Preparation method of mould-corrosion-resistant ABS electromagnetic protective coating in humid environment
By preparing an ultra-thin multifunctional gradient composite coating on the ABS surface, the problems of poor hydrophobicity, mildew corrosion resistance and electromagnetic shielding performance of ABS material in humid environments are solved, and efficient electromagnetic protection and mildew inhibition effects are achieved.
Patent Information
- Application Number
- CN202510885363.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-30
- Publication Date
- 2025-09-26
AI Technical Summary
ABS materials have poor hydrophobicity, fungal corrosion resistance and electromagnetic shielding properties in humid environments. Existing modification methods affect mechanical properties and cannot effectively solve the problems of fungal corrosion and wide-band electromagnetic interference.
An ultra-thin multifunctional gradient composite coating was prepared on the ABS surface, including substrate pretreatment, electromagnetic shielding layer, mildew corrosion-resistant layer and hydrophobic layer preparation. A continuous conductive network and antibacterial layer were constructed by using the chemical copper plating process doped with nano-silver particles, the electroplating nickel process doped with zinc oxide particles and the injection molding polyurethane process doped with graphene oxide.
The hydrophobicity, mildew corrosion resistance and wide-band electromagnetic shielding performance of ABS materials have been improved, achieving 80-100dB electromagnetic wave attenuation and 80-95% mildew growth inhibition, isolating them from erosion in humid environments.
Smart Images
Figure CN120700482A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a surface coating technology, in particular to a multifunctional gradient composite coating technology, specifically to a method for preparing an ABS electromagnetic protective coating that is resistant to mold corrosion in a humid environment. Background Art
[0002] Acrylonitrile-butadiene-styrene (ABS) is a plastic with excellent mechanical properties and thermal stability. It is widely used in unmanned aerial vehicles (UAVs), electronic information equipment, and other fields, serving as a crucial protective casing for these devices. With the continued maturation of electromagnetic interference (EMI) technology and the surge in demand for humid environments, resistance to fungal corrosion and EMI has become increasingly important. However, ABS's surface has poor hydrophobicity, lacks antibacterial properties, and lacks EMI resistance, making it difficult to meet the corrosion and EMI requirements in humid environments.
[0003] To improve the hydrophobicity, corrosion resistance, and electromagnetic shielding properties of ABS parts, the most common method currently is to add silica to the ABS to improve hydrophobicity, zinc oxide to improve fungal corrosion resistance, and nanosilver particles to enhance electromagnetic shielding performance. However, directly modifying the internal structure of the ABS material severely impacts its mechanical properties and thermal stability, with minimal improvement in hydrophobicity and antibacterial properties, making it unable to meet long-term service requirements. Nanosilver particles struggle to form a continuous conductive network within ABS, resulting in limited electromagnetic wave attenuation and inability to resist strong broadband electromagnetic interference. In summary, existing modification methods compromise the overall performance of ABS and fail to fundamentally address the issues of fungal corrosion and broadband electromagnetic interference affecting ABS parts. Summary of the Invention
[0004] The present invention addresses the issues of poor surface hydrophobicity, fungal corrosion resistance, and electromagnetic shielding performance of ABS components used in electronic information devices in humid environments. A method for preparing a fungal-resistant ABS electromagnetic shielding coating for humid environments has been developed. This method modifies the ABS surface properties by applying an ultrathin, multifunctional gradient composite coating on the ABS surface, thereby improving the ABS material's hydrophobicity, fungal corrosion resistance, and broadband electromagnetic shielding performance.
[0005] The technical solution of the present invention is:
[0006] A method for preparing an ABS electromagnetic protective coating that is resistant to mildew corrosion in a humid environment is characterized in that the main preparation process includes ABS substrate pretreatment, electromagnetic shielding layer preparation, mildew corrosion resistant layer preparation and hydrophobic layer preparation.
[0007] The ABS substrate pretreatment first uses anhydrous ethanol to ultrasonically clean the contaminants attached to the ABS surface, and then uses a 0.25-1.0 μm diamond free abrasive mechanical polishing method to remove the surface oxide layer no more than 10 μm, with the abrasive size decreasing step by step.
