A method for manufacturing a spring probe connector

Abstract

This invention relates to the field of connector technology, and more particularly to a method for manufacturing a spring probe connector. The method involves pre-processing the components of the spring probe connector, electroplating them, and assembling them into a finished product. Based on a marine environment, the method detects a first electroplating parameter of the finished coaxial connector and compares it with a second electroplating parameter to determine if the electroplating indicators are qualified. If the electroplating is qualified, an insulating heat-shrink tubing is fitted and fixed, and the dielectric barrier parameter is detected. The impedance stability is determined based on the electroplating indicators. If the electroplating is unqualified, the electroplating control parameters are adjusted according to the first electroplating parameter until the impedance stability meets the standard, ensuring the connector is suitable for the marine environment. This invention improves the service life of spring probe connectors used in marine environments by detecting their dielectric barrier parameters.

Description

Technical Field

[0001] This invention relates to the field of connector technology, and in particular to a method for manufacturing a spring probe connector. Background Technology

[0002] A spring probe is a precision connector component consisting of a needle, a spring, and a tube. Its core structure involves the needle being elastically connected to the tube via a spring, forming a retractable conductive contact. The needle is typically made of a wear-resistant material, and its surface can be gold-plated to enhance conductivity and corrosion resistance. The spring provides stable elasticity, ensuring tight contact between the needle and the mating component. Spring probes primarily serve as a medium for conducting electrical signals or current, and are widely used in scenarios requiring frequent insertion and removal, precision mating, or minute displacement. Their core functions include: Conductive connection: The contact between the needle and mating components such as PCB boards, battery contacts, and chip pins establishes circuit continuity, transmitting electrical signals or power. Tolerance compensation: The elasticity of the spring compensates for minor displacements caused by installation errors, assembly gaps, or thermal expansion and contraction between mating components, ensuring stable contact. Wear resistance and long lifespan: Compared to fixed contacts, the elastic contact of spring probes reduces hard friction during insertion and removal, extending the connector's lifespan.

[0003] Chinese Patent Publication No. CN117525954A discloses a spring-loaded probe and connector. The spring-loaded probe is used for electrical connection with a mating end and has the advantages of simple structure and stability. The spring-loaded probe of this invention consists of a conductive hollow sleeve and a conductive integral spring terminal. The hollow sleeve has a mounting cavity, and the spring terminal has a mounting portion mounted in the mounting cavity and a mating portion exposed outside the hollow sleeve. Both the mounting portion and the mating portion are compressible elastic structures, and the mating portion can elastically abut against and electrically connect to the mating end.

[0004] It is evident that the existing technology has the following problems: when using spring probe connectors in marine environments, salt spray corrosion can prevent the components from connecting properly, thus shortening their service life. Summary of the Invention

[0005] Therefore, the present invention provides a method for manufacturing a spring probe connector to overcome the problem in the prior art that the components of the spring probe connector cannot be properly connected due to salt spray corrosion when used in a marine environment, thus shortening its service life.

[0006] To achieve the above objectives, the present invention provides a method for manufacturing a spring probe connector, comprising:

[0007] The components of the spring probe connector are pre-processed to obtain spring probe connector assemblies. The spring probe connector assemblies are electroplated to obtain electroplated spring probe connector assemblies. The electroplated spring probe connector assemblies are then assembled to obtain the finished spring probe connector.

[0008] Based on the marine environment usage scenario, the electroplating parameters of the coaxial connector of the finished spring probe connector are detected to obtain the first electroplating parameter. The first electroplating parameter and the second electroplating parameter are compared to obtain the electroplating parameter comparison result. Based on the electroplating parameter comparison result, it is determined whether its electroplating index is qualified.

[0009] If the electroplating is qualified, the insulating heat shrink tubing is covered on the outside of the electroplated spring probe connector assembly and fixed by heat shrinking. The dielectric barrier parameter between the coaxial connector and the insulating heat shrink tubing is detected to obtain the actual dielectric barrier parameter. The impedance stability is determined to be qualified based on the actual dielectric barrier parameter and the electroplating index.

[0010] For cases where the electroplating parameters are not up to standard, the electroplating control parameters are adjusted based on the first electroplating parameter to obtain a spring probe connector with acceptable impedance stability.

[0011] The electroplating spring probe assembly includes a coaxial connector, a first spring probe, and a second spring probe. The electroplating parameters are determined based on the electroplating layer thickness and electroplating uniformity. The second electroplating parameter is the electroplating parameter of the spring probe. The electroplating index is an index reflecting corrosion resistance. The medium barrier parameter is the amount of salt spray penetration within a preset time. The electroplating control parameters include the electroplating duration and the initial overall current density.

[0012] Furthermore, the process of electroplating each component of the spring probe connector to obtain the electroplated spring probe connector assembly includes,

[0013] Scan each component of the spring probe connector to obtain a 3D image of each component. Select any component's 3D image and measure its curvature and tip position to obtain the actual curvature and actual tip position number. Determine the corresponding initial overall current density during electroplating based on the actual curvature and actual tip position.

[0014] Furthermore, the process of determining the initial overall current density during electroplating based on the actual curvature and the actual number of tip points includes,

[0015] The initial value of the initial overall current density is determined based on the actual curvature and the compensation parameter for the influence of curvature on the initial overall current density. The initial value of the initial overall current density is then adjusted according to the actual number of tip points to obtain the target value of the initial overall current density.

[0016] Furthermore, the process of obtaining the first electroplating parameter by detecting the electroplating parameters of the coaxial connector of the finished spring probe connector includes,

[0017] The surface of the coaxial connector is divided into several regions. The electroplating thickness of any coaxial connector surface region is randomly selected for testing to obtain the actual electroplating thickness of the region. The actual electroplating thickness is compared with the standard electroplating thickness range to obtain the electroplating thickness comparison result. Based on the electroplating thickness comparison result, it is determined whether the electroplating uniformity meets the standard.

[0018] The standard electroplating layer thickness range is determined based on the initial overall current density and the actual curvature corresponding to the surface area of ​​the coaxial connector.

