Heat dissipation packaging module of semiconductor detector

Abstract

The invention, which relates to the technical field of heat dissipation packaging, discloses a heat dissipation packaging module of a semiconductor detector, comprising a DBC substrate and a heat dissipation module. The semiconductor detector comprises a pixel type detection sensor, a connector and a plurality of processor chips which are adaptively connected, the pixel type detection sensor is arranged on the front surface of the DBC substrate, and the connector and the plurality of processor chips are arranged on the back surface of the DBC substrate; a first boss, a second boss and a plurality of protruding blocks located between the first boss and the second boss are arranged on the front face of the heat dissipation module, and the heat dissipation module is connected with the back face of the DBC substrate through the first boss, the second boss and the protruding blocks. The heat dissipation packaging structure has good heat dissipation capability, and can better meet the heat dissipation requirement when the pixel type detector module works.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation packaging technology, and in particular to a heat dissipation packaging module for a semiconductor detector. Background Technology

[0002] With the rapid development of semiconductor technology and processes, the integration and performance of semiconductor detectors, especially pixel imaging semiconductor detector modules, based on semiconductor technology are constantly improving. A pixel imaging detector module consists of a pixel-type radiation sensor that converts X-ray information into electrical signals, coupled with an application-specific integrated circuit (ASIC) chip that processes and analyzes the sensor's electrical signals.

[0003] As the performance of pixel imaging semiconductor sensors improves and the processing power of electronic chips increases, the power consumption and heat generation of pixel detector chip modules are also constantly increasing. Therefore, the requirements for chip heat dissipation capabilities during the packaging design of pixel detector chip modules are also constantly increasing. Only by implementing novel structural designs with effective and sufficient heat dissipation capabilities can pixel detector chip modules function properly and prevent chip failure due to excessive temperature. Summary of the Invention

[0004] In response to the aforementioned problems and technical requirements, the applicant has proposed a heat dissipation packaging module for a semiconductor detector.

[0005] The technical solution of the present invention is as follows:

[0006] A heat dissipation packaging module for a semiconductor detector includes a DBC substrate and a heat dissipation module; the semiconductor detector includes a pixel-type detection sensor, a connector, and multiple processor chips that are adapted and connected, wherein the pixel-type detection sensor is disposed on the front side of the DBC substrate, and the connector and multiple processor chips are disposed on the back side of the DBC substrate.

[0007] The front side of the heat dissipation module is provided with a first protrusion, a second protrusion, and a plurality of protrusions located between the first protrusion and the second protrusion. The heat dissipation module is connected to the back side of the DBC substrate through the first protrusion, the second protrusion, and the plurality of protrusions.

[0008] The heat dissipation module, the first boss, and the second boss are all rectangular flat plates with long and short sides. The width sides of the first boss and the second boss are flush with the length sides of the heat dissipation module, and the length sides of the first boss and the second boss are flush with the width sides of the heat dissipation module.

[0009] A further technical solution is that the DBC substrate is rectangular with a long side and a short side, and the multiple processor chips are divided into two groups on an even basis, with the two groups of processor chips arranged symmetrically about the long central axis of the DBC substrate.

[0010] The further technical solution is that the positions of multiple bumps on the front of the heat dissipation module are matched one by one with the positions of multiple processor chips on the back of the DBC substrate.

[0011] A further technical solution is that a plurality of first cooling holes are provided in the first boss and the second boss, the length direction of the first cooling hole is parallel to the long side direction of the heat dissipation module, and the length of the first cooling hole is less than the width of the first boss and the second boss.

[0012] The heat dissipation module is provided with a plurality of second cooling holes, which penetrate the heat dissipation module along the long side of the heat dissipation module.

[0013] A further technical solution is that the first cooling hole disposed in the first boss is connected to the first communicating cavity, and the first cooling hole disposed in the second boss is connected to the second communicating cavity; one end of the second cooling hole is connected to the first communicating cavity, and the other end of the second cooling hole is connected to the second communicating cavity.

[0014] A further technical solution is that the first connecting cavity is provided with an inlet communicating with the first connecting cavity, and the second connecting cavity is provided with an outlet communicating with the second connecting cavity.

[0015] A further technical solution is that multiple strip-shaped grooves are evenly distributed on the back of the heat dissipation module to form multiple heat dissipation fins on the back of the heat dissipation module.

[0016] On the cross-section of the heat dissipation module, the strip groove located below the first boss, the second boss and / or the protrusion extends vertically into the first boss, the second boss and / or the protrusion.

