Correction method and device, storage medium and program product

Abstract

The invention discloses a correction method and device, a storage medium and a program product, relates to the technical field of material processing, and is used for improving the accuracy and stability of operation parameter control in the execution process of to-be-executed operation. The method comprises the steps of obtaining a target parameter curve of a to-be-executed operation, wherein the target parameter curve comprises target parameter values corresponding to operation parameters of the to-be-executed operation at at least two time points; in response to the target parameter curve, executing the to-be-executed operation to obtain a first response parameter curve; determining a first transfer model, wherein the first transfer model is associated with the target parameter curve and the first response parameter curve; based on the first transfer model, correcting the target parameter curve to obtain a corrected target parameter curve; and in response to the corrected target parameter curve, executing the to-be-executed operation to obtain a second response parameter curve.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of material processing, and in particular to a correction method and device, a storage medium, and a program product. BACKGROUND

[0002] Rapid thermal processing (RTP) is a heat treatment technology in semiconductor manufacturing processes, which can achieve ultra-fast temperature rise and fall through high-precision transient thermal control. Based on the rapid thermal processing technology, the semiconductor material can experience a high temperature stage in a short time, thereby achieving core process objectives such as defect repair, impurity activation, and thin film growth. Among them, the thermal budget is a key control parameter of the rapid thermal processing technology, and accurate control of the thermal budget is crucial for maintaining the quality and performance of semiconductor manufacturing. The change of the thermal budget has a significant impact on the final process results of the rapid thermal processing. In the rapid thermal processing technology, the thermal budget is mainly composed of heating rate, annealing temperature, annealing time, and cooling rate, etc. Therefore, accurate temperature control needs to be achieved during the rapid thermal processing process to achieve the set process target. SUMMARY

[0003] The present application discloses a correction method, device, storage medium, and program product, which are used to improve the accuracy and stability of operation parameter control.

[0004] In a first aspect, the present application provides a correction method, which comprises: obtaining a target parameter curve of an operation to be performed, the target parameter curve comprising target parameter values corresponding to operation parameters of the operation to be performed at at least two time points; performing the operation to be performed in response to the target parameter curve to obtain a first response parameter curve; determining a first transfer model, the first transfer model being associated with the target parameter curve and the first response parameter curve; correcting the target parameter curve based on the first transfer model to obtain a corrected target parameter curve; performing the operation to be performed in response to the corrected target parameter curve to obtain a second response parameter curve; and wherein a difference between a parameter value corresponding to a first time point in the second response parameter curve and a first target parameter value is less than a difference between a parameter value corresponding to the first time point in the first response parameter curve and the first target parameter value, the first target parameter value being a target parameter value corresponding to the first time point in the target parameter curve, and the first time point being any one of the at least two time points.

[0005] Based on the above technical solution, the target parameter curve can be corrected based on the target parameter curve of the to-be-executed operation and the first response parameter curve, so that the second response parameter curve obtained based on the corrected target parameter curve is closer to the execution target of the to-be-executed operation, that is, the execution result of the to-be-executed operation can be more matched with the target parameter curve. In this way, the accuracy and stability of the operation parameter control in the execution process of the to-be-executed operation can be improved. Taking the to-be-executed operation as a rapid thermal processing operation in the field of semiconductor technology as an example, based on the technical solution provided in the present application, the response curve of the corrected target temperature curve can be closer to the temperature target of the rapid thermal processing, so as to realize more accurate temperature control. Moreover, based on the above technical solution, the execution equipment of the to-be-executed operation can reduce the interference of the equipment state by itself, and has the ability to match the target parameter curve through the correction process of the scheme in different equipment states, thereby enhancing the process stability of the to-be-executed operation to ensure the process maturity and replicability of the to-be-executed operation. Taking the to-be-executed operation as a rapid thermal processing operation in the field of semiconductor technology as an example, based on the above technical solution, the rapid thermal annealing equipment used in the rapid thermal processing process can have the ability to match the target temperature curve, thereby ensuring the maturity and replicability of the rapid thermal processing process. In addition, in the technical solution, the target parameter curve can be corrected based on the target parameter curve and the first response parameter curve, and the correction process can be adapted to the actual target parameter curve corresponding to different to-be-executed operations, so that the above technical solution can be applicable to different target parameter curves, and has high flexibility.

[0006] In a possible implementation manner of the first aspect, the method further includes: determining, according to the target parameter curve, a ideal parameter curve obtained by executing the to-be-executed operation in an ideal execution state. The first transfer model is determined according to the target parameter curve, the ideal parameter curve and the first response parameter curve. In the possible implementation manner, the first transfer model can be determined in combination with the ideal parameter curve, the target parameter curve and the first response parameter curve of the to-be-executed operation. The ideal parameter curve refers to the expected response in the ideal execution state, that is, the theoretical target of the to-be-executed operation. In combination with the ideal parameter curve, the difference between the current equipment response and the correction target that can be achieved by the equipment can be more accurately analyzed, so that the first transfer model determined can correct the target parameter curve within a reasonable range, thereby improving the feasibility of correction.

[0007] In a possible implementation manner of the first aspect, the first transfer model is determined according to the target parameter curve, the ideal parameter curve, and the first response parameter curve, including: determining a dynamic response characteristic of the to-be-executed operation according to the target parameter curve and the first response parameter curve; determining an ideal dynamic characteristic of the to-be-executed operation according to the target parameter curve and the ideal parameter curve, where the ideal dynamic characteristic is used to reflect an ideal response state of the to-be-executed operation to the target parameter curve; and determining the first transfer model according to the dynamic response characteristic and the ideal dynamic characteristic.

[0008] In a possible implementation manner of the first aspect, the dynamic response characteristic of the to-be-executed operation is determined according to the target parameter curve and the first response parameter curve, including: constructing a second transfer model according to a transfer relationship from the target parameter curve to the first response curve, where the second transfer model is used to reflect the dynamic response characteristic. In the possible implementation manner, a closed-loop model for describing a closed-loop dynamic characteristic of an execution device of the to-be-executed operation in a case where no correction is performed, that is, the second transfer model, can be established based on a dynamic relationship between the first response parameter curve and the target parameter curve, so that the response of the to-be-executed operation in the case where no correction is performed can be more accurately reflected, and the accuracy of the correction is further improved.

[0009] In a possible implementation manner of the first aspect, the ideal dynamic characteristic of the to-be-executed operation is determined according to the target parameter curve and the ideal parameter curve, including: constructing a third transfer model according to a transfer relationship from the target parameter curve to the ideal parameter curve, where the third transfer model is used to reflect the ideal dynamic characteristic. In the possible implementation manner, a closed-loop model for describing a closed-loop dynamic characteristic of an execution device of the to-be-executed operation in a case where an ideal response is performed, that is, the third transfer model, can be established based on a dynamic relationship between the ideal parameter curve and the target parameter curve, so that the ideal response of the to-be-executed operation can be more accurately reflected, and the accuracy of the correction is further improved.

[0010] In a possible implementation manner of the first aspect, the first transfer model is generated according to the dynamic response characteristic and the ideal dynamic characteristic, including: constructing the first transfer model according to the second transfer model and the third transfer model. In the possible implementation manner, a mapping relationship between the second transfer model and the third transfer model can be constructed.

[0011] In a possible implementation of the first aspect, the method further includes: encapsulating the configuration parameter of the first transfer model into a configuration file of an execution device that performs the operation. In this way, the correction module for correction does not need additional computing resources, and the management of the correction module can be implemented through the configuration management of the configuration file of the execution device, so that the correction module can be lightweight and diversified. For example, the correction module can be modified, added or deleted through overloading, and read-write update can be implemented without relying on software and hardware upgrade actions.

[0012] In a possible implementation of the first aspect, the target parameter curve includes any one of the following: a temperature curve, a liquid level curve, a gas pressure curve, or a flow rate curve. In this way, the technical solution of the present application can be applied to various different target parameter curves, and has high flexibility.

