A multi-dimensional system integrated interconnect assembly and method of assembly
By designing multi-dimensional system integration interconnect components, three-dimensional interconnection between parallel printed circuit boards and vertical printed circuit boards was achieved, solving the problems of high cost, large size and poor signal transmission of connectors in the existing technology, and improving assembly density and signal quality.
Patent Information
- Application Number
- CN202511425835.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2045-09-30
AI Technical Summary
In existing technologies, it is difficult to achieve three-dimensional connection between parallel printed circuit boards and vertical printed circuit boards, resulting in high connector costs, large size, and poor signal transmission quality, which cannot meet the requirements of miniaturization, integration, and high speed.
Design a multi-dimensional system integration interconnect component, including a protection unit and a connection unit. The connection unit extends to different end faces for connection. The three-dimensional interconnection of the printed circuit board is realized by using an elastomer and a conductor. The protection unit provides limiting and guidance.
It realizes three-dimensional interconnection between parallel and vertical printed circuit boards, which improves assembly density, shortens interconnection line length, reduces signal noise, and improves signal transmission quality.
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Figure CN120895926B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip interconnection, and in particular to a multi-dimensional system integration interconnection component and assembly method. Background Technology
[0002] In electronic devices, the interconnection between parallel printed circuit boards is mainly achieved through vertical interconnect connectors, enabling reliable vertical interconnection of signals between two parallel printed circuit boards. Traditional vertical interconnect connectors mainly include surface mount soldering and through-board soldering in terms of mating methods. However, these methods have problems such as large insertion and extraction forces when blindly mating between boards, large connector size, poor high-frequency performance, and complex maintenance.
[0003] Two-dimensional planar assembly currently provides the most common interconnects between parallel printed circuit boards. However, it has reached its technological limits. Existing interconnect structures only address vertical interconnections between parallel printed circuit boards and cannot achieve three-dimensional interconnections between parallel and vertical printed circuit boards. Therefore, in practical applications, multiple sets of connectors are typically required, resulting in high costs for the entire electronic connection structure and failing to meet the demands for miniaturization, integration, high speed, and lightweight design. Summary of the Invention
[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a multi-dimensional system integration interconnection component and assembly method.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: a multi-dimensional system integration interconnection component, wherein the interconnection component is disposed between printed circuit boards.
[0006] The interconnect components include:
[0007] Protection unit;
[0008] The inner side of the protection unit forms a receiving cavity, and a connecting unit is provided inside the receiving cavity;
[0009] The connecting unit extends toward multiple end faces of the protection unit and passes through the outside of the protection unit, thereby connecting the printed circuit boards located at different end faces of the interconnecting component.
[0010] As a further description of the above technical solution: the protection unit includes a first housing, a second housing, and a third housing, the first housing and the second housing are disposed opposite to each other, and the third housing is disposed above the first housing and the second housing, splicing together to form the receiving cavity.
[0011] As a further description of the above technical solution: the first housing, the second housing and the third housing are provided with slots at their end faces, so that the connecting unit extends to the outside, and the third housing limits the connecting unit.
[0012] As a further description of the above technical solution: the connecting unit includes a first insulating member and a second insulating member, two of which are provided, and the second insulating member is vertically disposed between the two first insulating members.
[0013] As a further description of the above technical solution: one side of each of the two first insulating members is coplanar with the end faces of the first housing and the second housing respectively through the slot, and one side of the second insulating member is coplanar with the end face of the third housing.
[0014] As a further description of the above technical solution: the first insulating member or the second insulating member is provided with a plurality of through holes, so that the first insulating member and the second insulating member are connected.
[0015] As a further description of the above technical solution: an elastomer and a conductor connected to one side of the elastomer are provided inside the through hole, and one side of the conductor extends to the outside of the first insulating member or the second insulating member for elastic interconnection.
[0016] As a further description of the above technical solution: the other side of the elastomer extends into the second insulating member, the second insulating member has a cavity, a connector is provided inside the cavity, and the connector is connected to the elastomer.
[0017] As a further description of the above technical solution: a pressure block is provided on the second insulating member, the pressure block being used to limit the position of the connector.
[0018] It also includes an assembly method based on multi-dimensional system integration interconnection components, comprising:
[0019] S1. Place the conductor and elastomer into the through hole of the first insulator or the second insulator;
[0020] S2. Place a connector and a pressure block on one side of the second insulating member, and then connect the first insulating member and the second insulating member through the elastic body and the through hole to form a connecting unit;
[0021] S3. Connect the first housing and the second housing, and place the connecting unit between the first housing and the second housing;
[0022] S4. Install locating pins on the third housing and connect the third housing to the first housing and the second housing to form an interconnection assembly.
[0023] The above technical solution has the following advantages or beneficial effects:
[0024] The interconnect components designed in this application enable interconnection of three sides of parallel and vertical printed circuit boards, improving product assembly density, reducing product size, shortening the length of interconnect lines, reducing signal noise, and solving the problem that excessively long interconnect lines in high-performance systems not only affect signal transmission quality but can even cause logic errors. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a perspective view of the interconnection component proposed in this invention;
[0027] Figure 2 This is a top view of the interconnection component proposed in this invention;
[0028] Figure 3 This is a side view of the interconnection component proposed in this invention;
[0029] Figure 4 This is a cross-sectional view of the interconnect component proposed in this invention;
[0030] Figure 5 This is an exploded view of the interconnect component proposed in this invention;
[0031] Figure 6 The three-dimensional form of the connecting unit in this invention Figure 1 ;
[0032] Figure 7 The three-dimensional form of the connecting unit in this invention Figure 2 ;
[0033] Figure 8 This is a flowchart of the assembly method proposed in this invention.
