High-conductivity graphene power cable processing equipment

Abstract

The invention provides high-conductivity graphene power cable processing equipment, and relates to the technical field of cable processing, the high-conductivity graphene power cable processing equipment comprises two groups of supporting seats, a processing shuttle box, a cooling mechanism, two groups of electrostatic adsorption mechanisms, a stringing rolling mechanism and two groups of wiring channels, the two groups of supporting seats are symmetrically mounted at the two ends of the bottom of the processing shuttle box in parallel; and the cooling mechanism is arranged outside one end of the machining shuttle box, the two sets of electrostatic adsorption mechanisms are arranged in the machining shuttle box and located on the upper portion and the lower portion of the end, away from the cooling mechanism, of the machining shuttle box correspondingly, and the stringing rolling mechanism is arranged in the middle of the interior of the machining shuttle box. By optimizing a cooling mode and an impurity cleaning mechanism, the processing quality of the graphene cable is effectively improved, the stability and efficiency of equipment operation are enhanced, and the device is suitable for large-scale production of the high-conductivity graphene power cable.

Description

Technical Field

[0001] This invention relates to the field of cable processing technology, and in particular to a high-conductivity graphene power cable processing equipment. Background Technology

[0002] With the rapid development of new energy, smart grids, and other fields, higher requirements are being placed on the conductivity, mechanical strength, and environmental resistance of cables. Graphene materials, due to their ultra-high thermal conductivity (5300 W / m·K), excellent electrical conductivity, and mechanical properties, are widely used in the sheath reinforcement or conductor modification of high-end cables. However, graphene cables face many technical bottlenecks in the processing stage (especially cooling and surface treatment after extrusion molding). Traditional processes are difficult to adapt to its material characteristics. Specific problems are as follows: Traditional cable cooling methods often involve immersion in water tanks or spraying with water mist. While these methods can quickly lower the temperature, they have significant limitations for graphene cables. Graphene composite sheaths have extremely high thermal conductivity (more than 5 times that of traditional PVC), but they are also quite brittle. When cooling in a water tank, the radial temperature difference caused by the water film can easily lead to stress concentration and cause microcracks in the sheath. Graphene surfaces readily adsorb water molecules, and residual moisture after water mist or cooling in a water bath can reduce its conductivity (tests show that conductivity decreases by more than 15% when the water content is >0.1%). When the cooling medium (water) comes into contact with the high-temperature sheath, bubbles may be generated due to local vaporization, which may adhere to the surface of the graphene layer and form defects, resulting in a high rate of damage during processing. Summary of the Invention

[0003] In view of the shortcomings of the prior art, the purpose of this invention is to provide a high-conductivity graphene power cable processing equipment that can solve the technical problem that the outer sheath of graphene cables is prone to cracking due to cooling methods such as water-cooled spraying and immersion in the prior art.

[0004] This invention provides a high-conductivity graphene power cable processing equipment, comprising: two sets of support bases, a processing shuttle box, a cooling mechanism, two sets of electrostatic adsorption mechanisms, a wire-rolling mechanism, and two sets of wire routing channels; The two sets of support seats are installed in parallel and symmetrically at both ends of the bottom of the processing shuttle box, and are arranged at equal distances along the horizontal direction. The cooling mechanism is located outside one end of the processing shuttle box. The two sets of electrostatic adsorption mechanisms are respectively located inside the processing shuttle box at the upper and lower ends away from the cooling mechanism. The wire rolling mechanism is located in the middle inside the processing shuttle box. The overhead line rolling mechanism includes several sets of fixing blocks, several sets of cable-carrying rollers, and two sets of suspensions; The two sets of suspensions are respectively fixedly mounted on both sides of the inner wall of the processing shuttle box, and several sets of fixing blocks are symmetrically arranged in pairs along the horizontal direction on both sides of the suspension. Several sets of cable-running rollers are sequentially locked between two opposite fixing blocks. The cooling mechanism includes a semiconductor cooler, a mounting frame, an air inlet pipe, and a helium gas inlet device; The fixing bracket is mounted on the outside of one side of the semiconductor cooler. The side of the fixing bracket away from the semiconductor cooler is fixedly installed on the outer wall of one side of the processing shuttle box. One end of the semiconductor cooler is connected to the inside of the air inlet pipe. One end of the air inlet pipe extends into the inside of the processing shuttle box. The end of the air inlet pipe away from the processing shuttle box is connected to the helium gas inlet device. The helium gas inlet device is fixedly installed on the upper surface of one side of one set of support seats. The electrostatic adsorption mechanism includes a motor, an L-shaped frame, a C-shaped ring shell, an electrostatic adsorption plate, a pulley assembly, a connecting rod, and a connecting shaft. The L-shaped frame is fixedly installed on the outer wall of one end of the processing shuttle box and near the top. The motor is fixedly installed on one side of the L-shaped frame. The connecting shaft is inserted inside the L-shaped frame and near the bottom of the motor. The connecting rod is located inside the processing shuttle box, and one end of the connecting shaft is inserted into the connecting rod. The motor output shaft is rotatably connected to the connecting shaft through a pulley assembly fitted at one end. The electrostatic adsorption plate is located inside the processing shuttle box and is fixedly connected to the outer wall of the connecting rod on one side. The C-shaped ring shell is fixedly installed on one end of the inner wall of the processing shuttle box and above the connecting rod.

