Heat dissipation device and control method

Abstract

The invention discloses a heat dissipation device and a control method, and relates to the technical field of heat dissipation, the heat dissipation device comprises a main heat dissipation module, an expansion heat dissipation module and a control unit, the main heat dissipation module and the expansion heat dissipation module are flexibly combined and split through a quick connector to form a modular structure, independent maintenance and replacement of each module are facilitated, and the heat dissipation efficiency is improved. And the heat dissipation requirements of different numbers of to-be-cooled pieces can be met. Each heat dissipation module is provided with an independent flow control valve, the first temperature detection mechanism on the corresponding part to be cooled is combined, under coordination of the control unit, the opening degree of the valve can be adjusted in real time according to first temperature data, and dynamic adaptation of the flow of cooling liquid is achieved. Therefore, the technical problems that an existing heat dissipation system is fixed in structure and difficult to adapt to the heat dissipation requirements of different numbers of hardware in the updating process of the server, and the heat dissipation performance is not matched with the actual heat load can be solved, and the technical effects of adapting to the heat dissipation requirements of different numbers of to-be-cooled pieces and achieving dynamic adaptation of the cooling liquid flow are achieved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a control method. Background Art

[0002] With the rapid development of artificial intelligence and high-performance computing technologies, the system integration of graphics processing unit (GPU) cabinets continues to improve. Not only are more GPUs integrated within a single cabinet, but components such as GPUs and memory are also optimized and integrated to form highly coordinated high-performance computing units. However, the simultaneous operation of numerous high-power chips causes a sharp increase in heat density within the cabinet, significantly increasing heat generation and heat dissipation pressure. The current cooling system has a fixed structure and is difficult to adapt to the cooling needs of varying hardware quantities during server upgrades. Moreover, the cooling performance does not match the actual heat load, affecting the stable operation of the server. Summary of the Invention

[0003] The present application provides a heat dissipation device and a control method to at least solve the problem in the related art that the heat dissipation system structure is fixed, making it difficult to adapt to the heat dissipation requirements of different quantities of hardware during server upgrades, and the heat dissipation performance does not match the actual heat load, affecting the stable operation of the server.

[0004] The present application provides a heat dissipation device, including a main heat dissipation module, an extended heat dissipation module and a control unit, the main heat dissipation module including a liquid inlet module and a liquid outlet module; the extended heat dissipation module is connected to the liquid inlet module and the liquid outlet module through a quick-connect joint; the main heat dissipation module and the extended heat dissipation module are respectively used to cooperate with a group of parts to be cooled for heat conduction; and each of the parts to be cooled is provided with a first temperature detection mechanism; the main heat dissipation module and the extended heat dissipation module are respectively provided with a flow control valve; the control unit is communicatively connected with the first temperature detection mechanism and the flow control valve, and adjusts the valve opening of the corresponding flow control valve according to the first temperature data of the first temperature detection mechanism.

[0005] The present application also provides a control method for the above-mentioned heat dissipation device, comprising the following steps: Acquiring first temperature data of a first temperature detection mechanism; The valve opening of the corresponding flow control valve is adjusted according to the first temperature data.

[0006] Through this application, by connecting the main heat dissipation module and the extended heat dissipation module via quick-connect connectors, the main heat dissipation module and the extended heat dissipation module can be quickly connected and disconnected, forming a modular structure. This not only enables the system to be flexibly combined to adapt to the heat dissipation needs of different numbers of parts to be cooled, but also improves maintainability: each module can be independently maintained or replaced, reducing maintenance costs and time in the event of a single module failure; it also avoids the efficiency loss and risks associated with the need for complete disassembly in traditional integrated heat dissipation solutions, and reduces the need for customized piping processing, thereby effectively controlling manufacturing costs; at the same time, each heat dissipation module is equipped with an independent flow control valve. Combined with the first temperature detection mechanism on the corresponding part to be cooled, under the coordination of the control unit, the valve opening can be adjusted in real time based on the first temperature data to achieve dynamic adaptation of the coolant flow rate. This ensures the independence and targeted heat dissipation of each part to be cooled, improves heat dissipation efficiency, and avoids energy waste through intelligent control. Therefore, it is possible to solve the technical problems that the current cooling system has a fixed structure, is difficult to adapt to the cooling needs of different numbers of hardware during server upgrades, and the cooling performance does not match the actual heat load, affecting the stable operation of the server. It can adapt to the cooling needs of different numbers of parts to be cooled, and realize dynamic adaptation of the coolant flow rate, making the entire cooling process more efficient, energy-saving, flexible and reliable, and can effectively meet the cooling needs under different working conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0008] Figure 1 A schematic structural diagram of a heat dissipation device provided in an embodiment of the present application; Figure 2 A schematic structural diagram of the main heat dissipation module provided in an embodiment of the present application; Figure 3 An exploded schematic diagram of the main heat dissipation module provided in an embodiment of the present application; Figure 4 A schematic structural diagram of a second heat dissipation module provided in an embodiment of the present application; Figure 5 This is an exploded schematic diagram of the second heat dissipation module provided in an embodiment of the present application; Figure 6 A schematic structural diagram of a third heat dissipation module provided in an embodiment of the present application; Figure 7 An exploded schematic diagram of a third heat dissipation module provided in an embodiment of the present application; Figure 8A schematic flow chart of a control method for a heat dissipation device according to an embodiment of the present invention.

[0009] The above drawings include the following reference numerals: 10. Main heat dissipation module; 11. Liquid inlet module; 111. Liquid inlet pipeline; 112. Liquid inlet manifold; 113. First floating module; 12. Liquid outlet module; 121. Liquid outlet pipeline; 122. Liquid outlet manifold; 123. Second floating module; 13. First heat dissipation module; 1311. First cold plate; 1312. Second cold plate; 1313. Third cold plate; 1314. First connecting pipe; 1315. Second connecting pipe; 1316. First fixing cover; 1317. Second fixing cover; 132. First water inlet pipeline; 1331. First cooling pipe; 1332. Second cooling pipe; 1333. Flexible connecting pipe; 1334. First transfer water head; 1335. Second transfer water head; 21. Second heat dissipation module; 211. Second heat dissipation assembly; 2111. Fourth cold plate; 2112. Fifth cold plate; 2113. Sixth cold plate; 2114. Seventh cold plate; 2115. Third connecting pipe; 2116. Fourth connecting pipe; 2117. Fifth connecting pipe; 2118. Sixth connecting pipe; 2119. Third fixing cover; 2110. Fourth fixing cover; 212. Second water inlet pipe; 213. Second water outlet pipe; 214. Third transfer water head; 215. Fourth transfer water head; 216. Fifth transfer water head; 22. Third heat dissipation module; 221. Third heat dissipation assembly; 2211. Eighth cold plate; 2212. Liquid cooling assembly; 22121a. Main pipe; 22121b. Branch pipe; 22122. Liquid-cooled aluminum sheet; 22123. Connecting pipe; 2213. Ninth cold plate; 2214. First fixing member; 2215. Second fixing member; 2216. Seventh connecting pipe; 222. Third water inlet pipe; 223. Third water outlet pipe; 2231. Fastening nut; 30. Quick-connect connector; 31. Quick-connect male connector; 32. Quick-connect female connector. DETAILED DESCRIPTION

[0010] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0011] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0012] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0013] The embodiments of the present application provide a heat dissipation device and a control method, and the devices are described in detail in combination with the structures and working principles of the heat dissipation device and the control method.

