Heat dissipation device, electronic assembly, and electronic apparatus

Abstract

Provided in the embodiments of the present application are a heat dissipation device, an electronic assembly, and an electronic apparatus. The heat dissipation device is configured to dissipate heat from a heating element. The heat dissipation device comprises a jet structure, a heat dissipation structure and a supporting structure. The jet structure is spaced apart from the heat dissipation structure in a first direction, and the supporting structure provides support between the jet structure and the heat dissipation structure; and the surface of the heat dissipation structure away from the jet structure is configured to be in heat conduction connection with the heating element. The jet structure is provided with a liquid inlet, a jet opening, and a jet cavity, which brings the liquid inlet into communication with the jet opening. The jet opening faces the heat dissipation structure, and the jet opening is configured such that a refrigerant is ejected therethrough to the heat dissipation structure. Heat generated by the heating element can be conducted to the refrigerant via the heat dissipation structure, thereby causing the refrigerant to boil. After boiling, the refrigerant changes from liquid to gas, and detaches from the surface of the heat dissipation structure, thereby realizing heat dissipation for the heating element.

Description

Heat dissipation device, electronic component and electronic equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of the People's Republic of China on March 29, 2024, with application number 202410390103.7 and application name "A heat dissipation device, electronic component and electronic device", the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device, an electronic component, and an electronic device. Background Art

[0004] Electronic devices include a variety of electronic components, some of which generate heat during operation. For example, if the electronic device is a server, during operation, the chip will process data, which is accompanied by the generation of heat. If the heat generated by the electronic components cannot be dissipated in a timely manner, it may cause the electronic components to operate in a high-temperature environment, thereby affecting the stable operation and service life of the electronic components. In one existing technology, in order to dissipate heat from the electronic components, the electronic components are immersed in a coolant, and the coolant is driven to circulate to remove the heat generated by the electronic components, thereby achieving the purpose of dissipating heat from the electronic components.

[0005] In recent years, with the development of technology, the integration and power of electronic components have continued to increase, and the heat flux density of electronic components has also increased accordingly. As the heat flux density of electronic components gradually increases, the heat dissipation problem faced by electronic components is becoming increasingly severe. The above-mentioned heat dissipation methods can no longer meet the heat dissipation needs of electronic components. Summary of the Invention

[0006] The present application provides a heat dissipation device, an electronic component, and an electronic device for improving the heat dissipation effect of a heating element, extending the service life of the electronic component, and enhancing the performance of the electronic device.

[0007] In a first aspect, the present application provides a heat dissipation device, which is used to dissipate heat for a heating element. Specifically, the heat dissipation device includes a jet structure, a heat dissipation structure, and a support structure. The jet structure and the heat dissipation structure are arranged at intervals along a first direction; the support structure is supported between the jet structure and the heat dissipation structure, or in other words, the two ends of the support structure arranged along the first direction are respectively in contact with the jet structure and the heat dissipation structure. During use of the above-mentioned heat dissipation device, the side of the heat dissipation structure facing away from the jet structure is thermally connected to the heating element, so that the heat generated by the heating element can be conducted to the heat dissipation structure. Moreover, since the end of the support structure is pressed against the surface of the heat dissipation structure, the support structure can suppress the warping deformation of the heat dissipation structure, so that the heat dissipation structure and the heating element fit more closely, thereby improving the heat transfer effect between the heat dissipation structure and the heating element. The jet structure sprays refrigerant onto the heat dissipation structure, so that the refrigerant and the heat dissipation structure exchange heat, thereby achieving the effect of dissipating heat for the heating element. At the same time, due to the existence of the support structure, it is possible to thin the heat dissipation structure, that is, due to the support of the support structure, the heat dissipation structure is not easily deformed when thinned; the thinner the heat dissipation structure, the higher the heat transfer efficiency of the heat dissipation structure, and the better the heat dissipation effect of the heating element.

[0008] The jet structure comprises a liquid inlet, a jet outlet, and a jet cavity connecting the liquid inlet and the jet outlet. The liquid inlet is connected to a refrigerant transmission pipeline, which can deliver low-temperature refrigerant to the jet structure through the liquid inlet. The jet outlet faces the heat dissipation structure and is used to spray refrigerant toward the heat dissipation structure. After being ejected from the jet outlet, the refrigerant reaches the surface of the heat dissipation structure, where it absorbs heat conducted from the heating element, causing it to boil. After boiling, the refrigerant changes phase from liquid to gas, detaches from the surface of the heat dissipation structure, and then flows out through the gap between the heat dissipation structure and the jet structure. This phase transition of the refrigerant removes heat generated by the heating element, thereby achieving a cooling effect for the heating element. Because the latent heat of vaporization of a fluid is much greater than its specific heat, the cooling effect achieved by causing the refrigerant to undergo this phase transition is more significant than that achieved by immersing the heating element in coolant, thereby accommodating the increasing heat flux density of the heating element.

[0009] When specifically configuring the support structure, the support structure includes a variety of structural forms. For example, the support structure can be a columnar structure. For another example, the support structure can also be a plate-like structure. Of course, the support structure can also have other structural forms, which are not listed one by one in this application.

[0010] The number of support structures can be one or more. When arranging the support structures, the position of the support structures relative to the heat dissipation structure also includes a variety of options. In one technical solution, at least one support structure is provided between the jet structure and the heat dissipation structure, and the at least one support structure includes a first support structure, and the orthographic projection of the first support structure along the first direction covers the center of the orthographic projection of the heat dissipation structure along the first direction. In other words, at least one support structure is provided between the jet structure and the heat dissipation structure, and one end of the support structure is connected to the center of the heat dissipation structure. Optionally, the center of the orthographic projection of the heat dissipation structure along the first direction coincides with or nearly coincides with the center of the orthographic projection of the heating element along the first direction, and therefore, the orthographic projection of the first support structure along the first direction also covers the center of the orthographic projection of the heating element along the first direction. In other words, the first support structure can squeeze the central area of ​​the heating element through the heat dissipation structure, thereby improving the pressing effect of the heat dissipation structure and the heating element, so that the heat dissipation structure and the heating element fit closely, thereby improving the heat transfer efficiency between the heat dissipation structure and the heating element.

[0011] In one technical solution, a plurality of support structures are provided between the jet structure and the heat dissipation structure, and the plurality of support structures are arranged at intervals. The plurality of support structures include a second support structure, and the second support structure is located at the edge of the heat dissipation structure. In other words, at least one support structure whose one end is connected to the edge of the heat dissipation structure is provided between the jet structure and the heat dissipation structure, and the support structure can reduce the probability of warping of the edge of the heat dissipation structure. Optionally, the orthographic projection of the second support structure along the first direction falls on the edge of the orthographic projection of the heating element along the first direction. The second support structure can squeeze the edge of the heating element through the heat dissipation structure, and, similar to the first support structure, the second support structure also has the function of improving the pressing effect of the heat dissipation structure and the heating element, so that the heat dissipation structure and the heating element can fit tightly, thereby improving the heat transfer efficiency between the heat dissipation structure and the heating element.

[0012] In the heat dissipation device, in order to connect the jet structure, the heat dissipation structure and the support structure into a whole, a variety of optional technical solutions are included. In one technical solution, for the support structure and the jet structure, the support structure and the jet structure are an integrated structure, or the support structure and the jet structure are connected by a first connector. For the support structure and the heat dissipation structure, the support structure and the heat dissipation structure are an integrated structure, or the support structure and the heat dissipation structure are connected by a second connector. Optionally, the above-mentioned first connector and second connector are any one of a solder connection layer, an adhesive layer or a fastener. Among them, the fastener includes a bolt, a screw or a rivet, etc. In specific implementation, the jet structure and the support structure are connected in any of the above-mentioned ways, and after the heat dissipation structure and the support structure are connected in any of the above-mentioned ways, the jet structure, the heat dissipation structure and the support structure can be connected into a whole.

