Die bonding equipment and method

Abstract

The invention relates to a die bonding device and method. The die bonding equipment is used for realizing chip packaging on a mounting base, and comprises a bearing platform, and a base bearing device, a mounting binding head device and an upper view positioning device which are mounted on the bearing platform, the base bearing device moves on the bearing platform in the X-axis direction and the Y-axis direction, and the mounting binding head device moves above the base bearing device in the X-axis direction, the Y-axis direction and the Z-axis direction. The base bearing device is provided with a hollow channel in the vertical direction, and the top view positioning device moves in the hollow channel in the Z-axis direction. The base bearing device is provided with a base bearing platform for placing the mounting base, when the mounting base is arranged on the base bearing platform, the supporting part of the mounting base is detachably fixed on the base bearing platform, and the mounting part and the upper view alignment part of the mounting base are respectively positioned on one side close to the mounting binding head device and the upper view positioning device; when the base bearing device moves, the base bearing table and the mounting base move synchronously, so that the upper view alignment part and the supporting part enter the recognition area of the upper view positioning device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, in particular to a die bonding device and method. BACKGROUND

[0002] With the popularization of intelligent auxiliary driving, the demand for detectors increases rapidly, and there is no full-automatic large tube shell chip packaging equipment on the market at present, which needs human intervention in production, and the production efficiency and yield are low, and the precision is difficult to guarantee. Therefore, a shell packaging device is needed to improve the production efficiency, improve the yield of the final product, and ensure the precision. SUMMARY

[0003] To solve the technical problems of low production efficiency and product yield of the existing chip packaging equipment, and difficult to guarantee the precision, the present application provides a die bonding device and method.

[0004] The technical problem of the present application is solved by providing a die bonding device for chip packaging on a mounting base, the mounting base having a mounting portion, a supporting portion and an upper alignment portion connected in sequence, the die bonding device comprising a bearing platform, a base bearing device, a mounting head device and an upper positioning device mounted on the bearing platform; the base bearing device moves along the X and Y axis directions on the bearing platform, and the mounting head device moves above the base bearing device along the X, Y and Z axis directions; the base bearing device is provided with a hollow channel in the vertical direction, and the upper positioning device moves along the Z axis direction in the hollow channel; the mounting head device is provided with a lower positioning module; the base bearing device is provided with a base bearing table for placing the mounting base, when the mounting base is placed on the base bearing table, the supporting portion is detachably fixed to the base bearing table, the mounting portion is located on the side close to the mounting head device, and the upper alignment portion is located on the side close to the upper positioning device; when the base bearing device moves, the base bearing table and the mounting base move synchronously to make the upper alignment portion and the supporting portion enter the identification area of the upper positioning device; the upper positioning device can identify the upper alignment portion and the supporting portion, perform bottom visual positioning on the mounting base, and transmit an identification alignment signal to the mounting head device, and the mounting head device adheres a circular or non-circular mounting element to the mounting portion according to the identification alignment signal of the bottom visual positioning.

[0005] Preferably, the upper vision alignment part is in the shape of a cylinder, and the side of the upper vision alignment part facing the working end of the upper vision positioning device is circular; the side of the upper vision alignment part facing the upper vision positioning device has a first identification point, and the side of the mounting part facing the mounting head device has a first mounting position, the first identification point corresponding to the first mounting position; after the upper vision positioning device locates the first identification point, the mounting head device correspondingly mounts a circular mounting element to the first mounting position.

[0006] Preferably, two first through holes are arranged on the support part, the first through holes being symmetrically distributed on both sides of the upper vision alignment part, a second through hole being arranged on the base support table, the first through hole, the second through hole and the hollow channel being sequentially communicated; the inner wall surface of the first through hole has a second identification point, and after the upper vision positioning device locates the second identification point, the first identification point is combined to determine a second mounting position on the side of a circular mounting element facing the mounting head device; the mounting head device correspondingly mounts a non-circular mounting element to the second mounting position.

[0007] Preferably, the base support table is detachably mounted on the base support device, a limiting assembly is arranged on the base support table, and the limiting assembly includes a first limiting piece and a second limiting piece; the first limiting piece and the second limiting piece are arranged in close contact with the side edges of the support part, and the first limiting piece and the second limiting piece are oppositely arranged to detachably fix the mounting base to the base support table.

[0008] Preferably, the lower vision positioning module is mounted on the side edge part of the mounting head device; a height measuring module is further arranged on the mounting head device, the height measuring module being used for detecting the flatness of the mounting element on the mounting part, the height measuring module being mounted on the side edge part of the mounting head device or the side edge part of the lower vision positioning module; the lower vision positioning module and the height measuring module are arranged close to the working end of the mounting head device and move synchronously with the mounting head device.

[0009] Preferably, the die bonding equipment further includes a material table device and a suction nozzle rack device mounted on the carrying platform, the material table device being used for storing mounting elements, and the suction nozzle rack being used for storing suction nozzles; the material table device is located between the base support device and the suction nozzle rack device, and the working end of the mounting head device is matched with the material table device and the suction nozzle rack device respectively.

[0010] Preferably, a glue drawing module is arranged on the mounting head device, the glue drawing module moving synchronously with the mounting head device; and / or the die bonding equipment further includes a glue dipping device mounted on the carrying platform, the glue dipping device being close to the base support device.

[0011] Preferably, after the upper view positioning device identifies the upper view alignment part and the support part, the pasting head device firstly corresponds and pastes the circular pasting element to the first pasting position, and then corresponds and pastes the non-circular pasting element to the second pasting position; the circular pasting element comprises a ceramic piece, and the non-circular pasting element comprises a substrate and a chip bonded to the substrate, and the substrate has a bonding position for the top identification and positioning of the lower view positioning module.

[0012] The application further provides a die bonding method applied to the die bonding device, which comprises the following steps: providing a pasting base and pasting elements, the shapes of the pasting elements including circular and non-circular; after the upper view positioning device identifies the upper view alignment part for the first time, the pasting head device performs glue drawing or glue dipping treatment on the pasting part and corresponds and pastes the circular pasting element to the pasting part; after the pasting head device performs glue drawing or glue dipping treatment on the circular pasting element, the upper view positioning device identifies the upper view alignment part and the support part for the second time, the pasting head device corresponds and pastes the non-circular pasting element to the pasting part, and the pasting elements on the pasting part are arranged in a stacked manner; after the pasting head device performs glue drawing or glue dipping treatment on the non-circular pasting element, the lower view positioning module identifies the non-circular pasting element for the third time, and the pasting head device corresponds and pastes another non-circular pasting element to the pasting part.

[0013] Preferably, the die bonding device further comprises a base baking device; after the pasting head device corresponds and pastes the pasting element to the pasting part, the base baking device performs baking treatment on the pasting base.

