Moisture-proof and wear-resistant composite board and laminating process thereof

Abstract

The invention relates to the technical field of functional board manufacturing, in particular to a damp-proof and wear-resistant composite board and a laminating process thereof. The composite material is prepared from 40-50 parts of dithiocar-bamate modified epoxy resin, 30-40 parts of nano silicon dioxide-carbon quantum dot modified polyurethane, 5-8 parts of a graphene-silane-metal organic framework compound, 2-4 parts of magnetic field oriented silicon carbide whiskers and 1-3 parts of self-repairing microcapsules. The modified epoxy resin is prepared from epoxy chloropropane and mercapto silane through a reaction, the graphene compound is embedded into the ZIF-8 nanoparticles, and the silicon carbide whiskers are directionally arranged through a 0.5-1T magnetic field during lamination; the plate is of a three-layer structure, covalent bonds are formed among layers through a silane coupling agent, and the plate has moisture-proof, wear-resistant and self-repairing functions. The composite material is low in water absorption rate, high in wear resistance frequency, high in microcrack repairing efficiency, high in interlayer bonding strength, capable of being stably used in high and low temperature environments, efficient in preparation process and suitable for the fields of high-end buildings, electronic equipment and the like, and the moisture-proof grade reaches IP67.

Description

Technical Field

[0001] The invention relates to the technical field of functional plate manufacturing, in particular to a moisture-proof and wear-resistant composite plate and a laminating process thereof. Background Art

[0002] Composite panels, due to their excellent overall performance, are widely used in architectural decoration, electronic equipment casings, aerospace, and other fields. However, in humid environments or high-friction environments, the panels are prone to water absorption, swelling, and surface wear, which can lead to reduced structural strength, damage to the appearance, and even affect the operation of internal components. For example, outdoor building panels can delaminate and crack due to long-term rain erosion, and scratches on electronic equipment casings caused by friction can affect both the aesthetics and protective performance.

[0003] Traditional methods for improving the moisture and wear resistance of composite panels have significant drawbacks. While adding a single moisture-proofing agent can improve water resistance in the short term, it is prone to migration and precipitation, leading to performance degradation. Adding wear-resistant fillers such as silicon carbide can increase hardness, but they have poor dispersion and are prone to agglomeration, increasing the panel's brittleness and reducing its light transmittance. While multi-layer coating processes can achieve both moisture and wear resistance, they suffer from low interlayer bond strength, prone to peeling over time, and are complex and costly.

[0004] Nanocomposite technology provides new ideas for optimizing the performance of composite panels, but existing solutions still have limitations. Simply using nano-silica or graphene modification is difficult to simultaneously meet the requirements of moisture resistance, wear resistance and mechanical properties; some self-repair systems have slow response speeds and low repair efficiency, and cannot adapt to sudden damage scenarios. In addition, existing technologies lack system design for the coordinated regulation of material structure and performance, especially in terms of interlayer interface strengthening and environmental adaptability. There is an urgent need to develop composite panels and their preparation processes that have high efficiency moisture resistance, high wear resistance and self-repairing functions. Summary of the Invention

[0005] (1) Technical problems solved

[0006] In view of the deficiencies in the prior art, the present invention provides a moisture-proof and wear-resistant composite plate and a laminating process thereof.

[0007] (2) Technical solution

[0008] A moisture-proof and wear-resistant composite plate is prepared from the following raw materials in parts by weight: 40-50 parts of a dithiocarbamate-modified epoxy resin, 30-40 parts of nano-silica-carbon quantum dot-modified polyurethane, 5-8 parts of a graphene-silane coupling agent-metal organic framework composite, 2-4 parts of magnetic field-oriented silicon carbide whiskers, and 1-3 parts of self-repairing microcapsules. The dithiocarbamate-modified epoxy resin is prepared by reacting epichlorohydrin with 3-mercaptopropyltrimethoxysilane, wherein the epoxy resin has an epoxy value of 0.48-0.52 eq / 100g and a mercapto grafting rate of 20-25%. ZIF-8 nanoparticles are embedded in the graphene composite, and the silane loading is 10-15%.

[0009] Preferably, it also includes a graphene aerogel transition layer covalently bonded between layers, with a thickness of 50-100 μm, an aerogel porosity of 85-90%, and aminosilane grafted on the surface.

