Flexible thin film device testing device and system

Abstract

The invention relates to the technical field of flexible thin film device testing, and particularly provides a flexible thin film device testing device and system, and the device comprises a case which is internally provided with a circulating ventilation channel and an experiment cavity; the heating assembly is arranged in the circulating ventilation channel and located below the experiment cavity; the cooling assembly is arranged in the circulating ventilation channel and located above the experiment cavity; the objective table is rotationally mounted in the experiment cavity; when the actual temperature in the experiment cavity is smaller than a first preset temperature, the heating assembly heats the gas in the circulating ventilation channel until the actual temperature in the experiment cavity rises to a first preset target temperature; or when the actual temperature in the experimental cavity is higher than a second preset temperature, the cooling assembly cools the gas in the circulating ventilation channel until the actual temperature in the experimental cavity is reduced to a second preset target temperature; the device can effectively improve the temperature uniformity and the air characteristic uniformity in the experiment cavity.

Description

Technical Field

[0001] This application relates to the field of flexible thin-film device testing technology, and more specifically, to a flexible thin-film device testing device and system. Background Technology

[0002] Related technologies utilize flexible thin-film device testing equipment to perform performance tests on flexible thin-film devices. During different testing stages, these technologies supply heated air, cooled air, dry air, and / or humidified air into the experimental chamber of the testing equipment. Since the density of air is related to its temperature and humidity, the temperature and / or humidity of the heated air, cooled air, dry air, and / or humidified air introduced into the experimental chamber will differ from the temperature and / or humidity of the original air in the experimental chamber. Since these technologies cannot actively adjust the temperature and humidity of the gas within the experimental chamber, there is a problem of poor air uniformity within the experimental chamber during the period when heated air, cooled air, dry air, and / or humidified air are supplied to the experimental chamber of the flexible thin-film device testing equipment. This leads to a decrease in the reliability and accuracy of the performance tests.

[0003] Currently, there is no effective technical solution to the above-mentioned problems. It should be noted that the information disclosed in this section is only for understanding the background of the present invention and therefore may include information that does not constitute prior art. Summary of the Invention

[0004] The purpose of this application is to provide a testing device and system for flexible thin film devices, which can effectively improve the temperature uniformity and air property uniformity within the experimental chamber.

[0005] In a first aspect, this application provides a testing apparatus for flexible thin-film devices, comprising: The chassis contains a circulating air exchange channel and an experimental chamber. The circulating air exchange channel is located between the chassis and the experimental chamber and is connected to the top and bottom of the experimental chamber. The heating element is located within the circulating air exchange channel and below the experimental chamber. The cooling assembly is located within the circulating air exchange channel and above the experimental chamber. The stage is rotatably mounted inside the experimental chamber and is used to place the flexible thin-film device to be tested. When the actual temperature inside the experimental chamber is lower than the first preset temperature, the heating component heats the gas in the circulating ventilation channel until the actual temperature inside the experimental chamber rises to the first preset target temperature, which is lower than the first preset target temperature. Alternatively, when the actual temperature inside the experimental chamber is greater than the second preset temperature, the cooling component cools the gas in the circulating ventilation channel until the actual temperature inside the experimental chamber drops to the second preset target temperature, which is greater than the second preset target temperature.

[0006] This application provides a flexible thin-film device testing device that utilizes the natural convection principle of hot air rising and cold air falling by introducing a circulating ventilation channel and placing the heating component below the experimental chamber and the cooling component above the experimental chamber. This allows the gas to form an efficient and uniform circulation flow between the circulating ventilation channel and the experimental chamber. This circulation flow mechanism ensures that the temperature inside the experimental chamber can quickly and uniformly reach and maintain the preset target temperature, and that the gas inside the experimental chamber is evenly distributed. Therefore, even if heated air, cooling air, dry air, and / or humidified air are introduced into the experimental chamber, this application can effectively avoid the accumulation of heated air, cooling air, dry air, and / or humidified air at the top or bottom of the experimental chamber by utilizing the circulation flow mechanism. This effectively improves the temperature uniformity and air characteristic uniformity inside the experimental chamber, thereby effectively improving the reliability and accuracy of flexible thin-film device performance testing.

[0007] Optionally, the flexible thin film device testing apparatus includes a circulation guide component, which is connected to a circulation ventilation channel. The circulation guide component is used to drive the gas in the circulation ventilation channel to flow from its top to its bottom.

[0008] Optionally, the flexible thin film device testing apparatus further includes a stress testing component, which is mounted on a stage. The flexible thin film device to be tested is placed on the stress testing component, which is used to perform stress testing on the flexible thin film device placed on it.

[0009] Optionally, the stress testing assembly includes a first clamping arm and a second clamping arm, which cooperate to clamp the flexible thin film device to be tested. The flexible thin film device testing device also includes an electromagnetic coupling assembly, which is disposed between the first clamping arm and the second clamping arm. The magnetic field direction of the end of the electromagnetic coupling assembly near the first clamping arm is opposite to the magnetic field direction of the end of the electromagnetic coupling assembly near the second clamping arm.

[0010] Optionally, the stage is provided with multiple right-angle spiral through holes.

[0011] Gas entering the experimental chamber through the connection port at the bottom of the chamber flows through a right-angle spiral through-hole. This right-angle spiral through-hole can change the flow direction of the gas entering the experimental chamber through the connection port at the bottom of the chamber, so as to prevent the gas entering the experimental chamber through the connection port at the bottom of the chamber from blowing directly onto the flexible thin film device under test. Therefore, this technical solution can effectively avoid the situation where the flexible thin film device under test is accidentally displaced due to excessive gas flow velocity entering the experimental chamber through the connection port at the bottom of the chamber, thus ensuring that the performance test can be carried out smoothly.

[0012] Optionally, the flexible thin film device testing device also includes a humidification component connected to a circulating air exchange channel. When the actual humidity in the experimental chamber is less than the preset humidity, the humidification component humidifies the gas in the circulating air exchange channel until the actual humidity reaches the preset humidity.

[0013] Optionally, both the heating and cooling components adopt a grid structure, and both the heating and cooling components are made of thermally conductive materials with a thermal conductivity greater than 300W / m*k.

[0014] Secondly, this application also provides a testing system for flexible thin-film devices, comprising: The chassis contains a circulating air exchange channel and an experimental chamber. The circulating air exchange channel is located between the chassis and the experimental chamber and is connected to the top and bottom of the experimental chamber. The heating element is located within the circulating air exchange channel and below the experimental chamber. The cooling assembly is located within the circulating air exchange channel and above the experimental chamber. The stage is rotatably mounted inside the experimental chamber and is used to place the flexible thin-film device to be tested. A visible light image acquisition component is installed inside the experimental chamber and is used to acquire visible light images of the flexible thin-film device under test. An infrared image acquisition component, installed inside the experimental chamber, is used to acquire infrared images of the flexible thin-film device under test. The controller is used to control the heating component to heat the gas in the circulating ventilation channel when the actual temperature inside the experimental chamber is lower than a first preset temperature, until the actual temperature inside the experimental chamber rises to a first preset target temperature, and the first preset temperature is lower than the first preset target temperature; or when the actual temperature inside the experimental chamber is higher than a second preset temperature, the cooling component to cool the gas in the circulating ventilation channel until the actual temperature inside the experimental chamber drops to a second preset target temperature, and the second preset temperature is higher than the second preset target temperature. It is also used to perform wavelet denoising on the infrared image and to perform saliency feature enhancement on the infrared and visible light images to obtain enhanced infrared and enhanced visible light images. Furthermore, it is used to perform dynamic spectral fusion on the enhanced infrared and enhanced visible light images to obtain a fused image. It is also used to perform infrared feature extraction and visual feature extraction on the fused image to obtain a first feature matrix and a second feature matrix, and then obtain a fused feature vector based on the first and second feature matrices. Finally, it is used to perform feature classification based on the fused feature vector and to locate the classified features.