[0008] The electromagnetic shielding layer is prepared by reducing a dense Cu layer on the surface of a pretreated ABS substrate using a chemical copper plating process using a CuSO4 plating solution doped with 50-80 nm Ag particles. The thickness of the electromagnetic shielding layer is 4-5 μm. During the chemical Cu plating, the CuSO4 plating solution needs to be forced to flow. The nanosilver particles need to be evenly dispersed in the copper layer, and the concentration of the nanosilver dispersion is 5.0-8.0 mg / mL.
[0009] The fungus-resistant layer is prepared by using a nickel electroplating process with a NiSO4 plating solution doped with 30-50 nm ZnO particles to prepare a dense Ni layer on the surface of the electromagnetic shielding layer. The thickness of the fungus-resistant corrosion layer is 4-5 μm. When electroplating Ni, a mesh Ni electrode is required for the anode and the plating solution is forced to flow. The zinc oxide particles need to be evenly dispersed in the nickel layer, and the concentration of the zinc oxide dispersion is 4.0-5.0 mg / mL.
[0010] The hydrophobic layer is prepared by injection molding a hydrophobic polyurethane layer with a thickness of 2 to 3 μm and doped with 100 to 500 nm graphene oxide particles on the surface of the electroplated mildew corrosion-resistant layer. The graphene oxide particles need to be uniformly dispersed in the polyurethane, and the concentration of the graphene oxide dispersion is 2.0 to 5.0 mg / mL.
[0011] The mold-resistant ABS electromagnetic shielding coating has a shielding effectiveness of 80-100dB against electromagnetic waves in the 1-18GHz band. It also inhibits the growth of most molds, including Aspergillus niger, Aspergillus versicolor, Aspergillus flavus, Chaetomium globosum, and Penicillium funiculosum, by 80-95%. The hydrophobic layer of the mold-resistant ABS electromagnetic shielding coating protects against erosion from humid environments.
[0012] The beneficial effects of the present invention are:
[0013] The present invention provides a method for preparing an ABS electromagnetic protective coating that is resistant to mildew corrosion in a humid environment. Pretreatment of the ABS substrate can remove the ABS surface oxide layer, thereby improving the coating adhesion performance. The electromagnetic shielding layer is prepared by using a copper coating doped with silver nanoparticles to construct a continuous conductive network, thereby improving broadband electromagnetic loss performance. The mildew corrosion-resistant layer is prepared by electroplating a nickel coating doped with zinc oxide nanoparticles to inhibit the growth of mildew in a humid environment, and the copper-nickel interface effect further improves the electromagnetic shielding performance. The hydrophobic layer is prepared by injection-molding polyurethane doped with graphene oxide to improve surface hydrophobicity, and the internal dry environment hinders mildew growth.
[0014] The present invention is used to enhance the electromagnetic protection performance and fungal corrosion resistance of ABS components in electronic information equipment. Through a 10-13 μm ultra-thin composite coating, it achieves 80-100 dB attenuation of wide-band (1-18 GHz) electromagnetic waves, inhibiting the growth of most molds such as Aspergillus niger and Aspergillus flavus. It has broad application prospects in unmanned aerial vehicles, ships and other fields. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic structural diagram of the ABS electromagnetic protective coating resistant to mildew corrosion in a humid environment prepared by the present invention.
[0016] Figure 2 This is the result of a 14-day fungal corrosion test on a common Cu-Ni coating. DETAILED DESCRIPTION
[0017] The present invention will be further described below with reference to the accompanying drawings and examples.
[0018] like Figure 1 shown.
[0019] A method for preparing an ABS electromagnetic protective coating that is resistant to mildew corrosion in a humid environment, the main preparation process includes ABS substrate pretreatment, electromagnetic shielding layer preparation, mildew corrosion resistant layer preparation and hydrophobic layer preparation. The structure obtained by the preparation is as follows Figure 1 As shown, the structure consists of an ABS substrate and an electromagnetic shielding layer, a mildew corrosion resistant layer and a hydrophobic layer formed on both sides or one side of the substrate.
[0020] Example 1.
