A top structure of a high-performance measurement testing machine

Abstract

This invention provides a top structure for a high-performance measurement tester, including a load board with two sets of socket assemblies symmetrically arranged on it. Each set of socket assemblies has multiple signal connectors arranged around its perimeter. Each socket assembly includes multiple chip sockets. Below the load board, corresponding to the positions of the socket assemblies, a socket support plate, a rectifier plate, and an airtight box are arranged sequentially from top to bottom. The bottom of the airtight box has a through-hole. The bottom surface inside the airtight box has evenly distributed air intake channels, which communicate with the air intake. The rectifier plate has multiple through-holes for equalizing airflow. These air intake holes are located above and communicate with the air intake channels. The socket support plate has multiple first vent holes, which communicate with the space above the rectifier plate. The load board has multiple second vent holes, and each chip socket in the socket assembly has a third vent hole. When the socket assembly is installed on the load board, the second and third vent holes are connected in a one-to-one correspondence.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a top structure of a high-simultaneous-number testing machine. Background Technology

[0002] Final Test (FT) is the last testing step in the chip manufacturing process after packaging. It aims to verify that the chip's functionality, performance, and reliability fully meet design specifications, and is a crucial step in ensuring mass production quality. The number of chips tested simultaneously in a FT test is influenced by various factors. Taking common memory chips as an example, due to their relatively simple functions and regular testing patterns, a high number of chips can usually be tested simultaneously; some advanced testing equipment can achieve 64 or 128 chips tested at the same time.

[0003] Three-temperature testing is a chip testing method that verifies chip performance under different temperature environments. It evaluates the chip's stability in extreme environments by testing its functionality, performance, and reliability under three typical temperature conditions: high temperature, low temperature, and room temperature.

[0004] The traditional FT testing process can be summarized as follows: 1) The pressure arm 201 of the sorter 200 drives the suction head 202 to pick up chip 1 through the suction nozzle 203 and load it onto the chip socket 111 on the load board 110; 2) The test head 100 tests the chip 1 under test in the chip socket 111; 3) The sorter 200 sorts and unloads the chip 1 according to the feedback test results; 4) The first step is repeated for the next round of testing; for details, please refer to [link to relevant documentation]. Figure 1 .

[0005] In steps 1) and 3), the test machine 100 is in a non-testing waiting time. When there are many tests, the time required for steps 1) and 3) will be longer, which will greatly reduce UPH (Units Per Hour).

[0006] In addition, at high temperatures, the power consumption of chip 1 may increase significantly (e.g., dynamic power consumption increases with temperature), leading to increased chip heating and a risk of thermal runaway. Therefore, high-temperature testing requires heat dissipation for chip 1. At low temperatures, moisture will condense (low dew point), causing short circuits in the test spring pins or pads of chip socket 111. Therefore, low-temperature testing requires keeping the environment around chip 1 dry. The conventional approach is to circulate dry air inside the test machine 100 and blow it towards the bottom of the load board 4, which can have some heat dissipation effect. However, it is not very effective in preventing condensation on the pins of chip 1. The sorting machine 200 needs to blow dry air directly from above the load board 110. When performing large-scale measurements, it is difficult to ensure that the air is blown evenly onto each chip 1.

[0007] Therefore, there is a need to provide a top structure for a high-performance testing machine to solve the above problems. Summary of the Invention

[0008] The purpose of this invention is to provide a top structure for a high-simultaneous-number tester, which solves the problems of long waiting time and limited simultaneous-number in traditional FT testing, as well as poor heat dissipation at high temperatures, easy condensation at low temperatures, and difficulty in uniformly delivering dry air to each chip in three-temperature testing.

[0009] This invention provides a top structure for a high-performance measurement tester, comprising a load board with two sets of socket assemblies symmetrically arranged on the load board. The two sets of socket assemblies are spaced apart, and each set of socket assemblies has multiple signal connectors evenly arranged around its perimeter. Each socket assembly includes multiple chip sockets arranged in an array. Below the load board, corresponding to the positions of the socket assemblies, a socket support plate, a rectifier plate, and an airtight box are arranged sequentially from top to bottom. The airtight box is sealed to the load board.

[0010] The bottom of the airtight box is provided with a through air inlet; the bottom surface inside the airtight box is evenly provided with air intake channels, and the air intake channels are connected to the air inlet.