[0015] This application provides a flexible thin-film device testing system that utilizes the natural convection principle of hot air rising and cold air falling by introducing a circulating ventilation channel and placing the heating component below the experimental chamber and the cooling component above the experimental chamber. This allows for an efficient and uniform gas circulation between the ventilation channel and the experimental chamber. This circulation mechanism ensures that the temperature inside the experimental chamber can quickly and uniformly reach and maintain the preset target temperature, and that the gas inside the experimental chamber is evenly distributed. Therefore, even when heated air, cooling air, dry air, and / or humidified air are introduced into the experimental chamber, this application can effectively prevent the heated air, cooling air, dry air, and / or humidified air from accumulating at the top or bottom of the experimental chamber by utilizing the circulation mechanism. This effectively improves the temperature uniformity and air characteristic uniformity inside the experimental chamber, thereby effectively improving the reliability and accuracy of flexible thin-film device performance testing.

[0016] Optionally, the process of dynamically fusing the enhanced infrared image and the enhanced visible light image to obtain the fused image includes: Band registration was performed on enhanced infrared and enhanced visible light images; Image fusion weights are assigned to the registered enhanced infrared and enhanced visible light images using a multilayer sensor and a gating function. Image fusion is performed on enhanced infrared and enhanced visible light images based on image fusion weights to obtain a fused image.

[0017] Optionally, the process of obtaining the fused feature vector based on the first feature matrix and the second feature matrix includes: Cross-attention fusion technology is used to extract features and assign weights to the first feature matrix and the second feature matrix to obtain multiple first preliminary features and their corresponding preliminary weights; Redundant features are removed from all first preliminary features using a feature selection gate to obtain multiple second preliminary features and their corresponding preliminary weights. The preliminary weights corresponding to each second preliminary feature are adjusted using a multilayer sensor and a gating function to obtain the fusion weights corresponding to each second preliminary feature; All the second preliminary features are dimensionality reduced and compressed to obtain multiple features to be fused; Feature fusion is performed based on all features to be fused and their corresponding fusion weights to obtain a fused feature vector.

[0018] As can be seen from the above, the flexible thin-film device testing apparatus and system provided in this application utilizes the natural convection principle of hot air rising and cold air falling by introducing a circulating ventilation channel design and placing the heating component below the experimental chamber and the cooling component above the experimental chamber. This allows the gas to form an efficient and uniform circulating flow between the circulating ventilation channel and the experimental chamber. This circulating flow mechanism ensures that the temperature in the experimental chamber can quickly and uniformly reach and maintain the preset target temperature and that the gas in the experimental chamber is evenly distributed. Therefore, even if heated air, cooling air, dry air and / or humidified air are introduced into the experimental chamber, this application can effectively avoid the accumulation of heated air, cooling air, dry air and / or humidified air at the top or bottom of the experimental chamber by utilizing the circulating flow mechanism. This effectively improves the temperature uniformity and air characteristic uniformity in the experimental chamber, thereby effectively improving the reliability and accuracy of flexible thin-film device performance testing. Attached Figure Description

[0019] Figure 1 This is a cross-sectional view of a flexible thin-film device testing apparatus provided in the first embodiment of this application.

[0020] Figure 2 This is a cross-sectional view of a flexible thin-film device testing apparatus provided in the second embodiment of this application.

[0021] Figure 3 This is a schematic diagram of a flexible thin-film device testing system provided in an embodiment of this application.

[0022] Figure 4 This is a schematic diagram of the control relationship of a flexible thin film device testing system provided in an embodiment of this application.

[0023] Reference numerals: 1. Chassis; 2. Circulating air exchange channel; 3. Experimental chamber; 4. Heating component; 5. Cooling component; 6. Stage; 7. Flexible thin film device under test; 8. Circulating airflow guide component; 9. Stress testing component; 91. First clamping arm; 92. Second clamping arm; 93. Mounting bracket; 94. Support shaft; 10. Electromagnetic coupling component; 11. Humidification component; 12. Visible light image acquisition component; 13. Infrared image acquisition component; 14. Controller; 15. First air exchange mesh; 16. Second air exchange mesh; 17. First external interface; 18. Second external interface; 19. Right-angle spiral through hole. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] In a first aspect, this application provides a testing apparatus for flexible thin-film devices, comprising: The chassis 1 has a circulating ventilation channel 2 and an experimental chamber 3 inside. The circulating ventilation channel 2 is located between the chassis 1 and the experimental chamber 3 and is connected to the top and bottom of the experimental chamber 3. Heating component 4 is located inside the circulating ventilation channel 2 and below the experimental chamber 3; Cooling component 5 is located inside the circulating air exchange channel 2 and above the experimental chamber 3; The stage 6 is rotatably mounted inside the experimental chamber 3 and is used to place the flexible thin film device 7 to be tested. When the actual temperature inside the experimental chamber 3 is lower than the first preset temperature, the heating component 4 heats the gas in the circulating ventilation channel 2 until the actual temperature inside the experimental chamber 3 rises to the first preset target temperature, which is lower than the first preset target temperature. Alternatively, when the actual temperature inside the experimental chamber 3 is greater than the second preset temperature, the cooling component 5 cools the gas in the circulating ventilation channel 2 until the actual temperature inside the experimental chamber 3 drops to the second preset target temperature, which is greater than the second preset target temperature.

[0027] The flexible thin-film device testing apparatus provided in this embodiment can be used to perform performance testing on the flexible thin-film device 7 to evaluate its reliability and stability under different environmental conditions. The flexible thin-film device 7 to be tested refers to a thin-film electronic device (such as a flexible display screen, flexible sensor, flexible battery, etc.) that requires performance testing and has flexible characteristics such as bendability and foldability. The experimental chamber 3 in this embodiment is a sealed space for placing the flexible thin-film device 7 to be tested and simulating specific environmental conditions. The circulating ventilation channel 2 in this embodiment refers to the gas flow path formed around the experimental chamber 3 inside the chassis 1. The first preset temperature in this embodiment is the temperature threshold for triggering the operation of the heating component 4, and the second preset temperature in this embodiment is the temperature threshold for triggering the operation of the cooling component 5. The first preset target temperature in this embodiment refers to the ideal temperature value that the experimental chamber 3 needs to reach during the operation of the heating component 4, and the second preset target temperature in this embodiment refers to the ideal temperature value that the experimental chamber 3 needs to reach during the operation of the cooling component 5.