[0019] Furthermore, the process of determining whether the electroplating uniformity meets the standard based on the comparison results of the electroplated layer thickness includes:

[0020] If the comparison result of the electroplating layer thickness shows that the actual area electroplating layer thickness is less than the minimum value of the standard electroplating layer thickness range, the initial overall current density is increased according to the difference between the actual area electroplating layer thickness and the minimum value of the standard electroplating layer thickness range, or the electroplating time is increased.

[0021] If the comparison result of the electroplating layer thickness shows that the actual electroplating layer thickness in the area is within the range of the standard electroplating layer thickness, the electroplating control parameters should be maintained.

[0022] If the comparison result of the electroplating layer thickness shows that the actual area electroplating layer thickness is greater than the maximum value of the standard electroplating layer thickness range, the initial overall current density is reduced based on the difference between the actual area electroplating layer thickness and the maximum value of the standard electroplating layer thickness range, or the electroplating time is reduced.

[0023] Furthermore, the process of detecting the dielectric barrier parameters between the coaxial connector and the insulating heat shrink tubing includes,

[0024] The degree of salt spray particle distribution between the coaxial connector and the insulating heat shrink tubing is detected, and the medium barrier parameters are determined based on the degree of salt spray particle distribution.

[0025] The medium barrier parameter is negatively correlated with the degree of salt spray particle distribution.

[0026] Furthermore, the process of determining whether the impedance stability is qualified based on the actual dielectric barrier parameters and electroplating indicators includes,

[0027] By comparing the actual dielectric barrier parameters with the standard dielectric barrier parameters, a dielectric barrier comparison result is obtained. Based on the dielectric barrier comparison result and the electroplating index, it is determined whether the impedance stability is qualified.

[0028] Furthermore, the process of determining whether the impedance stability is qualified based on the comparison results of the dielectric barrier and the electroplating indicators includes:

[0029] If the actual dielectric barrier parameter is less than or equal to the standard dielectric barrier parameter in the dielectric barrier comparison result, the impedance stability is deemed qualified.

[0030] If the actual dielectric barrier parameter is greater than the standard dielectric barrier parameter, the impedance stability is judged to be qualified based on the difference between the actual dielectric barrier parameter and the standard dielectric barrier parameter, as well as the electroplating index.

[0031] Furthermore, the process of adjusting the electroplating control parameters based on the first electroplating parameters to obtain a spring probe connector with satisfactory impedance stability includes:

[0032] For cases where the electroplated layer thickness meets the standard electroplated layer thickness range, maintain the electroplating control parameters;

[0033] If the thickness of the electroplated layer does not meet the standard electroplated layer thickness range, the electroplating time or the initial overall current density shall be adjusted according to the difference in electroplated layer thickness.

[0034] Furthermore, the process of adjusting the electroplating time or the initial overall current density based on the difference in electroplated layer thickness includes,

[0035] If the initial overall current density cannot be adjusted, the electroplating time should be adjusted according to the difference in electroplating layer thickness.

[0036] Compared with existing technologies, the advantages of this invention lie in ensuring the corrosion resistance and impedance stability of the spring probe connector in a marine environment through a closed-loop process of pretreatment, electroplating, testing, and parameter adjustment, reducing poor contact and signal attenuation caused by plating defects. Electroplating parameters are set and dynamically adjusted according to the structural characteristics and functional requirements of different coaxial connectors and spring probes, achieving differentiated quality control and improving overall reliability. The electroplating layer provides basic corrosion resistance, while the insulating heat-shrink tubing further enhances the medium barrier effect, effectively resisting salt spray penetration and extending connector life. Electroplating time or current density is dynamically adjusted based on test results to promptly correct process deviations, avoid batch defects, reduce production costs, and improve production efficiency. By quantifying salt spray penetration, medium barrier parameters, and plating quality indicators, the long-term stability of the connector in a marine environment is accurately assessed, ensuring impedance fluctuations are within allowable ranges and meeting the demands of harsh scenarios such as deep-sea exploration and maritime communication. Ultrasonic waves and alkaline degreasers penetrate deep into crevices to thoroughly remove oil stains; acid pickling activates the surface and improves coating adhesion; vibratory grinding removes burrs and avoids uneven coating caused by tip discharge; low-concentration acid and alkali solutions and ceramic beads are used for physical treatment to reduce chemical pollution; process parameters are adjusted according to the characteristics of different components, such as extending the cleaning time for springs, to balance quality and efficiency. The pretreatment process is effective for components made of different materials such as brass and stainless steel, as well as components with helical springs and coaxial tubes, ensuring the consistency and reliability of the entire product series.

[0037] Furthermore, by capturing the curvature and tip positions of components through high-precision 3D scanning, geometric features are transformed into quantifiable current density parameters, replacing traditional empirical settings and improving the accuracy and consistency of the electroplating process. Based on the radius of curvature, bending compensation parameters are dynamically adjusted to reduce the initial current for highly curved areas, such as the outer convex surface of a spring, preventing excessively thick plating on the convex surface. The current is further optimized by adjusting coefficients based on the number of tips, suppressing current concentration at the tips and reducing the risk of excessive thickness or burning. For complex components with multiple bends and tips, such as needles and springs, initial values ​​are first determined through staged parameter calculations, followed by target values, ensuring uniform plating in different areas and meeting precision connection requirements. A unified parameter calculation logic is applicable to various components, reducing process fluctuations caused by differences in operator experience and ensuring the quality stability of mass production. Combining the material characteristics of stainless steel and other materials with the functional requirements of nickel plating, refined control of current density ensures plating adhesion while preventing internal stress cracking, balancing corrosion resistance and structural strength.

