Light path system of solid laser

Abstract

The invention discloses a light path system of a solid laser, which comprises a shell, a main shell, a heat dissipation plate, a light-emitting component, a Q-switching component, a PCB (Printed Circuit Board), a baffle plate, a connecting terminal and a heat dissipation fan, and is characterized in that the shell is provided with a cavity with openings in two sides; the main shell is provided with a containing cavity and a light outlet hole, and the light outlet hole is communicated with the containing cavity; the heat dissipation plate is connected with the main shell so as to cover the accommodating cavity; the light-emitting assembly is located in the containing cavity, the Q-switching assembly is located in the containing cavity, and the Q-switching assembly is used for receiving laser of the light-emitting assembly and emitting the laser from the light-emitting hole after Q-switching treatment; the PCB is fixedly connected with the main shell, and the PCB and the heat dissipation plate are located on the two sides of the main shell respectively; the baffle plate is provided with a through hole, and the connecting terminal passes through the through hole. The heat dissipation fan is connected with the heat dissipation plate, and the heat dissipation fan, the heat dissipation plate, the main shell and the PCB are fixedly arranged in sequence. As the heat dissipation fan, the heat dissipation plate, the main shell, the PCB and the baffle are all located in the cavity, the baffle blocks the opening in one side, the Q-switching assembly carries out Q-switching processing, and the output characteristic of the optical path system is improved.

Description

Technical Field

[0001] This application relates to the field of lasers, and more specifically, to an optical path system for a solid-state laser. Background Technology

[0002] A laser is a device that generates light by amplifying light through stimulated emission, and it has important applications in many fields. During operation, the pump source and gain medium of a laser often require stable laser output and precise control of the output wavelength.

[0003] However, under different environmental and working conditions, lasers may need to adjust their operating parameters to maintain optimal performance. Especially for some high-power and high-beam-quality applications (such as material processing), existing solid-state lasers are difficult to effectively adjust and control the output wavelength and pulse characteristics of the laser. At the same time, since the fan is fixed at one end of the laser, or even the PCB board is externally mounted in some cases, the laser is easily damaged, and the protection of the laser is weak, which directly affects the performance of the laser and makes it difficult to effectively balance the protection of the laser and the control of the output characteristics. Summary of the Invention

[0004] The purpose of this application is to provide an optical path system for a solid-state laser to solve the problem of effectively balancing laser protection and output characteristic control in existing lasers.

[0005] To solve the above problems, this application adopts the following technical solution:

[0006] This application provides an optical path system for a solid-state laser, including:

[0007] The outer shell has cavities with openings on both sides;

[0008] The main shell is provided with a receiving cavity and a light-emitting hole, and the light-emitting hole and the receiving cavity are connected;

[0009] A heat sink is connected to the main housing to cover the receiving cavity;

[0010] A light-emitting component is located in the receiving cavity, and the light-emitting component is used to emit laser light;

[0011] A Q-switching component is located in the receiving cavity. The Q-switching component is used to receive the laser light from the light-emitting component, and after Q-switching, emit the laser light from the light-emitting hole.

[0012] A PCB board is fixedly connected to the main shell, and the PCB board and the heat sink are respectively located on both sides of the main shell;

[0013] A baffle with perforations is fixed to the end of the main housing away from the light-emitting hole.

[0014] A connecting terminal is inserted through the through hole;

[0015] A cooling fan is connected to the heat sink. The cooling fan, the heat sink, the main housing, and the PCB board are fixedly arranged in sequence. The cooling fan, the heat sink, the main housing, the PCB board, and the baffle are all located inside the cavity.

[0016] Because the cooling fan, heat sink, main housing, and PCB board are housed within the cavity of the outer casing, and the baffle blocks one side of the casing opening, the laser's sealing and protection are improved, reducing the risk of damage to the light-emitting components, Q-switching components, and PCB board from the external environment, thus enhancing the laser's reliability. By incorporating a Q-switching component, the control over the laser's output characteristics is improved, balancing the needs for laser protection, heat dissipation, and output characteristic control.

[0017] Furthermore, the main housing is provided with an installation step, and the light-emitting component is installed on the installation step.