[0013] In another technical solution, the heat dissipation device further includes a base, which is located on the side of the heat dissipation structure facing away from the jet structure, and the heat dissipation structure and the support structure are clamped between the base and the jet structure. When the base is specifically set, the base has a through hole, and the orthographic projection of the through hole along the first direction and the orthographic projection of the heat dissipation structure along the first direction at least partially overlap. In other words, at least a portion of the surface of the side of the heat dissipation structure facing away from the jet structure can be exposed from the through hole. The through hole is used to accommodate at least a portion of the structure of the heating element, so that the heating element can contact the portion of the heat dissipation structure exposed from the through hole, thereby realizing heat conduction. In specific implementation, the base and the jet structure can be connected by fasteners, so that the heat dissipation structure and the support structure are clamped by the base and the jet structure, thereby making the jet structure, the heat dissipation structure and the support structure connected as a whole.

[0014] In another technical solution, the heat dissipation device includes, in addition to the aforementioned base, a top cover. The top cover is located on the side of the fluidic structure facing away from the heat dissipation structure. The top cover and the base are fixedly connected, so that the fluidic structure, support structure, and heat dissipation structure are sandwiched between the top cover and the base, thereby connecting the fluidic structure, heat dissipation structure, and support structure as a whole. In a specific implementation, the top cover and the base can be fixedly connected by fasteners. The fasteners can be screws, bolts, or rivets.

[0015] When installing the base, a limiting protrusion is provided on the surface of the base facing the fluidic structure, and the limiting protrusion is located around the heat dissipation structure. The limiting protrusion can limit the heat dissipation structure, reducing its movement on the surface of the base, thereby improving the installation accuracy of the heat dissipation structure and the base, and ensuring that the center of the heat dissipation structure and the center of the through hole coincide or nearly coincide. Optionally, the limiting protrusion is a strip structure, a column structure, a ring structure, or an L-shaped structure.

[0016] In order to reduce the position shift of the support structure during the process of assembling the jet structure, the support structure and the heat dissipation structure, in one technical solution, the jet structure has a first limiting groove on one side facing the support structure, and the end of the support structure close to the jet structure is located in the first limiting groove. The first limiting groove can limit the support structure so that the support structure and the jet structure meet the preset positional relationship, and can reduce the shift of the support structure relative to the jet structure, which is beneficial to improving the installation accuracy of the support structure and the jet structure. In another technical solution, the heat dissipation structure has a second limiting groove on one side facing the support structure, and the end of the support structure close to the heat dissipation structure is located in the second limiting groove. The second limiting groove and the first limiting groove have similar functions, both of which have the function of reducing the shift of the support structure during the assembly process, which will not be elaborated here. When the technical solution of the present application is specifically implemented, any one of the first limiting groove and the second limiting groove can be set, or the first limiting groove and the second limiting groove can also be set at the same time.

[0017] When the jet structure is specifically set up, the jet structure has a connecting portion, and the orthographic projection of the connecting portion along the first direction does not overlap with the orthographic projection of the heat dissipation structure along the first direction. Specifically, the orthographic projection of the connecting portion along the first direction is located on the circumferential side of the orthographic projection of the heat dissipation structure along the first direction Z. The above-mentioned connecting portion can be used to fix the jet structure to a substrate on which a heating element is installed. Optionally, the connecting portion is a connecting hole, and the connecting hole is used to accommodate a fastener, and the fastener is used to connect the jet structure and the substrate so that the jet structure is fixed to the substrate. During installation, the fastener avoids the heat dissipation structure, or in other words, the fastener does not pass through the heat dissipation structure. In this way, the integrity of the heat dissipation structure is protected, the area of ​​the heat dissipation structure is reduced, and the cost is reduced.

[0018] When the heat dissipation structure is specifically set, the heat dissipation structure is a heat dissipation plate, and the thickness of the heat dissipation plate along the first direction is less than or equal to 3.0mm. Optionally, the thickness of the heat dissipation structure along the first direction can be 0.5mm, 0.8mm, 1.1mm, 1.4mm, 1.7mm, 2.0mm, 2.3mm, 2.5mm or 2.8mm. Of course, the thickness of the heat dissipation structure along the first direction can also be other numerical values ​​that meet the above range, which are not listed one by one in this application. The thinner the thickness of the above-mentioned heat dissipation structure, the smaller the temperature difference between the side of the heat dissipation structure facing away from the heating element and the heating element, the higher the heat transfer efficiency of the heat dissipation structure, and the better the heat dissipation effect of the heating element. The heat dissipation structure is more likely to deform after being thinned, and in this application, the support structure can suppress the deformation of the heat dissipation structure, so that the heat dissipation structure and the heating element fit more closely. Therefore, in this application, the heat dissipation structure can be set thinner, thereby improving the heat transfer efficiency of the heat dissipation structure.

[0019] In order to speed up the rate of bubble generation during the boiling process of the refrigerant and improve the heat exchange efficiency between the refrigerant and the heat dissipation structure, in one technical solution, a boiling microstructure is provided on the side of the heat dissipation structure facing the jet structure, and the jet port faces the boiling microstructure. The boiling microstructure can increase the number of vaporization cores on the surface of the heat dissipation structure, thereby accelerating the rate at which the refrigerant generates bubbles on the surface of the heat dissipation structure, thereby improving the heat exchange efficiency between the heat dissipation structure and the refrigerant. At the same time, the boiling microstructure can also increase the heat exchange area of ​​the heat dissipation structure, thereby further improving the heat exchange efficiency between the heat dissipation structure and the refrigerant. In specific settings, the boiling microstructure has a variety of structural forms. For example, the boiling microstructure includes at least one layer of copper mesh. For another example, the boiling microstructure includes a copper powder sintered layer. For another example, the boiling microstructure includes a plurality of spaced-apart protrusion structures.

[0020] In a second aspect, the present application also provides an electronic component. The electronic component includes a heating element, a substrate, and a heat sink as described in any one of the technical solutions of the first aspect. The heating element is fixed to the substrate, and the heat sink is also fixed to the substrate. In the heat sink, the side of the heat sink structure facing away from the jet structure is thermally connected to the heating element. The heat sink can transfer heat generated by the heating element to the external environment, thereby reducing the temperature of the heating element and enabling stable operation of the heating element. Specifically, the medium used by the heat sink to achieve heat transfer is a refrigerant. After absorbing heat, the refrigerant boils and changes phase from liquid to gas. The process of the refrigerant changing phase from liquid to gas can remove the heat generated by the heating element, thereby achieving the effect of dissipating heat from the heating element. Because the latent heat of vaporization of a fluid is much greater than the specific heat of the fluid, the heat dissipation effect achieved by causing the refrigerant to undergo the above-mentioned phase change is more significant than the heat dissipation effect achieved by immersing the heating element in coolant. This can adapt to the trend of increasing heat flux density of the heating element, improve the power density of the electronic component, and extend the service life of the electronic component.

[0021] In one technical solution, the orthographic projection of the support structure along a first direction and the orthographic projection of the heating element along the first direction at least partially overlap. This allows the support structure to be at least partially positioned above the heating element. The support structure can transmit positive pressure to the heating element via the heat dissipation structure, thereby improving the pressure-bonding effect between the heat dissipation structure and the heating element. Under the pressure of the support structure, warping deformation of the heat dissipation structure is reduced, allowing the heat dissipation structure and the heating element to fit more closely, further improving the heat transfer efficiency between the heat dissipation structure and the heating element.