[0013] In a second aspect, a correction device is provided, which includes: an acquisition module, configured to acquire a target parameter curve of an operation to be performed, the target parameter curve including target parameter values corresponding to operation parameters of the operation to be performed at at least two time points; an execution module, configured to perform the operation to be performed to obtain a first response parameter curve in response to the target parameter curve; a determination module, configured to determine a first transfer model associated with the target parameter curve and the first response parameter curve; a correction module, configured to correct the target parameter curve based on the first transfer model to obtain a corrected target parameter curve; and the execution module is further configured to perform the operation to be performed to obtain a second response parameter curve in response to the corrected target parameter curve; wherein a difference between a parameter value corresponding to a first time point in the second response parameter curve and a first target parameter value is less than a difference between a parameter value corresponding to the first time point in the first response parameter curve and the first target parameter value, and the first target parameter value is a target parameter value corresponding to the first time point in the target parameter curve, and the first time point belongs to any one of the at least two time points.

[0014] In a possible implementation of the second aspect, the determination module is specifically configured to: determine an ideal parameter curve obtained by performing the operation to be performed in an ideal execution state according to the target parameter curve; and determine the first transfer model according to the target parameter curve, the ideal parameter curve, and the first response parameter curve.

[0015] In a possible implementation of the second aspect, the determination module is specifically configured to: determine a dynamic response feature of the operation to be performed according to the target parameter curve and the first response parameter curve; determine an ideal dynamic feature of the operation to be performed according to the target parameter curve and the ideal parameter curve, wherein the ideal dynamic feature is used to reflect an ideal response state of the operation to be performed to the target parameter curve; and determine the first transfer model according to the dynamic response feature and the ideal dynamic feature.

[0016] In a possible implementation manner of the second aspect, the determining module is specifically configured to: construct a second transfer model according to a transfer relationship from the target parameter curve to the first response curve; and wherein the second transfer model is used to reflect the dynamic response characteristic.

[0017] In a possible implementation manner of the second aspect, the correcting module is specifically configured to: determine the ideal dynamic characteristic of the to-be-executed operation according to the target parameter curve and the ideal parameter curve, including: constructing a third transfer model according to a transfer relationship from the target parameter curve to the ideal parameter curve; and wherein the third transfer model is used to reflect the ideal dynamic characteristic.

[0018] In a possible implementation manner of the second aspect, the determining module is specifically configured to: generate the first transfer model according to the dynamic response characteristic and the ideal dynamic characteristic, including: constructing the first transfer model according to the second transfer model and the third transfer model.

[0019] In a possible implementation manner of the second aspect, the storage module is configured to encapsulate a configuration parameter of the first transfer model into a configuration file of an execution device of the to-be-executed operation.

[0020] In a possible implementation manner of the second aspect, the target parameter curve includes any one of the following: a temperature curve, a liquid level curve, a gas pressure curve or a flow rate curve.

[0021] In a possible implementation manner of the third aspect, the correcting device includes: a processor and a memory; the memory is used to store computer instructions, when the processor executes the instructions, so as to make the correcting device execute the correcting method in any possible design of the first aspect.

[0022] In some possible designs, the correcting device can include: a processor and a communication interface; the communication interface is used to communicate with a module outside the correcting device; and the processor is used to execute computer programs or instructions, so as to make the correcting device execute the correcting method in any possible design of the first aspect.

[0023] In a possible implementation manner of the fourth aspect, the computer readable storage medium stores computer instructions, when the computer instructions run on a computer, so as to make the computer execute the correcting method in any possible design of the first aspect.

[0024] In a possible implementation manner of the fifth aspect, the computer program product includes computer instructions, when the computer instructions run on a computer, so as to make the computer execute the correcting method in any possible design of the first aspect.

[0025] In a sixth aspect, the present application provides a chip, comprising: a processor configured to execute instructions to cause an apparatus comprising the chip to perform the correction method in any possible implementation of the first aspect.

[0026] In a possible implementation of the sixth aspect, the chip further comprises a memory configured to store the instructions.

[0027] The technical effects brought by the possible implementation of the second aspect to the sixth aspect can refer to the technical effects brought by the first aspect and the possible implementation of the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only some of the embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0029] Figure 1 A schematic diagram of a rapid thermal processing system provided by an embodiment of the present application;

[0030] Figure 2 A schematic diagram of a rapid thermal processing process provided by an embodiment of the present application;

[0031] Figure 3 A structural schematic diagram of a correction apparatus provided by an embodiment of the present application;

[0032] Figure 4 A flowchart of a correction method provided by an embodiment of the present application;

[0033] Figure 5 A composition schematic diagram of a correction apparatus provided by an embodiment of the present application. DETAILED DESCRIPTION

[0034] The technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application.

[0035] At present, in the rapid thermal processing process, a temperature control method based on a segmented temperature curve smoothing coefficient can be used. The method realizes local shape correction of the temperature curve by manually adjusting the preset combination of parameters such as the ramp rate, the temperature gradient threshold and the like in the process menu through artificial iteration. However, this method needs to carry out multi-parameter joint debugging under the framework of a benchmark proportional-integral-derivative (PID) controller, and the entire adjustment process is extremely tedious, a large number of orthogonal tests are also needed to determine the optimal parameter set, the calculation amount is large, the efficiency is low, and the trial and error cost is high. Moreover, for non-standard temperature curve configurations (such as multi-stage slopes, nonlinear dwell segments, etc.), it is difficult to achieve effective fitting through limited parameter adjustment, and the temperature control effect is poor.

[0036] The present application provides a correction method, which comprises: obtaining a target parameter curve of a to-be-executed operation, the target parameter curve comprising target parameter values corresponding to operation parameters of the to-be-executed operation at at least two time points; in response to the target parameter curve, executing the to-be-executed operation to obtain a first response parameter curve; determining a first transfer model associated with the target parameter curve and the first response parameter curve; based on the first transfer model, correcting the target parameter curve to obtain a corrected target parameter curve; in response to the corrected target parameter curve, executing the to-be-executed operation to obtain a second response parameter curve; wherein the difference between the parameter value corresponding to the first time point in the second response parameter curve and the first target parameter value is less than the difference between the parameter value corresponding to the first time point in the first response parameter curve and the first target parameter value, and the first target parameter value is the target parameter value corresponding to the first time point in the target parameter curve, and the first time point belongs to any one of the at least two time points.

[0037] Based on the correction method, the target parameter curve can be corrected based on the target parameter curve of the to-be-executed operation and the first response parameter curve, so that the second response parameter curve obtained based on the corrected target parameter curve is closer to the execution target of the to-be-executed operation, that is, the execution result of the to-be-executed operation can be more matched with the target parameter curve. In this way, the accuracy and stability of the control of the operation parameter in the execution process of the to-be-executed operation can be improved. Moreover, based on the above technical solution, the execution device of the to-be-executed operation can reduce the interference of the device state by itself, and has the ability to match the target parameter curve through the correction process of the scheme in different device states, thereby enhancing the process stability of the to-be-executed operation to ensure the process maturity and replicability of the to-be-executed operation. In addition, in the technical solution, the target parameter curve can be corrected based on the target parameter curve and the first response parameter curve, and the correction process can be adapted to the actual target parameter curve corresponding to different to-be-executed operations, so that the above technical solution can be applied to different target parameter curves, and has high flexibility.

[0038] For example, taking the rapid thermal processing operation as an example, based on the correction method, the response curve of the corrected target temperature curve is closer to the temperature target of the rapid thermal processing, and is more matched with the target temperature curve of the rapid thermal processing, so that more accurate temperature control is realized. Compared with the temperature control method of enhancing the response characteristics of the system by establishing a complex thermodynamic model by using other control algorithms (such as model predictive control, adaptive fuzzy control, etc.), the correction method provided in the embodiments of the present application does not involve deep modification of the underlying control architecture, and does not need to redesign the hardware control system. The lightweight and diversified configuration of the correction module can be realized. For example, the correction module can be modified, added or deleted, etc. The read and write update can be realized without relying on software and hardware upgrade actions, and the maintenance cost is low. Moreover, based on the above correction method, the rapid thermal annealing equipment used in the rapid thermal processing process can have the ability to match the target temperature curve, thereby ensuring the maturity and reproducibility of the rapid thermal processing process.

