Laser cutting equipment and cutting process

Abstract

The invention belongs to the technical field of cutting machine tools, and particularly relates to equipment for laser cutting, in particular to laser cutting equipment and a cutting process. The laser cutting equipment comprises a working platform and a laser cutting device, a driving mechanism; a bearing tray; and a laser cutting mechanism. The first negative pressure adsorption pipeline is arranged at the bottom of the box body, during laser cutting, smoke dust caused by cutting is directly sucked from the bottom of a material plate, the amount of the smoke dust upwelling to a laser light path is reduced, the total amount of the smoke dust attached to a lens is reduced, and the lens is prevented from being overheated; only the air inlet hole and the air outlet hole corresponding to the to-be-cut area are exposed, so that the negative pressure adsorption force acts on the real-time machining area in a concentrated mode, the negative pressure suction force is concentrated to the cutting area, the smoke dust adsorption effect is improved, the amount of smoke dust upwelling to a laser light path is further reduced, and the lens is prevented from being overheated.

Description

Technical Field

[0001] The present invention belongs to the technical field of cutting machine tools, and specifically relates to equipment used for laser cutting, and in particular to a laser cutting equipment and a cutting process. Background Art

[0002] Laser cutting equipment produces a large amount of high-temperature smoke when processing sheet metal.

[0003] The cutting equipment in related technologies mainly extracts smoke and dust by setting an adsorption hood on the top of the material plate. The floating smoke and dust particles are easy to adhere to the lens of the laser cutting mechanism, and the pollutants will adhere to the surface of the lens. When the high-energy laser beam passes through the contaminated lens, the energy will be locally focused, causing the lens to overheat or even ablate. At the same time, the metal smoke and dust particles have a significant scattering and absorption effect on the laser, forcing the equipment to increase the power, resulting in a surge in energy consumption.

[0004] Therefore, how to prevent the lens from being damaged when the adsorption hood extracts smoke and dust from the top of the material plate is a technical problem that needs to be solved urgently.

[0005] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the Invention

[0006] The embodiments of the present disclosure at least provide a laser cutting device and a cutting process thereof.

[0007] In a first aspect, an embodiment of the present disclosure provides a laser cutting device, comprising: work platform; a driving mechanism, which is arranged on the working platform; A carrying tray, which is arranged on the driving mechanism and is used to support the material plate; a laser cutting mechanism, which is arranged above the driving mechanism and is used to cut the material sheet on the carrying tray; The carrying tray includes: The box body has a cavity on its inner wall, a plurality of air inlet holes on the top of the box body, and a plurality of air outlet holes on the bottom of the box body; Two electrically driven shielding portions arranged opposite to each other are provided in the cavity; a first negative pressure adsorption pipeline, which is connected to the air outlet at the bottom of the box body; The control module is configured to: control the two electrically driven shielding parts to move in opposite directions to connect the area to be cut of the material sheet with the air inlet and the air outlet corresponding to the box body, and control the external negative pressure source to suck air into the air inlet through the first negative pressure adsorption pipeline to absorb the smoke and dust generated when the laser cutting mechanism cuts the material sheet from the bottom of the material sheet.

[0008] In an optional embodiment, the electric drive shielding portion includes: a sliding plate disposed in the cavity and abutting against the upper top wall and the lower bottom wall of the cavity; a driving cylinder, which is disposed in the cavity and is used to drive the sliding plate to slide in the cavity; The top and bottom of the sliding plate are connected to the corresponding inner wall of the cavity through corresponding shielding plates; The control module adjusts the position of the sliding plate by driving the cylinder to connect the area to be cut of the material plate with the air inlet and the air outlet at the corresponding position of the box body.

[0009] In an optional embodiment, the shielding plate is an elastic sealing plate; Furthermore, the elastic sealing plate is in the shape of an accordion plate; When the driving cylinder drives the sliding plate to slide, it drives the shielding plate to connect or close the corresponding air inlet and outlet holes.