[0014] Compared with the prior art, the die bonding device and method provided by the application have the following advantages: 1. The die bonding device provided by the embodiment of the application is used for realizing chip packaging of a pasting base, the pasting base has a pasting part, a support part and an upper view alignment part connected in sequence, a base bearing device, a pasting head device and an upper view positioning device are integrated on a bearing platform, the base bearing device is provided with a hollow channel in the vertical direction, the upper view positioning device moves in the hollow channel, the pasting head device is located above the base bearing device, the hollow channel can provide independent movement space for the upper view positioning device, and the movement paths of the pasting head device and the upper view positioning device do not interfere with each other; the base bearing device is provided with a base bearing table, the base bearing table can be used for placing a plurality of pasting bases, when the pasting base is placed on the base bearing table, the pasting base is detachably fixed to the base bearing table through the support part, different specifications of pasting bases can be conveniently replaced to adapt to the packaging requirements of different types of chips, and the maintenance process of the die bonding device is simplified.

[0015] Understandably, the base carrying device moves along with the carrying platform in the X, Y axis direction, and the base carrying device moves synchronously with the base carrying table and the mounting base thereon to ensure that the upper view alignment part and the support part enter the identification area of the upper view positioning device, so as to avoid relative displacement between the base carrying device and the mounting base during movement, thereby avoiding positioning deviation; the upper view positioning device moves along the Z axis direction in the hollow channel, and the mounting base is positioned by identifying the upper view alignment part and the support part of the mounting base, thereby significantly improving the alignment accuracy of the mounting element and the mounting part; the lower view positioning module is arranged on the mounting head device and moves synchronously with the mounting head device, and is used for identifying the specific mounting position of the mounting element when a plurality of mounting elements are stacked and mounted, so as to significantly improve the alignment accuracy of the circular or non-circular mounting element and the mounting part without human intervention in production, improve the precision of the mounting head device in the X, Y, Z axis direction above the base carrying device to mount the mounting element to the mounting part, and realize chip packaging.

[0016] 2、The first identification point corresponds to the first mounting position in the die bonding equipment provided by the embodiment of the application, so that the positioning result of the first identification point by the upper view positioning device can be directly associated with the first mounting position on the mounting part, a precise positioning and mounting position correspondence is established, and the alignment accuracy between the circular mounting element and the mounting part is improved; the die bonding equipment positions the mounting base by the upper view positioning device, transmits the identification alignment signal to the mounting head device after positioning the first identification point, and mounts the circular mounting element to the mounting part by the mounting head device, so as to reduce the error in the positioning information transmission process and ensure the accuracy and consistency of the corresponding mounting of the mounting element to the first mounting position.

[0017] 3、The first through hole on the support part is symmetrically distributed, the inner wall surface of the first through hole has a second identification point, and the second mounting position on the circular mounting element can be accurately determined by combining the first identification point, so as to meet the high-precision requirements of the non-circular mounting element on the mounting position and the orientation, improve the mounting accuracy of the non-circular mounting element, and sequentially communicate the first through hole, the second through hole and the hollow channel, so as to ensure that the upper view positioning device is positioned to the second identification point without human intervention, provide a positioning basis for accurate mounting of the non-circular mounting element, determine the second mounting position by combining the second identification point with the first identification point, so that the die bonding equipment can adapt to the mounting requirements of the non-circular mounting element, improve the adaptability to different shapes of mounting elements, and further ensure the mounting precision.

[0018] 4. The die bonding apparatus provided by the embodiment of the present application, the base carrier table is detachably mounted on the base carrier device, different specifications of the base carrier table can be replaced according to the requirements of the chip packaging, so that the die bonding apparatus can realize packaging of different types of chips; the limiting assembly includes the first limiting piece and the second limiting piece which are arranged close to the side edges of the supporting part, the first limiting piece and the second limiting piece are oppositely arranged, through this design, the mounting base can be fixed on the base carrier table, when the base carrier device moves along the X and Y axes on the carrying platform, the base carrier table and the mounting base move synchronously, the relative displacement between the mounting base and the base carrier table is prevented, and the positioning accuracy of the upper visual positioning device is ensured; the mounting base is detachably fixed through the limiting assembly, the mounting base can be quickly replaced, the production efficiency of the die bonding apparatus is improved, and the requirements of batch production are met.

[0019] 5. The die bonding apparatus provided by the embodiment of the present application, the lower visual positioning module is arranged close to the working end of the mounting and binding head device and moves synchronously with the mounting and binding head device, the visual information of the mounting area can be obtained in real time and at a close distance, the positioning error caused by the distance or the relative displacement is reduced, and the accuracy of the lower visual positioning is improved; the height measuring module can be used to detect the flatness of the mounting element on the mounting part, so as to ensure the mounting quality, avoid packaging defects caused by uneven mounting elements, and improve the yield of the chip packaging on the mounting base; the height measuring module is installed on the side edge part of the mounting and binding head device or the side edge part of the lower visual positioning module and moves synchronously with the working end, the flatness detection of the mounting element can be completed in real time during the mounting process of the mounting and binding head device, and the detection efficiency is improved without additional processes; the height measuring module is arranged close to the working end of the mounting and binding head device, and the lower visual positioning module and the height measuring module move synchronously with the mounting and binding head device, so that the actions of the lower visual positioning and the flatness detection are closely matched with the mounting process, and the production efficiency and the product yield of the die bonding apparatus are improved.

[0020] 6. The die bonding apparatus provided by the embodiment of the present application, the material table device and the suction nozzle rack device are installed on the carrying platform, the mounting and binding head device can complete the processes of selecting the suction nozzle, taking the mounting element and mounting, the automation degree of the die bonding apparatus is improved, and the continuity of batch production is ensured; the circular or non-circular mounting elements are stored on the material table device to realize multi-chip mounting, the suction nozzle rack device can realize replacement of multiple different types of suction nozzles, and the mounting and binding head device can replace the suction nozzles matched with different types of mounting elements; the material table device is located between the base carrier device and the suction nozzle rack device, the working end of the mounting and binding head device can efficiently complete the consecutive actions of replacing the suction nozzle, taking the mounting element and mounting the mounting element to the mounting part, the movement path is shortened, and the working efficiency is improved.

[0021] 7. In the die bonding equipment provided by the embodiment of the present invention, the glue drawing module and the mounting head binding device move synchronously to avoid relative displacement between the glue drawing module and the mounting head binding device causing glue position deviation, thereby ensuring the fixing effect of the mounting component to the mounting part; the glue dipping device is close to the base supporting device, which can shorten the path of the glue dipping process, reduce the shape change of the glue during the transfer process, and improve the continuity and efficiency of the glue dipping and mounting processes; the die bonding equipment can choose glue drawing and / or glue dipping methods according to different mounting requirements, thereby improving the flexibility and applicability of the die bonding equipment in the glue processing link.

