Domain controller, movable platform and manufacturing method of domain controller

Abstract

The domain controller comprises a first shell and a second shell which define a containing cavity; the circuit board is arranged in the containing cavity and provided with a chip, and a plug hole is formed in the circuit board; the soaking plate is arranged in the accommodating cavity, a plug-in end matched with the plug-in hole is formed on the soaking plate, a limiting part expanding outwards is formed on the plug-in end, and the soaking plate is plugged on the circuit board and is limited by the limiting part to move, so that the first surface of the soaking plate is tightly pressed on the chip; and the fastener is connected with the first shell, the circuit board and the second shell, so that the second surface of the vapor chamber is attached to the inner wall of the first shell. The invention also provides a manufacturing method of the movable platform and the domain controller. Wherein the vapor chamber is inserted and fixed in an insertion hole of the circuit board by using an insertion end, and the movement is limited by a limiting part, so that the distance between the vapor chamber and the chip is only determined by the manufacturing tolerance of the vapor chamber and the process tolerance of welding the chip on the circuit board, and the precompression formed on the chip by the vapor chamber can be kept unchanged by strictly controlling the tolerances.

Description

Technical Field

[0001] This invention relates to the field of domain controller manufacturing, and more particularly to a domain controller with a heat dissipation housing, and a method for manufacturing the domain controller. Background Technology

[0002] Currently, domain controllers (or electronic devices) consist of one or more chips mounted on a PCB. As chip performance improves, the heat generated by the chips also increases; therefore, domain controllers typically have heat dissipation structures to ensure that the PCB and chips can function properly.

[0003] Chinese utility model patent with publication number CN217280746U discloses a heat dissipation structure for a chip (such as...). Figure 1 As shown, the circuit includes a circuit board 600 and a chip 500 disposed thereon, with a heat-conducting mechanism filling the space between the chip 500 and the housing 100. This heat-conducting mechanism includes a connecting assembly 700, and a first heat-conducting layer 400, a metal heat transfer element 300, and a second heat-conducting layer 200 stacked sequentially. The metal heat transfer element 300 is fixed to the circuit board 600 by the connecting assembly 700 (including a pin 701 and an elastic element 702). The drawback of this heat dissipation structure is that:

[0004] 1. The metal heat transfer component 300 and the circuit board 600 are connected by a pin 701 and an elastic component 702. The number of rotations of the nut at the end of the pin 701 determines the compression of the elastic component 702, which in turn determines the compression of the first heat-conducting layer 400. Different numbers of nut rotations can result in the metal heat transfer component 300 not pressing the chip 500 tightly or applying excessive pressure to the chip 500, making it difficult to maintain consistency during assembly.

[0005] 2. A flexible second thermally conductive layer 200 (graphene foam) is added between the metal heat transfer component 300 and the outer casing 100. Graphene foam itself has good surface thermal conductivity, but its thermal conductivity along its thickness direction is poor. If the compression is small, the overall heat dissipation performance will be significantly reduced. It is difficult to control the compression of the second thermally conductive layer 200 (graphene foam) by rotating the nut at the end of the pin 701, and this makes it even more difficult to control the pre-pressure applied to the chip 500, further increasing the difficulty of maintaining consistency.

[0006] 3. The assembly process is complex and not conducive to automated production line assembly. During high-frequency vibration, the nut at the tail of pin 701 is prone to loosening, requiring the use of anti-loosening adhesive, which increases the overall cost of the machine.

[0007] Chinese invention patent application CN118250968A discloses an electronic device (such as...). Figure 2As shown, the device includes a heat dissipation housing (with a top cover 14 and a base 15), a circuit board 2, and a chip 3, as well as a heat-conducting component 5 and an elastic component 6. To further reduce the gap between the chip 3 and the heat-conducting component 5, a thermal interface material layer 4 is also filled between them. The elastic component 6 includes a spring 61 and a heat pipe 62. The spring 61 is compressed between the heat-conducting component 5 and the first housing wall 11 to reduce the gap between the chip 3 and the heat-conducting component 5, while the heat pipe 62 connects the heat-conducting component 5 and the first housing wall 11 to transfer the heat absorbed by the heat-conducting component 5 from the chip 3 to the heat dissipation housing 1. The heat pipe 62 also has a certain degree of elasticity when compressed between the heat-conducting component 5 and the first housing wall 11. The drawback of this electronic device is:

[0008] 1. The heat-conducting component 5 is pressed against the chip 3 by the elastic force provided by the spring 61 and the heat pipe 62. However, the pressure between the heat-conducting component 5 and the chip 3 is uneven, which leads to uneven thickness of the thermal interface material layer 4. This causes the local hot spot temperature of some high-power chips to exceed the standard, making it difficult to maintain consistency during the assembly process.

[0009] 2. Although heat pipe 62 plays a role in heat conduction, its temperature uniformity is poor due to its shape. Moreover, the pre-pressure it generates is difficult to control, which can easily cause chip 3 to be subjected to greater stress, posing a risk of chip solder joint cracking.

[0010] 3. The assembly process is complex. It requires first fixing the circuit board 2 to the base 15, then fixing the spring 61 and heat pipe 62 to the top cover 14, and finally connecting the base 15 and the top cover 14. It is difficult to ensure that the heat-conducting component 5 is accurately pressed onto the chip 3 by the spring 61 and heat pipe 62. This is not conducive to assembly on automated production lines. Summary of the Invention

[0011] In view of the problems existing in the background art, a first aspect of the present invention provides a domain controller, comprising:

[0012] The first and second shells that enclose the receiving cavity;

[0013] A circuit board with a chip is disposed in the receiving cavity, and the circuit board has a plug hole;

[0014] A heat spreader plate is disposed in the receiving cavity. The heat spreader plate has a plug end that matches the plug hole. An outwardly expanding limiting part is formed on the plug end. The heat spreader plate is plugged into the circuit board and its movement is restricted by the limiting part, so that the first surface of the heat spreader plate is pressed against the chip.

