Optical engine and optical module based on silicon optical chip

Abstract

The invention discloses an optical engine and an optical module based on a silicon optical chip. The optical engine comprises a PCB (Printed Circuit Board); the optical assembly substrate is arranged on the PCB; the optical transmitting assembly is arranged on the optical assembly substrate, the optical transmitting assembly comprises a COC, a transmitting end silicon optical chip and a transmitting end optical fiber array unit which are sequentially arranged along an optical path, the COC is used for generating signal light, the signal light is coupled to enter an optical inlet waveguide of the transmitting end silicon optical chip, and the transmitting end optical fiber array unit is coupled with an optical outlet waveguide of the transmitting end silicon optical chip; the optical receiving assembly is arranged on the optical assembly substrate, the optical receiving assembly comprises a receiving end optical fiber array unit and a receiving end silicon optical chip which are sequentially arranged along an optical path, and the receiving end optical fiber array unit is coupled with an incident waveguide of the receiving end silicon optical chip; and the connector is connected with the transmitting end optical fiber array unit and the receiving end optical fiber array unit. The number of used optical elements is reduced, the structural layout of the optical assembly is optimized, and therefore the technological process of the optical assembly is effectively simplified.

Description

Technical Field

[0001] The present invention belongs to the field of optical communication technology, and in particular relates to an optical engine and an optical module based on a silicon photonic chip. Background Art

[0002] As telecommunications, big data, and cloud computing evolve toward higher speeds and larger capacities, demand for multi-channel, parallel, high-speed optical modules is rapidly increasing. Currently, the widely used parallel multi-channel EML (Electro-Absorption Modulated Laser) solutions on the transmitter side and discrete PD solutions on the receiver side occupy large space, have complex coupling processes, and consume high device power. Summary of the Invention

[0003] The purpose of the present invention is to provide an optical engine and optical module based on silicon photonic chips to solve the problems of high material cost, large space occupied by optical components, and complicated packaging process in the parallel multi-channel EML solution at the transmitting end and the discrete PD solution at the receiving end.

[0004] In order to achieve the above objectives, the technical solution adopted by the present invention is: In a first aspect, the present invention provides a light engine based on a silicon photonic chip, the light engine comprising: PCB board; The optical component substrate is arranged on the PCB board; The optical transmitter assembly is provided on the optical module substrate. The optical transmitter assembly includes a COC, a transmitting silicon photonic chip, and a transmitting fiber array unit arranged in sequence along the optical path. The COC is used to generate signal light, which is coupled into the input waveguide of the transmitting silicon photonic chip. The transmitting fiber array unit is coupled to the output waveguide of the transmitting silicon photonic chip. An optical receiving assembly is provided on the optical assembly substrate, and the optical receiving assembly includes a receiving end optical fiber array unit and a receiving end silicon photonic chip arranged in sequence along the optical path, wherein the receiving end optical fiber array unit is coupled to the light input waveguide of the receiving end silicon photonic chip; The connector is connected to the transmitting end optical fiber array unit and the receiving end optical fiber array unit.

[0005] In some embodiments, the optical transmission component also includes a first-stage lens and a second-stage lens, which are sequentially arranged in the optical path between the COC and the transmitting end silicon photonic chip, and are used to collimate and focus the signal light so that the signal light is coupled into the optical input waveguide of the transmitting end silicon photonic chip.

[0006] In some embodiments, the light emitting assembly further includes an isolator, which is disposed between the first-stage lens and the second-stage lens to isolate the reflected light.

[0007] In some embodiments, the optical transmitter component further includes a first transmitter substrate and a second transmitter substrate, both of which are arranged on the optical component substrate, the COC, the first-stage lens, the isolator and the second-stage lens are all mounted on the first transmitter substrate, and the transmitter silicon photonic chip is mounted on the second transmitter substrate.

[0008] In some embodiments, the number of channels of the COC is single-channel or multi-channel, and the number of channels is selected and set according to the optical port application of the silicon photonic chip at the transmitting end.

[0009] In some embodiments, a prism is provided in front of the light input waveguide of the silicon photonic chip at the transmitting end, so as to adjust the incident angle of the signal light so as to match the incident angle of the light input waveguide of the silicon photonic chip at the transmitting end.