[0005] Furthermore, a waste discharge box is installed inside the C-shaped ring shell, one end of which extends to the outside of the processing shuttle box, and a sealing plate is movably fitted on the outside of the end of the waste discharge box away from the processing shuttle box.

[0006] Furthermore, a first pneumatic rod is fixedly embedded on one side of the processing shuttle box and at the corresponding C-shaped ring shell. A scraper is fixedly installed at the telescopic end of the first pneumatic rod, and sliding rods are fixedly installed at both ends of the outer wall of the scraper. The ends of the two sliding rods away from the scraper extend to the outside of the processing shuttle box.

[0007] Furthermore, inserts are symmetrically installed at both ends of the inner walls of the two sets of suspensions. A second pneumatic rod is fixedly installed at the bottom of the inner side of each insert. A movable block is fixedly installed at the telescopic end of each second pneumatic rod. The movable block is slidably connected to the insert.

[0008] Furthermore, a plug rod is installed between the two sets of movable blocks, and a line-stopping wheel is rotatably fitted on the outside of the plug rod. The line-stopping wheel and the line-carrying roller are positioned opposite each other.

[0009] Furthermore, fixed rods are fixedly installed at both ends of the inner bottom wall of the processing shuttle box, and a spiral tube is installed at the upper end of the two fixed rods. Multiple nozzles are provided inside the spiral tube, and the multiple nozzles are evenly distributed along the spiral trajectory of the spiral tube. One end of the spiral tube is connected to the end of the air inlet pipe. The spiral tube is located outside of several sets of wire-carrying rollers. Observation windows are embedded at equal intervals along the horizontal direction inside the side of the processing shuttle box away from the semiconductor cooler.

[0010] Furthermore, a rectangular wire opening is provided on the top of the inner side of the processing shuttle box, and a movable sealing plate is installed inside the rectangular wire opening. The two sets of wiring channels are respectively opened at both ends inside the processing shuttle box.

[0011] Furthermore, a controller is fixedly installed on the upper outer wall of the processing shuttle box near the fixed frame, a negative pressure suction pipe is connected to the top of the processing shuttle box, and an infrared temperature sensor is connected to the top of the processing shuttle box near the L-shaped frame.

[0012] The beneficial effects of the technical solutions provided in the embodiments of the present invention include at least the following: In this embodiment of the invention, a cooling mechanism uses helium as the cooling medium, combined with a semiconductor cooler for precise temperature control. A uniform air curtain is formed around the cable through nozzles on the inner spiral surface of the spiral tube. The inert nature of helium prevents the graphene from reacting with oxygen at high temperatures, which would reduce its conductivity. Simultaneously, gas cooling eliminates contact pressure, overcoming the problem of excessive radial temperature differences caused by water film obstruction in traditional water cooling and water mist cooling. This fundamentally solves the problem of micro-cracks caused by temperature stress during the production of graphene composite cables. Two sets of electrostatic adsorption mechanisms (symmetrically arranged vertically) adsorb carbon powder from the outer surface of the graphene cable. During carbon powder processing, the symmetrically arranged motors alternately drive the connecting rods via drive pulley assemblies, causing the electrostatic adsorption plate to place the adsorbent cotton inside the C-shaped ring shell. The first pneumatic rod inside the processing shuttle box drives a scraper to the inside of the C-shaped ring shell. The horizontally pushed scraper removes impurities from the adsorption surface of the electrostatic adsorption plate and guides them into the waste removal box. The overall operation is highly efficient and fast. A negative pressure suction pipe is installed on the top of the processing shuttle box and connected to an external suction device to recover some of the cooled helium. After subsequent dust filtration and purification, it can be reused, making reasonable use of helium energy. Attached Figure Description

