An adaptive pore-forming quality detection device and system

Abstract

The application relates to the field of measurement testing technology, and specifically discloses a self-adaptive hole-forming quality detection device and system, which comprises a main controller, a plurality of intelligent modules electrically connected with the main controller and axially rotatably connected with the main controller, any intelligent module comprises a shell, a plurality of arm joints are arranged on the side wall of the shell in a circumferential array, a collection conversion module for connecting at least one stroke sensor and a pressure sensor is arranged in the shell, a self-adaptive elongated arm mechanism is arranged on the arm joint, the free end of the arm mechanism is provided with the stroke sensor, and the stroke sensor is in abutting contact with the inner wall of a hole; and any pressure sensor is embeddedly arranged on the inner wall of the hole. According to the application, the space-time distribution relationship between deformation and stress is analyzed in cooperation, not only can the abnormal area be positioned, but also the precursors of stress release and displacement increase representing instability can be reflected, so that the scientific inference and accurate prediction of the hole collapse position, range and even direction can be realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of physical property measurement of hole wall, test technology, in particular to the use of ultrasonic, laser radar to measure the physical properties inside the sidewall material, for analyzing the material properties of hole wall; Especially measure or test the characteristics of different thickness or depth geology, for evaluating the quality of hole wall, specifically relates to an adaptive hole quality detection device and system. BACKGROUND

[0002] In the field of civil engineering, geological exploration, road construction measurement, the quality of hole directly related to the safety and stability of the whole project. The most common engineering hidden trouble after hole is hole wall collapse, which not only will seriously affect the subsequent process, more likely to trigger a chain reaction, resulting in equipment damage, delay and even safety accidents. Therefore, real-time, accurate monitoring of hole deformation, and scientific prediction of hole collapse risk, has extremely important engineering significance. Especially in the high mountain and deep valley area, the stratum lithology is complex and changeable, the exposed rock in high altitude area is mainly medium-deep metamorphic rock, which is the product of high pressure or super high pressure metamorphism in plate subduction and collision process, and the rock mass after strong tectonic extrusion and shear action. This kind of rock mass is extremely broken, joint, fracture and fault are extremely developed, with poor integrity and low mechanical strength; It may also include the distribution of different lithology belts, combined with the high level of regional tectonic stress caused by plate collision and complex and changeable stress direction. This makes the hole wall extremely easy to have uncontrollable and unpredictable morphological changes after hole, such as hole collapse, water gushing, etc., especially the risk of hole collapse, which has great hidden trouble for subsequent construction, because the occurrence of hole collapse indicates that the geological characteristics are uncontrollable, which is also the significance of hole detection and measurement of surface changes of hole wall, changes of different thickness or depth.

[0003] Currently, the detection and monitoring of the quality of hole forming in the industry mainly relies on non-contact measurement technology, mainly including: ultrasonic measurement method: using ultrasonic reflection principle to measure the distance from the hole wall to the probe, and obtaining the cross-sectional profile of the hole wall through rotary scanning. Although this method can accurately describe the geometric shape after hole forming, the measurement result is only the instantaneous static of the hole wall surface, and it cannot continuously track the dynamic deformation process of the hole wall. More importantly, it is a "post" measurement, which cannot perceive the change of the internal stress of the hole wall rock-soil body, and cannot provide early warning before collapse occurs. Laser radar or optical measurement method: obtaining high-precision three-dimensional point cloud model of the hole wall through laser scanning. This method is also limited to one-time measurement of the apparent geometric shape of the hole wall, and cannot penetrate the hole wall medium. The measurement effect is easily disturbed by the environment in the hole, and also cannot reflect the change of the mechanical state of the hole wall. Infrared measurement method: indirectly judging some defects by detecting the change of the temperature field of the hole wall. The application range of this method is limited, and it has no direct connection with the mechanical properties of the hole wall structure, and lacks the ability to judge the risk of hole collapse caused by stress concentration. SUMMARY

[0004] In order to solve the problem that the existing measurement technology is based on static measurement and cannot solve the problem of displacement change caused by continuous or intermittent internal stress, and the existing hole forming measurement technology cannot collect the stress change at different depths and thicknesses. The root cause of hole collapse is that the shear stress of the soil around the hole exceeds its shear strength. The existing technology cannot measure the internal stress change of the rock-soil body at a certain depth of the hole wall, which is exactly the most direct and key parameter for predicting collapse. In order to solve the problem that the existing technology cannot provide continuous data stream changing with time, so as to capture the evolution trend of hole wall stability, and cannot provide prospective prediction for possible hole collapse, so as to obtain comprehensive detection of hole forming quality, the application provides a self-adaptive hole forming quality detection device and system, which adopts a distributed, embedded and directly contacting hole wall monitoring scheme, realizes direct and quantitative measurement of the internal stress of the hole forming side wall through the sensor array implanted in the hole wall. This is fundamentally different from all existing non-contact technologies, breaks through the fatal limitation that they cannot perceive the internal mechanical state of the medium, provides the most direct and key mechanical parameter basis for predicting collapse, not only can obtain intuitive measurement data, but also can evaluate and estimate the hole forming geology according to the obtained measurement data, and make the evaluation result from surface speculation to internal quantization.