[0011] The rectifier plate is disposed inside the airtight box, and the rectifier plate is provided with a plurality of air equalization holes; the plurality of air equalization holes are evenly distributed and are disposed above the air intake channel and communicate with the air intake channel;

[0012] The socket support plate is disposed on the top of the airtight box, and a plurality of first vent holes are provided through the socket support plate, the first vent holes being connected to the space above the rectifier plate;

[0013] The load board has a plurality of second vent holes through the socket assembly corresponding to the position of the socket assembly. Each chip socket of the socket assembly has a third vent hole through the socket assembly. When the socket assembly is installed on the load board, the second vent holes and the third vent holes are connected in a one-to-one correspondence.

[0014] During testing, high-flow-rate compressed dry air enters the airtight box through the air inlet, reduces its flow rate through the air intake channel, and becomes stable low-flow-rate dry air after entering the rectifier plate through the air distribution hole. The stable low-flow-rate dry air then enters the chip socket sequentially through the first vent, the second vent, and the third vent.

[0015] Preferably, the chip socket is provided with a test spring pin, the top of the test spring pin is connected to the chip, and the space where the top of the test spring pin is located is connected to the third vent hole. During low temperature testing, stable low-flow-rate dry air dries the test spring pin and the pins of the chip. During high temperature testing, stable low-flow-rate dry air dissipates heat from the chip.

[0016] Preferably, the air intake channel is provided with a mounting hole corresponding to the air distribution hole, the mounting hole is connected to the air intake channel, and a sound-absorbing plate is provided in the mounting hole, which reduces the flow velocity of the air while absorbing noise.

[0017] Preferably, the top of the socket support plate is further provided with a vent groove, which is connected to the first vent hole. When the socket support plate is installed on the load plate, the vent groove is connected to the second vent hole.

[0018] Preferably, the top of the rectifier plate is provided with a partition rib, which uniformly divides the top space of the rectifier plate into independent compartments.

[0019] Preferably, a load board support is provided below the load board; the load board support is hollowed out corresponding to the socket assembly and the signal connector; the signal connector is connected from the bottom of the load board to the load board and fixed to the load board support; the airtight box is sealed to the load board support.

[0020] Preferably, a sealing groove is provided on the top of the four edges of the airtight box, and a sealing ring is provided in the sealing groove. The airtight box is sealed to the load plate support through the sealing ring.

[0021] Preferably, the socket support plate is provided with mounting threaded holes, and the socket support plate is installed to the load plate by screws screwed into the mounting threaded holes.

[0022] Preferably, each group of the socket assembly has 512 chip sockets arranged in an array of 32 rows and 16 columns.

[0023] Preferably, the two sets of socket assemblies are arranged symmetrically on the load board.

[0024] Compared with the prior art, the technical solution of the embodiments of the present invention has at least the following beneficial effects:

[0025] The high-similarity tester top structure provided by this invention features two sets of socket assemblies symmetrically arranged on the load plate. This allows the sorting machine to load or unload the other set of socket assemblies while the tester is testing the chips in one set of socket assemblies. This optimizes the traditional sequential process into a parallel process of testing and loading / unloading. Especially when the testing time and loading / unloading time are roughly equal, the rhythm matching is optimal. In this case, the tester has no waiting time, achieving high-similarity test FT and improving testing efficiency. During the three-temperature test, the design of components such as the airtight box and rectifier plate gradually transforms the high-flow-rate compressed dry air into a stable low-flow-rate airflow, which is then evenly blown onto the chip and test spring pins through the vents of each component. This effectively solves the heat dissipation problem in high-temperature testing and the condensation problem in low-temperature testing, ensuring the effectiveness of the three-temperature test.

[0026] Furthermore, a sound-absorbing plate is installed at the air distribution hole connecting the rectifier plate in the airtight box to reduce noise and further reduce airflow velocity.