[0014] According to an embodiment of the present invention, on the one hand, a heat dissipation device is provided, such as Figure 1As shown, it includes a main heat dissipation module 10, an extended heat dissipation module and a control unit. The main heat dissipation module 10 includes a liquid inlet module 11 and a liquid outlet module 12; the extended heat dissipation module is connected to the liquid inlet module 11 and the liquid outlet module 12 through a quick connector 30; the main heat dissipation module 10 and the extended heat dissipation module are respectively used to cooperate with a group of parts to be cooled for heat conduction; and each part to be cooled is provided with a first temperature detection mechanism; the main heat dissipation module 10 and the extended heat dissipation module are respectively provided with a flow control valve; the control unit is communicated with the first temperature detection mechanism and the flow control valve, and adjusts the valve opening of the corresponding flow control valve according to the first temperature data of the first temperature detection mechanism.

[0015] In the above embodiment, since the main heat dissipation module 10 and the extended heat dissipation module are connected via a quick-connect connector 30, the main heat dissipation module 10 and the extended heat dissipation module can be quickly connected and disconnected, forming a modular structure. This not only enables the system to be flexibly combined to adapt to the heat dissipation needs of different numbers of components to be cooled, but also improves maintainability: each module can be independently maintained or replaced, reducing maintenance costs and time in the event of a single module failure; it also avoids the efficiency loss and risks associated with the traditional integrated heat dissipation solution that requires complete disassembly, and reduces the need for customized pipeline processing, thereby effectively controlling manufacturing costs; at the same time, each heat dissipation module is equipped with an independent flow control valve. Combined with the first temperature detection mechanism on the corresponding component to be cooled, under the coordination of the control unit, the valve opening can be adjusted in real time based on the first temperature data to achieve dynamic adaptation of the coolant flow rate. This ensures the independence and targeted heat dissipation of each component to be cooled, improves heat dissipation efficiency, and avoids energy waste through intelligent control. Therefore, it is possible to solve the technical problems that the current cooling system has a fixed structure, is difficult to adapt to the cooling needs of different numbers of hardware during server upgrades, and the cooling performance does not match the actual heat load, affecting the stable operation of the server. It can adapt to the cooling needs of different numbers of parts to be cooled, and realize dynamic adaptation of the coolant flow rate, making the entire cooling process more efficient, energy-saving, flexible and reliable, and can effectively meet the cooling needs under different working conditions.

[0016] In a specific embodiment, the quick-connect connector 30 includes a quick-connect male connector 31 and a quick-connect female connector 32, which plug and match to quickly connect and disconnect the pipes. This allows for tool-free assembly and disassembly, improving the efficiency of heat sink maintenance and module replacement. It also offers excellent sealing and reliability, making it suitable for heat sink modules that require frequent disassembly or expansion.

[0017] In one embodiment, Figure 2 and Figure 3As shown, the main heat dissipation module 10 also includes a first heat dissipation module 13, which includes a first heat dissipation component, a first water inlet pipe 132 and a first water outlet pipe; the two ends of the first water inlet pipe 132 are respectively connected to the liquid inlet module 11 and the first heat dissipation component; and a flow control valve is provided on the first water inlet pipe 132; the two ends of the first water outlet pipe are respectively connected to the first heat dissipation component and the liquid outlet module 12.

[0018] In the above embodiment, the first heat dissipation component is connected to the liquid inlet module 11 and the liquid outlet module 12 respectively through an independent first water inlet pipe 132 and a first water outlet pipe, forming a complete and independent heat dissipation flow channel, which can ensure that the coolant circulates efficiently within the first heat dissipation module 13. At the same time, a flow control valve is provided on the first water inlet pipe 132, which can regulate the flow of coolant entering the first heat dissipation component according to the needs of the cooling component corresponding to the first heat dissipation component, thereby achieving targeted heat dissipation. This not only ensures the stable connection between the first heat dissipation module 13 and the overall heat dissipation device, but also improves the flexibility and accuracy of heat dissipation regulation through independent pipes and dedicated control valves, can effectively adapt to the heat dissipation needs of the cooling component under different working conditions, and enhances heat dissipation efficiency and reliability.

[0019] In a specific embodiment, the first water inlet pipe 132 can be made of a metal material such as copper, aluminum, or stainless steel, or can also be made of a plastic or rubber material. It should be noted that in this embodiment, the first water inlet pipe 132 is a copper pipe, and its ends are welded to the inlet manifold 112 and the first cold plate 1311, respectively.

[0020] In one embodiment, Figure 2 and Figure 3 As shown, the first heat dissipation assembly includes a first cold plate 1311, a second cold plate 1312 and a third cold plate 1313; the first cold plate 1311 is connected to the first water inlet pipe 132; the second cold plate 1312 is connected to the first cold plate 1311; the third cold plate 1313 is connected to the second cold plate 1312 and is connected to the first water outlet pipe.

[0021] In the above embodiment, the first heat dissipation component is connected in sequence by the first cold plate 1311, the second cold plate 1312, and the third cold plate 1313. The series connection method can form a smooth and orderly flow path for the coolant inside the first heat dissipation component, ensuring that the cooling water can flow through each cold plate in sequence and fully exchange heat with the cold plate, avoiding the problem of heat dissipation dead corners caused by local water flow stagnation; and the split and independent setting of the first cold plate 1311, the second cold plate 1312 and the third cold plate 1313 is not only conducive to the flexible layout of the cold plate position according to actual heat dissipation needs and adapt to different installation spaces, but also can flexibly arrange the positions of each cold plate according to the structural characteristics of the component to be cooled, ensuring more accurate and comprehensive heat dissipation coverage, and effectively enhancing the overall heat dissipation efficiency and adaptability of the first heat dissipation component.

[0022] In a specific embodiment, the second cold plate 1312 is connected to the first cold plate 1311 via a first connecting pipe 1314. The first connecting pipe 1314 is a copper pipe, and its ends are welded to the second cold plate 1312 and the first cold plate 1311, respectively. The second cold plate 1312 is connected to the third cold plate 1313 via a second connecting pipe 1315. The second connecting pipe 1315 is a copper pipe, and its ends are welded to the second cold plate 1312 and the third cold plate 1313, respectively.

