Performance test method and system based on ultrathin touch switch color film

Abstract

The invention relates to the related technical field of performance testing, in particular to a performance testing method and system based on an ultrathin touch switch color film.The method comprises the steps that electrical performance testing parameters are configured to be connected with a signal generator and an oscilloscope, touch and force data are introduced, correlation between stray capacitance disturbance signals and time frequency is analyzed, and interference intensity and time delay are determined; and associating the physical defect type mapping failure path to generate a reminding signal. The technical problems that a single-point testing means is limited in analysis capacity for stray capacitance disturbance signals and cannot accurately grasp signal interference characteristics are solved, self-adaptive configuration of electrical performance testing parameters driven by building material parameters is achieved, the testing parameters can be automatically adjusted according to different color film material characteristics, the testing accuracy and effectiveness are improved, and the testing efficiency is improved. And meanwhile, the limitation of the traditional single-point test is broken through, the signal interference characteristics are accurately quantified, the signal interference condition is deeply known, the failure mechanism analysis is combined, the fault source is quickly positioned, and the fault occurrence probability is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field related to performance testing, and in particular to a performance testing method and system based on an ultra-thin touch switch color film. Background Art

[0002] With the widespread application of ultra-thin touch switch color films in electronic devices, their performance testing is crucial to ensuring product quality. Ultra-thin touch switch color film performance testing mostly uses pre-set fixed test parameters combined with single-point testing. The test is completed by detecting simple electrical performance indicators, which is difficult to meet diverse testing needs.

[0003] Fixed electrical performance test parameters cannot be adaptively adjusted according to the characteristics of the color film material, making it difficult to achieve the optimal test plan; the single-point test method can only obtain a small amount of performance data, and cannot comprehensively analyze the parasitic capacitance disturbance signal, making it difficult to accurately quantify the signal interference characteristics; there is a lack of in-depth research on the relationship between signal interference, physical defects and failure paths, and it is impossible to go from phenomenon detection to root cause location; a single test parameter cannot effectively simulate the situation in which the performance of the touch switch color film changes with touch and force in real usage scenarios; test results are mostly data lists, lacking effective analysis and conversion, and cannot provide an executable basis for maintenance decisions.

[0004] In summary, the existing technology has the technical problem that the single-point testing method has limited analysis capabilities for parasitic capacitance disturbance signals and cannot accurately grasp the signal interference characteristics. Summary of the Invention

[0005] This application provides a performance testing system based on ultra-thin touch switch color film, aiming to solve the technical problem that the single-point testing method in the existing technology has limited analysis ability of parasitic capacitance disturbance signals and cannot accurately grasp the signal interference characteristics.

[0006] In view of the above problems, the technical solution to implement this application is:

[0007] In one aspect, the present application provides a performance testing method based on an ultra-thin touch switch color film, wherein the method comprises:

[0008] The ultra-thin touch switch color film is set on a test platform, and basic material parameters are uploaded to the test platform; the test platform configures electrical performance test parameters based on the basic material parameters; the test platform is connected to a signal generator and an oscilloscope; after the test platform is initialized and configured with the electrical performance test parameters, touch signals and contact force data are introduced; the parasitic capacitance disturbance signal during the electrical performance test is recorded, the frequency component of the parasitic capacitance disturbance signal is decomposed, the disturbance feature vector is extracted, and a time-frequency domain synchronous correlation analysis is performed with the touch signal to determine the signal interference intensity and signal interference delay of the parasitic capacitance disturbance signal on the touch signal; based on the signal interference intensity and signal interference delay, multi-point correlation mapping is performed in combination with the physical defect type, and then the critical failure path is determined through failure mechanism analysis; the critical failure path is written into a failure reminder signal.

[0009] In another aspect, the present application provides a performance testing system based on an ultra-thin touch switch color film, wherein the system comprises:

[0010] A performance testing module is used to set the ultra-thin touch switch color film on the test platform and upload basic material parameters to the test platform; the test platform configures electrical performance test parameters through the basic material parameters; an initialization configuration module is used to connect the test platform with a signal generator and an oscilloscope; after the test platform is initialized and configured with the electrical performance test parameters, the touch signal and contact force data are introduced; a frequency decomposition module is used to record the parasitic capacitance disturbance signal during the electrical performance test, decompose the frequency component of the parasitic capacitance disturbance signal, extract the disturbance feature vector, perform time-frequency domain synchronous correlation analysis with the touch signal, and determine the signal interference intensity and signal interference delay of the parasitic capacitance disturbance signal on the touch signal; a failure reminder module is used to perform multi-point correlation mapping based on the signal interference intensity and signal interference delay in combination with the physical defect type, and then determine the critical failure path through failure mechanism analysis; and write the critical failure path into the failure reminder signal.

[0011] In summary, one or more technical solutions provided in this application realize the adaptive configuration of electrical performance test parameters driven by material parameters, which can automatically adjust the test parameters according to the characteristics of different color film materials, improve the accuracy and effectiveness of the test, and at the same time, break through the limitations of traditional single-point testing, accurately quantify the signal interference characteristics, deeply understand the signal interference situation, and combine with failure mechanism analysis to quickly locate the root cause of the fault and reduce the probability of failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A flow chart of a performance testing method based on ultra-thin touch switch color film is provided for this application;

[0013] Figure 2 A structural diagram of a performance testing system based on an ultra-thin touch switch color film is provided for this application.

