Semiconductor device and method for forming a semiconductor device

Abstract

The invention provides a semiconductor device and a method for forming the semiconductor device. The method includes: providing a semiconductor package, the semiconductor package including a plurality of contact pads formed on a surface of the semiconductor package; providing a template with a plurality of openings; disposing the template on a surface of the semiconductor package, wherein the plurality of openings are respectively aligned with the plurality of contact pads; forming a plurality of solder bumps on the plurality of contact pads and in the plurality of openings, respectively; and irradiating the plurality of solder bumps with a homogenized laser beam to form a solder interconnect between each of the plurality of solder bumps and a respective one of the plurality of contact pads.

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