[0028] Specifically, the flexible thin-film device testing apparatus of this application includes the following main features: First, the apparatus comprises a chassis 1, inside which is a circulating ventilation channel 2 and an experimental chamber 3. The circulating ventilation channel 2 is located between the chassis 1 and the experimental chamber 3, and communicates with the top and bottom of the experimental chamber 3. This design allows the gas to form a closed circulation path outside the experimental chamber 3 and exchange heat and humidity with the gas inside the experimental chamber 3. Preferably, the material of the experimental chamber 3 in this embodiment is a heat-insulating material to avoid the situation where the gas inside the experimental chamber 3 and the gas in the circulating ventilation channel 2 become close in temperature due to heat exchange between the gas inside the experimental chamber 3 and the gas in the circulating ventilation channel 2, thus affecting gas circulation. Second, the apparatus is provided with a heating component 4 and a cooling component 5. Heating component 4 is located within the circulation ventilation channel 2 and below the experimental chamber 3. Heating component 4 heats the gas within the circulation ventilation channel 2. This heating component 4 can be an electric heater or a hot air generator, etc. It should be understood that after being heated by the heating component 4, the gas density decreases. Therefore, the heated gas enters the experimental chamber 3 from below, driving the gas in the experimental chamber 3 to flow upwards and into the circulation ventilation channel 2, thus circulating the gas within the circulation ventilation channel 2 and the experimental chamber 3. Cooling component 5 is located within the circulation ventilation channel 2 and above the experimental chamber 3. This cooling component 5 can be a semiconductor cooling chip or a compressor cooling unit, etc. It should be understood that after being heated by the heating component 4, the gas density increases. Therefore, the cooled gas enters the experimental chamber 3 from above, driving the gas in the experimental chamber 3 to flow downwards and into the circulation ventilation channel 2, thus circulating the gas within the circulation ventilation channel 2 and the experimental chamber 3. Furthermore, the device also includes a stage 6, which is rotatably mounted within the experimental chamber 3 and used to place the flexible thin-film device 7 to be tested. The rotatable design of the stage 6 allows the flexible thin-film device 7 to be tested from multiple angles and directions within the experimental chamber 3, thereby providing a more comprehensive evaluation of its performance. It should be understood that this embodiment improves the convenience of placing and removing the flexible thin-film device by rotatably mounting the stage 6 within the experimental chamber 3. Finally, the device has an intelligent temperature control mechanism. This embodiment obtains the actual temperature within the experimental chamber 3 by installing a temperature sensor within the experimental chamber 3. When the actual temperature within the experimental chamber 3 is lower than a first preset temperature, the heating component 4 heats the gas in the circulating ventilation channel 2 until the actual temperature within the experimental chamber 3 rises to the first preset target temperature. Alternatively, when the actual temperature within the experimental chamber 3 is higher than a second preset temperature, the cooling component 5 cools the gas in the circulating ventilation channel 2 until the actual temperature within the experimental chamber 3 decreases to the second preset target temperature.This temperature threshold-based control method ensures that the temperature inside the experimental chamber 3 is always maintained near the preset target temperature (first preset target temperature or second preset target temperature) and utilizes hot or cold air to form natural convection inside the experimental chamber 3, so that the air inside the experimental chamber 3 is evenly distributed and provides a stable environment for testing flexible thin film devices.

[0029] The flexible thin-film device testing device of this application actively regulates the humidity and temperature of the gas in the experimental chamber 3 through the coordinated operation of the circulating ventilation channel 2, the heating component 4, and the cooling component 5. This effectively shortens the time required to uniformly distribute the gas introduced into the experimental chamber 3 at different testing stages, thereby effectively solving the problem of poor air uniformity in the experimental chamber 3 in the prior art. Specifically, when the actual temperature in the experimental chamber 3 is lower than the first preset temperature, the heating component 4 is activated to heat the gas in the circulating ventilation channel 2. The density of the heated gas decreases and it rises naturally, entering the experimental chamber 3 through the connecting port at the bottom of the experimental chamber 3 (which preferably has a first ventilation mesh 15). The hot air entering the experimental chamber 3 exchanges heat with the air in the experimental chamber 3 and drives the air in the experimental chamber 3 to flow upward, so that the air in the experimental chamber 3 is uniformly distributed, thereby improving the air uniformity in the experimental chamber 3. When the actual temperature inside the experimental chamber 3 is greater than the second preset temperature, the cooling component 5 is activated to cool the gas in the circulating ventilation channel 2. The density of the cooled gas increases and it naturally decreases, entering the experimental chamber 3 through the connecting port at the top of the experimental chamber 3 (which preferably has a second ventilation net 16). The cold air entering the experimental chamber 3 will exchange heat with the air inside the experimental chamber 3 and drive the air inside the experimental chamber 3 to flow downward, so that the air inside the experimental chamber 3 is evenly distributed, thereby improving the uniformity of the air characteristics inside the experimental chamber 3.

[0030] This application provides a flexible thin-film device testing device that utilizes the natural convection principle of hot air rising and cold air falling by introducing a circulating ventilation channel 2 and placing the heating component 4 below the experimental chamber 3 and the cooling component 5 above the experimental chamber 3. This allows for an efficient and uniform gas circulation between the circulating ventilation channel 2 and the experimental chamber 3. This circulation mechanism ensures that the temperature inside the experimental chamber 3 can quickly and uniformly reach and maintain a preset target temperature (first preset target temperature or second preset target temperature) and that the gas inside the experimental chamber 3 is evenly distributed. Therefore, even if heated air, cooling air, dry air, and / or humidified air are introduced into the experimental chamber 3, this application can effectively avoid the accumulation of heated air, cooling air, dry air, and / or humidified air at the top or bottom of the experimental chamber 3 by utilizing the circulation mechanism. This effectively improves the temperature uniformity and air characteristic uniformity inside the experimental chamber 3, thereby effectively improving the reliability and accuracy of flexible thin-film device performance testing.

[0031] In some preferred embodiments, the flexible thin-film device testing apparatus includes a circulation guide assembly 8, which is connected to the circulation ventilation channel 2. The circulation guide assembly 8 is used to drive unidirectional flow of gas within the circulation ventilation channel 2. The circulation guide assembly 8 in this embodiment can be understood as a device capable of generating airflow. Preferably, the circulation guide assembly 8 consists of two fan groups, one of which drives the gas within the circulation ventilation channel 2 to flow from bottom to top, and the other fan group drives the gas within the circulation ventilation channel 2 to flow from top to bottom. When the heating assembly 4 is operating, the fan group driving the gas within the circulation ventilation channel 2 to flow from top to bottom is pneumatically activated. When the cooling assembly 5 is operating, the fan group driving the gas within the circulation ventilation channel 2 to flow from bottom to top is activated. The circulating airflow guide component 8 can form a stable and directional circulating airflow by driving the gas in the circulating ventilation channel 2 to flow in one direction, thereby improving the convection efficiency of the experimental chamber 3 and helping to eliminate the temperature gradient in the experimental chamber 3. Therefore, this embodiment effectively improves the heat exchange efficiency between the gas entering the experimental chamber 3 through the circulating ventilation channel 2 and the original gas in the experimental chamber 3, thereby further avoiding the accumulation of heated air, cooling air, dry air and / or humid air at the top or bottom of the experimental chamber 3.