[0038] Furthermore, by dividing the area into different functional zones such as active contact areas and bending transition areas, the coating status of each area is specifically tested to avoid the overall average data masking local defects and to accurately locate coating deviations in weak points such as edge areas. By comparing the actual thickness of each area with the corresponding standard range, deviation analysis is used to objectively determine whether the uniformity meets the standard, rather than relying solely on intuition, ensuring that the judgment results match the corrosion resistance requirements of the marine environment. For detected thickness deviations, such as edge areas approaching the lower limit, adjustment plans are developed based on the cause of the deviation—insufficient current due to the shielding effect. Current density is optimized based on historical experience to avoid blind adjustments and ensure a more uniform coating thickness distribution after adjustment. Fine-tuning the current to compensate for insufficient current in edge areas enhances the coating quality of weak parts, reduces the corrosion risk caused by localized excessive thinness, and improves the overall corrosion resistance of the connector in salt spray environments. The test data and adjustment logic form a closed loop, making the electroplating parameter settings more closely match the structural characteristics of the component, such as the curvature and shielding effect of different areas, reducing batch-to-batch quality fluctuations and ensuring process stability.

[0039] Furthermore, by simulating the high-salt and high-humidity marine environment using a salt spray test chamber, the salt spray corrosion scenario of connectors and sleeves in actual use is accurately reproduced, ensuring that the test results directly reflect the actual protective capabilities. The distribution of salt spray particles is divided into different levels, and the degree of penetration is described from multiple dimensions, including location, quantity, and coverage area, enabling a quantitative assessment of the barrier effect and making the results more valuable. A scoring mechanism transforms qualitative penetration phenomena into intuitive media barrier parameters, and these parameters are negatively correlated with the degree of penetration, clearly distinguishing the differences in protective performance between different samples and facilitating the selection of qualified products. Careful handling during sleeve peeling, preserving residual particles within the gaps, avoids artificially destroying real penetration traces, ensuring that the state observed under the microscope is consistent with the actual corrosion situation, making the test data more reliable. Addressing the corrosion risks that may be caused by salt spray penetration in the marine environment, this testing process can identify fitting defects between the connector and sleeve in advance, such as edge gaps, providing a clear direction for optimizing the heat shrink process and improving overall sealing, ensuring the long-term stable operation of the connector.

[0040] Furthermore, by combining the physical protection capability of the dielectric barrier parameters with the corrosion resistance of the electroplating coating, misjudgments based on a single indicator are avoided. This prevents both the potential risk of meeting barrier standards but having a weak coating, and the hidden danger of excellent coatings but barrier failure, comprehensively ensuring impedance stability. For the differences between different dielectric barrier parameters and standards, the judgment levels are refined to include qualified, critically qualified, and unqualified, based on electroplating indicators. This allows for strict control of product quality in high-requirement scenarios such as deep-sea exploration, and provides improvement directions for critically qualified products, such as enhanced protection. Considering the high-frequency operating characteristics of marine exploration equipment, the judgment standards are directly linked to impedance fluctuation control requirements, ensuring stable signal transmission for qualified products during long-term use and reducing signal attenuation or distortion caused by corrosion or poor contact. Critically qualified products are promptly alerted to the need for enhanced protection, while unqualified products are explicitly rejected, preventing equipment failure due to impedance instability after entering actual application scenarios, reducing subsequent maintenance costs and safety risks. The judgment logic is clear, such as the difference range and the corresponding results of indicator combinations, facilitating unified standards in production and quality inspection, ensuring consistency in judgment across different batches of products, and improving overall quality control efficiency.

[0041] Furthermore, regarding whether the coating thickness is within the standard range, differentiated treatment is adopted. When the standard is met, the parameters are maintained to avoid ineffective adjustments; when the standard is not met, the current density or duration is precisely adjusted according to the difference to ensure that the thickness quickly returns to the qualified range, providing a basic guarantee for impedance stability. When the current density is adjusted due to component characteristics, such as the absence of a sharp tip, or the presence of a tip that cannot be adjusted, thickness compensation is achieved through duration adjustment, balancing process feasibility and quality requirements, and adapting to the structural limitations of different components. Priority is given to adjusting the current density, which has a faster response and is suitable for components without sharp tips and with low risk of current concentration, improving adjustment efficiency; for components with sharp tips, duration adjustment is used to avoid coating defects such as burning and cracking caused by excessive current, ensuring coating integrity. The thickness difference is correlated with the adjustment range, such as a specific difference corresponding to a fixed current or duration change, forming a replicable adjustment logic, reducing fluctuations caused by differences in human experience, ensuring stable coating quality in mass production, and thus maintaining consistent impedance performance. By adjusting parameters to ensure that the coating thickness and uniformity meet the standards, impedance fluctuations caused by localized corrosion due to excessive thinness or internal stress cracking due to excessive thickness are reduced, enabling the connector to maintain stable signal transmission performance in long-term salt spray environments. Attached Figure Description

[0042] Figure 1 This is a flowchart of the spring probe connector fabrication method in this embodiment;

[0043] Figure 2 This is a flowchart of the pretreatment process for each component of the spring probe connector in the spring probe connector manufacturing method of this embodiment.

[0044] Figure 3This is a flowchart of the electroplating uniformity determination process in the spring probe connector manufacturing method of this embodiment.

[0045] Figure 4 This is a flowchart illustrating the impedance stability determination process of the spring probe connector fabrication method in this embodiment.

[0046] Figure 5 This is a schematic diagram of the spring probe connector structure in this embodiment.

[0047] In the diagram, 1-coaxial connector; 2-first spring probe; 3-second spring probe; 4-insulating heat shrink tubing. Detailed Implementation

[0048] To make the objectives and advantages of the present invention clearer, the present invention will be further described below with reference to embodiments; it should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention.

[0049] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0050] It should be noted that in the description of this invention, the terms "upper", "lower", "left", "right", "inner", "outer", etc., which indicate directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. This is only for the convenience of description and is not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this invention.

[0051] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0052] Please see Figures 1-5 As shown, Figure 1 This is a flowchart of the spring probe connector fabrication method in this embodiment; Figure 2 This is a flowchart of the pretreatment process for each component of the spring probe connector in the spring probe connector manufacturing method of this embodiment. Figure 3 This is a flowchart of the electroplating uniformity determination process in the spring probe connector manufacturing method of this embodiment. Figure 4This is a flowchart illustrating the impedance stability determination process of the spring probe connector fabrication method in this embodiment. Figure 5 This is a schematic diagram of the spring probe connector structure in this embodiment.