[0014] Description of reference numerals: performance test module M100, initialization configuration module M200, frequency decomposition module M300, failure reminder module M400. DETAILED DESCRIPTION

[0015] Example 1

[0016] The present application will be described in detail below with reference to the accompanying drawings. Figure 1 As shown, the present application provides a performance testing method based on an ultra-thin touch switch color film, wherein the method includes:

[0017] S1: Place the ultra-thin touch switch color film on a test platform and upload basic material parameters to the test platform; the test platform configures electrical performance test parameters based on the basic material parameters; S2: Connect the test platform to a signal generator and an oscilloscope; after initializing the test platform with the electrical performance test parameters, introduce touch signals and contact force data.

[0018] Specifically, ultra-thin touch switch color films refer to touch-sensitive films used in touch devices that are thin and lightweight and have integrated color display capabilities. Their performance directly affects the device's touch sensitivity and display quality. The test platform is an integrated hardware and software system used to perform performance testing on ultra-thin touch switch color films. Basic material parameters include the color film's material type, thickness, dielectric constant, and other data reflecting the material's physical and chemical properties. Electrical performance test parameters are indicators used to measure the color film's electrical performance, such as voltage, current, and frequency, set based on the basic material parameters. A signal generator is used to generate electrical signals that simulate touch operations, while an oscilloscope can intuitively display the waveform of the electrical signal, facilitating the observation and analysis of signal characteristics.

[0019] First, the ultra-thin touch switch color film is placed and secured on the test platform to ensure a stable test environment. Basic material parameters for the color film, such as a thickness of 0.1mm and a dielectric constant of 3, are then uploaded to the test platform. Based on these parameters, the test platform uses a built-in algorithm to calculate and configure appropriate electrical performance test parameters, such as setting a test voltage of 5V and a test frequency of 100Hz. The test platform is then connected to a signal generator and oscilloscope and initialized using the configured electrical performance test parameters. A simulated touch signal is then introduced through the signal generator, with different contact force values, such as 1N and 2N, to simulate actual pressure conditions. Uploading basic material parameters and properly configuring electrical performance test parameters ensures that subsequent testing is based on the color film's inherent characteristics, resulting in more targeted and reliable test results. Connecting the signal generator and oscilloscope and introducing touch signals and contact force data simulates real-world usage scenarios, providing an effective data foundation for accurate analysis of the color film's performance.

[0020] S3: Record the parasitic capacitance disturbance signal during the electrical performance test, decompose the frequency component of the parasitic capacitance disturbance signal, extract the disturbance feature vector, perform time-frequency domain synchronous correlation analysis with the touch signal, and determine the signal interference intensity and signal interference delay of the parasitic capacitance disturbance signal on the touch signal; S4: Perform multi-point correlation mapping based on the signal interference intensity and signal interference delay in combination with the physical defect type, and then determine the critical failure path through failure mechanism analysis; write the critical failure path into the failure reminder signal.

[0021] Specifically, parasitic capacitance disturbance signals refer to electrical signal fluctuations caused by unexpected capacitance changes due to factors such as circuit layout and material properties during the electrical performance testing of ultra-thin touch switch color films. These fluctuations can interfere with normal touch signal transmission. Frequency component decomposition decomposes complex parasitic capacitance disturbance signals into sinusoidal components of different frequencies to more clearly analyze signal characteristics. The disturbance eigenvector is a set of numerical values ​​extracted from the decomposed frequency components that characterize the parasitic capacitance disturbance signal, such as the amplitude and phase of each frequency component. Time-frequency domain synchronous correlation analysis simultaneously correlates the parasitic capacitance disturbance signal with the touch signal in both the time and frequency domains to determine their synchronization relationship and degree of mutual influence. Signal interference intensity indicates the degree of interference caused by the parasitic capacitance disturbance signal on the touch signal, while signal interference delay refers to the time delay of the interference signal relative to the original touch signal. Physical defect types include scratches on the color film surface, internal short circuits, material inhomogeneities, and other physical damage or abnormalities. Multi-point correlation mapping correlates signal interference intensity and signal interference delay with different physical defect types in multiple dimensions. Failure mechanism analysis studies the impact of materials, structure, and environmental factors on product performance to reveal the root causes and mechanisms of product failure. Critical failure paths are the primary physical processes or mechanisms that lead to product performance degradation or failure.

[0022] During the electrical performance test, the parasitic capacitance disturbance signal is continuously recorded. The frequency components of this signal are decomposed using methods such as Fourier transforms. Eigenvalues ​​such as the amplitude and phase of each frequency component are extracted to form a disturbance feature vector. This disturbance feature vector is then subjected to simultaneous correlation analysis with the touch signal in the time-frequency domain. By calculating statistics such as the correlation coefficient, the signal interference intensity and signal interference delay of the parasitic capacitance disturbance signal on the touch signal are determined. Multi-point correlation mapping is then performed based on this interference data, combined with pre-defined association rules such as those for known physical defect types, such as surface scratches corresponding to interference intensity in the 20%-40% range and interference delay in the 3ms-7ms range. Failure mechanism analysis then investigates the impact of factors such as material properties, structural characteristics, and the test environment on failure. Key failure paths are identified, such as surface scratches → increased parasitic capacitance → increased signal interference → touch failure. Finally, this identified key failure path, such as the failure path in the example above, is written into the failure warning signal.