[0032] In some preferred embodiments, the flexible thin-film device testing apparatus further includes a stress testing component 9, which is mounted on a stage 6. The flexible thin-film device 7 to be tested is placed on the stress testing component 9, and the stress testing component 9 is used to perform stress testing on the flexible thin-film device 7 placed on it. In this embodiment, the stress testing component 9 refers to a device capable of applying a preset mechanical load to the flexible thin-film device and measuring its response. The stress testing component 9 is mounted on the stage 6 and is used to perform stress testing on the flexible thin-film device 7 under a controlled temperature environment. Specifically, the stress testing component 9 in this embodiment can simulate the mechanical environment that the flexible thin-film device may encounter in actual use by applying stresses in the form of tension, bending, torsion, or compression to the flexible thin-film device 7 to evaluate key parameters such as the structural integrity, electrical performance changes, and fatigue life of the flexible thin-film device under different stress conditions. This embodiment enables stress testing of the flexible thin-film device 7 under controlled temperature conditions by installing the stress testing component 9 on the stage 6. In other words, the flexible thin-film device testing device of this embodiment can test the performance of the flexible thin-film device under different combinations of temperature and stress conditions. Therefore, this flexible thin-film device testing device can perform multi-environmental comprehensive factor (temperature and stress) testing on the flexible thin-film device, effectively avoiding the situation where existing flexible thin-film device testing devices only perform single-environmental factor testing (e.g., measuring the performance of the flexible thin-film device under different temperatures or stresses), resulting in test results that cannot accurately reflect the performance of the flexible thin-film device in actual complex environments. This effectively improves the reliability and accuracy of flexible thin-film device performance testing.

[0033] In some preferred embodiments, the stress testing assembly 9 includes a first clamping arm 91 and a second clamping arm 92, which cooperate to clamp the flexible thin film device 7 to be tested. The flexible thin film device testing device also includes an electromagnetic coupling assembly 10, which is disposed between the first clamping arm 91 and the second clamping arm 92. The magnetic field direction of the end of the electromagnetic coupling assembly 10 near the first clamping arm 91 is opposite to the magnetic field direction of the end of the electromagnetic coupling assembly 10 near the second clamping arm 92. The stress testing assembly 9 of this embodiment includes a first clamping arm 91 and a second clamping arm 92. The first clamping arm 91 and the second clamping arm 92 are configured to fix the two end regions of the flexible thin film device 7 to be tested, so as to ensure that the flexible thin film device can be stably held when stress is applied. Preferably, the stress testing assembly 9 of this embodiment also includes a mounting frame 93, a support shaft 94 and a rotating assembly. The mounting frame 93 is mounted on the stage 6. The first clamping arm 91 and the second clamping arm 92 are symmetrically mounted on the mounting frame 93 and are both slidably connected to the mounting frame 93. The support shaft 94 is located between the first clamping arm 91 and the second clamping arm 92 and is slidably mounted on the mounting frame 93. The support shaft 94 is tightly The flexible thin film device 7 to be tested is attached. The rotating component is used to drive the support shaft 94 to rotate around its axis. The support shaft 94 is provided with a clamping component (not shown in the figure). The clamping component is used to clamp and fix the flexible thin film device 7 to be tested on the support shaft 94. In this embodiment, the bending test of the flexible thin film device 7 to be tested can be performed by moving the first clamping arm 91 and the second clamping arm 92 toward the center of the electromagnetic coupling component 10. In this embodiment, the winding test of the flexible thin film device 7 to be tested can be performed by first clamping and fixing the flexible thin film device 7 to be tested on the support shaft 94 with the clamping component, and then driving the support shaft 94 to rotate around its axis with the rotating component. The electromagnetic coupling component 10 of this embodiment can be understood as a device capable of generating a controllable magnetic field. Preferably, the electromagnetic coupling component 10 is a conventional electromagnetic coupling device. The electromagnetic coupling component 10 is disposed between the first clamping arm 91 and the second clamping arm 92. This embodiment can control the state of the flexible thin-film device 7 under test by generating a controllable magnetic field using the electromagnetic coupling component 10, thereby monitoring the performance changes of the flexible thin-film device 7 in real time. This embodiment can counteract stray magnetic field interference by making the magnetic field direction of the end of the electromagnetic coupling component 10 near the first clamping arm 91 opposite to the magnetic field direction of the end near the second clamping arm 92, thereby improving the state control accuracy of the flexible thin-film device 7 under test. Preferably, the magnetic field strength generated by the electromagnetic coupling component 10 of this embodiment is as follows: Where H represents the magnetic field strength, N represents the number of coil turns (preset value), I represents the current (preset value), and l magThe magnetic circuit length (preset value) is represented by M, the amplitude of the alternating magnetic field (preset value) is represented by β, the attenuation coefficient (preset value) is represented by ω, and the angular frequency (preset value) is represented by ω. Preferably, the flexible thin-film device testing device of this embodiment further includes a mechanical sensor for acquiring the actual stress of the flexible thin-film device 7 under test. When the actual stress reaches the preset stress, this embodiment controls the stress measurement component to stop performing stress experiments on the flexible thin-film device 7 under test, so as to avoid damage to the flexible thin-film device 7 due to excessive stress.

[0034] In some preferred embodiments, the stage 6 is provided with multiple right-angled spiral through holes 19. Gas entering the experimental chamber 3 through the communication port at the bottom of the experimental chamber 3 flows through the right-angled spiral through holes 19. These right-angled spiral through holes 19 can change the flow direction of the gas entering the experimental chamber 3 through the communication port at the bottom of the experimental chamber 3, so as to prevent the gas entering the experimental chamber 3 through the communication port at the bottom of the experimental chamber 3 from directly blowing the flexible thin film device 7 under test. Therefore, this embodiment can effectively avoid the situation where the flexible thin film device 7 under test is unexpectedly displaced due to the excessive flow rate of the gas entering the experimental chamber 3 through the communication port at the bottom of the experimental chamber 3, so as to ensure that the performance test can be carried out smoothly.