[0053] This embodiment provides a method for manufacturing a spring probe connector, including,

[0054] Step S1: Pre-process each component of the spring probe connector to obtain each spring probe connector assembly; perform electroplating on each spring probe connector assembly to obtain an electroplated spring probe connector assembly; assemble the electroplated spring probe connector assembly to obtain the finished spring probe connector.

[0055] Step S2: Based on the marine environment usage scenario, the electroplating parameters of the coaxial connector of the finished spring probe connector are detected to obtain the first electroplating parameter. The first electroplating parameter and the second electroplating parameter are compared to obtain the electroplating parameter comparison result. Based on the electroplating parameter comparison result, it is determined whether its electroplating index is qualified.

[0056] Step S3: If the electroplating is qualified, the insulating heat shrink tubing 4 is covered on the outside of the electroplated spring probe connector assembly and fixed by heat shrinking. The dielectric barrier parameter between the coaxial connector 1 and the insulating heat shrink tubing 4 is detected to obtain the actual dielectric barrier parameter. The impedance stability is determined to be qualified based on the actual dielectric barrier parameter and the electroplating index.

[0057] Step S4: If the electroplating parameters are not up to standard, adjust the electroplating control parameters based on the first electroplating parameters to obtain a spring probe connector with acceptable impedance stability.

[0058] The electroplating spring probe assembly includes a coaxial connector 1, a first spring probe 2, and a second spring probe 3; the electroplating parameters are determined based on the electroplating layer thickness and electroplating uniformity; the second electroplating parameter is the electroplating parameter of the spring probe; the electroplating index is an index reflecting corrosion resistance; the medium barrier parameter is the amount of salt spray penetration within a preset time; and the electroplating control parameters include the electroplating duration and the initial overall current density.

[0059] This embodiment also provides a pre-processing procedure for each component of a spring probe connector, including:

[0060] Step S11: Place each component into an ultrasonic cleaning tank with a power of 200-300W, add alkaline degreasing agent components: sodium hydroxide 50-80g / L, sodium carbonate 30-50g / L, sodium silicate 20-30g / L, pH 10-12, temperature 50-60℃, and ultrasonically clean for 10-15 minutes. For components with many gaps, such as springs, the time can be extended to 20 minutes to ensure that the oil stains in the spiral gaps are removed.

[0061] Step S12: Immerse the component in a 5-10% dilute sulfuric acid solution at room temperature for 3-5 minutes until the surface exhibits a uniform metallic luster.

[0062] Step S13: Use ceramic beads with a diameter of 0.1-0.3 mm to treat in a vibratory grinder for 5-10 minutes to remove burrs.

[0063] A closed-loop process involving pretreatment, electroplating, testing, and parameter adjustment ensures the corrosion resistance and impedance stability of spring probe connectors in marine environments, reducing poor contact and signal attenuation caused by plating defects. Electroplating parameters are set and dynamically adjusted according to the structural characteristics and functional requirements of different coaxial connectors and spring probes, achieving differentiated quality control and improving overall reliability. The electroplating layer provides basic corrosion resistance, while the insulating heat-shrink tubing further enhances the dielectric barrier effect, effectively resisting salt spray penetration and extending connector life. Electroplating time or current density is dynamically adjusted based on test results to promptly correct process deviations, avoid batch defects, reduce production costs, and improve production efficiency. By quantifying salt spray penetration dielectric barrier parameters and plating quality electroplating indicators, the long-term stability of connectors in marine environments is accurately assessed, ensuring impedance fluctuations remain within allowable ranges and meeting the demands of harsh scenarios such as deep-sea exploration and maritime communication. Ultrasonic waves and alkaline degreasers penetrate deep into crevices to thoroughly remove oil stains; acid pickling activates the surface and improves coating adhesion; vibratory grinding removes burrs and avoids uneven coating caused by tip discharge; low-concentration acid and alkali solutions and ceramic beads are used for physical treatment to reduce chemical pollution; process parameters are adjusted according to the characteristics of different components, such as extending the cleaning time for springs, to balance quality and efficiency. The pretreatment process is effective for components made of different materials such as brass and stainless steel, as well as components with helical springs and coaxial tubes, ensuring the consistency and reliability of the entire product series.

[0064] Specifically, the process of electroplating each component of the spring probe connector to obtain an electroplated spring probe connector assembly includes,

[0065] Scan each component of the spring probe connector to obtain a 3D image of each component. Select any component's 3D image and measure its curvature and tip position to obtain the actual curvature and actual tip position number. Determine the corresponding initial overall current density during electroplating based on the actual curvature and actual tip position.

[0066] Specifically, the process of determining the initial overall current density during electroplating based on the actual curvature and the actual number of tip points includes:

[0067] The initial value of the initial overall current density is determined based on the actual curvature and the compensation parameter for the influence of curvature on the initial overall current density. The initial value of the initial overall current density is then adjusted according to the actual number of tip points to obtain the target value of the initial overall current density.

[0068] A high-precision laser 3D scanner was used to fix the needle assembly on the stage. The scanner scanned at multiple angles along the X, Y, and Z axes, once every 15°, for a total of 24 viewpoints. The resulting 3D model was stitched together using software, clearly showing the surface contours of the tip and curved parts. The software stitching process is existing technology and will not be described in detail here.

[0069] In this embodiment, the compensation parameter for the influence of curvature on the initial overall current density is set as R, where the compensation parameter for the influence of curvature on the initial overall current density is determined based on the range of the radius of curvature.