[0023] Through in-depth analysis of parasitic capacitance disturbance signals and correlation research with touch signals, signal interference characteristics can be accurately quantified, providing key data support for subsequent physical defect location and failure path analysis. The combination of multi-point correlation mapping and failure mechanism analysis enables in-depth diagnosis from signal interference phenomena to the root causes of physical defects. It can accurately identify the key causes of product performance degradation, write key failure paths into failure reminder signals, and transform complex test analysis results into intuitive and actionable maintenance information, thereby improving product maintenance efficiency and reliability.

[0024] Furthermore, the present application method includes:

[0025] The basic material parameters include film thickness, electrode material, and touch sensing sensitivity, and an equivalent circuit model of the ultra-thin touch switch color film is constructed. Based on the equivalent circuit model of the ultra-thin touch switch color film located on the test platform, the impedance characteristics and capacitive reactance characteristics at different frequencies are obtained. The test voltage range, test current threshold, and frequency scanning interval are determined based on the impedance characteristics and capacitive reactance characteristics at different frequencies, and the electrical performance test parameters are set.

[0026] Specifically, the equivalent circuit model abstracts the physical structure and electrical characteristics of the ultra-thin touch switch color film into a mathematical model of a combination of circuit elements, used to simulate its behavior during electrical performance testing. The impedance characteristic reflects the frequency dependence of the circuit's resistance to current, while the capacitive reactance characteristic reflects the capacitor's ability to resist alternating current at different frequencies. The test voltage range is the voltage range that ensures test safety and accurately reflects the color film's performance. The test current threshold is the critical current value that determines whether the circuit is functioning properly. The frequency sweep range is the frequency range used for testing.

[0027] Basic material parameters such as film thickness (e.g., 0.1mm), electrode material (e.g., ITO), and touch sensing sensitivity (e.g., 5mV / N) are input into professional software (e.g., COMSOL). An equivalent circuit model containing components such as resistors and capacitors is constructed. The model is then subjected to impedance spectroscopy testing within a frequency range to obtain impedance and capacitive reactance values ​​at different frequencies. By analyzing the resonance point of the impedance-frequency curve (e.g., a peak appears at 5kHz) and the capacitive reactance variation trend, the test voltage range is determined in conjunction with the material breakdown voltage. The current threshold is set according to Ohm's law and a safety factor, and segments sensitive to impedance changes are selected as frequency sweep intervals. This provides precise parameters for subsequent testing. A reasonable voltage range is set to avoid breakdown risks, while the current threshold ensures test safety. The frequency sweep interval covers the main operating frequency bands.

[0028] Furthermore, the parasitic capacitance disturbance signal during the electrical performance test is recorded, the frequency component of the parasitic capacitance disturbance signal is decomposed, and the disturbance feature vector is extracted. The method of the present application includes:

[0029] The parasitic capacitance disturbance signal in the time domain is converted into a frequency domain signal using FFT. The frequency domain signal is subjected to multi-layer decomposition to obtain the sub-signal energy distribution of each frequency band, and the energy proportion, center frequency, and bandwidth of each frequency band are extracted as the components of the disturbance feature vector.

[0030] Specifically, FFT (Fast Fourier Transform) is an algorithm for efficiently calculating discrete Fourier transforms, which can convert time domain signals into frequency domain signals and reveal the frequency components of the signals; multi-layer decomposition refers to dividing the frequency domain signal into multiple sub-bands according to the frequency range (such as low frequency 0-1kHz, medium frequency 1-10kHz, high frequency 10-100kHz) in order to deeply analyze the characteristics of each frequency band; the sub-signal energy distribution reflects the concentration of signal energy in different frequency bands, the energy share refers to the percentage of energy in each frequency band in the total energy, the center frequency indicates the frequency point where the energy of the frequency band is concentrated, and the bandwidth measures the frequency range width of the frequency band; the energy share, center frequency and bandwidth of each frequency band are the components of the disturbance characteristic vector, and the disturbance characteristic vector is used to quantify the characteristics of the parasitic capacitance disturbance signal.

[0031] Perform FFT transformation on the parasitic capacitance disturbance signal in the time domain, and then perform wavelet packet decomposition (such as db4 wavelet, decomposition of 3 layers) on the frequency domain signal to obtain 8 sub-bands (2 3 =8), obtain the energy proportion of each sub-band signal; then extract the center frequency and bandwidth of each frequency band: the disturbance feature vector formed; convert the parasitic capacitance disturbance signal in the time domain into a frequency domain feature vector, and achieve time-frequency conversion through FFT, so that the frequency component distribution of the signal can be intuitively observed; perform multi-layer decomposition on the frequency domain signal to capture signal details with finer granularity, and then refine the frequency band analysis through multi-layer decomposition to locate the interference source of a specific frequency, thereby effectively avoiding omission or misjudgment of the interference source and improving the accuracy and reliability of signal processing.

[0032] Furthermore, the disturbance feature vector is extracted and a time-frequency domain synchronous correlation analysis is performed with the touch signal to determine the signal interference intensity and signal interference delay of the parasitic capacitance disturbance signal on the touch signal. The method of the present application includes:

[0033] The touch signal and the disturbance feature vector are converted into a time-frequency image using a short-time Fourier transform; in the time-frequency image, a time-frequency domain synchronization correlation matrix is ​​obtained based on the Pearson correlation coefficient of the time segment-frequency region; and the maximum correlation coefficient value and the correlation coefficient distribution variance are extracted from the time-frequency domain synchronization correlation matrix as quantitative indicators of the signal interference intensity and signal interference delay.