[0039] The technical solutions provided in the embodiments of the present application will be described below with reference to the accompanying drawings of the specification.

[0040] For example, taking the rapid thermal processing operation as an example, as shown in Figure 1 , a rapid thermal processing system provided by an embodiment of the present application. Wherein, the rapid thermal processing system 100 includes RTP chamber 1, power drive module 2, host computer 3 and lower computer 4.

[0041] Wherein, RTP chamber 1 refers to a closed reaction space for rapid thermal processing process. In RTP chamber 1, through radiation heating (such as halogen lamp, laser, etc.), precise temperature control, annealing, oxidation, doping, thin film deposition post-processing and other key processes of semiconductor wafer can be completed.

[0042] As shown in Figure 1 , RTP chamber 1 can include heating module 11 and temperature detection module 12.

[0043] The heating module 11 is the main heating source in the RTP chamber 1, which can heat the process materials (such as semiconductor wafers) in the RTP chamber 1 by emitting heat. The heating module 11 can be a halogen lamp array, a laser array, a plasma, etc. which can perform heating treatment.

[0044] The temperature detection module 12 is used to detect the temperature of the process materials in the RTP chamber 1 in real time. For example, the temperature detection module 12 can obtain wafer surface temperature data in real time and accurately through non-contact optical temperature measurement technology, and feed back the collected temperature data to the lower computer 4. The temperature detection module 12 can be a thermometer or a fiber-optic temperature sensor.

[0045] Optionally, the rapid thermal processing system 100 can further include a temperature processing module 13, the temperature detection module 12 is connected with the temperature processing module 13, the temperature processing module 13 is used for processing and analyzing the temperature data detected by the temperature detection module 12, and providing data support for temperature control of the system, and the temperature data after processing and analysis can be fed back to the lower computer 4. For example, the temperature processing module 13 can be a high-precision temperature acquisition and processing module, which can process and analyze the temperature data with high precision.

[0046] The power driving module 2 can be connected with the lower computer 4 (for example, connected with the control module 41 in the lower computer 4) and the heating module 11, and is used for controlling the power output of the heating module 11 based on the control signal from the lower computer 4, so as to control the heating speed and temperature of the process material.

[0047] The upper computer 3 is the control center of the rapid thermal processing system, and is responsible for interacting with the user, setting the target process parameters, monitoring the running state of the system, and processing and analyzing the data. For example, the upper computer 3 includes a computer system used for controlling and managing the whole RTP process.

[0048] Optionally, the upper computer 3 can obtain the target process parameters input from the outside, preset in the device, determined based on historical target process parameters, or determined by other possible ways. Therefore, the upper computer 3 can send the obtained target process parameters to the lower computer 4, and the lower computer 4 controls the running of the whole system based on the target process parameters to realize the to-be-executed operation. For example, the upper computer 3 can provide an operation interface, which can display a process menu, obtain the target process parameters of the rapid thermal processing input from the outside on the process menu, such as a target temperature curve (which can include parameters such as a heating rate, a peak temperature, a holding time, a cooling slope, a heating time, etc.), an environmental parameter (such as a chamber pressure, a gas flow), etc. In this way, the upper computer 3 can obtain the target process parameters input from the outside, and the upper computer 3 can also send the target process parameters input from the outside to the lower computer 4, and the lower computer 4 controls the running of the whole system based on the target process parameters to realize the corresponding rapid thermal processing operation.

[0049] The lower computer 4 is a core component for realizing the control of the rapid thermal processing process, and is used for adjusting the state of the device in real time according to the target process parameters sent by the upper computer 3 and according to a preset control algorithm and logic, so as to realize the corresponding rapid thermal processing operation. For example, the lower computer 4 can take a real-time master control service board (RTS) as a hardware carrier, and realize function decoupling and collaborative control through modular design. Optionally, the lower computer 4 can include a real-time system algorithm unit, which can provide algorithm support for the operation of each module in the lower computer 4.

[0050] Optionally, the lower computer 4 may include a control module 41 , a correction module 42 , and a data cache module 43 .

[0051] The control module 41 is used to determine the control signal for the rapid thermal processing process and feed it back to the power driver module 2 to control the power output of the heating module 11 and achieve precise control of the temperature of the process material. In some embodiments, the control module 41 can also compare the temperature data collected in real time by the temperature detection module 12 with a pre-set target temperature curve to determine the corresponding control signal and feed it back to the power driver module 2.

[0052] The correction module 42 is used to correct the target temperature curve of the rapid thermal processing system so that the response temperature curve obtained based on the corrected target temperature curve better matches the pre-set target parameter curve, thereby improving the accuracy and stability of temperature control during the rapid thermal processing process.

[0053] For example, Figure 2 As shown, when the rapid thermal processing system starts to perform rapid thermal processing, it can first obtain the target temperature curve, and then determine the first transfer model through the correction module in combination with the first response temperature curve and the target temperature curve, and then correct the target temperature curve in combination with the first transfer model to obtain a corrected target temperature curve, and then implement the corrected rapid thermal processing process based on the corrected target temperature curve through the execution module.

[0054] like Figure 1 As shown, the data cache module 43 can be used to store temperature data and control information over a period of time, providing historical data reference for determining the control signal. Exemplarily, the data stored in the data cache module 43 can provide historical data reference for correction calculation to determine a more accurate control signal.

[0055] It should be noted that the drawings provided above are for illustrative purposes only. The number of modules or devices included in the drawings and the names of the modules or devices are not restricted. In addition to the modules or devices illustrated above, other modules or devices may also be included, such as a gas control module, a communication module, etc.

[0056] In some embodiments, the above-mentioned rapid thermal processing system introduction is only an exemplary description. The correction method provided in the embodiment of the present application can also be applied to other possible scenarios. For example, the operation to be performed can be a slower heating operation, and the corresponding target parameter curve can also include a temperature curve. For another example, the operation to be performed can be an operation in a semiconductor wet etching process, and the corresponding target parameter curve can include a liquid level curve. For another example, the operation to be performed can also be a vacuum heat treatment operation, and the corresponding target parameter curve can include an air pressure curve. For another example, the operation to be performed can also be a pipeline transportation operation, and the corresponding target parameter curve can include a flow rate curve. Among them, the operation to be performed in the embodiment of the present application can also be other possible operations, which are not listed here one by one. Of course, the above-mentioned correction method can also be applied to the scenarios corresponding to these possible operations, and the present application does not limit this.

[0057] It should be noted that the application scenarios of the embodiments of the present application are not limited. The system architecture and business scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of related technologies and the emergence of new business scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.

[0058] In some embodiments, the embodiments of the present application further provide a correction device, which is used in the correction method provided in the embodiments of the present application, and can be an electronic device with data processing capabilities. Exemplarily, the correction device can be a device for executing the operation to be executed in the embodiments of the present application, or the correction device can be a functional module of the device such as a correction module, or the correction device can be any computing device connected to the device, etc., and the embodiments of the present application are not limited to this. Exemplarily, taking the operation to be executed as a rapid thermal processing operation as an example, the correction device is a device for performing rapid thermal processing, and the device can include the above-mentioned rapid thermal processing system 100, or the correction device can be the correction module 42 in the above-mentioned rapid thermal processing system 100. Of course, the correction device can also include other possible modules such as the control module 41, etc., which will not be repeated.

[0059] like Figure 3 , which is a schematic structural diagram of a correction device 300 provided in an embodiment of the present application.

[0060] like Figure 3 As shown, the correction device 300 includes a processor 310 , a communication circuit 320 and a communication interface 330 .

[0061] Optionally, the correction device 300 can further include a memory 340. The processor 310, the memory 340 and the communication interface 330 can be connected through a communication line 320.