[0035] In some preferred embodiments, the flexible thin-film device testing apparatus further includes a humidification component 11, which is connected to the circulating ventilation channel 2. When the actual humidity in the experimental chamber 3 is less than a preset humidity, the humidification component 11 humidifies the gas in the circulating ventilation channel 2 until the actual humidity reaches the preset humidity. In this embodiment, the humidification component 11 is a device capable of adding water vapor to the gas. The humidification component 11 can be an existing ultrasonic atomizer, which atomizes water into tiny particles through high-frequency vibration and then guides them into the circulating ventilation channel 2 through a fan or airflow. Alternatively, the humidification component 11 can be an existing steam generator, which heats water to generate steam and then introduces the steam into the circulating ventilation channel 2. This embodiment can obtain the actual humidity of the experimental chamber 3 by setting a humidity sensor inside the chamber. When the actual humidity is lower than the preset humidity, this embodiment uses the humidification component 11 to humidify the gas in the circulating ventilation channel 2. The humidified gas enters the experimental chamber 3 with the circulation flow of the circulating ventilation channel 2, thereby changing the humidity environment inside the experimental chamber 3. Therefore, this embodiment can flexibly set and maintain the humidity inside the experimental chamber 3 according to the characteristics and testing requirements of the flexible thin-film device 7 under test, to ensure the comprehensiveness and accuracy of the testing environment, thereby further improving the reliability and accuracy of the performance testing of flexible thin-film devices. Preferably, this embodiment uses the following formula for humidity control: ; where RH represents the humidity content of the air. This indicates the humidification rate of the humidification component 11. The condensation rate is determined based on the cooling temperature of cooling component 5. The air mass is defined as the mass of the air inside experimental chamber 3. The temperature control formula in this embodiment is preferably similar to the humidity control formula.

[0036] In some preferred embodiments, when the actual temperature inside the experimental chamber 3 is less than the first preset temperature and the difference between the actual temperature and the first preset temperature is greater than the first preset threshold, the heating component 4 heats the gas in the circulating ventilation channel 2 with the first heating power. When the actual temperature inside the experimental chamber 3 is less than the first preset temperature and the difference between the actual temperature and the first preset temperature is less than or equal to the first preset threshold, the heating component 4 heats the gas in the circulating ventilation channel 2 with the second heating power until the actual temperature inside the experimental chamber 3 rises to the preset target temperature, and the first heating power is greater than the second heating power. This embodiment is equivalent to the following: when the actual temperature inside the experimental chamber 3 is lower than the first preset temperature and the difference between the actual temperature and the first preset temperature is large (greater than the first preset threshold), the heating component 4 is used to heat the gas in the circulating ventilation channel 2 with a large heating power so that the actual temperature inside the experimental chamber 3 quickly approaches the preset target temperature; when the actual temperature inside the experimental chamber 3 is lower than the first preset temperature and the difference between the actual temperature and the first preset temperature is small (less than or equal to the first preset threshold), the heating component 4 is used to heat the gas in the circulating ventilation channel 2 with a small heating power so that the actual temperature inside the experimental chamber 3 slowly approaches the preset target temperature so that the actual temperature accurately reaches the preset target temperature.

[0037] In some preferred embodiments, when the actual temperature inside the experimental chamber 3 is greater than the second preset temperature and the difference between the actual temperature and the second preset temperature is greater than the second preset threshold, the cooling component 5 cools the gas in the circulating ventilation channel 2 with the first cooling power. When the actual temperature inside the experimental chamber 3 is greater than the second preset temperature and the difference between the actual temperature and the second preset temperature is less than or equal to the second preset threshold, the cooling component 5 cools the gas in the circulating ventilation channel 2 with the second cooling power until the actual temperature inside the experimental chamber 3 drops to the preset target temperature, and the first cooling power is greater than the second cooling power. This embodiment is equivalent to the following: when the actual temperature inside the experimental chamber 3 is lower than the second preset temperature and the difference between the actual temperature and the second preset temperature is large (greater than the second preset threshold), the cooling component 5 is used to cool the gas in the circulating ventilation channel 2 with a large cooling power, so that the actual temperature inside the experimental chamber 3 quickly approaches the preset target temperature; when the actual temperature inside the experimental chamber 3 is lower than the second preset temperature and the difference between the actual temperature and the second preset temperature is small (less than or equal to the second preset threshold), the cooling component 5 is used to cool the gas in the circulating ventilation channel 2 with a small cooling power, so that the actual temperature inside the experimental chamber 3 slowly approaches the preset target temperature, so that the actual temperature accurately reaches the preset target temperature.

[0038] In some preferred embodiments, both the heating component 4 and the cooling component 5 adopt a grid structure, and both are made of thermally conductive materials with a thermal conductivity greater than 300 W / m*K. A grid structure refers to the heating component 4 and the cooling component 5 being constructed with a mesh-like or grille-like structure (e.g., concentric circles, arrays, rows, or columns of stripes). This embodiment increases the contact area between the heating component 4 and the cooling component 5 and the gas in the circulating ventilation channel 2, thereby improving heat exchange efficiency. In this embodiment, both the heating component 4 and the cooling component 5 are made of thermally conductive materials with a thermal conductivity greater than 300 W / m*K (e.g., copper, aluminum oxide, aluminum nitride, boron nitride, silicon carbide, diamond, graphene, or graphite). This embodiment improves the heat exchange efficiency between the heating component 4 and the cooling component 5 and the gas in the circulating ventilation channel 2 by selecting thermally conductive materials with a thermal conductivity greater than 300 W / m*K. Preferably, this embodiment utilizes the Nusselt number to optimize the grid structure of the heating component 4 and the cooling component 5. The formula for calculating the Nusselt number is: Where Nu represents the Nusselt number, and h represents the convective heat transfer coefficient (calculated using the formula: Where Q represents heat (preset value), A represents surface area (preset value), ΔT represents temperature difference (preset value), L represents the characteristic length of the grid structure (preset value, which can be the grid spacing), k represents the preset gas thermal conductivity, and Re represents the Reynolds number (calculated using the formula: Where ρ represents gas density (preset value), v represents gas flow rate (preset value), μ represents gas viscosity (preset value), and Pr represents Prandtl number (calculated using the formula: Where μ represents the gas viscosity (preset value), C p , where k represents the specific heat capacity of the gas (preset value), and k represents the preset thermal conductivity of the gas. C, m, and n are all preset coefficients.

[0039] In some preferred embodiments, the side of the chassis 1 is provided with a first external interface 17 and a second external interface 18, with the first external interface 17 located below the second external interface 18. This embodiment enables the circulating ventilation channel 2 to communicate with external devices using the first external interface 17 and the second external interface 18. When the heating component 4 heats the gas in the circulating ventilation channel 2, or when the heating rate of the heating component 4 cannot meet the heating requirements of the gas in the circulating ventilation channel 2, this embodiment connects the first external interface 17 to an external heating device to supply heated gas to the circulating ventilation channel 2, thereby increasing the heating rate of the gas in the circulating ventilation channel 2 and ensuring that the heating rate meets the heating requirements of the gas in the circulating ventilation channel 2. When the actual humidity in the experimental chamber 3 is less than the preset humidity, this embodiment connects the first external interface 17 to the humidification component 11 to supply humidified gas to the circulating ventilation channel 2, thereby ensuring that the humidification rate meets the humidification requirements of the gas in the circulating ventilation channel 2. It should be understood that when the first external interface 17 is connected to an external heating device or humidification component 11, the second external interface 18 is connected to an air extraction component (e.g., a vacuum pump) to maintain the internal air pressure of the flexible thin film device testing device. When the cooling component 5 cools the gas in the circulating ventilation channel 2, or when the cooling rate of the cooling component 5 cannot meet the cooling requirements of the gas in the circulating ventilation channel 2, this embodiment connects the second external interface 18 to an external refrigeration device to supply cooling gas to the circulating ventilation channel 2, thereby increasing the cooling rate of the gas in the circulating ventilation channel 2 and ensuring that the cooling rate meets the cooling requirements of the gas in the circulating ventilation channel 2. When the actual humidity in the experimental chamber 3 is greater than the preset humidity, this embodiment connects the second external interface 18 to an external drying device to supply dry gas to the circulating ventilation channel 2, thereby reducing the actual humidity in the experimental chamber 3. It should be understood that when the second external interface 18 is connected to an external refrigeration device or an external drying device, the first external interface 17 is connected to an air extraction component (e.g., a vacuum pump) to maintain the internal air pressure of the flexible thin film device testing device.

