Clamp for wafer aging test

Abstract

The invention relates to the technical field of wafer testing, and particularly provides a clamp for wafer aging test, which comprises a PCB (printed circuit board), the PCB is fixedly arranged below an upper cover plate, a fixer fixes a probe card below the PCB, the PCB covers a lower cover plate, and the fixer and the probe card are both positioned in a test cavity. The inner ring of the fixator protrudes inwards in the radial direction to form an annular bearing platform, the multiple positioning columns are installed on the surface of the bearing platform in an array mode in the circumferential direction, multiple positioning holes are formed in the edge of the probe card in the axial direction, each positioning column corresponds to one positioning hole in position, the positioning columns are embedded into the positioning holes, and the probe card is fixed to the bearing platform. A plurality of abutting columns with adjustable resilience force are elastically arranged on the side face of each positioning column in the circumferential direction, the tail ends of the abutting columns abut against the inner surfaces of the positioning holes, and the abutting columns can elastically move in the radial direction of the positioning columns. According to the invention, the problem of poor contact effect between the probe and the contact caused by deformation of the probe card due to a high-temperature atmosphere during an aging test can be avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and in particular to a fixture for wafer aging testing. Background Art

[0002] With the continuous advancement of semiconductor manufacturing technology, wafer-level burn-in testing has become a critical step in ensuring semiconductor product quality. During wafer burn-in testing, fixture design is crucial. It not only needs to precisely secure and support the wafer but also adapt to thermal expansion to ensure accurate contact between the probes and the wafer surface contacts during testing. Because temperature changes can cause thermal expansion of materials, the fixing method for the probe card and fixture must be able to effectively address this issue to prevent poor contact caused by uneven expansion, which can affect test results.

[0003] At present, most common wafer aging test fixtures use positioning posts and positioning slots to fix the probe card. Although this design can achieve stable positioning of the probe card to a certain extent, it has the following shortcomings: the expansion of the probe card when heated is usually not uniform, and traditional positioning posts and positioning slots cannot be adaptively adjusted. Therefore, it may cause local warping of the probe card and horizontal position shifting. This local warping and shifting problem will not only affect the positioning accuracy, but also reduce the reliability of the test.

[0004] Therefore, how to provide a fixture design that can adapt to thermal expansion non-uniformity and ensure accurate contact between probes and contacts during wafer aging testing has become an important challenge in current technology. Summary of the Invention

[0005] In view of this, the present invention proposes a fixture for wafer aging testing that can improve reliability and accuracy.

[0006] The technical solution of the present invention is implemented as follows: The present invention provides a fixture for wafer aging testing, which includes: an upper cover plate, a lower cover plate, a PCB board, a probe card and a fixture. The top of the lower cover plate is provided with a test cavity, the PCB board is fixedly arranged below the upper cover plate, the fixture fixes the probe card below the PCB board, the PCB board cover is arranged above the lower cover plate and the fixture and the probe card are both located in the test cavity, and also includes a positioning column, the fixture is annular, the inner ring of the fixture protrudes radially inward to form an annular bearing platform, a plurality of positioning columns are installed on the surface of the bearing platform along a circumferential array, the edge of the probe card is provided with a plurality of positioning holes along the axial direction, each positioning column corresponds to the position of a positioning hole, the positioning column is embedded in the positioning hole, and the side surface of each positioning column is elastically provided with a plurality of supporting columns with adjustable rebound force along the circumferential direction, the end of the supporting column is supported on the inner surface of the positioning hole, and the supporting column can be elastically moved along the radial direction of the positioning column.

[0007] In the above embodiment, the positioning post is embedded in the positioning hole of the probe card, the diameter of the positioning hole is larger than the diameter of the positioning post, and the abutting post protrudes from the side of the positioning post. The positioning post abuts the inner surface of the positioning hole through multiple elastically movable abutting posts, ensuring the precise horizontal positioning of the probe card. Through the elastic force adjustment structure, the uneven displacement of the probe card caused by thermal expansion during high-temperature testing is dynamically compensated to ensure stable contact between the probe and the chip contact during the test. The elastic force of the abutting post is set in an adjustable manner, which can make the elastic force of the abutting post at the target position higher or lower. Therefore, when responding to the uneven displacement of thermal expansion, the corresponding abutting post can be displaced more or less, thereby allowing the probe card to maintain the stability of the overall position and avoiding large offsets between the probe and the contact.