[0034] Specifically, the short-time Fourier transform (STFT) is a time-frequency analysis method that decomposes non-stationary signals into multiple short-time stationary segments through windowing processing, generating a time-frequency image (a three-dimensional time-frequency-amplitude graph) that intuitively displays the changes in the signal frequency components over time; the Pearson correlation coefficient is used to measure the degree of linear correlation between two variables, with a value range of [-1,1], and is used here to calculate the correlation between time segments and frequency regions in the time-frequency image; the time-frequency domain synchronization correlation matrix is ​​a two-dimensional matrix, with rows representing time segments and columns representing frequency regions. The matrix elements are the Pearson correlation coefficients of the corresponding time and space regions, reflecting the synchronization of the touch signal and the disturbance signal in the time-frequency domain; the maximum correlation coefficient value reflects the strongest interference intensity, and the variance of the correlation coefficient distribution reflects the concentration of interference in the time-frequency domain. The larger the variance, the more dispersed the interference and the more complex the delay characteristics.

[0035] The touch signal and disturbance feature vector are transformed using the STFT transform. Specifically, the time-frequency image is divided into 10 segments (50ms each) along the time axis and into five regions along the frequency axis (low frequency 0-1kHz, medium frequency 1-5kHz, high frequency 5-10kHz, ultra-high frequency 10-20kHz, and extremely high frequency 20-50kHz). The Pearson correlation coefficient for each time segment-frequency region pair is evaluated to form a time-frequency domain synchronization correlation matrix. The time-frequency domain features are converted into quantifiable interference indicators: the maximum correlation coefficient value directly reflects the interference intensity; the variance of the correlation coefficient distribution is used to assess the dispersion of the interference and to indicate the presence of multiple interference sources. By locating the time-frequency region with the maximum correlation coefficient, the interference delay can be accurately determined, providing temporal fault characteristics for subsequent failure analysis.

[0036] Furthermore, based on the signal interference intensity and signal interference delay, multi-point correlation mapping is performed in combination with the physical defect type. The method of this application includes:

[0037] A defect feature library is established for physical defect types including scratches, bubbles, and electrode breakages, and the parasitic capacitance disturbance features, signal interference intensity features, and signal interference delay features corresponding to each physical defect type are classified and stored. For candidate defect types in the defect feature library, the waveform distortion of the touch signal and the correlation between the contact force values ​​are combined to screen out matching physical defect types and perform multi-point correlation mapping.

[0038] Specifically, the type of physical defect refers to the form of physical damage that may occur in the ultra-thin touch switch color film, such as surface scratches, internal bubbles, and electrode breakage; the defect feature library is a pre-established database that stores the key electrical performance characteristics corresponding to each physical defect, including: parasitic capacitance disturbance characteristics: scratches will cause the signal energy in a specific high-frequency band (such as 10-20kHz) to increase abnormally (15%-30% increase compared to the normal level); signal interference intensity characteristics: electrode breakage may cause the interference intensity to increase significantly when the contact force exceeds 2N (jumping from 0.3 to above 0.8); signal interference delay characteristics: bubble defects are usually accompanied by a more obvious signal delay (such as 30-50ms, 2-5 times longer than normal); waveform distortion includes amplitude attenuation of the touch signal (such as more than 25%), abnormal oscillation of the waveform or an increase in harmonic components; contact force correlation refers to the law of change of interference characteristics with pressing force.

[0039] By analyzing the electrical performance data of known defective samples, for example, testing color film with a 0.2mm scratch, we found that the signal energy ratio of the defective sample exceeded the average signal energy ratio of normal samples within the same frequency band (for example, 22% > 5%), and the interference intensity increased linearly with the intensity (slope 0.3 / N). These features are classified and stored in a defect feature library to form a characteristic label for each defect (for example, scratches correspond to increased high-frequency energy + positive correlation with intensity).

[0040] When testing an unknown sample, the frequency energy distribution, interference intensity, delay data and degree of touch signal waveform distortion of its parasitic capacitance disturbance signal are first extracted, and then these data are compared with the candidate types (scratches, bubbles, electrode fractures) in the defect feature library; through multi-dimensional feature matching (high-frequency energy + force correlation + amplitude attenuation), it is determined to be a scratch defect, and an association mapping between interference features and scratch defects is established; by associating interference features with physical defects at multiple points, misjudgment of a single indicator can be avoided (for example, bubbles may be confused with electrode oxidation based solely on delay), thereby improving the accuracy of defect identification.

[0041] Furthermore, for the candidate defect types in the defect feature library, the method of the present application includes:

[0042] A test feature vector is configured based on the quantitative indicators of the signal interference intensity and the signal interference delay, and the parasitic capacitance disturbance characteristics; a similarity threshold is set based on the cosine similarity between the test feature vector and the feature vectors of various physical defect types in the defect feature library; various physical defect types in the defect feature library are traversed, and one or more physical defect types whose feature vector cosine similarity is greater than the similarity threshold are marked as candidate defect types.

[0043] Specifically, the test feature vector is a multidimensional data set formed by integrating signal interference intensity, signal interference delay, and parasitic capacitance disturbance characteristics (such as the energy proportion of each frequency band, center frequency, etc.), which is used to characterize the abnormal electrical performance characteristics of the current test sample; cosine similarity is an algorithm that measures the directional similarity of two vectors, and its value range is [-1,1]. The closer the value is to 1, the higher the similarity of the feature vectors; the similarity threshold is a set judgment standard (such as 0.7) used to screen the physical defect types that match the test sample characteristics; the candidate defect type refers to the physical defect that is preliminarily determined to be possible after similarity calculation.