[0027] Furthermore, a partition rib is provided on the top of the fairing, which evenly divides the top space of the fairing into independent compartments, making the air flowing out of the fairing more uniform. Attached Figure Description

[0028] Figure 1 This is a partial cross-sectional view of the top structure of the high-performance measurement machine in an embodiment of the present invention;

[0029] Figure 2 This is a schematic diagram of the load board mounting socket assembly and signal connector in an embodiment of the present invention;

[0030] Figure 3 This is a schematic diagram of the structure of the airtight box in an embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of the structure of the airtight box and the rectifier plate in an embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram of the cooperative structure of the airtight box, rectifier plate, and socket support plate in an embodiment of the present invention;

[0033] Figure 6 This is a partial enlarged view of the chip socket and load board in an embodiment of the present invention.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1-Chip;

[0036] 2-Socket assembly; 21-Chip socket; 211-Third vent; 212-Test spring pin;

[0037] 3-Signal connector;

[0038] 4-Load plate; 41-Second vent;

[0039] 5-Socket support plate; 51-First vent hole; 52-Ventilation groove; 53-Mounting threaded hole;

[0040] 6-Rectifier plate; 61-Air distribution vent; 62-Separating rib;

[0041] 7-Airtight box; 71-Air inlet; 72-Air inlet channel; 73-Silencer; 74-Sealing groove;

[0042] 8-Load board bracket;

[0043] 100-Testing machine; 110-Load board; 111-Chip socket; 200-Sorter; 201-Pressure arm; 202-Suction head; 203-Suction nozzle. Detailed Implementation

[0044] To make the objectives, features, and beneficial effects of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described below are merely for explaining the present invention and are not intended to limit the present invention. Furthermore, the same or similar reference numerals may be used in the drawings to refer to the same or similar elements in different embodiments, and descriptions of the same or similar elements in different embodiments, as well as descriptions of prior art elements, features, effects, etc., may be omitted.

[0045] The purpose of this invention is to provide a top structure for a high-simultaneous-number tester, which solves the problems of long waiting time and limited simultaneous-number in traditional FT testing, as well as poor heat dissipation at high temperatures, easy condensation at low temperatures, and difficulty in uniformly delivering dry air to each chip in three-temperature testing.

[0046] Figure 1 This is a partial cross-sectional view of the top structure of the high-performance measurement machine in an embodiment of the present invention; Figure 2 This is a schematic diagram of the load board mounting socket assembly and signal connector in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the airtight box in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the airtight box and the rectifier plate in an embodiment of the present invention; Figure 5 This is a schematic diagram of the cooperative structure of the airtight box, rectifier plate, and socket support plate in an embodiment of the present invention; Figure 6 This is a partial enlarged view of the chip socket and load board in an embodiment of the present invention.

[0047] Now see Figures 1 to 6The present invention provides a top structure for a high-performance measurement tester, comprising a load plate 4, on which two sets of socket assemblies 2 are symmetrically arranged; the two sets of socket assemblies 2 are spaced apart, and each set of socket assemblies 2 has multiple signal connectors 3 evenly arranged around its perimeter; each socket assembly 2 includes multiple chip sockets 21 arranged in an array; below the load plate 4, corresponding to the position of the socket assembly 2, a socket support plate 5, a rectifier plate 6, and an airtight box 7 are arranged sequentially from top to bottom; the airtight box 7 is sealed to the load plate 4.

[0048] The bottom of the airtight box 7 is provided with a through air inlet 71; the bottom surface inside the airtight box 7 is provided with air intake channels 72 evenly arranged, and the air intake channels 72 are connected to the air inlet 71.

[0049] The rectifier plate 6 is installed inside the airtight box 7, and the rectifier plate 6 is provided with multiple air distribution holes 61; the multiple air distribution holes 61 are evenly distributed and are located above the air intake channel 72 and connected to the air intake channel 72.

[0050] The socket support plate 5 is located on the top of the airtight box 7. Multiple first vent holes 51 are provided through the socket support plate 5. The first vent holes 51 are connected to the space above the rectifier plate 6.

[0051] Multiple second vent holes 41 are provided on the load board 4 corresponding to the position of the socket assembly 2. Each chip socket 21 of the socket assembly 2 is provided with a third vent hole 211. When the socket assembly 2 is installed on the load board 4, the second vent holes 41 and the third vent holes 211 are connected in a one-to-one correspondence.

[0052] During testing, high-flow-rate compressed dry air enters the airtight box 7 through the air inlet 71, reduces its flow rate through the air intake channel 72, and enters the rectifier plate 6 through the air equalization hole 61, becoming stable low-flow-rate dry air. The stable low-flow-rate dry air enters the chip socket 21 through the first vent 51, the second vent 41 and the third vent 211 in sequence.