[0013] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts. Obviously, the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0014] Figure 1 This is a schematic diagram of the overall structure of a high-conductivity graphene power cable processing equipment provided in an embodiment of the present invention.

[0015] Figure 2 This is a schematic diagram of the overall structure of a high-conductivity graphene power cable processing equipment provided in an embodiment of the present invention from another perspective.

[0016] Figure 3 This is a schematic diagram of the inner structure of the processing shuttle box of a high-conductivity graphene power cable processing equipment provided in an embodiment of the present invention.

[0017] Figure 4 This is an overall schematic diagram of the overhead rolling mechanism of a high-conductivity graphene power cable processing equipment provided in an embodiment of the present invention.

[0018] Figure 5 This is a schematic diagram of the connection structure between the spiral tube and the nozzle of a high-conductivity graphene power cable processing equipment provided in an embodiment of the present invention.

[0019] Figure 6 This is a schematic diagram of the overall structure of the electrostatic adsorption mechanism of a high-conductivity graphene power cable processing equipment provided in an embodiment of the present invention.

[0020] Figure 7 This invention provides a high-conductivity graphene power cable processing equipment. Figure 4 Enlarged structural diagram at point A in the middle.

[0021] Explanation of reference numerals in the attached drawings: 1-Support base; 2-Processing shuttle box; 3-Observation window; 4-Cooling mechanism; 401-Semiconductor cooler; 402-Fixed frame; 403-Inlet pipe; 404-Helium gas inlet device; 5-Wire-carrying rolling mechanism; 501-Fixing block; 502-Wire-carrying roller; 503-Suspension; 6-Infrared temperature sensor; 7-Electrostatic adsorption mechanism; 701-Motor; 702-L-shaped frame; 703-C-shaped ring shell ; 704-Electrostatic adsorption plate; 705-Pulley assembly; 706-Connecting rod; 707-Connecting shaft; 8-First pneumatic rod; 9-Fixed rod; 10-Controller; 11-Second pneumatic rod; 12-Insertion rod; 13-Negative pressure suction tube; 14-Modible sealing plate; 15-Slide rod; 16-Miscellaneous waste box; 17-Scraper; 18-Wire-blocking wheel; 19-Spiral tube; 20-Nozzle; 21-Modible block; 22-Insertion cylinder; 23-Wire routing channel. Detailed Implementation

[0022] To enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0023] Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts disclosed in this invention.

[0024] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention.

[0025] Reference manual attached Figures 1 to 7 As shown, this embodiment of the invention provides a high-conductivity graphene power cable processing equipment, including: two sets of support seats 1, a processing shuttle box 2, a cooling mechanism 4, two sets of electrostatic adsorption mechanisms 7, a wire-rolling mechanism 5, and two sets of wire-running channels 23.

[0026] Two sets of support seats 1 are installed in parallel and symmetrically at both ends of the bottom of the processing shuttle box 2, and are arranged at equal distances along the horizontal direction. The cooling mechanism 4 is located outside one end of the processing shuttle box 2. Two sets of electrostatic adsorption mechanisms 7 are respectively located inside the processing shuttle box 2 at the upper and lower ends away from the cooling mechanism 4. The wire rolling mechanism 5 is located in the middle inside the processing shuttle box 2.

[0027] The overhead line rolling mechanism 5 includes several sets of fixed blocks 501, several sets of line-carrying rollers 502, and two sets of suspensions 503.

