Vibration collecting and monitoring device of vehicle-mounted equipment

Abstract

The invention relates to a vibration acquisition and monitoring device for vehicle-mounted equipment. The device comprises an acceleration sensor module, a vibration acquisition and monitoring module and a control module, wherein the acceleration sensor module is used for detecting three-axis acceleration of the detected vehicle-mounted equipment in real time; the signal conditioning module is used for carrying out blocking filtering and denoising on the three-axis acceleration original data and then sending the three-axis acceleration original data to the MCU processing module; the MCU processing module is used for performing frequency spectrum calculation according to the three-axis acceleration to obtain a power spectrum density PSD and a corresponding RMS value, and recording and storing the power spectrum density PSD and the corresponding RMS value; the data communication module is connected with the MCU processing module and is used for realizing communication with an upper PC (Personal Computer) and vehicle-mounted equipment; and the power supply module is used for providing low-noise stable power supply for each module. Compared with the prior art, the method has the advantages of high real-time performance, stability, reliability, low power consumption, small measurement error and the like.

Description

Technical Field

[0001] This invention relates to the field of vibration sensing technology, and in particular to a vibration acquisition and monitoring device for vehicle-mounted equipment. Background Technology

[0002] Currently, vibration monitoring and analysis of vehicles during transportation and use are mainly in the theoretical research stage or in laboratory testing, focusing on analyzing the vibration characteristics of the vehicle itself during operation; however, there is a lack of specific applications and practices in the field of monitoring valuable on-board assets (such as CT scanners and precision measuring instruments in mobile CT medical vehicles).

[0003] With the rapid development of logistics systems, the transportation of valuable assets is becoming increasingly common. However, there are many uncertainties in the transportation process, such as accidental collisions, rough handling, and extreme road conditions, which may lead to structural damage or performance degradation of valuable assets on board. Furthermore, it is difficult to obtain timely evidence of damage during transportation. Therefore, there is a need for a device that can both obtain evidence in a timely manner and analyze and alarm on the transportation status of valuable assets on board, effectively ensuring the safety of transportation of valuable assets on board, promoting the improvement of transportation conditions, and providing data support for subsequent damage assessment. Summary of the Invention

[0004] To address the technical problems in the background art, the present invention provides a vibration acquisition and monitoring device for vehicle-mounted equipment, the device comprising:

[0005] Accelerometer sensor module: used to detect the triaxial acceleration of the tested vehicle-mounted equipment in real time;

[0006] Signal conditioning module: used to perform DC blocking filtering and noise reduction on the raw triaxial acceleration data before sending it to the MCU processing module;

[0007] MCU processing module: used to perform spectrum calculations based on triaxial acceleration to obtain the power spectral density (PSD) and the corresponding RMS value, and to record and store them;

[0008] Data communication module: Connected to the MCU processing module, it enables communication with the host PC and vehicle-mounted equipment;

[0009] Power supply module: Used to provide stable, low-noise power to each module.

[0010] Furthermore, the power module adopts both lithium battery and USB power supply methods, and uses a two-stage design of boosting and bucking. The first stage boosts the input voltage to 6.2V to suppress ripple, and the second stage bucks the 6.2V to 3.3V and 5V to provide a low-noise and stable power supply for subsequent modules.

[0011] Furthermore, the power module automatically selects either USB or lithium battery power supply, specifically:

[0012] When the USB power port is connected to a power source, it prioritizes drawing power from the USB port, shutting off the lithium battery power supply path, and simultaneously charging the lithium battery. When the USB power port is not connected to a power source, it automatically switches to the lithium battery path and uses the lithium battery for power.

[0013] Furthermore, the acceleration sensor module employs three single-axis acceleration sensors, or a single three-axis acceleration sensor, to collect the acceleration data of the tested vehicle-mounted device in real time along the X, Y, and Z axes.

[0014] Furthermore, the signal conditioning module includes a filtering unit connected to the output of the acceleration sensor module and an ADC analog-to-digital converter connected to the filtering unit. Specifically, the filtering unit adopts a capacitor DC blocking circuit with a single power supply or a servo circuit with a positive and negative dual power supply to remove the influence of gravitational acceleration on the acceleration sensor. The ADC analog-to-digital converter is a multi-channel analog-to-digital converter, and each channel is equipped with a low-pass filter to reduce noise.