[0017] A further technical solution includes a first heat sink and a second heat sink disposed on the front side of the DBC substrate, wherein the pixel-type detection sensor is located between the first heat sink and the second heat sink.

[0018] A further technical solution is that the heat dissipation module has a perforated window, and the connector extends out through the perforated window.

[0019] A further technical solution is that the heat dissipation module, the first heat sink, and the second heat sink are made of metal.

[0020] The beneficial technical effects of this invention are:

[0021] The heat dissipation packaging module of the semiconductor detector proposed in this invention adopts a DBC substrate with better heat dissipation performance and is equipped with a heat dissipation module. The heat dissipation module increases the contact area with the DBC substrate by setting bosses and bumps, and further improves the heat dissipation efficiency by setting liquid cooling through holes or heat dissipation fins, thereby better meeting the heat dissipation requirements of the pixel-type detector module during operation. Attached Figure Description

[0022] Figure 1 This is a cross-sectional schematic diagram of an embodiment of the DBC substrate provided by the present invention.

[0023] Figure 2 This is a front view of an embodiment of the DBC substrate provided by the present invention.

[0024] Figure 3 This is a schematic diagram of the back side of an embodiment of the DBC substrate provided by the present invention.

[0025] Figure 4 This is a front view of an embodiment of the heat dissipation module provided by the present invention.

[0026] Figure 5 This is a cross-sectional schematic diagram of an embodiment of the heat dissipation module provided by the present invention.

[0027] Figure 6 This is a cross-sectional schematic diagram of another embodiment of the heat dissipation module provided by the present invention.

[0028] Figure label:

[0029] 1-DBC substrate, 2-Pixel-type detection sensor, 3-Connector, 4-Processor chip, 5-Heat dissipation module, 6-First boss, 7-Second boss, 8-Protrusion, 9-First cooling hole, 10-Second cooling hole, 11-First connecting cavity, 12-Second connecting cavity, 13-Liquid inlet, 14-Liquid outlet, 15-Heat dissipation fins, 16-First heat sink, 17-Second heat sink, 18-Perforated window. Detailed Implementation

[0030] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0031] This invention provides a heat dissipation packaging module for a semiconductor detector, including a DBC substrate 1 and a heat dissipation module 5. The semiconductor detector includes a pixel-type detection sensor 2, a connector 3, and multiple processor chips 4 that are adapted and connected. The pixel-type detection sensor 2 is disposed on the front side of the DBC substrate 1, and the connector 3 and multiple processor chips 4 are disposed on the back side of the DBC substrate 1. The front side of the heat dissipation module 5 is provided with a first protrusion 6, a second protrusion 7, and multiple bumps 8 located between the first protrusion 6 and the second protrusion 7. The heat dissipation module 5 is connected to the back side of the DBC substrate 1 through the first protrusion 6, the second protrusion 7, and the multiple bumps 8.

[0032] Specifically, both the DBC (Direct Bonding Copper) substrate 1 and the heat dissipation module 5 include a front side and a corresponding back side. In the semiconductor detector, the pixel detection sensor 2, the connector 3, and multiple processor chips 4 are soldered onto the DBC substrate 1. Related circuitry needs to be arranged on the DBC substrate 1 to power the pixel detection sensor 2 and electrically connect the pixel detection sensor 2 to the multiple processor chips 4, and electrically connect the multiple processor chips 4 to the connector 3. When the semiconductor detector is working, the pixel detection sensor 2 transmits the signals it generates during operation to the processor chips 4. The processor chips 4 then transmit the processed signals to the connector 3 for output to external devices.

[0033] Figures 1-3 Schematic diagrams of the cross-section, front side, and back side of the DBC substrate 1 are shown respectively, as follows: Figures 1-3 As shown, in this embodiment, the DBC substrate 1, pixel detection sensor 2, and connector 3 are rectangular with short and long sides. Six processor chips 4 are disposed on the back of the DBC substrate, and the six processor chips 4 are evenly divided into two groups. The two groups of processor chips 4 are symmetrically arranged about the long central axis of the DBC substrate 1. The connector 3 is soldered between the two groups of processor chips 4. The long and short sides of the DBC substrate 1, pixel detection sensor 2, and connector 3 are in the same direction, and the pixel detection sensor 2 and connector 3 are centered along the long central axis of the DBC substrate 1.