[0010] In some embodiments, the optical receiving component further includes a first receiving end substrate and a second receiving end substrate, both of which are arranged on the optical component substrate, the receiving end optical fiber array unit is mounted on the second receiving end substrate, and the receiving end silicon photonic chip is mounted on the first receiving end substrate.

[0011] In some embodiments, the coupling end faces of the transmitting end fiber array unit and the output waveguide of the transmitting end silicon photonic chip, and the coupling end faces of the receiving end fiber array unit and the input waveguide of the receiving end silicon photonic chip are both filled with refractive index matching liquid.

[0012] In some embodiments, the PCB board is provided with a slot, and the optical component substrate is bonded to the slot of the PCB board for accommodating the optical transmitting component and the optical receiving component.

[0013] In a second aspect, the present invention provides an optical module based on a silicon photonic chip, which includes the optical engine, optical module base, optical module cover and optical module pull ring described in any one of the first aspects; wherein the optical module base and the optical module cover encapsulate the optical engine, and the optical module pull ring is used to unlock / lock the optical module.

[0014] In general, the above technical solutions conceived by the present invention can achieve the following beneficial effects compared with the prior art: The present invention provides an optical engine based on silicon photonic chips. Both the optical emitting component and the optical receiving component of the optical engine adopt a packaging solution based on silicon photonic chips, and the optical emitting component and the optical receiving component are arranged on the same optical component substrate, thereby reducing the number of optical components such as COC, lenses, and isolators used, optimizing the structural layout of the optical component, and effectively simplifying the process flow of patching, coupling, etc. of the optical component.

[0015] Furthermore, a prism is provided in front of the optical waveguide of the silicon photonic chip at the transmitting end to adjust the incident angle of the signal light, so that the incident angle of the signal light can match the incident angle of the optical waveguide of the silicon photonic chip at the transmitting end.

[0016] Furthermore, the number of channels of COC can be selected as single-channel or multi-channel according to the actual optical port application of the silicon photonic chip at the transmitting end; the isolator arranged between the first-stage lens and the second-stage lens can isolate the reflected light to ensure the quality of the incident signal light; the coupling end face of the optical fiber array unit at the transmitting end and the output waveguide of the silicon photonic chip at the transmitting end, and the coupling end face of the optical fiber array unit at the receiving end and the input waveguide of the silicon photonic chip at the receiving end are both filled with refractive index matching liquid, which can improve mode field matching and increase coupling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a light engine based on a silicon photonic chip provided by an embodiment of the present invention; Figure 2 A schematic diagram of a light engine based on a silicon photonic chip from another angle provided by an embodiment of the present invention; Figure 3 A schematic diagram of an optical component of an optical engine based on a silicon photonic chip provided by an embodiment of the present invention; Figure 4 A schematic diagram of another optical component of a light engine based on a silicon photonic chip provided by an embodiment of the present invention; Figure 5 A schematic diagram of the packaging of an optical module based on a silicon photonic chip provided in an embodiment of the present invention.

[0018] In the figure: 10, optical engine; 20, optical module cover; 30, optical module base; 40, optical module pull ring; 100, PCB board; 110, connector; 120, optical component substrate; 200, optical transmitting component; 210, COC; 220, first-stage lens; 230, isolator; 240, second-stage lens; 250, transmitting end silicon photonic chip; 260, transmitting end fiber array unit; 270, transmitting end first substrate; 280, transmitting end second substrate; 290, prism; 300, optical receiving component; 310, receiving end silicon photonic chip; 320, receiving end fiber array unit; 330, receiving end first substrate; 340, receiving end second substrate. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Based on the embodiments provided by the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of the present invention.

[0020] Obviously, the drawings described below are merely examples or embodiments of the present invention. Those skilled in the art can apply the present invention to other similar scenarios based on these drawings without inventive effort. Furthermore, it is understood that while the effort involved in such a development process may be complex and lengthy, for those skilled in the art related to the disclosure of the present invention, any design, manufacturing, or production changes based on the technical content disclosed in the present invention are merely conventional technical means and should not be construed as an inadequacy of the disclosure of the present invention.