[0022] In order to reduce the impact of the refrigerant flowing around on the operation of some electronic components, in one technical solution, the above-mentioned electronic assembly also includes a box, and the heating element, substrate and heat dissipation device are all located in the box. In the specific technical solution, for some electronic components that are greatly affected by the refrigerant, these electronic components can be arranged outside the box; for some electronic components that are less affected by the refrigerant, these electronic components can be arranged inside the box. The box has a refrigerant inlet and a refrigerant outlet. The refrigerant inlet is connected to the liquid inlet and is used to replenish the refrigerant to the jet structure. The refrigerant outlet is used to discharge the refrigerant flowing out of the jet structure. During the use of the heat dissipation device, the refrigerant can be discharged from a special refrigerant outlet after absorbing heat, so that the refrigerant cannot flow freely, thereby reducing the impact of the refrigerant on some electronic components.

[0023] In a third aspect, the present application further provides an electronic device. The electronic device includes a housing and the electronic assembly described in any one of the technical solutions of the second aspect, wherein the electronic assembly is located within the housing. The electronic assembly includes a heating element and a heat sink. The heat sink can improve the heat dissipation effect of the heating element, allowing the heating element to operate stably, thereby ensuring good performance of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0025] FIG2 is a schematic structural diagram of an electronic component provided in an embodiment of the present application;

[0026] FIG3 is a schematic structural diagram of a heat dissipation device provided in an embodiment of the present application;

[0027] FIG4 is a schematic diagram of a distribution of a support structure provided in an embodiment of the present application;

[0028] FIG5 is another schematic structural diagram of a heat dissipation device provided in an embodiment of the present application;

[0029] FIG6 is another schematic structural diagram of a heat dissipation device provided in an embodiment of the present application;

[0030] FIG7 is another schematic structural diagram of a heat dissipation device provided in an embodiment of the present application;

[0031] FIG8 is a schematic structural diagram of a base provided in an embodiment of the present application;

[0032] FIG9 is another schematic structural diagram of the heat dissipation device provided in an embodiment of the present application.

[0033] Reference numerals: 100 - electronic device; 10 - housing; 20 - electronic assembly; 21 - heating element; 22 - substrate; 23 - housing; 24 - heat exchanger; 25 - liquid storage tank; 26 - circulating pump; 27 - electrical connector; 30 - heat dissipation device; 31 - jet structure; 311 - liquid inlet; 312 - jet outlet; 313 - jet cavity; 314 - bottom plate; 315 - cover plate; 316 - connection portion; 317 - first limiting groove; 32 - heat dissipation structure; 321 - second limiting groove; 33 - support structure; 331 - first supporting structure; 332 - second supporting structure; 333 - pressing plate; 3331 - through hole; 334 - support column; 34 - base; 341 - through hole; 342 - limiting protrusion; 35-Top cover. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be described in further detail below with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be understood as being limited to the embodiments set forth herein. The same figure marks in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all explained with reference to the accompanying drawings as examples, but changes can be made as needed, and the changes made are all included in the scope of protection of this application. The drawings in the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0035] It should be noted that the following description sets forth specific details to facilitate understanding of the present application. However, the embodiments of the present application can be implemented in a variety of ways other than those described herein, and those skilled in the art can make similar generalizations without violating the connotations of the embodiments of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0036] To facilitate understanding of the technical solutions provided by the embodiments of the present application, the application scenarios are first described. Electronic devices include a variety of electronic components. During operation, some electronic components generate heat. For example, the electronic device is a server. During operation, the chip of the server processes data, which is accompanied by the generation of heat. If the heat generated by the electronic components cannot be dissipated in a timely manner, it may cause the electronic components to operate in a high-temperature environment. High temperatures will accelerate the aging of electronic components, reduce the operating efficiency of electronic components, and affect the stable operation and service life of electronic components. In one prior art, in order to dissipate heat for electronic components, the electronic components are immersed in a coolant, and the coolant is driven to circulate to remove the heat generated by the electronic components, thereby achieving the purpose of dissipating heat for the electronic components. In recent years, with the development of technology, the integration and power of electronic components have continued to increase, and the heat flux density of electronic components has also increased accordingly. Under the development trend of gradually increasing heat flux density of electronic components, the heat dissipation problem faced by electronic components is becoming increasingly severe. The above-mentioned heat dissipation method of immersing electronic components in coolant can no longer meet the heat dissipation needs of electronic components.

[0037] In view of this, embodiments of the present application provide a heat dissipation device, an electronic component, and an electronic device to improve the heat dissipation effect of electronic components.

[0038] Figure 1 is a structural schematic diagram of an electronic device provided in an embodiment of the present application. As shown in Figure 1, in one embodiment, the electronic device 100 includes a housing 10 and an electronic component 20, and the electronic component 20 is located in the housing 10. The electronic component 20 includes electronic components, and the electronic components can be chips, capacitors, or inductors. Different types of electronic components have different uses. For example, chips can be used to control and process various types of data, capacitors can be used for energy storage, filtering, or signal coupling, and inductors can be used to isolate circuits or generate magnetic fields. The stable operation of various electronic components can ensure that the electronic device has good performance. Optionally, the above-mentioned electronic device 100 can be a computer device, such as a server or a desktop computer, etc.; it can also be a communication device, such as a mobile communication device such as a mobile phone or a tablet computer, or a radio frequency device, an optical fiber device, etc.

[0039] Figure 2 is a structural schematic diagram of an electronic component provided in an embodiment of the present application. As shown in Figure 2, in one embodiment, the electronic component 20 includes a heating element 21 and a substrate 22, and the heating element 21 is fixed to the substrate 22. The heating element 21 is one of the electronic components contained in the electronic component 20. For example, the heating element 21 can be a chip. Of course, the heating element 21 can also be other electronic components, which are not listed one by one in this application. The substrate 22 can be a circuit board or a metal plate. The heating element 21 generates heat during operation. The continuous accumulation of heat may cause the heating element 21 to operate in a high-temperature environment, thereby affecting the stable operation of the heating element 21 and further affecting the performance of the electronic device 100. In order to dissipate heat for the heating element 21, the above-mentioned electronic component 20 also includes a heat sink 30, which is also fixed to the substrate 22. The heat sink 30 is used to transfer the heat generated by the heating element 21 to the external environment, thereby reducing the temperature of the heating element 21, so that the heating element 21 can operate stably, and thus ensure that the electronic device 100 has good performance.

[0040] Please continue to refer to Figure 2. In one embodiment, the heat dissipation device 30 includes a jet structure 31, a heat dissipation structure 32 and a support structure 33. The jet structure 31 and the heat dissipation structure 32 are arranged at intervals along the first direction Z, and the side of the heat dissipation structure 32 facing away from the jet structure 31 is thermally connected to the heating element 21. The support structure 33 is supported between the jet structure 31 and the heat dissipation structure 32, or in other words, the two ends of the support structure 33 arranged along the first direction Z are respectively in contact with the jet structure 31 and the heat dissipation structure 32. The support structure 33 can suppress the warping deformation of the heat dissipation structure 32, so that the heat dissipation structure 32 and the heating element 21 fit more closely, thereby improving the heat transfer effect between the heat dissipation structure 32 and the heating element 21.