[0008] The positioning column, supporting column and elastic adjustment structure adopt modular design, which is easy to disassemble, maintain and replace, thereby improving the service life and maintenance efficiency of the fixture.

[0009] In some embodiments, the positioning column also includes an elastic adjustment structure, and a plurality of accommodating cavities are provided on the inner side of the positioning column along the circumferential direction. Each accommodating cavity is connected to the side of the positioning column through a limiting hole. A supporting column is embedded in each limiting hole. The supporting column is located in a short part of the accommodating cavity and has a larger diameter than the limiting hole, so that the supporting column can be limited to prevent the supporting column from escaping from the accommodating cavity. The elastic adjustment structure is accommodated in the accommodating cavity, and the elastic adjustment structure elastically drives the supporting column to reciprocate along its own axis in the limiting hole, and the elastic driving force is adjustable.

[0010] In some embodiments, the elastic force adjustment structure includes: an arc-shaped spring piece, a cylindrical cam and a driving member. The arc-shaped spring piece is arranged in the accommodating cavity and the convex surface of the arc-shaped spring piece is abutted against one end of the abutting column close to the accommodating cavity. One end of the arc-shaped spring piece along the circumference of the arc surface is abutted against the top of the accommodating cavity, and the other end is abutted against the circumferential surface of the cylindrical cam. The driving member can be used to drive the cylindrical cam to rotate around the axis.

[0011] In the above embodiment, the coordinated design of the arc-shaped spring piece and the cylindrical cam ensures that the elastic force adjustment process of the supporting column is stable and reliable. During the rotation of the cylindrical cam, the arc-shaped spring piece can be squeezed to different degrees. According to the degree of squeezing, the rebound force of the arc-shaped spring piece itself is changed. Different rebound forces can make the supporting column have different displacements under the same external pressure.

[0012] In some embodiments, the driving member includes: a rotating rod, a limiting disk, a positioning pin and a tightening spring. The surface of the positioning column is provided with an axial hole, and a plurality of positioning protrusions are circumferentially provided at one end of the axial hole close to the surface of the positioning column. A positioning groove is formed between two adjacent positioning protrusions. The rotating rod is coaxially slidingly arranged in the axial hole, and a limiting disk is coaxially fixed at one end of the rotating rod close to the surface of the positioning column. A positioning pin is protrudingly provided on the surface of the limiting disk. The limiting disk and the surface of the positioning column are elastically connected by a tightening spring. The tightening spring drives the limiting disk to press against a side of the positioning protrusion close to the positioning column. The positioning pin is selectively engaged in one of the positioning grooves. The compression of the tightening spring can drive the positioning pin to disengage from the positioning groove. After the tightening spring is compressed, the rotating rod can rotate relative to the axial hole.

[0013] The combination of the rotating rod, limit plate, positioning pin and tightening spring makes the rotation adjustment of the cylindrical cam simple and convenient. The user can quickly adjust the elastic force of the supporting column by compressing the tightening spring and rotating the rotating rod. After the adjustment is completed, the compression force on the compression spring is released, and the compression spring elastically resets, and the positioning pin is embedded in the positioning groove again, thereby achieving angle locking of the rotating rod.

[0014] In some embodiments, the positioning column is threadedly mounted on the surface of the supporting platform.

[0015] In some embodiments, an elastic washer is further included, and the elastic washer is clamped between the positioning column and the supporting platform.

[0016] In the above embodiment, the positioning column is mounted on the support platform surface via a threaded connection and combined with an elastic washer, further enhancing the stability and vibration resistance of the positioning column. The elastic washer also allows for horizontal angle adjustment of the positioning column. This angle adjustment can change the orientation of the support column with different abutment columns, thereby achieving more precise displacement adjustment.

[0017] In some embodiments, a sealing ring is further included. An annular mounting groove is provided on the upper surface of the lower cover plate along the circumference of the opening of the test cavity, and the sealing ring is embedded in the annular mounting groove.

[0018] In some embodiments, a buffer cavity is formed on the bottom surface of the upper cover plate, and a vent hole is formed on the surface of the PCB board, and the buffer cavity is connected to the test cavity through the vent hole.