[0015] Fasteners connecting the first housing, the circuit board, and the second housing are used to make the second surface of the heat spreader fit against the inner wall of the first housing.

[0016] In some embodiments of the present invention, the limiting portion is formed by cold riveting, hot deformation, welding, or curing with adhesive.

[0017] In some embodiments of the present invention, a protrusion is formed on the first surface of the heat spreader, and the area of ​​the protrusion is greater than or equal to the area of ​​the chip.

[0018] In some embodiments of the present invention, a first interface filling layer for heat conduction is provided between the chip and the first surface of the heat spreader, and / or a second interface filling layer for heat conduction is provided between the first housing and the second surface of the heat spreader.

[0019] In some embodiments of the present invention, a heat dissipation element is formed at least on the first housing adjacent to the heat spreader.

[0020] In some embodiments of the present invention, the second housing is bent to form a boss, and the fastener securely connects the second housing, the circuit board and the first housing at the boss.

[0021] In some embodiments of the present invention, the second housing is bent to form a boss, the boss being supported by the back side of the portion of the circuit board on which the chip is disposed.

[0022] In some embodiments of the present invention, the circuit board is provided with the chip and a reinforcing plate is provided near the second housing to increase the strength of the area where the chip is provided on the circuit board.

[0023] A second aspect of the invention provides a mobile platform comprising: any of the domain controllers described above.

[0024] A third aspect of the present invention provides a method for manufacturing a domain controller, comprising:

[0025] S101. A circuit board with a chip is provided, and the circuit board has a plug hole;

[0026] S102. Provide a heat spreader plate with a plug end that matches the plug hole, and plug the heat spreader plate into the circuit board;

[0027] S103. An outwardly expanding limiting portion is formed on the plug-in end, the limiting portion restricting the movement of the heat spreader relative to the circuit board, so that the first surface of the heat spreader is pressed against the chip;

[0028] S104. The first housing is placed with its inner wall facing upwards, and the circuit board is stacked on the first housing, with the heat spreader located between the first housing and the circuit board;

[0029] S105. The second housing is stacked on the circuit board, the first housing and the second housing form a receiving cavity, and the heat spreader and the circuit board are located in the receiving cavity;

[0030] S106. The second housing, the circuit board and the first housing are connected in sequence with fasteners so that the second surface of the heat spreader is in contact with the inner wall of the first housing.

[0031] A fourth aspect of the present invention provides another method of manufacturing a domain controller, comprising:

[0032] S201. A circuit board with a chip is provided, the circuit board having a socket hole, and a first interface filling layer for heat conduction is coated on the chip.

[0033] S202. Provide a heat spreader plate with a plug end that matches the plug hole, and plug the heat spreader plate into the circuit board;

[0034] S203. An outwardly expanding limiting portion is formed on the plug-in end, the limiting portion restricting the movement of the heat spreader relative to the circuit board, so that the first interface filling layer is squeezed thin by the first surface of the heat spreader.

[0035] S204. Place the first housing with its inner wall facing upwards, coat the inner wall with a second interface filling layer for heat conduction, and stack the circuit board on the first housing, with the heat spreader located between the first housing and the circuit board.

[0036] S205. The second housing is stacked on the circuit board, the first housing and the second housing form a receiving cavity, and the heat spreader and the circuit board are located in the receiving cavity;

[0037] S206. The second housing, the circuit board and the first housing are connected in sequence with fasteners so that the second interface filling layer is compressed and thinned by the second surface of the heat spreader.

[0038] In some embodiments of the present invention, during the process of forming the outwardly expanding limiting portion on the plug end, pressure is maintained on the heat spreader, the pressure being greater than the minimum allowable stress Fmin of the chip and less than the maximum allowable stress Fmax of the chip.

[0039] In some embodiments of the invention, a support is provided on one side of the plug-in end, and the plug-in end is pressed from the other side, so that the supported end is deformed into the outwardly expanding limiting portion.

[0040] In some embodiments of the present invention, the plug end is thermally deformed to form the outwardly expanding limiting portion.

[0041] In some embodiments of the present invention, the plug-in terminal is soldered to the circuit board, such that the solder forms the outwardly expanding limiting portion at the junction of the two.

[0042] In some embodiments of the present invention, adhesive is filled between the plug end and the circuit board, so that the cured adhesive forms the outwardly expanding limiting portion at the joint between the two.