[0018] By setting up installation steps, a precise installation reference is provided for the light-emitting components, thereby improving the alignment accuracy of the light emitted by the light-emitting components and improving the quality of laser output.

[0019] Furthermore, the main housing is provided with a clearance step, which is located on the side away from the receiving cavity, and the clearance step is used to accommodate the connecting terminal. By placing the connecting terminal on the clearance step away from the receiving cavity, it is separated from the light-emitting component, Q-switching component, and cooling fan, thus optimizing the spatial layout of the laser and avoiding interference.

[0020] Furthermore, the Q-switching assembly includes a mounting base, a Q-switching switch, and an output diaphragm. The mounting base has a receiving groove, the Q-switching switch has a protrusion located within the receiving groove, and the output diaphragm is fixed to the side of the Q-switching switch near the light output aperture.

[0021] The protrusion and the receiving groove are matched to limit the position and orientation of the Q-switching switch in the fixed base, ensuring that it maintains the correct spatial position during operation and improving the stability and reliability of the Q-switching process.

[0022] Furthermore, both the receiving groove and the protrusion have hemispherical contours.

[0023] The hemispherical profile simplifies the assembly process when the protrusion is inserted into the receiving groove, improves assembly efficiency, and effectively ensures the position of the Q-switch.

[0024] Furthermore, the outer casing is provided with heat dissipation holes, which are in communication with the cavity.

[0025] By creating heat dissipation holes on the outer casing and connecting them directly to the cavity, the heat generated inside can be dissipated to the external environment more quickly and directly, thus improving heat dissipation efficiency.

[0026] Furthermore, the heat sink is provided with multiple heat dissipation fins, all of which are parallel to the cooling fan, thereby increasing the surface area of ​​the heat sink and improving the heat conduction efficiency.

[0027] Furthermore, the baffle is provided with a through hole, which is arranged opposite to the heat dissipation fins.

[0028] Because the through holes on the baffle are positioned opposite to the heat dissipation fins, a smoother airflow path is formed. When the cooling fan is running, air can flow directly through the through holes to the heat dissipation fins, thereby accelerating heat conduction and dissipation.

[0029] In summary, this application includes at least one of the following beneficial technical effects:

[0030] 1. Since the cooling fan, heat sink, main shell, and PCB board are housed within the cavity of the outer shell, the baffle blocks one side opening of the outer shell, improving the laser's sealing and protection, reducing the risk of damage to the light-emitting components, Q-switching components, and PCB board from the external environment, and enhancing the reliability of the laser's optical path system.

[0031] 2. By setting up a Q-switching component, the control effect on the output characteristics of the optical path system is improved. The cooling fan and heat sink are also located inside the cavity, making the internal structure of the entire laser more compact and orderly. While enhancing protection, it also takes into account the requirements for laser protection, heat dissipation efficiency and output characteristics. Attached Figure Description

[0032] Figure 1 An exploded view of the optical path system of a solid-state laser provided in an embodiment of this application;

[0033] Figure 2 A schematic diagram of the optical path system of a solid-state laser provided in an embodiment of this application;

[0034] Figure 3 A schematic diagram of the structure of a main shell and a light-emitting component provided in an embodiment of this application;

[0035] Figure 4 This is a schematic diagram of the structure of a Q-switching component provided in an embodiment of this application;

[0036] Figure 5 This is a schematic diagram of the structure of a main shell provided in an embodiment of this application;

[0037] Figure 6 for Figure 5 A schematic diagram of the main shell structure from another perspective.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1. Outer shell; 11. Cavity; 12. Heat dissipation holes;

[0040] 2. Main shell; 21. Receiving cavity; 22. Light outlet hole; 23. Mounting step; 24. Step avoidance;

[0041] 3. Heat sink; 31. Heat sink fins; 4. Light-emitting components;

[0042] 5. Q-switching assembly; 51. Mounting base; 52. Q-switching switch; 53. Output diaphragm; 511. Receiving groove; 521. Protrusion;

[0043] 6. PCB board; 7. Baffle; 71. Through hole; 72. Through hole

[0044] 8. Connecting terminals; 9. Cooling fan. Detailed Implementation

[0045] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0046] It should be noted that, unless otherwise specified, the embodiments and technical features in the embodiments of this application can be combined with each other, and the detailed descriptions in the specific implementation should be understood as explanations of the purpose of this application and should not be regarded as undue limitations on this application.

