Silicon wafer cylinder processing grinding device for semiconductor production

Abstract

The application discloses a silicon wafer cylinder processing and grinding device for semiconductor production and relates to the technical field of semiconductor production. The device comprises a processing plate, a placing plate fixedly arranged on the top of the processing plate, a linear driving mechanism fixedly penetrated through the top of the processing plate, a driving motor fixedly arranged on the top of the moving end of the linear driving mechanism, a loading plate fixedly arranged on the output end of the driving motor, a polishing mechanism fixedly penetrated through the end of the loading plate away from the driving motor, and a clamping device. The clamping device comprises an electric push rod, a carrying plate, a T-shaped rod, a No.1 spring, a rubber plate, a lifting plate, a No.1 spring piece, two connecting rods, an arc-shaped strip and a supporting rod. The supporting force exerted by the processing plate improves the stability of polishing, and the arc-shaped strip is used to exert pressure on the silicon wafer cylinder, so that the silicon wafer cylinder cannot be deflected during polishing and the polishing effect is ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, specifically to a grinding apparatus for processing silicon wafer cylinders for semiconductor manufacturing. Background Technology

[0002] Silicon wafers are circular materials made of silicon single crystals. They are the basic materials in the manufacture of semiconductor devices. A wafer cylinder is one of the forms of this material. It is a cylindrical silicon single crystal formed during the crystal growth process after silicon is melted. This cylindrical silicon crystal can be cut into thin slices and then used to manufacture various semiconductor devices.

[0003] Patent publication number CN215510588U relates to a silicon wafer cylinder processing equipment for semiconductor production, including a base with a transparent cover fixedly connected to the top. During use, the protective cover effectively isolates dust generated during the grinding process, preventing dust from harming workers. Furthermore, the interaction between the servo motor, the second threaded rod, the second threaded sleeve, the fixing rod, and the T-shaped rod allows adjustment of the grinding disc position outside the transparent cover, avoiding direct hand operation by workers. The interaction between the clamping plate, the pressure plate, the arc-shaped slot, the anti-slip pad, the first threaded rod, and the hand crank prevents the silicon wafer cylinder from shaking during grinding, thus improving grinding efficiency. Finally, the interaction between the side plates and the hydraulic cylinder, by adjusting the distance between the two side plates, allows for the processing of silicon wafer cylinders of different lengths, resulting in good performance.

[0004] The aforementioned patent features a clamping function for silicon wafers of different lengths. Through the cooperation between the first threaded rod and the hand crank, the operator can easily adjust the clamping device to accommodate silicon wafers of various lengths, which not only simplifies the operation process but also meets various production needs. However, during the grinding process, the flat clamping plate cannot completely fit the curved surface of the cylindrical silicon wafer. Due to the limited contact area, the clamping force on the silicon wafer is unevenly distributed, causing the silicon wafer to shift or vibrate during the grinding process, thereby affecting the grinding accuracy. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a grinding apparatus for silicon wafer cylinder processing in semiconductor manufacturing, which solves the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a grinding apparatus for processing silicon wafer cylinders for semiconductor production, comprising a processing plate, a placement plate fixedly mounted on the top of the processing plate, a linear drive mechanism fixedly passing through the top of the processing plate, a drive motor fixedly mounted on the top of the moving end of the linear drive mechanism, a loading plate fixedly mounted on the output end of the drive motor, a grinding mechanism fixedly passing through the end of the loading plate away from the drive motor, a sliding groove formed on the top of the processing plate, and a clamping device; wherein, the clamping device comprises an electric push rod, a mounting plate, a T-shaped rod, a first spring, a rubber plate, a lifting plate, a first spring piece, two connecting rods, an arc-shaped strip, and a support rod. When the electric push rod is activated, its output end drives the mounting plate to move towards the placement plate, and the movement of the mounting plate drives the T-shaped rod to move towards the placement plate. The electric push rod is fixedly installed on the top of the processing plate, and the mounting plate is fixedly installed on the output end of the electric push rod. The T-shaped rod slides through the mounting plate on the side away from the electric push rod. The first spring is disposed between the T-shaped rod and the mounting plate. The rubber plate is fixedly installed on the side of the T-shaped rod away from the mounting plate. The lifting plate slides through the top of the mounting plate. The first spring is disposed between the lifting plate and the mounting plate. The two connecting rods are fixedly installed on the side of the lifting plate away from the electric push rod. The arc-shaped strips are disposed at both ends of the connecting rods away from the lifting plate. The support rod is fixedly installed at the bottom of the lifting plate and slides through the bottom of the mounting plate. The side of the rubber plate away from the mounting plate has a corrugation. During movement, the corrugation of the rubber plate contacts the silicon crystal cylinder, and the rubber plate stops moving due to the obstruction exerted by the silicon crystal cylinder.