[0023] In a specific embodiment, the first heat dissipation assembly further includes a first fixing cover 1316 and a second fixing cover 1317. The first fixing cover 1316 is used to fix the first cold plate 1311; the second fixing cover 1317 is used to fix the third cold plate 1313. Specifically, the first cold plate 1311 and the third cold plate 1313 are both arranged on one side of the second cold plate 1312.

[0024] In a specific embodiment, the first cold plate 1311, the second cold plate 1312, and the third cold plate 1313 are each thermally coupled to a component to be cooled, which can be a graphics processing unit (GPU), a central processing unit (CPU), or other types of chips or electronic components. In this embodiment, the first cold plate 1311 is thermally coupled to the GPU, the second cold plate 1312 is thermally coupled to the retimer chip, and the third cold plate 1313 is thermally coupled to the GPU.

[0025] Specifically, a first temperature detection mechanism is provided on each of the parts to be cooled corresponding to the first cold plate 1311 , the second cold plate 1312 and the third cold plate 1313 .

[0026] In one embodiment, Figure 2 and Figure 3 As shown, the first water outlet pipeline includes a first cooling pipe 1331, a second cooling pipe 1332 and a flexible connecting pipe 1333; one end of the first cooling pipe 1331 is connected to the second cold plate 1312; one end of the second cooling pipe 1332 is connected to the liquid outlet module 12; both ends of the flexible connecting pipe 1333 are respectively connected to the other end of the first cooling pipe 1331 and the other end of the second cooling pipe 1332.

[0027] In the above embodiment, the combination of the first cooling pipe 1331, the second cooling pipe 1332 and the flexible connecting pipe 1333 not only ensures the overall structural stability of the first water outlet pipe, but also enhances the adaptability of the first water outlet pipe with the help of the characteristics of the flexible connecting pipe 1333. The flexible connecting pipe 1333 is connected between the first cooling pipe 1331 and the second cooling pipe 1332, which can effectively buffer the displacement and stress of the first water outlet pipe caused by installation errors, equipment vibration or temperature changes, and avoid the first water outlet pipe from being damaged or leaked due to hard pulling or squeezing. At the same time, the segmented structure design facilitates the installation, disassembly and maintenance of the first water outlet pipe, and the layout of the first water outlet pipe can be flexibly adjusted according to actual needs, further improving the reliability and practicality of the entire heat dissipation device.

[0028] In a specific embodiment, the first cooling pipe 1331 and the second cooling pipe 1332 can be made of metal materials such as copper, aluminum, stainless steel, etc. It should be noted that in this embodiment, the first cooling pipe 1331 and the second cooling pipe 1332 are copper pipes.

[0029] Specifically, one end of first cooling pipe 1331 is welded to second cold plate 1312, and the other end is welded to first adapter water head 1334. One end of second cooling pipe 1332 is welded to second adapter water head 1335, and the other end is welded to liquid outlet manifold 122. Both ends of flexible connecting pipe 1333 are connected to first adapter water head 1334 and second adapter water head 1335, respectively.

[0030] In a specific embodiment, the flexible connecting tube 1333 is a rubber tube. Specifically, the flexible connecting tube 1333 is an EPDM rubber tube, which has good heat resistance and electrical insulation properties and is suitable for use in heat dissipation devices.

[0031] In one embodiment, Figure 2 and Figure 3 As shown, the liquid inlet module 11 includes a liquid inlet pipeline 111 and a liquid inlet water distributor 112; one end of the liquid inlet pipeline 111 is suitable for connection to an external coolant warehouse; the liquid inlet water distributor 112 is connected to the other end of the liquid inlet pipeline 111, the first water inlet pipeline 132, the first group of quick-connect connectors 30 and the third group of quick-connect connectors 30.

[0032] In the above embodiment, liquid inlet line 111 connects to an external coolant reservoir, introducing coolant to the entire system. Liquid inlet manifold 112 simultaneously connects liquid inlet line 111, first water inlet line 132, first set of quick-connect connectors 30, and third set of quick-connect connectors 30, distributing external coolant to first cooling module 13, second cooling module 21, and third cooling module 22, achieving centralized coolant supply and orderly flow distribution. This not only simplifies piping connections and reduces complex piping layouts, but also ensures stable coolant input to each cooling module, enabling each module to independently adjust flow rates based on actual needs, thereby improving the efficiency and coordination of liquid distribution throughout the cooling device.

[0033] In a specific embodiment, the liquid inlet pipeline 111 is a rubber tube. Specifically, the liquid inlet pipeline 111 is an EPDM rubber tube, which has good heat resistance and electrical insulation performance and is suitable for use in heat dissipation devices.

[0034] Specifically, one end of the liquid inlet pipe 111 is connected to the external coolant tank via the first floating module 113, and one end of the liquid inlet pipe 111 is connected to the first floating module 113 via a pagoda connector on the first floating module 113. The other end of the liquid inlet pipe 111 is connected to the liquid inlet manifold 112 via a pagoda connector.

[0035] In a specific embodiment, the quick-connect male end 31 of the first group of quick-connect joints 30 and the third group of quick-connect joints 30 are screwed onto the liquid inlet manifold 112 through threads; the second water inlet pipe 212 is connected to the quick-connect male end 31 of the first group of quick-connect joints 30 through the quick-connect female end 32 of the first group of quick-connect joints 30; and the third water inlet pipe 222 is connected to the quick-connect male end 31 of the third group of quick-connect joints 30 through the quick-connect female end 32 of the third group of quick-connect joints 30.

[0036] In one embodiment, Figure 2 and Figure 3 As shown, the liquid outlet module 12 includes a liquid outlet pipeline 121 and a liquid outlet water separator 122; one end of the liquid outlet pipeline 121 is suitable for connecting to an external coolant warehouse; the liquid outlet water separator 122 is connected to the other end of the liquid outlet pipeline 121, the first water outlet pipeline, the second group of quick-connect connectors 30 and the fourth group of quick-connect connectors 30.

[0037] In the above embodiment, the liquid outlet pipe 121 is connected to an external coolant warehouse, providing a return channel for the coolant after absorbing heat. The liquid outlet water distributor 122 is simultaneously connected to the liquid outlet pipe 121, the first water outlet pipe, the second set of quick-connect joints 30, and the fourth set of quick-connect joints 30. It can efficiently collect the coolant discharged from the main heat dissipation module 10 and the second and third heat dissipation modules 21, 22, and then return it to the external warehouse through the liquid outlet pipe 121, thereby achieving orderly recovery and recycling of the coolant. This not only simplifies the layout of the return pipes of multiple modules and avoids the clutter of the pipes, but also ensures smooth return of the liquid to each heat dissipation module, and forms an efficient cooperation with the diversion function of the liquid inlet module 11, further improving the stability and integrity of the liquid circulation of the entire heat dissipation device.