[0047] It should be understood that the orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings. These orientation terms are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application.

[0048] Figure 1 This is an exploded view of the optical path system of a solid-state laser provided in an embodiment of this application; Figure 2 A schematic diagram of the optical path system of a solid-state laser provided in an embodiment of this application; Figure 3 A schematic diagram of the structure of a main shell and a light-emitting component provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a Q-switching component provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a main shell provided in an embodiment of this application; Figure 6 for Figure 5 A schematic diagram of the main shell structure from another perspective.

[0049] like Figures 1 to 6As shown, this application provides an optical path system for a solid-state laser, including: a housing 1, a main housing 2, a heat sink 3, a light-emitting component 4, a Q-switching component 5, a PCB board 6, a baffle 7, connecting terminals 8, and a cooling fan 9. The housing 1 has cavities 11 with openings on both sides; the main housing 2 has a receiving cavity 21 and a light-emitting aperture 22, which are connected; the heat sink 3 is connected to the main housing 2 to cover the receiving cavity 21; the light-emitting component 4 is located in the receiving cavity 21 and is used to emit laser light; the Q-switching component 5 is located in the receiving cavity 21 and is used to adjust the laser beam. Q component 5 is used to receive the laser from light-emitting component 4, and after Q-switching, it is emitted from light-emitting hole 22; PCB board 6 is fixedly connected to main shell 2, and PCB board 6 and heat sink 3 are located on both sides of main shell 2 respectively; baffle 7 is provided with through hole 71, and baffle 7 is fixed to the end of main shell 2 away from light-emitting hole 22; connecting terminal 8 is inserted through through hole 71; cooling fan 9 is connected to heat sink 3, and cooling fan 9, heat sink 3, main shell 2 and PCB board 6 are fixedly arranged in sequence, and cooling fan 9, heat sink 3, main shell 2, PCB board 6 and baffle 7 are all located in cavity 11.

[0050] Specifically, the outer shell 1 provides an external protective enclosure for the solid-state laser. The outer shell 1 has cavities 11 with openings on both sides, providing space for internal components. The openings on both sides facilitate the installation and maintenance of these internal components. The main shell 2 has a receiving cavity 21 for accommodating the light-emitting component 4 and the Q-switching component 5, as well as a light-emitting aperture 22 for laser output. The light-emitting aperture 22 communicates with the receiving cavity 21, allowing the laser beam processed by the Q-switching component 5 to exit from the light-emitting aperture 22. The main shell 2 is fixedly installed within the cavity 11 of the outer shell 1. The receiving cavity 21 is approximately located in the central region of the cavity 11 to ensure the stability of the optical path system and uniform heat dissipation.

[0051] The heat sink 3 is connected to the main housing 2. For example, the heat sink 3 is attached to the top of the main housing 2 to cover the opening of the receiving cavity 21, allowing the heat sink 3 to effectively absorb heat from the main housing 2. For example, the heat sink 3 has multiple parallel heat dissipation fins 31, which increase the heat dissipation area and help dissipate heat. The light-emitting component 4 is placed in the receiving cavity 21 of the main housing 2. Its function is to emit pump light to excite the gain medium to generate laser. The heat generated by the light-emitting component 4 is conducted to the main housing 2. For example, the light-emitting component 4 is a laser diode array. The Q-switching component 5 is also located in the receiving cavity 21, enabling the optical path system to receive the laser from the light-emitting component 4. The Q-switching component 5 contains elements that implement the Q-switching function. It adjusts its optical characteristics according to the received control signal to modulate the laser pulse, so that the laser of the optical path system is emitted from the light exit hole 22 in the form of high energy and short pulse, meeting the needs of high-power and high-beam-quality applications such as material processing. The PCB board 6 carries the laser's control circuit, drive circuit, and other circuits. The PCB board 6 is fixedly connected to the main housing 2 by screws. For example, the PCB board 6 and the heat sink 3 are located on opposite sides of the main housing 2, making the PCB board 6 close to the main housing 2 and making the overall structure more compact, rather than placing the PCB board 6 externally. The baffle 7 is fixed to the end of the main housing 2 away from the light emission hole 22. The baffle 7 has a through hole 71 for the connection terminal 8 to pass through. The main function of the baffle 7 is to provide a physical barrier at the end of the main housing 2, protecting the internal light-emitting component 4 and Q-switching component 5 from external impacts or contamination from the direction of the connection terminal 8, and isolating the internal space of the receiving cavity 21 from the area where the connection terminal 8 is located to a certain extent. The connection terminal 8 passes through the through hole 71 of the baffle 7, with one end connected to the corresponding pad or connection point on the PCB board 6, and the other end exposed outside the housing 1 for external wiring. The presence of the baffle 7 provides support and protection for the wiring of the connection terminal 8.