[0007] According to the above technical solution, a spherical surface is provided at one end of the T-shaped rod near the lifting plate, and an inclined surface is provided on the side of the lifting plate near the T-shaped rod. The inclined surface of the lifting plate contacts the spherical surface during movement, and the inclined surface continues to move downward due to the resistance applied by the spherical surface.

[0008] According to the above technical solution, the arc-shaped strip itself is elastic. When the middle position of the arc-shaped strip is blocked, it stops moving. The connecting rod moves and stretches both ends of the arc-shaped strip. The arc-shaped strip is stretched and deformed. The side of the arc-shaped strip near the rubber plate is provided with an anti-slip groove.

[0009] According to the above technical solution, it further includes a dustproof device and a locking device; the dustproof device includes a moving frame, a glass cover, a rectangular plate, a second spring, a contact plate, a limiting plate, a cylindrical block, an elastic sheet, and a round rod. The lifting plate contacts the contact plate during movement, and the movement of the lifting plate applies a pushing force to the contact plate. The contact plate moves towards the placement plate under the influence of the pushing force. The moving frame is slidably installed on the top of the slide groove. The glass cover is fixedly installed inside the moving frame. The rectangular plate is slidably installed on the inner wall of the moving frame. The second spring is disposed between the rectangular plate and the moving frame. The contact plate is fixedly installed at the bottom of the rectangular plate. The limiting plate is fixedly installed on the outer wall of the moving frame. The cylindrical block is fixedly installed on the surface of the rectangular plate. The elastic sheet is fixedly installed on the inner wall of the moving frame. When the rectangular plate moves, it drives the cylindrical block to move towards the elastic sheet. The cylindrical block contacts the elastic sheet during movement. The round rod is fixedly installed on the inner wall of the moving frame.

[0010] According to the above technical solution, the elastic sheets are equidistantly distributed on the inner wall of the moving frame with the rectangular plate as the axis of symmetry. The cylindrical block continues to move and squeeze the elastic sheets. The elastic sheets are deformed by the squeeze. The surface of the elastic sheet in contact with the round rod during deformation separates. The limiting plate has a second inclined surface on the side close to the placement plate and a round hole on the side of the limiting plate away from the moving frame.

[0011] According to the above technical solution, the elastic sheet has an arc surface on the side away from the round rod. When the cylindrical block moves to reset, it contacts the arc surface of the elastic sheet. As the cylindrical block continues to move, it presses the arc surface, causing the elastic sheet to deform under pressure. The elastic sheet then contacts the circumferential surface of the round rod.

[0012] According to the above technical solution, the locking device includes a fixed plate, a movable rod, a second spring, a movable plate, a gripping rod, a connecting rod, a connecting seat, a rotating plate, and a blocking plate. The moving rod drives the movable plate to move towards the blocking plate, and the moving plate drives the movable rod to move towards the blocking plate. The fixed plate is fixedly installed on the surface of the processing plate. The movable rod slides through the interior of the fixed plate. The second spring is disposed between the movable rod and the fixed plate. The movable plate is fixedly installed on the side of the movable rod close to the fixed plate. The gripping rod is fixedly installed on the side of the movable plate away from the processing plate. The connecting rod is fixedly installed on the side of the movable plate away from the gripping rod. The connecting seat is fixedly installed on the top of the fixed plate. The rotating plate is rotatably installed inside the connecting seat. The blocking plate is fixedly installed on the top of the fixed plate. A spherical surface is provided at the end of the connecting rod away from the movable plate. The inclined surface of the limiting plate contacts the spherical surface during movement. The inclined surface continues to move and applies a pushing force to the spherical surface. The connecting rod moves towards the movable plate under the influence of the pushing force.