[0019] The buffer chamber on the bottom of the upper cover communicates with the test chamber. Vents regulate the air pressure within the test chamber, minimizing the effects of thermal expansion on the fixture structure. A sealing ring embedded in the annular mounting groove on the lower cover ensures the test chamber's tightness, preventing the ingress of external contaminants while also accommodating harsh testing environments such as high temperature and high pressure. The vents regulate the air pressure within the test chamber, minimizing the effects of thermal expansion on the fixture structure and improving its environmental adaptability.

[0020] In some embodiments, the buffer cavity has the same diameter as the test cavity.

[0021] The present invention has the following beneficial effects compared to the prior art: This invention significantly improves the positioning accuracy, reliability, and environmental adaptability of the wafer burn-in test fixture through its innovative design of positioning posts, support posts, and spring-force adjustment structures. Its spring-force adjustment mechanism effectively compensates for uneven displacement caused by thermal expansion, ensuring precise alignment of the probes and chip contacts. Furthermore, its modular design and convenient operation further enhance the fixture's practicality and maintenance efficiency. This solution is suitable for harsh testing environments such as high temperature and high pressure, and has broad application prospects and promotional value. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 This is an axonometric diagram of a fixture for wafer aging testing according to the present invention; Figure 2 An exploded view of a fixture for wafer aging testing according to the present invention; Figure 3 An exploded view of the fixture for wafer aging test according to the present invention from another perspective; Figure 4 is a side sectional view of a fixture for wafer aging test according to the present invention; Figure 5 for Figure 4 A partial enlarged view of part A; Figure 6 This is an axonometric diagram of a positioning column in a fixture for wafer aging testing according to the present invention; Figure 7 An exploded view of a positioning column in a fixture for wafer aging testing according to the present invention; Figure 8 A half-section isometric view of a positioning column in a fixture for wafer aging testing according to the present invention; Figure 9 This is an axonometric view of a driving component in a fixture for wafer aging testing according to the present invention.

[0024] In the figure: 1-upper cover, 2-lower cover, 3-PCB board, 4-probe card, 5-fixture, 6-positioning column, 7-elastic gasket, 10-sealing ring, 11-buffer chamber, 21-test chamber, 22-annular mounting groove, 41-positioning hole, 51-annular bearing platform, 61-holding column, 62-elastic force adjustment structure, 621-arc-shaped spring, 622-cylindrical cam, 623-driving member, 6231-rotating rod, 6232-limiting plate, 6233-positioning pin, 6234-tightening spring, 63-accommodating chamber, 631-limiting hole, 64-axis hole, 65-positioning protrusion, 66-positioning groove. DETAILED DESCRIPTION

[0025] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0027] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of the present invention belong. If the definitions set forth in this section are contrary to or otherwise inconsistent with definitions set forth in the patents, patent applications, published patent applications, and other publications incorporated herein by reference, the definitions listed in this section take precedence over the definitions incorporated herein by reference.

[0029] like Figure 1 As shown, combined Figure 2-9The fixture for wafer aging test of the present invention comprises: an upper cover plate 1, a lower cover plate 2, a PCB board 3, a probe card 4 and a holder 5. A test cavity 21 is opened on the top of the lower cover plate 2. The PCB board 3 is fixedly arranged below the upper cover plate 1. The holder 5 fixes the probe card 4 below the PCB board 3. The PCB board 3 is covered above the lower cover plate 2 and the holder 5 and the probe card 4 are both located in the test cavity 21. The fixture further comprises a positioning column 6. The holder 5 is annular. The inner ring of the holder 5 is along the diameter An annular supporting platform 51 is formed by protruding inward, and a plurality of positioning posts are installed in a circumferential array on the surface of the supporting platform 51. A plurality of positioning holes 41 are opened axially on the edge of the probe card 4. Each positioning post 6 corresponds to the position of a positioning hole 41. The positioning post 6 is embedded in the positioning hole 41. The side surface of each positioning post 6 is elastically provided with a plurality of supporting posts 61 with adjustable rebound force along the circumferential direction. The end of the supporting post 61 is supported on the inner surface of the positioning hole, and the supporting post 61 can elastically move along the radial direction of the positioning post 6.

