based on the quasi-electrostatic modulation layer, beamforming is realized, and the adaptability of the phased array antenna system is improved.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a phased array antenna system and a preparation method thereof. Background Art

[0002] A phased array antenna is an antenna system that electronically controls the direction of the electromagnetic beam without physically rotating the antenna itself.

[0003] Existing phased array antenna systems usually use static modulation methods in antenna modulation technology, which makes it difficult to meet the requirements of dynamic frequency band switching and beam control in 5G communications, resulting in poor adaptability of existing phased array antenna systems.

[0004] Therefore, how to improve the adaptability of the phased array antenna system is an issue that those skilled in the art urgently need to solve. Summary of the Invention

[0005] Based on the above problems, the present application provides a phased array antenna system and a preparation method thereof, which dynamically adjusts the charge distribution on the antenna surface based on a quasi-electrostatic modulation layer to achieve beamforming and improve the adaptability of the phased array antenna system.

[0006] In a first aspect, an embodiment of the present application provides a phased array antenna system, comprising: a quasi-electrostatic modulation layer, a first structural network layer, an adaptive feeding system, a radio frequency front-end module, and a system support module;

[0007] The input end of the adaptive feeding system is connected to the output end of the system support module for receiving environmental sensing data;

[0008] The output end of the adaptive feeding system is connected to the quasi-electrostatic modulation layer and the RF front-end module respectively, and is used to feed back a corresponding voltage control signal to the quasi-electrostatic modulation layer and feed back a corresponding beam control signal to the RF front-end module;

[0009] The quasi-electrostatic modulation layer is connected to the first structural network layer and is used to adjust the surface impedance of the phased array antenna system according to the voltage control signal;

[0010] The first structural network is used to modulate the radiation performance and isolation of the phased array antenna;

[0011] The radio frequency front-end module is used to send a corresponding radio frequency signal to the antenna unit according to the beam control signal.

[0012] Optionally, the first structural network layer includes: a composite resonant structure and a distributed decoupling network;

[0013] The composite resonant structure and the distributed decoupling network are sequentially connected to the quasi-static modulation layer;

[0014] The composite resonant structure is used to modulate the radiation performance of the phased array antenna;

[0015] The distributed decoupling network is used to modulate the isolation of the phased array antenna.

[0016] Optionally, the system support module includes: an environmental perception sensor;

[0017] The environmental perception sensor is used to perceive the signal strength and signal direction of the surrounding environment, form environmental perception data and send it to the adaptive feeding system.

[0018] Optionally, the system support module further includes: a power management unit;

[0019] The power management unit is used to supply power to the RF front-end module, the adaptive feeding system and the environmental perception sensor.

[0020] Optionally, the phased array antenna system further includes: an antenna substrate unit;

[0021] The antenna substrate unit is used to provide physical support for the quasi-electrostatic modulation layer and the first structural network layer.

[0022] In a second aspect, an embodiment of the present application provides a method for preparing a phased array antenna system, comprising:

[0023] providing a first substrate, a second substrate, and a third substrate;

[0024] forming a quasi-electrostatic modulation layer on the first substrate to obtain a first structure;

[0025] forming a first structure network layer on the second substrate to obtain a second structure;

[0026] forming an adaptive feeding system on the third substrate to obtain a third structure;

[0027] Based on the first structure, the second structure and the third structure, the quasi-electrostatic modulation layer, the first structure network layer, the adaptive feeding system, the RF front-end module and the system support module are integrated to obtain a phased array antenna system.

[0028] Optionally, forming a quasi-electrostatic modulation layer on the first substrate includes:

[0029] Depositing a TCO thin film on the first substrate based on a deposition process or a magnetron sputtering process;

[0030] Filling a liquid crystal material between the first substrate and the TCO film, and connecting a bias voltage source integrated with a control circuit to the TCO film to form a quasi-electrostatic modulation layer;

[0031] The bias voltage source applies a bias voltage of 0-30V; the first substrate is a glass or plastic substrate.

[0032] Optionally, the deposition process requires a deposition temperature between room temperature and 300° C.;

[0033] The magnetron sputtering process requires a vacuum degree of 10 -4 Pa.