[0013] According to the above technical solution, a spiral spring is provided between the rotating plate and the connecting seat. A semi-circular groove is provided on the side of the rotating plate away from the handle. The circumferential surface of the handle contacts the semi-circular groove during movement, so that the rotating plate limits the movement of the handle. At the same time, the connecting rod cannot contact the moving limiting plate, and the rotating plate contacts the blocking plate.

[0014] This invention provides a grinding apparatus for processing silicon wafer cylinders in semiconductor manufacturing. It has the following advantages:

[0015] (1) In the silicon wafer grinding device for semiconductor production, the T-shaped rod applies a pushing force to the rubber plate under the action of tension, so that the first corrugation is in close contact with the silicon wafer. The tension applied during the deformation of the first spring ensures that the first corrugation is in close contact with the silicon wafer, which helps to improve the stability of clamping. The two ends of the arc strip bend downward, and the anti-slip groove of the arc strip fits tightly with the curved surface of the silicon wafer during the deformation process. The support force applied by the processing plate improves the stability of grinding. Then, the arc strip applies pressure to the silicon wafer to ensure that the silicon wafer will not deflect during the grinding process, which will affect the grinding effect.

[0016] (2) In the silicon crystal cylinder grinding device for semiconductor production, the second spring sheet applies a reaction force to the moving frame under its own elasticity. The moving frames on both sides are in close contact under the influence of the reaction force. The reaction force applied by the second spring sheet ensures that the glass cover can effectively prevent the powder generated during the grinding process from flying into the working area. The elastic sheet recovers under its own elasticity. During the recovery process, the elastic sheet collides with the round rod to generate vibration. Multiple vibrations are generated by the intermittent collision between the elastic sheet and the round rod, and then the vibration is transmitted to the moving frame to avoid the dust accumulated in the chute affecting the smoothness of the moving frame.

[0017] (3) In the silicon crystal cylinder grinding device for semiconductor production, the docking rod passes through the round hole, so that the docking rod limits the moving frame. By limiting the moving frame by the docking rod passing through the round hole, the operator can open the glass cover after standardized operation, which helps to improve the safety of operation. The rotating plate limits the movement of the gripping rod, and at the same time, the docking rod cannot contact the limiting plate. By actively limiting the moving plate, the operator can easily rotate the docking rod according to the actual situation, which helps to improve the practicality of the docking rod. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 This is a schematic diagram of the top structure of the processing plate of the present invention;

[0020] Figure 3 For the present invention Figure 2 Enlarged structural diagram at point A in the middle;

[0021] Figure 4 This is a schematic diagram showing the position and structure of the drive motor and loading plate of the present invention;

[0022] Figure 5 This is a schematic diagram of the internal structure of the clamping device of the present invention;

[0023] Figure 6 For the present invention Figure 5 Enlarged structural diagram at point B;

[0024] Figure 7 This is a schematic diagram of the internal structure of the dustproof device of the present invention;

[0025] Figure 8 For the present invention Figure 7 Enlarged structural diagram at point C;

[0026] Figure 9 This is a schematic diagram of the internal structure of the locking device of the present invention.