[0041] During operation of the heat dissipation device 30, the jet structure 31 is used to spray refrigerant toward the heat dissipation structure 32. Heat generated by the heating element 21 can be transferred to the refrigerant via the heat dissipation structure 32, causing the refrigerant to boil. After boiling, the refrigerant changes phase from liquid to gas, detaches from the surface of the heat dissipation structure 32, and then flows out through the gap between the heat dissipation structure 32 and the jet structure 31. This phase transition of the refrigerant from liquid to gas removes the heat generated by the heating element 21, thereby dissipating heat from the heating element 21. Because the latent heat of vaporization of a fluid is much greater than its specific heat, the heat dissipation effect achieved by causing the refrigerant to undergo this phase transition is more significant than that achieved by immersing the heating element 21 in coolant. Furthermore, the jet structure 31 can continuously spray low-temperature refrigerant toward the heat dissipation structure 32, causing the low-temperature refrigerant to flow across the surface of the heat dissipation structure 32. This helps improve the heat exchange efficiency between the refrigerant and the heat dissipation structure 32, further enhancing the heat dissipation effect of the heating element 21.

[0042] It should be noted that refrigerant is liquid at room temperature and has a low boiling point. After absorbing heat, the temperature of the refrigerant rises. When the temperature reaches its boiling point, the refrigerant boils and changes from liquid to gas.

[0043] Since electronic device 100 also includes other electronic components, to reduce the impact of refrigerant flow on the operation of other electronic components, as shown in Figure 2, in one embodiment, electronic assembly 20 also includes a housing 23, with heat sink 30, heating element 21, and substrate 22 all located within housing 23. In specific implementations, electronic components significantly affected by the refrigerant can be placed outside housing 23. Electronic components less affected by the refrigerant can be placed within housing 23. Housing 23 has a refrigerant inlet and a refrigerant outlet. The refrigerant inlet communicates with the liquid inlet of fluidic structure 31 for replenishing refrigerant to fluidic structure 31. The refrigerant outlet is used to discharge refrigerant flowing out of fluidic structure 31. This refrigerant, which exchanges heat with heat dissipation structure 32, is a gaseous refrigerant, or may include both gaseous and liquid refrigerants. In specific implementations, the liquid and gaseous refrigerants can be discharged through the same refrigerant outlet or through separate outlets. In a specific embodiment, a refrigerant outlet is provided at the bottom of the side wall of the box body 23, and the refrigerant outlet is used to discharge the liquid refrigerant; and another refrigerant outlet is provided at the top of the side wall of the box body 23, and the refrigerant outlet is used to discharge the gaseous refrigerant.

[0044] Continuing with reference to FIG2 , in one embodiment, the electronic assembly 20 further includes a heat exchanger 24, which is connected to the refrigerant inlet and refrigerant outlet of the housing 23 via a transmission pipeline. After absorbing heat on the surface of the heat dissipation structure 32, the refrigerant flows out from the gap between the heat dissipation structure 32 and the jet structure 31 and is ultimately discharged through the refrigerant outlet of the housing 23. The refrigerant discharged from the refrigerant outlet of the housing 23 enters the heat exchanger 24 along the transmission pipeline, where it releases heat and its temperature decreases. After flowing out of the heat exchanger 24, the low-temperature refrigerant can return to the jet structure 31 through the transmission pipeline and be sprayed again onto the surface of the heat dissipation structure 32 by the jet port 312.

[0045] In addition, the electronic component 20 further includes a liquid storage tank 25 and a circulation pump 26 . The liquid storage tank 25 is used to store the low-temperature refrigerant flowing out of the heat exchanger 24 , and the circulation pump 26 is used to drive the refrigerant to flow.

[0046] To allow electrical communication between substrate 22 and the outside world, electronic assembly 20 further includes an electrical connector 27, which is electrically connected to substrate 22 and extends through the wall of housing 23. Substrate 22 can electrically communicate with the outside world via electrical connector 27. In practice, electrical connector 27 is hermetically sealed to housing 23, thereby minimizing refrigerant leakage.

[0047] FIG3 is a schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present application. As shown in FIG3 , in one embodiment, the jet structure 31 includes a liquid inlet 311, a jet outlet 312, and a jet cavity 313 connecting the liquid inlet 311 and the jet outlet 312. The liquid inlet 311 is used to communicate with a transmission pipeline for transporting refrigerant. The jet outlet 312 is disposed toward the heat dissipation structure 32 and is used to spray refrigerant toward the heat dissipation structure 32.

[0048] When the jet structure 31 is specifically set up, the jet structure 31 may have one liquid inlet 311 or multiple liquid inlets 311. Multiple liquid inlets 311 can increase the flow rate of the refrigerant and improve the heat exchange efficiency between the refrigerant and the heat dissipation structure 32. Similarly, the jet structure 31 may have one jet port 312 or multiple jet ports 312. Multiple jet ports 312 can cause the refrigerant to form a diversion when ejected and be ejected to different areas of the heat dissipation structure 32, thereby facilitating the increase of the contact area between the refrigerant and the heat dissipation structure 32 and improving the heat exchange efficiency between the refrigerant and the heat dissipation structure 32. As shown in Figure 3, in one embodiment, the jet structure 31 has multiple jet ports 312. The multiple jet ports 312 are arranged in an array, and each jet port 312 faces the heat dissipation structure 32. In other embodiments, the multiple jet ports 312 may also be randomly arranged.

[0049] When specifically arranging the liquid inlet 311 and the jet port 312, the liquid inlet 311 and the jet port 312 can be arranged in a variety of ways. In one embodiment, the central axis of the liquid inlet 311 and the central axis of the jet port 312 both extend along the first direction Z. By extending the central axis of the liquid inlet 311 and the central axis of the jet port 312 in the same direction, the resistance of the refrigerant during the flow can be reduced, the flow rate of the refrigerant can be increased, and the heat exchange efficiency between the refrigerant and the heat dissipation structure 32 can be accelerated. In another embodiment, the central axis of the liquid inlet 311 extends along the first direction Z, and there is an angle between the central axis of the jet port 312 and the first direction Z, and the angle is an acute angle. In other words, the refrigerant ejected from the jet port 312 can be sprayed onto the surface of the heat dissipation structure 32 at a certain inclination angle. In other embodiments, the central axis of the liquid inlet 311 extends along the second direction X, and the central axis of the jet port 312 extends along the first direction Z. The second direction X and the first direction Z are perpendicular to each other.

[0050] In the jet structure 31, the liquid inlet 311 and the jet outlet 312 are respectively connected to the jet chamber 313. When the jet chamber 313 is specifically formed, there are multiple ways of forming it. For example, as shown in Figure 3, in one embodiment, the jet structure 31 includes a bottom plate 314 and a cover plate 315, and the bottom plate 314 and the cover plate 315 are arranged relative to each other along the first direction Z, and a concave cavity is provided on the side of the bottom plate 314 facing the cover plate 315, and the bottom plate 314 and the cover plate 315 are buckled together to form the jet chamber 313. For another example, in another embodiment, the jet structure 31 also includes a bottom plate 314 and a cover plate 315, and the bottom plate 314 and the cover plate 315 are arranged relative to each other along the first direction Z. Different from the above embodiment, in this embodiment, a concave cavity is provided on the side of the cover plate 315 facing the bottom plate 314, and the jet chamber 313 is formed when the bottom plate 314 and the cover plate 315 are buckled together. For another example, in yet another embodiment, the jet structure 31 also includes a base plate 314 and a cover plate 315, and the base plate 314 and the cover plate 315 are arranged relative to each other along the first direction Z. Unlike the above two embodiments, a concave cavity is provided on the side of the cover plate 315 facing the base plate 314 and the side of the base plate 314 facing the cover plate 315, respectively. When the base plate 314 and the cover plate 315 are fastened together, a jet cavity 313 is formed. In the above embodiments, the base plate 314 and the cover plate 315 can be fastened together by welding or bonding, or they can be fastened by fasteners.