[0028] Two sets of suspensions 503 are fixedly mounted on both sides of the inner wall of the processing shuttle box 2. Several sets of fixing blocks 501 are symmetrically arranged in pairs along the horizontal direction on both sides of the suspension 503. Several sets of cable-running rollers 502 are sequentially clamped between two opposite fixing blocks 501.

[0029] See the attached instruction manual. Figure 1 , Figure 2 and Figure 7In this embodiment of the invention, the support base 1 provides stable support for the entire equipment, the processing shuttle box 2 serves as an enclosed space for cable processing, integrating various functional mechanisms, the wire rolling mechanism 5 carries and transports the graphene cable, the electrostatic adsorption mechanism 7 adsorbs some impurities on the outer surface of the graphene cable, and the cable routing channel 23 provides a path for the graphene cable to enter and exit the processing shuttle box 2.

[0030] Specifically, the cable enters the processing shuttle box 2 through the cable routing channel 23, is supported by the cable routing rollers 502 of the cable rolling mechanism 5, and is conveyed horizontally. During the conveying process, it passes through the cooling mechanism 4 for cooling and the electrostatic adsorption mechanism 7 for impurity removal, and is finally output from the other end of the cable routing channel 23.

[0031] In one possible implementation, the cooling mechanism 4 includes a semiconductor cooler 401, a mounting bracket 402, an air inlet pipe 403, and a helium gas inlet device 404.

[0032] The mounting bracket 402 is snapped onto the outside of one side of the semiconductor cooler 401. The side of the mounting bracket 402 away from the semiconductor cooler 401 is fixedly installed on the outer wall of one side of the processing shuttle box 2. One end of the semiconductor cooler 401 is connected to the inside of the air inlet pipe 403. One end of the air inlet pipe 403 extends into the inside of the processing shuttle box 2. The end of the air inlet pipe 403 away from the processing shuttle box 2 is connected to the helium gas inlet device 404. The helium gas inlet device 404 is fixedly installed on the upper surface of one side of one set of support seats 1.

[0033] See the attached instruction manual. Figure 1 , Figure 2 and Figure 4 In this embodiment of the invention, the fixing frame 402 is used to install the semiconductor cooler 401 on the outer wall of the processing shuttle box 2 to facilitate the provision of a low temperature environment. It is connected to the air inlet pipe 403 through the port, and the helium gas inlet device 404 delivers the low temperature gas to the inside of the processing shuttle box 2 through the lower end of the air inlet pipe 403.

[0034] Specifically, the helium gas inlet device 404 outputs helium gas, which is cooled to a set temperature by the semiconductor cooler 401 and then sent into the processing shuttle box 2 through the inlet pipe 403. This directly acts on the cable surface to achieve uniform cooling and avoids the thermal stress and decreased conductivity caused by traditional water cooling.

[0035] In one possible implementation, the electrostatic adsorption mechanism 7 includes a motor 701, an L-shaped frame 702, a C-shaped ring shell 703, an electrostatic adsorption plate 704, a pulley assembly 705, a connecting rod 706, and a connecting shaft 707.

[0036] L-shaped frame 702 is fixedly installed on the outer wall of one end of the processing shuttle box 2, near the top. Motor 701 is fixedly installed on one side of L-shaped frame 702. Connecting shaft 707 is inserted inside L-shaped frame 702, near the bottom of motor 701. Connecting rod 706 is located inside processing shuttle box 2, and one end of connecting shaft 707 is inserted into connecting rod 706. The output shaft of motor 701 is rotatably connected to connecting shaft 707 through a pulley assembly 705 fitted at one end. Electrostatic adsorption plate 704 is located inside processing shuttle box 2, and one side is fixedly connected to the outer wall of connecting rod 706. C-shaped ring shell 703 is fixedly installed on one end of inner wall of processing shuttle box 2, above connecting rod 706.

[0037] See the attached instruction manual. Figure 2 and Figure 5 In this embodiment of the invention, after the electrostatic adsorption plates 704, which are symmetrically arranged at the upper and lower ends, are energized, they can adsorb the carbon powder impurities remaining on the surface of the graphene cable above and below, ensuring the cleanliness of the cable during the processing.