[0021] An ABS electromagnetic protective coating resistant to mold corrosion in a humid environment is manufactured by the following steps:
[0022] 1. Substrate pretreatment. First, ultrasonically clean the contaminants attached to the ABS surface with anhydrous ethanol. Then, use 0.25-1.0μm diamond free abrasive to mechanically polish the surface to remove the oxide layer no thicker than 10μm. The oxide layer should be removed layer by layer, and the abrasive size should be gradually reduced until the removed layer thickness is close to 10μm.
[0023] 2. Preparation of the electromagnetic shielding layer. A dense Cu layer was reduced on the pretreated ABS substrate using an electroless copper plating process using a CuSO₄ plating solution doped with 50 nm Ag particles. The thickness of the electromagnetic shielding layer was 4 to 5 μm. The electroless Cu plating process required forced flow of the CuSO₄ plating solution. The nanosilver particles were uniformly dispersed throughout the copper layer. The concentration of the nanosilver dispersion was 5.0 mg / mL.
[0024] 3. Preparation of the fungus-resistant layer. A dense nickel layer was prepared on the surface of the electromagnetic shielding layer using a nickel electroplating process using a NiSO4 plating solution doped with 30nm ZnO particles. The fungus-resistant layer had a thickness of 4-5μm. During the nickel electroplating process, a mesh nickel electrode was used as the anode and the plating solution was forced to flow. The zinc oxide particles were evenly dispersed in the nickel layer, and the concentration of the zinc oxide dispersion was 4.0mg / mL.
[0025] 4. Preparation of the hydrophobic layer: A 2-3 μm thick hydrophobic polyurethane layer doped with 100 nm graphene oxide particles was injection molded onto the surface of the electroplated fungus-resistant layer. The graphene oxide particles were uniformly dispersed in the polyurethane, and the concentration of the graphene oxide dispersion was 2.0 mg / mL.
[0026] The measured effects of the obtained mildew corrosion-resistant ABS electromagnetic protective coating are as follows:
[0027] Electromagnetic shielding effect: For electromagnetic waves in the 1-18GHz band, the shielding effectiveness is 80-85dB.
[0028] Anti-fungal corrosion effect: It can inhibit the growth of 80% of most molds such as Aspergillus niger, Aspergillus versicolor, Aspergillus flavus, Chaetomium globosum, Penicillium funiculosum, etc.
[0029] Coating hydrophobic effect: The hydrophobic layer can isolate the erosion of humid environment.
[0030] Example 2.
[0031] An ABS electromagnetic protective coating resistant to mold corrosion in a humid environment is manufactured by the following steps:
[0032] 1. Substrate pretreatment: First, ultrasonically clean the contaminants attached to the ABS surface with anhydrous ethanol, and then use 0.25-1.0 μm diamond free abrasive mechanical polishing to remove the surface oxide layer no more than 10 μm. The abrasive size is gradually reduced. The removal method is the same as in Example 1.
[0033] 2. Preparation of the electromagnetic shielding layer. A dense Cu layer was reduced on the pretreated ABS substrate using an electroless copper plating process using a CuSO₄ plating solution doped with 60nm Ag particles. The thickness of the electromagnetic shielding layer was 4-5μm. Electroless Cu plating required forced flow of the CuSO₄ plating solution. The nanosilver particles were uniformly dispersed throughout the copper layer. The concentration of the nanosilver dispersion was 6.0mg / mL.
[0034] 3. Preparation of the fungus-resistant layer. A dense nickel layer was prepared on the surface of the electromagnetic shielding layer using a nickel electroplating process using a NiSO4 plating solution doped with 40nm ZnO particles. The fungus-resistant layer had a thickness of 4-5μm. During the nickel electroplating process, a mesh nickel electrode was used as the anode and the plating solution was forced to flow. The zinc oxide particles were evenly dispersed in the nickel layer, and the concentration of the zinc oxide dispersion was 4.5mg / mL.
[0035] 4. Preparation of the hydrophobic layer: A hydrophobic polyurethane layer with a thickness of 2 to 3 μm and doped with 100 to 500 nm graphene oxide particles is injection molded onto the surface of the electroplated fungus-resistant layer. The graphene oxide particles must be evenly dispersed in the polyurethane, and the concentration of the graphene oxide dispersion is 3.5 mg / mL.