[0005] In order to achieve the above purpose, the technical scheme adopted by the application is:

[0006] An adaptive pore-forming quality detection device, comprising a main controller, a plurality of intelligent modules electrically connected with the main controller and axially rotatably inserted with each other, any of the intelligent modules comprising a shell, a plurality of arm joints being distributed along a circumferential array on a side wall of the shell, a collection conversion module for connecting at least one stroke sensor and a pressure sensor being installed in the shell, an adaptive elongated arm mechanism being installed on the arm joint, a free end of the arm mechanism being installed with the stroke sensor, the stroke sensor being in abutting contact with an inner wall of a pore;

[0007] The collection conversion module comprises a local MCU electrically connected with any of the stroke sensor and the pressure sensor, and a conductive conversion mechanism rotatably installed at both ends of the shell for plugging with adjacent intelligent modules, the conductive conversion mechanism comprising a static conductive mechanism fixedly connected with the shell and a dynamic conductive mechanism rotatably installed on the static conductive mechanism, the static conductive mechanism being electrically connected with the local MCU.

[0008] Preferably, the dynamic conductive mechanism has a pin joint electrically connected with an adjacent intelligent module, and a plurality of conductive tubes embedded in an insulating material and coaxial with different diameters, adjacent two conductive tubes being isolated by the insulating material, any pin of the pin joint being electrically connected with a conductive tube, any conductive tube being electrically connected with the local MCU through a conductive module pre-embedded in the static conductive mechanism and corresponding to the conductive tube.

[0009] Preferably, the static conductive mechanism is provided in a hollow annular structure, the conductive module is configured as any conductive body pre-embedded in the static conductive mechanism, one end of the conductive body being connected with the local MCU, the other end extending radially to form a conductive spring always in contact with a side wall of the corresponding conductive tube; the conductive spring is arranged in a circumferential array and connected with each other, any conductive spring always being in contact with the corresponding conductive tube.

[0010] Preferably, the static conductive mechanism is provided in a hollow annular structure, a plurality of radial through holes being provided on a side wall of the static conductive mechanism in a radial direction, the conductive module being configured as a conductive assembly installed in the radial through hole, the conductive assembly comprising a brush head slidingly provided in the radial through hole for contacting an outer side wall of the conductive tube, a plug for plugging the radial through hole, and a spring provided between the brush head and the plug and in a compressed state.

[0011] Preferably, the static conductive mechanism is arranged as a hollow annular structure, the conductive module adopts a double conductive structure composed of a conductive spring assembly and a conductive brush assembly; the conductive spring is any conductive body pre-embedded in the static conductive mechanism, one end of the conductive body is connected to a local MCU, and the other end extends radially to form a conductive spring that is always in contact with the side wall of the corresponding conductive pipe; the conductive springs are arranged in a circumferential array and are connected to each other, and any conductive spring is always in contact with the corresponding conductive pipe, and the lower end surface of any conductive pipe and the outer side wall adopt a plane or a circular arc chamfer structure; the conductive brush assembly is a conductive assembly installed in a radial through hole arranged in the radial direction of the static conductive mechanism, the conductive assembly includes a brush head slidingly arranged in the radial through hole for contact with the outer side wall of the conductive pipe, a plug for plugging the radial through hole, and a spring arranged between the brush head and the plug and in a compressed state.

[0012] Preferably, the arm mechanism includes one or a plurality of module arms connected to each other, and a telescopic tube telescopically installed at the free end of the module arm, and the travel sensor is installed at the free end of the telescopic tube.

[0013] Preferably, the module arm is hollow and detachably connected by threads, the telescopic tube is inserted into the adjacent module arm, and a locking cap is provided on the telescopic tube to fix the telescopic tube and the module arm by thread connection.

[0014] Preferably, the conductive conversion mechanism arranged at both ends of the collection and conversion module is respectively provided with a female connector and a male connector which can be inserted into each other and are rotatably connected with the shell, the female connector has a groove in the center for installing a pin connector, and the male connector has a boss which is plugged with the pin connector and matches the groove.

[0015] Preferably, the conductive conversion mechanism adopts a composite female and male connector structure, the female connector extends axially along the shell to form a large male connector higher than the end face of the shell, the male connector is embedded in the shell to form a large female connector matching the large male connector, and at least one magnetic ring is provided on the outer side wall of the shell for auxiliary fixation.

[0016] The application also provides a self-adaptive hole forming quality detection system, which comprises a main controller, a laser radar module in communication connection with the main controller for scanning a hole wall to generate a three-dimensional point cloud model, a multi-frequency ultrasonic module for measuring a hole forming diameter and a hole forming inner wall crack, and a plurality of detection devices as described above in electrical connection with the main controller, and specifically further comprises: a static anomaly detection unit comprising a model M of fitting a least square circle for hole forming at each depth section data collected by the laser radar module, calculating the radial deviation of each measurement point at the corresponding depth from the model M , when , then the area is identified as a geometric defect area in the model M; wherein, is a preset radial deviation value;

[0017] a dynamic trend analysis unit including a preset displacement change rate threshold and a preset pressure change rate threshold ; when , then the area is identified as a deformation acceleration zone in the model M; is the time required for to occur;

[0018] when , then the area is identified as a stress mutation area in the model M; wherein, is the pressure change amount within time;

[0019] a stress analysis unit using the pressure actually measured by the detection device as a condition input, calculating the stress field of the inner wall of the hole, determining the plastic zone and the direction of the maximum principal stress, and when the actual calculation value , then the area is identified as the location and range of the potential slip surface in the model M, wherein, is the critical safety factor;

[0020] a hole collapse direction and probability prediction unit including a multi-factor weighted scoring model to evaluate the hole quality score S, wherein,

[0021] S = w 1 *S 几何缺陷 + w 2 *S 变形加速 +w 3 *S 应力突变

[0022] When S < 60, the hole quality evaluation is qualified;

[0023] When 60≤S≤80, the hole quality evaluation is rechecked;

[0024] When 80 < S≤90, the hole quality evaluation is warning;

[0025] When S > 90, the hole quality evaluation is dangerous;

[0026] wherein, w 1 , w 2 , w 3 are the weight coefficients of the influence of geometric defects, deformation acceleration and strain mutation on hole quality, respectively;S 几何缺陷 The score of the geometric defect evaluation dimension in the evaluation of hole formation quality; S 变形加速 The score of the deformation acceleration evaluation dimension in the evaluation of hole formation quality; S 应力突变 This represents the score of the stress mutation evaluation dimension in the evaluation of hole formation quality.