[0052] The cooling fan 9 is used for forced convection cooling. It is connected to the heat sink 3 by screws and is oriented towards the heat sink fins. In this embodiment, the cooling fan 9, heat sink 3, main shell 2 and PCB board 6 are fixedly arranged in sequence and are all located in the cavity 11 of the outer shell 1. This makes the cooling fan 9 no longer fixed to one end of the laser, but closely associated with the light-emitting component 4, Q-switching component 5 and PCB board 6, thereby achieving effective heat dissipation.

[0053] When the optical path system of the solid-state laser is working, the pump light generated by the light-emitting component 4 excites the gain medium to produce laser light. The laser light is pulse-modulated by the Q-switching component 5 and then output from the light-emitting aperture 22. The heat generated during operation is mainly conducted to the heat sink 3 through the main shell 2, and then dissipated through the heat sink fins on the heat sink 3. The cooling fan 9 accelerates the airflow over the heat sink fins, significantly improving heat dissipation efficiency. The control circuit on the PCB board 6 adjusts the drive current of the light-emitting component 4 and the working timing of the Q-switching component 5 as needed to achieve precise control of parameters such as laser output power, pulse width, and repetition frequency. The connection terminal 8 provides signal input for the optical path system. The baffle 7 and the shell 1 together constitute multiple protections for the internal precision optical and electronic components. In particular, the main shell 2 is provided with a mounting step 23, on which the light-emitting component 4 is mounted. By setting the mounting step 23, a precise mounting reference is provided for the light-emitting component 4, thereby improving the alignment accuracy of the light emitted by the light-emitting component 4 and improving the laser output quality.

[0054] It should be noted that since the cooling fan 9, heat sink 3, main housing 2, and PCB board 6 are housed within the cavity 11 of the outer shell 1, and the baffle 7 blocks one side opening of the outer shell 1, the laser's sealing and protection are improved, reducing the risk of damage to the light-emitting component 4, Q-switching component 5, and PCB board 6 from the external environment, thus enhancing the laser's reliability. By incorporating the Q-switching component 5, the control effect on laser output characteristics is improved. Since the cooling fan 9 and heat sink 3 are also located within the cavity 11, the overall internal structure of the laser is more compact and orderly, enhancing protection while simultaneously addressing the requirements for laser protection, heat dissipation efficiency, and output characteristics.

[0055] In some embodiments, the main housing 2 is provided with a clearance step 24, which is located on the side away from the receiving cavity 21 and is used to accommodate the connecting terminal 8. Specifically, in order to further optimize the internal space layout and provide a more stable and reliable installation and accommodating space for the connecting terminal 8, a clearance step 24 is provided on the main housing 2, and the location of the clearance step 24 is selected on the side away from the receiving cavity 21. A rectangular step structure recessed inward from the outer wall of the main housing 2 forms the clearance step 24, and the depth of the recess is sufficient to accommodate the main body of the connecting terminal 8. When the connecting terminal 8 needs to be installed, the main body of the connecting terminal 8 can be precisely placed and fixed on the clearance step 24.

[0056] By placing the connection terminal 8 on the clearance step 24, which is far away from the receiving cavity 21, and separating it from the light-emitting component 4, the Q-switching component 5, and the cooling fan 9, the spatial layout of the laser is optimized, the installation space problem of the connection terminal 8 is cleverly solved, interference with the internal optical path is avoided, and the stability of the connection and the overall reliability of the laser are improved.