[0027] In the diagram: 1. Processing plate; 2. Placement plate; 3. Linear drive mechanism; 4. Drive motor; 5. Loading plate; 6. Grinding mechanism; 7. Electric push rod; 8. Mounting plate; 9. T-shaped rod; 10. Spring No. 1; 11. Rubber plate; 12. Lifting plate; 13. Spring No. 1; 14. Connecting rod; 15. Arc strip; 16. Support rod; 161. Moving frame; 162. Glass cover; 163. Rectangular plate; 164. Spring No. 2; 165. Contact plate; 166. Limiting plate; 167. Cylindrical block; 168. Elastic sheet; 169. Round rod; 171. Fixed plate; 172. Moving rod; 173. Spring No. 2; 174. Movable plate; 175. Holding rod; 176. Connecting rod; 177. Connecting seat; 178. Rotating plate; 179. Blocking plate. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0029] Please see Figures 1-9One embodiment of the present invention is: a grinding apparatus for processing silicon wafer cylinders for semiconductor production, comprising a processing plate 1, a placement plate 2 fixedly mounted on the top of the processing plate 1, a linear drive mechanism 3 fixedly passing through the top of the processing plate 1, a drive motor 4 fixedly mounted on the top of the moving end of the linear drive mechanism 3, a loading plate 5 fixedly mounted on the output end of the drive motor 4, a grinding mechanism 6 fixedly passing through the end of the loading plate 5 away from the drive motor 4, a sliding groove formed on the top of the processing plate 1, and a clamping device; wherein, the clamping device comprises an electric push rod 7, a mounting plate 8, a T-shaped rod 9, a first spring 10, a rubber plate 11, a lifting plate 12, a first spring piece 13, two connecting rods 14, an arc-shaped strip 15, and a support rod 16, the electric push rod 7 being fixedly mounted on the top of the processing plate 1, and the mounting plate 8 being fixedly mounted on the electric push rod 7. At the output end, a T-shaped rod 9 slides through the side of the mounting plate 8 away from the electric push rod 7. A first spring 10 is positioned between the T-shaped rod 9 and the mounting plate 8. A rubber plate 11 is fixedly installed on the side of the T-shaped rod 9 away from the mounting plate 8. A lifting plate 12 slides through the top of the mounting plate 8. A first spring piece 13 is positioned between the lifting plate 12 and the mounting plate 8. Two connecting rods 14 are fixedly installed on the side of the lifting plate 12 away from the electric push rod 7. Arc-shaped strips 15 are positioned at both ends of the connecting rods 14 away from the lifting plate 12. A support rod 16 is fixedly installed at the bottom of the lifting plate 12 and slides through the bottom of the mounting plate 8. A corrugated section is provided on the side of the rubber plate 11 away from the mounting plate 8. The tension applied during the deformation of the first spring 10 ensures that the corrugated section is in close contact with the silicon cylinder, which helps to improve the stability of the clamping.

[0030] The T-shaped rod 9 has a spherical surface at one end near the lifting plate 12, and the lifting plate 12 has an inclined surface on the side near the T-shaped rod 9. By opening the spherical surface and the inclined surface, it is ensured that the T-shaped rod 9 can move downward smoothly when the inclined surface and the spherical surface are in contact.

[0031] The arc-shaped strip 15 itself is elastic, and the side of the arc-shaped strip 15 near the rubber plate 11 is provided with an anti-slip groove. The support force applied by the processing plate 1 improves the stability of the mounting plate 8 during grinding. The arc-shaped strip 15 is then used to apply pressure to the silicon crystal cylinder to ensure that the silicon crystal cylinder will not deflect during the grinding process and affect the grinding effect.