[0070] When the radius of curvature is greater than or equal to 0.5 mm, R is 0.9;

[0071] When the radius of curvature is between 0.2 and 0.5, R is 0.7;

[0072] When the radius of curvature is less than 0.2, R is 0.4;

[0073] Among them, the compensation parameter for the effect of curvature on the initial overall current density is negatively correlated with curvature;

[0074] For the bent portion, the outer convex surface of the spring has a high bending radius R = 0.15mm, is made of stainless steel, requires nickel plating, and the bending degree is less than 0.2mm; R is taken as 0.4. The reference current density is 2.0A / dm³. 2 The initial overall current density is 2.0 × 0.3 = 0.6 A / dm². 2 ,

[0075] This embodiment uses the tip assembly of a spring probe as an example. It contains multiple tip points, and the electroplating current needs to be precisely controlled to avoid the tips being too thick.

[0076] The adjustment factor for a single tip is set to 0.9. The tip adjustment factor is the adjustment parameter of the actual number of tip points on the initial value of the initial overall current density. Since the more tips there are, the higher the risk of current concentration, the initial value needs to be gradually reduced to balance the distribution.

[0077] The actual number of detection points is 3. The initial overall current density target value is the initial overall current density value × the total adjustment coefficient = 0.6 × 0.9 3 =0.4374A / dm 2 .

[0078] High-precision 3D scanning captures the curvature and tip locations of components, transforming geometric features into quantifiable current density parameters. This replaces traditional empirical settings, improving the accuracy and consistency of the electroplating process. Bending compensation parameters are dynamically adjusted based on the radius of curvature, reducing the initial current for highly curved areas such as the outer convex surface of springs to prevent excessively thick plating. The current is further optimized by adjusting coefficients based on the number of tips, suppressing current concentration at the tips and reducing the risk of excessive thickness or burning. For complex components with multiple bends and tips, such as needles and springs, staged parameter calculations first determine the initial value, then adjust the target value, ensuring uniform plating across different areas and meeting precision connection requirements. A unified parameter calculation logic applies to various components, reducing process fluctuations caused by differences in operator experience and ensuring quality stability in mass production. Combining the characteristics of materials such as stainless steel and the functional requirements of nickel plating, refined current density control ensures plating adhesion while preventing internal stress cracking, balancing corrosion resistance and structural strength.

[0079] Specifically, the process of obtaining the first electroplating parameter by detecting the electroplating parameters of the coaxial connector of the finished spring probe connector includes,

[0080] The surface of the coaxial connector is divided into several regions. The electroplating thickness of any coaxial connector surface region is randomly selected for testing to obtain the actual electroplating thickness of the region. The actual electroplating thickness is compared with the standard electroplating thickness range to obtain the electroplating thickness comparison result. Based on the electroplating thickness comparison result, it is determined whether the electroplating uniformity meets the standard.

[0081] The standard electroplating layer thickness range is determined based on the initial overall current density and the actual curvature corresponding to the surface area of ​​the coaxial connector.

[0082] Specifically, the process of determining whether the electroplating uniformity meets the standard based on the comparison results of the electroplated layer thickness includes,

[0083] If the comparison result of the electroplating layer thickness shows that the actual area electroplating layer thickness is less than the minimum value of the standard electroplating layer thickness range, the initial overall current density is increased according to the difference between the actual area electroplating layer thickness and the minimum value of the standard electroplating layer thickness range, or the electroplating time is increased.

[0084] If the comparison result of the electroplating layer thickness shows that the actual electroplating layer thickness in the area is within the range of the standard electroplating layer thickness, the electroplating control parameters should be maintained.

[0085] If the comparison result of the electroplating layer thickness shows that the actual area electroplating layer thickness is greater than the maximum value of the standard electroplating layer thickness range, the initial overall current density is reduced based on the difference between the actual area electroplating layer thickness and the maximum value of the standard electroplating layer thickness range, or the electroplating time is reduced.

[0086] In this embodiment, the coaxial connector to be tested is made of brass and is used for signal transmission in marine exploration equipment. It has a nickel-plated surface layer for corrosion resistance, with a designed thickness of 5-8 μm, plus a conductive gold layer with a designed thickness of 0.5-1 μm. Testing is required to determine if the plating uniformity meets the standards, and parameters are adjusted based on the results to ensure there are no weak points in the salt spray environment.

[0087] Based on structural characteristics and current distribution patterns, the surface of the coaxial connector is divided into three regions: Region A (active contact area), Region B (bending transition area), and Region C (fixed shell area). The actual bending degree of Region A (active contact area) is a slight bend with a curvature radius of 10mm; Region B (bending transition area) has a moderate bend with a curvature radius of 3mm; and Region C (fixed shell area) has a gentle curve with a curvature radius of 20mm.

[0088] Three detection points were randomly selected in region A, located at the edge, center, and curved transition point of region A, respectively. The actual electroplating layer thicknesses at the three points were measured using an X-ray fluorescence thickness gauge: A1 was 6.2 μm, A2 was 7.5 μm, and A3 was 5.8 μm. The standard range for the nickel layer in region A is 6-8 μm, and all three points were within this range.

[0089] The relative deviation in region A is (7.5 - 5.8) / [(6.2 + 7.5 + 5.8) / 3] = 26%. Since the marine environment requires a nickel layer uniformity of less than or equal to 20%, the nickel layer uniformity in region A is determined to be insufficient.

[0090] The 5.8μm point is close to the standard lower limit of 6μm, with a difference of 0.2μm. Because this point is located at the edge of region A, there is a slight shielding effect, resulting in a slightly lower current.

[0091] The difference between the actual thickness and the standard lower limit is 0.2 μm, corresponding to a current density adjustment factor of 0.1 A / dm. 2 Based on historical experimental data: for every 0.1 μm difference in nickel layer thickness, the current density needs to be increased or decreased by 0.05 A / dm. 2 ,

[0092] Adjust the initial overall current density: The initial overall current density in region A is adjusted from 0.4374 / dm². 2 Increased to 0.6374 / dm 2 The electroplating time remains unchanged at 15 minutes.