[0038] In a specific embodiment, the liquid outlet pipe 121 is a rubber tube. Specifically, the liquid outlet pipe 121 is an EPDM rubber tube, which has good heat resistance and electrical insulation performance and is suitable for use in heat dissipation devices.

[0039] Specifically, one end of the liquid outlet pipe 121 is connected to the external coolant storage via the second floating module 123, and one end of the liquid outlet pipe 121 is connected to the second floating module 123 via a pagoda connector on the second floating module 123. The other end of the liquid outlet pipe 121 is connected to the liquid outlet water separator 122 via a pagoda connector.

[0040] In a specific embodiment, the second group of quick-connect joints 30 and the quick-connect male head 31 of the fourth group of quick-connect joints 30 are screwed onto the liquid outlet water distributor 122 through threads; the second water outlet pipe 213 is connected to the quick-connect male head 31 of the second group of quick-connect joints 30 through the quick-connect female head 32 of the second group of quick-connect joints 30; the third water outlet pipe 223 is connected to the quick-connect male head 31 of the fourth group of quick-connect joints 30 through the quick-connect female head 32 of the fourth group of quick-connect joints 30.

[0041] In one embodiment, the liquid outlet module 12 also includes a flow detection mechanism, which is arranged on the liquid outlet pipeline 121 and is communicatively connected to the control unit; and / or, the liquid outlet module 12 also includes a second temperature detection mechanism, which is arranged on the liquid outlet pipeline 121 and is communicatively connected to the control unit.

[0042] In the above embodiment, by adding a flow detection mechanism and / or a second temperature detection mechanism in the liquid outlet module 12, the intelligent monitoring and control capabilities of the entire heat dissipation device are further enhanced; the flow detection mechanism monitors the coolant flow in the liquid outlet pipeline 121 in real time, and the second temperature detection mechanism monitors the temperature of the returning coolant in real time, both of which communicate with the control unit and can promptly feed back the returning coolant flow and the first temperature data to the control unit; so that the control unit can not only adjust the flow according to the temperature of the part to be cooled, but also combine the flow and temperature changes of the returning coolant to more comprehensively judge the operating status of the heat dissipation device; it not only improves the timeliness of the heat dissipation device fault detection, but also provides a basis for the precise adjustment of the flow control valve, thereby enhancing the stability, reliability and energy saving of the entire heat dissipation device, and ensuring that the heat dissipation process is always in the optimal state.

[0043] Preferably, a flow detection mechanism is provided on the liquid outlet pipeline 121, which can detect pipeline blockage or leakage through flow anomalies. A second temperature detection mechanism is provided on the liquid outlet pipeline 121, which can evaluate whether the heat dissipation efficiency meets the standard through temperature anomalies.

[0044] In one embodiment, Figure 4 and Figure 5 As shown, the extended heat dissipation module includes a second heat dissipation module 21, which is connected to the liquid inlet module 11 through a first set of quick-connect joints 30, and is connected to the liquid outlet module 12 through a second set of quick-connect joints 30; the second heat dissipation module 21 is suitable for heat conduction cooperation with a group of parts to be cooled; and a flow control valve is provided on the second heat dissipation module 21.

[0045] In one embodiment, Figure 4 and Figure 5 As shown, the second heat dissipation module 21 includes a second heat dissipation component 211, a second water inlet pipe 212 and a second water outlet pipe 213; the two ends of the second water inlet pipe 212 are respectively connected to the first set of quick-connect joints 30 and the second heat dissipation component 211; and a flow control valve is provided on the second water inlet pipe 212; the two ends of the second water outlet pipe 213 are respectively connected to the second heat dissipation component 211 and the second set of quick-connect joints 30.

[0046] In the above embodiment, the second heat dissipation component 211 is connected to the first set of quick-connect connectors 30 via an independent second water inlet pipe 212, thereby achieving connection with the liquid inlet module 11, and is connected to the second set of quick-connect connectors 30 via an independent second water outlet pipe 213, thereby achieving connection with the liquid outlet module 12, forming a complete and independent heat dissipation flow channel, which can ensure the efficient circulation of coolant in the second heat dissipation module 21. At the same time, a flow control valve is provided on the second water inlet pipe 212, which can accurately regulate the flow of coolant entering the second heat dissipation component 211 according to the needs of the cooling parts corresponding to the second heat dissipation component 211, thereby achieving targeted heat dissipation. This not only ensures the stable connection between the second heat dissipation module 21 and the overall heat dissipation device, but also improves the flexibility and accuracy of heat dissipation adjustment through independent pipes and dedicated control valves, can effectively adapt to the heat dissipation needs of the cooling parts under different working conditions, and enhances heat dissipation efficiency and reliability.

[0047] In a specific embodiment, the second water inlet pipe 212 and the second water outlet pipe 213 can be made of metal materials such as copper, aluminum, and stainless steel, or they can be made of plastic or rubber materials. It should be noted that in this embodiment, the second water inlet pipe 212 and the second water outlet pipe 213 are both rubber tubes. Specifically, the second water inlet pipe 212 and the second water outlet pipe 213 are both EPDM rubber tubes, which have excellent heat resistance and electrical insulation properties and are suitable for use in heat dissipation devices.

[0048] In a specific embodiment, the two ends of the second water inlet pipe 212 are respectively connected to the third adapter water head 214 and the fourth adapter water head 215 through pagoda joints; the third adapter water head 214 is connected to the quick-connect female head 32 of the first group of quick-connect joints 30; the fourth adapter water head 215 is connected to the fourth cold plate 2111.

[0049] In a specific embodiment, one end of the second water outlet pipe 213 connected to the liquid outlet module 12 is connected to the fifth adapter water head 216 through a pagoda joint, and the fifth adapter water head 216 is connected to the quick-connect female head 32 of the second set of quick-connect joints 30.

[0050] In one embodiment, Figure 4 and Figure 5 As shown, the second heat dissipation assembly 211 includes a fourth cold plate 2111, a fifth cold plate 2112, a sixth cold plate 2113 and a seventh cold plate 2114; the fourth cold plate 2111 is connected to the second water inlet pipe 212; the fifth cold plate 2112 is connected to the fourth cold plate 2111; the sixth cold plate 2113 is connected to the fifth cold plate 2112; the seventh cold plate 2114 is connected to the sixth cold plate 2113 and is connected to the second water outlet pipe 213.