[0044] The quantitative indicators obtained from a certain test (such as signal interference intensity of 0.8 and interference delay of 30ms) and parasitic capacitance disturbance characteristics (such as 20% energy proportion in the 15-20kHz frequency band and center frequency of 18kHz) are integrated into a test feature vector, for example, expressed as [0.8, 30, 0.2, 18]. Then, based on historical test data and defect diagnosis experience, the cosine similarity threshold is set to 0.7. That is, when the cosine value of the test feature vector and a certain type of feature vector in the defect feature library is ≥0.7, the two are considered to have a high similarity. All physical defect types in the defect feature library (such as scratches, bubbles, and electrode fractures) are traversed to determine the cosine similarity between the test feature vector and each type of feature vector. The next step is failure mechanism analysis, and defect types are quickly screened through quantitative calculations. When there are multiple physical defect types mixed on the ultra-thin touch switch color film, by setting a reasonable cosine similarity threshold, the false detection rate can be controlled within a certain range while avoiding missed detections.

[0045] Furthermore, by analyzing the failure mechanism to determine the critical failure path, the present application method includes:

[0046] Based on the matching physical defect types corresponding to the multi-point association mapping, a defect propagation path model is constructed; the electrical performance test parameters are used as evidence nodes of the defect propagation path model; and the critical failure path is formulated based on the analysis of the posterior probability of the defect propagation nodes corresponding to the matching physical defect types.

[0047] Specifically, the defect propagation path model is a causal relationship model built based on the physical defect type, which is used to describe the evolution process of defects from generation to performance failure (for example: surface scratches → increased parasitic capacitance → enhanced signal interference → touch response delay); the evidence node refers to the observable electrical performance test parameters in the model (such as test voltage, impedance value in the frequency scanning range), which is used as evidence for inferring the defect propagation path; the posterior probability is the probability of inferring the occurrence of a defect propagation node (such as increased parasitic capacitance and enhanced signal interference) under the condition of known electrical performance test data, reflecting the credibility of the node in the causal chain.

[0048] First, for the matched physical defect type, a corresponding defect propagation path model is constructed. Taking scratches as an example, the model path can be expressed as: initial defect (scratch) → intermediate node 1 (abnormal increase in parasitic capacitance) → intermediate node 2 (high-frequency signal interference intensity exceeds 0.6) → failure (false touch); electrical performance test parameters are embedded in the model as evidence nodes. For example, the impedance value fluctuation amplitude measured within the frequency scanning range (2kHz-20kHz) is used as evidence of parasitic capacitance anomaly. Probabilistic reasoning methods such as Bayesian networks are used to obtain the posterior probability of each defect propagation node; if the interference intensity is detected to be 0.75 (interference intensity threshold 0.6), the posterior probability of the signal interference enhancement node is further increased; by screening the path with the highest posterior probability (such as scratch → increased parasitic capacitance → enhanced signal interference → touch failure, the posterior probability mean of each node is sorted from large to small, and the path formed by connecting the nodes in the first place) is proposed as the key failure path.

[0049] From defect type matching to failure mechanism analysis, if the posterior probability of the contact resistance mutation node is 40%, while the posterior probability of the partial discharge-induced dielectric layer damage node is 90%, it indicates that the primary cause of failure is not direct fracture, but secondary discharge damage caused by fracture. Therefore, the critical failure path is corrected to (before correction: critical failure path: electrode fracture → contact resistance mutation → signal transmission anomaly → touch failure) electrode fracture → partial discharge → dielectric layer damage → signal attenuation. By combining evidence nodes with posterior probabilities, secondary interference factors can be eliminated and the accuracy of locating the critical failure path can be improved.

[0050] Furthermore, the critical failure path is written into the failure reminder signal. The method of the present application includes:

[0051] A virtual touch switch color film model containing the critical failure path is set up through digital twins; the virtual touch switch color film model is visually rendered in multiple dimensions; a data interaction channel is established between the virtual touch switch color film model and the test platform, and the critical failure path is uploaded to the virtual touch switch color film model to issue a failure risk warning.

[0052] Specifically, digital twin refers to a virtual model created through digital means that is completely equivalent to a real ultra-thin touch switch color film and can map the state and performance of the physical entity in real time. The virtual touch switch color film model is a three-dimensional virtual body constructed based on digital twin technology, which includes a parametric representation of key failure paths (such as the location and depth of scratches, the numerical change of parasitic capacitance, etc.). Multi-dimensional visual rendering refers to the intuitive display of model status in the form of graphics, animations, data dashboards, etc. from multiple dimensions such as geometric structure (such as film thickness distribution), electrical performance parameters (such as impedance curves), and failure path dynamics (such as interference signal propagation process). The data interaction channel is a real-time data transmission link connecting the virtual model and the test platform, which is used to synchronize test data (such as measured interference intensity and delay) and failure analysis results. Failure risk warning is to simulate the development trend of the failure path through the virtual model and issue warning information in advance.

[0053] Based on the identified critical failure paths (e.g., scratch → increased parasitic capacitance → increased signal interference → touch failure), a virtual touch switch color film model was constructed using CAD software and electromagnetic simulation tools (e.g., HFSS). The scratch's geometric parameters (length 2 mm, depth 5 μm) and corresponding parasitic capacitance value (25 pF higher than the normal area) were precisely set in the virtual touch switch color film model. The virtual touch switch color film model was then visually rendered in multiple dimensions: The geometric dimension used a semi-transparent effect to display the internal structure of the film layer and the scratch location; the electrical performance dimension used a dynamic real-time impedance-frequency curve, with the normal parameter range shaded in blue and abnormal values ​​indicated by a yellow curve; and the failure path dimension used an animation to demonstrate the propagation of the interference signal from the scratch area to the touch electrode, with arrows indicating the direction of energy leakage.