[0040] As can be seen from the above, the flexible thin-film device testing device provided in this application utilizes the natural convection principle of hot air rising and cold air falling by introducing a circulating ventilation channel 2 and placing the heating component 4 below the experimental chamber 3 and the cooling component 5 above the experimental chamber 3. This allows the gas to form an efficient and uniform circulating flow between the circulating ventilation channel 2 and the experimental chamber 3. This circulating flow mechanism ensures that the temperature in the experimental chamber 3 can quickly and uniformly reach and maintain the preset target temperature and that the gas in the experimental chamber 3 is evenly distributed. Therefore, even if heated air, cooling air, dry air and / or humidified air are introduced into the experimental chamber 3, this application can effectively avoid the accumulation of heated air, cooling air, dry air and / or humidified air at the top or bottom of the experimental chamber 3 by utilizing the circulating flow mechanism. This effectively improves the temperature uniformity and air characteristic uniformity in the experimental chamber 3, thereby effectively improving the reliability and accuracy of flexible thin-film device performance testing.

[0041] Secondly, such as Figure 4 As shown, this application also provides a flexible thin-film device testing system, which includes: The chassis 1 has a circulating ventilation channel 2 and an experimental chamber 3 inside. The circulating ventilation channel 2 is located between the chassis 1 and the experimental chamber 3 and is connected to the top and bottom of the experimental chamber 3. Heating component 4 is located inside the circulating ventilation channel 2 and below the experimental chamber 3; Cooling component 5 is located inside the circulating air exchange channel 2 and above the experimental chamber 3; The stage 6 is rotatably mounted inside the experimental chamber 3 and is used to place the flexible thin film device 7 to be tested. Visible light image acquisition component 12 is installed inside experimental cavity 3 and is used to acquire visible light images containing the flexible thin film device 7 to be tested; Infrared image acquisition component 13 is installed inside experimental cavity 3 and is used to acquire infrared images containing the flexible thin film device 7 to be tested; The controller 14 is used to control the heating component 4 to heat the gas in the circulating ventilation channel 2 when the actual temperature in the experimental chamber 3 is lower than the first preset temperature, until the actual temperature in the experimental chamber 3 rises to the first preset target temperature, and the first preset temperature is lower than the first preset target temperature; or to control the cooling component 5 to cool the gas in the circulating ventilation channel 2 when the actual temperature in the experimental chamber 3 is higher than the second preset temperature, until the actual temperature in the experimental chamber 3 drops to the second preset target temperature, and the second preset temperature is higher than the second preset target temperature. It is also used to perform wavelet denoising on the infrared image and to perform saliency feature enhancement on the infrared and visible light images to obtain enhanced infrared and enhanced visible light images. Furthermore, it is used to perform dynamic spectral fusion on the enhanced infrared and enhanced visible light images to obtain a fused image. It is also used to perform infrared feature extraction and visual feature extraction on the fused image to obtain a first feature matrix and a second feature matrix, and then obtain a fused feature vector based on the first and second feature matrices. Finally, it is used to perform feature classification based on the fused feature vector and to locate the classified features.

[0042] The chassis 1, circulating ventilation channel 2, experimental chamber 3, heating component 4, cooling component 5, and stage 6 provided in this embodiment are preferably the same as those provided in the above embodiments, and will not be discussed in detail here. The visible light image acquisition component 12 in this embodiment can be a high-resolution CCD camera or CMOS camera. This visible light image acquisition component 12 acquires visible light images containing the flexible thin-film device 7 under test by real-time imaging of the flexible thin-film device 7 within the experimental chamber 3 through an optical lens. This embodiment can utilize visible light images to obtain visual information such as the surface morphology, color, and texture of the flexible thin-film device 7 under test. The infrared image acquisition component 13 in this embodiment can be an existing thermal imager. This infrared image acquisition component 13 acquires infrared images containing the flexible thin-film device 7 under test by detecting the infrared radiation emitted by the device. This embodiment can utilize infrared images to obtain temperature distribution information of the flexible thin-film device 7 under test, thereby identifying defects, hot spots, or abnormally heated areas inside the flexible thin-film device 7 under test.

[0043] The controller 14 in this embodiment can perform wavelet denoising on the infrared image to improve its clarity and signal-to-noise ratio. Specifically, this embodiment uses the following formula for wavelet denoising: Among them, I denoised W represents the image obtained after wavelet denoising. -1 This represents the inverse wavelet transform. Let W represent the thresholding function, W represent the wavelet forward transform, and I represent the thresholding function. ir Indicating an infrared image, Ibg The background image is represented. In this embodiment, the controller 14 can significantly enhance the infrared and visible light images by adjusting their contrast and brightness, or by applying algorithms such as edge enhancement and texture enhancement to make features related to device defects or anomalies more prominent. This highlights the visual and thermal features in the infrared and visible light images that are crucial for evaluating the performance of flexible thin-film devices. The controller 14 in this embodiment can also dynamically spectrally fuse the enhanced infrared and enhanced visible light images by integrating the image information from the two modalities (enhanced infrared and enhanced visible light images) using methods such as pixel-level weighted averaging, maximum value fusion, or wavelet transform fusion, to generate a fused image containing richer information. The controller 14 in this embodiment can extract representative infrared features (thermodynamic features and energy distribution features) and visual features (such as texture features and geometric features) from the fused image using feature extraction algorithms such as SIFT, SURF, and HOG. Preferably, the first feature matrix in this embodiment is the matrix obtained after extracting infrared features from the fused image, and the second feature matrix is ​​the matrix obtained after extracting visual features from the fused image. The controller 14 in this embodiment can use machine learning classifiers such as Support Vector Machine (SVM), neural networks, and decision trees to classify the fused feature vectors. The controller 14 in this embodiment can use image coordinate mapping to locate the classified features. This embodiment is equivalent to using visible light images and infrared images to monitor the real-time state changes of the flexible thin-film device 7 under test.