[0051] In the above embodiment, the second heat dissipation assembly 211 is connected in sequence by the fourth cold plate 2111, the fifth cold plate 2112, the sixth cold plate 2113 and the seventh cold plate 2114. The series connection method can form a smooth and orderly flow path for the coolant inside the second heat dissipation assembly 211, ensuring that the cooling water can flow through each cold plate in sequence and fully exchange heat with the cold plate, avoiding the problem of heat dissipation dead corners caused by local water flow stagnation; and the split and independent setting of the fourth cold plate 2111, the fifth cold plate 2112, the sixth cold plate 2113 and the seventh cold plate 2114 is not only conducive to the flexible layout of the cold plate positions according to actual heat dissipation needs and adapting to different installation spaces, but also can flexibly arrange the positions of each cold plate according to the structural characteristics of the component to be cooled, ensuring more accurate and comprehensive heat dissipation coverage, and effectively enhancing the overall heat dissipation efficiency and adaptability of the second heat dissipation assembly 211.

[0052] In a specific embodiment, the fourth cold plate 2111 is connected to the fourth transfer water head 215 via a third connecting pipe 2115; the third connecting pipe 2115 is a copper pipe, and its ends are welded to the fourth cold plate 2111 and the fourth transfer water head 215, respectively. The fourth cold plate 2111 is connected to the fifth cold plate 2112 via a fourth connecting pipe 2116; the fourth connecting pipe 2116 is a copper pipe, and its ends are welded to the fourth cold plate 2111 and the fifth cold plate 2112, respectively. The fifth cold plate 2112 is connected to the sixth cold plate 2113 via a fifth connecting pipe 2117; the fifth connecting pipe 2117 is a copper pipe, and its ends are welded to the fifth cold plate 2112 and the sixth cold plate 2113, respectively. The sixth cold plate 2113 is connected to the seventh cold plate 2114 via a sixth connecting pipe 2118 . The sixth connecting pipe 2118 is a copper pipe, and both ends of the sixth connecting pipe 2118 are respectively welded to the sixth cold plate 2113 and the seventh cold plate 2114 .

[0053] In a specific embodiment, the second heat dissipation assembly 211 further includes a third fixing cover 2119 and a fourth fixing cover 2110. The third fixing cover 2119 is used to fix the fourth cold plate 2111; the fourth fixing cover 2110 is used to fix the sixth cold plate 2113. Specifically, the fourth cold plate 2111 and the sixth cold plate 2113 are both arranged on one side of the fifth cold plate 2112.

[0054] In a specific embodiment, the fourth cold plate 2111, the fifth cold plate 2112, the sixth cold plate 2113, and the seventh cold plate 2114 are each thermally coupled to a component to be cooled, which can be a graphics processing unit (GPU), a central processing unit (CPU), or other types of chips or electronic components. In this embodiment, the fourth cold plate 2111 is thermally coupled to the GPU, the fifth cold plate 2112 is thermally coupled to the retimer chip, the sixth cold plate 2113 is thermally coupled to the GPU, and the seventh cold plate 2114 is thermally coupled to the switch cold plate.

[0055] Specifically, a first temperature detection mechanism is provided on each of the parts to be cooled corresponding to the fourth cold plate 2111 , the fifth cold plate 2112 , the sixth cold plate 2113 and the seventh cold plate 2114 .

[0056] In one embodiment, Figure 6 and Figure 7 As shown, the extended heat dissipation module also includes a third heat dissipation module 22, which is connected to the liquid inlet module 11 through a third set of quick-connect joints 30, and is connected to the liquid outlet module 12 through a fourth set of quick-connect joints 30; the third heat dissipation module 22 is suitable for heat conduction cooperation with a group of parts to be cooled; and a flow control valve is provided on the third heat dissipation module 22.

[0057] In one embodiment, Figure 6 and Figure 7 As shown, the third heat dissipation module 22 includes a third heat dissipation component 221, a third water inlet pipe 222 and a third water outlet pipe 223; the two ends of the third water inlet pipe 222 are respectively connected to the third set of quick-connect joints 30 and the third heat dissipation component 221; and a flow control valve is provided on the third water inlet pipe 222; the two ends of the third water outlet pipe 223 are respectively connected to the third heat dissipation component 221 and the fourth set of quick-connect joints 30.

[0058] In the above embodiment, the third heat dissipation component 221 is connected to the third set of quick-connect connectors 30 via an independent third water inlet pipe 222, thereby achieving connection with the liquid inlet module 11. It is connected to the fourth set of quick-connect connectors 30 via an independent third water outlet pipe 223, thereby achieving connection with the liquid outlet module 12, forming a complete and independent heat dissipation flow path, which can ensure the efficient circulation of coolant within the third heat dissipation module 22. At the same time, a flow control valve is provided on the third water inlet pipe 222, which can accurately regulate the flow of coolant entering the third heat dissipation component 221 according to the needs of the cooling parts corresponding to the third heat dissipation component 221, thereby achieving targeted heat dissipation. This not only ensures the stable connection between the third heat dissipation module 22 and the overall heat dissipation device, but also improves the flexibility and accuracy of heat dissipation adjustment through independent pipes and dedicated control valves, can effectively adapt to the heat dissipation needs of the cooling parts under different working conditions, and enhances heat dissipation efficiency and reliability.

[0059] In a specific embodiment, the third water inlet pipe 222 and the third water outlet pipe 223 can be made of metal materials such as copper, aluminum, and stainless steel, or they can be made of plastic or rubber materials. It should be noted that in this embodiment, the third water inlet pipe 222 and the third water outlet pipe 223 are both rubber tubes. Specifically, the third water inlet pipe 222 and the third water outlet pipe 223 are both EPDM rubber tubes, which have excellent heat resistance and electrical insulation properties and are suitable for use in heat dissipation devices.

[0060] In a specific embodiment, one end of the third water inlet pipe 222 is connected to the quick-connect female connector 32 of the third set of quick-connect connectors 30 , and the other end is connected to the eighth cold plate 2211 .

[0061] In a specific embodiment, one end of the third water outlet pipe 223 is connected to the quick-connect female connector 32 of the fourth set of quick-connect connectors 30 , and the other end is connected to the ninth cold plate 2213 via a fastening nut 2231 .

[0062] In one embodiment, Figure 6 and Figure 7 As shown, the third heat dissipation assembly 221 includes an eighth cold plate 2211, a liquid cooling assembly 2212 and a ninth cold plate 2213; the eighth cold plate 2211 is connected to the third water inlet pipeline 222; the liquid cooling assembly 2212 is connected to the eighth cold plate 2211; the ninth cold plate 2213 is connected to the liquid cooling assembly 2212 and is connected to the third water outlet pipeline 223.