[0051] When specifically setting the heat dissipation structure 32, the shape of the heat dissipation structure 32 includes a variety of options. For example, the heat dissipation structure 32 can be circular, elliptical or polygonal. Of course, the heat dissipation structure 32 can also be other shapes, which are not listed one by one in this application. The heat dissipation structure 32 can specifically be plate-shaped, and the thickness direction of the heat dissipation structure 32 is consistent with the above-mentioned first direction Z. The two surfaces of the heat dissipation structure 32 arranged along the thickness direction have a large surface area, and thus have a large heat exchange area. One of the above-mentioned two surfaces faces the jet port 312 and can exchange heat with the refrigerant ejected from the jet port 312. The other of the two surfaces is thermally connected to the heating element 21 and can exchange heat with the heating element 21. The smaller the distance between the above-mentioned two surfaces along the first direction Z, the thinner the thickness of the heat dissipation structure 32, the smaller the temperature difference between the side of the above-mentioned two surfaces facing away from the heating element 21 and the heating element 21, the higher the heat transfer efficiency of the heat dissipation structure 32, and the better the heat dissipation effect of the heating element 21.

[0052] In one embodiment, the heat dissipation structure 32 is plate-shaped, and the thickness of the heat dissipation structure 32 along the first direction Z is less than or equal to 3.0 mm. Optionally, the thickness of the heat dissipation structure 32 along the first direction Z can be 0.5 mm, 0.8 mm, 1.1 mm, 1.4 mm, 1.7 mm, 2.0 mm, 2.3 mm, 2.5 mm or 2.8 mm. Of course, the thickness of the heat dissipation structure 32 along the first direction Z can also be other values ​​that meet the above range, which are not listed one by one in this application. The thinner the thickness of the heat dissipation structure 32, the more likely it is to deform while improving the heat transfer efficiency. For example, a local area of ​​the heat dissipation structure 32 may bulge in a direction away from the heating element 21, thereby affecting the heat conduction between the heat dissipation structure 32 and the jet structure 31. In the present application, since a support structure 33 is provided between the heat dissipation structure 32 and the jet structure 31, the end of the support structure 33 presses against the surface of the heat dissipation structure 32, thereby suppressing the deformation of the heat dissipation structure 32, so that the heat dissipation structure 32 and the heating element 21 fit more closely. Therefore, in the present application, the heat dissipation structure 32 can be set to be thinner. For example, the thickness of the heat dissipation structure 32 can be 1.0 mm, thereby improving the heat transfer efficiency of the heat dissipation structure 32 and improving the heat dissipation effect of the heating element 21.

[0053] When preparing the heat dissipation structure 32, a metal such as copper or aluminum can be used, so that the heat dissipation structure 32 has a high heat transfer efficiency. When the heat dissipation structure 32 and the heating element 21 are thermally connected, the heat dissipation structure 32 and the heating element 21 can be directly in contact with each other, so that heat can be directly transferred to the heat dissipation structure 32; alternatively, a thermally conductive adhesive can be provided between the heat dissipation structure 32 and the heating element 21, so that heat can be transferred to the heat dissipation structure 32 via the thermally conductive adhesive; alternatively, a thermally conductive pad can be provided between the heat dissipation structure 32 and the heating element 21, so that heat can be transferred to the heat dissipation structure 32 via the thermally conductive pad.

[0054] During operation of the heat dissipation device 30, the refrigerant absorbs heat on the surface of the heat dissipation structure 32 and boils. During the boiling process, bubbles are generated in the refrigerant. The faster the bubble generation rate, the higher the heat exchange efficiency between the refrigerant and the heat dissipation structure 32, and the better the heat dissipation effect of the heating element 21. In order to accelerate the bubble generation rate, in one embodiment, a boiling microstructure is provided on the side of the heat dissipation structure 32 facing the jet structure 31. The boiling microstructure protrudes from the surface of the heat dissipation structure 32, and the jet port 312 faces the boiling microstructure. The boiling microstructure can increase the number of vaporization cores on the surface of the heat dissipation structure 32, thereby accelerating the rate at which the refrigerant generates bubbles on the surface of the heat dissipation structure 32, thereby improving the heat exchange efficiency between the heat dissipation structure 32 and the refrigerant. At the same time, the boiling microstructure can also increase the heat exchange area of ​​the heat dissipation structure 32, thereby further improving the heat exchange efficiency between the heat dissipation structure 32 and the refrigerant.

[0055] The boiling microstructure has a variety of structural forms. In one structural form, the boiling microstructure includes at least one layer of copper mesh. The copper mesh can be welded to the surface of the heat dissipation structure 32, or it can be bonded to the surface of the heat dissipation structure 32. In another structural form, the boiling microstructure includes a copper powder sintered layer, and the copper powder sintered layer has a rough surface structure. During specific preparation, the copper powder sintered layer can be formed by sintering copper powder on the surface of the heat dissipation structure 32 in an environment filled with protective gas. In another structural form, the boiling microstructure includes a plurality of spaced-apart protrusion structures. During specific preparation, the protrusion structure can be first processed to form the protrusion structure, and then the protrusion structure can be welded or bonded to the surface of the heat dissipation structure 32. Alternatively, the surface of the heat dissipation structure 32 can be directly machined to form the protrusion structure.

[0056] Specifically, when the boiling microstructure is arranged on the surface of the heat dissipation structure 32, the boiling microstructure can be arranged in the entire area of ​​the side of the heat dissipation structure 32 facing the jet structure 31, or the boiling microstructure can be arranged in a local area of ​​the above surface. Optionally, the orthographic projection of the area of ​​the heat dissipation structure 32 where the boiling microstructure is arranged along the first direction Z and the orthographic projection of the heating element 21 along the first direction Z have an overlapping portion, so that the heat generated by the heating element 21 can be conducted to the boiling microstructure more quickly, thereby accelerating the vaporization of the refrigerant. In a specific embodiment, the orthographic projection of the area of ​​the heat dissipation structure 32 where the boiling microstructure is arranged along the first direction Z covers the orthographic projection of the heating element 21 along the first direction Z. In the above embodiment, the boiling microstructure is located above the heating element 21 and covers the entire heating element 21, so that the heat generated by the entire heating element 21 can be conducted to the boiling microstructure at a faster speed, thereby further accelerating the vaporization of the refrigerant and improving the heat dissipation effect of the heating element 21.

[0057] With reference to Figures 2 and 3, in the heat sink 30, the two ends of the support structure 33 are respectively in contact with the jet structure 31 and the heat dissipation structure 32. During the installation of the heat sink 30, after the jet structure 31 is fixed, the support structure 33 can transmit pressure to the heat dissipation structure 32, so that the heat dissipation structure 32 is pressed against the surface of the heating element 21, so that the heat generated by the heating element 21 can be conducted to the heat dissipation structure 32. When the support structure 33 is arranged, the orthographic projection of the support structure 33 along the first direction Z and the orthographic projection of the heating element 21 along the first direction Z can at least partially overlap, so that the support structure 33 is at least partially located above the heating element 21. The above-mentioned support structure 33 can transmit positive pressure to the heating element 21 through the heat dissipation structure 32, thereby improving the pressure-bonding effect of the heat dissipation structure 32 and the heating element 21. Under the pressure of the support structure 33, the warping deformation of the heat dissipation structure 32 can be suppressed, so that the heat dissipation structure 32 and the heating element 21 are more closely attached, thereby further improving the heat transfer efficiency between the heat dissipation structure 32 and the heating element 21.

[0058] In one application scenario, the jet structure 31 is directly fixed to the substrate 22 on which the heating element 21 is mounted. When the jet structure 31 is fixed, the jet structure 31 can transmit pressure to the heat dissipation structure 32 through the support structure 33, so that the heat dissipation structure 32 is pressed against the surface of the heating element 21. As shown in Figure 3, in a specific embodiment, the jet structure 31 has a connecting portion 316, which is used to fix the jet structure 31 to the substrate 22. In addition, the orthographic projection of the connecting portion 316 along the first direction Z and the orthographic projection of the heat dissipation structure 32 along the first direction Z do not overlap, or in other words, the orthographic projection of the connecting portion 316 along the first direction Z is located on the circumferential side of the orthographic projection of the heat dissipation structure 32 along the first direction Z.