[0010] In an optional embodiment, a collecting tank is provided at the bottom of the cavity; The collecting tank is opened in the middle of the cavity; After the cutting is completed, the control module is further configured to control the two electrically driven shielding parts to move toward each other, so as to push the waste chips at the bottom of the cavity into the collection tank through the electrically driven shielding parts.

[0011] In an optional embodiment, a chip removal hole is provided at the bottom of the collecting tank; The chip removal hole is communicated with the first negative pressure adsorption pipeline.

[0012] In an optional embodiment, the laser cutting equipment further includes: The second negative pressure adsorption pipeline; an adsorption cover, which is arranged above the box body and is in communication with the second negative pressure adsorption pipeline; The control module is further configured to control the external negative pressure source to suck air into the adsorption hood through the second negative pressure adsorption pipeline to absorb the smoke and dust on the top of the material plate.

[0013] In an optional embodiment, the top of the adsorption cover is provided with an opening; The ray outlet of the laser cutting mechanism is arranged above the opening; The second negative pressure adsorption pipeline is communicated with the side wall of the adsorption cover.

[0014] In an optional embodiment, the adsorption force in the first negative pressure adsorption pipeline is greater than the adsorption force in the second negative pressure adsorption pipeline.

[0015] In an optional embodiment, the driving mechanism includes: A first direction driving unit, which is arranged on the working platform; a second direction driving portion, which is arranged on the first direction driving portion; The carrying tray is arranged on the second direction driving part; The control module is further configured to adjust the position of the carrying tray through the first direction driving unit and the second direction driving unit to facilitate the laser cutting mechanism to cut the material sheet.

[0016] In a second aspect, the present disclosure also provides a cutting process applied to the laser cutting device as described above, the cutting process comprising: The control module controls the driving mechanism to transport the carrying tray carrying the material sheet to the bottom of the laser cutting mechanism; The control module controls the two electrically driven shielding parts to move in opposite directions so as to connect the area to be cut of the sheet with the air inlet and the air outlet corresponding to the box body; Controlling the external negative pressure source to provide negative pressure to the first negative pressure adsorption pipeline; The control module drives the laser cutting mechanism to cut the material sheet, and moves the material sheet along a preset cutting route through the driving mechanism. At this time, the first negative pressure adsorption tube absorbs the smoke and dust generated when cutting the material sheet from the bottom of the material sheet through the air inlet hole.

[0017] The beneficial effect of the present invention is that the laser cutting equipment and cutting process set a first negative pressure adsorption pipeline at the bottom of the box body, and during laser cutting, the smoke and dust caused by cutting are directly absorbed from the bottom of the material plate, thereby reducing the amount of smoke and dust rising to the laser light path, reducing the total amount of smoke and dust attached to the lens, and avoiding lens overheating. At the same time, when cutting, the electric drive shielding part is controlled to move in opposite directions, only the air inlet and outlet holes corresponding to the area to be cut are exposed, so that the negative pressure adsorption force is concentrated on the real-time processing area, thereby concentrating the suction force of the negative pressure to the cutting area, improving the adsorption effect on smoke and dust, further reducing the amount of smoke and dust rising to the laser light path, and avoiding lens overheating.

[0018] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited herein and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A schematic structural diagram of a laser cutting device provided in an embodiment of the present disclosure; Figure 2 A cross-sectional view of a portion of the structure of a carrier tray provided in an embodiment of the present disclosure; Figure 3 A cross-sectional view of a portion of the structure of the carrier tray provided by an embodiment of the present disclosure from another perspective; Figure 4 A schematic diagram of the state of the carrying tray provided in an embodiment of the present disclosure when cleaning waste; Figure 5 A schematic structural diagram of the laser cutting device provided by an embodiment of the present disclosure from another perspective; Figure 6 An electrical control schematic diagram of the laser cutting equipment provided in an embodiment of the present disclosure; Figure 7 Flowchart of the cutting process of the laser cutting equipment provided in an embodiment of the present disclosure.