[0053] In some embodiments, a test spring pin 212 is provided in the chip socket 21. The top end of the test spring pin 212 is connected to the chip 1. The space where the top end of the test spring pin 212 is located is connected to the third vent 211. During low-temperature testing, stable low-flow-rate dry air dries the pins of the test spring pin 212 and the chip 1. During high-temperature testing, stable low-flow-rate dry air dissipates heat from the chip 1.

[0054] In some embodiments, the air intake channel 72 is provided with an installation hole corresponding to the air distribution hole 61. The installation hole is connected to the air intake channel 72, and a sound-absorbing plate 73 is provided in the installation hole. The sound-absorbing plate 73 reduces the flow rate of the air while absorbing noise.

[0055] In some embodiments, the top of the socket support plate 5 is also provided with a vent groove 52, which is connected to the first vent hole 51. When the socket support plate 5 is installed on the load plate 4, the vent groove 52 is connected to the second vent hole 41.

[0056] In some embodiments, a partition 62 is provided on the top of the rectifier 6, which divides the top space of the rectifier 6 into independent compartments, making the air flowing out of the rectifier 6 more uniform.

[0057] In some embodiments, a load board support 8 is provided below the load board 4; the load board support 8 is hollowed out corresponding to the socket assembly 2 and the signal connector 3; the signal connector 3 is connected from the bottom of the load board 4 to the load board 4 and fixed to the load board support 8; the airtight box 7 is sealed to the load board support 8.

[0058] In some embodiments, a sealing groove 74 is provided on the top of the four edges of the airtight box 7, and a sealing ring (not shown) is provided in the sealing groove 74. The airtight box 7 is sealed to the load plate support 8 through the sealing ring.

[0059] In some embodiments, the socket support plate 5 is provided with a mounting threaded hole 53, and the socket support plate 5 is mounted to the load plate 4 by screws screwed into the mounting threaded hole 53.

[0060] In some embodiments, each socket assembly 2 has 512 chip sockets 21 arranged in an array of 32 rows and 16 columns.

[0061] In some embodiments, two sets of socket assemblies 2 are symmetrically deployed on the load board 4.

[0062] The top structure of the high-performance measurement tester provided by this invention includes the following steps in its specific implementation:

[0063] While the testing machine 100 tests the chip 1 in the first set of socket assemblies 2, the sorting machine 200 feeds the second set of socket assemblies 2.

[0064] After the testing machine 100 completes the test on the chip 1 in the first set of socket assemblies 2, it switches to test the chip 1 in the second set of socket assemblies 2. At this time, the sorting machine 200 performs the unloading action on the chip 1 in the first set of socket assemblies 2.

[0065] Repeat the above steps to achieve parallel operation of the testing process of the testing machine 100 and the loading and unloading process of the sorting machine 200.

[0066] During the three-temperature test, compressed dry air is introduced through the airtight box 7, the flow rate is reduced through the air intake channel 72, and after entering the rectifier plate 6 through the air equalization hole 61, it becomes stable low-flow dry air. The stable low-flow dry air enters the chip socket 21 through the first vent 51, the vent groove 52, the second vent 41 and the third vent 211 in sequence, and blows onto the chip 1 and the test spring pin 212, achieving cooling during high-temperature testing and preventing condensation during low-temperature testing.

[0067] In summary, the top structure of the high-similarity measurement tester provided by this invention symmetrically arranges two sets of socket components 2 on the load plate 4. This allows the sorting machine 200 to load or unload the other set of socket components 2 while the tester 100 is testing the chip 1 of one set of socket components 2. This optimizes the traditional sequential process into a parallel process of testing and loading / unloading. Especially when the testing time and loading / unloading time are similar, the rhythm matching is optimal. At this time, the tester 100 has no waiting time, achieving high-similarity measurement FT and improving testing efficiency. During the three-temperature test, the design of components such as the airtight box 7 and the rectifier plate 6 gradually transforms the high-flow-rate compressed dry air into a stable low-flow-rate airflow, which can be evenly blown onto the chip 1 and the test spring pin 212 through the vents of each component. This effectively solves the heat dissipation problem of high-temperature testing and the condensation problem of low-temperature testing, ensuring the effectiveness of the three-temperature test.

[0068] Furthermore, a sound-absorbing plate 73 is installed at the air distribution hole 61 of the rectifier plate 6 in the airtight box 7 to further reduce the air velocity while achieving sound absorption.

[0069] Furthermore, a partition 62 is provided on the top of the rectifier 6, which divides the top space of the rectifier 6 into independent compartments, making the air flowing out of the rectifier 6 more uniform.

