Staggered jet flow micro-channel heat dissipation device

Abstract

The invention relates to a staggered jet flow micro-channel heat dissipation device which comprises a cover plate layer, a manifold layer, a jet flow layer and a micro-channel layer which are stacked in sequence, a fluid inlet and a fluid outlet are formed in the cover plate layer, the manifold layer is used for shunting fluid at the fluid inlet, jet flow holes and backflow holes which are distributed in an array mode are formed in the jet flow layer, and the micro-channel layer is used for cooling the fluid at the fluid outlet. The jet flow holes and the backflow holes are distributed in a staggered mode, heat dissipation grooves are formed in the micro-channel layer, columnar pin fins distributed in an array mode are arranged in the heat dissipation grooves, pin fin micro-channels are formed, and the axial direction of the columnar pin fins is parallel to the jet flow direction of the jet flow holes. Fluid ejected out of the jet flow holes absorbs heat, boils in the pin-fin micro-channels and transversely flows, and based on staggered distribution of the jet flow holes and the backflow holes, the transversely-flowing fluid in the pin-fin micro-channels is in staggered reverse flow and flows to the fluid outlet through the backflow holes. Compared with the prior art, the temperature uniformity of a heat dissipation object is improved, generation of local hot spots is effectively restrained, and the heat exchange efficiency is greatly improved.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a staggered jet microchannel heat dissipation device. Background Art

[0002] As the performance of electronic devices continues to improve and their structures become increasingly compact, the heat generated during operation increases exponentially, reaching as high as 10 7 W / cm 2 Heat accumulation can reduce the performance and stability of electronic components. Therefore, efficiently removing heat from electronic components has become a key research issue. Microchannel heat exchangers, with their high heat transfer efficiency and compact structure, are expected to provide a solution to the high heat flux heat dissipation problem of electronic devices.

[0003] For example, the invention with publication number CN109524376A discloses a multi-branch jet microchannel chip liquid cooling heat dissipation device, including a cooling liquid inlet pipe, a cooling liquid outlet pipe and a multi-branch jet microchannel cavity. The cooling liquid inlet pipe and the cooling liquid outlet pipe are installed on the multi-branch jet microchannel cavity. The multi-branch jet microchannel cavity is a tight whole formed by stacking and bonding the inlet and outlet layer, the recovery layer, the recovery hole layer, the jet nozzle layer and the microchannel layer in sequence. The cooling liquid inlet pipe is arranged on the inlet and outlet layer and is connected with the jet nozzle layer. The cooling liquid enters the microchannel layer through the jet nozzle layer. The cooling liquid outlet pipe is arranged on the inlet and outlet layer and is connected with the recovery layer. The cooling liquid that absorbs heat is discharged from the microchannel layer through the jet nozzle layer, the recovery hole layer and the recovery layer in sequence from the cooling liquid outlet pipe.

[0004] However, most of the above-mentioned existing microchannel cooling solutions adopt the traditional parallel microchannel structure for surface heat sources. This structure cannot solve the problem of high-intensity point heat source distribution in wide bandgap power devices. In addition, due to the layout of the main channel being perpendicular to the direction of heat flow, the flow-heat synergy in the channel is poor, which can easily trigger unstable phase transitions and cause serious problems such as premature critical boiling crisis. Summary of the Invention

[0005] The purpose of the present invention is to provide a staggered jet microchannel heat dissipation device to overcome the defects of the above-mentioned prior art that adopts a parallel microchannel structure, cannot solve the problem of high-intensity point heat source distribution of wide bandgap power devices, and the main channel is perpendicular to the direction of heat flow, resulting in poor flow-heat synergy in the channel, which is very easy to trigger unstable phase change and thus cause the critical boiling crisis to come early.

[0006] The purpose of the present invention can be achieved by the following technical solutions:

[0007] A staggered jet microchannel heat dissipation device comprises a cover layer, a manifold layer, a jet layer and a microchannel layer stacked in sequence, wherein the cover layer is provided with a fluid inlet and a fluid outlet, and the manifold layer is used to divert the fluid at the fluid inlet.

[0008] The jet layer is provided with an array of jet holes and return holes, and the jet holes and return holes are staggered. The microchannel layer is provided with a heat dissipation groove, and the heat dissipation groove is provided with an array of columnar pin fins to form a pin fin microchannel. The axial direction of the columnar pin fin is parallel to the jet direction of the jet hole.