[0027] Beneficial effects:

[0028] 1. This invention constructs a continuously operating real-time dynamic monitoring network using stroke and pressure sensors, capable of capturing a complete data stream of borehole wall radial displacement and internal stress changes over time, 24 / 7. This fundamentally solves the problem of existing technologies only providing a snapshot of surface morphology at a single moment. It enables the determination of the evolution trend of borehole wall stability over time based on the detected data stream, thereby achieving early identification of potential risks and process tracking, and realizing comprehensive detection and evaluation of borehole wall quality.

[0029] 2. This invention deeply integrates two heterogeneous but highly related physical information types, displacement and pressure. By synergistically analyzing the spatiotemporal distribution relationship between deformation and stress, it can not only locate abnormal areas, but also reveal the coupling mechanism that characterizes the precursors of instability, such as "stress release-displacement increase". This enables scientific inference and accurate prediction of the location, range and even direction of the collapsed hole.

[0030] 3. The modular design and infinitely cascadeable topology of this invention give it unprecedented flexibility and scalability. Users can flexibly increase or decrease the number of modules according to the actual hole depth, without the need to customize equipment of different lengths. One system can adapt to a variety of engineering scenarios, significantly reducing the application threshold and repeated purchase costs.

[0031] 4. Because the sensor unit of this invention directly contacts or is embedded in the medium inside the borehole via a mechanical support arm, its measurement process is almost unaffected by the complex environment commonly found inside the borehole. Compared with traditional technologies that rely on optical and acoustic principles, this invention achieves extremely high environmental robustness and data reliability, ensuring stable operation under real-world harsh conditions. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a top view of the detection device.

[0034] Figure 2 is a structural axonometric view of the intelligent module. Figure 1

[0035] Figure 3 is a structural axonometric view of the intelligent module.

[0036] Figure 4 is a top view of the intelligent module. Figure 3

[0037] Figure 5 is a full cross-sectional view of the intelligent module along the section symbol A-A. Figure 4

[0038] Figure 6 is a full cross-sectional view of the intelligent module along the section symbol B-B. Figure 5

[0039] Figure 7 is a structural enlargement of the C area in the intelligent module. Figure 5

[0040] Figure 8 is a schematic view of the installation structure when the present application is in detection.

[0041] Figure 9 is a structural enlargement of the D area in the intelligent module. Figure 8

[0042] Figure 10 is a flow direction block diagram of the electric current in the conductive conversion mechanism.

[0043] Figure 11 is a structural block diagram of the system of the present application.

[0044] Figure 12 is a schematic view of the connection structure of the arc-shaped plate and the magnetic ring in the embodiment 6 of the present application.

[0045] In the figure: 1-intelligent module; 11-housing; 12-branch joint; 13-magnetic ring; 131-arc-shaped plate; 14-acquisition and conversion module; 141-female joint; 142-pin joint; 143-movable conductive mechanism; 1431-conductive tube; 144-stationary conductive mechanism; 1440-insulating ring; 1441-radial through hole; 1442-conductive spring; 1443-brush head; 1444-spring; 1445-plug; 145-local MCU; 146-male joint.

[0046] 2-branch; 21-module branch; 22-locking cap; 23-telescopic tube; 231-through hole; 3-travel sensor; 4-pressure sensor.

[0047] DETAILED DESCRIPTION

[0048] ​​​​​​​In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0049] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application.

[0050] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0051] In the description of the present application, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the application is usually placed, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the present application. In addition, if the terms "first", "second" and the like appear in the description of the present application, they are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0052] In addition, if the terms "horizontal", "vertical" and the like appear in the description of the present application, they do not mean that the component must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0053] In the description of the present application, it should also be noted that unless otherwise explicitly specified and limited, if the terms "arrangement", "installation", "connection", "connection" appear, they should be understood in a broad sense, for example, they can be fixedly connected, or detachably connected, or integrally connected; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium, or the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0054] Embodiment 1:

[0055] The embodiment provides a self-adaptive hole-forming quality detection device, and refers to the accompanying drawings Figures 1-7 As shown in the drawings, the device comprises a main controller, a plurality of intelligent modules 1 which are electrically connected to the main controller and are axially rotatably inserted into each other, any of the intelligent modules 1 comprises a shell 11, a plurality of arm joints 12 are distributed along the circumferential array on the side wall of the shell 11, a collection conversion module 14 for connecting at least one stroke sensor 3 and a pressure sensor 4 is installed in the shell 11, an adaptive elongated arm mechanism is installed on the arm joint 12, the free end of the arm mechanism is provided with the stroke sensor 3, and the stroke sensor 3 is in abutting contact with the inner wall of a hole; any of the pressure sensors 4 is embeddedly installed on the inner wall of the hole;

[0056] The collection conversion module 14 comprises a local MCU 145 which is electrically connected to any of the stroke sensors 3 and the pressure sensors 4, and a conductive conversion mechanism which is rotatably installed at both ends of the shell 11 and is used for being inserted into the adjacent intelligent module 1, the conductive conversion mechanism comprises a static conductive mechanism 144 which is fixedly connected to the shell 11 and a dynamic conductive mechanism 143 which is rotatably installed on the static conductive mechanism 144, and the static conductive mechanism 144 is electrically connected to the local MCU 145.