[0054] A data interface is established between the virtual touch switch color film model and the test platform, and the measured electrical performance parameters are synchronized to the virtual touch switch color film model in real time. The virtual touch switch color film model is based on a mathematical model of key failure paths (such as the relationship between scratch depth and parasitic capacitance). The failure risk level is predicted based on historical data. If the current trend continues, the virtual touch switch color film model shows that the probability of touch failure will increase after a preset time period. Multi-dimensional rendering can quickly locate the root cause of failure, and combined with dynamic simulation, failure development trends can be predicted, turning passive maintenance into active prevention.

[0055] Furthermore, the critical failure path is uploaded to the virtual touch switch color film model, and the method of the present application further includes:

[0056] The information of each node in the critical failure path is encoded to form a digital label containing the defect type, location coordinates, and impact degree; the digital label is used for mapping and highlighting in the virtual touch switch color film model; the touch signal and contact force data of the next node are uploaded, and a defect propagation evaluation function is constructed to quantitatively evaluate the impact of the critical failure path on the touch performance of the next node and determine the critical contact force threshold.

[0057] Specifically, the information of each node in the critical failure path refers to the elements of each link that constitutes the failure chain, such as surface scratches (defect type), the upper left corner area of ​​the film layer (position coordinates), and the increase in parasitic capacitance (degree of impact); the digital label is a character string or QR code generated by encoding this information according to specific rules, which contains parameters such as defect type, position coordinates, and degree of impact; mapping and highlighting means that in the virtual model, the defect position and impact corresponding to the digital label are intuitively presented in the form of color flashing, three-dimensional annotation, etc.; the defect propagation evaluation function is used to calculate the quantitative impact of the critical failure path on the touch performance of the next node (such as from increased parasitic capacitance to enhanced signal interference), such as the relationship between interference intensity and contact force is obtained through regression analysis; the critical contact force threshold refers to the minimum contact force value that triggers the next stage of failure. Exceeding this threshold will cause the touch performance to deteriorate significantly.

[0058] Information is encoded for each node in the identified critical failure path (such as electrode fracture → increased contact resistance → signal attenuation); a digital label is generated using the node with increased contact resistance as an example; the digital label is mapped to the three-dimensional structure in the virtual touch switch color film model; through dynamic rendering, when the mouse hovers over the node, the model automatically highlights the impact range of the node on the surrounding circuit (such as the signal attenuation area represented by blue shading), uploads the test data of the next node (such as the touch signal waveform when the contact force gradually increases from 1N to 3N), calls the defect propagation evaluation function (associated with the contact force and the resistance increase ratio), compares the performance impact values ​​under different forces, and determines the critical contact force threshold (such as 2.5N). At this time, the corresponding force adjustment slider in the virtual model automatically marks the warning line and pops up an early warning: exceeding 2.5N will trigger the risk of signal failure.

[0059] In summary, the beneficial effects of the embodiments of the present application are:

[0060] The ultra-thin touch switch color film is set on the test platform, and the basic material parameters are uploaded to the test platform; the test platform configures the electrical performance test parameters based on the basic material parameters; the test platform is connected to the signal generator and oscilloscope; after the test platform is initialized and configured with the electrical performance test parameters, the touch signal and contact force data are introduced; the parasitic capacitance disturbance signal during the electrical performance test is recorded, the frequency component of the parasitic capacitance disturbance signal is decomposed, the disturbance feature vector is extracted, and the time-frequency domain synchronous correlation analysis is performed with the touch signal to determine the signal interference intensity and signal interference delay of the parasitic capacitance disturbance signal on the touch signal; according to the signal interference intensity and signal interference delay, multi-point correlation mapping is performed in combination with the physical defect type, and then the critical failure path is determined through failure mechanism analysis; the critical failure path is written into the failure reminder signal. This application provides a performance testing method and system based on ultra-thin touch switch color film, which realizes the adaptive configuration of electrical performance test parameters driven by material parameters. It can automatically adjust the test parameters according to the characteristics of different color film materials, improve the accuracy and effectiveness of the test, and at the same time, break through the limitations of traditional single-point testing, accurately quantify the signal interference characteristics, deeply understand the signal interference situation, and combine with failure mechanism analysis to quickly locate the root cause of the fault and reduce the probability of failure.

[0061] Example 2

[0062] Based on the same inventive concept as the performance testing method based on the ultra-thin touch switch color film in the above embodiment, Figure 2 As shown, the embodiment of the present application provides a performance testing system based on an ultra-thin touch switch color film, wherein the system includes:

[0063] The performance test module M100 is used to place the ultra-thin touch switch color film on a test platform and upload basic material parameters to the test platform; the test platform configures electrical performance test parameters based on the basic material parameters.

[0064] The initialization configuration module M200 is used to connect the test platform with the signal generator and the oscilloscope; after the test platform is initialized and configured with the electrical performance test parameters, the touch signal and contact force data are introduced.

[0065] The frequency decomposition module M300 is used to record the parasitic capacitance disturbance signal during the electrical performance test, decompose the frequency component of the parasitic capacitance disturbance signal, extract the disturbance feature vector, perform time-frequency domain synchronous correlation analysis with the touch signal, and determine the signal interference intensity and signal interference delay of the parasitic capacitance disturbance signal on the touch signal.