[0030] The test chamber 21, defined at the top of the lower cover 2, accommodates the probe card 4 and the holder 5. The upper and lower cover 1 are connected by a fixing structure (such as bolts or clips) to form a closed test environment. The PCB 3 is secured beneath the upper cover 1, and the probe card 4 is secured beneath the PCB 3 by the holder 5, ensuring stable contact between the probe card 4 and the wafer. Positioning holes 41 defined on the edge of the probe card 4 correspond to positioning posts 6 on the support platform 51 of the holder 5. The positioning posts 6 engage within the positioning holes 41, ensuring precise alignment of the probe card 4. Each positioning post 6 is circumferentially arranged with a plurality of abutting posts 61, the ends of which abut against the inner surface of the positioning hole 41. The elastic force of the abutting posts 61 is adjustable via a spring-force adjustment mechanism, dynamically compensating for uneven displacement of the probe card 4 due to thermal expansion or installation errors. A sealing ring is embedded within the annular mounting groove on the top surface of the lower cover 2 to ensure the seal of the test chamber 21 and prevent the ingress of external contaminants. The buffer cavity on the bottom surface of the upper cover plate 1 communicates with the test cavity 21 via a vent, regulating the air pressure within the test cavity 21 and reducing the effects of thermal expansion on the fixture structure. Multiple abutment posts 61 uniformly support the inner surface of the positioning hole 41, ensuring precise horizontal positioning of the probe card 4. A spring-loaded adjustment structure dynamically compensates for uneven displacement of the probe card 4 caused by thermal expansion during high-temperature testing, ensuring stable contact between the probe and chip contacts during testing.

[0031] In some embodiments, the positioning column 6 also includes an elastic force adjustment structure 62. A plurality of accommodating cavities 63 are provided on the inner side of the positioning column 6 along the circumferential direction. Each accommodating cavity 63 is connected to the side of the positioning column 6 through a limiting hole 631. A supporting column 61 is embedded in each limiting hole 631. The elastic force adjustment structure 62 is accommodated in the accommodating cavity 63. The elastic force adjustment structure 62 elastically drives the supporting column 61 to reciprocate along its own axis and the elastic force is adjustable.

[0032] In the structural scheme of the above embodiment, a plurality of accommodating cavities 63 are provided on the inner side of the positioning post 6 along the circumferential direction, and each accommodating cavity is connected to the side surface of the positioning post 6 through a limiting hole 631. The limiting hole 631 is used to embed the supporting post 61 and limit its movement direction (only reciprocating along its own axis). During high-temperature testing, the probe card 4 tends to move horizontally due to thermal expansion. By adjusting the elastic force of the supporting posts 61 in different directions, the stress in the displacement direction can be actively offset to keep the probe card 4 aligned. If the positioning hole 41 of the probe card 4 is slightly misaligned with the positioning post 6 due to installation deviation, the elastic support of the supporting post 61 can achieve fine-tuning of the positioning of the probe card 4 by adaptively adjusting the elastic force.

[0033] In some embodiments, the elastic force adjustment structure 62 includes: an arc-shaped spring piece 621, a cylindrical cam 622 and a driving member 623. The arc-shaped spring piece 621 is arranged in the accommodating cavity 63 and the convex surface of the arc-shaped spring piece 621 is abutted against one end of the abutting column 61 close to the accommodating cavity 63. One end of the arc-shaped spring piece 621 along the circumference of the arc surface is abutted against the top of the accommodating cavity 63, and the other end is abutted against the circumferential surface of the cylindrical cam 622. The driving member 623 can be used to drive the cylindrical cam 622 to rotate around the axis.

[0034] In the above embodiment, the curved spring piece 621 is used to provide elastic support for the abutment post 61. The axis of the cylindrical cam 622 is perpendicular to the axis of the curved spring piece. When the cylindrical cam 622 rotates, the degree of compression on the end of the curved spring piece 621 can be changed, thereby changing the elastic force exerted by the curved spring piece 621 on the surface of the abutment post 61. This changing elastic force causes the amount of elastic deformation of the abutment post 61 to vary when it comes into contact with the inner wall of the positioning hole 41, thereby adjusting the position of the probe card 4 relative to the positioning post 6. Therefore, by adjusting the rotation amount of the cylindrical cam 622, the adaptive adjustment distance can be changed to cope with different amounts of thermal deformation.