[0043] In the domain controller provided by this invention, the heat spreader is fixed to the plug-in holes of the circuit board via plug-in terminals and its movement is restricted by limiting parts. This ensures that the distance between the heat spreader and the chip is determined only by the manufacturing tolerances of the heat spreader itself and the process tolerances of the chip soldering onto the circuit board (PCBA sub-board). Strict control of these tolerances ensures that the pre-pressure formed by the heat spreader on the chip remains constant, preventing situations like in existing technologies where the heat spreader fails to properly press the chip, leading to reduced heat dissipation or excessive pressure causing solder joint breakage. Furthermore, the heat spreader can be a conventional plate shape, eliminating the need for irregularly shaped heat pipes as in existing technologies. This allows the high lateral thermal conductivity of the heat spreader to achieve temperature uniformity, reducing the system's heat flux density and enabling the heat generated by the chip to be conducted more quickly through the heat spreader to the first housing and then dissipated outside the domain controller. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of a heat dissipation structure for a chip in the prior art;

[0045] Figure 2 This is a schematic diagram of the structure of an electronic device in the prior art;

[0046] Figure 3 A cross-sectional view of the domain controller provided by the present invention;

[0047] Figure 4 for Figure 3 A schematic diagram of the heat spreader shown in the figure;

[0048] Figure 5 for Figure 3 A schematic diagram of the circuit board shown;

[0049] Figure 6 A cross-sectional view of a domain controller with a second housing of a different shape;

[0050] Figure 7 A cross-sectional view of a domain controller with reinforcement plates;

[0051] Figure 8 for Figure 7 Schematic diagram of the middle reinforcing plate;

[0052] Figures 9a-9c for Figure 3 The assembly flowchart of the domain controller shown (the limiting part is formed by cold riveting process);

[0053] Figure 10 This is a flowchart of the assembly process of the heat spreader and the circuit board (the limiting part is formed by the melting process);

[0054] Figure 11 This is a flowchart of the assembly process of the heat spreader and the circuit board (using laser welding to form the limiting part);

[0055] Figure 12 This is a flowchart of the assembly process of the heat spreader and the circuit board (the limiting part is formed by conventional soldering process);

[0056] Figure 13 This is a flowchart of the assembly process of the heat spreader and the circuit board (the limiting part is formed by the adhesive curing process);

[0057] Figure 14 A flowchart illustrating a method for manufacturing a domain controller provided by the present invention;

[0058] Figure 15 A flowchart illustrating another method for manufacturing a domain controller provided by the present invention.

[0059] Explanation of reference numerals in the attached figures:

[0060] Domain controller 100;

[0061] First housing 10; heat sink 11; mounting post 12;

[0062] Second housing 20; Boss 21; Part 22 where no boss is formed;

[0063] Circuit board 30; Connector 31; PCBA main board 32; PCBA daughter board 33;

[0064] Heat spreader 40; First surface 40a; Second surface 40b; Insertion end 41; Limiting part 42; Protrusion part 43;

[0065] Fastener 50;

[0066] Chip 60;

[0067] First interface fill layer 70;

[0068] Second interface fill layer 80;

[0069] Reinforcing plate 90;

[0070] Reception cavity A. Detailed Implementation

[0071] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0072] like Figure 3-5 As shown, an embodiment of the present invention provides a domain controller 100, mainly including a first housing 10, a second housing 20, a circuit board 30, a heat spreader 40, and fasteners 50. The first housing 10 and the second housing 20 form a receiving cavity A. The circuit board 30, having a chip 60, is disposed in the receiving cavity A, and has a connector hole 31. The heat spreader 40 is disposed in the receiving cavity A, and has a connector end 41 that matches the connector hole 31. An outwardly expanding limiting portion 42 is formed on the connector end 41. The heat spreader 40 is inserted into the circuit board 30 and its movement is restricted by the limiting portion 42, so that the first surface 40a of the heat spreader 40 is pressed against the chip 60. The fasteners 50 connect the first housing 10, the circuit board 30, and the second housing 20, so that the second surface 40b of the heat spreader 40 is in contact with the inner wall of the first housing 10.

[0073] For example, the circuit board 30 can be a bare PCB board, or a PCBA board (Printed Circuit Board Assembly) made by mounting components on a bare PCB board using SMT (Surface Mount Technology).

[0074] For example, the heat spreader 40 can be a metal plate with good heat transfer effect, such as a copper plate, aluminum plate, or iron plate, or a vacuum chamber heat spreader (VC).

[0075] For example, the first housing 10 and the second housing 20 may also be made of metal, such as aluminum or aluminum alloy, copper or copper alloy, or steel, etc., and are die-cast.

[0076] In this embodiment, the circuit board 30 includes a PCBA main board 32 and a PCBA daughter board 33. The PCBA daughter board 33 is disposed on the PCBA main board 32, the chip 60 is disposed on the PCBA daughter board 33, the insertion hole 31 is formed on the PCBA main board 32, and the heat dissipation plate 40 is inserted into the PCBA main board 32 and its movement is restricted by the limiting part 42.

[0077] In other embodiments, circuit board 30 may simply be a PCBA board with chip 60 disposed thereon.

[0078] Those skilled in the art should understand that the heat spreader 40 is fixed to the insertion hole 31 of the circuit board 30 by the insertion end 41 and the movement is restricted by the limiting part 42, so that the distance between the heat spreader 40 and the chip 60 is only determined by the manufacturing tolerance of the heat spreader 40 itself and the process tolerance of the chip 60 soldered on the circuit board 30 (PCBA sub-board 33). By strictly controlling the above tolerances, the pre-pressure formed by the heat spreader 40 on the chip 60 (greater than the minimum allowable stress Fmin of the chip 60 and less than the maximum allowable stress Fmax of the chip 60) can be kept constant. Unlike the prior art, the heat spreader 40 will not be able to press the chip 60 tightly, resulting in a reduction in heat dissipation effect or excessive pressure on the chip 60, resulting in solder joint breakage. Furthermore, the heat spreader 40 can be a conventional plate shape, without the need for irregularly shaped heat pipes as in the prior art. This allows the heat spreader 40 to achieve a uniform temperature effect by utilizing its high lateral thermal conductivity, thereby reducing the heat flux density of the system and enabling the heat generated by the chip 60 to be conducted more quickly through the heat spreader 40 to the first housing 10 and then dissipated to the outside of the domain controller 100.