[0022] In the figure: 100, working platform; 200, driving mechanism; 210, first direction driving part; 220, second direction driving part; 300, carrying tray; 310, box body; 311, cavity; 312, electric drive shielding part; 3121, sliding plate; 3122, driving cylinder; 3123, shielding plate; 313, air inlet; 314, air outlet; 315, collecting tank; 316, chip discharge hole; 320, first negative pressure adsorption pipeline; 330, second negative pressure adsorption pipeline; 400, laser cutting mechanism; 500, material plate; 600, adsorption hood; 610, opening. DETAILED DESCRIPTION

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0024] In the present document, when a first component is referred to as being "on" a second component, it can be directly formed on the second component, or a third component can be interposed between the first component and the second component. Also, in the drawings, the thickness of components can be exaggerated or reduced for effective description of the technical content.

[0025] In the present document, when an element or layer is referred to as being "on", "engaged to", "connected to", "attached to", or "coupled to" another element or layer, it can be directly on, engaged, connected, attached, or coupled to the other element or layer, or one or more intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on", "directly engaged to", "directly connected to", "directly attached to", or "directly coupled to" another element or layer, there are no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., "between" versus "directly between", "adjacent" versus "directly adjacent", etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0026] In the present document, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of", when preceded by the term comprising, modifies the phrase "comprising a list of two or more elements" such that any and all combinations of one or more of the elements in the list are covered. For example, "at least one of a, b, and c" would cover the possibilities of a only, b only, c only, both a and b, both a and c, both b and c, or all of a, b, and c.

[0027] The terminology used herein is for the purpose of describing particular example configurations only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises", "comprising", "includes", "including" and "has", "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order in which they are described, unless specifically identified as an order of performance. Additional or alternative steps can be employed.

[0028] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations, aspects, or designs. Instead, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0029] Research has found that when relevant cutting equipment is cutting the material plate, in order to prevent smoke from contaminating the lens, a top adsorption hood is used to extract the smoke. The escaped smoke is easy to adhere to the lens, and the pollutants will adhere to the surface of the lens. When the high-energy laser beam passes through the contaminated lens, the energy will be locally focused, causing the lens to overheat or even ablate. Moreover, in order to prevent smoke from affecting the optical path of the laser beam, the adsorption hood is generally set away from the laser optical path of the laser beam. In order to avoid too much smoke escaping during the adsorption of smoke and affecting the laser optical path, it is necessary to increase the adsorption force of the adsorption hood, which leads to increased energy consumption.

[0030] Based on the above research, the embodiment of the present disclosure provides a laser cutting device and a cutting process. By setting a first negative pressure adsorption pipeline 320 at the bottom of the box body 310, during laser cutting, the smoke caused by cutting is directly sucked from the bottom of the material plate 500, thereby reducing the amount of smoke rising to the laser light path. On the one hand, it prevents the smoke from adhering to the lens. On the other hand, it reduces the amount of smoke entering the laser light path, thereby reducing the total amount of smoke adhering to the lens and preventing the lens from overheating.

[0031] The defects in the above solutions are the results obtained by the inventors after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present disclosure in this article should be the contributions made by the inventors to the present disclosure during the disclosure process.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0033] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0034] See also Figure 1 and Figure 2 The embodiment of the present disclosure provides a laser cutting device, which comprises a workbench 100, a driving mechanism 200 arranged on the workbench 100, a bearing tray 300 arranged on the driving mechanism 200 and used for bearing a material plate 500, and a laser cutting mechanism 400 arranged above the driving mechanism 200 and used for cutting the material plate 500 on the bearing tray 300, wherein the bearing tray 300 comprises a box body 310, an inner wall of the box body 310 is provided with a cavity 311, a top of the box body 310 is provided with a plurality of air inlet holes 313, a bottom of the box body 310 is provided with a plurality of air outlet holes 314, two oppositely arranged electric drive shielding parts 312 are arranged in the cavity 311, and a first negative pressure adsorption pipeline 320 is in communication with the air outlet holes 314 at the bottom of the box body 310.