[0062] The processor 310 can be a central processing unit (CPU), a general processor network processor (NP), a digital signal processing (DSP), a microprocessor, a microcontroller, a programmable logic device (PLD), or any combination thereof. The processor 310 can also be any other device with processing function, such as a circuit, a device, or a software module, without limitation.

[0063] In an example, the processor 310 can include one or more CPUs, such as CPU0 and CPU1 in Figure 3 .

[0064] As an optional implementation, the correction device 300 includes multiple processors, for example, in addition to the processor 310, the correction device 300 can further include a processor 370. The communication line 320 is used to transmit information between the components included in the correction device 300.

[0065] The communication interface 330 is used to communicate with other devices or other communication networks. The other communication network can be an Ethernet, a radio access network (RAN), a wireless local area network (WLAN), etc. The communication interface 330 can be a module, a circuit, a transceiver, or any device capable of communication.

[0066] The memory 340 is used to store instructions. The instructions can be a computer program.

[0067] Among them, the memory 340 can be a read-only memory (ROM) or other types of static storage devices that can store static information and / or instructions, or a random access memory (RAM) or other types of dynamic storage devices that can store information and / or instructions, or an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compact disc, laser disc, optical disc, digital versatile disc, Blu-ray disc, etc.), magnetic disk storage media or other magnetic storage devices, etc., without limitation.

[0068] It should be noted that the memory 340 can exist independently of the processor 310 or can be integrated with the processor 310. The memory 340 can be used to store instructions, program codes, or some data. The memory 340 can be located within the correction device 300 or outside the correction device 300, without limitation.

[0069] Processor 310 is configured to execute instructions stored in memory 340 to implement the correction method provided in the following embodiments of this application. For example, when correction device 300 is a terminal or a chip or system-on-chip in the terminal, processor 310 may execute instructions stored in memory 340 to implement the correction method provided in this application.

[0070] As an optional implementation, correction device 300 further includes an output device 350 and an input device 360. Output device 350 can be a device such as a display screen or a speaker that can output data from correction device 300 to a user. Input device 360 ​​can be a device such as a keyboard, a mouse, a microphone, or a joystick that can input data into correction device 300.

[0071] It is understandable that Figure 3 The illustrated structure does not constitute a specific limitation on the correction device. For example, in other embodiments of the present application, the correction device may include more or fewer components than illustrated, or may combine or separate certain components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0072] It can be understood that, in the embodiments of the present application, the correction device is used to execute part or all of the steps in the embodiments of the present application, and these steps or operations are only examples, and the embodiments of the present application can also execute other operations or various modifications of the operations. In addition, the various steps can be executed in different orders as presented in the embodiments of the present application, and it is possible that not all the operations in the embodiments of the present application are executed.

[0073] The correction method of the present application will be specifically introduced below in combination with the drawings of the specification.

[0074] As shown in the embodiments of the present application, a correction method is provided, which can be executed by a correction device. The method comprises: Figure 4

[0075] S101, obtaining a target parameter curve of an operation to be executed.

[0076] The target parameter curve comprises target parameter values corresponding to the operation parameter of the operation to be executed at at least two time points. That is, the target parameter curve comprises target parameter values corresponding to the operation parameter of the operation to be executed at different time points. It can be seen that the target parameter curve can be understood as a target change condition describing the change of the operation parameter of the operation to be executed with time, and can be used as a control target in the dynamic process of executing the operation to be executed. Optionally, the target parameter curve can be a discrete time-parameter value set, or a continuous mathematical function.

[0077] It should be understood that the target parameter curve is only an example of naming, and it can also be called a process menu target curve, a set parameter curve, a target process curve, and other names with the same or similar meanings, which are not limited in the present application.

[0078] The operation parameter refers to a physical quantity or variable that needs to be directly adjusted in the process of executing the operation to be executed, and can also be called a key parameter of the operation to be executed. The value of the operation parameter can directly affect the dynamic behavior and output response of the device or equipment executing the operation to be executed, and is the core control object for realizing the matching of the target parameter curve.

[0079] Optionally, the target parameter curve comprises any one of the following: a temperature curve, a liquid level curve, a gas pressure curve, or a flow rate curve. Correspondingly, the operation parameter can comprise temperature, liquid level, gas pressure, or flow rate. The target parameter curve can also have multiple curve types, for example, the temperature curve of a rapid thermal processing operation can comprise a "spike" type annealing temperature curve, an "immersion" type annealing temperature curve, etc., and the rapid thermal processing equipment can execute the rapid thermal processing with the temperature curve as the target parameter curve. Based on the "spike" type annealing temperature curve, the rapid thermal processing process has a short holding time at the peak temperature and is rapidly cooled. Based on the "immersion" type annealing temperature curve, the rapid thermal processing process is slowly heated to a high temperature and can maintain the high temperature for a long time.​

[0080] In some embodiments, the correction device obtains a target process parameter corresponding to the to-be-executed operation, and determines the target parameter curve based on the target process parameter.

[0081] For example, the target process parameter corresponding to the to-be-executed operation can be externally input, preset in the device, determined based on historical target process parameters, or determined by other possible manners. The target process parameter corresponding to the to-be-executed operation can include a target parameter curve, an environmental parameter, etc.

[0082] For example, when the to-be-executed operation starts to be executed, the correction device can first obtain the target process parameter externally input through a process menu displayed on the operation interface. In an example, the correction device can obtain, on the process menu, a process type, a material type, an operation parameter (e.g., a temperature value), a key point in a time coordinate system, a parameter value rising rate, a peak parameter value, a parameter value falling time, a parameter value falling slope, an operation time length, a chamber pressure, a gas flow, a curve type of a target parameter curve, etc. externally input, and then can determine the target process parameter based on these parameters. Thus, the correction device can integrate and analyze the target process parameter input by the user, and generate the target parameter curve in combination with the target process parameter. Taking a rapid thermal processing operation as an example, the correction device can generate the target parameter curve in combination with a target process parameter such as a key point in a temperature-time coordinate system, a temperature rising rate, a peak temperature, a holding time, a temperature falling slope, a heating time length, and a curve type of a target temperature curve (e.g., a “spike” type annealing temperature curve or an “immersion” type annealing temperature curve).

[0083] S102, obtaining a first response parameter curve in response to the target parameter curve.

[0084] The first response parameter curve is used to reflect an actual response of an execution device of the to-be-executed operation to the target parameter curve under an initial execution strategy without correction.

[0085] The execution device of the to-be-executed operation can execute the to-be-executed operation based on the target parameter curve, and periodically or continuously collect parameter values of operation parameters in the process of executing the to-be-executed operation, so that the correction device can generate a curve, i.e., the first response parameter curve, according to the collected parameter values.

[0086] Exemplarily, taking the to-be-executed operation as a rapid thermal processing operation, the rapid thermal processing apparatus can perform the rapid thermal processing operation based on the received target process parameter, wherein the target process parameter comprises a target temperature curve, i.e., a target parameter curve. Further, the rapid thermal processing apparatus can periodically collect the temperature value of the process material in the RTP chamber at a preset frequency during the execution of the rapid thermal processing operation, and generate a curve, i.e., a first response parameter curve, according to the real-time collected temperature value of the process material.

[0087] Optionally, during the obtaining of the first response parameter curve, the pre-processor can be closed.

[0088] Exemplarily, taking the to-be-executed operation as a rapid thermal processing operation, the rapid thermal processing apparatus can close the pre-processor before the execution of the rapid thermal processing operation, and collect the temperature value of the process material based on a reference controller, such as a PID controller, using a non-contact high-precision temperature sensor.

[0089] It should be understood that the pre-processor can be used to perform filtering, smoothing, linearization, etc., which can mask the real device response dynamics. After the pre-processor is closed, the obtained raw data can more truly reflect the actual response of the system, which is helpful for the correction of the first response parameter curve in the present application.

[0090] S103, determining a first transfer model, the first transfer model being associated with the target parameter curve and the first response parameter curve.