[0079] Furthermore, the limiting part 42 is formed by cold riveting, hot deformation, welding, or curing with adhesive.

[0080] In different processes, the limiting part 42 can be formed on the upper and lower sides of the circuit board 30, or only on the upper side, or only on the lower side.

[0081] For example, in the cold riveting process, special reference is made. Figure 9a As shown, a two-pronged riveting machine (model HJ-13SL) is used for one side of the insertion end 41 (e.g. Figure 9a The lower side (as shown) provides support, and the other side (e.g., using a PROMESS series pressing machine (model LN510030-20-020HG2 or MLN510030-20-020HG1) is supported by the other side. Figure 9a The upper side of the circuit board 30 is shown. The compression plug end 41 is used to shape the supported end into an outwardly expanding limiting part 42 on the lower side of the circuit board 30.

[0082] For example, in the melting (heat distortion) process, special reference is made. Figure 10 As shown, a melting device with an arc-shaped surface is used to heat the end of the plug-in terminal 41, causing it to undergo thermal deformation on the underside of the adjacent circuit board 30 to form an outwardly expanding limiting part 42.

[0083] For example, in laser welding (heat deformation) processes, special reference is made. Figure 11 As shown, a laser welding device (model UW-S4310M) is used to irradiate the plug end 41, causing it to undergo thermal deformation on the upper and lower sides of the adjacent circuit board 30, so as to form an outwardly expanding limiting part 42.

[0084] For example, in conventional welding processes, special reference is made. Figure 12 As shown, the HAKKO series solder pot is used to solder the plug terminal 41 to the circuit board 30, so that the solder forms outwardly expanding limiting parts 42 on the upper and lower sides of the circuit board 30.

[0085] For example, in the adhesive curing process, special reference is made. Figure 13 As shown, an automated dispensing machine fills the space between the connector 41 and the circuit board 30 with epoxy resin, so that the cured epoxy resin forms outwardly expanding limiting portions 42 on the upper and lower sides adjacent to the circuit board 30.

[0086] Reference Figure 3 and 4 As shown, a protrusion 43 is further formed on the first surface 40a of the heat spreader 40, and the area of ​​the protrusion 43 is greater than or equal to the area of ​​the chip 60.

[0087] Those skilled in the art should understand that, under normal circumstances, the heat generated at different locations on the chip 60 is not completely uniform. Therefore, designing the area of ​​the protrusion 43 to be greater than or equal to the area of ​​the chip 60 can prevent it from only contacting a part of the chip 60, resulting in the heat of another part not being absorbed. That is, the heat spreader 40 should be able to absorb the heat generated at different locations on the chip 60, and avoid local heat accumulation that could damage the chip 60.

[0088] Continue to refer to Figure 3 As shown, a first interface filling layer 70 for heat conduction is further provided between the chip 60 and the first surface 40a of the heat spreader 40, and / or a second interface filling layer 80 for heat conduction is provided between the first housing 10 and the second surface 40b of the heat spreader 40.

[0089] For example, the first interface filling layer 70 and the second interface filling layer 80 can be made of materials such as silicone, silicone grease and gel, which are used to fill gaps and have good thermal conductivity.

[0090] In this embodiment, the first surface 40a is the lower surface of the heat spreader 40, and the second surface 40b is the upper surface of the heat spreader 40. A first interface filling layer 70 and a second interface filling layer 80 are also provided.

[0091] Those skilled in the art should understand that the first interface filling layer 70 and / or the second interface filling layer 80 are thinned (≤0.05 mm) during the assembly process, thereby significantly reducing the thermal resistance between the first surface 40a of the chip 60 and the heat spreader 40, and between the first housing 10 and the second surface 40b of the heat spreader 40, so that the heat generated by the chip 60 can be conducted to the first housing 10 more quickly via the heat spreader 40 and then dissipated to the outside of the domain controller 100.

[0092] Continue to refer to Figure 3 As shown, further, at least a portion of the first housing 10 adjacent to the heat spreader 40 is provided with a heat sink 11.

[0093] In this embodiment, the heat sink 11 is a water-cooled cavity or air-cooled cavity disposed within the first housing 10, and a mounting post 12 (with internal threads) is formed on the inner wall of the first housing 10. Threaded holes / through holes are provided at corresponding positions on the second housing 20 and the PCBA main board 32. Fasteners 50 are screws, which pass sequentially through the threaded holes / through holes of the second housing 20 and the PCBA main board 32, and then engage with the internal threads on the mounting post 12 of the first housing 10, thus fixing the three together. The heat sink 11 is positioned directly above the heat spreader 40, allowing the fluid in the air-cooled cavity or water-cooled cavity to absorb the heat conducted by the heat spreader 40 and discharge it outside the first housing 10 through flow.

[0094] In other embodiments, the heat sink 11 may also be a heat sink fin, heat sink rib, etc., disposed on the first housing 10, for transferring the heat conducted by the heat spreader 30 back to the external environment of the first housing 10. Alternatively, the heat sink 11 may be any combination of two or more of the following: water cooling cavity, air cooling cavity, heat sink fin, and heat sink rib.

[0095] Still refer to Figure 3 As shown, the second housing 20 is further bent to form a boss 21, and the fastener 50 fixes the second housing 20, the circuit board 30 and the first housing 10 at the boss 21.

[0096] In this embodiment, the second housing 20 is bent to form left and right bosses 21, and the bosses 21 are provided with threaded holes / through holes so that two fasteners 50 (screws) pass through the threaded holes / through holes at the left and right bosses 21 respectively to fix the second housing 20, circuit board 30 and first housing 10.