[0036] The measured effects of the obtained mildew corrosion-resistant ABS electromagnetic protective coating are as follows:
[0037] 1. Electromagnetic shielding effect of the coating. The fungus-resistant ABS electromagnetic protective coating has a shielding effectiveness of 85-90dB against electromagnetic waves in the 1-18GHz band.
[0038] 2. Anti-fungal corrosion effect of the coating. Anti-fungal corrosion ABS electromagnetic protective coating inhibits 85% of the growth of most molds such as Aspergillus niger, Aspergillus versicolor, Aspergillus flavus, Chaetomium globosum, Penicillium funiculosum, etc.
[0039] 3. Hydrophobic effect of coating. The hydrophobic layer of ABS electromagnetic protective coating is resistant to mildew corrosion and isolates it from erosion in humid environments.
[0040] Example 3.
[0041] An ABS electromagnetic protective coating resistant to mold corrosion in a humid environment is manufactured by the following steps:
[0042] 1. Substrate Pretreatment: First, ultrasonically clean the ABS surface of any contaminants with anhydrous ethanol. Then, mechanically polish the surface using 0.25-1.0 μm diamond free abrasives to remove the oxide layer (less than 10 μm thick). The abrasive size is gradually reduced. The removal method is the same as in Example 1.
[0043] 3. Preparation of the electromagnetic shielding layer. A dense Cu layer was reduced on the pretreated ABS substrate using an electroless copper plating process using a CuSO₄ plating solution doped with 80nm Ag particles. The thickness of the electromagnetic shielding layer was 4-5μm. Electroless Cu plating required forced flow of the CuSO₄ plating solution. The nanosilver particles were uniformly dispersed throughout the copper layer. The concentration of the nanosilver dispersion was 8.0mg / mL.
[0044] 4. Preparation of the fungus-resistant layer. A dense nickel layer was prepared on the surface of the electromagnetic shielding layer using a nickel electroplating process using a NiSO4 plating solution doped with 50nm ZnO particles. The fungus-resistant layer had a thickness of 4-5μm. During nickel electroplating, a mesh nickel electrode was used as the anode and the plating solution was forced to flow. The zinc oxide particles were evenly dispersed in the nickel layer, and the concentration of the zinc oxide dispersion was 5.0mg / mL.
[0045] 5. Preparation of the hydrophobic layer: A hydrophobic polyurethane layer with a thickness of 2 to 3 μm and doped with 100 to 500 nm graphene oxide particles is injection molded onto the surface of the electroplated fungus-resistant layer. The graphene oxide particles must be evenly dispersed in the polyurethane, and the concentration of the graphene oxide dispersion is 5.0 mg / mL.
[0046] The measured effects of the obtained mildew corrosion-resistant ABS electromagnetic protective coating are as follows:
[0047] 1. Electromagnetic shielding effect of the coating. The fungus-resistant ABS electromagnetic protective coating has a shielding effectiveness of 95-100dB for electromagnetic waves in the 1-18GHz band.
[0048] 2. Anti-fungal effect of the coating. Anti-fungal ABS electromagnetic protective coating inhibits the growth of 95% of most molds such as Aspergillus niger, Aspergillus versicolor, Aspergillus flavus, Chaetomium globosum, Penicillium funiculosum, etc.
[0049] 3. Hydrophobic effect of coating. The hydrophobic layer of ABS electromagnetic protective coating is resistant to mildew corrosion and isolates it from erosion in humid environments.
[0050] Comparative Example 1.
[0051] Ordinary ABS electromagnetic protection Cu-Ni coating is manufactured by the following steps:
[0052] 1. Substrate pretreatment. First, ultrasonically clean the contaminants attached to the ABS surface with anhydrous ethanol. Then, use 0.25-1.0μm diamond free abrasive to mechanically polish the surface to remove the oxide layer no thicker than 10μm. The oxide layer should be removed layer by layer, and the abrasive size should be gradually reduced until the removed layer thickness is close to 10μm.