[0034] The heat dissipation module 5 provides mechanical support and heat dissipation path for the DBC substrate 1. The first protrusion 6, the second protrusion 7 and multiple protrusions 8 in the heat dissipation module 5 are connected to the back of the DBC substrate 1 through thermally conductive adhesive. The design of the protrusions and protrusions 8 is to maximize the contact area between the heat dissipation module 5 and the DBC substrate 1 without contacting the electronic components on the back of the DBC substrate 1, thereby enhancing the heat dissipation capacity.

[0035] Please refer to Figure 4In one embodiment of the present invention, the heat dissipation module 5, the first protrusion 6, and the second protrusion 7 are all rectangular flat plates with long and short sides. The size of the heat dissipation module 5 matches that of the DBC substrate 1. The long and short sides of the first protrusion 6 and the second protrusion 7 are in different directions from those of the heat dissipation module 5, and the two sides of the width of the first protrusion 6 and the second protrusion 7 are flush with the two sides of the length of the heat dissipation module 5. The outer sides of the length of the first protrusion 6 and the second protrusion 7 are flush with the two sides of the width of the heat dissipation module 5. Specifically, the outer sides of the length of the first protrusion 6 and the second protrusion 7 refer to the sides of the first protrusion 6 and the second protrusion 7 that are away from the protrusion 8 in the width direction. The multiple protrusions 8 are located on the front of the heat dissipation module 5 and the multiple processor chips 4 are located on the back of the DBC substrate 1, so that after the heat dissipation module 5 is connected to the DBC substrate 1, each processor chip 4 has a protrusion 8 on the side of the corresponding long side of the DBC substrate 1, so as to increase the contact area and improve the heat dissipation effect.

[0036] Furthermore, a perforated window 18 is provided on the heat dissipation module 5 in the area corresponding to the connector 3 disposed on the back of the DBC substrate 1, so that the connector 3 can extend through the perforated window 18 to connect with an external device. In this embodiment, the perforated window 18 also extends along the long central axis of the heat dissipation module 5 to the first boss 6 and the second boss 7, and a plurality of protrusions 8 are disposed on the upper and lower sides of the perforated window 18.

[0037] Furthermore, such as Figure 2 As shown, the heat dissipation packaging structure further includes a first heat sink 16 and a second heat sink 17 disposed on the front side of the DBC substrate 1, with the pixel-type detection sensor 2 located between the first heat sink 16 and the second heat sink 17. The thickness of the first heat sink 16 and the second heat sink 17 can be the same as or slightly less than that of the pixel-type detection sensor 2. The first heat sink 16 and the second heat sink 17 are designed to cover the area on the front side of the DBC substrate 1 not covered by the pixel-type detection sensor 2. The materials of the heat dissipation module 5, the first heat sink 16, and the second heat sink 17 are all metals, such as aluminum or copper, to improve the heat dissipation capacity of the DBC substrate 1.

[0038] To further enhance heat dissipation, in one embodiment of the present invention, a plurality of first cooling holes 9 are provided within the first boss 6 and the second boss 7. The length direction of the first cooling holes 9 is parallel to the long side direction of the heat dissipation module 5, and the length of the first cooling holes 9 is less than the width of the first boss 6 and the second boss 7. Simultaneously, a plurality of second cooling holes 10 are provided within the heat dissipation module 5, and the second cooling holes 10 penetrate the heat dissipation module 5 along the long side direction. The plurality of first cooling holes 9 and second cooling holes 10 are parallel. It should be noted that the area in the heat dissipation module 5 corresponding to the perforated window 18 does not have second cooling holes 10.

[0039] The first cooling hole 9, located within the first protrusion 6, communicates with the first connecting cavity 11; the first cooling hole 9, located within the second protrusion 7, communicates with the second connecting cavity 12. One end of the second cooling hole 10 communicates with the first connecting cavity 11, and the other end communicates with the second connecting cavity 12. The first connecting cavity 11 has an inlet 13 communicating with it, and the second connecting cavity 12 has an outlet 14 communicating with it. In practice, the cooling medium can be injected into the first cooling hole 9 and the second cooling hole 10 through the inlet 13, and flow from the inlet 13 through the second cooling hole 10 to the outlet 14 to enhance heat dissipation. Preferably, the diameter of the second cooling hole 10 can be larger than the diameter of the first cooling hole 9 to further increase the flow rate of the cooling medium and enhance heat dissipation.