[0057] Working principle:

[0058] In order to better understand the present application, the working principle part of the embodiment first describes the functions of various components, and then summarizes and details the overall working principle; the functions of the components are described as follows:

[0059] Travel sensor 3: Travel sensor 3 is installed at the end of the arm mechanism, which is a mechanical structure that can be adjusted in length according to the actual installation scene, mainly serving as a support, and the length of the arm mechanism will not be adjusted after installation is completed; Travel sensor 3 is always in contact with the inner wall of the hole being measured; In this embodiment, the intelligent module 1 has four arm mechanisms evenly distributed on the circumferential side wall of the shell 11, that is, there are travel sensors on the front, back, left and right of the shell 11, and if there is a radial displacement at the detection point of the travel sensor 3, the travel sensor 3 can capture the corresponding parameters. In this embodiment, the travel sensor 3 can use an analog output infrared distance measuring sensor, such as Sharp GP2Y0A41SK0F, which has a 4-30cm range and is suitable for hole diameter measurement, is small in size and easy to integrate inside the arm, and in addition, the present application is developed for complex geological areas, such as Tibet, especially the high-altitude geological construction in the Yarlung Zangbo River area. Of course, this is only a preferred scheme, and those skilled in the art can also choose other models of travel sensors 3 that meet the conditions, such as Turck Q50UR series ultrasonic distance measuring sensors or well-known Potentiometer linear displacement sensors.

[0060] Pressure sensor 4: The pressure sensor 4 is used to detect the existence of geological internal stress at different thickness detection points in the hole wall. Since the pressure sensor 4 has many distribution points, it can cover the entire hole wall in a networked manner, so by continuously detecting the size, distribution and changes of geological internal stress, it can effectively judge the possible movement and hole collapse of the hole wall. Compared with the existing static detection of hole quality, which obtains static parameters at a certain moment, continuous dynamic detection is more objective and accurate. In this embodiment, the pressure sensor 4 used is model TE Connectivity MS5837-30BA, which has a 30bar range, integrated digital output I2C / SPI, built-in high-precision ADC, factory calibrated, greatly improving the convenience of integration, and has a small size, all stainless steel structure, corrosion resistance, and is very suitable for embedded installation at the end of the arm, directly sensing the earth pressure.

[0061] Regarding the main controller, the present embodiment can be implemented using existing technology, with various models available, such as Advantech industrial personal computer (IPC) or ADLINK cPCI series, as well as the lower-cost Raspberry Pi CM4 + IOBoard. Those skilled in the art have a wide range of options for the main controller, and the selection of the main controller is determined based on the functional requirements and cost of the system, which is prior art. Those skilled in the art can select suitable products from existing commercially available products, and the main controller is not the point of improvement of the present application, and will not be described here.

[0062] The number of installed detection devices depends on the actual detection environment; for example, still taking hole quality detection as an example, referring to Figures 8-9 The axial size of a single detection device is 10 cm, and the hole depth to be detected is 3 m. To detect the hole quality, 30 monitoring devices are needed, and the phase angle of the adjacent two detection devices is a = 5°. Each detection device has 4 arm mechanisms, so the number of travel sensors 3 is 30*4 = 120, and there are 120 radial displacement measurement points. One arm mechanism leads to 5 pressure sensors 4, so the number of pressure sensors 4 is 30*4*5 = 600, and there are 600 address internal stress measurement points.

[0063] When measuring, the working process of the detection device is the cyclic acquisition, upload and storage of data. By analyzing the data collected by the detection device, it can be determined whether there is a risk of hole collapse, as well as the location and probability of possible hole collapse. The following are the detailed steps of the data flow:

[0064] Step 1: The detection device is powered on, and the main controller performs a broadcast self-check. After each intelligent module receives the command, it checks the status of its sensors and returns the module ID, sensor status, including normal or fault, to the main controller. The main controller establishes a system module list and topology, and after confirming that all nodes are normal, it enters the main loop.

[0065] Step 2: Data acquisition cycle, the main controller sequentially Figure 11As shown, the intelligent module #1 to the intelligent module #N sends a "data request" command packet to the bus, which contains the target module ID, of course, it can also not in order, in order of priority, which involves the communication order can be customized by the user. The MCU of the intelligent module receives the command, synchronously collects the readings of its four travel sensors, travel sensor A, travel sensor B…travel sensor N, N=4, measures the radial displacement. Synchronously collect the readings of its 20 pressure sensors, pressure sensor A, pressure sensor B…pressure sensor N, N=20, measure the soil pressure. All the above data, plus timestamp, provided by the main controller command packet to ensure synchronization, module ID, sensor ID, packaged into a data frame, any intelligent module 1 will send the data frame back to the main controller through the RS-485 bus. The main controller receives and parses the data frame, stores it in the temporary database or buffer array, and the main controller repeatedly asks the next module until all module data collection is complete.