[0034] Optionally, the first structural network layer includes: a composite resonant structure and a distributed decoupling network;

[0035] The forming of the first structural network layer on the second substrate comprises:

[0036] Etching a gradient groove line and an asymmetric dipole composite structure on the second substrate;

[0037] integrating a periodic electromagnetic bandgap structure on the second substrate;

[0038] The etched gradient slot line, the asymmetric dipole composite structure and the electromagnetic bandgap structure are stacked in multiple layers based on a lamination process to form a composite resonant structure;

[0039] etching a defective structure on the second substrate;

[0040] etching a resonant isolator on the second substrate;

[0041] The defective ground structure, the resonant isolator and the electromagnetic coupling structure are stacked in multiple layers based on the lamination process to form a distributed decoupling network.

[0042] Optionally, the lamination process requires a process temperature between 150-200° C. and a pressure between 1-5 MPa.

[0043] It can be seen from the above technical solutions that compared with the existing technology, this application has the following advantages:

[0044] The phased array antenna system provided by the present application includes: a quasi-electrostatic modulation layer, a first structural network layer, an adaptive feeding system, a radio frequency front-end module, and a system support module. Among them, the input end of the adaptive feeding system is connected to the output end of the system support module for receiving environmental perception data; the output end of the adaptive feeding system is respectively connected to the quasi-electrostatic modulation layer and the radio frequency front-end module for feeding back the corresponding voltage control signal to the quasi-electrostatic modulation layer and the corresponding beam control signal to the radio frequency front-end module; the quasi-electrostatic modulation layer is connected to the first structural network layer for adjusting the surface impedance of the phased array antenna system according to the voltage control signal; the first structural network is used to modulate the radiation performance and isolation of the phased array antenna; the radio frequency front-end module is used to send the corresponding radio frequency signal to the antenna unit according to the beam control signal. In this way, the surface charge distribution of the antenna is dynamically adjusted based on the quasi-electrostatic modulation layer to achieve beamforming, thereby improving the adaptability of the phased array antenna system. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic diagram of the connection relationship of a phased array antenna system provided in an embodiment of the present application;

[0046] Figure 2 A schematic diagram of a first structural network layer provided in an embodiment of the present application;

[0047] Figure 3 A schematic diagram of a system support module provided in an embodiment of the present application;

[0048] Figure 4 A flowchart of a method for preparing a phased array antenna system provided in an embodiment of the present application;

[0049] Figure 5 A schematic structural diagram of a phased array antenna system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0050] As mentioned above, existing phased array antenna systems suffer from poor adaptability. Specifically, they typically use static modulation, which makes it difficult to meet the dynamic frequency switching and beam steering requirements of 5G communications. This, in turn, leads to poor adaptability.

[0051] In order to solve the above problems, the present application provides a phased array antenna system, including: a quasi-electrostatic modulation layer, a first structural network layer, an adaptive feeding system, a radio frequency front-end module, and a system support module. Among them, the input end of the adaptive feeding system is connected to the output end of the system support module for receiving environmental perception data; the output end of the adaptive feeding system is respectively connected to the quasi-electrostatic modulation layer and the radio frequency front-end module for feeding back a corresponding voltage control signal to the quasi-electrostatic modulation layer and a corresponding beam control signal to the radio frequency front-end module; the quasi-electrostatic modulation layer is connected to the first structural network layer for adjusting the surface impedance of the phased array antenna system according to the voltage control signal; the first structural network is used to modulate the radiation performance and isolation of the phased array antenna; the radio frequency front-end module is used to send a corresponding radio frequency signal to the antenna unit according to the beam control signal.

[0052] In this way, the charge distribution on the antenna surface is dynamically adjusted based on the quasi-electrostatic modulation layer to achieve beamforming, thereby improving the adaptability of the phased array antenna system.

[0053] It should be noted that the phased array antenna system and its manufacturing method provided in this application can be applied to the field of communication technology. The above is only an example and does not limit the application field of the phased array antenna system and its manufacturing method provided in this application.