[0066] The failure reminder module M400 is used to perform multi-point correlation mapping based on the signal interference intensity and signal interference delay in combination with the physical defect type, and then determine the critical failure path through failure mechanism analysis; and write the critical failure path into the failure reminder signal.

[0067] Furthermore, the performance test module M100 is used to perform the following method:

[0068] The basic material parameters include film thickness, electrode material, and touch sensing sensitivity, and an equivalent circuit model of the ultra-thin touch switch color film is constructed. Based on the equivalent circuit model of the ultra-thin touch switch color film located on the test platform, the impedance characteristics and capacitive reactance characteristics at different frequencies are obtained. The test voltage range, test current threshold, and frequency scanning interval are determined based on the impedance characteristics and capacitive reactance characteristics at different frequencies, and the electrical performance test parameters are set.

[0069] Furthermore, the frequency decomposition module M300 is used to perform the following method:

[0070] The parasitic capacitance disturbance signal in the time domain is converted into a frequency domain signal using FFT. The frequency domain signal is subjected to multi-layer decomposition to obtain the sub-signal energy distribution of each frequency band, and the energy proportion, center frequency, and bandwidth of each frequency band are extracted as the components of the disturbance feature vector.

[0071] Furthermore, the frequency decomposition module M300 is further configured to perform the following method:

[0072] The touch signal and the disturbance feature vector are converted into a time-frequency image using a short-time Fourier transform; in the time-frequency image, a time-frequency domain synchronization correlation matrix is ​​obtained based on the Pearson correlation coefficient of the time segment-frequency region; and the maximum correlation coefficient value and the correlation coefficient distribution variance are extracted from the time-frequency domain synchronization correlation matrix as quantitative indicators of the signal interference intensity and signal interference delay.

[0073] Furthermore, the failure reminder module M400 is used to execute the following method:

[0074] A defect feature library is established for physical defect types including scratches, bubbles, and electrode breakages, and the parasitic capacitance disturbance features, signal interference intensity features, and signal interference delay features corresponding to each physical defect type are classified and stored. For candidate defect types in the defect feature library, the waveform distortion of the touch signal and the correlation between the contact force values ​​are combined to screen out matching physical defect types and perform multi-point correlation mapping.

[0075] Furthermore, the failure reminder module M400 is further configured to execute the following method:

[0076] According to the quantitative indicators of the signal interference intensity and the signal interference delay, and the parasitic capacitance disturbance characteristics, a test feature vector is configured; according to the cosine similarity between the test feature vector and the feature vectors of various physical defect types in the defect feature library, a similarity threshold is set;

[0077] Various physical defect types in the defect feature library are traversed, and one or more physical defect types whose feature vector cosine similarity is greater than a similarity threshold are marked as candidate defect types.

[0078] Furthermore, the failure reminder module M400 is further configured to execute the following method:

[0079] Based on the matching physical defect types corresponding to the multi-point association mapping, a defect propagation path model is constructed; the electrical performance test parameters are used as evidence nodes of the defect propagation path model; and the critical failure path is formulated based on the analysis of the posterior probability of the defect propagation nodes corresponding to the matching physical defect types.

[0080] Furthermore, the failure reminder module M400 is further configured to execute the following method:

[0081] A virtual touch switch color film model containing the critical failure path is set up through digital twins; the virtual touch switch color film model is visually rendered in multiple dimensions; a data interaction channel is established between the virtual touch switch color film model and the test platform, and the critical failure path is uploaded to the virtual touch switch color film model to issue a failure risk warning.

[0082] Furthermore, the failure reminder module M400 is further configured to execute the following method:

[0083] The information of each node in the critical failure path is encoded to form a digital label containing the defect type, location coordinates, and impact degree; the digital label is used for mapping and highlighting in the virtual touch switch color film model; the touch signal and contact force data of the next node are uploaded, and a defect propagation evaluation function is constructed to quantitatively evaluate the impact of the critical failure path on the touch performance of the next node and determine the critical contact force threshold.

[0084] In summary, any step can be stored as a computer instruction or program in an unlimited computer memory and can be called and recognized by an unlimited computer processor, without any unnecessary restrictions.

[0085] Furthermore, the above technical solution only reflects the preferred technical solution of the technical solution of the embodiment of the present application. Some changes that may be made to certain parts thereof by technical personnel in this technical field all reflect the novel principles of the embodiment of the present application. Obviously, technical personnel in this field can make various changes and modifications to the present application without departing from the scope of the present application.

Claims

1. The performance test method based on ultra-thin touch switch color film is characterized in that: The method comprises: The ultra-thin touch switch color film is placed on a test platform, and basic material parameters are uploaded to the test platform; the test platform configures electrical performance test parameters based on the basic material parameters; The test platform is connected to a signal generator and an oscilloscope; after the test platform is initialized and configured with the electrical performance test parameters, touch signals and contact force data are introduced; Recording a parasitic capacitance disturbance signal during an electrical performance test, decomposing the frequency component of the parasitic capacitance disturbance signal, extracting a disturbance feature vector, and performing time-frequency domain synchronous correlation analysis with the touch signal to determine the signal interference intensity and signal interference delay of the parasitic capacitance disturbance signal on the touch signal; According to the signal interference intensity and signal interference delay, multi-point correlation mapping is performed in combination with the physical defect type, and then the critical failure path is determined through failure mechanism analysis; the critical failure path is written into the failure reminder signal.