[0035] In some embodiments, the driving member 623 includes: a rotating rod 6231, a limiting plate 6232, a positioning pin 6233 and a tightening spring 6234. The surface of the positioning column 6 is provided with an axial hole 64. The end of the axial hole 64 close to the surface of the positioning column 6 is provided with a plurality of positioning protrusions 65 along the circumferential direction. A positioning groove 66 is formed between two adjacent positioning protrusions 65. The rotating rod 6231 is coaxially slidably arranged in the axial hole 64. The end of the rotating rod 6231 close to the surface of the positioning column 6 is coaxially fixed with the limiting plate 6 232, a positioning pin 6233 is protrudingly provided on the surface of the limit plate 6232, and the limit plate 6232 and the surface of the positioning column 6 are elastically connected by a tightening spring 6234. The tightening spring 6234 drives the limit plate 6232 to press against the side of the positioning protrusion 65 close to the positioning column 6, and the positioning pin 6233 is selectively engaged in one of the positioning grooves 66. The compression of the tightening spring 6234 can drive the positioning pin 6233 to disengage from the positioning groove 66, and the rotating rod 6231 can rotate relative to the shaft hole 64.

[0036] In the above embodiment, in order to realize the rotational drive of the cylindrical cam 622, the matching structure of the positioning pin 6233 and the positioning groove 66 is used to lock the rotation angle of the limit plate 6232, and the tightening spring 6234 is used to tighten the limit plate 6232 so that the limit plate 6232 can maintain the angle locked when it is not subjected to other external forces. When adjustment is required, the limit plate 6232 is driven by pressure to press the tightening spring 6234, so that the positioning pin 6233 is disengaged from the positioning groove 66. At this time, the limit plate 6232 can be rotated, thereby driving the cylindrical cam 622 to rotate, thereby realizing compression or release of the arc-shaped spring piece 621 to adjust the elastic force on the supporting column 61.

[0037] In some embodiments, the positioning column 6 is threadedly installed on the surface of the supporting platform 51 .

[0038] In the above embodiments, the positioning column 6 adopts a modular structure, and the threaded connection can realize installation, disassembly and replacement.

[0039] In some embodiments, an elastic washer 7 is further included, and the elastic washer 7 is clamped between the positioning column 6 and the supporting platform 51 .

[0040] In the above embodiment, the elastic washer 7 can tighten the positioning column 6 to improve the installation stability. At the same time, the elastic washer 7 allows the positioning column 6 to rotate around its axis, thereby adjusting the direction of different supporting columns 61. By adjusting the direction of the supporting columns 61, different thermal expansion dimensions can be adapted and adjusted.

[0041] In some embodiments, a sealing ring 10 is further included. An annular mounting groove 22 is provided on the upper surface of the lower cover plate 2 along the circumference of the opening of the test cavity 21 , and the sealing ring 10 is embedded in the annular mounting groove 22 .

[0042] In the above embodiments, the sealing ring 10 is used to improve the sealing effect between the test cavity 21 and the PCB board.

[0043] In some embodiments, a buffer cavity 11 is formed on the bottom surface of the upper cover 1 , and a vent hole is formed on the surface of the PCB board 3 . The buffer cavity 11 is connected to the test cavity 21 through the vent hole.

[0044] In the above embodiments, the buffer cavity 11 is used to balance the pressure in the upper and lower spaces of the PCB board to prevent deformation of the PCB board caused by the pressure difference.

[0045] In some embodiments, the diameters of the buffer cavity 11 and the test cavity 21 are the same.

[0046] In the above embodiments, the buffer cavity 11 and the test cavity 21 having the same diameter can balance the forces on both sides of the PCB.