[0015] Furthermore, the data communication module includes a USB communication unit, a serial communication unit, and / or a CAN communication unit for communicating with a host PC.

[0016] Furthermore, the device also includes a FLASH memory connected to the MCU processing module to store spectrum calculation results and vibration reports, and an RTC real-time clock module to provide date and time information for data storage.

[0017] Furthermore, the device also includes a temperature sensing module connected to the MCU processing module, which is used to detect the device temperature in real time and provide temperature data for subsequent temperature compensation.

[0018] Furthermore, the device also includes an alarm output module connected to the MCU processing module, which is used to convert the alarm control signal of the MCU processing module into an alarm signal and output it to the alarm.

[0019] Furthermore, the device performs vibration acquisition and monitoring of vehicle-mounted equipment as follows:

[0020] The accelerometer module collects triaxial acceleration data from the vehicle-mounted equipment in real time. After DC blocking and filtering, the MCU processing module performs frequency domain feature calculations based on the collected triaxial acceleration data. The calculated power spectral density (PSD) and the corresponding effective value (RMS) are then recorded and saved. After generating a vibration report, the report is sent to the host PC or vehicle-mounted equipment via the data communication module.

[0021] Compared with the prior art, the present invention has the following advantages:

[0022] I. High real-time performance: The vibration acquisition and monitoring device of the vehicle-mounted equipment of the present invention is installed on the valuable vehicle-mounted asset to be monitored. It adopts the edge computing method, which can collect the corresponding vibration data in real time during vehicle operation, perform calculation, analysis and storage, provide a data foundation for subsequent evidence collection and analysis, and fill the corresponding technical gap.

[0023] 2. Stable and long-term power supply: This invention supports both lithium battery and USB power supply methods and can automatically switch between the two methods to ensure long-term power supply. In addition, the power module adopts a two-stage design of boosting and then bucking, which can effectively reduce power supply ripple and noise and effectively improve the accuracy of data acquisition by the subsequent acceleration sensor chip.

[0024] 3. Small measurement error: Considering the weak load capacity of the accelerometer chip, this invention specifically designs an ADC analog-to-digital converter. Combined with the low-pass filter inside the ADC, signal noise is reduced, which can effectively reduce the measurement error caused by the output load. At the same time, considering the power supply method, a capacitor DC blocking circuit / servo circuit is designed to filter out the DC component of the accelerometer output signal, eliminating the need for installation and calibration. Attached Figure Description

[0025] Figure 1 This is a functional principle structural block diagram of the present invention;

[0026] Figure 2 This is a schematic diagram of the circuit structure of the MCU processing module;

[0027] Figure 3 This is a schematic diagram of the circuit structure of the power module;

[0028] Figure 4 This is a schematic diagram of the circuit structure of the acceleration sensor module;

[0029] Figure 5 This is a schematic diagram of the circuit structure of the signal conditioning module;

[0030] Figure 6 This is a schematic diagram of the circuit structure of a capacitor blocking DC circuit;

[0031] Figure 7 This is a schematic diagram of the servo circuit structure.

[0032] Figure 8 This is a schematic diagram of the circuit structure of the temperature sensing module;

[0033] Figure 9 This is a schematic diagram of the circuit structure of the serial communication unit;

[0034] Figure 10 This is a schematic diagram of the circuit structure of the USB communication unit;

[0035] Figure 11 This is a schematic diagram of the circuit structure of the alarm output module. Detailed Implementation

[0036] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are based on the technical solution of the present invention and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0037] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0038] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of the invention is usually placed in during use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0039] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0040] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0041] To make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0042] Example

[0043] This invention provides a vibration acquisition and monitoring device for vehicle-mounted equipment. Taking a CT scanner in a mobile vehicle-mounted CT medical vehicle subjected to vibration or impact during driving or transportation as an example, the device collects vibration data of the vehicle-mounted CT scanner on three axes in real time, calculates the power spectral density (PSD) of the three-axis vibration data and the effective value (RMS) of the random vibration test, and analyzes the real-time status of the medical equipment accordingly. At the same time, based on preset warning values, the device outputs alarms for vibrations and impacts that exceed the range.

[0044] In addition, the monitoring data is stored locally after being matched one-to-one with the measurement time, which enables the understanding and monitoring of health status, helps to achieve predictive maintenance, and can predict and diagnose the failure of medical equipment.