[0021] References to "embodiments" in this disclosure mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the disclosure. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described in this disclosure may be combined with other embodiments, unless there is a conflict.

[0022] Unless otherwise defined, technical or scientific terms used in this disclosure shall have the ordinary meaning as understood by persons of ordinary skill in the art to which this disclosure pertains. As used herein, the terms "a," "an," "an," "the," and similar expressions do not denote limitations on quantity and may refer to either the singular or the plural. As used herein, the terms "comprise," "include," "have," and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or modules (units) is not limited to the listed steps or units but may also include steps or units not listed, or may include other steps or units inherent to the process, method, product, or apparatus. As used herein, the terms "connect," "connected," "coupled," and similar expressions are not limited to physical or mechanical connections but may include electrical connections, whether direct or indirect. As used herein, the term "plurality" means two or more. "And / or" describes an association between associated objects, indicating that three possible relationships exist. For example, "A and / or B" may represent: A exists alone; A and B exist simultaneously; or B exists alone. The character " / " generally indicates that the objects in the preceding and following relationship are in an "or" relationship. The terms "first", "second", "third", etc. involved in the present invention are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0023] The present invention provides an optical engine and optical module based on silicon photonic chips. It adopts an optical component packaging solution of all silicon photonic chips, optimizes the structural layout of the optical components, simplifies the process flow of the optical components, and uses the same optical component substrate for the light-emitting and receiving components. The consistency of the same process flow is high, making manufacturing more convenient.

[0024] like Figure 1 、 Figure 2 and Figure 5 As shown, the optical module based on silicon photonic chips provided in an embodiment of the present invention includes an optical engine 10, an optical module cover 20, an optical module base 30, and an optical module pull ring 40. The optical engine 10 is the core functional component, which is encapsulated and fixed by the optical module cover 20 and the optical module base 30. The optical module pull ring 40 is set at the end of the optical module and is used for unlocking / locking the optical module.

[0025] like Figure 1 and Figure 2As shown, the core structure of the light engine 10 includes a PCB 100, an optical component substrate 120, an optical transmitter 200, an optical receiver 300, and a connector 110. PCB 100 has a slot into which optical component substrate 120 is bonded, accommodating optical transmitter 200 and optical receiver 300. Connector 110, located at the end of PCB 100, connects to optical transmitter 200 and optical receiver 300 for external transmission of optical signals.

[0026] In some embodiments, the optical transmission component 200 is used to generate and output a modulated optical signal, such as Figure 3 As shown, it includes a COC 210, a first-stage lens 220, an isolator 230, a second-stage lens 240, a transmitter silicon photonic chip 250, a transmitter fiber array unit 260, a transmitter first substrate 270, and a transmitter second substrate 280. The transmitter first substrate 270 and the transmitter second substrate 280 are bonded to the optical component substrate 120 and are used to accommodate other components of the optical transmitter assembly 200. The COC 210, the first-stage lens 220, the isolator 230, and the second-stage lens 240 are sequentially mounted on the preset optical path of the transmitter first substrate 270. The transmitter silicon photonic chip 250 is mounted on the transmitter second substrate 280, with its input optical waveguide aligned with the light output direction of the second-stage lens 240.

[0027] In this embodiment, a chip on carrier (COC) (primarily comprising a spacer and laser) generates signal light. A first-stage lens 220 (primarily for signal light collimation) and a second-stage lens 240 (primarily for focusing the collimated signal light) collimate and focus the signal light, coupling it into the input waveguide of the transmitting silicon photonics chip 250. An isolator 230, positioned between the two lenses in the optical path, isolates the reflected light. The signal light emerges from the output waveguide of the transmitting silicon photonics chip 250 and is directly coupled to the transmitting fiber array unit 260. Refractive index matching fluid can be added to the end face to improve mode field matching and increase coupling efficiency.

[0028] In this embodiment, the signal light generated by the COC 210 is collimated by the first-stage lens 220, focused by the isolator 230, and the second-stage lens 240, and is incident on the input waveguide of the transmitting silicon photonic chip 250; after being modulated by the transmitting silicon photonic chip 250, the signal light is emitted from the output waveguide of the transmitting silicon photonic chip 250, and finally transmitted to the connector 110 through the transmitting optical fiber array unit 260.