[0022] 8. In the die bonding equipment provided by the embodiment of the present invention, the first identification point is located on the side of the upward-looking alignment part facing the upward-looking positioning device, and the second identification point is located on the inner wall surface of the first through hole. The upward-looking positioning device locates the first identification point and the second identification point in sequence, and the mounting head device first mounts the circular mounting component to the first mounting position on the mounting part, and then mounts the non-circular mounting component to the second mounting position on the circular mounting component, that is, different mounting components are stacked to meet the process logic of chip packaging, avoid mutual interference between different mounting components during mounting, and improve the orderliness and continuity of the chip packaging process; the bonding position on the substrate can be used for the downward-looking positioning module to perform top identification and positioning. After the downward-looking positioning module performs top identification and positioning on the bonding position, the mounting head device mounts the chip to the corresponding bonding position. Through this design, the alignment accuracy of the chip mounting by the mounting head device can be significantly improved, ensuring a reliable connection between the chip and the substrate.

[0023] 9. An embodiment of the present invention also provides a die bonding method, which is applied to the above-mentioned die bonding equipment. By first mounting circular mounting components and then mounting non-circular mounting components, and the mounting components are stacked, components of different shapes and types are mounted in sequence according to the process logic to avoid mutual interference, thereby ensuring the orderliness and continuity of the die bonding process; by applying glue or dipping glue between the mounting part and the mounting components and between the stacked mounting components, and performing positioning and calibration before each mounting, it can be ensured that the mounting part and the mounting components and between the stacked mounting components are firmly connected through the glue layer, thereby improving the structural stability of the chip package; the upward positioning device performs a second identification on the upward alignment part and the support part to adapt to the mounting requirements of the non-circular mounting components, and the downward positioning module performs a third identification on the non-circular mounting components that have been mounted to the mounting part, and identifies the bonding position through the top recognition positioning to further ensure the mounting accuracy of the mounting head binding device.

[0024] 10、The die bonding method provided by the embodiment of the present application, after the mounting and binding head device mounts the corresponding mounting elements to the mounting portion, the base baking device bakes the mounting base, which can promote the curing of the glue material used in the mounting process, enhance the bonding strength between the mounting elements and the mounting portion and between the mounting elements, reduce the risk of the mounting elements falling off after packaging, ensure the stability of the chip packaging, and bake the mounting base in the die bonding process, without transferring the mounting base to external equipment, shorten the process interval, and improve the overall coherence and production efficiency of the die bonding process. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0026] Figure 1 is the overall frame schematic diagram of the die bonding equipment of the embodiment of the present application.

[0027] Figure 2 is the structure schematic diagram of the base bearing device and the upper view positioning device of the die bonding equipment of the embodiment of the present application.

[0028] Figure 3 is the structure schematic diagram of the mounting base of the die bonding equipment of the embodiment of the present application.

[0029] Figure 4 is the cross-sectional view of the mounting base of the die bonding equipment of the embodiment of the present application.

[0030] Figure 5 is the structure schematic diagram of the mounting and binding head device of the die bonding equipment of the embodiment of the present application. Figure 2 is the local enlarged view of part A of the mounting and binding head device of the die bonding equipment of the embodiment of the present application.

[0031] Figure 6 is the structure schematic diagram of the material table device of the die bonding equipment of the embodiment of the present application.

[0032] Figure 7 is the structure schematic diagram of the suction nozzle rack device of the die bonding equipment of the embodiment of the present application.

[0033] Figure 8 is the flow schematic diagram of the die bonding method of the embodiment of the present application.

[0034] BRIEF DESCRIPTION OF DRAWINGS 100, die bonding equipment; 1, base bearing device; 12, base bearing table; 13, mounting base; 131, mounting part; 132, support part; 1321, first through hole; 133, upper view alignment part; 14, limiting assembly; 141, first limiting piece; 142, second limiting piece; 2, mounting binding head device; 21, lower view positioning module; 22, height measurement module; 23, picture glue module; 3, upper view positioning device; 4, material table device; 41, material table body; 42, first support column; 43, first base; 5, suction nozzle frame device; 51, suction nozzle frame body; 510, containing groove; 52, second support column; 53, second base; 6, glue dipping device; 101, bearing platform; 102, first identification point; 103, second identification point. DETAILED DESCRIPTION

[0035] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0036] In the embodiments provided by the present application, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that the determination of B according to A does not mean that B is determined only according to A, but B can also be determined according to A and / or other information.

[0037] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the present application.

[0038] In various embodiments of the present application, it should be understood that the size of the serial number of the above processes does not mean the inevitable sequence of execution, and the execution sequence of the processes should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0039] The computer program product of the present application can have a signal including computer readable instructions, which, when implemented by the various computing devices described herein, direct the computing devices to carry out the methods described herein. The computer program product can be a storage medium or a signal. Examples of computer readable media suitable for implementing the application include disk memory devices, chip memory devices, and other storage devices suitable for interfacing with a computer or computer system. The computer readable instructions can be implemented in any of numerous ways, including as computer software, firmware, microcode, and / or other control logic. The computer readable instructions can be implemented using computer language, logic, and / or other instructions suitable for an electronic digital computer or processor. Software can be described for example, in any programming language, such as, for example, assembly language, machine language, machine code, high-level languages, etc. The software can be compiled or interpreted.

[0040] Referring to Figure 1 , Figure 2 and Figure 3 , the embodiment of the present application provides a die bonding equipment 100, which realizes chip packaging for a mounting base 13, the mounting base 13 has a mounting part 131, a supporting part 132 and an upper alignment part 133 connected in sequence; the die bonding equipment 100 comprises a bearing platform 101, a base bearing device 1, a mounting binding head device 2 and an upper positioning device 3 installed on the bearing platform 101; the base bearing device 1 moves along the X and Y axis directions on the bearing platform 101, the mounting binding head device 2 is above the base bearing device 1 and moves along the X, Y and Z axis directions; the base bearing device 1 is provided with a hollow passage in the vertical direction, and the upper positioning device 3 moves along the Z axis direction in the hollow passage; the mounting binding head device 2 is provided with a lower positioning module 21; the base bearing device 1 is provided with a base bearing table 12 for placing the mounting base 13, when the mounting base 13 is placed on the base bearing table 12, the supporting part 132 is detachably fixed to the base bearing table 12, the mounting part 131 is located on the side close to the mounting binding head device 2, and the upper alignment part 133 is located on the side close to the upper positioning device 3; when the base bearing device 1 moves, the base bearing table 12 and the mounting base 13 move synchronously, so that the upper alignment part 133 and the supporting part 132 enter the identification area of the upper positioning device 3; the upper positioning device 3 can identify the upper alignment part 133 and the supporting part 132, perform bottom visual positioning on the mounting base 13, and transmit an identification alignment signal to the mounting binding head device 2, and the mounting binding head device 2 adheres a circular or non-circular mounting element to the mounting part 131 according to the identification alignment signal of the bottom visual positioning.

[0041] The crystal mounting equipment 100 provided by the embodiment of the present application is characterized in that the base bearing device 1, the mounting and binding head device 2 and the upward positioning device 3 are integrated on the bearing platform 101, the base bearing device 1 is provided with a hollow channel in the vertical direction, the upward positioning device 3 moves in the hollow channel, the mounting and binding head device 2 is located above the base bearing device 1, the hollow channel can provide independent movement space for the upward positioning device 3, and can also provide an observation channel for the upward positioning device 3 to perform bottom visual positioning on the mounting base 13, when the upward alignment part 133 and the support part 132 enter the identification area of the upward positioning device 3, the upward alignment part 133 and the support part 132 can be positioned and identified by the upward positioning device 3, and the upward positioning device 3 and the mounting and binding head device 2 are respectively located on the top and the bottom side of the base bearing device 1, and the movement paths of the two do not interfere with each other.