[0054] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0055] Figure 1 A schematic diagram of the connection relationship of a phased array antenna system provided in an embodiment of the present application. Figure 1 As shown, the system includes: a quasi-electrostatic modulation layer 100, a first structure network layer 200, an adaptive feeding system 300, a radio frequency front-end module 400 and a system support module 500;

[0056] The input end of the adaptive feeding system 300 is connected to the output end of the system support module 500 for receiving environmental sensing data;

[0057] The output end of the adaptive feeding system 300 is connected to the quasi-electrostatic modulation layer 100 and the RF front-end module 400, respectively, for feeding back a corresponding voltage control signal to the quasi-electrostatic modulation layer 100 and feeding back a corresponding beam control signal to the RF front-end module 400;

[0058] The quasi-electrostatic modulation layer 100 is connected to the first structural network layer 200 and is used to adjust the surface impedance of the phased array antenna system according to the voltage control signal;

[0059] The first structural network is used to modulate the radiation performance and isolation of the phased array antenna;

[0060] The RF front-end module 400 is configured to send a corresponding RF signal to the antenna unit according to the beam control signal.

[0061] Specifically, the system support module 500 can sense the signal strength, direction and other information of the surrounding signals, and send these environmental perception data to the adaptive feeding system 300 connected thereto, providing a basis for beamforming. The adaptive feeding system 300 is connected to the quasi-electrostatic modulation layer 100 and the RF front-end module 400, and can receive environmental perception data. Through FPGA or DSP, it sends voltage control signals and beam control signals to the quasi-electrostatic modulation layer 100 and the RF front-end module 400 respectively to achieve dynamic impedance matching and beamforming, and optimize the performance of the antenna. The quasi-electrostatic modulation layer 100 is connected to the adaptive feeding system 300, receives the voltage control signal, and dynamically adjusts the surface impedance based on this, to achieve dynamic impedance matching and broadband performance optimization of the antenna. The first structural network layer 200 is integrated with the quasi-electrostatic modulation layer 100 to ensure the radiation performance and isolation of the phased array antenna.

[0062] Figure 2 A schematic diagram of a first structure network layer provided in an embodiment of the present application. Figure 2 As shown, regarding how to design the first structure network layer 200, the first structure network layer 200 specifically includes: a composite resonant structure 210 and a distributed decoupling network 220;

[0063] The composite resonant structure 210 and the distributed decoupling network 220 are sequentially connected to the quasi-electrostatic modulation layer 100;

[0064] The composite resonant structure 210 is used to modulate the radiation performance of the phased array antenna;

[0065] The distributed decoupling network 220 is used to modulate the isolation of the phased array antenna.

[0066] Specifically, to achieve ultra-wideband coverage and a compact design, this application introduces a composite resonant structure 210 integrated with the quasi-electrostatic modulation layer 100. This composite resonant structure 210 can also receive signals from the adaptive feeding system 300. By combining a tapered slot line with an asymmetric dipole structure and slow-wave effects, the antenna's radiation performance is optimized. A distributed decoupling network 220 is integrated with the composite resonant structure 210, reducing coupling between antenna elements and improving isolation through the use of DGS, resonant isolators, and electromagnetic coupling neutralization techniques.

[0067] As an implementation method, regarding how to design the system support module 500, the system support module 500 specifically includes: an environment perception sensor 510;

[0068] The environment perception sensor 510 is used to sense the signal strength and signal direction of the surrounding environment, generate environment perception data, and send the data to the adaptive feeding system 300 .

[0069] Furthermore, the system support module 500 specifically further includes: a power management unit 520;

[0070] The power management unit 520 is configured to supply power to the RF front-end module 400 , the adaptive feeding system 300 , and the distributed decoupling network 220 .

[0071] Figure 3 A schematic diagram of a system support module provided in an embodiment of the present application. Figure 3 As shown, the environmental perception sensor 510 can sense the surrounding signal strength, direction, and other information, generate environmental perception data, and send it to the adaptive feeding system 300 to provide a basis for beamforming. Furthermore, the input end of the power management unit 520 is connected to an external power source, such as a battery or power adapter; the output end is connected to the RF front-end module 400, the adaptive feeding system 300, and the environmental perception sensor 510, respectively, to provide a stable power supply for the entire system.