[0091] The first transfer model is used to correct the target parameter curve, and can reflect the mapping relationship between the target parameter curve and the first response parameter curve, so as to correct the target parameter curve based on the mapping relationship. In the present application, the first transfer model can also be referred to as a correction module, a correction compensator, etc.

[0092] In some embodiments, the correction device can determine the first transfer model according to the target parameter curve, the ideal parameter curve, and the first response parameter curve.

[0093] Exemplarily, the correction device can determine an ideal parameter curve obtained by executing the to-be-executed operation in an ideal execution state according to the target parameter curve.

[0094] The ideal parameter curve refers to the expected response in the ideal execution state, i.e., the theoretical target of the to-be-executed operation. It is used to reflect the response parameter curve obtained by executing the to-be-executed operation in the ideal execution state. It should be understood that the ideal parameter curve is only an exemplary name, and it can also be referred to as a target process closed-loop temperature curve, an ideal response curve, etc., with the same or similar meanings, which are not limited in the present application.

[0095] For example, the execution device to be executed operation can determine the ideal execution state corresponding to the target parameter curve, such as the corresponding ideal environment parameter, ideal device parameter, etc., based on the target parameter curve, and simulate the response parameter curve obtained by executing the target parameter curve, that is, the ideal parameter curve, based on the ideal execution state.

[0096] It should be understood that the target process parameters adopted by the execution device in determining the ideal parameter curve are the same as the target process parameters adopted in determining the first response parameter curve. Of course, the target parameter curve here is the same as the target parameter curve adopted in determining the first response parameter curve.

[0097] For example, taking a rapid thermal processing operation as an example, a rapid thermal processing model can be established based on the ideal environment and the ideal device state, for example, the delay, heat loss, etc. of the heating assembly of the rapid thermal processing model can be set within the ideal range, and then the target temperature curve is taken as the input, and the rapid thermal processing process with the target temperature curve as the target is simulated based on the rapid thermal processing model, and then the response temperature curve of the thermal processing process is obtained (which can be determined based on the simulation of multiple temperature values-time points), which is the ideal temperature curve of the rapid thermal processing operation, that is, the ideal parameter curve. It should be noted that based on the target parameter curve and the first response parameter curve, in combination with the ideal parameter curve, the difference between the current device response and the correction target that the device can reach can be more accurately analyzed, so that the first transfer model can be corrected within a reasonable range. The target parameter curve improves the feasibility of correction.

[0098] Therefore, the correction device can determine the first transfer model according to the determined ideal correction curve and the target parameter curve and the first response parameter curve. For example, it can be specifically implemented as follows:

[0099] S1, determining the dynamic response characteristics of the to-be-executed operation according to the target parameter curve and the first response parameter curve.

[0100] The dynamic response characteristics refer to the characteristics of the dynamic response process of the execution device to the target parameter curve in the case where no correction is performed, which can reflect the dynamic response of the execution device to the target parameter curve in this case.

[0101] In some embodiments, the correction device can construct a second transfer model according to the transfer relationship from the target parameter curve to the first response curve. The second transfer model is used to reflect the dynamic response characteristics. In this way, the response of the to-be-executed operation without correction can be more accurately reflected, thereby improving the accuracy of correction.

[0102] The transfer model can also be referred to as a transfer function, which is a mathematical model reflecting the dynamic relationship between the input and the output. The second transfer model can be used to reflect the dynamic relationship between the first response parameter curve and the target parameter curve, which is obtained based on the execution device performing the operation without correction. The execution device can output a dynamic response (i.e., the first response parameter curve) that changes over time based on the input target parameter curve, so that the dynamic relationship can also be used to reflect the characteristics of the dynamic response process of the execution device to the target parameter curve in this case.

[0103] For example, the second transfer model G1(s) can be as shown in the following formula (1), which satisfies T set => G1(s) => T self .

[0104]

[0105] where b 1,0 , b 1,1 , b 1,m-1 , b 1,m , etc. are coefficients in the numerator polynomial of G1(s), and a 1,0 , a 1,1 , a 1,n-1 , a 1,n , etc. are coefficients in the denominator polynomial of G1(s). Wherein m, n are non-negative integers. T set is the target parameter curve, T self is the first response parameter curve, => indicates the transfer direction, T set => G1(s) => T self is the transfer from the target parameter curve T set to the first response parameter curve T self through the second transfer model G1(s), that is, the closed-loop response process from the target parameter curve to the first response parameter curve.

[0106] It should be noted that the above transfer process or closed-loop response process generally refers to the dynamic adjustment or dynamic correction process of a system. For example, the input target and the actual output value (response value) can be compared, and an error signal can be generated based on the comparison result, and then the related parameters of the execution device performing the operation, such as the heating power, can be adjusted using the error signal. The above comparison process can be performed at multiple time points in the process of performing the operation at a predetermined frequency, and the error signal obtained is used for dynamic adjustment, so that the output value approaches the input target, thereby forming a closed-loop dynamic balance.

[0107] For example, assuming that the process requirement for a 12-inch wafer is to linearly increase the temperature from 25°C to 1000°C within 30 seconds, a rapid thermal processing operation is performed in response to the target temperature curve, and the sampled temperature values-time points obtained during the rapid thermal processing operation include (25.1°C, 0s), (25.3°C, 0.1s), …, (980.0°C, 29.9s), (980.5°C, 30s). The rapid thermal processing operation performed in response to the target temperature curve is a closed-loop response process, and the G1(s) reflecting the closed-loop response process can be obtained according to the response result. For example, the second transfer function can be fitted by using a least square method, a step response fitting method, an artificial neural network (ANN) identification, or a numerical algorithm for subspace state space system identification (N4SID) according to the target temperature values-time points in the target temperature curve and the sampled temperature values-time points. The rapid thermal processing operation performed in response to the target temperature curve is a closed-loop response process. For example, the second transfer model obtained by using the step response fitting method can be

[0108] S2, determining an ideal dynamic characteristic of the to-be-executed operation according to the target parameter curve and the ideal parameter curve.

[0109] The ideal dynamic characteristic is used to reflect an ideal response state of the to-be-executed operation to the target parameter curve.

[0110] In some embodiments, the correction device can construct a third transfer model according to the transfer relationship from the target parameter curve to the ideal parameter curve. The third transfer model is used to reflect the ideal dynamic characteristic. In this way, the ideal response of the to-be-executed operation can be more accurately reflected, and the accuracy of the correction can be improved.

[0111] The third transfer model can be used to reflect the dynamic relationship between the target parameter curve and the ideal parameter curve, and the dynamic relationship is obtained based on the execution device of the to-be-executed operation in the ideal state. That is, the execution device can output the ideal dynamic response (i.e., the ideal response state) varying with time based on the input target parameter curve in the ideal state, and thus the dynamic relationship can also be used to reflect the characteristics of the ideal response process of the execution device to the target parameter curve in the ideal state.

[0112] For example, the third transfer model G2(s) can be as shown in the following formula (2), and T set => G2(s) => Tcustom .

[0113]

[0114] wherein b 2,0 , b 2,1 , b 2,m-1 , b 2,m , etc. are coefficients in the numerator polynomial of G2(s), and a 2,0 , a 2,1 , a 2,n-1 , a 2,n , etc. are coefficients in the denominator polynomial of G2(s). Wherein m, n are non-negative integers. set is the target parameter curve, T custom is the ideal response curve, => is the transfer direction, T set => G1(s) => T self is the process of transferring from the target parameter curve T set to the ideal parameter curve T custom through the third transfer model G2(s), that is, the closed-loop response process from the target parameter curve to the ideal parameter curve.