[0097] Reference Figure 6 As shown, the second housing 20 is further bent to form a boss 21, which is supported by the portion of the back side of the circuit board 30 on which the chip 60 is disposed.

[0098] In this embodiment, a chip 60 can be disposed on the circuit board 30. The second housing 20 is bent to form three protrusions 21 on the left, middle, and right. The left and right protrusions 21 are provided with threaded holes / through holes so that two fasteners 50 (screws) pass through the threaded holes / through holes at the left and right protrusions 21 respectively to fix the second housing 20, the circuit board 30, and the first housing 10. The middle protrusion 21 fits against the part of the circuit board 30 where the chip 60 is disposed from the back side and provides support for it, which can reduce the warping of the circuit board 30 at the chip 60.

[0099] Those skilled in the art should understand that the multiple protrusions 21 formed on the second housing 20 serve two purposes: firstly, they act as reinforcing structures to provide good support for the circuit board 30, preventing it from being deformed by compression (the portion 22 without protrusions can also prevent external forces from directly impacting the circuit board 30); secondly, the protrusions 21 also provide installation space for the fasteners 50, preventing them (especially when screws are used) from loosening due to external impacts. Furthermore, the first housing 10 does not require through holes to accommodate spring screws, thus eliminating the risk of dust and water damage or EMC leakage.

[0100] Reference Figure 7 and 8 As shown, the circuit board 30 is further provided with a chip 60 and a reinforcing plate 90 is provided near the second housing 20 to increase the strength of the circuit board 30 where the chip 60 is provided.

[0101] For example, the reinforcing plate 90 may be a steel gasket. The reinforcing plate 90 has threaded holes / through holes for fasteners 50 to pass through, and can be fixed to the back side of the circuit board 30 by screws and / or bonded to the back side of the circuit board 30 by adhesive or other means. The reinforcing plate 90 may be hollow in the middle so as not to obstruct or compress the electronic components on the back of the circuit board 30.

[0102] Those skilled in the art should understand that the reinforcing plate further enhances the rigidity of the circuit board 30 where the chip 60 is located, and can also be seen as the reinforcing plate 90 providing good support to the circuit board 30 from the back side.

[0103] Furthermore, the domain controller 100 described above can also be used as a mobile platform. The mobile platform can be a car, unmanned aerial vehicle (UAV), remote-controlled car, unmanned boat, or robot. The car can be a driverless vehicle or a manned vehicle, and the UAV can be a drone or other unmanned aerial vehicle. Of course, the mobile platform is not limited to the mobile platforms listed above and can also be other mobile platforms.

[0104] Those skilled in the art should understand that, since the movable platform employs the aforementioned domain controller 100, it possesses all the technical effects brought about by the aforementioned domain controller 100. For example, the heat spreader 40 is fixed to the insertion hole 31 of the circuit board 30 via the insertion end 41, and its movement is restricted by the limiting part 42. This ensures that the distance between the heat spreader 40 and the chip 60 is determined only by the manufacturing tolerance of the heat spreader 40 itself and the process tolerance of the chip 60 being soldered onto the circuit board 30 (PCBA sub-board 33). The overall Z-direction (thickness direction) dimensional chain is short, which is beneficial for controlling the thickness of the first interface filling layer 70 between the heat spreader 40 and the chip 60, thereby improving the overall heat dissipation consistency. By strictly controlling the aforementioned tolerances, the pre-pressure formed by the heat spreader 40 on the chip 60 can be kept constant, preventing situations like in the prior art where the heat spreader 30 fails to press the chip 60 firmly, resulting in reduced heat dissipation or excessive pressure on the chip 60 leading to solder joint breakage. Furthermore, the heat spreader 40 can be a conventional plate shape, without the need for irregularly shaped heat pipes as in the prior art. This allows the heat spreader 40 to achieve a uniform temperature effect by utilizing its high lateral thermal conductivity, thereby reducing the heat flux density of the system and enabling the heat generated by the chip 60 to be conducted more quickly through the heat spreader 40 to the first housing 10 and then dissipated to the outside of the domain controller 100.

[0105] like Figures 9a-9c and Figure 14 As shown, one embodiment of the present invention provides a method for manufacturing a domain controller 100, comprising:

[0106] S101. A circuit board 30 with a chip 60 is provided, and the circuit board 30 has a plug hole 31.

[0107] S102. Provide a heat spreader 40 with a plug-in terminal 41 that matches the plug-in hole 31, and plug the heat spreader 40 into the circuit board 30.

[0108] S103. An outwardly expanding limiting portion 42 is formed on the plug-in end 41. The limiting portion 42 restricts the movement of the heat spreader 40 relative to the circuit board 20 so that the first surface 40a of the heat spreader 40 is pressed against the chip 60.

[0109] S104. Place the first housing 10 with its inner wall facing upwards, and stack the circuit board 30 on the first housing 10, with the heat dissipation plate 40 located between the first housing 10 and the circuit board 30.

[0110] S105. The second housing 20 is stacked on the circuit board 30, and the first housing 10 and the second housing 20 form a receiving cavity A. The heat dissipation plate 40 and the circuit board 30 are located in the receiving cavity A.

[0111] S106. The second housing 20, the circuit board 30 and the first housing 10 are connected in sequence with fasteners 50 so that the second surface 40b of the heat spreader 40 is attached to the inner wall of the first housing 10.