[0042] Further, the base bearing table 12 is arranged on the base bearing device 1, and a plurality of mounting bases 13 can be placed on the base bearing table 12, the mounting base 13 has the mounting part 131, the support part 132 and the upward alignment part 133 connected in sequence, and the mounting base 13 is detachably connected and fixed to the base bearing table 12 through the support part 132, so that different specifications of the mounting base 13 can be conveniently replaced to adapt to the packaging requirements of various chips, and the maintenance process of the crystal mounting equipment 100 is simplified.

[0043] The mounting and binding head device 2 of the present application can mount circular or non-circular mounting elements to the mounting part 131, so that the chip packaging can be realized on the mounting base 13, the number of the mounting base 13 in the embodiment is six, so as to facilitate batch mounting of the mounting elements and reduce the time for frequently replacing the base bearing table 12 or the mounting base 13, wherein the number of the mounting base 13 can be adjusted according to actual conditions, for example, the size of the base bearing table 12 or the base bearing device 1 is considered, or whether the distance between the mounting bases 13 will affect the effect of mounting in sequence is considered, and the above is only one embodiment of the present application, and does not limit the present application, any modification, equivalent replacement and improvement within the principle of the present application shall be included in the protection scope of the present application.

[0044] It can be understood that the base bearing device 1 moves along the X and Y axis directions on the bearing platform 101, and the base bearing device 1 drives the base bearing table 12 and the mounting base 13 thereon to move synchronously, so as to ensure that the upward alignment part 133 and the support part 132 enter the identification area of the upward positioning device 3, and avoid that the relative displacement between the base bearing device 1 and the mounting base 13 occurs when the base bearing device 1 moves, thereby causing positioning deviation.

[0045] It should be noted that the mounting portion 131, the supporting portion 132 and the upper view alignment portion 133 are sequentially connected, wherein the side of the supporting portion 132 away from the mounting portion 131 is attached to the upper surface of the base carrying table 12, and the upper view alignment portion 133 is arranged in the base carrying table 12 for the bottom vision positioning device 3 to perform bottom vision positioning; the bottom vision positioning device 3 moves along the Z-axis direction in the hollow channel, and the bottom vision positioning device 3 performs bottom vision positioning on the mounting base 13 by identifying the upper view alignment portion 133 and the supporting portion 132 of the mounting base 13, thereby significantly improving the alignment accuracy of the mounting element and the mounting portion 131; the lower view positioning module 21 is arranged on the mounting head device 2 and moves synchronously with the mounting head device 2, and is used to identify the specific mounting position on the mounting element when a plurality of mounting elements are stacked and mounted. Compared with the traditional chip packaging equipment, the automatic degree of the die bonding equipment 100 provided by the present application is higher, and the alignment accuracy of the circular or non-circular mounting element and the mounting portion 131 is significantly improved without human intervention in production by the cooperation of the upper view positioning device 3 and the lower view positioning module 21, the accuracy of the mounting head device 2 moving along the X, Y and Z axes above the base carrying device 1 to mount the mounting element to the mounting portion 131 is improved, the chip packaging of the mounting base 13 is better implemented, and the technical problems of the existing chip packaging equipment, such as low production efficiency and product yield and difficult to guarantee the accuracy, are solved.

[0046] Please refer to Figures 1 to 4 The shape of the upper view alignment portion 133 is a cylinder, and the side of the upper view alignment portion 133 facing the working end of the upper view positioning device 3 is circular; the side of the upper view alignment portion 133 facing the upper view positioning device 3 has a first identification point 102, the side of the mounting portion 131 facing the mounting head device 2 has a first mounting position, and the first identification point 102 corresponds to the first mounting position; after the upper view positioning device 3 positions the first identification point 102, the mounting head device 2 corresponds the circular mounting element to the first mounting position.

[0047] In the die bonding equipment 100 provided by the embodiment of the present application, the first identification point 102 corresponds to the first mounting position, so that the positioning result of the first identification point 102 by the upper view positioning device 3 can be directly associated with the first mounting position on the mounting portion 131, a precise relationship between the identification point positioning and the mounting position is established, and the alignment accuracy between the circular mounting element and the mounting portion 131 is improved.

[0048] It can be understood that the die bonding equipment 100 positions the mounting base 13 by the upper view positioning device 3, transmits the identification alignment signal to the mounting head device 2 after positioning the first identification point 102, and mounts the circular mounting element to the mounting portion 131 by the mounting head device 2, thereby reducing the error in the positioning information transmission process and ensuring the accuracy and consistency of the corresponding mounting of the mounting element to the first mounting position.

[0049] Specifically, the first identification point 102 is the center of the circle on the side of the upper view alignment part 133 facing the working end of the upper view positioning device 3, the first mounting position on the mounting part 131 is the center of the circular mounting element, the first identification point 102 is coaxially arranged with the first mounting position, and the specific steps of positioning the first identification point 102 by the upper view positioning device 3 and corresponding mounting the circular mounting element to the first mounting position by the mounting and binding head device 2 are as follows: When the base carrying device 1 moves along the X and Y axes, the base carrying table 12 and the mounting base 13 move synchronously until the mounting base 13 moves to the position directly above the working end of the upper view positioning device 3, the upper view alignment part 133 enters the identification area of the upper view positioning device 3, at this time, the upper view positioning device 3 performs bottom visual positioning on the mounting base 13, and positioning of the first identification point 102 can be started; in the embodiment of the application, the shape of the upper view alignment part 133 of the mounting base 13 is a cylinder, and the side of the upper view alignment part 133 facing the working end of the upper view positioning device 3 is circular, the upper view positioning device 3 takes any three points on the bottom surface of the upper view alignment part 133, wherein any two points can be connected to form a straight line, the perpendicular lines of the two straight lines are taken, and the intersection of the perpendicular lines is the center of the circle, which is the first identification point 102 in the embodiment, corresponding to the first mounting position on the mounting part 131, the upper view positioning device 3 transmits an identification alignment signal to the mounting and binding head device 2, the mounting and binding head device 2 correspondingly mounts the circular mounting element to the first mounting position, and one mounting is completed.

[0050] Further, the support part 132 is provided with two first through holes 1321, the first through holes 1321 are symmetrically distributed on the two sides of the upper view alignment part 133, the base carrying table 12 is provided with a second through hole, and the first through hole 1321, the second through hole and the hollow passage are sequentially connected; the inner wall surface of the first through hole 1321 has a second identification point 103, after the upper view positioning device 3 positions the second identification point 103, the second mounting position on the side of the mounting part 131 facing the mounting and binding head device 2 is determined in combination with the first identification point 102; the mounting and binding head device 2 correspondingly mounts the non-circular mounting element to the second mounting position.