[0072] As an implementation method, with respect to how to design a phased array antenna system, the phased array antenna system further includes: an antenna base unit;

[0073] The antenna substrate unit is used to provide physical support for the quasi-electrostatic modulation layer 100 and the first structural network layer 200 .

[0074] Specifically, the antenna substrate provides physical support for various antenna components (such as the quasi-electrostatic modulation layer 100, the composite resonant structure 210, and the distributed decoupling network 220), ensuring their stability during manufacturing and use. Without a stable substrate structure, antenna components could be damaged by mechanical vibration or environmental factors, affecting antenna performance.

[0075] In actual use, the phased array antenna system is first initialized (connecting an external power supply to the power management unit 520 to ensure stable power supply; starting the power management unit 520 to provide power to the RF front-end module 400, the adaptive feeding system 300, and the environmental sensing sensor 510). The environmental sensing sensor 510 is then activated to begin sensing the signal strength and direction of the surrounding environment and transmit this sensing data to the adaptive feeding system 300. Furthermore, the adaptive feeding system 300 calculates the optimal beam direction and modulation parameters based on the environmental sensing data, sends a corresponding beam control signal to the RF front-end module 400 to adjust the beam direction, and sends a corresponding voltage control signal to the quasi-electrostatic modulation layer 100 to adjust the surface impedance. For signal transmission, an external lacing processing unit transmits the baseband signal to the RF front-end module 400, which up-converts and amplifies the baseband signal to generate an RF signal. This RF signal is then transmitted to the antenna unit for transmission. On the other hand, for signal reception, there is an antenna unit that receives external RF signals and sends the received RF signals to the RF front-end module 400. The RF front-end module 400 down-converts and processes the RF signals to generate baseband signals, and sends the baseband signals to the baseband processing unit. Furthermore, the environmental perception sensor 510 continuously perceives environmental changes during this process and updates the perception data in real time. The adaptive feeding system 300 dynamically adjusts the beam direction and modulation parameters according to the latest perception data, adjusts the surface impedance of the quasi-electrostatic modulation layer 100, and optimizes the signal transmission efficiency. The RF front-end module 400 dynamically adjusts the beam direction according to the beam control signal to ensure the best signal transmission effect.

[0076] In summary, the phased array antenna system provided by the present application includes: a quasi-electrostatic modulation layer, a first structural network layer, an adaptive feeding system, a radio frequency front-end module, and a system support module. Among them, the input end of the adaptive feeding system is connected to the output end of the system support module for receiving environmental perception data; the output end of the adaptive feeding system is respectively connected to the quasi-electrostatic modulation layer and the radio frequency front-end module for feeding back the corresponding voltage control signal to the quasi-electrostatic modulation layer and the corresponding beam control signal to the radio frequency front-end module; the quasi-electrostatic modulation layer is connected to the first structural network layer for adjusting the surface impedance of the phased array antenna system according to the voltage control signal; the first structural network is used to modulate the radiation performance and isolation of the phased array antenna; the radio frequency front-end module is used to send the corresponding radio frequency signal to the antenna unit according to the beam control signal. In this way, the surface charge distribution of the antenna is dynamically adjusted based on the quasi-electrostatic modulation layer to achieve beam shaping, thereby improving the adaptability of the phased array antenna system.

[0077] Figure 4 A flow chart of a method for preparing a phased array antenna system provided in an embodiment of the present application. Figure 4 As shown, the preparation method of the phased array antenna system may include:

[0078] S401: providing a first substrate, a second substrate, and a third substrate.

[0079] In practical applications, before preparing the quasi-electrostatic modulation layer, the first structural network layer, and the adaptive feed system, it is necessary to select appropriate substrate materials for each structure. The first substrate corresponds to the quasi-electrostatic modulation layer, the second substrate corresponds to the first structural network layer, and the third substrate corresponds to the adaptive feed system.