[0038] Specifically, when cleaning impurities on the surface of the electrostatic adsorption plate 704, after the motor 701 is started, it drives the connecting shaft 707 to rotate through the pulley assembly 705, which in turn drives the connecting rod 706 and the electrostatic adsorption plate 704 to rotate within the range of the C-shaped ring shell 703. The C-shaped ring shell 703 has a notch inside that is adapted to the vertical flipping of the upper end of the connecting rod 706. The purpose is to place the impurities inside the C-shaped ring shell 703 so that they can be easily discharged.

[0039] In one possible implementation, a waste discharge box 16 is installed inside the C-shaped ring shell 703. One end of the waste discharge box 16 extends to the outside of the processing shuttle box 2, and a sealing plate is movably fitted on the outside of the end of the waste discharge box 16 away from the processing shuttle box 2.

[0040] See the attached instruction manual. Figure 2 and Figure 6 In this embodiment of the invention, the impurities removed by the electrostatic adsorption mechanism 7 are collected to prevent impurities from accumulating in the processing space and causing secondary pollution.

[0041] Specifically, after the impurities on the electrostatic adsorption plate 704 are cleaned, they enter the waste discharge box 16 through the channel of the C-shaped ring shell 703. The sealing plate closes the end of the waste discharge box 16 to prevent impurities from overflowing. The impurities inside the box can be cleaned by periodically opening the sealing plate.

[0042] In one possible implementation, a first pneumatic rod 8 is fixedly embedded on one side of the processing shuttle box 2 and at the corresponding C-shaped ring shell 703. A scraper 17 is fixedly installed at the telescopic end of the first pneumatic rod 8. Slide rods 15 are fixedly installed at both ends of the outer wall of the scraper 17. The ends of the two slide rods 15 away from the scraper 17 extend to the outside of the processing shuttle box 2.

[0043] See the attached instruction manual. Figure 6 In this embodiment of the invention, the impurities adsorbed on the electrostatic adsorption plate 704 are scraped off and pushed into the impurity discharge box 16 to ensure that the adsorption plate continues to work effectively.

[0044] Specifically, after the electrostatic adsorption plate 704 adsorbs impurities, the first pneumatic rod 8 extends and retracts to drive the scraper 17 to move horizontally along the guide of the slide rod 15. The scraper 17 contacts the surface of the electrostatic adsorption plate 704, scrapes off the impurities and pushes them into the C-shaped ring shell 703, and finally enters the impurity discharge box 16.

[0045] In one possible implementation, inserts 22 are symmetrically installed at both ends of the inner walls of the two sets of suspensions 503. A second pneumatic rod 11 is fixedly installed on the bottom inner side of each insert 22. A movable block 21 is fixedly installed on the telescopic end of each second pneumatic rod 11. The movable block 21 is slidably connected to the insert 22.

[0046] See the attached instruction manual. Figure 4 and Figure 7 In this embodiment of the invention, by adjusting the height of the movable block 21, the subsequent line-supporting wheel 18 is driven to rise and fall, adapting to the conveying needs of cables of different specifications.

[0047] Specifically, the movable block 21 is driven to slide up and down along the inner wall of the insert 22 by the extension and retraction of the second pneumatic rod 11, thereby adjusting the height of the movable block 21 and providing a basis for the position adjustment of the line-stopping wheel 18.

[0048] In one possible implementation, a rod 12 is installed between the two sets of movable blocks 21, and a wire-stopping wheel 18 is rotatably mounted on the outside of the rod 12. The position of the wire-stopping wheel 18 is offset from that of the wire-running roller 502.

[0049] See the attached instruction manual. Figure 3 and Figure 4 In this embodiment of the invention, the cable-holding wheel 18 and the cable-carrying roller 502 cooperate to clamp the cable, preventing it from shifting or shaking during the cable transport process and ensuring transport stability.

[0050] Specifically, the insertion rod 12 of the movable block 21 drives the external abutment wheel 18 to move. The abutment wheel 18 and the cable guide roller 502 clamp the outer surface of the graphene cable from both the top and bottom. When the graphene cable is pulled and transported by the external traction and winding mechanism, the abutment wheel 18 and the cable guide roller 502 contact and rotate with the graphene cable to reduce friction damage.