[0066] Step 3: Data preprocessing and structuring, the main controller integrates all the data collected in a round; according to the ID of each module and the preset spiral arrangement rule, that is, the phase angle α=5°, the accurate coordinates of each sensor in three-dimensional space are calculated, and the spatial position mapping is completed; finally, the discrete sensor point data is generated through the interpolation algorithm to generate continuous hole wall displacement nephogram and hole wall stress nephogram, so as to judge the hole forming quality.

[0067] Example 2:

[0068] This embodiment is further structural optimization of the detection device based on example 1. Specifically, referring to Figures 3-7 As shown, the dynamic conductive mechanism 143 has a pin joint 142 electrically connected with the adjacent intelligent module 1, and a plurality of conductive tubes 1431 embedded in the insulating material and coaxial with different diameters, the adjacent two conductive tubes 1431 are isolated by insulating material, any pin of the pin joint 142 is electrically connected with a conductive tube 1431, and any conductive tube 1431 is electrically connected with the local MCU 145 through the conductive module preset in the static conductive mechanism 144 and corresponding to the conductive tube 1431. Specifically referring to Figure 5As shown, any sensor electrically connected with the local MCU 145 sends an electrical signal to the local MCU 145, and then the electrical signal is transmitted directly or through a cable to the main controller through the conductive module, the conductive tube 1431 and the pin joint 142 in turn. In order to solve the problem of arranging the stroke sensors 3 as evenly as possible and covering the entire detection area under the premise of limited support arm mechanism, the adjacent two detection devices are rotationally connected. In order to solve the problem of simultaneously meeting stable communication and not being limited by the rotation phase angle a, a scheme is needed to meet the requirement of stable power supply for multiple cables under the condition of any rotation angle. Therefore, the scheme of the embodiment is provided. The specific principle is that the static conductive mechanism 144 is fixedly installed in the shell 11 by clamping or interference fit or through friction fixation. The static conductive mechanism 144 is rotationally electrically connected with the conductive tube 1431 through the built-in conductive module. The conductive tube 1431 transmits the electrical signal to the adjacent intelligent module 1 or cable through the pin joint 142, and finally transmits to the main controller. It is worth mentioning and emphasizing that the meaning of one-to-one correspondence between the conductive tube 1431 and the conductive module is that an independent conductive tube 1431 is electrically connected with an independent conductive module. Since the communication battery of the sensor is not only one, the number of the conductive tube 1431 is also not one, but multiple conductive tubes 1431 arranged in a concentric circle. The adjacent two conductive tubes 1431 are filled with insulating material and act as conductors for conducting and transmitting signals. Figure 5 As shown, the conductive tube 1431 is gradually shortened from the smallest diameter to the largest diameter along the axial direction, so that the circumferential side wall of any conductive tube 1431 near the lower end face has an exposed section for contacting the conductive module. When the conductive tube 1431 rotates with the entire dynamic conductive mechanism 143, the dynamic conductive mechanism 143 rotates relative to the static conductive mechanism 144, but does not affect the electrical signal transmission of any conductive tube 1431. At the same time, the effect of installing multiple detection devices with different phases and stable signal transmission is achieved.

[0069] Embodiment 3:

[0070] This embodiment is further refined for the static conductive mechanism on the basis of the above-mentioned embodiments. For details, see Figure 5 and Figure 6As shown, the static conductive mechanism 144 is arranged as a hollow ring structure, and the conductive module is configured as any conductive body embedded in the static conductive mechanism 144, one end of the conductive body is connected to the local MCU 145, and the other end extends radially to form a conductive spring 1442 that is always in contact with the side wall of the corresponding conductive pipe 1431; the conductive springs 1442 are arranged in a circumferential array and are connected to each other, and any conductive spring 1442 is always in contact with the corresponding conductive pipe 1431. In order to solve the technical problem of stable conduction, the distance between the conductive spring 1442 and the axis of the static conductive mechanism 144 in the natural state is less than that of the conductive pipe 1431 in contact with it, and after the conductive pipe 1431 is installed, the conductive spring 1442 will always be pressed on the side wall of the conductive pipe 1431 under the action of its own deformation spring force, realizing stable conduction; in order to further realize stable power supply, the number of conductive springs 1442 is multiple and connected to each other, as long as any one is in contact with the conductive pipe 1431, the expected technical effect can be achieved. As shown in Figure 6 As shown, the embodiment provides a scheme of arranging 4 conductive springs 1442 in a circumferential array to ensure stable conduction performance when the conductive pipe 1431 rotates.

[0071] Embodiment 4:

[0072] The embodiment is further refined on the basis of the above-mentioned embodiments 1-2 for the static conductive mechanism, which is used as an alternative to or in combination with the scheme of embodiment 3 to solve the problem of stable conduction of the static conductive mechanism 144 and the dynamic conductive mechanism 143 under the condition of rotation. The static conductive mechanism 144 is arranged as a hollow ring structure, and the side wall of the static conductive mechanism 144 is provided with a plurality of radial through holes 1441 in the radial direction, and the conductive module is configured as a conductive assembly installed in the radial through hole 1441, which includes a brush head 1443 slidingly arranged in the radial through hole 1441 for contacting the outer side wall of the conductive pipe 1431, a plug 1445 for plugging the radial through hole 1441, and a spring 1444 arranged between the brush head 1443 and the plug 1445 and in a compressed state. Unlike the conductive spring 1442 used in embodiment 3, this embodiment uses another combined structure to realize close sliding contact with the conductive pipe 1431. The specific principle is that the brush head 1443 is in contact with the corresponding conductive pipe 1431, the plug 1445 is fixedly connected with the insulating ring 1440 as the body structure of the static conductive mechanism 144, and the spring 1444 in the compressed state tightly abuts the conductive pipe 1431, so that the rotation of the conductive pipe 1431 does not affect the stability of power supply; the end of the spring 1444 close to the plug 1445 or the plug 1445 made of conductive material is electrically connected to the local MCU 145 through a conductor.