[0040] Please refer to Figure 6 In another embodiment of the present invention, a plurality of strip-shaped grooves are evenly distributed on the back of the heat dissipation module 5, and the plurality of strip-shaped grooves are parallel to the short side of the heat dissipation module 5 to form a plurality of parallel heat dissipation fins 15 on the back of the heat dissipation module 5; on the cross-section of the heat dissipation module 5, the strip-shaped grooves located below the first boss 6, the second boss 7 and / or the protrusion 8 extend vertically into the first boss 6, the second boss 7 and / or the protrusion 8. The heat dissipation fins 15 have a flat fin-like structure, which can significantly increase the contact area between the heat dissipation module and the air and improve the heat dissipation efficiency.

[0041] In the description of this application, if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "inner", "outer", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0042] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] The use of terms such as "an embodiment / method" indicates that a specific feature, structure, material, or characteristic described in connection with that embodiment / method is included in at least one embodiment / method of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment / method. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments / methods. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments / methods described in this specification and the features of different embodiments / methods.

[0044] The above descriptions are merely preferred embodiments of the present invention, and the present invention is not limited to the above embodiments. It is understood that other improvements and variations that can be directly derived or conceived by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included within the protection scope of the present invention.

Claims

1. A heat dissipation packaging module for a semiconductor detector, characterized in that, It includes a DBC substrate and a heat dissipation module; the semiconductor detector includes a pixel-type detection sensor, a connector and multiple processor chips that are adapted and connected, wherein the pixel-type detection sensor is disposed on the front side of the DBC substrate, and the connector and multiple processor chips are disposed on the back side of the DBC substrate; The front side of the heat dissipation module is provided with a first protrusion, a second protrusion, and a plurality of protrusions located between the first protrusion and the second protrusion. The heat dissipation module is connected to the back side of the DBC substrate through the first protrusion, the second protrusion, and the plurality of protrusions. The heat dissipation module, the first boss, and the second boss are all rectangular flat plates with long and short sides. The two sides of the width of the first boss and the second boss are flush with the two sides of the length of the heat dissipation module, and the outer sides of the length of the first boss and the second boss are flush with the two sides of the width of the heat dissipation module.

2. The heat dissipation packaging module for a semiconductor detector according to claim 1, characterized in that, The DBC substrate is rectangular with a long side and a short side. The multiple processor chips are divided into two groups, and the two groups of processor chips are symmetrically arranged about the long central axis of the DBC substrate.

3. The heat dissipation packaging module for a semiconductor detector according to claim 2, characterized in that, The positions of multiple bumps on the front of the heat dissipation module are matched one by one with the positions of multiple processor chips on the back of the DBC substrate.

4. The heat dissipation packaging module for a semiconductor detector according to claim 2, characterized in that, The first boss and the second boss are provided with a plurality of first cooling holes. The length direction of the first cooling hole is parallel to the long side direction of the heat dissipation module, and the length of the first cooling hole is less than the width of the first boss and the second boss. The heat dissipation module is provided with a plurality of second cooling holes, which penetrate the heat dissipation module along the long side of the heat dissipation module.

5. The heat dissipation packaging module for a semiconductor detector according to claim 4, characterized in that, The first cooling hole located in the first boss is connected to the first connecting cavity, and the first cooling hole located in the second boss is connected to the second connecting cavity; one end of the second cooling hole is connected to the first connecting cavity, and the other end of the second cooling hole is connected to the second connecting cavity.

6. The heat dissipation packaging module for a semiconductor detector according to claim 5, characterized in that, The first communicating cavity is provided with an inlet that communicates with the first communicating cavity, and the second communicating cavity is provided with an outlet that communicates with the second communicating cavity.

7. The heat dissipation packaging module for a semiconductor detector according to claim 2, characterized in that, The back of the heat dissipation module has multiple strip-shaped grooves evenly distributed to form multiple heat dissipation fins on the back of the heat dissipation module. On the cross-section of the heat dissipation module, the strip groove located below the first boss, the second boss and / or the protrusion extends vertically into the first boss, the second boss and / or the protrusion.

8. The heat dissipation packaging module for a semiconductor detector according to claim 1, characterized in that, It also includes a first heat sink and a second heat sink disposed on the front side of the DBC substrate, and the pixel-type detection sensor is located between the first heat sink and the second heat sink.

9. The heat dissipation packaging module for a semiconductor detector according to claim 2, characterized in that, The heat dissipation module has a perforated window, through which the connector extends.

10. The heat dissipation packaging module for a semiconductor detector according to claim 8, characterized in that, The heat dissipation module, the first heat sink, and the second heat sink are made of metal.

Images