[0112] In step S103, forming the outwardly expanding limiting portion 42 on the insertion end 41 can be achieved in one of the following ways:

[0113] Cold riveting, please refer to the following: Figure 9a As shown, a two-pronged riveting machine (model HJ-13SL) is used for one side of the insertion end 41 (e.g. Figure 9a The lower side (as shown) provides support, and the other side (e.g., using a PROMESS series pressing machine (model LN510030-20-020HG2 or MLN510030-20-020HG1) is supported by the other side. Figure 9a The upper side of the circuit board 30 is shown. The compression plug end 41 is used to shape the supported end into an outwardly expanding limiting part 42 on the lower side of the circuit board 30.

[0114] Melting (heat distortion), see special reference. Figure 10 As shown, a melting device with an arc-shaped surface is used to heat the end of the plug-in terminal 41, causing it to undergo thermal deformation on the underside of the adjacent circuit board 30 to form an outwardly expanding limiting part 42.

[0115] Laser welding (heat deformation), please refer to the following: Figure 11 As shown, a laser welding device (model UW-S4310M) is used to irradiate the plug end 41, causing it to undergo thermal deformation on the upper and lower sides of the adjacent circuit board 30, so as to form an outwardly expanding limiting part 42.

[0116] Conventional welding, with special reference Figure 12 As shown, the HAKKO series solder pot is used to solder the plug terminal 41 to the circuit board 30, so that the solder forms outwardly expanding limiting parts 42 on the upper and lower sides of the circuit board 30.

[0117] Adhesive curing, please refer to the instructions. Figure 13 As shown, an automated dispensing machine fills the space between the connector 41 and the circuit board 30 with epoxy resin, so that the cured epoxy resin forms outwardly expanding limiting portions 42 on the upper and lower sides adjacent to the circuit board 30.

[0118] For example, circuit board 30 and heat spreader 40 can be placed on the same processing tray. A first robotic arm or suction cup grasps or picks up heat spreader 40 and inserts it onto circuit board 30. The processing tray is moved to the next step, where an outwardly expanding limiting portion 42 is formed on the insertion end 41 using any of the following processes: cold riveting, melting, laser welding, conventional welding, or adhesive curing, so that the first surface 40a of heat spreader 40 is pressed against chip 60. The processing tray is moved to the next step, where a second robotic arm or suction cup grasps or picks up first housing 10 and inverts it onto the processing tray. Then, a second robotic arm or suction cup grasps or picks up circuit board 30 with heat spreader 40 assembled on it and places circuit board 30 on top of first housing 10, with heat spreader 40 located between first housing 10 and circuit board 30. The processing tray is moved to the next process, where a third robotic arm or suction cup grasps or picks up the second housing 20 and places it on the circuit board 30 in a stacked manner. The processing tray is moved to the next process, where a fully automatic screw-driving machine sequentially connects the second housing 20, the circuit board 30, and the first housing 10 with fasteners 50 (screws). The circuit board 30 is fixed in a preset position in the receiving cavity A so that the second surface 40b of the heat spreader 40 is in contact with the inner wall of the first housing 10.

[0119] Alternatively, the circuit board 30, heat spreader 40, first housing 10, and second housing 20 are placed on the same processing tray. A robotic arm or suction cup is used to grasp or pick up the heat spreader 40, which is then inserted into the circuit board 30. Any one of the following processes—cold riveting, melting, laser welding, conventional welding, or adhesive curing—is used to form an outwardly expanding limiting portion 42 on the insertion end 41, so that the first surface 40a of the heat spreader 40 is pressed firmly onto the chip 60. The same robotic arm or suction cup is used to grasp or pick up the circuit board 30 with the heat spreader 40 assembled on it, and the circuit board 30 is stacked on the first housing 10, with the heat spreader 40 located between the first housing 10 and the circuit board 30. The same robotic arm or suction cup is used to grasp or pick up the second housing 20, and the second housing 20 is stacked on the circuit board 30. Finally, the fasteners 50 (screws) are connected to the second housing 20, the circuit board 30 and the first housing 10 in sequence using a fully automatic screw-driving machine. The circuit board 30 is fixed in a preset position in the receiving cavity A so that the second surface 40b of the heat spreader 40 is attached to the inner wall of the first housing 10.

[0120] Those skilled in the art should understand that, in the manufacturing process of the domain controller 100, the above-described stacking scheme eliminates the need for segmented assembly of components, and the semi-finished products formed in each step do not require flipping. Therefore, the types and quantities of equipment required for the fully automated production line are very small (it can only have a robotic arm or suction cup, a fully automatic screw-driving machine, and any one of the following: cold riveting, melting, laser welding, conventional welding, or automated dispensing equipment), which is extremely advantageous for fully automated production and assembly. As mentioned above, the heat spreader 40 is fixed to the insertion hole 31 of the circuit board 30 by the insertion end 41, and its movement is restricted by the limiting part 42. This ensures that the distance between the heat spreader 40 and the chip 60 is determined only by the manufacturing tolerance of the heat spreader 40 itself and the process tolerance of the chip 60 soldered onto the circuit board 30 (PCBA sub-board 33). By strictly controlling the above tolerances, the pre-pressure formed by the heat spreader 40 on the chip 60 can be kept constant, unlike in the prior art where the heat spreader 30 fails to press the chip 60 tightly, resulting in reduced heat dissipation or excessive pressure on the chip 60 leading to solder joint breakage. Furthermore, the heat spreader 40 can be a conventional plate shape, without the need for irregularly shaped heat pipes as in the prior art. This allows the heat spreader 40 to achieve a uniform temperature effect by utilizing its high lateral thermal conductivity, thereby reducing the heat flux density of the system and enabling the heat generated by the chip 60 to be conducted more quickly through the heat spreader 40 to the first housing 10 and then dissipated to the outside of the domain controller 100.