[0035] As shown in Figure 3 , a control module is configured to control the two electric drive shielding parts 312 to move in opposite directions (as shown by an arrow F1 in Figure 2 ) so that the to-be-cut area of the material plate 500 is communicated with the air inlet holes 313 and the air outlet holes 314 corresponding to the box body 310, and control an external negative pressure source to inhale air through the first negative pressure adsorption pipeline 320 (an air inhaling direction is shown by an arrow F3 in Figure 2 ), so that the smoke and dust generated when the laser cutting mechanism 400 cuts the material plate 500 is sucked from the bottom of the material plate 500.

[0036] By arranging the first negative pressure adsorption pipeline 320 at the bottom of the box body 310, the smoke and dust generated during laser cutting can be directly sucked from the bottom of the material plate 500, the amount of smoke and dust rising to the laser light path is reduced, the total amount of smoke and dust adhering to the lens is reduced, the lens is prevented from overheating, and when the electric drive shielding parts 312 are controlled to move in opposite directions during cutting, only the air inlet holes 313 and the air outlet holes 314 corresponding to the to-be-cut area are exposed, so that the negative pressure adsorption force is concentrated on the real-time processing area, thereby concentrating the suction force of the negative pressure on the cutting area, improving the adsorption effect of the smoke and dust, further reducing the amount of smoke and dust rising to the laser light path, and further preventing the lens from overheating.

[0037] Please refer to Figure 2 and Figure 3The electrically driven shielding portion 312 includes: a sliding plate 3121, which is arranged in the cavity 311 and abuts against the upper top wall and the lower bottom wall of the cavity 311; a driving cylinder 3122, which is arranged in the cavity 311 and is used to drive the sliding plate 3121 to slide in the cavity 311; the top and bottom of the sliding plate 3121 are connected to the corresponding inner walls of the cavity 311 through corresponding shielding plates 3123; the control module adjusts the position of the sliding plate 3121 by driving the cylinder 3122 to connect the area to be cut of the material sheet 500 with the air inlet 313 and the air outlet 314 corresponding to the box body 310.

[0038] By arranging shielding plates 3123 connected to the inner wall of the cavity 311 at the top and bottom of the sliding plate 3121 , air pressure leakage in the non-cutting area is reduced, thereby increasing the adsorption force between the two sliding plates 3121 .

[0039] Please continue reading Figure 2 and Figure 3 The shielding plate 3123 is an elastic sealing plate; and the elastic sealing plate is in the shape of an accordion plate; when the driving cylinder 3122 drives the sliding plate 3121 to slide, it drives the shielding plate to connect or close the corresponding air inlet 313 and the air outlet 314.

[0040] The accordion-shaped elastic sealing plate automatically deforms as the sliding plate 3121 expands and contracts. When it contracts, it can tightly abut against the top and bottom walls of the cavity 311, further improving the sealing between the elastic sealing plate and the cavity 311 and reducing air pressure leakage in the non-cutting area.

[0041] See also Figure 2 and Figure 4 The bottom of the cavity 311 is provided with a collecting tank 315; the collecting tank 315 is opened in the middle of the cavity 311; after the cutting is completed, the control module is further configured to: control the two electric drive shielding parts 312 to move toward each other (the direction of movement is as follows Figure 2 In the direction shown by F2 in FIG, the waste chips at the bottom of the cavity 311 are pushed into the collecting groove 315 through the electrically driven shielding portion.

[0042] A chip removal hole 316 is provided at the bottom of the collecting tank 315 ; the chip removal hole 316 is communicated with the first negative pressure adsorption pipeline 320 .

[0043] After each cutting is completed, the control module controls the electric drive shielding part 312 to move towards each other to clean the waste chips, pushing the waste chips at the bottom of the cavity 311 into the collection groove 315 to prevent the waste chips from surging and generating secondary smoke and dust. At the same time, the waste chips are discharged from the chip discharge hole 316 through negative pressure to avoid affecting the next cutting.