[0115] Taking the rapid thermal processing operation as an example, and combining the example of the process requirement temperature of the 12-inch wafer, which is linearly raised from 25°C to 1000°C within 30 seconds, based on the target temperature curve, the corresponding ideal response curve can be determined, wherein based on the target temperature curve, the corresponding ideal response curve can be determined, which is a kind of closed-loop response process, so that G2(s) capable of reflecting the closed-loop response process can be obtained according to the ideal response curve. Further, combining the plurality of target temperature values-time points in the target temperature curve and the plurality of ideal temperature values-time points in the ideal response curve, the third transfer function can be fitted by using the least square method, the step response fitting method, ANN identification, or N4SID system identification method. For example, by using the N4SID method, the third transfer model can be

[0116] S3, determining the first transfer model according to the dynamic response characteristics and the ideal dynamic characteristics.

[0117] In some embodiments, the correction device can construct the first transfer model according to the second transfer model and the third transfer model.

[0118] For example, the first transfer model M(s) can be as shown in the following formula (3), satisfying M(s) = G2(s) / G1(s), that is, satisfying T set => M(s) => G1(s) => T custom .

[0119]

[0120] wherein b 0,0 , b 0,1 , b 0,m-1 , b 0,m , etc. are coefficients in the numerator polynomial of M(s), a 0,0 , a 0,1 , a 0,n-1 , a 0,n , etc. are coefficients in the denominator polynomial of M(s). Wherein m, n are non-negative integers. G2(s) is the third transfer model, G1(s) is the second transfer model, since the first transfer model M(s) = G2(s) / G1(s), G2(s) = M(s) · G1(s) can be obtained, combined with T set = > G2(s) = > T custom , T set = G2(s) · T custom = M(s) · G1(s) · T custom , that is, T set = > M(s) = > G1(s) = > T custom . => means the transfer direction, T set = > M(s) = > G1(s) = > T custom is the target parameter curve T set , through the first transfer model M(s), the second transfer model G1(s) to the ideal parameter curve T custom , that is, the closed loop response process from the target parameter curve to the ideal parameter curve.

[0121] It should be noted that the mapping relationship between the second transfer model and the third transfer model is constructed through the first transfer model, so that the correction of the first transfer model is more suitable for the execution device, so that the response parameter curve obtained based on the target parameter curve corrected by the first transfer model can be closer to the ideal response, that is, the execution target of the to-be-executed operation, thereby improving the accuracy and stability of the operation parameter control in the execution process of the to-be-executed operation.

[0122] Taking the to-be-executed operation as a rapid heat treatment operation as an example, the above and can be obtained

[0123] In some embodiments, the correction device can also perform discrete processing on the dynamic correction parameter.

[0124] Exemplarily, the discretized first transfer model M(z) is shown in the following formula (4), where M(z) can be implemented based on a difference equation, and both m and n are non-negative integers:

[0125]

[0126] In some embodiments, the correction device may use a bilinear transformation method, a zero-order hold method, or a forward / backward difference method to discretize the first transfer model M(z).

[0127] For example, taking bilinear transformation as an example, in the discretization process, the mapping formula of bilinear transformation, that is, the following formula (5), can be used first to replace s in M(s) with Simplify and organize the discretization coefficients a′0, a′1, a′ n-1 , a′ n ,…,b′0,b′1,b′ m-1 , b′ m etc., we can get M(z).

[0128]

[0129] Where T is the sampling period of the discretization process, z refers to the complex variable in the discrete domain (corresponding to M(s)), and s is the complex variable in the continuous domain (corresponding to M(z)).

[0130] For example, if Substituting into the above formula (5) we can get Multiplying the numerator and denominator by (Z+1) yields It can then be written as Among them, the discretization coefficients b′0 = (2b0 + b1T), b′1 = (b1T - 2b0), a′0 = (2a0 + a1T), and a1 = (a1T - 2a0).

[0131] In some embodiments, to reduce the error caused by the differential equation, the correction device may use a high-precision and high-real-time main control service board RTS calculation unit to run the calculation M(z).

[0132] In some embodiments, the discretized M(z) can be expressed as a differential equation: ref (k)+a′1T ref (k-1)+…=b′0R set (k)+b′1T set (k-1)+….

[0133] Among them, T ref Represents the corrected target parameter curve, T ref(k) represents the target parameter value after correction at the current time point k, T ref (k-1) represents the target parameter value after correction at the previous time point (k-1), T set (k) represents the target temperature value before correction at the current time point k, T set (k-1) represents the target temperature value before correction at the previous time point (k-1).

[0134] It should be understood that the discretization coefficients of M(z) obtained may include the above-mentioned a′0, a′1, a′ n-1 , a′ n ,…,b′0,b′1,b′ m-1 , b′ m , so that the correction device can determine the above-mentioned differential equation in combination with these discretization coefficients, and determine the corrected target parameter value corresponding to each time point, so that the corrected target parameter curve can be generated in combination with the corrected target parameter value at each time point.

[0135] It should be noted that discretization is a processing method that converts continuous data or problems into discrete forms, such as the process of converting a continuous-time system into a discrete-time system, so that it can be implemented in a digital controller or computer, thereby adapting the continuous-time signal and algorithm to the hardware environment of discrete sampling and calculation. In this application, the continuous-time transfer function M(s) can be converted into a discrete-time transfer function M(z) for processing and calculation in the control component. In addition, this application can also use a high-precision, high-real-time main control service board RTS calculation unit to run the calculation M(z) to reduce the error caused by the differential equation.

[0136] Taking the operation to be executed as a rapid thermal processing operation as an example, combined with the above Assuming T = 0.1s, we can get The difference equation is 1·T ref (k)-1.817T ref (k-1)+0.825T ref (k-2)…=1.052T set (k)-1.889T set (k-1)+0.852·Tset(k-2).

[0137] Thus, the correction device can combine the differential equation and determine the corrected target temperature value corresponding to each time point, so that the corrected target temperature curve can be generated by combining the corrected target temperature values ​​at each time point.

[0138] Optionally, the correction device can encapsulate the configuration parameters of the correction compensation model in the configuration file of the execution device of the to-be-executed operation. In this way, the correction module does not need additional computing resources, and the management of the correction module can be realized through the configuration management of the configuration file of the execution device, so that the lightweight and diversified configuration of the correction module can be realized. For example, the correction module can be modified, added or deleted through reloading, and read-write update can be realized without relying on software and hardware upgrade actions.

[0139] Optionally, the correction device can cooperate with the reference feedback controller between the correction module and the execution device. In this way, the original controller software architecture of the execution device is not affected, and it is more flexible and convenient.

[0140] S104, in response to the corrected target parameter curve, executing the to-be-executed operation to obtain a second response parameter curve.

[0141] In the second response parameter curve, the difference between the parameter value corresponding to the first time point and the first target parameter value is less than the difference between the parameter value corresponding to the first time point in the first response parameter curve and the first target parameter value, and the first target parameter value is the target parameter value corresponding to the first time point in the target parameter curve. The first time point is any one of the at least two time points. That is, the second response parameter curve obtained after correction matches the target parameter curve more, so as to improve the accuracy of operation parameter control in the execution process of the to-be-executed operation.

[0142] For example, the execution device of the to-be-executed operation can execute the to-be-executed operation based on the corrected target parameter curve, and periodically or continuously collect the parameter value of the operation parameter during the execution of the to-be-executed operation, so that the correction device can generate a curve, i.e. the second response parameter curve, according to the collected parameter value.

[0143] For example, during the execution of the to-be-executed operation by the execution device based on the modified target parameter curve, for the collected parameter value of the operation parameter, the error value between the collected parameter value and the target parameter value corresponding to the same time point in the modified target parameter curve can be used to adjust the control parameter of the execution device, thereby affecting the collected parameter value in the execution process, i.e. affecting the response curve (such as the above-mentioned second response parameter curve) generated based on the collected parameter value, so that the response curve matches the target parameter curve more, thereby improving the accuracy of the execution device in executing the to-be-executed operation.