[0093] By dividing the area into functional zones such as active contact areas and bending transition zones, the coating status of each area is specifically tested to avoid the overall average data masking local defects and to accurately locate coating deviations in weak points such as edge areas. By comparing the actual thickness of each area with the corresponding standard range, deviation analysis is used to objectively determine whether uniformity meets the standards, rather than relying solely on intuition, ensuring that the judgment results match the corrosion resistance requirements of the marine environment. For detected thickness deviations, such as edge areas approaching the lower limit, adjustment plans are developed based on the cause of the deviation—insufficient current due to the shielding effect. Current density is optimized based on historical experience to avoid blind adjustments and ensure a more uniform coating thickness distribution after adjustment. Fine-tuning the current to compensate for insufficient current in edge areas enhances the coating quality of weak parts, reduces the risk of corrosion due to localized excessive thinness, and improves the overall corrosion resistance of the connector in salt spray environments. A closed loop is formed between the test data and the adjustment logic, making the electroplating parameter settings more closely match the structural characteristics of the component, such as the curvature and shielding effect of different areas, reducing batch-to-batch quality fluctuations and ensuring process stability.

[0094] Specifically, the process of detecting the dielectric barrier parameters between the coaxial connector and the insulating heat shrink tubing includes,

[0095] The degree of salt spray particle distribution between the coaxial connector and the insulating heat shrink tubing is detected, and the medium barrier parameters are determined based on the degree of salt spray particle distribution.

[0096] The medium barrier parameter is negatively correlated with the degree of salt spray particle distribution.

[0097] Select three coaxial connector assemblies from the same batch, numbered 1, 2, and 3 respectively, and ensure that the sleeve is tightly shrunk, with no obvious bubbles or gaps visible to the naked eye.

[0098] A salt spray test chamber was used to continuously spray salt spray at a concentration of 5% for 48 hours, with a pH of 6.5-7.2 and a temperature of 35℃±2℃, to simulate a high-humidity, high-salt marine environment.

[0099] Salt spray particle distribution refers to the location, quantity, and coverage area of ​​salt spray penetrating between the connector and the sleeve through gaps.

[0100] After the test, carefully peel off the insulating heat shrink tubing to avoid damaging any salt spray residue. Gently rinse the connector surface with deionized water to remove any adhering salt spray, leaving any particle residue in the gaps. Observe the contact area between the connector and the tubing using a high-definition microscope.

[0101] Record the distribution level of salt spray particles.

[0102] No visible white salt spray particles or NaCl crystals were found in the Level 0 area, and the distribution degree was quantified as 0.

[0103] Level 1 particles are only distributed at the edge of the area, covering an area of ​​≤5%, and the distribution degree is quantified as 1.

[0104] Level 2 particles are distributed at the edge and center of the region, covering an area of ​​6%-20%, with a distribution degree quantification value of 2;

[0105] Level 3 particles are densely distributed, covering an area of ​​>20%, or there is continuous salt frost, with a distribution degree quantification value of 3;

[0106] The media barrier parameter is defined as a score of the connector and sleeve's ability to block salt spray penetration, ranging from 0 to 100. It is negatively correlated with the degree of salt spray particle distribution; the higher the distribution degree, the lower the parameter value and the worse the barrier capability.

[0107] If the detection degree of salt spray particle distribution is 2, then the actual medium barrier parameter is 100 - 2 × 2 = 94 points.

[0108] The salt spray test chamber simulates the high-salt and high-humidity marine environment, accurately reproducing the salt spray corrosion scenario of connectors and sleeves in actual use, ensuring that the test results directly reflect the actual protective capability. Salt spray particle distribution is divided into different levels, and the degree of penetration is described from multiple dimensions, including location, quantity, and coverage area, enabling a quantitative assessment of the barrier effect and making the results more valuable. A scoring mechanism transforms qualitative penetration phenomena into intuitive media barrier parameters, and these parameters are negatively correlated with the degree of penetration, clearly distinguishing the differences in protective performance between different samples and facilitating the selection of qualified products. Careful handling during sleeve peeling, preserving residual particles in the gaps, avoids artificially destroying real penetration traces, ensuring that the state observed under the microscope is consistent with the actual corrosion situation, making the test data more reliable. Addressing the corrosion risks that may be caused by salt spray penetration in the marine environment, this testing process can identify fitting defects between the connector and sleeve in advance, such as edge gaps, providing a clear direction for optimizing the heat shrink process and improving overall sealing, ensuring the long-term stable operation of the connector.

[0109] Specifically, the process of determining whether the impedance stability is qualified based on the actual dielectric barrier parameters and electroplating indicators includes,

[0110] By comparing the actual dielectric barrier parameters with the standard dielectric barrier parameters, a dielectric barrier comparison result is obtained. Based on the dielectric barrier comparison result and the electroplating index, it is determined whether the impedance stability is qualified.

[0111] Specifically, the process of determining whether the impedance stability is qualified based on the comparison results of the dielectric barrier and the electroplating indicators includes the following:

[0112] If the actual dielectric barrier parameter is less than or equal to the standard dielectric barrier parameter in the dielectric barrier comparison result, the impedance stability is deemed qualified.

[0113] If the actual dielectric barrier parameter is greater than the standard dielectric barrier parameter, the impedance stability is judged to be qualified based on the difference between the actual dielectric barrier parameter and the standard dielectric barrier parameter, as well as the electroplating index.

[0114] In this embodiment, the finished spring probe connector is used in marine exploration equipment operating at frequencies (1-10GHz). It must meet the following requirements: long-term impedance stability with impedance fluctuation ≤5%. The standard dielectric barrier parameter is set at 90 points. Standard electroplating parameters are set as follows: nickel layer thickness 5-8μm, uniformity ≤15%; gold layer thickness 0.5-1μm, uniformity ≤10%. Meeting both standards is considered a qualified electroplating indicator; failing to meet either standard is considered an unqualified electroplating indicator.

[0115] If the actual dielectric barrier parameter is greater than or equal to the standard dielectric barrier parameter, the impedance stability is directly deemed to be qualified and the barrier capability is qualified. If the electroplating index is qualified, there is no risk of corrosion.