[0080] S402: forming a quasi-electrostatic modulation layer on the first substrate to obtain a first structure.

[0081] In practical applications, a dynamically modulated quasi-electrostatic layer is required above the radiating element to control the surface impedance characteristics through voltage control. The quasi-electrostatic modulation layer must also have a response time of less than 1ms to meet the requirements of 5G dynamic scenarios, and an insertion loss of less than 0.5dB, far superior to traditional PIN diode tuning methods and capable of achieving dynamic impedance matching across a wide bandwidth. The first substrate and quasi-electrostatic modulation layer are collectively referred to as the first structure.

[0082] In addition, since the methods for preparing the quasi-electrostatic modulation layer are different, the embodiments of the present application can illustrate one possible preparation method.

[0083] In one embodiment, the first substrate is a glass or plastic substrate; and forming a quasi-electrostatic modulation layer on the first substrate comprises:

[0084] Depositing a TCO thin film on the first substrate based on a deposition process or a magnetron sputtering process;

[0085] Filling a liquid crystal material between the first substrate and the TCO film, and connecting a bias voltage source integrated with a control circuit to the TCO film to form a quasi-electrostatic modulation layer;

[0086] The bias voltage source applies a bias voltage of 0-30V.

[0087] Furthermore, the deposition process requires a deposition temperature between room temperature and 300°C;

[0088] The magnetron sputtering process requires a vacuum degree of 10 -4 Pa.

[0089] In practical applications, the substrate used to prepare the quasi-electrostatic modulation layer, that is, the first substrate, is usually a transparent glass or plastic substrate. In addition, the first substrate needs to be strictly cleaned and surface treated (such as using ultrasonic cleaning equipment and deionized water for cleaning) to remove impurities and oil stains on the surface to ensure the quality of subsequent processes. In the process of preparing the quasi-electrostatic modulation layer, a layer of transparent conductive oxide (TCO) film is first deposited on the first substrate using magnetron sputtering equipment or chemical vapor deposition equipment. The commonly used materials are indium tin oxide (ITO) or zinc oxide (ZnO). The deposition temperature is usually between room temperature and 300°C, and a high vacuum degree of 10°C needs to be maintained during the magnetron sputtering process. -4 Pa. Further, the liquid crystal material is filled into the space between the TCO film and the first substrate by a solution coating device or a vacuum perfusion device. It should be noted that the filling of the liquid crystal material is usually carried out at room temperature, but the ambient temperature needs to be controlled to avoid phase change of the liquid crystal material, and the vacuum degree needs to be maintained at 10 -2 Pa to ensure uniform filling of the liquid crystal material. Furthermore, to control the temperature, a bias voltage source is connected to the TCO film using welding equipment or conductive adhesive coating equipment, ensuring that a bias voltage of 0-30V can be applied. To control the temperature, a control circuit (FPGA or DSP) is integrated with the bias voltage source using a placement machine or welding equipment to adjust the voltage value in real time and achieve dynamic impedance matching.

[0090] S403: forming a first structure network layer on the second substrate to obtain a second structure.

[0091] In practical applications, the design of the first structural network layer effectively reduces surface wave coupling, further optimizing the antenna's radiation performance, enabling it to maintain ultra-wideband characteristics while maintaining miniaturization. Furthermore, it achieves inter-unit isolation greater than 25dB across the entire frequency band, significantly improving the isolation between multiple antenna elements in a MIMO system. This resolves the conflict between high isolation and antenna radiation efficiency in existing technologies, providing strong support for efficient multi-input, multi-output communications. The second substrate and the first structural network layer are collectively referred to as the second structure.

[0092] In addition, since the methods for preparing the first structural network are different, the embodiments of the present application can illustrate a possible preparation method.