[0044] See also Figure 1 and Figure 5 The laser cutting equipment also includes: a second negative pressure adsorption pipeline 330; an adsorption hood 600, which is arranged above the box body 310 and is connected to the second negative pressure adsorption pipeline 330; the control module is also configured to: control the external negative pressure source to suck air into the adsorption hood 600 through the second negative pressure adsorption pipeline 330 to absorb the smoke and dust on the top of the material sheet 500.

[0045] Specifically, an opening 610 is provided on the top of the adsorption cover 600 ; the ray outlet of the laser cutting mechanism 400 is provided above the opening 610 ; and the second negative pressure adsorption pipeline 330 is communicated with the side wall of the adsorption cover 600 .

[0046] It should be noted that the adsorption force in the first negative pressure adsorption pipeline 320 is greater than the adsorption force in the second negative pressure adsorption pipeline 330 .

[0047] A dual negative pressure adsorption system is adopted to suck the smoke and dust from the top and bottom of the material plate 500 respectively, and the adsorption force of the first negative pressure pipeline is greater than the adsorption force of the second negative pressure pipeline. Most of the smoke and dust are sucked from the bottom of the material plate 500 through the first negative pressure pipeline with large adsorption force, and a small amount of escaped smoke and dust are sucked from the side wall of the adsorption hood 600 by the second negative pressure pipeline, thereby avoiding the laser light path. Without increasing the energy consumption of the external negative pressure source, the amount of smoke and dust attached to the lens of the laser cutting mechanism 400 is reduced. At the same time, to avoid overheating of the lens, the laser light path can be directly shot into the opening 610 of the adsorption hood 600 without the need to keep the adsorption hood 600 away from the laser light path.

[0048] See also Figure 1 The driving mechanism 200 includes: a first direction driving unit 210, which is arranged on the working platform 100; a second direction driving unit 220, which is arranged on the first direction driving unit 210; the carrying tray 300 is arranged on the second direction driving unit 220; the control module is also configured to adjust the position of the carrying tray 300 through the first direction driving unit 210 and the second direction driving unit 220, so as to facilitate the laser cutting mechanism to cut the material sheet 500.

[0049] The position of the sheet 500 is adjusted by the linkage of the first direction driving unit 210 (X axis) and the second direction driving unit 220 (Y axis) so that the area to be cut (such as Figure 2 The air inlet 313 and the air outlet 314 are always connected to each other, thereby improving the adsorption effect of smoke and dust.

[0050] See also Figure 7At least one embodiment further provides a cutting process for the laser cutting equipment as described above, by providing a first negative pressure adsorption pipeline 320 at the bottom of the box body 310, during laser cutting, smoke and dust caused by cutting are directly sucked from the bottom of the sheet 500, thereby reducing the amount of smoke and dust rising to the laser light path, reducing the total amount of smoke and dust adhering to the lens, and avoiding lens overheating. At the same time, when cutting, the electric drive shielding part 312 is controlled to move in opposite directions, only exposing the air inlet 313 and the air outlet 314 corresponding to the area to be cut, so that the negative pressure adsorption force is concentrated on the real-time processing area, thereby concentrating the suction force of the negative pressure on the cutting area, improving the adsorption effect on smoke and dust, further reducing the amount of smoke and dust rising to the laser light path, and avoiding lens overheating.

[0051] Specifically, the cutting process includes: S110: The control module controls the driving mechanism 200 to transport the carrying tray 300 supporting the material plate 500 to the bottom of the laser cutting mechanism 400; S120: The control module controls the two electrically driven shielding parts 312 to move in opposite directions to connect the to-be-cut area of ​​the sheet 500 with the air inlet 313 and the air outlet 314 at the corresponding locations of the box body 310; S130: Controlling the external negative pressure source to provide negative pressure to the first negative pressure adsorption pipeline 320; S140: The control module drives the laser cutting mechanism 400 to cut the sheet 500, and moves the sheet 500 along a preset cutting route through the driving mechanism 200. At this time, the first negative pressure adsorption tube absorbs the smoke generated when cutting the sheet 500 from the bottom of the sheet 500 through the air inlet 313.