[0009] The fluid ejected from the jet holes absorbs heat, boils and flows transversely in the pin-fin microchannel. Based on the staggered distribution of the jet holes and the reflux holes, the transversely flowing fluid in the pin-fin microchannel presents a staggered countercurrent and flows to the fluid outlet through the reflux holes.

[0010] Preferably, the columnar pin fins are distributed in the heat dissipation slot in a rectangular array, the columnar pin fins are cylindrical structures, and the columnar pin fins are evenly distributed.

[0011] Preferably, the spacing between adjacent cylindrical pin fins is equal to the diameter of the cylindrical pin fins.

[0012] Preferably, the height of the columnar pin fins is equal to the depth of the heat dissipation slots, and the diameter of the columnar pin fins is in the range of 50-100 microns.

[0013] Preferably, a return port and an inlet collecting groove are provided on the manifold layer, the return port is connected to the fluid outlet, the inlet collecting groove is connected to the fluid inlet, and a diversion hole is provided in the inlet collecting groove, and the diversion hole corresponds one-to-one to the jet holes on the jet layer for diverting the fluid.

[0014] Preferably, an outlet manifold is provided on the jet layer, the jet holes and the return holes are located in the outlet manifold, and the outlet manifold is connected to the return port.

[0015] Preferably, the reflux hole is formed by opening a through hole at the bottom of the outlet manifold, and the jet hole is formed by a guide tube penetrating the jet layer, and the upper surface of the guide tube is flush with the upper surface of the jet layer.

[0016] Preferably, the jet holes and the reflow holes are distributed in a rectangular array, and the jet holes and the reflow holes in the same column or row are distributed alternately.

[0017] Preferably, the cover layer and the fluidic layer are made of glass material, the manifold layer is made of PDMS material, and the microchannel layer is made of silicon material. The cover layer, the manifold layer, the fluidic layer and the microchannel layer are bonded in sequence from top to bottom.

[0018] Preferably, the manifold layer is connected to the cover plate layer and the fluidic layer respectively through a plasma bonding process, and the microchannel layer is connected to the fluidic layer through an anodic bonding process.

[0019] Compared with the existing technology, the present invention has the following advantages:

[0020] 1. This solution incorporates heat sinks on the microchannel layer and an array of columnar pin fins within the heat sinks. The axial direction of the columnar pin fins is parallel to the jet direction, allowing the cooling fluid to enter the heat sink vertically and then undergo a lateral flow process within the microchannel, allowing for full development of fluid boiling. Compared to jet impact in parallel flow channels, this overcomes the problem of insufficient boiling in conventional jet structures. Furthermore, by staggering the jet holes and return holes, the crossflow within the microchannel exhibits staggered countercurrent characteristics, improving the temperature uniformity of the heat sink and effectively suppressing the generation of local hot spots. The structural coordination of the jet layer and the microchannel layer can effectively enhance the heat dissipation efficiency of the radiator.

[0021] 2. This scheme adopts a pin-fin microchannel structure. Compared with conventional straight microchannels, the layout of the fluid path in the jet structure is parallel to the heat flow direction, which effectively enhances the flow-heat synergy in the microchannel and greatly improves the heat exchange efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic structural diagram of the staggered jet microchannel heat dissipation device provided by the present invention;

[0023] Figure 2 A schematic structural diagram of the cover layer provided by the present invention;

[0024] Figure 3 A schematic structural diagram of the manifold layer provided by the present invention;

[0025] Figure 4 A schematic structural diagram of the jet layer provided by the present invention;

[0026] Figure 5 A schematic structural diagram of the microchannel layer provided by the present invention;

[0027] Figure 6 A schematic diagram of the distribution structure of the jet holes and the return holes provided by the present invention;

[0028] Figure 7 A comparison diagram of the distribution principles of the jet and heat flow directions of the pin-fin microchannel (b) and the straight microchannel (a) provided by the present invention.

[0029] In the figure: 1, cover layer, 2, manifold layer, 3, jet layer, 4, microchannel layer, 5, fluid inlet, 6, fluid outlet, 7, inlet collecting groove, 8, diversion hole, 9, return port, 10, jet hole, 11, return hole, 12, outlet collecting groove, 13, pin-fin microchannel, 14, radiator bottom, 15, heat dissipation groove, 16, columnar pin fin. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0033] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting the present invention.

[0034] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0035] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0036] Example 1

[0037] like Figures 1 to 5 As shown, this embodiment provides a staggered jet microchannel heat dissipation device, comprising a cover layer 1, a manifold layer 2, a jet layer 3, and a microchannel layer 4 stacked in sequence. The cover layer 1 is provided with a fluid inlet 5 and a fluid outlet 6. The manifold layer 2 is used to divert the fluid inlet 5.