[0010] Preferably, it also includes temperature-sensitive shape memory polyurethane microspheres with a glass transition temperature of 45-55° C., which trigger self-repair when the plate is impacted, with a repair efficiency of ≥80%.

[0011] Preferably, in the nano-silica-carbon quantum dot modified polyurethane, the SiO2 particle size is 8-12 nm, the carbon quantum dots are grafted onto the polyurethane segments via amide bonds, the grafting rate is 15-20%, and the polyurethane hardness is Shore A 85-95.

[0012] Preferably, the magnetic field-oriented silicon carbide whiskers have an aspect ratio of 15-25, and are axially aligned when a 0.5-1T magnetic field is applied during lamination. The angle between the whisker axis and the plate surface is ≤15°, and the wear resistance coefficient is increased by 40-60%.

[0013] Preferably, the self-repairing microcapsules encapsulate two-component epoxy resin, the wall material is urea-formaldehyde resin, the microcapsules have a rupture strength of 5-8 MPa, and a repair reaction is triggered when exposed to water.

[0014] Preferably, the lamination process of the moisture-proof and wear-resistant composite plate comprises the following steps:

[0015] S1: Preparation of modified epoxy resin: epichlorohydrin and silane react at 85-95°C for 4-5 hours, dithiocarbamate is added, and the temperature is raised to 110°C for crosslinking for 2 hours;

[0016] S2: Preparation of graphene composite: graphene oxide, silane, and ZIF-8 were ultrasonically dispersed at 70-80°C for 3-4 hours, reduced with hydrazine hydrate, and freeze-dried to obtain the composite;

[0017] S3: Lamination molding: After each layer of material is spread, press it at 130-150℃ and 12-18MPa for 2.5-3.5 hours, and apply 0.5-1T magnetic field to align the whiskers. When cooled to 50℃, irradiate with ultraviolet light for 3-5 minutes to solidify the microcapsule wall material.

[0018] Preferably, the dithiocarbamate in S1 forms a chelate structure with the epoxy resin, and the infrared spectrum shows that 1650 cm -1 A C=S characteristic peak appears at the bottom, and the moisture-proof factor is increased by 30-40%.

[0019] Preferably, the surfaces of each layer in S3 are treated with oxygen plasma before lamination, with a surface roughness of Ra 0.2-0.5 μm and an interlayer bonding strength ≥ 25 MPa.

[0020] Preferably, the composite board is pre-treated with wet heat aging after forming to trigger the initial repair of microcapsules, and the surface resistivity is stabilized at 10 8 -10 9 Ω, moisture-proof grade reaches IP67.

[0021] (3) Beneficial effects

[0022] Compared with the existing technology, the beneficial effects of the present invention are:

[0023] 1. The moisture-proof and wear-resistant composite sheet provided by the present invention achieves comprehensive performance improvements through multi-component collaborative design and innovative processes. A dithiocarbamate-modified epoxy resin and a graphene-silane-ZIF-8 complex form a double-barrier structure, blocking the permeation path of water molecules. This reduces water absorption compared to traditional sheet materials, and provides an IP67 moisture resistance rating, adapting to high-humidity environments of 85°C. Silicon carbide whiskers are axially aligned under the directional action of a magnetic field, increasing the surface wear resistance compared to unoriented sheet materials and effectively resisting friction damage.

[0024] 2. When the self-healing microcapsules rupture due to water or mechanical damage, they release a two-component epoxy resin to repair the cracks with extremely high efficiency, extending the service life of the board. A silane coupling agent forms covalent bonds between the layers, achieving a bond strength of 35 MPa, addressing the delamination issue of traditional laminates. Nano-silica-carbon quantum dot-modified polyurethane enhances matrix toughness, maintaining extremely high tensile strength at low temperatures, and broadening the application temperature range.

[0025] 3. The manufacturing process utilizes a synergistic combination of magnetic field orientation and UV curing, resulting in highly oriented whiskers and a curing time reduced to less than 5 minutes, improving production efficiency. This sheet offers advantages such as moisture resistance, wear resistance, self-healing properties, and environmental adaptability, making it suitable for a wide range of applications in high-end architecture, electronic equipment, and aerospace, with significant economic and social benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A moisture-proof wear-resistant composite board and its laminating process flow chart;

[0027] Figure 2 A comparison bar chart of wear-resistant times and micro-crack repair efficiency of examples and comparative examples;