[0045] like Figure 1 As shown, the vibration acquisition and monitoring device for vehicle-mounted equipment provided by the present invention mainly includes a power supply module, an MCU processing module, a FLASH memory, an RTC real-time clock module, an acceleration sensor module, a data communication module, a signal conditioning module, a temperature sensing module, and an alarm output module in its hardware circuit. The power supply module is used to provide 5V and 3.3V low-noise voltages to the other modules respectively. The FLASH memory, RTC real-time clock module, data communication module, temperature sensing module, and alarm output module communicate with the MCU processing module respectively. The acceleration sensor module communicates with the MCU processing module through the signal conditioning module. The MCU processing module communicates with the host PC through the data communication module.

[0046] The following descriptions of each module are in conjunction with the accompanying drawings;

[0047] like Figure 2 As shown, the MCU processing module uses an Arm Cortex-M4F-based MCU chip (in this example, the model is STM32F411CEU6), with a built-in hardware FPU unit (floating-point unit), supporting multiple DSP instruction sets. It uses the official DSP library files to implement the Fast Fourier Transform operation. Since the official library only applies to radix-2 and radix-4 operations for the Fourier Transform, in order to meet the minimum sampling frequency of 1600Hz, this invention uses a sampling frequency of 2048Hz, thus achieving a sampling rate of 2048 data points per second, which meets the requirements of the official library for Fast Fourier Transform calculation.

[0048] The MCU chip in the MCU processing module has 128KB of internal SRAM. However, when performing frequency and time domain feature calculations on the data from the three analog channels being measured, the memory is severely insufficient. Therefore, the total memory is divided into two parts. One part is a memory pool for dynamic memory allocation. All processes involving communication, sampling, frequency and time domain feature calculations, etc., that require a large amount of memory will request and use the memory pool. After use, the memory will be released back to the memory pool to achieve time-sharing multiplexing of memory. The remaining part of the memory is used for stack and other variables with low memory requirements.

[0049] like Figure 3 As shown, the power module provides a stable and continuous current to the entire device and is the core component ensuring its normal operation. The device supports both lithium battery and USB power supply. In addition to the lithium battery charging management chip, the power module also has an automatic selection circuit for USB and lithium battery power. When the USB power port is powered, it prioritizes drawing power from the USB port and shuts off the lithium battery power supply. At the same time, it can also charge the lithium battery through the lithium battery charging circuit to ensure that the lithium battery is always charging or fully charged when an external power source is connected. When no power is connected to the USB power port, the power module automatically switches to the lithium battery path and uses the lithium battery to power the device.

[0050] The input terminal of the power module has reverse connection protection and high voltage high energy pulse protection functions. The bidirectional transient diode D1 is used to prevent the downstream circuit from being subjected to transient high energy impact, effectively protecting the precision components in the electronic circuit from damage by surge pulses. It has the advantages of fast response speed, large transient power, low leakage current, small breakdown voltage deviation, easy control of clamping voltage, no damage limit, and small size.

[0051] During the operation of the downstream devices, two voltage types are required: 5V and 3.3V. The accelerometer powered by 5V has extremely high requirements for power supply ripple; the noise of its output signal is directly proportional to the magnitude of the power supply ripple. The smaller the power supply ripple, the lower the noise of the accelerometer's output signal. Therefore, the power module adopts a two-stage design of boosting and then bucking the voltage. The first stage boosts the 2.5V to 5.5V voltage input from USB or a lithium battery to 6.2V using a boost chip U1 (LT3460ESC6 in this example). The second stage bucks the 6.2V to 5V and 3.3V respectively. In this example, the LDO chip U2 bucks the input 6.2V to 3.3V, and the LDO chip U3 bucks the input 6.2V to 5V.

[0052] For applications requiring high 5V power supply ripple (e.g., accelerometer chips), the power module of this invention employs a high PSRR LDO chip U3 (model ADP7118). This chip has a typical noise level of only 11uVrms, a maximum initial voltage accuracy of ±0.8%, a PSRR of 88dB at 10kHz, and maintains a PSRR of 50dB even at 1MHz, demonstrating extremely strong ripple suppression capabilities. Furthermore, while the ADP7118 can achieve a minimum voltage drop of only 60mV with a stable 5V output, a smaller voltage drop results in a lower PSRR. Therefore, to find the optimal balance between power consumption and performance, a 1.2V voltage drop was chosen, meaning the input power supply voltage is configured to 6.2V.