[0038] The jet layer 3 is provided with an array of jet holes 10 and return holes 11, which are staggered. The microchannel layer 4 is provided with a heat dissipation groove 15, and the heat dissipation groove 15 is provided with an array of columnar pin fins 16, which form a pin fin microchannel 13. The axial direction of the columnar pin fins 16 is parallel to the jet direction of the jet hole 10.

[0039] The fluid ejected from the jet hole 10 absorbs heat, boils and flows transversely in the pin-fin microchannel 13. Based on the staggered distribution of the jet hole 10 and the reflux hole 11, the transversely flowing fluid in the pin-fin microchannel 13 presents a staggered countercurrent and flows to the fluid outlet 6 through the reflux hole 11.

[0040] By providing heat sinks on the microchannel layer and arranging an array of cylindrical pin fins within them, with the axial direction of the pin fins parallel to the jet direction, the cooling fluid, after vertically injecting into the heat sink, undergoes a lateral flow process within the microchannels, allowing for full boiling of the fluid. This overcomes the problem of insufficient boiling in conventional jet structures, compared to jet impact in parallel flow channels. Furthermore, by staggering the jet and return holes, the crossflow within the microchannels exhibits a staggered countercurrent characteristic, improving temperature uniformity across the heat sink and effectively suppressing the generation of localized hot spots. The structural coordination of the jet and microchannel layers effectively enhances the heat dissipation efficiency of the radiator.

[0041] Preferred embodiment, as Figure 5 As shown, the columnar pin fins 16 are distributed in a rectangular array in the heat dissipation slot 15. The columnar pin fins 16 are cylindrical structures and are evenly distributed. The spacing between adjacent columnar pin fins 16 is equal to the diameter of the columnar pin fins.

[0042] In this embodiment, the height of the columnar pin fins 16 is equal to the depth of the heat dissipation slots 15 , and the diameter of the columnar pin fins 16 is in the range of 50-100 microns.

[0043] The columnar fins 16 are designed to be cylindrical structures so that the spacing between adjacent columnar fins 16 is the same as their own diameter, and the resulting pin-fin microchannels are more symmetrical. When the fluid ejected from the jet hole 10 is injected into the pin-fin microchannel 13, it can flow evenly laterally, thereby improving the heat dissipation uniformity.

[0044] In this embodiment, a return port 9 and an inlet collecting groove 7 are provided on the manifold layer 2. The return port 9 is connected to the fluid outlet 6, and the inlet collecting groove 7 is connected to the fluid inlet 5. A diversion hole 8 is provided in the inlet collecting groove 7. The diversion hole 8 corresponds one-to-one to the jet hole 10 on the jet layer 3 and is used to divert the fluid.

[0045] Furthermore, an outlet manifold 12 is provided on the jet layer 3 , the jet holes 10 and the return holes 11 are located in the outlet manifold 12 , and the outlet manifold 12 is connected to the return port 9 .

[0046] In this embodiment, the return hole 11 is formed by opening a through hole at the bottom of the outlet manifold 12, and the ejection hole 10 is formed by a guide tube penetrating the ejection layer 3, and the upper surface of the guide tube is flush with the upper surface of the ejection layer.

[0047] The length of the jet hole 10 is matched with the depth of the outlet collecting groove 12, and it is directly connected with the diversion hole 8 of the manifold layer 2 to inject the fluid into the microchannel. The port of the reflux hole 11 is located at the bottom of the outlet collecting groove 12. The heat-absorbing fluid in the microchannel enters the outlet collecting groove 12 through the reflux hole 11, and then refluxes through the reflux port 9 and the fluid outlet 6.

[0048] like Figure 6 As shown, in this embodiment, the jet holes 10 and return holes 11 are arranged in a rectangular array, with the jet holes 10 and return holes 11 arranged alternately in the same column or row. This staggered arrangement of the jet holes and return holes creates a staggered countercurrent flow pattern within the microchannel, improving temperature uniformity across the heat dissipation target and effectively suppressing the generation of local hot spots.

[0049] In this embodiment, the cover layer 1 and the fluidic layer 3 are made of glass material, the manifold layer 2 is made of PDMS material, and the microchannel layer 4 is made of silicon material. The cover layer 1, the manifold layer 2, the fluidic layer 3 and the microchannel layer 4 are bonded in sequence from top to bottom.

[0050] Furthermore, the manifold layer 2 is connected to the cover plate layer 1 and the fluidic layer 3 respectively through a plasma bonding process, and the microchannel layer 4 is connected to the fluidic layer 3 through an anodic bonding process.