[0051] In one possible implementation, two fixing rods 9 are fixedly installed at both ends of the inner bottom wall of the processing shuttle box 2. The upper ends of the two fixing rods 9 are jointly installed with a spiral tube 19. Multiple nozzles 20 are provided inside the spiral tube 19, and the multiple nozzles 20 are evenly distributed along the spiral trajectory of the spiral tube 19. One end of the spiral tube 19 is connected to the end of the air inlet pipe 403. The spiral tube 19 is located outside of several sets of wire-carrying rollers 502. Observation windows 3 are embedded at equal intervals in the horizontal direction on the side of the processing shuttle box 2 away from the semiconductor cooler 401.

[0052] See the attached instruction manual. Figure 1 , Figure 3 and Figure 5 In this embodiment of the invention, the spiral tube 19 and the nozzle 20 make the cooling helium gas evenly wrap around the graphene cable, thereby improving the cooling efficiency. The observation window 3 facilitates real-time observation of the processing status of the graphene cable inside the processing shuttle box 2.

[0053] Specifically, cryogenic helium gas supplied by the cooling mechanism 4 enters the spiral tube 19 and is sprayed towards the center through the nozzles 20 on the inner spiral surface, forming an annular air curtain that completely surrounds the graphene cable during transport, achieving uniform cooling. Operators can visually monitor the transport, cooling, and impurity removal of the graphene cable through the observation window 3.

[0054] In one possible implementation, a rectangular wire opening is provided on the top of the inner side of the processing shuttle box 2, and a movable sealing plate 14 is installed inside the rectangular wire opening. Two sets of wiring channels 23 are respectively opened at both ends inside the processing shuttle box 2.

[0055] See the attached instruction manual. Figure 1 and Figure 2 In this embodiment of the invention, the rectangular conductor opening and the movable sealing plate 14 facilitate operation during initial cable threading or equipment maintenance. During threading or maintenance, the movable sealing plate 14 is opened, and the graphene cable is operated through the rectangular conductor opening. During normal processing, the movable sealing plate 14 is closed to ensure the sealing of the processing space. The graphene cable enters and exits through the wiring channels 23 at both ends, restricting the transport path.

[0056] In one possible implementation, a controller 10 is fixedly installed on the outer wall above the processing shuttle box 2 on the side near the fixed frame 402, a negative pressure suction pipe 13 is connected to the top of the processing shuttle box 2, and an infrared temperature sensor 6 is connected to the top of the processing shuttle box 2 near the L-shaped frame 702.

[0057] See the attached instruction manual. Figure 1 and Figure 2 The controller 10 coordinates the operation of each mechanism to achieve automated processing. The negative pressure suction pipe 13 can recover underutilized cooling helium, saving energy. The infrared temperature sensor 6 monitors the temperature in real time, providing a basis for cooling regulation.

[0058] Specifically, the infrared temperature sensor 6 detects the internal temperature of the processing shuttle box 2 and transmits the data to the controller 10. The controller 10 adjusts the power of the semiconductor cooler 401 and the helium flow rate according to the temperature. At the same time, it coordinates the operation rhythm of components such as the electrostatic adsorption mechanism 7. The negative pressure suction pipe 13 recovers the helium in the box through an external suction device, which can be reused after purification.

[0059] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the preferred embodiments, while those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention, and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the protection scope of the present invention.