[0121] like Figures 9a-9c and Figure 15 As shown, one embodiment of the present invention provides another method for manufacturing a domain controller 100, comprising:

[0122] S201. A circuit board 30 with a chip 60 is provided. The circuit board 30 has a socket 31 and a first interface filling layer 70 for heat conduction is coated on the chip 60.

[0123] S202, Provide a heat spreader 40 with a plug end 41 that matches the plug hole 31, and plug the heat spreader 40 into the circuit board 30 so that the chip 60 is attached to the first interface filling layer 70.

[0124] S203. An outwardly expanding limiting portion 42 is formed on the plug-in end 41. The limiting portion 42 restricts the movement of the heat spreader 40 relative to the circuit board 30 so that the first interface filling layer 70 is squeezed thin by the first surface 40a of the heat spreader 40.

[0125] S204. Place the first housing 10 with its inner wall facing upwards, coat the inner wall with a second interface filling layer 80 for heat conduction, and stack the circuit board 30 on the first housing 10, with the heat spreader located between the first housing and the circuit board.

[0126] S205. The second housing 20 is stacked on the circuit board 30, and the first housing 10 and the second housing 20 form a receiving cavity A. The heat dissipation plate 40 and the circuit board 30 are located in the receiving cavity A.

[0127] S206. The second housing 20, the circuit board 30 and the first housing 10 are connected in sequence by fasteners 50 so that the second interface filling layer 80 is squeezed thin by the second surface 40b of the heat spreader 40.

[0128] Exemplarily, the circuit board 30 and the heat spreader 40 can be placed on the same processing tray. An automated dispensing machine coats a first interface filler layer 70 for heat conduction onto the first surface 40a of the heat spreader 30. A first robotic arm or suction cup grasps or picks up the heat spreader 40 and inserts it onto the circuit board 30. The processing tray is moved to the next process, where any of the following processes—cold riveting, melting, laser welding, conventional welding, or adhesive curing—is used to form an outwardly expanding limiting portion 42 on the insertion end 41, so that the first interface filler layer 70 is compressed and thinned by the first surface 40a of the heat spreader 40. Moving the processing tray to the next process, a second robotic arm or suction cup grasps or picks up the first housing 10 and inverts it onto the processing tray. An automated dispensing machine coats the inner wall of the first housing 10 with a second interface filler layer 80 for heat conduction. Then, the second robotic arm or suction cup grasps or picks up the circuit board 30 assembled with the heat spreader 40 and places the circuit board 30 on the first housing 10 in a stacked manner. Moving the processing tray to the next process, a third robotic arm or suction cup grasps or picks up the second housing 20 and places the second housing 20 on the circuit board 30 in a stacked manner. Moving the processing tray to the next process, a fully automatic screw-driving machine sequentially connects the second housing 20, the circuit board 30, and the first housing 10 with fasteners 50 (screws). The circuit board 30 is fixed in a preset position in the receiving cavity A so that the second interface filler layer 80 is compressed and thinned by the second surface 40b of the heat spreader 40.

[0129] Alternatively, the circuit board 30, the heat spreader 40, the first housing 10, and the second housing 20 are placed on the same processing tray. An automated dispensing machine coats the first surface 40a of the heat spreader 30 with a first interface filler layer 70 for heat conduction, and coats the inner wall of the first housing 10 with a second interface filler layer 80 for heat conduction. A robotic arm or suction cup grasps or picks up the heat spreader 40 and inserts it into the circuit board 30. Any one of the following processes—cold riveting, melting, laser welding, conventional welding, or adhesive curing—is used to form an outwardly expanding limiting part 42 on the insertion end 41, so that the first interface filler layer 70 is compressed and thinned by the first surface 40a of the heat spreader 40. The same robotic arm or suction cup grasps or picks up the circuit board 30 assembled with the heat spreader 40, and places the circuit board 30 in a stacked manner on the first housing 10, with the heat spreader 40 located between the first housing 10 and the circuit board 30. The second housing 20 is grasped or sucked up by the same robotic arm or suction cup and placed on the circuit board 30 in a stacked manner. Finally, the fasteners 50 (screws) are connected to the second housing 20, the circuit board 30 and the first housing 10 in sequence by a fully automatic screw-driving machine. The circuit board 30 is fixed in a preset position in the receiving cavity A so that the second interface filling layer 80 is squeezed thin by the second surface 40b of the heat spreader 40.

[0130] Those skilled in the art should understand that, in the manufacturing process of the domain controller 100, the above-described stacking scheme eliminates the need for segmented assembly of components, and the semi-finished products formed in each step do not require flipping. Therefore, the types and quantities of equipment required for the fully automated production line are very few (it can only include automated dispensing machines, robotic arms or suction cups, fully automated screw-driving machines, and any one of cold riveting, melting, laser welding, conventional welding, and automated dispensing equipment), which is extremely advantageous for fully automated production and assembly. In addition to the aforementioned beneficial effects, the degree to which the first interface filling layer 70 and the second interface filling layer 80 are thinned during the assembly process is basically the same, and the thinned first interface filling layer 70 and the second interface filling layer 80 are uniform and free of voids and air bubbles.

[0131] Furthermore, in steps S103 and S203, during the process of forming the outwardly expanding limiting portion 42 on the plug-in end 41, pressure is maintained on the heat spreader 40, the pressure being greater than the minimum allowable stress Fmin of the chip 60 and less than the maximum allowable stress Fmax of the chip 60.