[0051] Working principle: The heat from the heat source is removed by heat conduction between the bottom of the radiator and the heat source and heat convection of the cooling fluid inside the radiator. During use, the bottom of the radiator is brought into contact with the heat-generating components of the electronic equipment (such as chips), absorbing the heat from the heat source and continuously supplying coolant to the radiator. After the cooling fluid enters the radiator from the cover layer, it first reaches the manifold layer, flows into the jet holes of the jet layer through the diversion holes of the manifold layer, and is injected into the microchannel layer through the jet holes. It absorbs heat and boils in the pin-fin flow channel of the microchannel layer, changing from a single phase to a gas-liquid two-phase state, and then flows back to the jet layer through the reflux hole and converges to the outlet, and finally flows out of the radiator. The flow path of the fluid in the microchannel layer is constrained by the jet holes and the reflux holes. Since the jet holes and reflux holes in two adjacent columns are staggered, the fluid in the pin-fin flow channel exhibits the characteristics of staggered countercurrent, thereby improving the heat exchange performance.

[0052] In combination with the above preferred embodiments, this embodiment also provides a more specific embodiment, such as Figure 1-6 As shown, a staggered jet microchannel radiator relies on heat conduction between the bottom of the radiator and the heat source, as well as heat convection of the cooling fluid inside the radiator to remove heat from the heat source. It mainly includes four layers, from top to bottom, namely, the cover layer 1, the manifold layer 2, the jet layer 3 and the microchannel layer 4. The cover layer 1 is where the fluid inlet and outlet of the entire radiator are located; the manifold layer 2 acts as a diverter for the cooling fluid entering the radiator; the jet layer 3, on the one hand, receives the cooling liquid flowing down from the manifold layer and injects it vertically into the microchannel layer 4, and on the other hand, is responsible for converging the cooling liquid flowing back from the microchannel layer 4 and allowing it to flow out of the radiator from the total outlet; the microchannel layer is the core heat exchange unit of the entire radiator, which absorbs heat through heat conduction between its bottom and the heat source, and transfers the absorbed heat to the cooling fluid to achieve heat dissipation of the heat source.

[0053] Specifically, the radiator is 24mm long, 18mm wide and 5.6mm thick. Among them, the cover layer is 1mm thick, the manifold layer is 2.5mm thick, the jet layer is 1.6mm thick, and the microchannel layer is 1mm thick. The cover layer 1 has two through holes with a diameter of 3.5mm, and the centers of the two holes are 12.1mm apart. The manifold layer 2 has a groove with a length of 9.6mm, a width of 7.2mm and a depth of 0.8mm. Part of the area inside the groove is provided with diversion holes for specifying the jet path. The jet layer 3 has a groove with a length of 9.9mm, a width of 7.8mm and a depth of 0.8mm. Part of the area inside the groove is provided with jet holes and return holes. Among them, the jet holes that run through the entire jet layer are used to receive the cooling fluid of the manifold layer and inject it into the microchannel layer; the remaining holes are all return holes, which are used to collect hot fluid from the microchannel layer. The microchannel layer has a groove with a length of 7.2 mm, a width of 3.9 mm, and a depth of 0.3 mm. The groove is equipped with micropillars with a diameter of 80 μm, a spacing of 80 μm, and a height of 0.3 mm.

[0054] The cover layer 1 and fluidic layer 3 are made of glass, the manifold layer 2 is made of PDMS, and the microchannel layer 4 is made of silicon. The cover layer 1, manifold layer 2, fluidic layer 3, and microchannel layer 4 are bonded sequentially from top to bottom. The glass and PDMS are bonded using a plasma bonding process, while the glass and silicon wafer are bonded using an anodic bonding process.

[0055] During use, the bottom 14 of the radiator is brought into contact with the heat-generating components (such as chips) of the electronic device to absorb heat from the heat source and continuously supply coolant to the radiator. After the cooling fluid enters the radiator from the fluid inlet 5 of the cover layer 1, it first reaches the inlet manifold 7 of the manifold layer 2, flows into the jet hole 10 of the jet layer 3 through the diversion hole 8 of the manifold layer 2, and is injected into the microchannel layer 4 through the jet hole 10. It absorbs heat and boils in the pin-fin microchannel 13 of the microchannel layer 4, changing from a single phase to a gas-liquid two-phase state, and then flows back to the jet layer 3 through the reflux hole 11 and converges to the outlet manifold 12, and finally flows out of the radiator through the fluid outlets 9 and 6 in sequence. The flow path of the fluid in the microchannel layer 4 is constrained by the jet holes 10 and the reflux holes 11. Since the jet holes 10 and the reflux holes 11 in two adjacent rows are staggered, the fluid presents a uniform flow in the pin-fin microchannel 13. Figure 6 The staggered counter-flow characteristics shown in FIG4 improve the heat transfer performance.