[0052] In summary, the present invention provides a laser cutting device and a cutting process, wherein the laser cutting device comprises: a working platform 100; a driving mechanism 200, which is arranged on the working platform 100; a carrying tray 300, which is arranged on the driving mechanism 200 and is used to support the material plate 500; a laser cutting mechanism 400, which is arranged above the driving mechanism 200 and is used to cut the material plate 500 on the carrying tray 300; wherein the carrying tray 300 comprises: a box body 310, the inner wall of which is provided with a cavity 311, and the top of the box body 310 is provided with a plurality of air inlet holes 313, the box body A plurality of air outlet holes 314 are provided at the bottom of the body 310; two oppositely arranged electric-driven shielding parts 312 are provided in the cavity 311; a first negative pressure adsorption pipeline 320 is connected to the air outlet holes 314 at the bottom of the box body 310; a control module is configured to: control the two electric-driven shielding parts 312 to move in opposite directions to connect the area to be cut of the material plate 500 with the air inlet holes 313 and the air outlet holes 314 at the corresponding positions of the box body 310, and control the external negative pressure source to suck air into the air inlet holes 313 through the first negative pressure adsorption pipeline 320, so as to absorb the smoke and dust when the laser cutting mechanism 400 cuts the material plate 500 from the bottom of the material plate 500. By setting a first negative pressure adsorption pipeline 320 at the bottom of the box body 310, during laser cutting, the smoke caused by cutting is directly sucked from the bottom of the material plate 500, reducing the amount of smoke and dust rising to the laser light path, reducing the total amount of smoke and dust attached to the lens, and avoiding lens overheating. At the same time, when cutting, the electric drive shielding part 312 is controlled to move in opposite directions, only the air inlet 313 and the air outlet 314 corresponding to the area to be cut are exposed, so that the negative pressure adsorption force is concentrated on the real-time processing area, thereby concentrating the negative pressure suction force on the cutting area, improving the adsorption effect on smoke and dust, further reducing the amount of smoke and dust rising to the laser light path, and avoiding lens overheating.

[0053] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0054] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used herein unless expressly indicated herein. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0055] Spatially relative terms, such as "inside," "outside," "below," "beneath," "down," "above," "on," etc., may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientations depicted in the figures, spatially relative terms may be intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as being "below" or "below" other elements or features will be oriented to be "above" the other elements or features. Thus, the example term "below" may encompass both above and below orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0056] In the above discussion, unless otherwise indicated, the terms "about," "approximately," "substantially," etc., when used to describe a numerical value, mean a variation of + / - 10% of the value.

[0057] With the above-described preferred embodiments of the present invention as a guide, and with reference to the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A laser cutting device, characterized in that: include: Work platform (100); A driving mechanism (200) is provided on the working platform (100); a carrying tray (300), which is arranged on the driving mechanism (200) and is used to support the material plate (500); a laser cutting mechanism (400), which is arranged above the driving mechanism (200) and is used to cut the material plate (500) on the carrying tray (300); Wherein, the carrying tray (300) comprises: A box body (310) has an inner wall provided with a cavity (311), a top of the box body (310) is provided with a plurality of air inlet holes (313), and a bottom of the box body (310) is provided with a plurality of air outlet holes (314); Two electrically driven shielding portions (312) arranged opposite to each other are provided in the cavity (311); a first negative pressure adsorption pipeline (320), which is in communication with the air outlet (314) at the bottom of the box body (310); The control module is configured to: control the two electrically driven shielding parts (312) to move in opposite directions to connect the area to be cut of the material plate (500) with the air inlet (313) and the air outlet (314) at the corresponding positions of the box body (310), and control the external negative pressure source to suck air into the air inlet (313) through the first negative pressure adsorption pipeline (320) to absorb smoke and dust generated when the laser cutting mechanism (400) cuts the material plate (500) from the bottom of the material plate (500).

