Conductor assembly for transmitting high-frequency signals
CN120836066APending Publication Date: 2025-10-24YINGANG TEST EQUIP CO LTD
Patent Information
- Application Number
- CN202480020851.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-04-14
- Filing Date
- 2024-04-11
- Publication Date
- 2025-10-24
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Figure CN120836066A_ABST
Abstract
The invention relates to a conductor arrangement (7a, 7b) for transmitting high-frequency signals, in particular an insulated socket, preferably for a contact element (10) arranged in a test device (100), the conductor arrangement (7a, 7b) having: at least one inner conductor (1a, 1b) for transmitting high-frequency signals; a second conductor (2) separate from the inner conductor (1a, 1b), in particular an outer conductor surrounding the inner conductor; and at least one insulating element (3a, 3b) between the first conductor and the second conductor, the insulating element (3a, 3b) surrounding the inner conductor (1a, 1b) at least in sections, the at least one insulating element (3a, 3b, 3c) comprising at least two sub-regions (4a, 4b) having different dielectric constants.
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Citation Information
Patent Citations
Method for producing a three-dimensional object through additive manufacturing
DE102013003167A1
Test socket for testing device under test
WO2021162314A1