[0063] In the above embodiment, the third heat dissipation assembly 221 is connected in sequence by the eighth cold plate 2211, the liquid-cooling assembly 2212 and the ninth cold plate 2213. The serial connection method can form a smooth and orderly flow path for the coolant inside the third heat dissipation assembly 221, ensuring that the cooling water can flow through the eighth cold plate 2211, the liquid-cooling assembly 2212 and the ninth cold plate 2213 in sequence, and fully exchange heat with the eighth cold plate 2211, the liquid-cooling assembly 2212 and the ninth cold plate 2213, thereby avoiding the problem of heat dissipation dead corners caused by local water stagnation. Moreover, the separate and independent arrangement of the eighth cold plate 2211, the liquid-cooling assembly 2212 and the ninth cold plate 2213 is not only conducive to the flexible layout of the cold plate positions according to actual heat dissipation requirements and adapting to different installation spaces, but also can flexibly arrange the positions of each cold plate according to the structural characteristics of the component to be cooled, ensuring more accurate and comprehensive heat dissipation coverage, thereby effectively enhancing the overall heat dissipation efficiency and adaptability of the third heat dissipation assembly 221.

[0064] In a specific embodiment, the third heat dissipation component 221 also includes a first fixing member 2214 and a second fixing member 2215, which are respectively fixed at the two ends of the eighth cold plate 2211, and the two ends of the liquid cooling component 2212 are respectively connected to the first fixing member 2214 and the second fixing member 2215.

[0065] In a specific embodiment, the liquid cooling assembly 2212 includes two sets of liquid cooling pipes and multiple liquid cooling aluminum fins 22122; one set of liquid cooling pipes is connected to the eighth cold plate 2211, and the other set of liquid cooling pipes is connected to the ninth cold plate 2213. The two sets of liquid cooling pipes are interconnected via a connecting pipe 22123. Specifically, the liquid cooling pipes include two main pipes 22121a and multiple branch pipes 22121b. The two main pipes 22121a are respectively fixed to the first fixing member 2214 and the second fixing member 2215. The multiple branch pipes 22121b are each arranged between the two main pipes 22121a, and the ends of the branch pipes 22121b are respectively connected to the two main pipes 22121a. A liquid cooling aluminum fin 22122 is correspondingly arranged on each branch pipe 22121b, and the liquid cooling aluminum fin 22122 is welded to the corresponding branch pipe 22121b.

[0066] Specifically, the liquid cooling component 2212 is connected to the ninth cold plate 2213 through a seventh connecting pipe 2216 ; the seventh connecting pipe 2216 is a copper pipe, and both ends of the seventh connecting pipe 2216 are respectively welded to the liquid cooling component 2212 and the ninth cold plate 2213 .

[0067] In a specific embodiment, the eighth cold plate 2211, liquid cooling assembly 2212, and ninth cold plate 2213 are each thermally coupled to a component to be cooled, which can be a graphics processing unit (GPU), a central processing unit (CPU), or other types of chips or electronic components. In this embodiment, the eighth cold plate 2211 is thermally coupled to the GPU, the liquid cooling assembly 2212 is thermally coupled to the memory module, and the ninth cold plate 2213 is thermally coupled to the power module.

[0068] Specifically, a first temperature detection mechanism is provided on each of the parts to be cooled corresponding to the eighth cold plate 2211 , the liquid cooling assembly 2212 and the ninth cold plate 2213 .

[0069] In a specific embodiment, the control unit is a baseboard management controller (BMC), and the plurality of first temperature detection mechanisms communicate with the baseboard management controller in real time via an integrated circuit bus.

[0070] Specifically, the baseboard management controller establishes a connection with the server management platform through the Intelligent Platform Management Interface (IPMI).

[0071] In this embodiment, the coolant enters the liquid inlet pipeline 111 from the first floating module 113, and is divided into three paths after passing through the liquid inlet water separator 112. The first path enters the first heat dissipation module 13 through the first water inlet pipeline 132, and then flows through the first cold plate 1311, the first connecting pipe 1314, the second cold plate 1312, the second connecting pipe 1315, the third cold plate 1313, the first cooling pipe 1331, the first adapter water head 1334, the flexible connecting pipe 1333, the second adapter water head 1335, the second cooling pipe 1332, the liquid outlet water separator 122, the liquid outlet pipeline 121 and the second floating module 123 before flowing out. The second path flows through the first set of quick-connect joints 30, the third adapter water head 214, the first water inlet pipe 132, the fourth adapter water head 215, the third connecting pipe 2115, the fourth cold plate 2111, the fourth connecting pipe 2116, the fifth cold plate 2112, the fifth connecting pipe 2117, the sixth cold plate 2113, the sixth connecting pipe 2118, the seventh cold plate 2114, the second water outlet pipe 213, the fifth adapter water head 216, the second set of quick-connect joints 30, and the liquid outlet. The third route flows through the water container 122, the liquid outlet pipeline 121 and the second floating module 123; the third route flows through the third set of quick-connect joints 30, the third water inlet pipeline 222, the eighth cold plate 2211, a group of liquid cooling pipelines, the connecting pipe 22123, another group of liquid cooling pipelines, the seventh connecting pipe 2216, the ninth cold plate 2213, the third water outlet pipeline 223, the fourth set of quick-connect joints 30, the liquid outlet water distributor 122, the liquid outlet pipeline 121 and the second floating module 123 before flowing out.

[0072] According to an embodiment of the present invention, on the other hand, a control method is provided for the above-mentioned heat dissipation device, such as Figure 8 As shown, the following steps are included: S1. Acquire first temperature data of a first temperature detection mechanism; S2. Adjust the valve opening of the corresponding flow control valve according to the first temperature data.

[0073] In the above embodiment, by obtaining the first temperature data of the part to be cooled fed back by the first temperature detection mechanism in real time, the control unit can grasp the actual heating state of each part to be cooled, and adjust the opening of the corresponding flow control valve accordingly to achieve dynamic matching of the coolant flow and the heat dissipation demand. When the temperature of the part to be cooled rises, the valve opening can be increased to increase the coolant supply and enhance the heat dissipation effect; when the temperature drops, the opening is reduced to avoid energy waste. The on-demand adjustment mode ensures that each part to be cooled is always within the appropriate temperature range, maximizes energy utilization efficiency, and reduces unnecessary energy consumption, thereby achieving high efficiency, energy saving, and adaptability of the entire heat dissipation device.

[0074] In one embodiment, adjusting the valve opening of the corresponding flow control valve according to the first temperature data includes the following steps: determining whether the first temperature data is within a preset normal temperature range; if the first temperature data is within the preset normal temperature range, adjusting the total coolant flow to a preset low flow threshold; and adjusting the valve opening of the corresponding flow control valve according to a preset flow distribution strategy.