Claims

1. A high-conductivity graphene power cable processing equipment, characterized in that, include: Two sets of support bases, processing shuttle box, cooling mechanism, two sets of electrostatic adsorption mechanism, wire rolling mechanism, and two sets of wire routing channels; The two sets of support seats are installed in parallel and symmetrically at both ends of the bottom of the processing shuttle box, and are arranged at equal distances along the horizontal direction. The cooling mechanism is located outside one end of the processing shuttle box. The two sets of electrostatic adsorption mechanisms are respectively located inside the processing shuttle box at the upper and lower ends away from the cooling mechanism. The wire rolling mechanism is located in the middle inside the processing shuttle box. The overhead line rolling mechanism includes several sets of fixing blocks, several sets of cable-carrying rollers, and two sets of suspensions; The two sets of suspensions are respectively fixedly mounted on both sides of the inner wall of the processing shuttle box, and several sets of fixing blocks are symmetrically arranged in pairs along the horizontal direction on both sides of the suspension. Several sets of cable-running rollers are sequentially locked between two opposite fixing blocks. The cooling mechanism includes a semiconductor cooler, a mounting frame, an air inlet pipe, and a helium gas inlet device; The fixing bracket is mounted on the outside of one side of the semiconductor cooler. The side of the fixing bracket away from the semiconductor cooler is fixedly installed on the outer wall of one side of the processing shuttle box. One end of the semiconductor cooler is connected to the inside of the air inlet pipe. One end of the air inlet pipe extends into the inside of the processing shuttle box. The end of the air inlet pipe away from the processing shuttle box is connected to the helium gas inlet device. The helium gas inlet device is fixedly installed on the upper surface of one side of one set of support seats. The electrostatic adsorption mechanism includes a motor, an L-shaped frame, a C-shaped ring shell, an electrostatic adsorption plate, a pulley assembly, a connecting rod, and a connecting shaft. The L-shaped frame is fixedly installed on the outer wall of one end of the processing shuttle box and near the top. The motor is fixedly installed on one side of the L-shaped frame. The connecting shaft is inserted inside the L-shaped frame and near the bottom of the motor. The connecting rod is located inside the processing shuttle box, and one end of the connecting shaft is inserted into the connecting rod. The motor output shaft is rotatably connected to the connecting shaft through a pulley assembly fitted at one end. The electrostatic adsorption plate is located inside the processing shuttle box and is fixedly connected to the outer wall of the connecting rod on one side. The C-shaped ring shell is fixedly installed on one end of the inner wall of the processing shuttle box and above the connecting rod.

2. The high-conductivity graphene power cable processing equipment according to claim 1, characterized in that, The C-shaped ring shell is internally connected to a waste discharge box, one end of which extends to the outside of the processing shuttle box, and the end of the waste discharge box away from the processing shuttle box is movably fitted with a sealing plate.

3. The high-conductivity graphene power cable processing equipment according to claim 1, characterized in that, A first pneumatic rod is fixedly embedded on one side of the processing shuttle box and at the corresponding C-shaped ring shell. A scraper is fixedly installed at the telescopic end of the first pneumatic rod. Slide rods are fixedly installed at both ends of the outer wall of the scraper. The ends of the two slide rods away from the scraper extend to the outside of the processing shuttle box.

4. The high-conductivity graphene power cable processing equipment according to claim 1, characterized in that, Two sets of suspensions have symmetrically installed inserts at both ends of their inner walls. A second pneumatic rod is fixedly installed at the bottom of the inner side of each insert. A movable block is fixedly installed at the telescopic end of each second pneumatic rod. The movable block is slidably connected to the insert.

5. The high-conductivity graphene power cable processing equipment according to claim 4, characterized in that, A rod is installed between the two sets of movable blocks. A wire-stopping wheel is rotatably fitted on the outside of the rod. The position of the wire-stopping wheel is offset from that of the wire-carrying roller.

6. The high-conductivity graphene power cable processing equipment according to claim 1, characterized in that, Fixed rods are fixedly installed at both ends of the inner bottom wall of the processing shuttle box. A spiral tube is installed at the upper end of the two fixed rods. Multiple nozzles are provided inside the spiral tube and are evenly distributed along the spiral trajectory of the spiral tube. One end of the spiral tube is connected to the end of the air inlet pipe. The spiral tube is located outside several sets of wire-carrying rollers. Observation windows are embedded at equal intervals along the horizontal direction on the side of the processing shuttle box away from the semiconductor cooler.

7. The high-conductivity graphene power cable processing equipment according to claim 1, characterized in that, A rectangular wire guide opening is provided on the top inner side of the processing shuttle box. A movable sealing plate is installed inside the rectangular wire guide opening. Two sets of wiring channels are respectively opened at both ends inside the processing shuttle box.

8. The high-conductivity graphene power cable processing equipment according to claim 1, characterized in that, A controller is fixedly installed on the outer wall of the processing shuttle box near the fixed frame. A negative pressure suction pipe is installed on the top of the processing shuttle box. An infrared temperature sensor is installed on the top of the processing shuttle box near the L-shaped frame.

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