[0032] In this embodiment, the silicon wafer is placed on top of the placement plate 2. The electric push rod 7 is activated, and its output drives the mounting plate 8 towards the placement plate 2. The movement of the mounting plate 8 causes the T-shaped rod 9 to move towards the placement plate 2, which in turn moves the rubber plate 11 towards the placement plate 2. During this movement, the corrugations of the rubber plate 11 come into contact with the silicon wafer. The rubber plate 11 stops moving due to the obstruction exerted by the silicon wafer. The mounting plate 8 continues to move, stretching the first spring 10. The first spring 10 deforms under this stretching, and its elasticity exerts force on the T-shaped rod 9. A pulling force is applied, and the T-shaped rod 9 exerts a pushing force on the rubber plate 11 under the action of the pulling force, so that the corrugated part 1 is in close contact with the silicon crystal cylinder. The pulling force applied by the first spring 10 during deformation ensures that the corrugated part 1 is in close contact with the silicon crystal cylinder, which helps to improve the stability of clamping. The mounting plate 8 continues to move, driving the lifting plate 12 to move. The inclined surface 1 of the lifting plate 12 contacts the spherical surface 1 during the movement. The inclined surface 1 continues to move and moves downward due to the resistance exerted by the spherical surface 1. The lifting plate 12 moves downward and squeezes the first spring piece 13. The first spring piece 13 is squeezed and deformed. The movement of the lifting plate 12 drives the support rod 16 to move downward. During movement, the support rod 16 contacts the top of the processing plate 1, and the processing plate 1 applies an upward supporting force to the support rod 16. The support rod 16 transmits the supporting force to the mounting plate 8. Simultaneously, the lifting plate 12 moves, causing the connecting rod 14 to move downward. The moving connecting rod 14 causes the arc-shaped strip 15 to move downward. The middle position of the arc-shaped strip 15 contacts the curved surface of the silicon cylinder during movement. The middle position of the arc-shaped strip 15 is blocked and stops moving. The moving connecting rod 14 stretches the two ends of the arc-shaped strip 15. The arc-shaped strip 15 is stretched and deformed, causing the two ends of the arc-shaped strip 15 to bend downward. The anti-slip groove of the arc-shaped strip 15 is formed. During the process, the silicon crystal cylinder is tightly fitted to the curved surface. After the silicon crystal cylinder is clamped, the operator starts the linear drive mechanism 3. The moving end of the linear drive mechanism 3 drives the drive motor 4 to move back and forth. The output end of the drive motor 4 drives the loading plate 5 to move towards the placement plate 2. The movement of the loading plate 5 drives the grinding mechanism 6 to move towards the placement plate 2. The grinding mechanism 6 is started to grind the silicon crystal cylinder. The support force applied by the processing plate 1 improves the stability of the grinding. Then, the arc strip 15 applies pressure to the silicon crystal cylinder to ensure that the silicon crystal cylinder will not deflect during the grinding process, thus affecting the grinding effect.

[0033] Please see Figures 1-9Based on the above embodiments, another embodiment of the present invention further includes a dustproof device and a locking device; the dustproof device includes a movable frame 161, a glass cover 162, a rectangular plate 163, a second spring 164, a contact plate 165, a limiting plate 166, a cylindrical block 167, an elastic sheet 168, and a round rod 169. The movable frame 161 is slidably mounted on the top of the slide groove, the glass cover 162 is fixedly mounted inside the movable frame 161, the rectangular plate 163 is slidably mounted on the inner wall of the movable frame 161, and the second spring 164 is disposed on the rectangular plate 165. Between the 3 and the movable frame 161, the contact plate 165 is fixedly installed at the bottom of the rectangular plate 163, the limiting plate 166 is fixedly installed on the outer wall of the movable frame 161, the cylindrical block 167 is fixedly installed on the surface of the rectangular plate 163, the elastic sheet 168 is fixedly installed on the inner wall of the movable frame 161, and the round rod 169 is fixedly installed on the inner wall of the movable frame 161. Through the reaction force applied by the second spring sheet 164, it is ensured that the glass cover 162 can effectively prevent the powder generated during the grinding process from flying into the working area, thereby reducing the cleaning burden of the workers.

[0034] The elastic sheets 168 are evenly distributed on the inner wall of the moving frame 161 with the rectangular plate 163 as the axis of symmetry. The limiting plate 166 has a second inclined surface on the side close to the placement plate 2 and a round hole on the side away from the moving frame 161. The elastic sheets 168 and the round rod 169 intermittently collide to generate multiple vibrations, which are then transmitted to the moving frame 161 to prevent the dust accumulated in the groove from affecting the smoothness of the movement of the moving frame 161.