[0028] Figure 3 A comparison line chart of resistivity change rate after high temperature and high humidity and tensile strength retention rate after low temperature of examples and comparative examples;

[0029] Figure 4 A comparison bar line chart of water absorption and surface resistivity of examples and comparative examples. DETAILED DESCRIPTION

[0030] According to Figures 1 to 4 , the specific embodiments of the present application are as follows:

[0031] Example 1: Preparation of moisture-proof wear-resistant composite board by standard process

[0032] S1: Preparation of dithiocarbamate modified epoxy resin

[0033] Into a 2L four-necked flask, 450g of epoxy resin (epoxy value 0.5 eq / 100g) was added, and after three times of nitrogen replacement, the temperature was raised to 85℃, 120g of 3-mercaptopropyltrimethoxysilane was added, and the reaction was stirred magnetically for 4 hours. 15g of dithiocarbamate (3% of the weight of the resin) was added, and the temperature was raised to 110℃ for crosslinking for 2 hours. The byproduct was removed by vacuum distillation (-0.09MPa, 80℃), and a modified epoxy resin with a mercapto grafting rate of 22% was prepared. The infrared spectrum showed the presence of a C=S characteristic peak at 1650cm -1 .

[0034] S2: Preparation of graphene-silane-ZIF-8 composite

[0035] 5g of graphene oxide was dispersed in 500mL of anhydrous ethanol, and ultrasonic treatment (400W, 40kHz) was carried out for 1 hour until uniform, 8g of silane coupling agent (KH-570), 0.3g of ZIF-8 nanoparticles (particle size 60nm) were added, and ultrasonic dispersion was carried out at 70℃ for 3 hours. 0.6g of hydrazine hydrate (12% of the weight of the graphene oxide) was added, and reduction was carried out under nitrogen protection for 2 hours. Freeze-drying was carried out for 48 hours, and a composite with a silane loading of 12% and uniform embedding of ZIF-8 was prepared, with a graphene sheet thickness of 2nm.

[0036] S3: Preparation of nano-silicon dioxide-carbon quantum dot modified polyurethane

[0037] 350g of polyurethane prepolymer (Shore A 90) was dissolved in 1L of DMF, and 10g of nano-SiO2 (particle size 10nm) and 5g of carbon quantum dots (particle size 6nm) were added. The reaction was carried out by amide bond grafting at 80°C for 2 hours to obtain a modified polyurethane with a grafting rate of 18%. Dynamic mechanical analysis showed that the glass transition temperature increased to 105°C.

[0038] S4: Preparation of self-healing microcapsules

[0039] Urea-formaldehyde resin was used as the wall material and two-component epoxy resin (A:B=1:1) was used as the core material. The in-situ polymerization method was adopted: the molar ratio of urea to formaldehyde was 1:1.5, the pH was adjusted to 3.5, and emulsification was carried out at 60°C for 1 hour to form a 5 μm emulsion. Ammonia water was added dropwise to adjust the pH to 8.0, and the reaction was carried out at a constant temperature for 3 hours to produce microcapsules with a wall thickness of 300 nm and a burst strength of 6 MPa.

[0040] S5: Lamination

[0041] Spreading order:

[0042] Surface layer: modified epoxy resin + 10% graphene composite, coating 0.2mm;

[0043] Middle layer: modified polyurethane + 2.5 parts of silicon carbide whiskers (aspect ratio 20), oriented in a 0.8T magnetic field;

[0044] Bottom layer: modified epoxy resin bonding layer (0.08mm).

[0045] Hot pressing parameters: 140℃, 15MPa, pressing for 3 hours, maintaining magnetic field orientation; after cooling to 50℃, 365nm ultraviolet light (120mW / cm 2 ) irradiated for 4 minutes to solidify the microcapsule wall material.

[0046] Example 2: Self-repairing microcapsule optimized composite sheet

[0047] S1: Preparation of dithiocarbamate-modified epoxy resin

[0048] 450 g of epoxy resin (epoxy value 0.5 eq / 100 g) was added to a 2 L four-necked flask. The mixture was replaced with nitrogen three times and then heated to 85°C. 120 g of 3-mercaptopropyltrimethoxysilane was added and the mixture was stirred under magnetic stirring for 4 hours. 15 g of dithiocarbamate (3% of the resin weight) was added and the mixture was heated to 110°C for crosslinking for 2 hours. By-products were removed by vacuum distillation (-0.09 MPa, 80°C) to obtain a modified epoxy resin with a mercapto grafting rate of 22%. The infrared spectrum showed a peak at 1650 cm -1 There is a C=S characteristic peak at .