[0116] If the actual medium barrier parameter is less than the standard medium barrier parameter

[0117] If the difference between the actual dielectric barrier parameter and the standard dielectric barrier parameter is ≤5 points, and the electroplating index is qualified, the impedance stability is deemed qualified, and the risk of slight leakage can be compensated by electroplating protection.

[0118] If the difference between the actual dielectric barrier parameter and the standard dielectric barrier parameter is greater than 5 points, and the electroplating index is qualified, the impedance stability is judged to be critically qualified, and protection needs to be strengthened.

[0119] If the difference between the actual dielectric barrier parameter and the standard dielectric barrier parameter is ≤5 points and the electroplating index is unqualified, the impedance stability is deemed unqualified and the weak electroplating area cannot resist leakage.

[0120] If the difference between the actual dielectric barrier parameter and the standard dielectric barrier parameter is greater than 5 points, and the electroplating index is unqualified, the impedance stability is judged to be seriously unqualified.

[0121] By combining the physical protection capability of dielectric barrier parameters with the corrosion resistance of electroplating indicators, misjudgments based on a single indicator are avoided. This prevents both the potential risk of meeting barrier standards but having a weak coating, and the hidden danger of excellent coatings but barrier failure, comprehensively ensuring impedance stability. For the differences between different dielectric barrier parameters and standards, and in conjunction with electroplating indicators, the judgment levels are refined to include qualified, critically qualified, and unqualified. This allows for strict control of product quality in high-demand scenarios such as deep-sea exploration, and provides improvement directions for critically qualified products, such as enhanced protection. For the high-frequency operating characteristics of marine exploration equipment, the judgment standards are directly linked to impedance fluctuation control requirements, ensuring stable signal transmission of qualified products during long-term use and reducing signal attenuation or distortion caused by corrosion or poor contact. Critically qualified products are promptly alerted to the need for enhanced protection, while unqualified products are explicitly rejected, preventing equipment failure due to impedance instability after entering actual application scenarios, reducing subsequent maintenance costs and safety risks. The judgment logic is clear, such as the difference range and the corresponding results of indicator combinations, facilitating unified standards in production and quality inspection, ensuring consistency in judgment across different batches of products, and improving overall quality control efficiency.

[0122] Specifically, the process of adjusting the electroplating control parameters based on the first electroplating parameters to obtain a spring probe connector with satisfactory impedance stability includes:

[0123] For cases where the electroplated layer thickness meets the standard electroplated layer thickness range, maintain the electroplating control parameters;

[0124] If the thickness of the electroplated layer does not meet the standard electroplated layer thickness range, the electroplating time or the initial overall current density shall be adjusted according to the difference in electroplated layer thickness.

[0125] Specifically, the process of adjusting the electroplating time or the initial overall current density based on the difference in electroplated layer thickness includes,

[0126] If the initial overall current density cannot be adjusted, the electroplating time should be adjusted according to the difference in electroplating layer thickness.

[0127] In this embodiment, the spring probe needle assembly to be adjusted is made of brass and requires a nickel plating layer for corrosion resistance. The standard plating layer thickness range is 5-8 μm, meeting marine environmental requirements. The initial plating control parameters are an initial overall current density of 1.2 A / dm² and a plating time of 15 minutes. Testing revealed that the plating thickness of some components did not meet the standard, necessitating parameter adjustments based on the difference to ensure that the final impedance stability fluctuation is ≤5%.

[0128] The actual thickness is 6.2μm, within the range of 5-8μm. The electroplating uniformity meets the standard of 12%, maintaining the initial overall current density of 1.2A / dm. 2 The electroplating time is 15 minutes and no adjustment is required.

[0129] The actual electroplated layer thickness of 4.0 μm is too thin, with a difference of 1.0 μm, and needs to be increased by 1.0 μm.

[0130] The thickness of the nickel plating is positively correlated with current density and duration; higher current density and longer duration result in a thicker plating. Within the adjustable current density range, the equipment allows for 1.0-1.5 A / dm². 2 Furthermore, since the needle has no sharp tip, the risk of current concentration is low. Therefore, adjusting the current density is recommended: based on experimental data, for every 0.1 A / dm³ increase in current density... 2 The thickness increases by approximately 0.5 μm within 15 minutes. A further increase of 1.0 μm is needed, therefore the current density is adjusted to 1.2 + 0.2 = 1.4 A / dm². 2 Electroplating time is maintained at 15 minutes.

[0131] The actual electroplated layer thickness of 9.5μm is too thick; the difference is 1.5μm, so it needs to be reduced by 1.5μm.

[0132] For every 0.1 A / dm³ decrease in current density 2 The thickness decreased by approximately 0.5 μm within 15 minutes. A reduction of 1.5 μm is required, therefore the initial overall current density is adjusted to 1.2 - 0.3 = 0.9 A / dm². 2 Electroplating time is maintained at 15 minutes.

[0133] To address whether the coating thickness falls within the standard range, a differentiated approach is adopted. When the thickness meets the standard, parameters are maintained to avoid ineffective adjustments. When it falls short, the current density or duration is precisely adjusted based on the difference to ensure the thickness quickly returns to the acceptable range, providing a fundamental guarantee for impedance stability. When the current density is adjusted due to component characteristics, such as the absence of a sharp point for adjustment, or the presence of a sharp point that cannot be adjusted, thickness compensation is achieved through duration adjustment. This balances process feasibility and quality requirements, adapting to the structural limitations of different components. Priority is given to adjusting the current density for components with faster response times, suitable for components without sharp points and with low risk of current concentration, improving adjustment efficiency. For components with sharp points, duration adjustment is used to avoid coating defects such as burning and cracking caused by excessive current, ensuring coating integrity. The thickness difference is correlated with the adjustment range, such as specific differences corresponding to fixed current or duration changes, forming a replicable adjustment logic. This reduces fluctuations caused by differences in human experience, ensuring stable coating quality in mass production, and thus maintaining consistent impedance performance. By adjusting parameters to ensure that the coating thickness and uniformity meet the standards, impedance fluctuations caused by localized corrosion due to excessive thinness or internal stress cracking due to excessive thickness are reduced, enabling the connector to maintain stable signal transmission performance in long-term salt spray environments.