[0035] The elastic sheet 168 has an arc surface on the side away from the round rod 169. The elastic sheet 168 contacts the circumferential surface of the round rod 169. By opening the arc surface, it is ensured that the elastic sheet 168 will not hinder the operator from resetting the cylindrical block 167 to its initial position.

[0036] The locking device includes a fixed plate 171, a moving rod 172, a second spring 173, a movable plate 174, a gripping rod 175, a connecting rod 176, a connecting seat 177, a rotating plate 178, and a blocking plate 179. The fixed plate 171 is fixedly installed on the surface of the processing plate 1. The moving rod 172 slides through the interior of the fixed plate 171. The second spring 173 is disposed between the moving rod 172 and the fixed plate 171. The movable plate 174 is fixedly installed on the side of the moving rod 172 closest to the fixed plate 171. The gripping rod 175 is fixedly installed on the side of the movable plate 174 furthest from the fixed plate 171. On the side away from the processing plate 1, the connecting rod 176 is fixedly installed on the side of the movable plate 174 away from the handle 175. The connecting seat 177 is fixedly installed on the top of the fixed plate 171. The rotating plate 178 is rotatably installed inside the connecting seat 177. The blocking plate 179 is fixedly installed on the top of the fixed plate 171. The end of the connecting rod 176 away from the movable plate 174 has a spherical second surface. The moving frame 161 is limited by the connecting rod 176 passing through the round hole, so that the glass cover 162 can only be opened after the operator has performed the operation in accordance with the procedure, which helps to improve the safety of the operation.

[0037] A spiral spring is provided between the rotating plate 178 and the connecting seat 177. A semi-circular groove is provided on the side of the rotating plate 178 away from the handle 175. The rotating plate 178 contacts the blocking plate 179. Through the active limiting movable plate 174, it is convenient for the staff to rotate and use the docking rod 176 according to the actual situation, which helps to improve the practicality of the docking rod 176.

[0038] In this embodiment, during operation, the lifting plate 12 contacts the contact plate 165 while moving. The movement of the lifting plate 12 applies a pushing force to the contact plate 165, causing the contact plate 165 to move towards the placement plate 2 under the influence of the pushing force. The movement of the contact plate 165 drives the rectangular plate 163 to move towards the placement plate 2, which in turn drives the moving frame 161 to move towards the placement plate 2. The movement of the moving frame 161 drives the limiting plate 166 to move towards the placement plate 2. Simultaneously, the movement of the moving frame 161 drives the glass cover 162 to move towards the placement plate 2. During movement, the movable frame 161 comes into contact with the contact plate 165, causing it to stop moving. The lifting plate 12 continues to apply a pushing force to the contact plate 165, which moves under the influence of the pushing force. This causes the rectangular plate 163 to continue moving and compress the second spring piece 164. The second spring piece 164 deforms under the compression, and its elasticity causes it to exert a reaction force on the movable frame 161. The two movable frames 161 on both sides come into close contact under the influence of the reaction force. To ensure that the glass cover 162 can effectively prevent powder generated during the polishing process from scattering into the working area, the rectangular plate 163 moves while driving the cylindrical block 167 towards the elastic sheet 168. During this movement, the cylindrical block 167 contacts the elastic sheet 168, causing it to continue moving and compressing the elastic sheet 168. The elastic sheet 168 deforms under this pressure, and the surface of the elastic sheet 168 in contact with the cylindrical rod 169 separates. When the surface of the cylindrical block 167 and the elastic sheet 168 separates, the elastic sheet 168, due to its own elasticity... During the recovery process, the elastic sheet 168 vibrates by colliding with the round rod 169. When the cylindrical block 167 moves to reset, it contacts the arc surface of the elastic sheet 168. The cylindrical block 167 continues to move and presses the arc surface, causing the elastic sheet 168 to deform under pressure. When the cylindrical block 167 separates from the arc surface, the elastic sheet 168 automatically recovers. Multiple vibrations are generated by the intermittent collision between the elastic sheet 168 and the round rod 169, and the vibrations are then transmitted to the moving frame 161 to prevent dust accumulated in the groove from affecting the smoothness of the movement of the moving frame 161.