[0049] S2: Preparation of graphene-silane-ZIF-8 composite

[0050] 5g of graphene oxide was dispersed in 500mL of anhydrous ethanol and sonicated (400W, 40kHz) for 1 hour until homogeneous. 8g of a silane coupling agent (KH-570) and 0.3g of ZIF-8 nanoparticles (60nm in diameter) were then added, followed by sonication at 70°C for 3 hours. 0.6g of hydrazine hydrate (12% by weight of the graphene oxide) was then added, and the mixture was reduced under nitrogen for 2 hours and freeze-dried for 48 hours to produce a composite with a 12% silane loading and uniformly embedded ZIF-8, resulting in a 2nm thick graphene sheet.

[0051] S3: Preparation of Nano-Silica-Carbon Quantum Dot Modified Polyurethane

[0052] 350g of polyurethane prepolymer (Shore A 90) was dissolved in 1L of DMF, and 10g of nano-SiO2 (particle size 10nm) and 5g of carbon quantum dots (particle size 6nm) were added. The reaction was carried out by amide bond grafting at 80°C for 2 hours to obtain a modified polyurethane with a grafting rate of 18%. Dynamic mechanical analysis showed that the glass transition temperature increased to 105°C.

[0053] S4: Optimized preparation of self-healing microcapsules

[0054] Urea-formaldehyde resin was used as the wall material and two-component epoxy resin (A:B=1:1) was used as the core material. The in-situ polymerization method was adopted: the molar ratio of urea to formaldehyde was adjusted to 1:1.8, the pH was adjusted to 4.0, and emulsification was carried out at 60°C for 1.5 hours to form an emulsion (the particle size was 5-8 μm as detected by a laser particle size analyzer). Ammonia water was added dropwise to adjust the pH to 8.0, and the reaction was carried out at a constant temperature for 3 hours to obtain microcapsules with a wall thickness of 400 nm and a burst strength of 7 MPa.

[0055] S5: Lamination

[0056] Spreading order:

[0057] Surface layer: modified epoxy resin + 10% graphene composite, coating 0.2mm;

[0058] Middle layer: modified polyurethane + 2.5 parts of silicon carbide whiskers (aspect ratio 20), oriented in a 0.8T magnetic field;

[0059] Bottom layer: modified epoxy resin bonding layer (0.08mm).

[0060] Hot pressing parameters: 140℃, 15MPa, pressing for 3 hours, maintaining magnetic field orientation; after cooling to 50℃, 365nm ultraviolet light (150mW / cm 2 ) irradiated for 5 minutes to cure the microcapsule wall material, producing a board with a repair efficiency of 92%.

[0061] Example 3: Composite plate with optimized magnetic field orientation parameters

[0062] S1: Preparation of dithiocarbamate-modified epoxy resin

[0063] 450 g of epoxy resin (epoxy value 0.5 eq / 100 g) was added to a 2 L four-necked flask. The mixture was replaced with nitrogen three times and then heated to 85°C. 120 g of 3-mercaptopropyltrimethoxysilane was added and the mixture was stirred under magnetic stirring for 4 hours. 15 g of dithiocarbamate (3% of the resin weight) was added and the mixture was heated to 110°C for crosslinking for 2 hours. By-products were removed by vacuum distillation (-0.09 MPa, 80°C) to obtain a modified epoxy resin with a mercapto grafting rate of 22%. The infrared spectrum showed a peak at 1650 cm -1 There is a C=S characteristic peak at .

[0064] S2: Preparation of graphene-silane-ZIF-8 composite

[0065] 5g of graphene oxide was dispersed in 500mL of anhydrous ethanol and sonicated (400W, 40kHz) for 1 hour until homogeneous. 8g of a silane coupling agent (KH-570) and 0.3g of ZIF-8 nanoparticles (60nm in diameter) were then added, followed by sonication at 70°C for 3 hours. 0.6g of hydrazine hydrate (12% by weight of the graphene oxide) was then added, and the mixture was reduced under nitrogen for 2 hours and freeze-dried for 48 hours to produce a composite with a 12% silane loading and uniformly embedded ZIF-8, resulting in a 2nm thick graphene sheet.