[0093] In one embodiment, the second substrate is a high-frequency dielectric material substrate; the first structural network layer includes: a composite resonant structure and a distributed decoupling network;

[0094] The forming of the first structural network layer on the second substrate comprises:

[0095] Etching a gradient groove line and an asymmetric dipole composite structure on the second substrate;

[0096] integrating a periodic electromagnetic bandgap structure on the second substrate;

[0097] The etched gradient slot line, the asymmetric dipole composite structure and the electromagnetic bandgap structure are stacked in multiple layers based on a lamination process to form a composite resonant structure;

[0098] etching a defective structure on the second substrate;

[0099] etching a resonant isolator on the second substrate;

[0100] The defective ground structure, the resonant isolator and the electromagnetic coupling structure are stacked in multiple layers based on the lamination process to form a distributed decoupling network.

[0101] Furthermore, the lamination process requires a process temperature between 150-200° C. and a pressure between 1-5 MPa.

[0102] In practical applications, the composite resonant structure and distributed decoupling network require a two-step design. Specifically, the second substrate is a high-frequency dielectric material. For fabrication of the composite resonant structure, the second substrate can be made of Rogers or polytetrafluoroethylene (PTFE). Furthermore, the second substrate requires rigorous cleaning and surface treatment (such as using an ultrasonic cleaner with deionized water and isopropyl alcohol at room temperature) to remove surface impurities and oils to ensure the quality of subsequent processes. During the fabrication of the composite resonant structure, a composite structure of gradient grooves and asymmetric dipoles is first etched onto the second substrate. These structures achieve multimode resonant characteristics, covering the ultra-wideband frequency band of 24-40 GHz. Specifically, the designed gradient groove and asymmetric dipole patterns are transferred onto copper foil using photolithography techniques at room temperature using photolithography equipment and etching equipment. Unwanted portions are then removed using chemical etching or plasma etching (using ferric chloride solution or ammonium persulfate solution). Next, under the same conditions, a periodic electromagnetic bandgap (EBG) structure is integrated onto a second substrate to achieve a slow-wave effect, further compressing the equivalent wavelength and reducing antenna size. Finally, using a lamination machine at temperatures between 150-200°C and 1-5 MPa (depending on the material of the second substrate), the etched tapered slot, asymmetric dipole composite structure, and EBG structure are stacked in multiple layers to form a complete composite resonant structure. This tapered slot, asymmetric dipole composite structure, combined with the periodic EBG structure, achieves ultra-wideband coverage of 24-40 GHz and an equivalent wavelength compression ratio of 1.8:1, while maintaining a small element size (0.3λ × 0.3λ), significantly improving the antenna's broadband performance. Furthermore, the completed composite resonant structure can be surface-treated, such as by polishing the surface to ensure a surface roughness of less than 0.1μm, to enhance radiation performance. This completes the design of the radiating element. Furthermore, for the fabrication of the distributed decoupling network, the second substrate can be made of Rogers 4350B or PTFE. Similarly, the second substrate is rigorously cleaned and surface treated to remove impurities and oil stains on the surface to ensure the quality of subsequent processes. In the process of preparing the distributed decoupling network, a defective ground structure (DGS) is first etched on the second substrate to reduce the coupling between antenna units. DGS is usually composed of periodically arranged defect units and can effectively suppress surface waves. Specifically, based on photolithography equipment and etching equipment, photolithography technology can be used to transfer the designed DGS pattern to copper foil, and then the unnecessary parts are removed by chemical etching or plasma etching (using ferric chloride solution or ammonium persulfate solution). Then, based on the same conditions, a resonant isolator is etched on the second substrate to further improve the isolation between antenna units.Resonant isolators are usually composed of a resonant cavity and a coupling structure, which can effectively isolate the signals between different antenna units. Then, based on the same conditions, electromagnetic coupling neutralization technology is applied in the vertical direction, and the vertical coupling between antenna units is reduced by designing a specific electromagnetic coupling structure. Finally, based on lamination equipment, between 150-200°C and 1-5MPa, the etched DGS structure, resonant isolator and electromagnetic coupling structure are stacked in multiple layers to form a complete distributed decoupling network. In addition, the complete distributed decoupling network formed can also be surface treated, such as processing the surface of the distributed decoupling network based on polishing equipment to ensure that its surface roughness is less than 0.1μm, thereby improving the isolation performance.

[0103] S404: forming an adaptive feeding system on the third substrate to obtain a third structure.