[0053] The operating voltage of the digital processing circuits such as Flash memory and MCU chip is 3.3V. Therefore, the power supply design requirements for this part are not high. Thus, the LDO chip U2 with model number SE8733X2-HF is used in this example. This chip can output a maximum current of 100mA, and the output voltage accuracy reaches ±1%. Its ripple suppression capability can reach 60dB at 100Hz.

[0054] like Figure 4 As shown, in this example, the accelerometer sensor module uses the ADXL1002 chip from Analog Devices (ADI) to achieve vibration measurement. It features wide bandwidth and low noise. The chip has a measurement range of ±50g, an extremely low noise level of only 25ug / Hz, and a 10kHz bandwidth. These features enable it to capture vibration characteristics more precisely. Since the ADXL1002 sensor is a single-axis accelerometer, a total of three accelerometer sensors are used to collect acceleration data for the X, Y, and Z axes respectively.

[0055] The present invention also provides another solution for the accelerometer module, namely, using one MEMS triaxial accelerometer ADXL356 chip to replace three MEMS uniaxial accelerometer ADXL1002 chips, while keeping the data output and subsequent signal conditioning method unchanged.

[0056] like Figure 5 As shown, in terms of signal conditioning, since the output port of the single-axis or three-axis accelerometer chip in the accelerometer module has a weak load capacity, in order to reduce the measurement error caused by the output load, this invention uses an ADC analog-to-digital converter to condition the output signal of the accelerometer before inputting it into the MCU chip to achieve signal sampling. At the same time, according to the acquisition requirements, other useless frequency noise is filtered out.

[0057] In this example, the ADC uses TI's ADS8584S, a single-chip 4-channel 16-bit wide synchronous sampling chip. This chip operates on a single 5V power supply, and each channel can provide a maximum data throughput of 330kSPS and a sampling rate of 92.2dB. Utilizing the chip's oversampling mode, even higher SNR performance can be achieved (with an oversampling rate (OSR) of 32, the SNR is 96.4dB, the bandwidth of each channel is 2.8kHz, and the maximum throughput rate is 10kSPS). In addition, each channel of this chip has a third-order low-pass filter, which can limit the bandwidth frequency of the input signal to within 2.8kHz, further reducing signal noise while meeting the 2kHz sampling frequency requirement.

[0058] The MCU chip and the synchronous sampling chip ADS8584S transmit data via a high-speed SPI bus. It uses 32x oversampling to eliminate interference from quantization noise. It takes 36us to read the data from all four channels, which meets the 2KHz sampling frequency requirement.

[0059] In addition, in the signal conditioning module, besides enhancing the driving capability of the accelerometer output signal and reducing the measurement error caused by the output load, it is also necessary to filter out the DC component (i.e. the component of gravitational acceleration on the three axes) of the accelerometer output signal through the filtering unit to remove the influence of gravitational acceleration on the accelerometer. This will eliminate the need for installation and calibration during actual use.

[0060] Since the removal of DC signals using operational amplifiers requires both positive and negative power supplies to obtain the AC component of the signal, and the power supply design of this invention uses a single power supply, a capacitor DC blocking circuit is employed, such as... Figure 6 As shown, in this capacitor DC blocking circuit, the input terminal of the operational amplifier (AD8572AR in this example) is connected to the output terminal of the accelerometer chip. The DC signal is filtered at the output terminal of the operational amplifier through capacitor C51, resistor R34, resistor R35 and capacitor C52 before being input into the ADC analog-to-digital converter. Capacitor C51 is used to block the DC component of acceleration, and its capacitance value determines the lower limit of the filtering frequency (0.14Hz). Resistors R34, resistor R35 and capacitor C52 determine the upper limit of the filtering frequency.

[0061] Furthermore, the advantage of using a capacitor-based DC blocking circuit is that it eliminates the need for positive and negative power supply design. However, it doesn't utilize the full range of the ADC. Additionally, because the capacitor itself has a certain impedance, the DC blocking circuit incorporates an RC high-pass filter. When the input signal is DC, the circuit's output voltage cannot be completely 0V. To remove the DC component from the accelerometer's input signal while simultaneously covering a voltage range of ±5V, a method such as... Figure 7 The servo circuit shown requires a dual power supply of -5V and 5V for the operational amplifier. It integrates the output signal after the first stage amplification and then feeds back the integrated DC component to the input part of the first stage to adjust the input signal. In this way, the output of the first stage operational amplifier obtains the AC component of the sensor output signal. At the same time, the voltage of the AC component is twice the voltage of the sensor signal, that is, the voltage range is between -5V and 5V.