[0029] In other embodiments, the angle at which the signal light in the optical transmitting assembly 200 enters the optical waveguide of the transmitting end silicon photonic chip 250 can be adjusted according to the structural design, and a prism 290 having a refraction angle matching the incident angle of the incident light signal is provided in front of the optical waveguide of the transmitting end silicon photonic chip 250, preferably a turning prism, such as Figure 4 As shown, the incident angle of the signal light is adjusted to match the incident angle of the light input waveguide of the silicon photonic chip 250 at the transmitting end.

[0030] In this embodiment, the signal light generated by the COC 210 is collimated by the first-stage lens 220, focused by the isolator 230, focused by the second-stage lens 240, and adjusted in angle by the prism 290, and then incident on the input waveguide of the transmitting silicon photonic chip 250; the signal light is modulated by the transmitting silicon photonic chip 250, emitted from the output waveguide of the transmitting silicon photonic chip 250, and finally transmitted to the connector 110 through the transmitting optical fiber array unit 260.

[0031] It should be noted that the number of channels of COC 210 can be selected as single-channel or multi-channel according to the actual optical port application of the silicon photonic chip. Figure 3 and Figure 4 That is a schematic diagram of a multi-channel parallel optical engine and optical module provided by an embodiment of the present invention.

[0032] In some embodiments, the optical receiving component 300 is used to receive external optical signals and convert them into electrical signals. Figure 3 and Figure 4 As shown, it includes a receiving fiber array unit 320, a receiving silicon photonic chip 310, a first receiving substrate 330, and a second receiving substrate 340. The first receiving substrate 330 and the second receiving substrate 340 are bonded to the optical component substrate 120. The receiving fiber array unit 320 is mounted on the second receiving substrate 340, with its input end connected to the connector 110. The receiving silicon photonic chip 310 is mounted on the first receiving substrate 330, with its input waveguide aligned with the output end face of the receiving fiber array unit 320. The received signal light is directly coupled from the receiving fiber array unit 320 into the input waveguide of the receiving silicon photonic chip 310. Refractive index matching fluid can be added to the end face to improve mode field matching and increase coupling efficiency. The receiving silicon photonic chip 310 can integrate components such as a PD and a TIA (transimpedance amplifier).

[0033] In this embodiment, the external optical signal is transmitted to the receiving-end optical fiber array unit 320 via the connector 110 , and the optical signal is distributed to the optical input waveguide of the receiving-end silicon photonic chip 310 through the optical fiber array.

[0034] In the present invention, the optical component substrate 120 is generally made of metal. The portion of the optical component substrate 120 housing the optical transmitter 200 is bonded to the first transmitter substrate 270 and the second transmitter substrate 280. The portion of the optical component substrate 120 housing the optical receiver 300 is bonded to the first receiver substrate 330 and the second receiver substrate 340. These four substrates are mounted on the optical component substrate 120 for mounting various optical components. These substrates are generally made of ceramic and serve to support and elevate the optical components, ensure consistent optical axis height, and aid in heat dissipation.

[0035] In summary, the present invention provides an optical engine and optical module based on a silicon photonic chip. The optical module includes an optical engine, an optical module cover, an optical module base, and an optical module pull ring. The optical engine includes a PCB, an optical component substrate, an optical transmitter component, an optical receiver component, and a connector. The optical transmitter component may include a first transmitter substrate, a second transmitter substrate, a COC, a first-stage lens, an isolator, a second-stage lens, a transmitter silicon photonic chip, a prism, and a transmitter fiber array unit. The optical receiver component may include a first receiver substrate, a second receiver substrate, a receiver fiber array unit, and a receiver silicon photonic chip.

[0036] The present invention adopts a packaging solution based on silicon photonic chips in both the optical transmitting component and the optical receiving component, and sets the receiving and emitting components on the same optical component substrate, reducing the number of optical components such as COC, lenses, and isolators, optimizing the structural layout of the optical component, thereby effectively simplifying the patch, coupling and other process flows of the optical component; and a prism is mounted at the optical input waveguide of the silicon photonic chip at the transmitting end, which can adapt to different incident light angles.