[0053] 2. Preparation of Cu layer: A dense Cu layer with a thickness of 4 μm was reduced on the surface of the pretreated ABS substrate using a CuSO4 plating solution. The CuSO4 plating solution must be forced to flow during the electroless Cu plating process.
[0054] 3. Preparation of Ni layer: A dense Ni layer with a thickness of 5 μm is prepared on the surface of the Cu layer using a nickel electroplating process using a NiSO4 plating solution. When electroplating Ni, a mesh Ni electrode is used as the anode and the plating solution is forced to flow.
[0055] The measured effects of the obtained ordinary ABS electromagnetic protection Cu-Ni coating are as follows:
[0056] Electromagnetic shielding effect: For electromagnetic waves in the 1-18GHz band, the shielding effectiveness is 40-50dB.
[0057] Anti-fungal corrosion effect: Figure 2 As shown, there is mold growth on the coating surface.
[0058] Coating hydrophobic effect: The hydrophobic performance is poor, and the surface moisture is conducive to the growth of mold. Figure 2 shown.
[0059] The pre-treatment, preparation process and post-treatment not covered by the present invention are the same as those in the prior art or can be implemented by using the prior art.
Claims
1. A method for preparing an ABS electromagnetic protective coating that is resistant to mold corrosion in a humid environment, characterized in that: The method includes ABS substrate pretreatment, electromagnetic shielding layer preparation, mildew corrosion resistant layer preparation and hydrophobic layer preparation.
2. The preparation method according to claim 1, characterized in that The ABS substrate pretreatment first uses anhydrous ethanol to ultrasonically clean the pollutants attached to the ABS surface, and then uses a 0.25-1.0 μm diamond free abrasive mechanical polishing method to remove the surface oxide layer.
3. The preparation method according to claim 2, characterized in that The total thickness of the removed oxide layer should not exceed 10 μm, and the abrasive size used in the removal process should be reduced step by step.
4. The preparation method according to claim 1, characterized in that The electromagnetic shielding layer is prepared by reducing a dense Cu layer on the surface of a pretreated ABS substrate using a chemical copper plating process using a CuSO4 plating solution doped with 50-80 nm Ag particles. During chemical Cu plating, the CuSO4 plating solution needs to be forced to flow, and the nanosilver particles need to be evenly dispersed in the copper layer. The concentration of the nanosilver dispersion is 5.0-8.0 mg / mL.
5. The preparation method according to claim 4, characterized in that The thickness of the electromagnetic shielding layer is 4 to 5 μm.
6. The preparation method according to claim 1, characterized in that The fungus-resistant layer is prepared by using a nickel electroplating process with a NiSO4 plating solution doped with 30-50nm ZnO particles to prepare a dense Ni layer on the surface of the electromagnetic shielding layer to form a fungus-resistant corrosion layer; when electroplating Ni, a mesh Ni electrode is required as the anode and the plating solution is forced to flow. The zinc oxide particles need to be evenly dispersed in the nickel layer, and the concentration of the zinc oxide dispersion is 4.0-5.0mg / mL.
7. The preparation method according to claim 6, characterized in that The thickness of the mold corrosion resistant layer is 4 to 5 μm.
8. The preparation method according to claim 1, characterized in that The hydrophobic layer is prepared by injection molding a hydrophobic polyurethane layer with a thickness of 2 to 3 μm and doped with 100 to 500 nm graphene oxide particles on the surface of the electroplated mildew corrosion-resistant layer. The graphene oxide particles need to be uniformly dispersed in the polyurethane, and the concentration of the graphene oxide dispersion is 2.0 to 5.0 mg / mL.
9. The preparation method according to claim 1, characterized in that The mold corrosion-resistant ABS electromagnetic protective coating has a shielding effectiveness of 80 to 100 dB against electromagnetic waves in the 1 to 18 GHz band; the mold corrosion-resistant ABS electromagnetic protective coating inhibits the growth of Aspergillus niger, Aspergillus versicolor, Aspergillus flavus, Chaetomium globosum and Penicillium funiculosum by 80 to 95%; the hydrophobic layer of the mold corrosion-resistant ABS electromagnetic protective coating can isolate it from erosion by a humid environment.