[0056] The above describes in detail the preferred embodiments of the present invention. It should be understood that those skilled in the art can make numerous modifications and variations based on the concepts of the present invention without inventive effort. Therefore, any technical solutions that can be derived by those skilled in the art through logical analysis, reasoning, or limited experimentation based on the concepts of the present invention and the prior art should be within the scope of protection defined by the claims.

Claims

1. A staggered jet microchannel heat dissipation device, comprising a cover layer (1), a manifold layer (2), a jet layer (3) and a microchannel layer (4) stacked in sequence, wherein the cover layer (1) is provided with a fluid inlet (5) and a fluid outlet (6), and the manifold layer (2) is used to divert the fluid in the fluid inlet (5), characterized in that: The jet layer (3) is provided with jet holes (10) and return holes (11) distributed in an array, and the jet holes (10) and return holes (11) are staggered. The microchannel layer (4) is provided with a heat dissipation groove (15), and the heat dissipation groove (15) is provided with columnar pin fins (16) distributed in an array to form a pin fin microchannel (13). The axial direction of the columnar pin fins (16) is parallel to the jet direction of the jet hole (10). The fluid ejected from the jet hole (10) absorbs heat, boils, and flows transversely in the pin-fin microchannel (13). Based on the staggered distribution of the jet hole (10) and the reflux hole (11), the transversely flowing fluid in the pin-fin microchannel (13) presents a staggered countercurrent and flows to the fluid outlet (6) through the reflux hole (11).

2. The staggered jet microchannel heat dissipation device according to claim 1, characterized in that: The columnar pin fins (16) are distributed in a rectangular array in the heat dissipation slot (15); the columnar pin fins (16) are cylindrical structures, and the columnar pin fins (16) are evenly distributed.

3. The staggered jet microchannel heat dissipation device according to claim 2, characterized in that: The spacing between adjacent columnar pin fins (16) is equal to the diameter of the columnar pin fins.

4. The staggered jet microchannel heat dissipation device according to claim 1, characterized in that: The height of the columnar pin fins (16) is equal to the depth of the heat dissipation grooves (15), and the diameter of the columnar pin fins (16) is in the range of 50-100 microns.

5. The staggered jet microchannel heat dissipation device according to claim 1, characterized in that: The manifold layer (2) is provided with a return port (9) and an inlet collecting groove (7), the return port (9) is connected to the fluid outlet (6), the inlet collecting groove (7) is connected to the fluid inlet (5), and a diversion hole (8) is provided in the inlet collecting groove (7), and the diversion hole (8) corresponds one-to-one with the jet hole (10) on the jet layer (3) and is used to divert the fluid.

6. The staggered jet microchannel heat dissipation device according to claim 5, characterized in that: An outlet collecting groove (12) is provided on the jet layer (3), the jet holes (10) and the return holes (11) are located in the outlet collecting groove (12), and the outlet collecting groove (12) is connected to the return port (9).

7. The staggered jet microchannel heat dissipation device according to claim 6, characterized in that: The return hole (11) is formed by opening a through hole at the bottom of the outlet manifold (12), and the jet hole (10) is formed by a guide tube penetrating the jet layer (3), wherein the upper surface of the guide tube is flush with the upper surface of the jet layer.

8. The staggered jet microchannel heat dissipation device according to claim 1, characterized in that: The jet holes (10) and the reflow holes (11) are distributed in a rectangular array, and the jet holes (10) and the reflow holes (11) in the same column or row are distributed alternately.

9. The staggered jet microchannel heat dissipation device according to claim 1, characterized in that: The cover plate layer (1) and the fluidic layer (3) are made of glass material, the manifold layer (2) is made of PDMS material, and the microchannel layer (4) is made of silicon material. The cover plate layer (1), the manifold layer (2), the fluidic layer (3) and the microchannel layer (4) are bonded in sequence from top to bottom.

10. The staggered jet microchannel heat dissipation device according to claim 9, characterized in that: The manifold layer (2) is respectively connected to the cover plate layer (1) and the fluidic layer (3) through a plasma bonding process, and the microchannel layer (4) is connected to the fluidic layer (3) through an anodic bonding process.

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