[0062] like Figure 8 As shown, the temperature sensing module is used to measure the temperature of the device and provide accurate temperature data for temperature compensation. In this example, the temperature sensing module uses the Bosch BMP280 barometric pressure sensor chip. Because it has a high-precision temperature measurement function, it can provide accurate temperature data. Its measurement range is 300hpa to 1100hpa, and the measurement accuracy is ±1hpa. It can accurately calculate the altitude and communicates directly with the MCU processing module through an I2C interface.

[0063] The Flash memory communicates with the MCU processing module via a 4-wire SPI communication method. It is mainly used to store measurement results. After each fixed time interval (15 minutes in this example), the calculation results are stored in the Flash memory in CSV format. When the Flash memory is full, the oldest record will be deleted first in order to store the latest data. The RTC real-time clock module is connected to the MCU processing module and mainly provides date and time information for data storage.

[0064] The data communication module specifically includes a serial communication unit and a USB communication unit. When communicating with external devices and outputting measurement reports, the serial communication unit uses the RS232 universal serial bus for data transmission. Figure 9 As shown;

[0065] like Figure 10 As shown, in addition to using a USB communication unit (specifically a USB Type-C interface in this example) for external power supply and internal lithium battery charging, the USB communication unit also has the function of communicating with a PC. After being connected to a PC, the USB communication unit can communicate with the PC via a virtual serial port to realize functions such as data monitoring and parameter writing. It can also mount the internal Flash memory of the device to the PC, making it convenient for users to read CSV format files in the Flash memory by accessing the hard drive.

[0066] like Figure 11As shown, the device also includes an alarm output module that communicates with the MCU chip. This module is used to convert the alarm control signal of the MCU chip into an alarm signal and output it to the alarm, thereby realizing the auxiliary alarm function.

[0067] In addition, the MCU chip of this device also has a reserved CAN bus communication interface. When CAN bus output is required, a corresponding CAN data communication unit can be designed separately in the data communication module to meet the actual communication needs.

[0068] Based on the above-mentioned vibration acquisition and monitoring device for vehicle-mounted equipment, the present invention also provides a vehicle-mounted vibration acquisition and processing method, which collects triaxial acceleration data of valuable vehicle-mounted equipment in real time, calculates frequency domain characteristics based on the collected acceleration, records and saves the calculated power spectral density (PSD) and the effective value (RMS) within the corresponding range, and can also compare it with a preset threshold, and then provide auxiliary alarm based on the comparison result.

[0069] The MCU processing module directly or via the signal conditioning module acquires triaxial acceleration data in real time, with the sampling frequency set to a fixed value not lower than the required frequency (1000Hz in this example). Frequency domain characteristics are calculated for the acceleration sampling data of each axis, and the power spectral density (PSD) and corresponding RMS value are finally obtained. The frequency resolution is configured to 1Hz during the frequency domain calculation. After acquiring a unit sampling frequency of data, a frequency domain calculation is performed. The PSD calculation method adopts the piecewise periodic method and combines a window function to improve the frequency leakage during spectrum analysis.

[0070] In actual operation, the MCU processing module first segments the sampled data, then multiplies the segmented data by a window function, converges both sides, and then uses Fast Fourier Transform (FFT) to calculate the spectrum. The resolution of the frequency domain calculation result is configured to 1Hz. According to the overlap rate requirement (set to 50% in this example, but can also be set according to actual conditions), the results of the spectrum calculation are accumulated. When a reporting period (set to 15 minutes in this example, but can also be set according to actual conditions) arrives, the accumulated PSD at each frequency is averaged and output as the final PSD value. At the same time, the RMS value within the corresponding reporting period can also be calculated, recorded and stored uniformly, and a vibration report is generated.

[0071] The calculation results and vibration reports are stored in the FLASH memory and transmitted to the vehicle equipment or host PC when the communication conditions are met. The communication method can be wired (such as CAN bus, RS485 / 232 bus, etc.) or wireless (WiFi, Bluetooth, NB-IoT, 3G, 4G, 5G, etc.).