[0044] The core innovation of this application lies in the deep integration of precise environmental temperature control with advanced multimodal image acquisition and intelligent analysis technology. Specifically, this application simultaneously acquires surface visual information and internal thermal information of the device by introducing a visible light image acquisition component 12 and an infrared image acquisition component 13 to form a complementary dataset. This application achieves a complete chain from data acquisition to intelligent analysis by performing a series of refined processing on these multi-source heterogeneous data (including noise reduction, saliency feature enhancement, dynamic spectral fusion, multimodal feature extraction, and final feature classification and localization). Therefore, this application can achieve the following beneficial effects: 1. Improved testing comprehensiveness: It can not only detect visible surface defects, but also discover internal thermal anomalies or hidden damage through infrared images; 2. Improved testing accuracy: Through multimodal image fusion and feature enhancement, it can more clearly identify and distinguish different types of defects, reducing false positives and false negatives; 3. Enhanced intelligence: The controller 14 automatically completes complex image processing and defect identification tasks, reducing reliance on human experience and improving detection efficiency and consistency.

[0045] Therefore, the flexible thin film device testing system of this application can provide a more stable and uniform testing environment for flexible thin film devices. On this basis, through intelligent analysis of multimodal images, it can achieve a deeper, more comprehensive and more accurate evaluation of device performance and defects. It effectively overcomes the testing errors and limitations caused by single testing methods or insufficient data processing capabilities in the prior art, and significantly improves the overall level and intelligence of flexible thin film device testing.

[0046] In some preferred embodiments, the process of dynamically fusing enhanced infrared and enhanced visible light images to obtain a fused image includes: Band registration was performed on enhanced infrared and enhanced visible light images; Image fusion weights are assigned to the registered enhanced infrared and enhanced visible light images using a multilayer sensor and a gating function. Image fusion is performed on enhanced infrared and enhanced visible light images based on image fusion weights to obtain a fused image.

[0047] Band registration of enhanced infrared and enhanced visible light images refers to ensuring that image data from different spectra (infrared and visible light) are spatially aligned before image fusion. This embodiment can utilize existing geometric transformations, feature point matching, or image registration algorithms to achieve band registration. This embodiment can effectively eliminate image deviations caused by factors such as sensor position, viewing angle, or distortion by performing band registration of enhanced infrared and enhanced visible light images, thereby ensuring the accuracy and effectiveness of subsequent fusion. Because this embodiment utilizes a multilayer sensor and a gating function to assign image fusion weights to the registered enhanced infrared and enhanced visible light images, it effectively prevents the image fusion process from simply averaging or proportionally superimposing the images. Specifically, the multilayer sensor can be configured to learn and recognize different features in the infrared and visible light images (e.g., thermal information and temperature distribution in the infrared image, and texture details and edge information in the visible light image). The gating function dynamically adjusts the weight of each image in the fusion result based on the saliency or importance of these features. For example, in regions where infrared features (such as thermal anomalies) are more important, the weight of the infrared image is increased; while in regions where visible light features (such as structural details) are more important, the weight of the visible light image is increased. This dynamic weight allocation mechanism allows the fusion process to adaptively highlight the advantageous information of different images, thereby generating a more informative fused image. This embodiment can utilize existing image fusion techniques (such as weighted averaging, wavelet transform fusion, or multi-scale decomposition fusion) to perform image fusion of enhanced infrared and enhanced visible light images according to the image fusion weights. Specifically, this embodiment uses the following formula for image fusion: Where Ffused represents the fused image, This represents the results of feature recognition using a multilayer sensor on infrared and visible light images. This represents the fusion weights assigned to the infrared image based on the feature recognition results of the multilayer sensor using a gating function. Equivalent to F ir Indicates an infrared image, F vis Represents a visible light image. This indicates that features at the same positions in the feature matrices corresponding to the infrared and visible light images are added together. This indicates multiplication of features in the feature matrix. This embodiment effectively improves the accuracy of image fusion by performing band registration on enhanced infrared and enhanced visible light images. By utilizing a multilayer sensor and gating functions for dynamic weight allocation, the fusion process intelligently highlights the advantageous information of different spectra based on image content, avoiding the limitations of fixed-weight fusion. Therefore, the fused image in this embodiment not only clearly displays the thermal characteristics of the target but also retains rich visual details, providing a more comprehensive and reliable data foundation for subsequent feature extraction, classification, and localization, thereby improving the accuracy and efficiency of flexible thin-film device detection.

[0048] In some preferred embodiments, the process of obtaining the fused feature vector based on the first feature matrix and the second feature matrix includes: Cross-attention fusion technology is used to extract features and assign weights to the first feature matrix and the second feature matrix to obtain multiple first preliminary features and their corresponding preliminary weights; Redundant features are removed from all first preliminary features using a feature selection gate to obtain multiple second preliminary features and their corresponding preliminary weights. The preliminary weights corresponding to each second preliminary feature are adjusted using a multilayer sensor and a gating function to obtain the fusion weights corresponding to each second preliminary feature; All the second preliminary features are dimensionality reduced and compressed to obtain multiple features to be fused; Feature fusion is performed based on all features to be fused and their corresponding fusion weights to obtain a fused feature vector.

[0049] The first feature matrix and the second feature matrix represent the infrared and visual features extracted from the fused image, respectively. To effectively fuse these heterogeneous features, this embodiment utilizes cross-attention fusion technology to extract features and assign weights to the first and second feature matrices. The cross-attention mechanism allows the model to simultaneously focus on relevant features of another modality while processing features of one modality, thereby achieving cross-modal information interaction and complementarity. In this way, multiple first preliminary features and their corresponding preliminary weights can be obtained. These preliminary features contain preliminary fusion information from the infrared and visible light modalities, and these weights reflect their importance in the preliminary fusion process. This embodiment improves the quality of features used for image fusion and reduces the computational burden by using a feature selection gate to remove redundant features from all first preliminary features. Specifically, the feature selection gate is a screening mechanism that identifies and eliminates preliminary features that contribute little to the final classification or localization, or may even introduce noise or redundant information, based on preset discrimination criteria or learned rules. That is, compared to the first preliminary features, the second preliminary features in this embodiment are more representative and discriminative. The process of adjusting the preliminary weights corresponding to each second preliminary feature in this embodiment is similar to the process of image fusion weight allocation for enhanced infrared and enhanced visible light images in the above embodiment, and will not be discussed in detail here. This embodiment can reduce the dimension of the feature vector while retaining as much key information as possible in the original features by performing dimensionality reduction compression on all second preliminary features. This embodiment can achieve dimensionality reduction compression through principal component analysis (PCA), linear discriminant analysis (LDA), or other dimensionality reduction techniques in deep learning. This embodiment can reduce the complexity of subsequent processing by performing dimensionality reduction compression on all second preliminary features and may eliminate some potential noise.

[0050] This application's solution effectively addresses the problems of redundant information, uneven feature weight distribution, and poor fusion results that may exist in traditional feature fusion by introducing a multi-stage, refined feature fusion strategy. Specifically, firstly, cross-attention fusion technology enables deep interaction between infrared and visual features in the initial fusion stage, ensuring the complementarity of information between different modalities and avoiding information loss or confusion that may result from simple splicing. Secondly, by introducing a feature selection gate, redundant or low-value features that contribute significantly to the final decision are actively identified and eliminated, thereby purifying the feature space and improving the purity and discriminative power of the features. Thirdly, by using a multi-layer sensor and gating function to dynamically adjust the initial weights, the importance of each feature can be accurately evaluated and allocated, ensuring that key features receive sufficient attention during the fusion process while secondary features are appropriately suppressed. Finally, by performing dimensionality reduction and compression on the second initial features, the feature dimensionality is effectively reduced while retaining core information, further reducing the computational burden and improving the compactness and robustness of the fused features.