[0104] In practical applications, the third substrate is typically a high-frequency dielectric material. During fabrication, it can be Rogers 4350B or PTFE. Furthermore, the third substrate requires rigorous cleaning and surface treatment similar to the cleaning methods used for the second substrate to remove surface impurities and oil, ensuring quality in subsequent processes. During the fabrication of the adaptive feed system, the feed network is first designed and etched onto the third substrate. The feed network typically consists of microstrip lines or coplanar waveguides, used to distribute signals to the various antenna elements. Specifically, photolithography and etching equipment can be used to transfer the designed feed network pattern onto copper foil. Chemical etching or plasma etching (using ferric chloride solution or ammonium persulfate solution) is then used to remove unwanted portions. Next, an impedance matching circuit is designed and etched. This circuit typically consists of adjustable capacitors, inductors, and transmission lines, used to dynamically adjust the antenna's impedance. Specifically, combining the above conditions, photolithography can be used to transfer the designed impedance matching circuit pattern onto copper foil. Chemical etching or plasma etching can then be used to remove unwanted portions. Then, using a placement machine and welding equipment to control the temperature, the FPGA or DSP chip is mounted on the PCB using a placement machine. The chip is then connected to the circuit on the PCB through welding to integrate the control circuit with the feed network and impedance matching circuit for real-time adjustment of the impedance and beam direction. Finally, using lamination equipment, the etched copper foil layer is laminated with the high-frequency dielectric substrate material at a temperature between 150-200°C and 1-5MPa (depending on the material of the second substrate), so that the etched feed network, impedance matching circuit, and control circuit are stacked in multiple layers to form a complete adaptive feed system. In addition, the complete adaptive feed system can also be surface treated, such as using polishing equipment to treat the surface of the adaptive feed system to ensure that its surface roughness is less than 0.1μm, thereby improving system performance.

[0105] S405: Based on the first structure, the second structure and the third structure, the quasi-electrostatic modulation layer, the first structure network layer, the adaptive feeding system, the RF front-end module and the system support module are integrated to obtain a phased array antenna system.

[0106] In practical applications, an antenna substrate unit (typically a high-frequency dielectric substrate material) is provided. The various layers are then laminated to the high-frequency dielectric substrate material using laminating equipment at temperatures between 150-200°C and 1-5 MPa (depending on the substrate unit material), ensuring a tight bond between the layers. Specifically, the quasi-electrostatic modulation layer, composite resonant structure, distributed decoupling network, and adaptive feed system are stacked on the high-frequency dielectric substrate material to form a complete phased array antenna system. Furthermore, the resulting complete phased array antenna system can undergo surface treatment, such as polishing the surface to ensure a surface roughness of less than 0.1 μm, improving system performance.

[0107] Figure 5 A schematic diagram of the structure of a phased array antenna system provided in an embodiment of the present application. Figure 5 As shown, the phased array antenna system provided by the present application includes: a quasi-electrostatic modulation layer, a composite resonant structure, a distributed decoupling network, an adaptive feeding system, a radio frequency front-end module, an environmental perception sensor, a power management unit, and an antenna substrate unit (600). Among them, the present application has made innovative designs in the quasi-electrostatic modulation layer, the composite resonant structure, the distributed decoupling network, and the adaptive feeding system, which significantly improves the performance of the antenna system. Compared with the existing technology, this solution has obvious advantages in dynamic modulation, broadband coverage, high isolation, and beam control, and can better meet the needs of 5G communication systems.

[0108] In summary, the method for preparing a phased array antenna system provided in the present application includes: first providing a first substrate, a second substrate, and a third substrate. Then, a quasi-electrostatic modulation layer is formed on the first substrate to obtain a first structure; a first structure network layer is formed on the second substrate to obtain a second structure; and an adaptive feeding system is formed on the third substrate to obtain a third structure. Finally, based on the first structure, the second structure, and the third structure, the quasi-electrostatic modulation layer, the first structure network layer, the adaptive feeding system, the RF front-end module, and the system support module are integrated to obtain a phased array antenna system. In this way, the charge distribution on the antenna surface is dynamically adjusted based on the quasi-electrostatic modulation layer to achieve beamforming, thereby improving the adaptability of the phased array antenna system.