[0073] Embodiment 5:

[0074] This embodiment is another preferred solution of the present application to solve the stable conduction problem of the static conduction mechanism 144 and the dynamic conduction mechanism 143 under the rotating condition; the solution is to combine the embodiment 3 and the embodiment 4, and the specific structure is shown in the attached drawings of the specification Figures 5-6 As shown in the drawings, specifically, the static conduction mechanism 144 is arranged in a hollow ring structure, and the conduction module adopts a double conduction structure composed of a conduction spring assembly and a conduction brush assembly; the conduction spring is any conductive body pre-embedded in the static conduction mechanism 144, one end of the conductive body is connected to the local MCU 145, and the other end extends radially to form a conduction spring 1442 that is always in contact with the side wall of the corresponding conduction pipe 1431; the conduction springs 1442 are arranged in a circumferential array and are connected to each other, and any conduction spring 1442 is always in contact with the corresponding conduction pipe 1431, and the lower end surface of any conduction pipe 1431 and the outer side wall adopt a plane or a circular arc chamfer structure; the conduction brush assembly is a conductive assembly installed in the radial through hole 1441 arranged in the radial direction of the static conduction mechanism 144, the conductive assembly includes a brush head 1443 slidingly arranged in the radial through hole 1441 for contacting the outer side wall of the conduction pipe 1431, a plug 1445 for plugging the radial through hole 1441, and a spring 1444 arranged between the brush head 1443 and the plug 1445 and in a compressed state. The working principle is the same as the content described in the embodiment 3 and the embodiment 4, and will not be repeated here. The direction of the electric signal flow collected by the travel sensor 3 and the pressure sensor 4 is shown in the drawings, which is transmitted independently through two parallel paths, and the interruption of any one transmission path will not affect the stable transmission of the electric signal, perfectly solving the problem of stable transmission of the electric signal in the rotating process of the adjacent two detection devices. It is worth noting that the rotating installation is necessary for the overall detection of the stress state and displacement state of the hole wall, and the stable transmission of the electric signal is necessary for the bus mode adopted by the present application. The present application has the ability to theoretically expand the wireless capacity, so all sensors need to transmit data based on the bus. Under the condition that the main controller can load, the number of sensors can be expanded wirelessly, and the number of detection points can be almost infinitely increased. The detection is dynamic and continuous, which has outstanding substantial features and significant progress in accuracy and trend predictability compared with the existing static state detection. Figure 10

[0075] Embodiment 6:

[0076] This embodiment is further optimized on the basis of any of the above embodiments, specifically, please refer to the attached drawings of the specification Figures 1-2 ​As shown, the arm mechanism comprises one or a plurality of module arms 21 connected with each other, and a telescopic pipe 23 telescopically installed at the free end of the module arm 21, and the stroke sensor 3 is installed at the free end of the telescopic pipe 23.

[0077] In the embodiment, the module arm 21 is hollow and connected by threads, the telescopic pipe 23 is inserted into the adjacent module arm 21, and the locking cap 22 is sleeved on the telescopic pipe 23 to fix the telescopic pipe 23 and the module arm 21 by thread connection.

[0078] In the embodiment, in order to realize stable insertion, the application provides a joint structure of male and female integration, that is, the male joint contains the female joint structure, and the female joint contains the male joint structure, which will be described in detail with reference to Figure 5 the drawings.

[0079] In the embodiment, the conductive conversion mechanism distributed at both ends of the collection conversion module 14 is respectively provided with a female joint 141 and a male joint 146 which can be inserted into each other and are rotationally connected with the shell 11, the female joint 141 has a groove in the center for installing a pin joint 142, and the male joint 146 has a boss which is inserted into the pin joint 142 and matches the groove.

[0080] In this embodiment, the conductive conversion mechanism adopts a composite male and female joint structure, the female joint 141 extends axially along the shell 11 to form a large male joint higher than the end face of the shell 11, and the male joint 146 is embedded in the shell 11 to form a large female joint matched with the large male joint. The outer side wall of the shell 11 is sleeved with at least one magnetic ring 13 for auxiliary fixation. The magnetic ring 13 is a structure for assisting in improving the stability of a plurality of mutually plugged detection devices; still taking the axial length of a single detection device body as 10 cm as an example, the axial length of 10 mutually plugged detection devices is 1 meter, and the axial length of 100 mutually plugged detection devices is 10 meters, which makes the structural stability of the entire plurality of detection devices connected together decrease with the increase in the number; then in order to simplify the structure as much as possible while not destroying the possibility of modular combination, a rigid structure magnetically connected with the magnetic ring 13 can enhance the overall strength. For example, an arc-shaped plate member 131 matched with the outer diameter of the magnetic ring 13 is adopted, and one arc-shaped plate member 131 can be magnetically connected with 4-8 mutually connected detection devices; then through a plurality of arc-shaped plate members 131, the overall axial and radial strength of the plurality of mutually connected detection devices can be significantly enhanced. For example, taking one arc-shaped plate member 131 capable of magnetically connecting 5 detection devices as an example, the first arc-shaped plate member 131 magnetically connects detection devices numbered 1-5, the second arc-shaped plate member 131 magnetically connects detection devices numbered 4-8, and the third arc-shaped plate member 131 magnetically connects detection devices numbered 6-10, the total number of detection devices is N, N≥2, and so on, so that any two adjacent detection devices share at least one arc-shaped plate member 131, thereby significantly enhancing the radial bending resistance of the plurality of mutually connected detection devices and improving the overall strength. Referring to Figure 12 As shown from top to bottom, the first arc-shaped plate member magnetically connects 1-3 detection devices, the second arc-shaped plate member 131 magnetically connects 3-5 detection devices; the third arc-shaped plate member 131 magnetically connects 5-7 detection devices… and so on; so that the overall structural stability of the plurality of adjacent plugged detection devices is better; of course, due to the different radial phase angles of the adjacent two detection devices, the arc-shaped plate member 131 can be provided in different spiral curvature structures to adapt to different connection scenes, and the more detection devices magnetically connected by a single arc-shaped plate member 131, the better the overall stability.