[0059] In order to improve the fixing effect of the jet structure 31, the jet structure 31 may have a plurality of the above-mentioned connecting parts 316, and the plurality of connecting parts 316 may be distributed on the edge of the jet structure 31. When the connecting part 316 is specifically set, the connecting part 316 may be a connecting hole. The connecting hole is used to accommodate a fastener, and the fastener is used to connect the jet structure 31 and the substrate 22, so that the jet structure 31 is fixed to the substrate 22. During installation, the fastener avoids the heat dissipation structure 32, or in other words, the fastener does not pass through the heat dissipation structure 32. In this way, the integrity of the heat dissipation structure 32 is protected, the area of ​​the heat dissipation structure 32 is reduced, and the cost is reduced. Optionally, the above-mentioned fasteners may be bolts, screws or rivets, etc.

[0060] In another application scenario, the fluidic structure 31 is fixed to another structural member, and the structural member and the substrate 22 are relatively fixed, thereby indirectly fixing the fluidic structure 31 and the substrate 22. After the fluidic structure 31 is fixed, the fluidic structure 31 can also transmit pressure to the heat dissipation structure 32 through the support structure 33, so that the heat dissipation structure 32 is pressed against the surface of the heating element 21.

[0061] A thermally conductive adhesive or thermal pad can be provided between the heat dissipation structure 32 and the heating element 21. Under the pressure of the heat dissipation structure 32, the thermally conductive adhesive will flow toward the surrounding area, thereby filling the gap between the heat dissipation structure 32 and the heating element 21, thereby further improving the heat transfer efficiency between the heat dissipation structure 32 and the heating element 21. Under the pressure of the heat dissipation structure 32, the thermal pad will be compressed and deformed, thereby tightly fitting the heat dissipation structure 32 and the heating element 21, thereby also improving the heat transfer efficiency between the heat dissipation structure 32 and the heating element 21.

[0062] When the support structure 33 is specifically arranged, on the one hand, the support structure 33 avoids the jet port 312 of the jet structure 31, so that the jet port 312 can smoothly spray the refrigerant to the heat dissipation structure 32. On the other hand, the area of ​​the region where the orthographic projection of the support structure 33 along the first direction Z and the orthographic projection of the heat dissipation structure 32 along the first direction Z overlap is smaller than the area of ​​the orthographic projection of the heat dissipation structure 32 along the first direction Z. In other words, the support structure 33 cannot completely cover the heat dissipation structure 32, so that the jet port 312 can spray the refrigerant to the region of the heat dissipation structure 32 that is not covered by the support structure 33. Optionally, the region of the heat dissipation structure 32 that is not covered by the support structure 33 is at least partially located above the heating element 21. In other words, the orthographic projection of the region of the heat dissipation structure 32 that is not covered by the support structure 33 along the first direction Z and the orthographic projection of the heat dissipation element 21 along the first direction Z have an overlapping area. In this way, the heat generated by the heating element 21 can be transferred to the area of ​​the heat dissipation structure 32 that is not covered by the support structure 33, and absorbed by the refrigerant sprayed into the area, causing the refrigerant to boil and vaporize, thereby taking away the heat generated by the heating element 21, thereby achieving the purpose of heat dissipation for the heating element 21.

[0063] In one embodiment, at least one supporting structure 33 is provided between the jet structure 31 and the heat dissipation structure 32, and the at least one supporting structure 33 includes a first supporting structure 331, wherein the orthographic projection of the first supporting structure 331 along the first direction Z covers the center of the orthographic projection of the heat dissipation structure 32 along the first direction Z. In a specific implementation, the center of the orthographic projection of the heat dissipation structure 32 along the first direction Z coincides with or nearly coincides with the center of the orthographic projection of the heating element 21 along the first direction Z. Therefore, the orthographic projection of the first supporting structure 331 along the first direction Z also covers the center of the orthographic projection of the heating element 21 along the first direction Z. In other words, the first supporting structure 331 can squeeze the central area of ​​the heating element 21 through the heat dissipation structure 32, thereby improving the pressing effect between the heat dissipation structure 32 and the heating element 21, so that the heat dissipation structure 32 and the heating element 21 fit tightly, thereby improving the heat transfer efficiency between the heat dissipation structure 32 and the heating element 21.

[0064] In one embodiment, a plurality of support structures 33 are provided between the jet structure 31 and the heat dissipation structure 32, and the plurality of support structures 33 include a second support structure 332, and the second support structure 332 is located at the edge of the heat dissipation structure 32. In a specific implementation, the orthographic projection of the second support structure 332 along the first direction Z can fall on the edge of the orthographic projection of the heating element 21 along the first direction Z. The above-mentioned second support structure 332 can squeeze the edge of the heating element 21 through the heat dissipation structure 32, thereby improving the pressing effect of the heat dissipation structure 32 and the heating element 21, so that the heat dissipation structure 32 and the heating element 21 fit closely, thereby improving the heat transfer efficiency between the heat dissipation structure 32 and the heating element 21. In a specific setting, the number of the above-mentioned second support structures 332 can be one, or two, three or other numbers, and this application does not list them one by one. In a specific embodiment, a plurality of second support structures 332 are provided between the jet structure 31 and the heat dissipation structure 32, and the plurality of second support structures 332 are distributed in a circle with the center of the heat dissipation structure 32 as the center.

[0065] When multiple support structures 33 are provided between the fluidic structure 31 and the heat dissipation structure 32, they can be arranged so that the gaps between adjacent support structures 33 form refrigerant discharge channels. After absorbing heat and changing into a gaseous state, the refrigerant can flow out through the discharge channels. Of course, liquid refrigerant can also be discharged through the above-mentioned discharge channels.

[0066] FIG4 is a distribution diagram of the support structure provided in an embodiment of the present application. As shown in FIG4 , in one embodiment, a plurality of support structures 33 are provided between the jet structure 31 and the heat dissipation structure 32, and the plurality of support structures 33 are distributed at intervals. Specifically, the plurality of support structures 33 include a first support structure 331 and at least two second support structures 332, and the at least two second support structures 332 are provided around the first support structure 331. The orthographic projection of the first support structure 331 along the first direction Z covers the center of the orthographic projection of the heating element 21 along the first direction Z, and the orthographic projection of each second support structure 332 along the first direction Z falls on the edge of the orthographic projection of the heating element 21 along the first direction Z. Optionally, the number of the second support structures 332 can be three, four, five, six or other numbers, and these second support structures 332 are distributed in a circle around the first support structure 331. The above-mentioned multiple supporting structures 33 can squeeze the central area and edge area of ​​the heating element 21 through the heat dissipation structure 32, so that the heat dissipation structure 32 and the heating element 21 are more closely fitted, thereby facilitating improving the heat exchange efficiency between the heat dissipation structure 32 and the heating element 21.

[0067] When the support structure 33 is specifically set, the support structure 33 includes a variety of structural forms. For example, the support structure 33 can be a columnar structure. The columnar structure can be a column with uniform thickness, or it can also be a column that gradually thickens along the direction from the jet structure 31 to the heat dissipation structure 32 to form a stable support. When arranging, a plurality of the above-mentioned support structures 33 can be set between the jet structure 31 and the heat dissipation structure 32, and the orthographic projection of one of the support structures 33 along the first direction Z covers the center of the orthographic projection of the heating element 21 along the first direction Z, and the orthographic projections of the remaining support structures 33 along the first direction Z fall on the edge of the orthographic projection of the heating element 21 along the first direction Z. Optionally, the above-mentioned support structure 33 can be a cylindrical structure or a prismatic structure.