[0039] As the limiting plate 166 moves, the second inclined surface contacts the second spherical surface. The continued movement of the second inclined surface applies a pushing force to the second spherical surface. The connecting rod 176, influenced by this pushing force, moves towards the movable plate 174. This movement of the connecting rod 176 causes the movable plate 174 to move towards the blocking plate 179. The movement of the movable plate 174 then causes the moving rod 172 to move towards the blocking plate 179. The moving rod 172 compresses the second spring 173, causing it to deform. The deformed second spring 173 stores energy under its own elasticity. When the limiting plate 166 moves to the designated position, the surface in contact with the second spherical surface separates, allowing the second spring to... The 173-restore mechanism moves the movable rod 172 away from the blocking plate 179. This movement of the movable rod 172 moves the movable plate 174 away from the blocking plate 179. The movable plate 174 then moves the connecting rod 176 away from the blocking plate 179. During this movement, the connecting rod 176 passes through the circular hole, thus limiting the movement of the movable frame 161. This limitation ensures that the glass cover 162 can only be opened after proper operation, improving operational safety. When the connecting rod 176 is not needed to limit the movement of the movable frame 161... Manually press the rotating plate 178 to rotate it away from the blocking plate 179. As the rotating plate 178 rotates, the spiral spring is stretched and deformed. Simultaneously, the rotating plate 178 separates from the blocking plate 179. Then, pull the handle 175 to move it towards the blocking plate 179. The movement of the handle 175 causes the movable plate 174 to move towards the blocking plate 179. The movement of the movable plate 174 causes the connecting rod 176 to move towards the blocking plate 179. After the handle 175 reaches the designated position, release the rotating plate 178. The spiral spring returns to its original position, causing the rotating plate 178 to contact the blocking plate 179 and stop. To stop rotation, release the grip 175. The second spring 173 returns to its original position, causing the moving rod 172 to move towards the processing plate 1. The movement of the moving rod 172 causes the movable plate 174 to move towards the processing plate 1. The movement of the movable plate 174 causes the grip 175 to move towards the processing plate 1. During the movement, the circumferential surface of the grip 175 contacts the semi-circular groove, so that the rotating plate 178 applies a limit to the movement of the grip 175. At the same time, the docking rod 176 cannot contact the moving limiting plate 166. By actively limiting the movable plate 174, it is convenient for the staff to rotate and use the docking rod 176 according to the actual situation, which helps to improve the practicality of the docking rod 176.