[0081] Embodiment 7:

[0082] The application also provides a self-adaptive hole forming quality detection system, comprising a main controller, a laser radar module in communication connection with the main controller for scanning a hole wall to generate a three-dimensional point cloud model, a multi-frequency ultrasonic module for measuring a hole forming diameter and a hole forming inner wall crack, and a plurality of detection devices provided by any of the above embodiments in electrical connection with the main controller, and specifically further comprising: a static anomaly detection unit comprising a model M of fitting a least square circle for hole forming at each depth section data collected by the laser radar module, calculating the radial deviation of each measurement point from the model M at the corresponding depth , when , a geometric defect area is identified in the model M; wherein, is a preset radial deviation value;

[0083] a dynamic trend analysis unit comprising a preset displacement change rate threshold and a preset pressure change rate threshold ; when , a deformation acceleration zone is identified in the model M; is the time required for to occur;

[0084] when , a stress mutation area is identified in the model M; wherein, is the pressure change amount within time;

[0085] a stress analysis unit using the measured pressure of the detection device as a condition input, calculating the stress field of the hole forming inner wall, determining the plastic zone and the maximum principal stress direction, and when the actual calculation value , a potential slip surface position and range are identified in the model M, wherein, is a critical safety factor;

[0086] a hole collapse direction and probability prediction unit comprising a multi-factor weighted scoring model for evaluating a hole forming quality score S, wherein,

[0087] S = w 1 *S 几何缺陷 + w 2 *S 变形加速 +w 3 *S 应力突变

[0088] when S < 60, the quality of the counterbore is evaluated as qualified;

[0089] when 60≤S≤80, the quality of the counterbore is evaluated as rechecked;

[0090] When 80 < S ≤ 90, the quality of the counterbore is evaluated as a warning;

[0091] When S > 90, the quality of the counterbore is evaluated as dangerous;

[0092] wherein, w 1 , w 2 , w 3 are weight coefficients of the influence of the geometric defects, deformation acceleration and stress mutation on the quality of the hole forming, respectively; S 几何缺陷 is the score of the geometric defect evaluation dimension in the evaluation of the quality of the hole forming; S 变形加速 is the score of the deformation acceleration evaluation dimension in the evaluation of the quality of the hole forming; S 应力突变 is the score of the stress mutation evaluation dimension in the evaluation of the quality of the hole forming.

[0093] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Various modifications and changes can be made by those skilled in the art based on the principles and technical solutions of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An adaptive hole forming quality detection system, comprising a main controller, a laser radar module connected with the main controller for scanning hole wall to generate a three-dimensional point cloud model, a multi-frequency ultrasonic module for measuring hole diameter and hole wall crack, and a plurality of detection devices electrically connected with the main controller, characterized in that: the detection device comprises a plurality of intelligent modules (1) electrically connected with the main controller and axially rotatably inserted with each other, any of the intelligent modules (1) comprises a shell (11) with a plurality of arm joints (12) arranged in a circumferential array on the side wall, a collection and conversion module (14) for connecting at least one travel sensor (3) and a pressure sensor (4) is installed in the shell (11), an adaptive elongated arm mechanism is installed on the arm joint (12), a free end of the arm mechanism is provided with the travel sensor (3) in abutting contact with the hole wall, and any of the pressure sensors (4) is embeddedly installed on the hole wall. The collection and conversion module (14) comprises a local MCU (145) electrically connected with any of the travel sensor (3) and the pressure sensor (4), and a conductive conversion mechanism rotatably installed at both ends of the shell (11) for plugging with adjacent intelligent modules (1), the conductive conversion mechanism comprises a static conductive mechanism (144) fixedly connected with the shell (11) and a dynamic conductive mechanism (143) rotatably installed on the static conductive mechanism (144), and the static conductive mechanism (144) is electrically connected with the local MCU (145). A hole collapse direction and probability prediction unit comprises a multi-factor weighted scoring model for evaluating a hole quality score S, wherein, Further comprising a static anomaly detection unit, comprising a model M fitting a least square circle to each depth section data by collecting the data of the holes by the laser radar module, calculating the radial deviation of each measuring point from the model M at the corresponding depth , when , then identifying as a geometric defect area in the model M; wherein, is a preset radial deviation value; a dynamic trend analysis unit comprising a preset displacement change rate threshold value and a preset pressure change rate threshold value ; when then a deformation acceleration zone is identified in the model M; the time needed for the occurrence of a deformation acceleration zone When is greater than a predetermined threshold value, then the stress mutation region is identified in the model M; wherein, is the pressure change amount within the time The stress analysis unit calculates the stress field of the inner wall of the hole by using the pressure measured by the detection device as a condition input, determines the plastic zone and the direction of the maximum principal stress, and identifies the position and range of the potential slip surface in the model M when the actual calculation value is less than the critical safety factor . S = w When S < 60, the hole quality is evaluated as qualified; 1 *S 几何缺陷 + w 2 *S 变形加速 +w 3 *S 应力突变 When 60 < S < 80, the hole quality is evaluated as rechecked; When 80 < S < 90, the hole quality is evaluated as warning; When S > 90, the hole quality is evaluated as dangerous. The dynamic conductive mechanism (143) has a pin joint (142) electrically connected with the adjacent intelligent module (1), and a plurality of conductive tubes (1431) coaxially embedded in an insulating material and having different diameters, adjacent two conductive tubes (1431) are isolated by the insulating material, any pin of the pin joint (142) is electrically connected with a conductive tube (1431), and any conductive tube (1431) is electrically connected with the local MCU (145) through a conductive module pre-embedded in the static conductive mechanism (144) and corresponding to the conductive tube (1431). wherein, w 1 , w 2 , w 3 are the weight coefficients of the influence of the geometric defects, the deformation acceleration and the strain mutation on the pore-forming quality, respectively; S 几何缺陷 is the score of the geometric defect evaluation dimension in the evaluation of the pore-forming quality; S 变形加速 is the score of the deformation acceleration evaluation dimension in the evaluation of the pore-forming quality; S 应力突变 is the score of the stress mutation evaluation dimension in the evaluation of the pore-forming quality.