[0066] S3: Preparation of Nano-Silica-Carbon Quantum Dot Modified Polyurethane

[0067] 350g of polyurethane prepolymer (Shore A 90) was dissolved in 1L of DMF, and 10g of nano-SiO2 (particle size 10nm) and 5g of carbon quantum dots (particle size 6nm) were added. The reaction was carried out by amide bond grafting at 80°C for 2 hours to obtain a modified polyurethane with a grafting rate of 18%. Dynamic mechanical analysis showed that the glass transition temperature increased to 105°C.

[0068] S4: Preparation of self-healing microcapsules

[0069] Urea-formaldehyde resin was used as the wall material and two-component epoxy resin (A:B=1:1) was used as the core material. The in-situ polymerization method was adopted: the molar ratio of urea to formaldehyde was 1:1.5, the pH was adjusted to 3.5, and emulsification was carried out at 60°C for 1 hour to form a 5 μm emulsion. Ammonia water was added dropwise to adjust the pH to 8.0, and the reaction was carried out at a constant temperature for 3 hours to produce microcapsules with a wall thickness of 300 nm and a burst strength of 6 MPa.

[0070] S5: Lamination Optimization

[0071] Spreading order:

[0072] Surface layer: modified epoxy resin + 10% graphene composite, coating 0.2mm;

[0073] Middle layer: modified polyurethane + 2.5 parts of silicon carbide whiskers (aspect ratio 25), oriented in a 1T magnetic field;

[0074] Bottom layer: modified epoxy resin bonding layer (0.08mm).

[0075] Hot pressing parameters: 150℃, 15MPa, pressing for 3.5 hours, maintaining magnetic field orientation (whisker orientation degree reaches 90%, the angle between the axis and the surface is ≤10°); after cooling to 50℃, 365nm ultraviolet light (120mW / cm 2 ) was irradiated for 4 minutes to solidify the microcapsule wall material, producing a plate with a wear resistance of 180,000 times.

[0076] Comparative Example: Composite Sheet Omitting Graphene Composite

[0077] S1: Preparation of modified epoxy resin

[0078] Omitting dithiocarbamate, only using 120g of silane to modify 450g of epoxy resin, the reaction was carried out for 4 hours, the thiol grafting rate was 10%, and no C=S peak was detected.

[0079] S2: Complex Preparation

[0080] Graphene and ZIF-8 were omitted, and only 8 g of silane was used to treat the filler without ultrasonic dispersion and reduction.

[0081] S3: Polyurethane modification preparation

[0082] No carbon quantum dots were added, only 10 g of nano-SiO2 was added, and the grafting rate was 10%.

[0083] S4: Preparation of self-healing microcapsules

[0084] The wall material thickness is 200nm and the burst strength is 5MPa.

[0085] S5: Lamination

[0086] No magnetic field was applied, the pressing temperature was 120° C., the pressure was 10 MPa, the pressing was carried out for 2 hours, and no UV curing was performed, to produce a board with a water absorption rate of 2.3%.

[0087] The performance comparison between the embodiment and the comparative example is shown in the following table:

[0088] Table 1

[0089] Test item Example 1 Example 2 Example 3 Comparative example Water absorption (%) 0.8 0.6 0.5 2.3 Surface resistivity (Ω) <![CDATA[5.6×10 8 ]]> 4.8 x 10 8 ]] <![CDATA[3.2×10 8 ]]> <![CDATA[1.2×10 10 ]]> Wear resistance (thousands of times) 120 150 180 60 Microcrack repair efficiency (%) 85 92 88 0

[0090] Summary: By comparing Examples 1-3 with the comparative example, it can be seen that optimizing the self-healing microcapsules, magnetic field orientation and other processes can significantly reduce the water absorption rate of the composite board, improve the surface conductivity, wear resistance and microcrack repair efficiency, and highlight the performance improvement effect of nanocomposite and other technologies.

[0091] The environmental adaptability of the embodiment and the comparative example is compared in the following table:

[0092] Table 2

[0093] Test item Example 1 Example 2 Example 3 Comparative example Interlayer bonding strength (MPa) 28 32 35 15 Change rate of resistivity after high temperature and high humidity 15％ 10％ 8％ 180％ Tensile strength retention rate after low temperature 93％ 95％ 90％ 65％

[0094] In summary, the interlayer bonding strength, resistivity stability after high temperature and high humidity, and low-temperature tensile strength retention of Examples 1-3 are significantly better than those of the comparative example. Among them, the interlayer bonding strength of Example 3 reaches 35 MPa, and the resistivity change rate after high temperature and high humidity is only 8%, indicating that the optimized process effectively improves the interface performance and environmental adaptability of the composite board.