[0134] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of the present invention.

[0135] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for manufacturing a spring probe connector, characterized in that, include, The components of the spring probe connector are pre-processed to obtain spring probe connector assemblies. The spring probe connector assemblies are electroplated to obtain electroplated spring probe connector assemblies. The electroplated spring probe connector assemblies are then assembled to obtain the finished spring probe connector. Based on the marine environment usage scenario, the electroplating parameters of the coaxial connector of the finished spring probe connector are detected to obtain the first electroplating parameter. The first electroplating parameter and the second electroplating parameter are compared to obtain the electroplating parameter comparison result. Based on the electroplating parameter comparison result, it is determined whether its electroplating index is qualified. If the electroplating is qualified, the insulating heat shrink tubing is covered on the outside of the electroplated spring probe connector assembly and fixed by heat shrinking. The dielectric barrier parameter between the coaxial connector and the insulating heat shrink tubing is detected to obtain the actual dielectric barrier parameter. The impedance stability is determined to be qualified based on the actual dielectric barrier parameter and the electroplating index. For cases where the electroplating parameters are not up to standard, the electroplating control parameters are adjusted based on the first electroplating parameter to obtain a spring probe connector with acceptable impedance stability. The electroplated spring probe assembly includes a coaxial connector, a first spring probe, and a second spring probe. The electroplating parameters are determined based on the electroplating layer thickness and electroplating uniformity; the second electroplating parameter is the electroplating parameter of the spring probe; the electroplating index is an indicator reflecting corrosion resistance; the medium barrier parameter is the amount of salt spray penetration within a preset time; the electroplating control parameters include electroplating duration and initial overall current density. The process of electroplating each component of the spring probe connector to obtain the electroplated spring probe connector assembly includes the following steps: Scan each component of the spring probe connector to obtain a 3D image of each component. Select any component's 3D image and measure its curvature and tip position to obtain the actual curvature and the actual number of tip positions. Determine the initial value of the initial overall current density based on the actual curvature and the compensation parameter for the influence of curvature on the initial overall current density. Adjust the initial value of the initial overall current density according to the actual number of tip positions to obtain the target value of the initial overall current density.

2. The method for manufacturing a spring probe connector according to claim 1, characterized in that, The process of obtaining the first electroplating parameter by detecting the electroplating parameters of the coaxial connector of the finished spring probe connector includes the following steps: The surface of the coaxial connector is divided into several regions. The electroplating thickness of any coaxial connector surface region is randomly selected for testing to obtain the actual electroplating thickness of the region. The actual electroplating thickness is compared with the standard electroplating thickness range to obtain the electroplating thickness comparison result. Based on the electroplating thickness comparison result, it is determined whether the electroplating uniformity meets the standard. The standard electroplating layer thickness range is determined based on the initial overall current density and the actual curvature corresponding to the surface area of ​​the coaxial connector.

3. The method for manufacturing a spring probe connector according to claim 2, characterized in that, The process of determining whether the electroplating uniformity meets the standard based on the comparison results of the electroplated layer thickness includes: If the comparison result of the electroplating layer thickness shows that the actual area electroplating layer thickness is less than the minimum value of the standard electroplating layer thickness range, the initial overall current density is increased according to the difference between the actual area electroplating layer thickness and the minimum value of the standard electroplating layer thickness range, or the electroplating time is increased. If the comparison result of the electroplating layer thickness shows that the actual electroplating layer thickness in the area is within the range of the standard electroplating layer thickness, the electroplating control parameters should be maintained. If the comparison result of the electroplating layer thickness shows that the actual area electroplating layer thickness is greater than the maximum value of the standard electroplating layer thickness range, the initial overall current density is reduced based on the difference between the actual area electroplating layer thickness and the maximum value of the standard electroplating layer thickness range, or the electroplating time is reduced.

4. The method for manufacturing a spring probe connector according to claim 3, characterized in that, The process of detecting the dielectric barrier parameters between the coaxial connector and the insulating heat shrink tubing includes, The degree of salt spray particle distribution between the coaxial connector and the insulating heat shrink tubing is detected, and the medium barrier parameters are determined based on the degree of salt spray particle distribution. The medium barrier parameter is negatively correlated with the degree of salt spray particle distribution.

5. The method for manufacturing a spring probe connector according to claim 4, characterized in that, The process of determining whether the impedance stability is qualified based on the actual dielectric barrier parameters and electroplating indicators includes: By comparing the actual dielectric barrier parameters with the standard dielectric barrier parameters, a dielectric barrier comparison result is obtained. Based on the dielectric barrier comparison result and the electroplating index, it is determined whether the impedance stability is qualified.

6. The method for manufacturing a spring probe connector according to claim 5, characterized in that, The process of determining whether the impedance stability is qualified based on the comparison results of the dielectric barrier and the electroplating indicators includes: If the actual dielectric barrier parameter is less than or equal to the standard dielectric barrier parameter in the dielectric barrier comparison result, the impedance stability is deemed qualified. If the actual dielectric barrier parameter is greater than the standard dielectric barrier parameter, the impedance stability is judged to be qualified based on the difference between the actual dielectric barrier parameter and the standard dielectric barrier parameter, as well as the electroplating index.

7. The method for manufacturing a spring probe connector according to claim 6, characterized in that, The process of adjusting the electroplating control parameters based on the first electroplating parameters to obtain a spring probe connector with satisfactory impedance stability includes the following steps: For cases where the electroplated layer thickness meets the standard electroplated layer thickness range, maintain the electroplating control parameters; If the thickness of the electroplated layer does not meet the standard electroplated layer thickness range, the electroplating time or the initial overall current density shall be adjusted according to the difference in electroplated layer thickness.

8. The method for manufacturing a spring probe connector according to claim 7, characterized in that, The process of adjusting the electroplating time or initial overall current density based on the difference in electroplating layer thickness includes: If the initial overall current density cannot be adjusted, the electroplating time should be adjusted according to the difference in electroplating layer thickness.

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