[0068] For another example, the support structure 33 may be a plate-like structure. During arrangement, multiple support structures 33 may be provided between the fluidic structure 31 and the heat dissipation structure 32, with the orthographic projection of each support structure 33 along the first direction Z positioned at the edge of the orthographic projection of the heating element 21 along the first direction Z. A gap may be provided between adjacent support structures 33, forming a refrigerant discharge channel.

[0069] FIG5 is another structural schematic diagram of a heat dissipation device provided in an embodiment of the present application, which includes a support structure of another structural form. As shown in FIG5 , in the heat dissipation device, the support structure 33 includes a pressure plate 333 and a plurality of support columns 334. The pressure plate 333 is located on the side of the heat dissipation structure 32 facing the jet structure 31, and the plurality of support columns 334 are arranged between the pressure plate 333 and the jet structure 31. In one embodiment, the pressure plate 333 is a rectangular structure, and the support columns 334 are arranged at the four end corners of the pressure plate 333. The pressure plate 333 has a through hole 3331, and the orthographic projection of the through hole 3331 along the first direction Z falls within the orthographic projection of the heat dissipation structure 32 along the first direction Z. In other words, part of the surface of the heat dissipation structure 32 is exposed from the through hole 3331. The jet structure 31 can spray a refrigerant into the through hole 3331, so that the refrigerant contacts the heat dissipation structure 32 exposed from the through hole 3331 and performs heat exchange.

[0070] Specifically, when the through hole 3331 is provided, the through hole 3331 can be rectangular or circular. The size of the through hole 3331 is smaller than the size of the heat dissipation structure 32, so that the pressure plate 333 is pressed against the edge of the heat dissipation structure 32. The size of the through hole 3331 is also smaller than the size of the heating element 21, so that the orthographic projection of the pressure plate 333 along the first direction Z can cover the peripheral edge of the orthographic projection of the heating element 21 along the first direction Z.

[0071] In the heat dissipation device 30, there are multiple ways to connect the fluidic structure 31, the heat dissipation structure 32, and the support structure 33 into a whole. For example, the fluidic structure 31 and the support structure 33 can be an integral structure, or the fluidic structure 31 and the support structure 33 can be connected by a first connecting member. Optionally, the first connecting member can be a solder connection layer, an adhesive layer, or a fastener. The fastener includes a bolt, a screw, or a rivet. The heat dissipation structure 32 and the support structure 33 can be an integral structure, or the heat dissipation structure 32 and the support structure 33 can be connected by a second connecting member. Optionally, the second connecting member can be a solder connection layer, an adhesive layer, or a fastener. The fastener includes a bolt, a screw, or a rivet. The fluidic structure 31 and the support structure 33 are connected in any of the above ways, and after the heat dissipation structure 32 and the support structure 33 are connected in any of the above ways, the fluidic structure 31, the heat dissipation structure 32, and the support structure 33 can be connected into a whole.

[0072] In a specific embodiment, the support structure 33 is a columnar structure having a first end and a second end. The first end is connected to the fluidic structure 31 via a solder connection layer, and the second end is connected to the heat dissipation structure 32 via a welding connection layer, thereby connecting the fluidic structure 31, the heat dissipation structure 32, and the support structure 33 into a whole.

[0073] Figure 6 is another structural schematic diagram of the heat dissipation device provided in an embodiment of the present application, in which the jet structure 31, the heat dissipation structure 32 and the support structure 33 are connected as a whole in another way. As shown in Figure 6, in one embodiment, the heat dissipation device 30 also includes a base 34, and the base 34 is located on the side of the heat dissipation structure 32 away from the jet structure 31, and the heat dissipation structure 32 and the support structure 33 are clamped between the base 34 and the jet structure 31. During specific implementation, the base 34 and the jet structure 31 are fixedly connected, so that the heat dissipation structure 32 and the support structure 33 are clamped by the base 34 and the jet structure 31, thereby connecting the jet structure 31, the heat dissipation structure 32 and the support structure 33 as a whole. Optionally, the base 34 and the jet structure 31 are fixedly connected by fasteners. The fasteners may be screws, bolts or rivets.

[0074] 6 , in a specific configuration, the base 34 has a through hole 341 , and the orthographic projection of the through hole 341 along the first direction Z at least partially overlaps with the orthographic projection of the heat dissipation structure 32 along the first direction Z. The through hole 341 can accommodate at least a portion of the structure of the heating element 21 , so that the heating element 21 and the heat dissipation structure 32 are in contact, thereby achieving heat conduction.

[0075] During assembly, the base 34 and the fluidic structure 31 can be directly fastened using fasteners, thereby clamping the heat dissipation structure 32 and the support structure 33 between the base 34 and the fluidic structure 31. Alternatively, the support structure 33 and the fluidic structure 31 can be pre-positioned first, and / or the support structure 33 and the heat dissipation structure 32 can be pre-positioned; then, the base 34 and the fluidic structure 31 can be fastened using fasteners, thereby clamping the heat dissipation structure 32 and the support structure 33 between the base 34 and the fluidic structure 31. For example, the support structure 33, the heat dissipation structure 32, and the fluidic structure 31 can be pre-bonded using glue, and then the base 34 and the fluidic structure 31 can be fastened using fasteners, thereby clamping the heat dissipation structure 32 and the support structure 33 between the base 34 and the fluidic structure 31. Alternatively, the support structure 33 and the heat dissipation structure 32 can be pre-welded, and then the base 34 and the fluidic structure 31 can be fastened using fasteners, thereby clamping the heat dissipation structure 32 and the support structure 33 between the base 34 and the fluidic structure 31. Optionally, the fasteners are screws, which pass through the fluidic structure 31 and the base 34 and are then fixed to the base plate 22 .

[0076] FIG7 is another structural schematic diagram of a heat sink provided in an embodiment of the present application. The structure of the heat sink is similar to that of the heat sink shown in FIG6 , and the way in which the heat sink connects the jet structure 31, the heat dissipation structure 32, and the support structure 33 into a whole is also similar to the way used by the heat sink shown in FIG6 . Compared with the heat sink 30 shown in FIG6 , the heat sink 30 shown in FIG7 includes, in addition to a base 34, a top cover 35. The top cover 35 is located on the side of the jet structure 31 away from the heat dissipation structure 32. The top cover 35 and the base 34 are fixedly connected, so that the jet structure 31, the heat dissipation structure 32, and the support structure 33 are all clamped by the top cover 35 and the base 34, thereby connecting the jet structure 31, the heat dissipation structure 32, and the support structure 33 into a whole. Optionally, the top cover 35 and the base 34 are fixedly connected by fasteners. The fasteners may be screws, bolts, or rivets.

[0077] Before fixing the above-mentioned heat dissipation device 30 to the substrate 22, a layer of thermally conductive adhesive can be coated on the surface of the heat dissipation structure 32 and / or the heating element 21, or a thermally conductive pad can be provided on the surface of the heating element 21. When fixing the heat dissipation device 30, screws can be passed through the jet structure 31 and fixed to the substrate 22. In the process of tightening the screws, the thermally conductive adhesive or the thermally conductive pad can be compressed and deformed under the extrusion of the heat dissipation structure 32 and the heating element 21, thereby filling the gap between the heat dissipation structure 32 and the heating element 21. The above-mentioned heat dissipation structure 32 does not need to be connected to the heating element 21 by welding, thereby protecting the surface structure of the heating element 21 and simplifying the installation steps, so that the above-mentioned heat dissipation device 30 can be installed in one step by fixing the jet structure 31.