[0095] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A moisture-proof and wear-resistant composite plate, characterized in that: The invention is prepared from the following raw materials in parts by weight: 40-50 parts of dithiocarbamate-modified epoxy resin, 30-40 parts of nano-silica-carbon quantum dot-modified polyurethane, 5-8 parts of graphene-silane coupling agent-metal organic framework composite, 2-4 parts of magnetic field-oriented silicon carbide whiskers, and 1-3 parts of self-repairing microcapsules; the dithiocarbamate-modified epoxy resin is prepared by reacting epichlorohydrin with 3-mercaptopropyltrimethoxysilane, wherein the epoxy value of the epoxy resin is 0.48-0.52 eq / 100g and the mercapto grafting rate is 20-25%; ZIF-8 nanoparticles are embedded in the graphene composite, and the silane loading amount is 10-15%.

2. The moisture-proof and wear-resistant composite plate according to claim 1, characterized in that: The invention also includes a graphene aerogel transition layer covalently bonded between layers, with a thickness of 50-100 μm, an aerogel porosity of 85-90%, and aminosilane grafted on the surface.

3. The moisture-proof and wear-resistant composite plate according to claim 2, characterized in that: It also includes temperature-sensitive shape-memory polyurethane microspheres with a glass transition temperature of 45-55°C, which trigger self-repair when the plate is impacted, with a repair efficiency of ≥80%.

4. The moisture-proof and wear-resistant composite plate according to claim 3, characterized in that: In the nano-silicon dioxide-carbon quantum dot modified polyurethane, the SiO2 particle size is 8-12nm, the carbon quantum dots are grafted onto polyurethane segments via amide bonds, the grafting rate is 15-20%, and the polyurethane hardness is 85-95 Shore A.

5. The moisture-proof and wear-resistant composite plate according to claim 4, characterized in that: The magnetic field-oriented silicon carbide whiskers have an aspect ratio of 15-25, and are axially arranged by applying a 0.5-1T magnetic field during lamination. The angle between the whisker axis and the plate surface is ≤15°, and the wear resistance coefficient is increased by 40-60%.

6. The moisture-proof and wear-resistant composite plate according to claim 5, characterized in that: The self-repairing microcapsules encapsulate two-component epoxy resin, and the wall material is urea-formaldehyde resin. The microcapsules have a rupture strength of 5-8 MPa and trigger a repair reaction when exposed to water.

7. The lamination process of the moisture-proof and wear-resistant composite plate according to claim 6, characterized in that: The following steps are involved: S1: Preparation of modified epoxy resin: epichlorohydrin and silane react at 85-95°C for 4-5 hours, dithiocarbamate is added, and the temperature is raised to 110°C for crosslinking for 2 hours; S2: Preparation of graphene composite: graphene oxide, silane, and ZIF-8 were ultrasonically dispersed at 70-80°C for 3-4 hours, reduced with hydrazine hydrate, and freeze-dried to obtain the composite; S3: Lamination molding: After each layer of material is spread, press it at 130-150℃ and 12-18MPa for 2.5-3.5 hours, and apply 0.5-1T magnetic field to align the whiskers. When cooled to 50℃, irradiate with ultraviolet light for 3-5 minutes to solidify the microcapsule wall material.

8. The lamination process of moisture-proof and wear-resistant composite board according to claim 7, characterized in that: The dithiocarbamate in S1 forms a chelate structure with the epoxy resin, and the infrared spectrum shows 1650cm -1 A C=S characteristic peak appears at the bottom, and the moisture-proof factor is increased by 30-40%.

9. The lamination process of moisture-proof and wear-resistant composite board according to claim 7, characterized in that: In the S3, the surfaces of each layer are treated with oxygen plasma before lamination, with a surface roughness Ra of 0.2-0.5 μm and an interlayer bonding strength of ≥25 MPa.

10. The lamination process of moisture-proof and wear-resistant composite board according to claim 7, characterized in that: After the composite board is formed, it is pre-treated with wet heat aging to trigger the initial repair of microcapsules, and the surface resistivity is stabilized at 10 8 -10 9 Ω, moisture-proof grade reaches IP67.

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