2. The performance testing method based on the ultra-thin touch switch color film according to claim 1, characterized in that: The basic material parameters include film thickness, electrode material, and touch sensing sensitivity, and an equivalent circuit model of the ultra-thin touch switch color film is constructed; Obtaining impedance characteristics and capacitive reactance characteristics at different frequencies according to an equivalent circuit model of the ultra-thin touch switch color film located on the test platform; The test voltage range, test current threshold and frequency scanning interval are determined by the impedance characteristics and capacitive reactance characteristics at different frequencies, and the electrical performance test parameters are set.

3. The performance testing method based on the ultra-thin touch switch color film according to claim 1, characterized in that: Recording a parasitic capacitance disturbance signal during an electrical performance test, decomposing the frequency component of the parasitic capacitance disturbance signal, and extracting a disturbance feature vector, the method comprising: Use FFT to convert the parasitic capacitance disturbance signal in the time domain into a frequency domain signal; The frequency domain signal is subjected to multi-layer decomposition to obtain the sub-signal energy distribution of each frequency band, and the energy proportion, center frequency, and bandwidth of each frequency band are extracted as components of the disturbance feature vector.

4. The performance testing method based on the ultra-thin touch switch color film according to claim 3, characterized in that: Extracting a disturbance feature vector, performing time-frequency domain synchronous correlation analysis with the touch signal, and determining the signal interference intensity and signal interference delay of the parasitic capacitance disturbance signal on the touch signal, the method includes: Converting the touch signal and the disturbance feature vector into a time-frequency image using short-time Fourier transform; In the time-frequency image, a time-frequency domain synchronization correlation matrix is ​​obtained according to the Pearson correlation coefficient of the time segment-frequency region; The maximum correlation coefficient value and the correlation coefficient distribution variance are extracted from the time-frequency domain synchronization correlation matrix as quantitative indicators of the signal interference intensity and the signal interference delay.

5. The performance testing method based on the ultra-thin touch switch color film according to claim 4, characterized in that: According to the signal interference intensity and signal interference delay, multi-point correlation mapping is performed in combination with the physical defect type, and the method includes: Establish a defect feature library for physical defect types including scratches, bubbles, and electrode fractures, and classify and store the parasitic capacitance disturbance features, signal interference intensity features, and signal interference delay features corresponding to each physical defect type; For the candidate defect types in the defect feature library, the waveform distortion of the touch signal and the correlation of the contact force are combined to screen out matching physical defect types and perform multi-point correlation mapping.

6. The performance testing method based on the ultra-thin touch switch color film according to claim 5, characterized in that: For the candidate defect types in the defect feature library, the method includes: Configuring a test feature vector according to the quantitative indicators of the signal interference intensity and the signal interference delay, and the parasitic capacitance disturbance characteristics; Setting a similarity threshold based on the cosine similarity between the test feature vector and the feature vectors of various physical defect types in the defect feature library; Various physical defect types in the defect feature library are traversed, and one or more physical defect types whose feature vector cosine similarity is greater than a similarity threshold are marked as candidate defect types.

7. The performance testing method based on the ultra-thin touch switch color film according to claim 5, characterized in that: Determining the critical failure path through failure mechanism analysis, the method comprising: Constructing a defect propagation path model based on the matching physical defect types corresponding to the multi-point association mapping; using the electrical performance test parameters as evidence nodes of the defect propagation path model; The critical failure path is formulated based on analyzing the posterior probability of the defect propagation node corresponding to the matching physical defect type.

8. The performance testing method based on the ultra-thin touch switch color film according to claim 1, characterized in that: Writing the critical failure path into a failure reminder signal, the method comprising: Setting a virtual touch switch color film model including the critical failure path through digital twins; performing multi-dimensional visual rendering on the virtual touch switch color film model; A data interaction channel is established between the virtual touch switch color film model and the test platform, and the critical failure path is uploaded to the virtual touch switch color film model to perform failure risk warning.

9. The performance testing method based on the ultra-thin touch switch color film according to claim 8, characterized in that: Uploading the critical failure path to the virtual touch switch color film model, the method further includes: Encoding the information of each node in the critical failure path to form a digital label containing the defect type, location coordinates, and impact degree; In the virtual touch switch color film model, the digital label is used for mapping and highlighting; Upload the touch signal and contact force data of the next node, construct a defect propagation evaluation function, quantitatively evaluate the impact of the critical failure path on the touch performance of the next node, and determine the critical contact force threshold.

10. The performance test system based on ultra-thin touch switch color film is characterized by: A system for implementing the performance testing method based on the ultra-thin touch switch color film according to any one of claims 1 to 9, comprising: The performance test module is used to place the ultra-thin touch switch color film on a test platform and upload basic material parameters to the test platform; the test platform configures electrical performance test parameters based on the basic material parameters. The initialization configuration module is used to connect the test platform with the signal generator and the oscilloscope; after the test platform is initialized and configured with the electrical performance test parameters, the touch signal and contact force data are introduced. The frequency decomposition module is used to record the parasitic capacitance disturbance signal during the electrical performance test, decompose the frequency component of the parasitic capacitance disturbance signal, extract the disturbance feature vector, perform time-frequency domain synchronous correlation analysis with the touch signal, and determine the signal interference intensity and signal interference delay of the parasitic capacitance disturbance signal on the touch signal. The failure reminder module is used to perform multi-point correlation mapping based on the signal interference intensity and signal interference delay in combination with the physical defect type, and then determine the critical failure path through failure mechanism analysis; and write the critical failure path into the failure reminder signal.

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