[0070] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the invention, even when only a single embodiment is described with respect to a particular feature. The feature examples provided in this disclosure are intended to be illustrative and not limiting, unless otherwise stated. In practice, one or more technical features of the dependent claims may be combined with the technical features of the independent claims as needed and where technically feasible, and may be derived from the technical features of the respective independent claims in any suitable manner rather than solely by the specific combinations listed in the claims.

[0071] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A high homodyne test set-top structure, characterized by, The load board is provided with two groups of socket assemblies symmetrically arranged thereon; the two groups of socket assemblies are arranged at intervals, and each group of socket assemblies is uniformly provided with a plurality of signal connectors around the socket assemblies; the socket assembly comprises a plurality of chip sockets arranged in an array; a socket support plate, a rectifier plate and an airtight box are sequentially arranged below the load board in correspondence with the positions of the socket assemblies; the airtight box is sealingly connected with the load board; The airtight box is provided with a gas inlet penetrating the bottom thereof; the bottom surface of the airtight box is uniformly provided with gas inlet flow channels in communication with the gas inlet; The rectifier plate is arranged in the airtight box, and the rectifier plate is provided with a plurality of uniform gas holes penetrating the rectifier plate; the uniform gas holes are uniformly distributed and arranged above the gas inlet flow channels and in communication with the gas inlet flow channels; The socket support plate is arranged on the top of the airtight box, and the socket support plate is provided with a plurality of first air holes penetrating the socket support plate, which are in communication with the space above the rectifier plate; The load board is provided with a plurality of second air holes penetrating the load board in correspondence with the positions of the socket assemblies; each chip socket of the socket assembly is provided with a third air hole penetrating the chip socket; when the socket assembly is mounted on the load board, the second air holes and the third air holes are in one-to-one correspondence and communication; During testing, high-flow-rate compressed dry air enters the airtight box from the gas inlet, the flow rate is reduced through the gas inlet flow channels, and the dry air becomes stable low-flow-rate dry air after passing through the uniform gas holes of the rectifier plate; the stable low-flow-rate dry air enters the chip socket through the first air holes, the second air holes and the third air holes in sequence.

2. The high goniometer test top structure of claim 1, wherein, The chip socket is provided with a test spring needle, the top end of the test spring needle is connected with a chip, and the space where the top end of the test spring needle is located is in communication with the third air hole; during low-temperature testing, the stable low-flow-rate dry air dries the test spring needle and the pins of the chip; during high-temperature testing, the stable low-flow-rate dry air cools the chip.

3. The high g-meter test machine top structure of claim 1, wherein, The gas inlet flow channels are provided with mounting holes in correspondence with the uniform gas holes, the mounting holes are in communication with the gas inlet flow channels, and the mounting holes are provided with sound-absorbing sheets, which absorb sound and reduce the flow rate of the air flowing therethrough.

4. The high g-meter test machine top structure of claim 1, wherein, The socket support plate is further provided with a ventilation groove on the top thereof, the ventilation groove is in communication with the first air holes, and the ventilation groove is in communication with the second air holes when the socket support plate is mounted on the load board.

5. The high g-number test set-top structure of claim 1, wherein, The top of the rectifier plate is provided with a partition rib, which uniformly divides the space on the top of the rectifier plate into independent cabins.

6. The high g-number test set-top structure of claim 1, wherein, The load board is provided with a load board support below; the load board support is hollowed out in correspondence with the socket assemblies and the signal connectors; the signal connectors are connected to the load board from the bottom of the load board and fixed to the load board support; the airtight box is sealingly connected with the load board support.

7. The high homologous number test set top structure of claim 6, wherein, The top of the periphery of the airtight box is provided with a sealing groove, the sealing groove is provided with a sealing ring, and the airtight box is sealingly connected with the load board support through the sealing ring.

8. The high g-number test set-top structure of claim 1, wherein, The socket support plate is provided with mounting threaded holes, and the socket support plate is mounted to the load board through screws screwed into the mounting threaded holes.

9. The high g-number test set-top structure of claim 1, wherein, The number of the chip sockets of each group of the socket assemblies is 512, and the chip sockets are arranged in an array of 32 rows and 16 columns.

10. The high g-number test set-top structure of claim 1, wherein, The two groups of the socket assemblies are disposed symmetrically left and right on the load board.

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