[0144] For example, taking a rapid thermal processing operation as an example of the to-be-executed operation, the reference feedback controller of the rapid thermal processing device can periodically or continuously collect temperature values during the rapid thermal processing process. For the collected temperature values, the corresponding power value can be determined by using the target temperature value in the corrected target temperature curve corresponding to the same time point as the collected temperature value and the error value between the collected temperature value, and the power value is delivered to the power driving module. The power driving module can combine the configuration of the heating module and the power value to control the heating of the process material in the chamber, thereby affecting the collected temperature values during the rapid thermal processing process, i.e., affecting the response curve generated based on the collected temperature values, so that the response curve is more matched with the target temperature curve, thereby improving the accuracy of executing the rapid thermal processing.

[0145] Based on the technical solutions provided in the present application, the target parameter curve can be corrected based on the target parameter curve of the to-be-executed operation and the first response parameter curve, so that the second response parameter curve obtained based on the corrected target parameter curve is closer to the execution target of the to-be-executed operation, i.e., the execution result of the to-be-executed operation can be more matched with the target parameter curve. In this way, the accuracy and stability of the operation parameter control during the execution of the to-be-executed operation can be improved. Taking a rapid thermal processing operation in the field of semiconductor process as an example of the to-be-executed operation, based on the technical solutions provided in the present application, the response curve of the corrected target temperature curve can be closer to the temperature target of the rapid thermal processing, thereby realizing more accurate temperature control. Moreover, based on the above technical solutions, the execution device of the to-be-executed operation can reduce the interference of the device state by itself, and has the ability to match the target parameter curve through the correction process of the scheme in different device states, thereby enhancing the process stability of the to-be-executed operation to ensure the process maturity and replicability of the to-be-executed operation. Taking a rapid thermal processing operation in the field of semiconductor process as an example of the to-be-executed operation, based on the above technical solutions, the rapid thermal annealing device used in the rapid thermal processing process can have the ability to match the target temperature curve, thereby ensuring the maturity and replicability of the rapid thermal processing process. In addition, in the technical solutions, the target parameter curve can be corrected based on the target parameter curve and the first response parameter curve. The correction process can be adapted to the actual target parameter curve corresponding to different to-be-executed operations, so that the above technical solutions can be applicable to different target parameter curves, and have high flexibility.

[0146] The above mainly introduces the scheme provided by the embodiments of the present application from the method aspect. In order to realize the above functions, it contains the hardware structure and / or software module corresponding to the execution of each function. The technical person skilled in the art should easily realize that, in combination with the units and algorithm steps of each example described in the embodiments disclosed in the present application, the present application can be realized in the form of hardware or the combination of hardware and computer software. Whether a certain function is executed in the form of hardware or computer software driven hardware depends on the specific application and design constraints of the technical scheme. The technical person skilled in the art can use different methods to realize the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0147] The embodiments of the present application can group the functional modules of the correction device and the like according to the above method examples. For example, each functional module can be grouped according to each function, or two or more functions can be integrated in one processing module. The above integrated module can be realized in the form of hardware or in the form of a software functional module. It should be noted that the grouping of modules in the embodiments of the present application is illustrative, and is only a logical grouping. Actual implementation can have another grouping manner.

[0148] Figure 5 Fig. 1 shows a composition schematic diagram of a correction device provided by the embodiments of the present application. As shown in Fig. 1, Figure 5 The correction device 500 can be used to execute the above correction method. As a possible implementation manner, as shown in Fig. 2, Figure 5 The correction device 500 includes an acquisition module 501, an execution module 502, a determination module 503 and a correction module 504. Optionally, the correction device 500 can further include a storage module 505.

[0149] The acquisition module 501 is configured to acquire a target parameter curve of an operation to be executed, the target parameter curve including target parameter values corresponding to operation parameters of the operation to be executed at at least two time points.

[0150] The execution module 502 is configured to execute the operation to be executed to obtain a first response parameter curve in response to the target parameter curve.

[0151] The determination module 503 is configured to determine a first transfer model, the first transfer model being associated with the target parameter curve and the first response parameter curve.

[0152] The correction module 504 is configured to correct the target parameter curve based on the first transfer model to obtain a corrected target parameter curve.

[0153] The execution module 502 is further configured to execute the to-be-executed operation to obtain a second response parameter curve in response to the modified target parameter curve; wherein a difference between a parameter value corresponding to the first time point in the second response parameter curve and the first target parameter value is less than a difference between a parameter value corresponding to the first time point in the first response parameter curve and the first target parameter value, the first target parameter value being a target parameter value corresponding to the first time point in the target parameter curve, and the first time point being any one of the at least two time points.

[0154] As a possible implementation form, the determination module 503 is specifically configured to: determine, according to the target parameter curve, an ideal parameter curve obtained by executing the to-be-executed operation in an ideal execution state; and determine the first transfer model according to the target parameter curve, the ideal parameter curve and the first response parameter curve.

[0155] As a possible implementation form, the determination module 503 is specifically configured to: determine, according to the target parameter curve and the first response parameter curve, a dynamic response feature of the to-be-executed operation; determine, according to the target parameter curve and the ideal parameter curve, an ideal dynamic feature of the to-be-executed operation, wherein the ideal dynamic feature is used to reflect an ideal response state of the to-be-executed operation to the target parameter curve; and determine the first transfer model according to the dynamic response feature and the ideal dynamic feature.

[0156] In some embodiments, the determination module 503 is specifically configured to: construct a second transfer model according to a transfer relationship from the target parameter curve to the first response curve; wherein the second transfer model is used to reflect the dynamic response feature.

[0157] In some embodiments, the modification module 504 is specifically configured to: determine, according to the target parameter curve and the ideal parameter curve, an ideal dynamic feature of the to-be-executed operation, including: constructing a third transfer model according to a transfer relationship from the target parameter curve to the ideal parameter curve; wherein the third transfer model is used to reflect the ideal dynamic feature.

[0158] In some embodiments, the determination module 503 is specifically configured to: generate the first transfer model according to the dynamic response feature and the ideal dynamic feature, including: constructing the first transfer model according to the second transfer model and the third transfer model.

[0159] As a possible implementation form, the storage module 505 is configured to encapsulate a configuration parameter of the first transfer model into a configuration file of an execution device of the to-be-executed operation.

[0160] As a possible implementation form, the target parameter curve includes any one of the following: a temperature curve, a liquid level curve, a gas pressure curve or a flow rate curve.

[0161] For the above obtaining module 501, the executing module 502, the determining module 503, the correcting module 504 and the storing module 505, more detailed descriptions, more detailed descriptions of technical features, and descriptions of beneficial effects, etc. can refer to the corresponding method embodiments described above, and will not be repeated here.

[0162] It should be noted that, Figure 5 The module can also be referred to as a unit, for example, the obtaining module can be referred to as an obtaining unit. In addition, Figure 5 In the embodiments shown in the figure, the name of each module can not be the name shown in the figure, for example, the determining module can also be referred to as a processing module.

[0163] Through the description of the above embodiments, those skilled in the art can clearly understand that, for the convenience and brevity of description, only the grouping of the above functional modules is taken as an example, and in actual application, the above functions can be completed by different functional modules according to needs, that is, the internal structure of the device is grouped into different functional modules to complete all or part of the functions described above.

[0164] In several embodiments provided in the present application, it should be understood that the disclosed device and method can be implemented by other ways. For example, the device embodiments described above are only schematic, for example, the grouping of the modules or units is only a logical function grouping, and actual implementation can have another grouping manner, for example, a plurality of units or components can be combined or integrated into another device, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units or components shown or discussed can be indirect coupling or communication connection through some interface, device or unit, which can be electrical, mechanical or other forms.

[0165] The units described as separate components can or can not be physically separated, and the components shown as units can be one physical unit or multiple physical units, that is, they can be located in one place, or they can be distributed to multiple different places. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.

[0166] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of software functional unit.

[0167] The integrated unit, if implemented in the form of a software function unit and sold or used as an independent product, can be stored in a readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application essentially or say the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The software product is stored in a storage medium, and includes several instructions for making a device, such as a single-chip microcomputer, a chip, or a processor, execute all or part of the steps of the method described in the various embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a ROM, a RAM, a magnetic disk or an optical disk, and various storage program codes.