[0051] It should be noted that in the embodiment of the application, the first through hole 1321 of the upper view alignment part 133 is an elliptical hole, the second through hole on the base carrying table 12 is a circular hole, and the size of the first through hole 1321 is smaller, so that the upper view positioning device 3 can better position the second identification point 103 on the inner wall surface of the first through hole 1321 through the second through hole, and the second identification point 103 on the inner wall surface of the first through hole 1321 can also be avoided from being shielded by the base carrying table 12 due to the fine adjustment of the placement angle of the mounting base 13 in the previous mounting process.

[0052] The first through holes 1321 on the support part 132 are symmetrically distributed, the inner wall surface of the first through hole 1321 has a second identification point 103, and the second identification point 103 can be accurately determined in combination with the first identification point 102, so that the high-precision requirements of the non-circular mounting element on the mounting position and the orientation are met, and the mounting accuracy of the non-circular mounting element is improved; the first through hole 1321, the second through hole and the hollow channel are sequentially communicated, so that the upper positioning device 3 can be positioned to the second identification point 103 without human intervention, and a positioning basis is provided for accurate mounting of the non-circular mounting element; the second identification point 103 is combined with the first identification point 102 to determine the second mounting position, so that the mounting device 100 can adapt to the mounting requirements of the non-circular mounting element, improve the adaptability to different shapes of mounting elements, and further ensure the mounting precision.

[0053] Specifically, on the basis that the first identification point 102 has been positioned, the specific steps of positioning the second identification point 103 by the upper positioning device 3 and mounting the non-circular mounting element to the second mounting position by the mounting head binding device 2 are as follows: The base carrying device 1 moves the mounting base 13 to the upper side of the working end of the upper positioning device 3 by moving the carrying platform 101 along the X and Y axes, so that the upper positioning part 133 and the support part 132 enter the identification area of the upper positioning device 3; since the first through hole 1321, the second through hole and the hollow channel are sequentially communicated, the working end of the upper positioning device 3 can directly identify the second identification point 103 on the inner wall surface of the first through hole 1321, and the first through hole 1321 is symmetrically distributed on both sides of the upper positioning part 133; after identifying the two symmetric second identification points 103, a perpendicular bisector of a straight line connecting the two second identification points 103 is taken, the perpendicular bisector intersects the first identification point 102, and the second mounting position on the side of the circular mounting element facing the mounting head binding device 2 is determined, that is, the mounting orientation of the non-circular mounting element can be determined; the upper positioning device 3 transmits an identification alignment signal to the mounting head binding device 2, the mounting head binding device 2 mounts the non-circular mounting element to the second mounting position, and one mounting is completed.

[0054] Please refer to Figures 1 to 3 , Figure 5 , the base carrying platform 12 is detachably mounted on the base carrying device 1, the base carrying platform 12 is provided with a limiting assembly 14, the limiting assembly 14 includes a first limiting piece 141 and a second limiting piece 142; the first limiting piece 141 and the second limiting piece 142 are arranged in close contact with the side edges of the support part 132, and the first limiting piece 141 and the second limiting piece 142 are oppositely arranged to detachably fix the mounting base 13 to the base carrying platform 12.

[0055] The detachable base carrying table 12 in the die bonding equipment 100 provided by the embodiment of the present application can facilitate replacement of base carrying tables 12 of different specifications according to the requirements of chip packaging, the types of the mounting bases 13 that can be placed on the base carrying tables 12 of different specifications are different, and the specific positions identified by the upper-view positioning device 3 can also change before mounting by the mounting and bonding head device 2, so that the die bonding equipment 100 can realize chip packaging of different types.

[0056] Understandably, the limiting assembly 14 includes a first limiting piece 141 and a second limiting piece 142, the first limiting piece 141 and the second limiting piece 142 are arranged in close contact with the side edges of the supporting part 132, and the first limiting piece 141 and the second limiting piece 142 are oppositely arranged, through this design, the mounting base 13 can be fixed on the base carrying table 12, when the base carrying device 1 moves along the X and Y axes directions on the carrying platform 101, driving the base carrying table 12 and the mounting base 13 to move synchronously, the relative displacement between the mounting base 13 and the base carrying table 12 is prevented, and the positioning accuracy of the upper-view positioning device 3 is further ensured.

[0057] Understandably, the supporting part 132 is provided with two first through holes 1321, the base carrying table 12 is provided with two second through holes corresponding to the different first through holes 1321 on the supporting part 132 respectively, and the first through holes 1321, the second through holes and the hollow passage are sequentially communicated, therefore, the first limiting piece 141 and the second limiting piece 142 of the embodiment of the present application need to avoid the second through holes on the base carrying table 12, which can ensure that the mounting base 13 is fixed on the base carrying table 12 while avoiding affecting the positioning of the second identification point 103 on the inner wall surface of the first through hole 1321 by the upper-view positioning device 3.

[0058] Further, the position and size between the first limiting piece 141 and the second limiting piece 142 are adapted to the supporting part 132, when the mounting bases 13 of different specifications are replaced, different second limiting pieces 142 and second limiting pieces 142 can also be selected, through this design, no matter what specification of the mounting base 13 is selected to realize chip packaging, the detachable fixing can be realized through the cooperation between the first limiting piece 141 and the second limiting piece 142, the mounting base 13 can also be quickly replaced, the production efficiency of the die bonding equipment 100 is improved, and the demand of batch production is met.

[0059] Please refer to Figure 1 , Figure 2 and Figure 5The downward-looking positioning module 21 is installed on the side of the mounting head-binding device 2; the mounting head-binding device 2 is also provided with a height measuring module 22, which is used to detect the flatness of the mounted components on the mounting portion 131. The height measuring module 22 is installed on the side of the mounting head-binding device 2 or the side of the downward-looking positioning module 21; the downward-looking positioning module 21 and the height measuring module 22 are arranged close to the working end of the mounting head-binding device 2, and move synchronously with the mounting head-binding device 2.

[0060] In the die bonding equipment 100 provided in the embodiment of the present invention, the downward-looking positioning module 21 is arranged close to the working end of the mounting head binding device 2 and moves synchronously with the mounting head binding device 2. It can obtain visual information of the mounting area in real time and at close range, reduce positioning errors caused by distance or relative displacement, and improve the accuracy of downward-looking visual positioning.

[0061] It is understood that the height measurement module 22 can be used to detect the flatness of the components being mounted on the mounting portion 131, thereby ensuring the quality of the mounting, avoiding packaging defects caused by uneven mounting components, and improving the yield rate of chip packaging on the mounting base 13. Specifically, the height measurement module 22 is installed on the side of the mounting head binding device 2 or the side of the bottom-view positioning module 21, and moves synchronously with the working end. It can complete the flatness detection of the mounted components in real time during the mounting process of the mounting head binding device 2, improving the detection efficiency without the need for additional processes.