[0047] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A fixture for wafer burn-in testing, comprising: An upper cover plate (1), a lower cover plate (2), a PCB board (3), a probe card (4) and a holder (5), wherein a test cavity (21) is provided on the top of the lower cover plate (2), the PCB board (3) is fixedly arranged below the upper cover plate (1), the holder (5) fixes the probe card (4) below the PCB board (3), the PCB board (3) is covered above the lower cover plate (2) and the holder (5) and the probe card (4) are both located in the test cavity (21), characterized in that the holder (5) further comprises a positioning column (6), the holder (5) is annular, and the inner ring of the holder (5) is radially inward. A protrusion forms an annular supporting platform (51), and a plurality of positioning posts are installed on the surface of the supporting platform (51) in a circumferential array. A plurality of positioning holes (41) are opened axially on the edge of the probe card (4), and each positioning post (6) corresponds to the position of a positioning hole (41). The positioning post (6) is embedded in the positioning hole (41). The side surface of each positioning post (6) is elastically provided with a plurality of supporting posts (61) with adjustable rebound force along the circumferential direction. The end of the supporting post (61) is supported on the inner surface of the positioning hole, and the supporting post (61) can be elastically moved along the radial direction of the positioning post (6).

2. The fixture for wafer aging test according to claim 1, wherein: The positioning column (6) further includes an elastic force adjustment structure (62). A plurality of accommodating cavities (63) are provided on the inner side of the positioning column (6) along the circumferential direction. Each accommodating cavity (63) is connected to the side of the positioning column (6) through a limiting hole (631). A supporting column (61) is embedded in each limiting hole (631). The elastic force adjustment structure (62) is accommodated in the accommodating cavity (63). The elastic force adjustment structure (62) elastically drives the supporting column (61) to reciprocate along its own axis, and the elastic force is adjustable.

3. The fixture for wafer aging test according to claim 2, wherein: The elastic force adjustment structure (62) comprises: an arc-shaped spring piece (621), a cylindrical cam (622) and a driving member (623). The arc-shaped spring piece (621) is arranged in the accommodating cavity (63) and the convex surface of the arc-shaped spring piece (621) abuts against one end of the abutting column (61) close to the accommodating cavity (63). One end of the arc-shaped spring piece (621) along the circumference of the arc surface abuts against the top of the accommodating cavity (63), and the other end abuts against the circumferential surface of the cylindrical cam (622). The driving member (623) can be used to drive the cylindrical cam (622) to rotate around the axis.

4. The fixture for wafer aging test according to claim 3, wherein: The driving member (623) includes: a rotating rod (6231), a limiting plate (6232), a positioning pin (6233) and a tightening spring (6234). The surface of the positioning column (6) is provided with an axial hole (64). An end of the axial hole (64) close to the surface of the positioning column (6) is provided with a plurality of positioning protrusions (65) along the circumferential direction. A positioning groove (66) is formed between two adjacent positioning protrusions (65). The rotating rod (6231) is coaxially slidably arranged in the axial hole (64). The end of the rotating rod (6231) close to the surface of the positioning column (6) is coaxially fixed with the limiting plate (6232). A positioning pin (6233) is protruding from the surface of the limiting plate (6232), and the limiting plate (6232) is elastically connected to the surface of the positioning column (6) through a tightening spring (6234). The tightening spring (6234) drives the limiting plate (6232) to abut against the side of the positioning protrusion (65) close to the positioning column (6), and the positioning pin (6233) is selectively engaged in one of the positioning grooves (66). The compression of the tightening spring (6234) can drive the positioning pin (6233) to disengage from the positioning groove (66), and the rotating rod (6231) can rotate relative to the shaft hole (64).

5. The fixture for wafer aging test according to claim 1, wherein: The positioning column (6) is threadedly connected and installed on the surface of the bearing platform (51).

6. The fixture for wafer aging test according to claim 5, wherein: It also includes an elastic washer (7), which is clamped and arranged between the positioning column (6) and the bearing platform (51).

7. The fixture for wafer aging test according to claim 1, wherein: It also includes a sealing ring (10), and an annular mounting groove (22) is provided on the upper surface of the lower cover plate (2) along the circumference of the opening of the test cavity (21), and the sealing ring (10) is embedded in the annular mounting groove (22).

8. The fixture for wafer aging test according to claim 1, wherein: A buffer cavity (11) is provided on the bottom surface of the upper cover plate (1), and a vent hole is provided on the surface of the PCB board (3), and the buffer cavity (11) is connected to the test cavity (21) through the vent hole.

9. The fixture for wafer aging test according to claim 8, wherein: The buffer cavity (11) and the test cavity (21) have the same diameter.

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