2. The laser cutting device according to claim 1, wherein: The electric drive shielding portion (312) comprises: a sliding plate (3121) disposed in the cavity (311) and abutting against the upper top wall and the lower bottom wall of the cavity (311); a driving cylinder (3122), which is disposed in the cavity (311) and is used to drive the sliding plate (3121) to slide in the cavity (311); The top and bottom of the sliding plate (3121) are connected to the corresponding inner wall of the cavity (311) through corresponding shielding plates (3123); The control module adjusts the position of the sliding plate (3121) by driving the air cylinder (3122) to connect the area to be cut of the material plate (500) with the air inlet (313) and the air outlet (314) at the corresponding positions of the box body (310).

3. The laser cutting device according to claim 2, characterized in that: The shielding plate (3123) is an elastic sealing plate; Furthermore, the elastic sealing plate is in the shape of an accordion plate; When the driving cylinder (3122) drives the sliding plate (3121) to slide, it drives the shielding plate to connect or close the corresponding air inlet (313) and the air outlet (314).

4. The laser cutting device according to claim 1, wherein: A collecting tank (315) is provided at the bottom of the cavity (311); The collecting tank (315) is opened in the middle of the cavity (311); After cutting is completed, the control module is further configured to control the two electrically driven shielding parts (312) to move toward each other, thereby pushing the waste chips at the bottom of the cavity (311) into the collection groove (315) through the electrically driven shielding parts.

5. The laser cutting device according to claim 4, characterized in that: The bottom of the collecting trough (315) is provided with a chip removal hole (316); The chip removal hole (316) is in communication with the first negative pressure adsorption pipeline (320).

6. The laser cutting device according to claim 1, wherein: The laser cutting equipment also includes: A second negative pressure adsorption pipeline (330); an adsorption cover (600), which is disposed above the box body (310) and is in communication with the second negative pressure adsorption pipeline (330); The control module is further configured to control the external negative pressure source to suction the adsorption hood (600) through the second negative pressure adsorption pipeline (330) to absorb the smoke and dust on the top of the material plate (500).

7. The laser cutting device according to claim 6, wherein: The top of the adsorption cover (600) is provided with an opening (610); The ray outlet of the laser cutting mechanism (400) is arranged above the opening (610); The second negative pressure adsorption pipeline (330) is in communication with a side wall of the adsorption hood (600).

8. The laser cutting device according to claim 6, wherein: The adsorption force in the first negative pressure adsorption pipeline (320) is greater than the adsorption force in the second negative pressure adsorption pipeline (330).

9. The laser cutting device according to claim 1, wherein: The driving mechanism (200) comprises: A first direction driving unit (210), which is arranged on the working platform (100); a second direction driving portion (220), which is arranged on the first direction driving portion (210); The carrying tray (300) is arranged on the second direction driving part (220); The control module is further configured to adjust the position of the carrying tray (300) through the first direction driving unit (210) and the second direction driving unit (220) so as to facilitate the laser cutting mechanism to cut the material plate (500).

10. A cutting process applied to the laser cutting equipment according to claim 1, characterized in that: The cutting process includes: The control module controls the driving mechanism (200) to transport the carrying tray (300) supporting the material plate (500) to the bottom of the laser cutting mechanism (400); The control module controls the two electrically driven shielding parts (312) to move in opposite directions to connect the area to be cut of the material plate (500) with the air inlet (313) and the air outlet (314) at corresponding locations of the box body (310); Controlling an external negative pressure source to provide negative pressure to the first negative pressure adsorption pipeline (320); The control module drives the laser cutting mechanism (400) to cut the material plate (500), and moves the material plate (500) according to a preset cutting route through the driving mechanism (200). At this time, the first negative pressure adsorption tube absorbs smoke and dust generated when the material plate (500) is cut from the bottom of the material plate (500) through the air inlet hole (313).

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