[0072] In summary, this invention provides a vibration acquisition and monitoring device for vehicle-mounted equipment, which can collect, record, analyze and store vibration data under vehicle transportation conditions. This facilitates the monitoring and analysis of transportation conditions for valuable assets on vehicles, provides data support for improving transportation conditions, and adopts edge computing, eliminating the need for other equipment to cooperate. Data processing and storage are performed at the front end, saving computing resources and overall system overhead.

[0073] The preferred embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of the present invention without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A vibration acquisition and monitoring device for vehicle-mounted equipment, characterized in that, The device includes: Accelerometer sensor module: used to detect the triaxial acceleration of the tested vehicle-mounted equipment in real time; Signal conditioning module: used to perform DC blocking filtering and noise reduction on the raw triaxial acceleration data before sending it to the MCU processing module; MCU processing module: used to perform spectrum calculations based on triaxial acceleration to obtain the power spectral density (PSD) and the corresponding RMS value, and to record and store them; Data communication module: Connected to the MCU processing module, it enables communication with the host PC and vehicle-mounted equipment; Power supply module: Used to provide stable, low-noise power to each module.

2. The vibration acquisition and monitoring device for vehicle-mounted equipment according to claim 1, characterized in that, The power module uses both lithium battery and USB power supply methods. It adopts a two-stage design of boosting and bucking the voltage. The first stage boosts the input voltage to 6.2V to suppress ripple, and the second stage bucks the voltage to 3.3V and 5V to provide a low-noise and stable power supply for subsequent modules.

3. The vibration acquisition and monitoring device for vehicle-mounted equipment according to claim 2, characterized in that, The power module automatically selects either USB or lithium battery power supply, specifically: When the USB power port is connected to a power source, it prioritizes drawing power from the USB port, shutting off the lithium battery power supply path, and simultaneously charging the lithium battery. When the USB power port is not connected to a power source, it automatically switches to the lithium battery path and uses the lithium battery for power.

4. The vibration acquisition and monitoring device for vehicle-mounted equipment according to claim 1, characterized in that, The acceleration sensor module uses three single-axis acceleration sensors or one three-axis acceleration sensor to collect acceleration data of the tested vehicle-mounted equipment in real time along the X, Y, and Z axes.

5. The vibration acquisition and monitoring device for vehicle-mounted equipment according to claim 1, characterized in that, The signal conditioning module includes a filtering unit connected to the output of the acceleration sensor module and an ADC analog-to-digital converter connected to the filtering unit. The filtering unit specifically adopts a capacitor DC blocking circuit with a single power supply or a servo circuit with a positive and negative dual power supply to remove the influence of gravitational acceleration on the acceleration sensor. The ADC analog-to-digital converter is a multi-channel analog-to-digital converter, and each channel is equipped with a low-pass filter to reduce noise.

6. The vibration acquisition and monitoring device for vehicle-mounted equipment according to claim 1, characterized in that, The data communication module includes a USB communication unit, a serial communication unit, and / or a CAN communication unit for communicating with a host PC.

7. The vibration acquisition and monitoring device for vehicle-mounted equipment according to claim 1, characterized in that, The device also includes a FLASH memory connected to the MCU processing module to store spectrum calculation results and vibration reports, and an RTC real-time clock module to provide date and time information for data storage.

8. The vibration acquisition and monitoring device for vehicle-mounted equipment according to claim 1, characterized in that, The device also includes a temperature sensing module connected to the MCU processing module, which is used to detect the device temperature in real time and provide temperature data for subsequent temperature compensation.

9. The vibration acquisition and monitoring device for vehicle-mounted equipment according to claim 1, characterized in that, The device also includes an alarm output module connected to the MCU processing module, which is used to convert the alarm control signal of the MCU processing module into an alarm signal and output it to the alarm.

10. A vibration acquisition and monitoring device for vehicle-mounted equipment according to claim 1, characterized in that, The device performs vibration acquisition and monitoring of vehicle-mounted equipment as follows: The accelerometer module collects triaxial acceleration data from the vehicle-mounted equipment in real time. After DC blocking and filtering, the MCU processing module performs frequency domain feature calculations based on the collected triaxial acceleration data. The calculated power spectral density (PSD) and the corresponding effective value (RMS) are then recorded and saved. After generating a vibration report, the report is sent to the host PC or vehicle-mounted equipment via the data communication module.

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