[0075] In the above embodiment, by first determining whether the first temperature data is within the normal range, a clear benchmark is provided for determining the system's operating status. When the temperature is normal, the total coolant flow rate is first adjusted to a low flow threshold, thereby reducing overall energy consumption and achieving basic energy savings. The valve openings are then controlled in conjunction with a preset flow distribution strategy to ensure that, even under low flow conditions, coolant is still distributed to the cooling modules in a reasonable proportion to meet the basic cooling requirements of each component to be cooled. This not only avoids flow waste when the temperature is normal, but also ensures balanced cooling through reasonable distribution. This minimizes energy consumption while maintaining stable system operation, making the cooling process more economical and efficient.

[0076] In one embodiment, adjusting the valve opening of the corresponding flow control valve according to the first temperature data also includes the following steps: comparing the first temperature data with a first preset threshold; determining the deviation between the first temperature data and the first preset threshold; and linearly adjusting the valve opening of the flow control valve corresponding to the first temperature data according to the deviation, wherein the adjustment amplitude of the valve opening is proportional to the deviation.

[0077] In the above embodiment, by comparing the first temperature data with the first preset threshold and calculating the deviation, the degree of temperature deviation of the component to be cooled can be clearly quantified; linear adjustment is performed based on the deviation, and the adjustment amplitude is proportional to the deviation, so that the opening change of the flow control valve is directly related to the degree of temperature deviation. The greater the temperature deviation, the greater the flow adjustment amplitude, so that the supply of coolant can be quickly matched to the actual heat dissipation demand. This avoids the problem of over- or under-adjusting the valve opening of the flow control valve, and can quickly enhance the heat dissipation effect when the temperature deviates significantly, while making fine adjustments to maintain stability when the temperature deviates slightly. This effectively improves the timeliness and accuracy of the heat dissipation response, ensures that the temperature of the component to be cooled quickly returns to a reasonable range, and reduces unnecessary flow fluctuations, optimizing the energy efficiency and stability of the system.

[0078] In one embodiment, adjusting the valve opening of the corresponding flow control valve according to the first temperature data also includes the following steps: determining whether the first temperature data reaches a second preset threshold; if the first temperature data reaches the second preset threshold, adjusting the valve opening of the flow control valve corresponding to the first temperature data to a fully open state.

[0079] In the above embodiment, when the first temperature reaches the second preset threshold, indicating an emergency high temperature situation at the component being cooled, the corresponding flow control valve is fully opened, maximizing the coolant supply to the heat dissipation module and enhancing heat dissipation capabilities. This quickly controls the temperature rise, effectively protecting the component from high-temperature damage. This provides a highly effective emergency response mechanism for the heat dissipation device, enabling rapid response when the component's temperature reaches a critical level, thereby enhancing the device's reliability and safety in handling extreme operating conditions.

[0080] Preferably, a liquid inlet pump and a liquid inlet valve are provided on the liquid inlet pipeline 111, and both the liquid inlet pump and the liquid inlet valve are in communication with the control unit. When the first temperature data reaches a second preset threshold, the control unit controls the liquid inlet valve to be fully opened and increases the speed of the liquid inlet pump, thereby increasing the output flow of the liquid inlet module 11, increasing the total amount of coolant in the entire device from the source, and ensuring that the modules in the fully open state can continuously receive sufficient coolant.

[0081] Preferably, the rising rate of the first temperature data is calculated; it is determined whether the rising rate exceeds the preset sudden rise rate threshold; if the rising rate exceeds the preset sudden rise rate threshold, for example, the temperature rises by 10°C per minute, the emergency mode is triggered, and the control unit controls the valve opening of all flow control valves to be adjusted to a fully open state, and by maximizing the flow and flow rate of the coolant, the heat dissipation capacity is quickly enhanced to suppress the continuous rise in temperature; at the same time, the control unit links the server to reduce the frequency, which is used to reduce the computing frequency of the server and reduce the generation of heat from the heat source.

[0082] In one embodiment, the control method further comprises the following steps: S3, acquiring flow data of the flow detection mechanism and second temperature data of the second temperature detection mechanism; S4. Correct the valve opening of the flow control valve according to the comparison result of the flow data and the second temperature data with the preset target data.

[0083] In the above embodiment, by acquiring flow rate data from the flow detection mechanism and second temperature data from the second temperature detection mechanism, the real-time status of the coolant in the liquid outlet module 12 can be determined, providing a multi-dimensional reference for determining the system's operating status. By comparing this status information with the preset target state, possible deviations in the actual heat dissipation process can be promptly detected and the flow control valve opening can be corrected accordingly. This avoids relying solely on the temperature of the component to be cooled, forming a closed-loop control of the coolant status. This can compensate for regulation errors caused by factors such as pipeline problems and changes in medium characteristics, making flow control more consistent with actual operating conditions and further enhancing the reliability of the heat dissipation device.

[0084] Preferably, the control unit builds a device thermal load-flow demand mapping model by learning the system's historical operating data. Based on this model, it can automatically match the corresponding flow supply according to the device's real-time thermal load status to achieve accurate and efficient heat dissipation. For example, when it is detected that the power consumption of the graphics processor exceeds 50% of its nominal value, the control unit will automatically maintain the cold plate flow corresponding to the graphics processor within the range of 3-4L / min, and provide an adaptive cooling flow for the part to be cooled, ensuring that the heat dissipation efficiency is always at a stable and reliable level, thereby ensuring that the part to be cooled continues to operate in a suitable temperature environment.

[0085] Preferably, during the low-load period at night, the system will automatically start the energy-saving mode. For example, when the temperature of all components is monitored to be lower than 60°C, the system will adjust the main flow rate to a basic value of 2L / min and reduce the speed of the liquid inlet pump to reduce energy consumption. At the same time, in order to grasp the temperature changes in real time, the temperature sensor will maintain a high-frequency sampling of 10 times / second to ensure that temperature fluctuations can be captured in time, thereby achieving energy saving while ensuring that the heat dissipation status is controllable.

[0086] Preferably, when it is detected that the temperature difference between adjacent devices in the same heat dissipation module exceeds 15°C, the control unit will give priority to increasing the flow rate of the corresponding pipeline of the high-temperature device, and specifically improve the cooling capacity of the area; avoid local overheating of the high-temperature device, thereby further ensuring the balance of temperature distribution of the entire system while taking into account energy saving, and ensuring that all devices can operate stably in a suitable environment.