[0062] It should be noted that the height measuring module 22 of the embodiment of the present invention is installed on the side of the downward-looking positioning module 21, and the height measuring module 22 is also arranged close to the working end of the mounting head binding device 2, and the downward-looking positioning module 21 and the height measuring module 22 both move synchronously with the mounting head binding device 2. Through this design, it can be ensured that the downward-looking positioning and flatness detection actions are closely coordinated with the mounting process, thereby improving the production efficiency and product yield of the crystal bonding equipment 100.

[0063] See also Figure 1 、 Figures 5 to 7 The die bonding equipment 100 further includes a material table device 4 and a nozzle rack device 5 installed on the carrying platform 101. The material table device 4 is used to store the mounting components, and the nozzle rack is used to store the nozzles.

[0064] In the die bonding equipment 100 provided in the embodiment of the present invention, the material table device 4 and the suction nozzle holder device 5 are installed on the carrying platform 101, so that the mounting head binding device 2 can completely select the suction nozzle, pick up the mounting components and complete the mounting process, thereby improving the degree of automation of the die bonding equipment 100 and ensuring the continuity of batch production; circular or non-circular mounting components are stored on the material table device 4 to realize multi-chip mounting, and the suction nozzle holder device 5 can realize the replacement of multiple different types of suction nozzles. The mounting head binding device 2 can replace the corresponding suction nozzle according to different types of mounting components.

[0065] Furthermore, the material table device 4 is located between the base supporting device 1 and the suction nozzle holder device 5, and the working end of the mounting head binding device 2 cooperates with the material table device 4 and the suction nozzle holder device 5 respectively; through this design, the working end of the mounting head binding device 2 is convenient for efficiently completing the continuous actions of replacing the suction nozzle, taking the mounting components, and mounting the mounting components to the mounting part 131, shortening the movement path, and thereby improving the working efficiency of the crystal bonding equipment 100.

[0066] As an embodiment of the present invention, the base supporting device 1, the material table device 4 and the suction nozzle rack device 5 are arranged in sequence on the horizontal plane of the supporting platform 101, and the material table device 4 is close to the base supporting device 1, and the suction nozzle rack device 5 is close to the material table device 4.

[0067] In some embodiments, the material table device 4 includes a material table body 41, a first support 42, and a first base 43. The first base 43 is mounted and fixed to the supporting platform 101, and the first support 42 supports the material table body 41. It is understood that different types of SMT components can be placed on the material table body 41 of the material table device 4. The SMT head assembly 2 can place the components on the material table device 4 by sucking them, thereby achieving the placement of multiple SMT components and improving the placement efficiency.

[0068] In some embodiments, the nozzle holder device 5 includes a nozzle holder body 51, a second support column 52, and a second base 53. The second base 53 is mounted and fixed on the supporting platform 101, and the second support column 52 supports the nozzle holder body 51. The nozzle holder body 51 is provided with a receiving groove 510 for accommodating vacuum nozzles of different sizes. It can be understood that the nozzle holder device 5 is a device for replacing vacuum nozzles. The working end of the mounting and binding head device 2 can be detachably connected to nozzles of different sizes, and the mounting and binding head device 2 can replace the vacuum nozzle through the nozzle holder device 5 automatically or manually. The specific method can be set according to actual conditions. The embodiment of the present invention can meet the compatibility of replacing vacuum nozzles of different sizes by providing the nozzle holder device 5.

[0069] Please continue reading Figure 1 、 Figure 2 andFigure 5 The drawing glue module 23 is provided on the mounting and binding head device 2, and the drawing glue module 23 moves synchronously with the mounting and binding head device 2; and / or the die bonding equipment 100 further comprises a glue dipping device 6 installed on the bearing platform 101, and the glue dipping device 6 is close to the base bearing device 1.

[0070] In the die bonding equipment 100 provided by the embodiment of the present application, the drawing glue module 23 moves synchronously with the mounting and binding head device 2, so that the relative displacement between the drawing glue module 23 and the mounting and binding head device 2 does not cause the glue position deviation, thereby ensuring the fixing effect of the mounting component on the mounting part 131; the glue dipping device 6 is close to the base bearing device 1, so that the path of the glue dipping process can be shortened, the shape change of the glue in the transfer process is reduced, and the coherence and efficiency of the glue dipping and mounting process are improved.

[0071] It should be noted that the die bonding equipment 100 can select the glue drawing and / or glue dipping mode according to different mounting requirements, so as to improve the flexibility and applicability of the die bonding equipment 100 in the glue processing link. In the embodiment of the present application, the die bonding equipment 100 comprises the glue dipping device 6 installed on the bearing platform 101 and the drawing glue module 23 provided on the mounting and binding head device 2.

[0072] Please refer to Figure 1 , Figure 2 , Figure 4 and Figure 5 In some embodiments, after the upward positioning device 3 identifies the upward alignment part 133 and the supporting part 132, the mounting and binding head device 2 first corresponds the circular mounting component to the first mounting position, and then corresponds the non-circular mounting component to the second mounting position.

[0073] In the die bonding equipment 100 provided by the embodiment of the present application, the first identification point 102 is located on the side of the upward alignment part 133 facing the upward positioning device 3, and the second identification point 103 is located on the inner wall surface of the first through hole 1321; the upward positioning device 3 sequentially positions the first identification point 102 and the second identification point 103, so that the mounting and binding head device 2 first corresponds the circular mounting component to the first mounting position on the mounting part 131, and then corresponds the non-circular mounting component to the second mounting position on the circular mounting component, that is, different mounting components are stacked and placed, so as to meet the process logic of the chip packaging, avoid the mutual interference of different mounting components during mounting, and improve the orderliness and coherence of the chip packaging process.

[0074] Specifically, the circular mounting component comprises a ceramic piece, and the non-circular mounting component comprises a substrate and a chip bonded to the substrate, and the substrate has a bonding position for the top identification and positioning of the downward positioning module 21. In the embodiment of the present application, the shape of the substrate and the chip is square, which can be rectangular or square.

[0075] It can be understood that the bonding position on the substrate can be used for top identification and positioning by the downward-looking positioning module 21. After the downward-looking positioning module 21 performs top identification and positioning on the bonding position, the mounting head device 2 mounts the chip to the corresponding bonding position. Through this design, the alignment accuracy of the mounting head device 2 in completing chip mounting can be significantly improved, ensuring a reliable connection between the chip and the substrate.

[0076] See also Figure 8 The embodiment of the present invention further provides a die bonding method, which is applied to the above-mentioned die bonding device. The die bonding method includes the following steps: S1: Provide mounting base and mounting components. The shapes of mounting components include circular and non-circular. S2: After the upward positioning device recognizes the upward alignment part for the first time, the mounting head binding device applies glue or dips glue on the mounting part and mounts the circular mounting component to the mounting part accordingly; S3: After the mounting head binding device applies glue or dips glue on the circular mounting component, the upward positioning device performs a second recognition on the upward alignment part and the support part. The mounting head binding device mounts the non-circular mounting component to the mounting part accordingly, and the mounting components on the mounting part are stacked; S4: After the mounting head binding device applies glue or dips glue on the non-circular mounting component, the downward positioning module recognizes the non-circular mounting component for the third time, and the mounting head binding device mounts another non-circular mounting component to the mounting part.