[0057] In some embodiments, the Q-switching assembly 5 includes a mounting base 51, a Q-switching switch 52, and an output diaphragm 53. The mounting base 51 is provided with a receiving groove 511, the Q-switching switch 52 is provided with a protrusion 521, the protrusion 521 is located in the receiving groove 511, and the output diaphragm 53 is fixed to the side of the Q-switching switch 52 near the light output hole 22.

[0058] Specifically, to achieve Q-switching operation and ensure the quality of the output beam, a Q-switching assembly 5 is provided in this embodiment. The Q-switching assembly 5 includes a mounting base 51, a Q-switching switch 52, and an output diaphragm 53. The mounting base 51 is the basic structure of the Q-switching assembly 5, and its main function is to accurately support and position the Q-switching switch 52. A receiving groove 511 is machined into its main structure. The shape, size, and contour of the receiving groove 511 match the corresponding protrusion 521 on the Q-switching switch 52. The receiving groove 511 not only provides a stable mounting base for the Q-switching switch 52, but also plays a crucial role in axial limiting and positioning, ensuring that the Q-switching switch 52 is accurately and fixedly positioned on the mounting base 51, without axial movement. The bottom or sidewall of the receiving groove 511 is also designed with a heat dissipation structure to help conduct the heat generated during the operation of the Q-switching switch 52.

[0059] The Q-switching switch 52 is the core optical component for realizing the Q-switching function of the laser. The Q-switching switch 52 has a specific shape and a protrusion 521 on one end or side facing the mounting base 51. The protrusion 521 can be part of the Q-switching switch 52 body or can be added later through processing or assembly. The shape and size of the protrusion 521 precisely match the receiving groove 511 on the mounting base 51. When the Q-switching switch 52 is installed on the mounting base 51, its protrusion 521 is accurately received within the receiving groove 511, thereby fixing the Q-switching switch 52 in a predetermined position. This not only provides reliable mechanical support but also ensures extremely high parallelism and perpendicularity between the Q-switching switch 52 and the mounting base 51, which is crucial for the subsequent installation and alignment of the output diaphragm 53.

[0060] The output film 53 is a thin film with specific optical properties, typically deposited on a substrate via optical adhesive bonding or vacuum evaporation. The output coupling of the laser resonator is achieved through the output film 53. The output film 53 is fixed to the side of the Q-switched switch 52 near the light-emitting aperture 22, with the surface of the output film 53 precisely parallel to the light-emitting surface of the Q-switched switch 52. For example, the substrate of the output film 53 can be directly bonded to the light-emitting surface of the Q-switched switch 52, ensuring that the laser beam is incident on the output film 53 at the correct angle and position, thereby guaranteeing the beam quality and energy extraction efficiency of the output laser.

[0061] Specifically, both the receiving groove 511 and the protrusion 521 have hemispherical contours. The hemispherical contours simplify the assembly operation and improve assembly efficiency when the protrusion is inserted into the receiving groove 511, and also effectively ensure the position of the Q-switch 52.

[0062] The protrusion 521 and the receiving groove 511 cooperate to limit the position and orientation of the Q-switching switch 52 within the fixed base 51, ensuring that it maintains the correct spatial position during operation and improving the stability and reliability of the Q-switching process.

[0063] In the optical path system of a solid-state laser, a Q-switch is a component used to control the loss within the laser's resonant cavity. It modulates the laser pulse by rapidly changing the cavity's quality factor (Q-value). The Q-value describes the photon lifetime within the resonant cavity, and its level directly affects the laser's susceptibility to oscillation. The Q-switch introduces controllable loss into the cavity, rapidly reducing it at specific moments to allow the laser to release high-energy, short-pulse laser output. For example, by rapidly adjusting the cavity's Q-value, laser energy is released in an extremely short time, significantly shortening the pulse width, typically to the nanosecond level. Concentrating laser energy for output in a very short time greatly increases the peak power of the laser, usually several orders of magnitude higher than that of continuous-wave lasers. When the Q-switch is off, the resonant cavity is in a high-loss state, and pump energy accumulates in the gain medium. When the Q-switch is on, the cavity loss rapidly decreases, and the accumulated energy is released in the form of short pulses. By precisely controlling the pulse width and repetition frequency, Q-switching technology can achieve regular pulse sequence outputs, meeting the requirements of high-power-density applications.