[0087] The above is a detailed introduction to a heat dissipation device and control method provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A heat dissipation device, characterized in that: include: A main heat dissipation module (10) comprising a liquid inlet module (11) and a liquid outlet module (12); An extended heat dissipation module is connected to the liquid inlet module (11) and the liquid outlet module (12) via a quick-connect connector (30); The main heat dissipation module (10) and the extended heat dissipation module are respectively used for heat conduction cooperation with a group of parts to be cooled; and each of the parts to be cooled is provided with a first temperature detection mechanism; The main heat dissipation module (10) and the extended heat dissipation module are respectively provided with flow control valves; The control unit is in communication with the first temperature detection mechanism and the flow control valve, and adjusts the valve opening of the corresponding flow control valve according to the first temperature data of the first temperature detection mechanism.

2. The heat dissipation device according to claim 1, characterized in that: The main heat dissipation module (10) further comprises a first heat dissipation module (13), wherein the first heat dissipation module (13) comprises: a first heat dissipation component; A first water inlet pipeline (132), both ends of which are respectively connected to the liquid inlet module (11) and the first heat dissipation component; and the first water inlet pipeline (132) is provided with a flow control valve; The first water outlet pipeline has two ends connected to the first heat dissipation component and the liquid outlet module (12) respectively.

3. The heat dissipation device according to claim 2, characterized in that: The first heat dissipation component includes: A first cold plate (1311) connected to the first water inlet pipeline (132); A second cold plate (1312) is connected to the first cold plate (1311); The third cold plate (1313) is in communication with the second cold plate (1312) and is connected to the first water outlet pipeline.

4. The heat dissipation device according to claim 3, characterized in that: The first water outlet pipeline comprises: A first cooling pipe (1331), one end of which is connected to the second cold plate (1312); A second cooling pipe (1332), one end of which is connected to the liquid outlet module (12); The flexible connecting tube (1333) has two ends connected to the other end of the first cooling tube (1331) and the other end of the second cooling tube (1332), respectively.

5. The heat dissipation device according to claim 2, characterized in that: The liquid inlet module (11) comprises: A liquid inlet pipeline (111), one end of which is suitable for connection to an external coolant warehouse; The liquid inlet water distributor (112) is connected to the other end of the liquid inlet pipeline (111), the first heat dissipation module (13), and the extended heat dissipation module.

6. The heat dissipation device according to claim 2, characterized in that: The liquid outlet module (12) comprises: A liquid outlet pipe (121), one end of which is suitable for connection to an external coolant warehouse; The liquid outlet water distributor (122) is connected to the other end of the liquid outlet pipeline (121), the first heat dissipation module (13), and the extended heat dissipation module.

7. The heat dissipation device according to claim 6, characterized in that: The liquid outlet module (12) further comprises a flow detection mechanism, which is arranged on the liquid outlet pipeline (121) and is communicatively connected to the control unit; And / or, the liquid outlet module (12) further comprises a second temperature detection mechanism, the second temperature detection mechanism being arranged on the liquid outlet pipeline (121) and being communicatively connected to the control unit.

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The extended heat dissipation module comprises a second heat dissipation module (21), the second heat dissipation module (21) being connected to the liquid inlet module (11) via a first set of quick-connect joints (30), and being connected to the liquid outlet module (12) via a second set of quick-connect joints (30); the second heat dissipation module (21) being suitable for heat conduction cooperation with a set of parts to be cooled; and a flow control valve is provided on the second heat dissipation module (21).

9. The heat dissipation device according to claim 8, characterized in that: The second heat dissipation module (21) comprises: A second heat dissipation component (211); A second water inlet pipeline (212), both ends of which are respectively connected to the first set of quick-connect connectors (30) and the second heat dissipation assembly (211); and a flow control valve is provided on the second water inlet pipeline (212); The second water outlet pipe (213) has two ends connected to the second heat dissipation assembly (211) and the second set of quick-connect connectors (30), respectively.

10. The heat dissipation device according to claim 9, characterized in that: The second heat dissipation component (211) comprises: a fourth cold plate (2111), connected to the second water inlet pipeline (212); a fifth cold plate (2112), connected to the fourth cold plate (2111); a sixth cold plate (2113), connected to the fifth cold plate (2112); The seventh cold plate (2114) is in communication with the sixth cold plate (2113) and is connected to the second water outlet pipeline (213).

11. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The extended heat dissipation module further includes a third heat dissipation module (22), the third heat dissipation module (22) being connected to the liquid inlet module (11) via a third set of quick-connect joints (30), and being connected to the liquid outlet module (12) via a fourth set of quick-connect joints (30); the third heat dissipation module (22) being suitable for heat conduction cooperation with a group of parts to be cooled; and the third heat dissipation module (22) being provided with a flow control valve.

12. The heat dissipation device according to claim 11, characterized in that: The third heat dissipation module (22) comprises: a third heat dissipation component (221); A third water inlet pipeline (222), both ends of which are respectively connected to the third set of quick-connect connectors (30) and the third heat dissipation assembly (221); and a flow control valve is provided on the third water inlet pipeline (222); The third water outlet pipe (223) has two ends connected to the third heat dissipation assembly (221) and the fourth set of quick-connect joints (30), respectively.

13. The heat dissipation device according to claim 12, characterized in that: The third heat dissipation component (221) comprises: an eighth cold plate (2211), connected to the third water inlet pipeline (222); a liquid cooling component (2212), connected to the eighth cold plate (2211); The ninth cold plate (2213) is in communication with the liquid cooling assembly (2212) and is connected to the third water outlet pipeline (223).

14. A control method, characterized in that: The heat dissipation device according to any one of claims 1 to 9 comprises the following steps: Acquiring first temperature data of a first temperature detection mechanism; The valve opening of the corresponding flow control valve is adjusted according to the first temperature data.

15. The control method according to claim 14, characterized in that: The step of adjusting the valve opening of the corresponding flow control valve according to the first temperature data comprises the following steps: Determining whether the first temperature data is within a preset normal temperature range; If the first temperature data is within a preset normal temperature range, adjusting the total coolant flow rate to a preset low flow rate threshold; According to the preset flow distribution strategy, adjust the valve opening of the corresponding flow control valve; And / or, adjusting the valve opening of the corresponding flow control valve according to the first temperature data comprises the following steps: comparing the first temperature data with a first preset threshold; determining a deviation between the first temperature data and the first preset threshold; linearly adjusting the valve opening of the flow control valve corresponding to the first temperature data according to the deviation, wherein the adjustment amplitude of the valve opening is proportional to the deviation; And / or, adjusting the valve opening of the corresponding flow control valve according to the first temperature data comprises the following steps: Determining whether the first temperature data reaches a second preset threshold; If the first temperature data reaches a second preset threshold, adjusting the valve opening of the flow control valve corresponding to the first temperature data to a fully open state; And / or, the control method further comprises the following steps: Acquire flow data of the flow detection mechanism and second temperature data of the second temperature detection mechanism; The valve opening of the flow control valve is corrected according to the comparison result between the flow data and the second temperature data and the preset target data.

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