[0077] The die bonding method of the embodiment of the present invention has the same beneficial effects as the above-mentioned die bonding equipment. By first mounting circular mounting components and then mounting non-circular mounting components, and by stacking the mounting components, components of different shapes and types can be mounted in sequence according to the process logic, avoiding mutual interference, and ensuring the orderliness and continuity of the die bonding process.

[0078] In step S1, the circular mounting components include ceramic parts. After the upward positioning device completes the first recognition, the mounting head device applies glue or dips glue to the mounting portion and mounts the ceramic parts to the mounting portion. Non-circular mounting components include substrates and chips. The substrates and chips are square in shape, which can be rectangular or square. After the upward positioning device completes the second recognition, the mounting head device mounts the substrate to the mounting portion. There is a bonding position on the substrate for the downward positioning module to perform top recognition and positioning. After the downward positioning module completes the third recognition, the mounting head device mounts the chip to the bonding position. At this time, the ceramic parts, substrates and chips are stacked. Through this design, the alignment accuracy of the mounting head device in completing chip mounting can be significantly improved, and a reliable connection between the ceramic parts, substrates and chips can be guaranteed.

[0079] In steps S2-S4, by performing glue painting or dipping treatment between the mounting part and the mounting element and between the stacked mounting elements, and positioning calibration before each mounting, the mounting part and the mounting element and the stacked mounting elements can be stably connected through the glue layer, and the structural stability of the chip package is improved. In step S3, the upper-view positioning device performs second identification on the upper-view alignment part and the support part, and adapts to the mounting requirements of the non-circular mounting element; in step S4, the lower-view positioning module performs third identification on the non-circular mounting element which has been mounted on the mounting part, and identifies the bonding position through the top identification positioning, so as to further ensure the mounting precision of the mounting head device.

[0080] The die bonding method provided by the embodiment of the application has the same beneficial effects as the die bonding device described above. Specifically, please refer to the description of the die bonding device Figures 1 to 4 The mounting base 13 has a mounting part 131, a support part 132 and an upper-view alignment part 133 connected in sequence. When the mounting base 13 is placed on the base carrier 12, the support part 132 is detachably fixed to the base carrier 12, the mounting part 131 is located on the side close to the mounting head device 2, and the upper-view alignment part 133 is located on the side close to the upper-view positioning device 3. When the base carrier device 1 moves, the base carrier 12 and the mounting base 13 move synchronously, so that the upper-view alignment part 133 and the support part 132 enter the identification area of the upper-view positioning device 3. The upper-view positioning device 3 can identify the upper-view alignment part 133 and the support part 132, and perform bottom visual positioning on the mounting base 13, and transmit the identification alignment signal to the mounting head device 2. The mounting head device 2 mounts the circular or non-circular mounting element to the mounting part 131 according to the identification alignment signal of the bottom visual positioning.

[0081] In step S2, the upper-view positioning device 3 performs first identification on the upper-view alignment part 133, specifically as follows: the shape of the upper-view alignment part 133 is a cylinder, and the side of the upper-view alignment part 133 facing the working end of the upper-view positioning device 3 is circular. The side of the upper-view alignment part 133 facing the upper-view positioning device 3 has a first identification point 102, and the side of the mounting part 131 facing the mounting head device 2 has a first mounting position, the first identification point 102 corresponds to the first mounting position. After the upper-view positioning device 3 positions the first identification point 102, the mounting head device 2 mounts the circular mounting element to the first mounting position.

[0082] It should be noted that the first identification point 102 is the center of the side of the upper-view alignment part 133 facing the working end of the upper-view positioning device 3, and the first mounting position on the mounting part 131 is the center of the circular mounting element, and the first identification point 102 and the first mounting position are coaxially arranged.

[0083] In step S2, the binding head device 2 correspondingly attaches the circular mounting element to the mounting portion 131, and the specific steps are as follows: When the base carrying device 1 moves along the X and Y axes, the base carrying table 12 and the mounting base 13 move synchronously until the mounting base 13 moves to the top of the upper-view positioning device 3, the upper-view alignment portion 133 enters the identification area of the upper-view positioning device 3, at this time, the upper-view positioning device 3 performs bottom visual positioning on the mounting base 13, and positioning of the first identification point 102 can be started; in the embodiment of the application, the shape of the upper-view alignment portion 133 of the mounting base 13 is a cylinder, and the side of the upper-view alignment portion 133 facing the working end of the upper-view positioning device 3 is circular, the upper-view positioning device 3 takes any three points on the bottom surface of the upper-view alignment portion 133, wherein any two points can be connected to form a straight line, the perpendicular lines of the two straight lines are taken, and the intersection of the perpendicular lines is the center of the circle, which is the first identification point 102 in the embodiment, corresponding to the first mounting position on the mounting portion 131, the upper-view positioning device 3 transmits an identification alignment signal to the binding head device 2, and the binding head device 2 correspondingly attaches the circular mounting element to the first mounting position, completing one mounting.

[0084] Further, in step S3, the upper-view positioning device 3 performs second identification on the upper-view alignment portion 133 and the support portion 132, and the specific steps are as follows: the support portion 132 is provided with two first through holes 1321, the first through holes 1321 are symmetrically distributed on the two sides of the upper-view alignment portion 133, the base carrying table 12 is provided with a second through hole, and the first through hole 1321, the second through hole and the hollow channel are sequentially connected; the inner wall surface of the first through hole 1321 has a second identification point 103, after the upper-view positioning device 3 positions the second identification point 103, the second mounting position on the side of the mounting portion 131 facing the binding head device 2 is determined in combination with the first identification point 102; the binding head device 2 correspondingly attaches the non-circular mounting element to the second mounting position.

[0085] It should be noted that the two first through holes 1321 on the support portion 132 are symmetrically distributed, the inner wall surface of the first through hole 1321 has the second identification point 103, and the second mounting position on the circular mounting element can be accurately determined in combination with the first identification point 102, thereby meeting the high-precision requirements of the non-circular mounting element on the mounting position and the orientation, and improving the mounting accuracy of the non-circular mounting element.

[0086] In step S3, the binding head device 2 correspondingly attaches the non-circular mounting element to the mounting portion 131, and the specific steps are as follows: The base carrying device 1 moves the mounting base 13 to the top of the upper view positioning device 3 by moving the carrying platform 101 along the X and Y axes, so that the upper view alignment part 133 and the supporting part 132 enter the identification area of the upper view positioning device 3; since the first through hole 1321, the second through hole and the hollow channel are sequentially communicated, the working end of the upper view positioning device 3 can directly identify the second identification point 103 on the inner wall surface of the first through hole 1321, and the first through hole 1321 is symmetrically distributed on both sides of the upper view alignment part 133; after identifying two symmetric second identification points 103, a median line of the straight line connecting the two second identification points 103 is obtained, the median line intersects with the first identification point 102, and the second mounting position of the upper side of the circular mounting element facing the mounting head device 2 is determined, that is, the mounting direction of the non-circular mounting element can be determined; the upper view positioning device 3 transmits an identification alignment signal to the mounting head device 2, the mounting head device 2 correspondingly mounts the non-circular mounting element to the second mounting position, and one mounting is completed.