[0078] FIG8 is a schematic structural diagram of a base provided in an embodiment of the present application. As shown in FIG8 , in one embodiment, a limiting protrusion 342 is provided on the surface of the base 34 facing the jet structure 31, and the limiting protrusion 342 is located around the through hole 341. Optionally, there is a gap between the end of the limiting protrusion 342 close to the through hole 341 and the edge of the through hole 341. In combination with FIG6 , after the base 34 and the heat dissipation structure 32 are assembled, the heat dissipation structure 32 covers the through hole 341, and the limiting protrusion 342 is located around the heat dissipation structure 32. The limiting protrusion 342 can limit the heat dissipation structure 32, reduce the displacement of the heat dissipation structure 32 on the surface of the base 34, improve the installation accuracy of the heat dissipation structure 32 and the base 34, and make the center of the heat dissipation structure 32 coincide with or nearly coincide with the center of the through hole 341.

[0079] When the limiting protrusion 342 is specifically set, the limiting protrusion 342 can be a strip structure, a columnar structure, an annular structure or an L-shaped structure. The number of limiting protrusions 342 can be one or more. In one embodiment, the heat dissipation structure 32 is rectangular, and the surface of the base 34 facing the jet structure 31 is provided with a plurality of strip-shaped or columnar limiting protrusions 342, and at least one of the above-mentioned limiting protrusions 342 is distributed on each side of the heat dissipation structure 32. In another embodiment, the heat dissipation structure 32 is rectangular, and the surface of the base 34 facing the jet structure 31 is provided with at least two L-shaped limiting protrusions 342, and the at least two L-shaped limiting protrusions 342 are distributed at the end corners of the heat dissipation structure 32. In another embodiment, the surface of the base 34 facing the jet structure 31 is provided with an annular limiting protrusion 342, and the annular limiting protrusion 342 is arranged around the circumference of the heat dissipation structure 32.

[0080] In order to reduce the possibility of the support structure 33 shifting during the assembly of the fluidic structure 31, the heat dissipation structure 32, and the support structure 33, a structure for limiting the position of the support structure 33 can be provided on the fluidic structure 31 and / or the heat dissipation structure 32 to reduce the possibility of the support structure 33 shifting during the assembly process. FIG9 is a schematic diagram of another structure of a heat dissipation device provided in an embodiment of the present application. As shown in FIG9, in one embodiment, the side of the fluidic structure 31 facing the support structure 33 has a first limiting groove 317, and the end of the support structure 33 near the fluidic structure 31 is located within the first limiting groove 317. The first limiting groove 317 can limit the support structure 33 so that the support structure 33 and the fluidic structure 31 meet a predetermined first positional relationship and reduce the possibility of the support structure 33 shifting relative to the fluidic structure 31, thereby improving the installation accuracy of the support structure 33 and the fluidic structure 31. In another embodiment, the side of the heat dissipation structure 32 facing the support structure 33 has a second limiting groove 321, and the end of the support structure 33 near the heat dissipation structure 32 is located within the second limiting groove 321. The second limiting groove 321 can also limit the support structure 33, so that the support structure 33 and the heat dissipation structure 32 meet the preset second position relationship, and can reduce the displacement of the support structure 33 relative to the heat dissipation structure 32, which is beneficial to improving the installation accuracy of the support structure 33 and the heat dissipation structure 32.

[0081] Obviously, those skilled in the art may make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations.

Claims

1. A heat dissipation device, characterized in that: Used to dissipate heat for a heating element; the heat dissipation device includes a jet structure, a heat dissipation structure, and a support structure, wherein the jet structure and the heat dissipation structure are arranged at intervals along a first direction, and the support structure is supported between the jet structure and the heat dissipation structure; a side of the heat dissipation structure facing away from the jet structure is used for thermal connection with the heating element; The jet structure comprises a liquid inlet, a jet port and a jet cavity communicating with the liquid inlet and the jet port. The jet port faces the heat dissipation structure and is used for spraying refrigerant toward the heat dissipation structure.

2. The heat dissipation device according to claim 1, wherein: At least one supporting structure is provided between the jet structure and the heat dissipation structure. The at least one supporting structure includes a first supporting structure, and the orthographic projection of the first supporting structure along the first direction covers the center of the orthographic projection of the heat dissipation structure along the first direction.

3. The heat dissipation device according to claim 1 or 2, wherein: A plurality of the support structures are provided between the jet structure and the heat dissipation structure, and the plurality of the support structures are arranged at intervals; The plurality of support structures include a second support structure, and the second support structure is located at an edge of the heat dissipation structure.

4. The heat dissipation device according to any one of claims 1 to 3, wherein: The support structure and the jet structure are an integrated structure, or the support structure and the jet structure are connected via a first connecting member; The support structure and the heat dissipation structure are an integrated structure, or the support structure and the heat dissipation structure are connected via a second connecting member.

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The heat dissipation device further includes a base, the base being located on a side of the heat dissipation structure away from the jet structure, the heat dissipation structure and the support structure being sandwiched between the base and the jet structure; The base has a through hole, the orthographic projection of the through hole along the first direction and the orthographic projection of the heat dissipation structure along the first direction at least partially overlap, and the through hole is used to accommodate at least a part of the structure of the heating element.

6. The heat dissipation device according to claim 5, wherein: The heat dissipation device also includes a top cover, which is located on the side of the jet structure away from the heat dissipation structure. The top cover is fixedly connected to the base, and the jet structure, the support structure and the heat dissipation structure are sandwiched between the top cover and the base.

7. The heat dissipation device according to claim 5 or 6, characterized in that: A limiting protrusion is provided on a surface of the base facing the fluidic structure, and the limiting protrusion is located on a peripheral side of the heat dissipation structure.

8. The heat dissipation device according to any one of claims 1 to 7, wherein: The jet structure has a first limiting groove on a side facing the support structure, and an end of the support structure close to the jet structure is located in the first limiting groove; and / or the heat dissipation structure has a second limiting groove on a side facing the support structure, and an end of the support structure close to the heat dissipation structure is located in the second limiting groove.

9. The heat dissipation device according to any one of claims 1 to 8, wherein: The jet structure has a connecting portion, and an orthographic projection of the connecting portion along the first direction does not overlap with an orthographic projection of the heat dissipation structure along the first direction.

10. The heat dissipation device according to any one of claims 1 to 9, wherein: The heat dissipation structure is a heat dissipation plate, and the thickness of the heat dissipation plate along the first direction is less than or equal to 3.0 mm.

11. The heat dissipation device according to any one of claims 1 to 10, wherein: A boiling microstructure is provided on a side of the heat dissipation structure facing the jet structure, and the jet port faces the boiling microstructure.

12. An electronic component, characterized in that: It comprises a heating element, a substrate and a heat dissipation device as claimed in any one of claims 1 to 11; the heating element is fixed to the substrate, and the heat dissipation device is also fixed to the substrate; and the heat dissipation structure is thermally connected to the heating element on one side away from the jet structure.

13. The electronic component according to claim 12, wherein: The orthographic projection of the supporting structure along the first direction and the orthographic projection of the heating element along the first direction at least partially overlap.

14. The electronic component according to claim 12 or 13, wherein: It also includes a box body, in which the heating element, the substrate and the heat dissipation device are all located; the box body has a refrigerant inlet and a refrigerant outlet, the refrigerant inlet is connected to the liquid inlet, and is used to replenish refrigerant to the jet structure, and the refrigerant outlet is used to discharge the refrigerant flowing out of the jet structure.

15. An electronic device, characterized in that: The electronic component comprises a housing and the electronic component according to any one of claims 12 to 14, wherein the electronic component is located in the housing.

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