2. The self-adapting hole quality detection system of claim 1, wherein: The static conductive mechanism (144) is provided in a hollow ring structure, the conductive module is configured as any conductive body pre-embedded in the static conductive mechanism (144), one end of the conductive body is connected with the local MCU (145), the other end extends radially to form a conductive spring (1442) always in contact with the side wall of the corresponding conductive tube (1431), and the conductive springs (1442) are arranged in a circumferential array and connected with each other, and any conductive spring (1442) is always in contact with the corresponding conductive tube (1431).

3. A self-adapting hole quality detection system according to claim 2, characterized in that: ​ 4. The self-adapting hole quality detection system of claim 2, wherein: The static conductive mechanism (144) is arranged as a hollow ring structure, and a plurality of radial through holes (1441) are arranged on the side wall of the static conductive mechanism (144) in the radial direction. The conductive module is configured as a conductive assembly installed in the radial through hole (1441). The conductive assembly includes a brush head (1443) slidingly arranged in the radial through hole (1441) for contacting the outer side wall of the conductive pipe (1431), a plug (1445) for plugging the radial through hole (1441), and a spring (1444) arranged between the brush head (1443) and the plug (1445) and in a compressed state.

5. The self-adapting hole quality detection system of claim 2, wherein: The static conductive mechanism (144) is arranged as a hollow ring structure, and the conductive module adopts a double-conductive structure composed of a conductive spring assembly and a conductive brush assembly. The conductive spring is any conductive body pre-embedded in the static conductive mechanism (144). One end of the conductive body is connected to a local MCU (145), and the other end extends in the radial direction to form a conductive spring (1442) that is always in contact with the side wall of the corresponding conductive pipe (1431). The conductive springs (1442) are arranged in a circumferential array and are connected to each other. Any conductive spring (1442) is always in contact with the corresponding conductive pipe (1431). The lower end surface of any conductive pipe (1431) and the outer side wall adopt a planar or circular arc chamfer structure. The conductive brush assembly is a conductive assembly installed in a radial through hole (1441) arranged in the radial direction of the static conductive mechanism (144). The conductive assembly includes a brush head (1443) slidingly arranged in the radial through hole (1441) for contacting the outer side wall of the conductive pipe (1431), a plug (1445) for plugging the radial through hole (1441), and a spring (1444) arranged between the brush head (1443) and the plug (1445) and in a compressed state.

6. The self-adapting hole quality detection system of claim 1, wherein: The arm mechanism includes one or a plurality of module arms (21) connected to each other, and a telescopic tube (23) telescopically installed at the free end of the module arm (21). The travel sensor (3) is installed at the free end of the telescopic tube (23).

7. A self-adapting hole quality detection system according to claim 6, characterized in that: The module arm (21) is hollow and detachably connected by threads. The telescopic tube (23) is inserted into the adjacent module arm (21). A locking cap (22) is provided on the telescopic tube (23) to fix the telescopic tube (23) and the module arm (21) by thread connection.

8. A self-adapting hole quality detection system according to any one of claims 1-7, characterized in that: The conductive conversion mechanism arranged at both ends of the collection conversion module (14) is respectively provided with a female connector (141) and a male connector (146) which can be inserted into each other and are rotatably connected with the shell (11). The female connector (141) has a groove in the center for installing a pin connector (142). The male connector (146) has a boss which is plugged with the pin connector (142) and matches the groove.

9. The adaptive hole quality detection system of claim 8, wherein: The conductive conversion mechanism adopts a composite male and female joint structure, the female joint (141) extends axially along the shell (11) to form a large male joint higher than the end face of the shell (11), and the male joint (146) is embedded in the shell (11) to form a large female joint matched with the large male joint, and at least one magnetic ring (13) for auxiliary fixation is sleeved on the outer side wall of the shell (11).

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