[0064] In the initial stage, when the Q-switched switch is off, the resonant cavity is in a high-loss state (low Q value), photons cannot accumulate effectively within the cavity, and the laser cannot oscillate. During this period, the pump source continuously supplies energy to the gain medium, causing the population inversion in the gain medium to gradually increase, allowing energy to accumulate. In the triggering stage, when the population inversion reaches its maximum value, the Q-switched switch quickly turns on, the resonant cavity loss suddenly decreases (Q value increases), and the laser quickly reaches the threshold and begins laser oscillation. Due to the extremely low cavity loss, the laser energy is rapidly amplified in a short time, forming a short pulse with high peak power. As the laser energy is released, the population inversion in the gain medium rapidly decreases, the laser output power begins to decay, and eventually a short pulse is formed. Q-switching technology is widely used in fields requiring high-power, short-pulse lasers, including laser processing, laser medicine, lidar, and spectroscopic research. By rapidly adjusting the Q value of the laser resonant cavity, the Q-switching switch achieves efficient accumulation and instantaneous release of laser energy, thereby generating a laser output with high peak power and short pulse width.

[0065] In some embodiments, the outer casing 1 is provided with heat dissipation holes 12, which are in communication with the cavity 11.

[0066] Specifically, the outer casing 1 is roughly rectangular in shape, and multiple heat dissipation holes 12 are provided on the top of the outer casing 1. The heat dissipation holes 12 are elongated in shape, and their size and number are optimized according to the heat dissipation requirements of the equipment. The multiple heat dissipation holes 12 are evenly distributed and arranged.

[0067] The outer casing 1 has an internal cavity 11 with openings on both sides, which communicates with heat dissipation holes 12. For example, heat dissipation holes 12 are provided at specific locations on the outer casing 1, ensuring that the size and number of the heat dissipation holes 12 meet the heat dissipation requirements. The cavity 11 is designed inside the outer casing 1, and the cavity 11 communicates with the heat dissipation holes 12. By opening heat dissipation holes 12 on the outer casing 1 and directly communicating with the cavity 11, the heat generated inside can be dissipated to the external environment more quickly and directly, improving heat dissipation efficiency.

[0068] In some embodiments, the heat sink 3 is provided with a plurality of heat dissipation fins 31, all of which are parallel to the cooling fan 9. Specifically, a plurality of heat dissipation fins 31 are formed on the top surface of the heat sink 3 by machining. The heat dissipation fins 31 extend vertically or nearly vertically from the substrate of the heat sink 3, and each heat dissipation fin 31 has a rectangular cross-sectional shape. The plurality of heat dissipation fins 31 are arranged in parallel on the heat sink 3, the spacing between adjacent heat dissipation fins 31 is approximately equal, and all fins extend in the same direction. The parallel arrangement helps to form a regular airflow channel, which facilitates the uniform flow of air generated by the fan over each fin.

[0069] One side of the cooling fan 9 faces the heat dissipation hole 12, and the other side of the cooling fan 9 faces the heat dissipation fins 31, so that the heat dissipation fins 31, the heat dissipation hole 12 and the air blowing or exhaust direction of the cooling fan 9 are consistent, that is, the heat dissipation fins 31 face the cooling fan 9 as a whole. Installation and layout: The heat sink 3, together with the heat dissipation fins 31 parallel to the fan, is fixed in the cavity 11 of the laser. The cooling fan 9 can drive air to flow through the heat dissipation fins 31 and the PCB board 6 during its operation.

[0070] Since the parallel heat dissipation fins 31 on the heat sink 3 face the cooling fan 9, the airflow generated by the cooling fan 9 can blow or sweep across the surface of the heat dissipation fins 31 more directly and comprehensively, increasing the contact area between the air and the heat dissipation fins 31 and optimizing convection heat transfer.

[0071] In some embodiments, the baffle 7 is provided with a through hole 72, which is disposed opposite to the heat dissipation fins 31.