[0087] In some embodiments, the die bonding device 100 further comprises a base baking device; after the mounting head device 2 correspondingly mounts the mounting element to the mounting part 131, the base baking device performs baking treatment on the mounting base 13.

[0088] In the die bonding method provided by the embodiment of the present application, after the mounting head device 2 correspondingly mounts the mounting element to the mounting part 131, the base baking device performs baking treatment on the mounting base 13, which can promote the curing of the glue material used in the mounting process, enhance the bonding strength between the mounting element and the mounting part 131 and between the mounting elements, reduce the risk of falling off of the mounting element after packaging, and ensure the stability of the chip packaging.

[0089] It should be noted that the baking treatment is integrated into the die bonding process, and the mounting base 13 does not need to be transferred to an external device, thereby shortening the process interval and improving the overall coherence and production efficiency of the die bonding process. In the embodiment of the present application, the baking treatment is performed once every time the mounting head device 2 correspondingly mounts the mounting element to the mounting part 131.

[0090] The above describes in detail a die bonding device and method disclosed by the embodiment of the present application, and the principles and implementation manners of the present application are described by applying specific examples. The above embodiment is only used to help understand the method of the present application and its core idea. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and application range can be changed, and the above description should not be understood as a limitation of the present application. Any modification, equivalent replacement and improvement within the principles of the present application should be included in the protection scope of the present application.

Claims

1. A die bonding device for implementing chip packaging on a mounting base, wherein the mounting base comprises a mounting portion, a supporting portion, and an upward-looking alignment portion connected in sequence, characterized in that: The die bonding equipment includes a carrying platform and a base carrying device, a mounting head device and an upward positioning device installed on the carrying platform; the base carrying device moves along the X and Y axis directions on the carrying platform, and the mounting head device moves above the base carrying device along the X, Y and Z axis directions; the base carrying device is provided with a hollow channel in the vertical direction, and the upward positioning device moves along the Z axis direction in the hollow channel; the mounting head device is provided with a downward positioning module; The base bearing device is provided with a base bearing platform for placing the placement base. When the placement base is placed on the base bearing platform, the support portion is detachably fixed to the base bearing platform. The placement portion is located on a side close to the placement head binding device, and the upward-looking alignment portion is located on a side close to the upward-looking positioning device. When the base bearing device moves, the base bearing platform and the placement base move synchronously, so that the upward-looking alignment portion and the support portion enter the recognition area of ​​the upward-looking positioning device. The upward positioning device can identify the upward alignment portion and the supporting portion, perform bottom visual positioning on the mounting base, and transmit the identification alignment signal to the mounting head binding device. The mounting head binding device mounts the circular or non-circular mounting component to the mounting portion based on the identification alignment signal of the bottom visual positioning.

2. The die bonding device according to claim 1, wherein: The upward-view alignment portion is cylindrical in shape, and a surface of the upward-view alignment portion facing the working end of the upward-view positioning device is circular; a first identification point is provided on a side of the upward-view alignment portion facing the upward-view positioning device, and a first mounting position is provided on a side of the mounting portion facing the mounting head-binding device, wherein the first identification point corresponds to the first mounting position; After the upward positioning device locates the first identification point, the mounting head binding device mounts the circular mounting component to the first mounting position accordingly.

3. The die bonding device according to claim 2, wherein: The support portion is provided with two first through holes, which are symmetrically distributed on both sides of the top-view alignment portion; the base supporting platform is provided with a second through hole, and the first through hole, the second through hole and the hollow channel are connected in sequence; The inner wall surface of the first through hole has a second identification point. After the upward positioning device locates the second identification point, it determines the second mounting position of the circular mounting component on the side facing the mounting head device in combination with the first identification point; the mounting head device mounts the non-circular mounting component to the corresponding second mounting position.

4. The die bonding device according to claim 3, wherein: The base bearing platform is detachably mounted on the base bearing device, and a limiting assembly is provided on the base bearing platform, and the limiting assembly includes a first limiting member and a second limiting member; The first limiting member and the second limiting member are closely arranged on the side of the supporting portion, and the first limiting member and the second limiting member are arranged opposite to each other to detachably fix the mounting base to the base supporting platform.

5. The die bonding device according to claim 3, wherein: The downward-looking positioning module is installed on the side of the head-binding device; The mounting head binding device is further provided with a height measuring module, which is used to detect the flatness of the mounting components on the mounting portion. The height measuring module is installed on the side of the mounting head binding device or the side of the downward-looking positioning module. The downward-looking positioning module and the height measuring module are arranged close to the working end of the mounting and binding device, and move synchronously with the mounting and binding device.

6. The die bonding device according to claim 3, wherein: The die bonding equipment further comprises a material table device and a nozzle rack device mounted on the carrying platform, wherein the material table device is used to store the mounting components, and the nozzle rack is used to store the nozzles; The material table device is located between the base bearing device and the nozzle frame device, and the working end of the mounting head binding device cooperates with the material table device and the nozzle frame device respectively.

7. The die bonding device according to claim 5 or 6, wherein: The mounting head binding device is provided with a glue drawing module, and the glue drawing module moves synchronously with the mounting head binding device; and / or the die bonding equipment further includes a glue dipping device installed on the carrying platform, and the glue dipping device is close to the base carrying device.

8. The die bonding device according to claim 7, wherein: After the upward-looking positioning device identifies the upward-looking alignment portion and the supporting portion, the mounting head binding device first mounts the circular mounting component to the first mounting position, and then mounts the non-circular mounting component to the second mounting position. The circular mounting component includes a ceramic part, and the non-circular mounting component includes a substrate and a chip bonded to the substrate. The substrate has a bonding position for the downward-looking positioning module to perform top recognition and positioning.

9. A die bonding method, applied to the die bonding device according to any one of claims 1 to 8, characterized in that: The die bonding method comprises the following steps: Providing the mounting base and mounting components, wherein the shapes of the mounting components include circular and non-circular; After the upward positioning device recognizes the upward alignment portion for the first time, the mounting head binding device applies glue or dips glue on the mounting portion and mounts the circular mounting component to the mounting portion accordingly; After the mounting head binding device applies glue or dips glue to the circular mounting component, the upward-view positioning device performs a second recognition on the upward-view alignment portion and the supporting portion, and the mounting head binding device mounts the non-circular mounting component to the mounting portion accordingly, and the mounting components on the mounting portion are stacked; After the mounting head binding device applies glue or dips glue on the non-circular mounting component, the downward positioning module identifies the non-circular mounting component for the third time, and the mounting head binding device mounts another non-circular mounting component to the mounting portion.

10. The die bonding method according to claim 9, wherein: The crystal bonding equipment further includes a susceptor baking device; After the mounting head binding device mounts the mounting components to the mounting portion, the base baking device bakes the mounting base.

Images