[0168] The embodiments of the present application also provide a computer readable storage medium, including computer execution instructions, when running on a computer, causing the computer to execute any one of the correction methods provided by the above embodiments.

[0169] The embodiments of the present application also provide a computer program product including computer execution instructions, when running on a computer, causing the computer to execute any one of the correction methods provided by the above embodiments.

[0170] The embodiments of the present application also provide a chip including: a processor, the processor being configured to run instructions, causing a device including the chip to execute any one of the correction methods provided by the above embodiments.

[0171] It should be noted that the terms "first" and "second" and the like in the specification, claims and drawings of the present application are used to distinguish different objects, and are not used to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0172] It should be understood that, in the present application, "at least one" means one or more, "multiple" means two or more, "at least two" means two or three and three or more, and "and / or" is used to describe the association relationship of the associated objects, which means that there can be three relationships, for example, "A and / or B" can mean that there are three cases of only A, only B and A and B at the same time, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after it. "At least one of the following" or similar expressions means any combination of these items, including any combination of single or multiple items. For example, at least one of a, b or c can mean a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0173] It should be understood that, in the embodiments of the present application, "B corresponding to A" means that B is associated with A. For example, B can be determined according to A. It should also be understood that determining B according to A does not mean that B is determined only according to A, but B can also be determined according to A and / or other information. In addition, "connection" appearing in the embodiments of the present application means direct connection or indirect connection and various connection modes to achieve communication between devices, which is not limited by the embodiments of the present application.

[0174] The "transmit" appearing in the embodiments of the present application means bidirectional transmission, including sending and / or receiving actions, unless otherwise specified. Specifically, "transmit" in the embodiments of the present application includes data sending, data receiving, or data sending and data receiving. Or, the data transmission here includes uplink and / or downlink data transmission. The data can include channels and / or signals, uplink data transmission is uplink channel and / or uplink signal transmission, and downlink data transmission is downlink channel and / or downlink signal transmission. The "network" and "system" appearing in the embodiments of the present application express the same concept, and the communication system is a communication network.

[0175] Through the description of the above embodiments, those skilled in the art can clearly understand that, for the convenience and brevity of description, only the grouping of the above functional modules is exemplified, and in actual application, the above functions can be completed by different functional modules according to needs, that is, the internal structure of the device is grouped into different functional modules to complete all or part of the functions described above.

[0176] In several embodiments provided in the present application, it should be understood that the disclosed apparatus and method can be implemented by other manners. For example, the apparatus embodiments described above are merely illustrative, for example, the grouping of the modules or units is merely a logical function grouping, and actual implementation can have another grouping manner, for example, a plurality of units or components can be combined or integrated into another apparatus, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed units can be indirect coupling or communication connection through some interfaces, apparatuses or units, and can be electrical, mechanical or other forms.

[0177] The units described as separate components can or can not be physically separated, and the components shown as units can be one physical unit or multiple physical units, that is, can be located in one place, or can be distributed to multiple different places. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0178] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0179] The integrated unit, if realized in the form of a software functional unit and sold or used as an independent product, can be stored in a readable storage medium. Based on this understanding, the technical solutions of the embodiments of the present application can be embodied in the form of a software product in essence or the part of the prior art or the whole or part of the technical solutions of the present application. The software product is stored in a storage medium, and includes a plurality of instructions for causing an apparatus, such as a single-chip microcomputer, a chip, or a processor, to execute all or part of the steps of the method described in each embodiment of the present application. The foregoing storage medium includes various storage program codes of media, such as a U disk, a mobile hard disk, a ROM, a RAM, a magnetic disk or an optical disk.

[0180] The above is merely a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto, and any change or replacement within the technical scope disclosed in the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method of correction, characterized by, The method comprises: obtaining a target parameter curve of an operation to be performed, the target parameter curve comprising target parameter values corresponding to operation parameters of the operation to be performed at at least two time points; performing the operation to be performed to obtain a first response parameter curve in response to the target parameter curve; determining a first transfer model associated with the target parameter curve and the first response parameter curve; modifying the target parameter curve based on the first transfer model to obtain a modified target parameter curve; performing the operation to be performed in response to the modified target parameter curve to obtain a second response parameter curve; wherein a difference between a parameter value corresponding to a first time point in the second response parameter curve and a first target parameter value is less than a difference between a parameter value corresponding to the first time point in the first response parameter curve and the first target parameter value, the first target parameter value being a target parameter value corresponding to the first time point in the target parameter curve, and the first time point being any one of the at least two time points.

2. The method of claim 1, wherein, Further comprising: determining an ideal parameter curve obtained by performing the operation to be performed in an ideal execution state according to the target parameter curve; the determining of the first transfer model comprises: determining the first transfer model according to the target parameter curve, the ideal parameter curve, and the first response parameter curve.

3. The method of claim 2, wherein, the determining of the first transfer model according to the target parameter curve, the ideal parameter curve, and the first response parameter curve comprises: determining a dynamic response characteristic of the operation to be performed according to the target parameter curve and the first response parameter curve; determining an ideal dynamic characteristic of the operation to be performed according to the target parameter curve and the ideal parameter curve, wherein the ideal dynamic characteristic is used to reflect an ideal response state of the operation to be performed with respect to the target parameter curve; determining the first transfer model according to the dynamic response characteristic and the ideal dynamic characteristic.

4. The method of claim 3, wherein, the determining of the dynamic response characteristic according to the target parameter curve and the first response parameter curve comprises: constructing a second transfer model according to a transfer relationship from the target parameter curve to the first response curve, wherein the second transfer model is used to reflect the dynamic response characteristic.

5. The method according to claim 3 or 4, characterized in that, the determining of the ideal dynamic characteristic according to the target parameter curve and the ideal parameter curve comprises: constructing a third transfer model according to a transfer relationship from the target parameter curve to the ideal parameter curve, wherein the third transfer model is used to reflect the ideal dynamic characteristic.

6. The method according to any one of claims 3-5, characterized in that, the generating of the first transfer model according to the dynamic response characteristic and the ideal dynamic characteristic comprises: constructing the first transfer model according to the second transfer model and the third transfer model.

7. The method of claim 6, wherein, The method further comprises: encapsulating a configuration parameter of the first transfer model in a configuration file of an execution device of the operation to be performed.

8. The method according to any one of claims 1-7, characterized in that, The target parameter curve comprises any one of the following: a temperature curve, a liquid level curve, a gas pressure curve, or a flow rate curve.

9. A correction device, characterized in that The correction device comprises: an acquisition module configured to acquire a target parameter curve of an operation to be performed, the target parameter curve comprising target parameter values corresponding to operation parameters of the operation to be performed at at least two time points; an execution module configured to perform the operation to be performed in response to the target parameter curve to obtain a first response parameter curve; a determination module configured to determine a first transfer model associated with the target parameter curve and the first response parameter curve; a correction module configured to correct the target parameter curve based on the first transfer model to obtain a corrected target parameter curve; the execution module is further configured to perform the operation to be performed in response to the corrected target parameter curve to obtain a second response parameter curve; wherein a difference between a parameter value corresponding to a first time point in the second response parameter curve and a first target parameter value is less than a difference between a parameter value corresponding to the first time point in the first response parameter curve and the first target parameter value, the first target parameter value being a target parameter value corresponding to the first time point in the target parameter curve, and the first time point being any one of the at least two time points.

10. An electronic device, comprising: comprise: a memory and a processor; the memory and the processor are coupled; the memory is configured to store instructions executable by the processor; the processor executes the instructions to perform the method in any one of claims 1 to 8.

11. A computer readable storage medium, characterized in that, The computer readable storage medium stores computer instructions, when the computer instructions run on the processor, make the processor execute the method in any one of claims 1 to 8.

12. A computer program product, characterised in that, The computer program product contains a computer program, when the computer program runs on the computer, makes the computer execute the method in any one of claims 1 to 8.

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