[0132] Those skilled in the art should understand that, through reasonable calculation, the applied pressure is made greater than the minimum allowable stress Fmin on the surface of chip 60 to prevent internal delamination of chip 60 under long-term high-temperature conditions, which would increase thermal resistance and lead to thermal failure. The applied pressure is less than the maximum allowable stress Fmax of chip 60 to prevent excessive stress on chip 60 from damaging the internal wafers or causing solder joint breakage.

[0133] In the description of this specification, the references to terms such as "certain embodiments," "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0134] In this invention, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "link" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0135] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not restrictive. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A domain controller, characterized in that, include: The first and second shells that enclose the receiving cavity; A circuit board with a chip is disposed in the receiving cavity, and the circuit board has a plug hole; A heat spreader plate is disposed in the receiving cavity. The heat spreader plate has a plug end that matches the plug hole. An outwardly expanding limiting part is formed on the plug end. The heat spreader plate is plugged into the circuit board and its movement is restricted by the limiting part, so that the first surface of the heat spreader plate is pressed against the chip. Fasteners connecting the first housing, the circuit board, and the second housing are used to make the second surface of the heat spreader fit against the inner wall of the first housing.

2. The domain controller according to claim 1, characterized in that: The limiting part is formed by cold riveting, hot deformation, welding, or adhesive curing.

3. The domain controller according to claim 1, characterized in that: A protrusion is formed on the first surface of the heat spreader, and the area of ​​the protrusion is greater than or equal to the area of ​​the chip.

4. The domain controller according to claim 1, characterized in that: A first interface filling layer for heat conduction is provided between the chip and the first surface of the heat spreader, and / or a second interface filling layer for heat conduction is provided between the first housing and the second surface of the heat spreader.

5. The domain controller according to claim 1, characterized in that: At least a portion of the first housing adjacent to the heat spreader is provided with a heat dissipation element.

6. The domain controller according to claim 1, characterized in that: The second housing is bent to form a boss, and the fasteners fix the second housing, the circuit board and the first housing at the boss.

7. The domain controller according to claim 1, characterized in that: The second housing is bent to form a boss, which is supported by the portion of the circuit board on the back side where the chip is disposed.

8. The domain controller according to any one of claims 1-6, characterized in that: The circuit board is provided with the chip and a reinforcing plate is provided near the second housing to increase the strength of the area where the chip is located on the circuit board.

9. A mobile platform, characterized in that, include: The domain controller as described in any one of claims 1-8.

10. A method for manufacturing a domain controller, characterized in that, include: S101. A circuit board with a chip is provided, and the circuit board has a plug hole; S102. Provide a heat spreader plate with a plug end that matches the plug hole, and plug the heat spreader plate into the circuit board; S103. An outwardly expanding limiting portion is formed on the plug-in end, the limiting portion restricting the movement of the heat spreader relative to the circuit board, so that the first surface of the heat spreader is pressed against the chip; S104. The first housing is placed with its inner wall facing upwards, and the circuit board is stacked on the first housing, with the heat spreader located between the first housing and the circuit board; S104. The second housing is stacked on the circuit board, the first housing and the second housing form a receiving cavity, and the heat spreader and the circuit board are located in the receiving cavity; S105. The second housing, the circuit board and the first housing are connected in sequence with fasteners so that the second surface of the heat spreader is in contact with the inner wall of the first housing.

11. A method for manufacturing a domain controller, characterized in that, include: S201. A circuit board with a chip is provided, the circuit board having a socket hole, and a first interface filling layer for heat conduction is coated on the chip. S202. Provide a heat spreader plate with a plug end that matches the plug hole, and plug the heat spreader plate into the circuit board; S203. An outwardly expanding limiting portion is formed on the plug-in end, the limiting portion restricting the movement of the heat spreader relative to the circuit board, so that the first interface filling layer is squeezed thin by the first surface of the heat spreader. S204. Place the first housing with its inner wall facing upwards, coat the inner wall with a second interface filling layer for heat conduction, and stack the circuit board on the first housing, with the heat spreader located between the first housing and the circuit board. S205. The second housing is stacked on the circuit board, the first housing and the second housing form a receiving cavity, and the heat spreader and the circuit board are located in the receiving cavity; S206. The second housing, the circuit board and the first housing are connected in sequence with fasteners so that the second interface filling layer is compressed and thinned by the second surface of the heat spreader.

12. The method of manufacturing a domain controller according to claim 10 or 11, characterized in that: During the process of forming the outwardly expanding limiting portion on the plug end, pressure is maintained on the heat spreader, the pressure being greater than the minimum allowable stress Fmin of the chip and less than the maximum allowable stress Fmax of the chip.

13. The method of manufacturing a domain controller according to claim 10 or 11, characterized in that: One side of the plug-in end is supported, and the plug-in end is pressed from the other side, so that the supported end is deformed into the outwardly expanding limiting portion.

14. The method of manufacturing a domain controller according to claim 10 or 11, characterized in that: The insertion end is thermally deformed to form the outwardly expanding limiting portion.

15. The method of manufacturing a domain controller according to claim 10 or 11, characterized in that: The connector is soldered to the circuit board, so that the solder forms an outwardly expanding limiting portion at the junction of the two.

16. The method of manufacturing a domain controller according to claim 10 or 11, characterized in that: An adhesive is filled between the plug-in end and the circuit board, so that the cured adhesive forms an outwardly expanding limiting portion at the joint between the two.

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