[0109] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A phased array antenna system, characterized in that: include: Quasi-electrostatic modulation layer, first structural network layer, adaptive feeding system, RF front-end module and system support module; The input end of the adaptive feeding system is connected to the output end of the system support module for receiving environmental sensing data; The output end of the adaptive feeding system is connected to the quasi-electrostatic modulation layer and the RF front-end module respectively, and is used to feed back a corresponding voltage control signal to the quasi-electrostatic modulation layer and feed back a corresponding beam control signal to the RF front-end module; The quasi-electrostatic modulation layer is connected to the first structural network layer and is used to adjust the surface impedance of the phased array antenna system according to the voltage control signal; The first structural network is used to modulate the radiation performance and isolation of the phased array antenna; The radio frequency front-end module is used to send a corresponding radio frequency signal to the antenna unit according to the beam control signal.

2. The system according to claim 1, wherein: The first structural network layer includes: a composite resonant structure and a distributed decoupling network; The composite resonant structure and the distributed decoupling network are sequentially connected to the quasi-static modulation layer; The composite resonant structure is used to modulate the radiation performance of the phased array antenna; The distributed decoupling network is used to modulate the isolation of the phased array antenna.

3. The system according to claim 1, wherein: The system support module includes: an environmental perception sensor; The environmental perception sensor is used to perceive the signal strength and signal direction of the surrounding environment, form environmental perception data and send it to the adaptive feeding system.

4. The system according to claim 3, characterized in that The system support module further includes: a power management unit; The power management unit is used to supply power to the RF front-end module, the adaptive feeding system and the environmental perception sensor.

5. The system according to claim 1, wherein: The phased array antenna system further includes: an antenna substrate unit; The antenna substrate unit is used to provide physical support for the quasi-electrostatic modulation layer and the first structural network layer.

6. A method for preparing a phased array antenna system, characterized in that: The method comprises: providing a first substrate, a second substrate, and a third substrate; forming a quasi-electrostatic modulation layer on the first substrate to obtain a first structure; forming a first structure network layer on the second substrate to obtain a second structure; forming an adaptive feeding system on the third substrate to obtain a third structure; Based on the first structure, the second structure and the third structure, the quasi-electrostatic modulation layer, the first structure network layer, the adaptive feeding system, the RF front-end module and the system support module are integrated to obtain a phased array antenna system.

7. The method according to claim 6, characterized in that The forming of the quasi-electrostatic modulation layer on the first substrate comprises: Depositing a TCO thin film on the first substrate based on a deposition process or a magnetron sputtering process; Filling a liquid crystal material between the first substrate and the TCO film, and connecting a bias voltage source integrated with a control circuit to the TCO film to form a quasi-electrostatic modulation layer; The bias voltage source applies a bias voltage of 0-30V; the first substrate is a glass or plastic substrate.

8. The method according to claim 7, characterized in that The deposition process requires a deposition temperature between room temperature and 300°C; The magnetron sputtering process requires a vacuum degree of 10 -4 Pa.

9. The method according to claim 6, characterized in that The first structural network layer includes: a composite resonant structure and a distributed decoupling network; The forming of the first structural network layer on the second substrate comprises: Etching a gradient groove line and an asymmetric dipole composite structure on the second substrate; integrating a periodic electromagnetic bandgap structure on the second substrate; The etched gradient slot line, the asymmetric dipole composite structure and the electromagnetic bandgap structure are stacked in multiple layers based on a lamination process to form a composite resonant structure; etching a defective structure on the second substrate; etching a resonant isolator on the second substrate; The defective ground structure, the resonant isolator and the electromagnetic coupling structure are stacked in multiple layers based on the lamination process to form a distributed decoupling network; The second substrate is a high-frequency dielectric material substrate.

10. The method according to claim 9, characterized in that The lamination process requires a process temperature between 150-200° C. and a pressure between 1-5 MPa.

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