[0037] It should be pointed out that, according to the needs of implementation, the various steps / components described in the present invention can be split into more steps / components, or two or more steps / components or partial operations of steps / components can be combined into new steps / components to achieve the purpose of the present invention.

[0038] It will be easily understood by those skilled in the art that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A light engine based on a silicon photonic chip, characterized in that: The light engine includes: PCB board; The optical component substrate is arranged on the PCB board; The optical transmitter assembly is provided on the optical module substrate. The optical transmitter assembly includes a COC, a transmitting silicon photonic chip, and a transmitting fiber array unit arranged in sequence along the optical path. The COC is used to generate signal light, which is coupled into the input waveguide of the transmitting silicon photonic chip. The transmitting fiber array unit is coupled to the output waveguide of the transmitting silicon photonic chip. An optical receiving assembly is provided on the optical assembly substrate, and the optical receiving assembly includes a receiving end optical fiber array unit and a receiving end silicon photonic chip arranged in sequence along the optical path, wherein the receiving end optical fiber array unit is coupled to the light input waveguide of the receiving end silicon photonic chip; The connector is connected to the transmitting end optical fiber array unit and the receiving end optical fiber array unit.

2. The light engine based on silicon photonic chip according to claim 1, characterized in that: The optical transmission component also includes a first-stage lens and a second-stage lens, which are sequentially arranged on the optical path between the COC and the transmitting end silicon photonic chip to collimate and focus the signal light so that the signal light is coupled into the optical input waveguide of the transmitting end silicon photonic chip.

3. The light engine based on silicon photonic chip according to claim 2, characterized in that: The optical transmission assembly further includes an isolator, which is arranged between the first-stage lens and the second-stage lens.

4. The light engine based on silicon photonic chip according to claim 3, characterized in that: The optical transmission component also includes a first transmitting end substrate and a second transmitting end substrate. The first transmitting end substrate and the second transmitting end substrate are both arranged on the optical component substrate. The COC, the first-stage lens, the isolator and the second-stage lens are all mounted on the first transmitting end substrate, and the transmitting end silicon photonic chip is mounted on the second transmitting end substrate.

5. The light engine based on silicon photonic chip according to any one of claims 1 to 4, characterized in that: The number of channels of COC is single-channel or multi-channel, and the number of channels is selected and set according to the optical port application of the silicon photonic chip at the transmitting end.

6. The light engine based on silicon photonic chip according to any one of claims 1 to 4, characterized in that: A prism is set in front of the optical waveguide of the silicon photonic chip at the transmitting end to adjust the incident angle of the signal light so that it matches the incident angle of the optical waveguide of the silicon photonic chip at the transmitting end.

7. The light engine based on silicon photonic chip according to claim 1, characterized in that: The optical receiving component also includes a first receiving end substrate and a second receiving end substrate. Both the first receiving end substrate and the second receiving end substrate are arranged on the optical component substrate. The receiving end optical fiber array unit is mounted on the second receiving end substrate, and the receiving end silicon photonic chip is mounted on the first receiving end substrate.

8. The light engine based on silicon photonic chip according to claim 1, characterized in that: The coupling end faces of the optical fiber array unit at the transmitting end and the optical waveguide of the silicon photonic chip at the transmitting end, and the coupling end faces of the optical fiber array unit at the receiving end and the optical waveguide of the silicon photonic chip at the receiving end are both filled with refractive index matching liquid.

9. The light engine based on silicon photonic chip according to claim 1, characterized in that: The PCB board is provided with a slot, and the optical component substrate is bonded to the slot of the PCB board for accommodating the optical transmitting component and the optical receiving component.

10. An optical module based on a silicon photonic chip, characterized in that: The optical module comprises the optical engine according to any one of claims 1 to 9, an optical module base, an optical module cover, and an optical module pull ring; wherein the optical module base and the optical module cover encapsulate the optical engine, and the optical module pull ring is used to unlock / lock the optical module.

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