[0051] As can be seen from the above, the flexible thin-film device testing apparatus and system provided in this application utilizes the natural convection principle of hot air rising and cold air falling by introducing a circulating ventilation channel 2 and placing the heating component 4 below the experimental chamber 3 and the cooling component 5 above the experimental chamber 3. This allows the gas to form an efficient and uniform circulating flow between the circulating ventilation channel 2 and the experimental chamber 3. This circulating flow mechanism ensures that the temperature in the experimental chamber 3 can quickly and uniformly reach and maintain the preset target temperature and that the gas in the experimental chamber 3 is evenly distributed. Therefore, even if heated air, cooling air, dry air and / or humidified air are introduced into the experimental chamber 3, this application can effectively avoid the accumulation of heated air, cooling air, dry air and / or humidified air at the top or bottom of the experimental chamber 3 by utilizing the circulating flow mechanism. This effectively improves the temperature uniformity and air characteristic uniformity in the experimental chamber 3, thereby effectively improving the reliability and accuracy of flexible thin-film device performance testing.

[0052] In the embodiments provided in this application, it should be understood that relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0053] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A testing device for flexible thin-film devices, characterized in that, The flexible thin-film device testing apparatus includes: The chassis has a circulating ventilation channel and an experimental chamber inside. The circulating ventilation channel is located between the chassis and the experimental chamber and communicates with the top and bottom of the experimental chamber. A heating component is disposed within the circulating ventilation channel and located below the experimental chamber; A cooling assembly is disposed within the circulating air exchange channel and located above the experimental chamber; The stage is rotatably mounted inside the experimental chamber and is used to place the flexible thin-film device to be tested. When the actual temperature inside the experimental chamber is less than the first preset temperature, the heating component heats the gas in the circulating ventilation channel until the actual temperature inside the experimental chamber rises to the first preset target temperature, where the first preset temperature is less than the first preset target temperature. Alternatively, if the actual temperature inside the experimental chamber is greater than the second preset temperature, the cooling component cools the gas in the circulating ventilation channel until the actual temperature inside the experimental chamber drops to the second preset target temperature, which is greater than the second preset target temperature.

2. The flexible thin-film device testing apparatus according to claim 1, characterized in that, The flexible thin film device testing device includes a circulation guide component, which is connected to the circulation ventilation channel. The circulation guide component is used to drive the gas in the circulation ventilation channel to flow from its top to its bottom.

3. The flexible thin-film device testing apparatus according to claim 1, characterized in that, The flexible thin film device testing apparatus further includes a stress testing component, which is mounted on the stage. The flexible thin film device to be tested is placed on the stress testing component, and the stress testing component is used to perform stress testing on the flexible thin film device to be tested placed on it.

4. The flexible thin-film device testing apparatus according to claim 3, characterized in that, The stress testing assembly includes a first clamping arm and a second clamping arm, which cooperate to clamp the flexible thin film device to be tested. The flexible thin film device testing device also includes an electromagnetic coupling assembly, which is disposed between the first clamping arm and the second clamping arm. The magnetic field direction of the end of the electromagnetic coupling assembly near the first clamping arm is opposite to the magnetic field direction of the end of the electromagnetic coupling assembly near the second clamping arm.

5. The flexible thin-film device testing apparatus according to claim 1, characterized in that, The platform is provided with multiple right-angle spiral through holes.

6. The flexible thin-film device testing apparatus according to claim 1, characterized in that, The flexible thin-film device testing device also includes a humidification component connected to the circulating ventilation channel. When the actual humidity in the experimental chamber is less than the preset humidity, the humidification component humidifies the gas in the circulating ventilation channel until the actual humidity reaches the preset humidity.

7. The flexible thin-film device testing apparatus according to claim 1, characterized in that, Both the heating and cooling components adopt a grid structure, and the materials of both the heating and cooling components are thermally conductive materials with a thermal conductivity greater than 300W / m*k.

8. A testing system for flexible thin-film devices, characterized in that, The flexible thin-film device testing system includes: The chassis has a circulating ventilation channel and an experimental chamber inside. The circulating ventilation channel is located between the chassis and the experimental chamber and communicates with the top and bottom of the experimental chamber. A heating component is disposed within the circulating ventilation channel and located below the experimental chamber; A cooling assembly is disposed within the circulating air exchange channel and located above the experimental chamber; The stage is rotatably mounted inside the experimental chamber and is used to place the flexible thin-film device to be tested. A visible light image acquisition component is disposed within the experimental chamber and is used to acquire visible light images containing the flexible thin-film device under test; An infrared image acquisition component is disposed within the experimental chamber and is used to acquire infrared images containing the flexible thin-film device under test. The controller is configured to: control the heating component to heat the gas in the circulating ventilation channel when the actual temperature inside the experimental chamber is lower than a first preset temperature, until the actual temperature inside the experimental chamber rises to a first preset target temperature; or control the cooling component to cool the gas in the circulating ventilation channel when the actual temperature inside the experimental chamber is higher than a second preset temperature, until the actual temperature inside the experimental chamber drops to a second preset target temperature; and further be configured to: perform wavelet denoising on the infrared image and perform saliency feature enhancement on the infrared image and the visible light image to obtain enhanced infrared image and enhanced visible light image; perform dynamic spectral fusion on the enhanced infrared image and the enhanced visible light image to obtain a fused image; perform infrared feature extraction and visual feature extraction on the fused image to obtain a first feature matrix and a second feature matrix; obtain a fused feature vector based on the first feature matrix and the second feature matrix; and perform feature classification based on the fused feature vector and locate the classified features.

9. The flexible thin-film device testing system according to claim 8, characterized in that, The process of dynamically fusing the enhanced infrared image and the enhanced visible light image to obtain a fused image includes: Band registration is performed on the enhanced infrared image and the enhanced visible light image; Image fusion weights are assigned to the registered enhanced infrared and enhanced visible light images using a multilayer sensor and a gating function. The enhanced infrared image and the enhanced visible light image are fused according to the image fusion weights to obtain a fused image.

10. The flexible thin-film device testing system according to claim 8, characterized in that, The process of obtaining the fused feature vector based on the first feature matrix and the second feature matrix includes: Cross-attention fusion technology is used to extract features and assign weights to the first feature matrix and the second feature matrix to obtain multiple first preliminary features and their corresponding preliminary weights; Redundant features are removed from all the first preliminary features using a feature selection gate to obtain multiple second preliminary features and their corresponding preliminary weights. The preliminary weights corresponding to each of the second preliminary features are adjusted using a multilayer sensor and a gating function to obtain the fusion weights corresponding to each of the second preliminary features; All the second preliminary features are dimensionality reduced and compressed to obtain multiple features to be fused; Feature fusion is performed based on all the features to be fused and their corresponding fusion weights to obtain a fused feature vector.

Images