[0072] Specifically, to further optimize the airflow path inside the solid-state laser and ensure that the airflow generated by the cooling fan 9 can efficiently act on the heat dissipation fins 31 on the heat sink 3, a through hole 72 is provided on the baffle 7, which is positioned opposite to the heat dissipation fins 31. The baffle 7 is located inside the laser housing 1 and at the end furthest from the light emission port 22. The through hole 72 is provided on the baffle 7 according to the arrangement of the multiple heat dissipation fins 31 on the heat sink 3. The shape and size of the through hole 72 are adapted to the shape of the multiple heat dissipation fins 31. The shape of the through hole 72 can be circular, elliptical, square, or other shapes that match the array of heat dissipation fins 31. Its edges can be chamfered or rounded to reduce airflow resistance.

[0073] The through-hole 72 is positioned opposite to the heat dissipation fins 31. This means that after the solid-state laser is assembled, the through-hole 72 on the baffle 7 is spatially aligned with the area where the array of heat dissipation fins 31 is located on the heat dissipation plate 3. For example, the opening direction of the through-hole 72 is consistent with the extension direction of the heat dissipation fins 31 and the main flow direction of the airflow, so that the airflow can be blown onto the windward surface of the heat dissipation fins 31 to the maximum extent and evenly after passing through the through-hole 72. The through-hole 72 on the baffle 7 acts as a "guide," allowing the airflow generated by the cooling fan 9 to form an effective heat dissipation path through the through-hole 72 after acting on the heat dissipation fins 31, thereby improving heat dissipation efficiency and enhancing the heat exchange efficiency between the heat dissipation fins 31 and the air. This accelerates heat dissipation and helps to more effectively control the internal temperature of the solid-state laser.

[0074] Since the through holes 72 on the baffle 7 are positioned opposite to the heat dissipation fins 31, a smoother airflow path is formed. When the cooling fan 9 is running, air can flow directly through the through holes 72 to the heat dissipation fins 31, thereby accelerating heat conduction and dissipation.

[0075] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions claimed in this application.

Claims

1. An optical path system for a solid-state laser, characterized in that, include: The outer shell has cavities with openings on both sides; The main shell is provided with a receiving cavity and a light-emitting hole, and the light-emitting hole and the receiving cavity are connected; A heat sink is connected to the main housing to cover the receiving cavity; A light-emitting component is located in the receiving cavity, and the light-emitting component is used to emit laser light; A Q-switching component is located in the receiving cavity. The Q-switching component is used to receive the laser light from the light-emitting component, and after Q-switching, emit the laser light from the light-emitting hole. A PCB board is fixedly connected to the main shell, and the PCB board and the heat sink are respectively located on both sides of the main shell; A baffle with perforations is fixed to the end of the main housing away from the light-emitting hole. A connecting terminal is inserted through the through hole; A cooling fan is connected to the heat sink. The cooling fan, the heat sink, the main housing, and the PCB board are fixedly arranged in sequence. The cooling fan, the heat sink, the main housing, the PCB board, and the baffle are all located inside the cavity.

2. The optical path system of a solid-state laser according to claim 1, characterized in that, The main housing is provided with an installation step, and the light-emitting component is installed on the installation step.

3. The optical path system of a solid-state laser according to claim 1, characterized in that, The main housing is provided with a clearance step, which is located on the side away from the receiving cavity, and the clearance step is used to accommodate the connecting terminal.

4. The optical path system of a solid-state laser according to claim 1, characterized in that, The Q-switching assembly includes a mounting base, a Q-switching switch, and an output diaphragm. The mounting base has a receiving groove, the Q-switching switch has a protrusion located within the receiving groove, and the output diaphragm is fixed to the side of the Q-switching switch near the light output aperture.

5. The optical path system of a solid-state laser according to claim 4, characterized in that, Both the receiving groove and the protrusion have hemispherical contours.

6. The optical path system of a solid-state laser according to claim 1, characterized in that, The outer casing is provided with heat dissipation holes, which are in communication with the cavity.

7. The optical path system of a solid-state laser according to claim 1, characterized in that, The heat sink is provided with multiple heat dissipation fins, all of which are parallel to the cooling fan.

8. The optical path system of a solid-state laser according to claim 7, characterized in that, The baffle is provided with a through hole, which is arranged opposite to the heat dissipation fins.

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