[0040] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cylinder processing grinding device for semiconductor production, comprising a processing plate (1), characterized in that: It also includes clamping device, dustproof device and locking device, the top of the processing plate (1) is fixedly installed with a placing plate (2), the top of the processing plate (1) is fixedly penetrated with a linear drive mechanism (3), the moving end of the linear drive mechanism (3) is fixedly installed with a driving motor (4), the output end of the driving motor (4) is fixedly installed with a loading plate (5), the end away from the driving motor (4) of the loading plate (5) is fixedly penetrated with a polishing mechanism (6), the top of the processing plate (1) is provided with a sliding groove; Wherein, the clamping device includes electric push rod (7), carrying plate (8), T-shaped rod (9), spring (10), rubber plate (11), lifting plate (12), spring (13), two link rods (14), arc strip (15) and support rod (16), the electric push rod (7) is fixedly installed on the top of the processing plate (1), the carrying plate (8) is fixedly installed on the output end of the electric push rod (7), the T-shaped rod (9) is slidably penetrated in the side of the carrying plate (8) away from the electric push rod (7), the spring (10) is arranged between the T-shaped rod (9) and the carrying plate (8), the rubber plate (11) is fixedly installed on the side of the T-shaped rod (9) away from the carrying plate (8), the lifting plate (12) is slidably penetrated in the top of the carrying plate (8), the spring (13) is arranged between the lifting plate (12) and the carrying plate (8), two the link rods (14) are fixedly installed on the side of the lifting plate (12) away from the electric push rod (7), the arc strip (15) is arranged at the two ends of the link rod (14) away from the lifting plate (12), the support rod (16) is fixedly installed at the bottom of the lifting plate (12), the support rod (16) is slidably penetrated in the bottom of the carrying plate (8), the side of the rubber plate (11) away from the carrying plate (8) is provided with corrugation one; The dustproof device includes moving frame (161), glass cover (162), rectangular plate (163), spring (164), contact plate (165), limiting plate (166), cylindrical block (167), elastic sheet (168) and round rod (169), the moving frame (161) is slidably installed on the top of the sliding groove, the glass cover (162) is fixedly installed in the moving frame (161), the rectangular plate (163) is slidably installed on the inner wall of the moving frame (161), the spring (164) is arranged between the rectangular plate (163) and the moving frame (161), the contact plate (165) is fixedly installed at the bottom of the rectangular plate (163), the limiting plate (166) is fixedly installed on the outer wall of the moving frame (161), the cylindrical block (167) is fixedly installed on the surface of the rectangular plate (163), the elastic sheet (168) is fixedly installed on the inner wall of the moving frame (161), and the round rod (169) is fixedly installed on the inner wall of the moving frame (161). The locking device comprises a fixed plate (171), a moving rod (172), a No. 2 spring (173), a movable plate (174), a handle rod (175), a butt joint rod (176), a connecting seat (177), a rotating plate (178) and a blocking plate (179), the fixed plate (171) is fixedly installed on the surface of the machining plate (1), the moving rod (172) is slidably penetrated in the inside of the fixed plate (171), the No. 2 spring (173) is arranged between the moving rod (172) and the fixed plate (171), the movable plate (174) is fixedly installed on the side of the moving rod (172) close to the fixed plate (171), the handle rod (175) is fixedly installed on the side of the movable plate (174) away from the machining plate (1), the butt joint rod (176) is fixedly installed on the side of the movable plate (174) away from the handle rod (175), the connecting seat (177) is fixedly installed on the top of the fixed plate (171), the rotating plate (178) is rotatably installed in the inside of the connecting seat (177), and the blocking plate (179) is fixedly installed on the top of the fixed plate (171).

2. The silicon wafer cylinder processing and grinding device for semiconductor production according to claim 1, characterized in that: The T-shaped rod (9) is provided with a spherical surface one on the end close to the lifting plate (12), and the lifting plate (12) is provided with an inclined surface one on the side close to the T-shaped rod (9).

3. The silicon wafer cylinder processing and grinding device for semiconductor production according to claim 1, characterized in that: The arc-shaped strip (15) is elastic by itself, and is provided with an anti-skid groove on the side close to the rubber plate (11).

4. The silicon wafer cylinder processing and grinding device for semiconductor production according to claim 1, characterized in that: The elastic sheets (168) are equidistantly distributed on the inner wall of the moving frame (161) with the rectangular plate (163) as the symmetric axis, the limiting plate (166) is provided with an inclined surface two on the side close to the placing plate (2), and the limiting plate (166) is provided with a circular hole on the side away from the moving frame (161).

5. The silicon wafer cylinder processing and grinding apparatus for semiconductor production according to claim 4, characterized by: The elastic sheet (168) is provided with an arc surface one on the side away from the circular rod (169), and the elastic sheet (168) is in contact with the circumferential surface of the circular rod (169).

6. The silicon wafer cylinder processing and grinding apparatus for semiconductor production according to claim 1, characterized by: The rotating plate (178) is provided with a volute spring between the connecting seat (177), the rotating plate (178) is provided with a semicircular groove on the side away from the handle rod (175), and the rotating plate (178) is in contact with the blocking plate (179).

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