[0034] Legend:
[0035] 1. Protection unit; 11. First housing; 12. Second housing; 13. Third housing; 2. Connecting unit; 21. First insulating component; 22. Second insulating component; 23. Elastomer; 24. Conductor; 25. Connector; 26. Pressure block; 3. Pin; 4. Positioning pin. Detailed Implementation
[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0037] Reference Figures 1-7 The present invention provides an embodiment of a multi-dimensional system integration interconnection component, wherein the interconnection component is disposed between printed circuit boards, and the interconnection component includes: a protection unit 1; a receiving cavity is formed inside the protection unit 1, and a connecting unit 2 is disposed inside the receiving cavity; the connecting unit 2 extends in multiple end face directions of the protection unit 1 and passes through to the outside of the protection unit 1, and the printed circuit boards located at different end faces of the interconnection component are connected through the connecting unit 2.
[0038] In this embodiment, parallel printed circuit boards and vertical printed circuit boards, as well as parallel printed circuit boards and parallel printed circuit boards, are connected by interconnect components to achieve three-sided interconnection. A connecting unit 2 is provided inside the protection unit 1. The connecting unit 2 is installed, guided, and protected. The connecting unit 2 extends from multiple end faces of the protection unit 1 to connect with external printed circuit boards, realizing three-dimensional interconnection. This improves the assembly density of subsequent products, reduces product size, shortens the length of interconnect line transmission, reduces signal noise, and solves the problem that in high-performance systems, excessively long interconnect lines not only affect signal transmission quality but can even cause logic errors.
[0039] The protection unit 1 includes a first housing 11, a second housing 12 and a third housing 13. The first housing 11 and the second housing 12 are arranged opposite to each other, and the third housing 13 is arranged above the first housing 11 and the second housing 12, and are spliced together to form a receiving cavity.
[0040] In this embodiment, the first housing 11 and the second housing 12 are arranged opposite to each other and connected by screws to form an inwardly recessed rectangular groove structure. The third housing 13 is disposed on the first housing 11 and the second housing 12 and connected by screws to form a receiving cavity for placing the connecting unit 2 and protecting the connecting unit 2 on the inner side.
[0041] The first housing 11, the second housing 12 and the third housing 13 have slots on their end faces, allowing the connecting unit 2 to extend to the outside, and the third housing 13 limits the connection unit.
[0042] In this embodiment, the connecting unit 2 extends to the outside through the slot for electrical connection with the external printed circuit board. The first housing 11, the second housing 12 and the third housing 13 can limit the surrounding area of the connecting unit 2 to prevent the connecting unit 2 from rotating or deforming during interconnection, thus affecting the connection effect.
[0043] The connecting unit 2 includes a first insulating member 21 and a second insulating member 22. There are two first insulating members 21, and the second insulating member 22 is vertically disposed between the two first insulating members 21.
[0044] In this embodiment, two first insulating members 21 are provided and are arranged opposite to each other, located at the first housing 11 and the second housing 12 respectively. The second insulating member 22 is perpendicular to the first insulating member 21 and is located between the two first insulating members 21 to prevent the first insulating member 21 from being displaced.
[0045] One side of each of the two first insulating members 21 is coplanar with the end faces of the first housing 11 and the second housing 12 respectively through the slot, and one side of the second insulating member 22 is coplanar with the end face of the third housing 13.
[0046] In this embodiment, one side of the two first insulating members 21 is coplanar with the end face of the first housing 11 and the second housing 12, and one side of the second insulating member 22 is coplanar with the end face of the third housing 13. When interconnecting, the end face is attached to the external printed circuit board to ensure that the connection unit 2 can be effectively connected and to avoid the problem of poor connection contact.
[0047] The first insulating member 21 or the second insulating member 22 is provided with a plurality of through holes, so that the first insulating member 21 and the second insulating member 22 are connected.
[0048] In this embodiment, the first insulating member 21 is provided with 12 through holes in a single row, and the second insulating member 22 is provided with 12 through holes in two rows. The through holes on the first insulating member 21 are connected to the row of through holes on the second insulating member 22 that are close to each other, so as to achieve interconnection.
[0049] An elastomer 23 and a conductor 24 connected to one side of the elastomer 23 are provided inside the through hole. One side of the conductor 24 extends to the outside of the first insulator 21 or the second insulator 22 for elastic interconnection.
[0050] In this embodiment, the elastic body 23 is a button connector with conductive and stretchable characteristics. It is vibration resistant, resistant to insertion and removal, and has better high-frequency performance than ordinary spring pins. It replaces rigid pins and reduces insertion and removal wear. The elastic body 23 is clearance-fitted with the through hole. The conductor 24 is connected to one side of the elastic body 23, and part of the conductor 24 extends to the outside of the first insulating member 21 or the second insulating member 22. When performing plug-in interconnection, the conductor 24 is springed back by the elastic body 23, and the springback margin is 0.3mm.
[0051] The other side of the elastic body 23 extends into the second insulating member 22. The second insulating member 22 has a cavity, and a connector 25 is provided inside the cavity. The connector 25 is connected to the elastic body 23.
[0052] In this embodiment, the other side of the elastic body 23 extends into the inner cavity of the second insulating member 22 and is connected to the connector 25. The inner cavity of the second insulating member 22 is divided into multiple cavity areas to place the connector 25. The position of the connector 25 corresponds to the position of the through hole and is used to electrically connect with the elastic body 23 to realize electrical signal transmission.
[0053] The second insulating member 22 is provided with a pressure block 26, which is used to limit the connection body 25.
[0054] In this embodiment, a pressure block 26 is provided on the second insulating member 22. The pressure block 26 is used to install on one side of the cavity to limit the connector 25 inside the cavity, so as to prevent the connector 25 from moving during the plug-in interconnection, which would result in poor contact with the elastic body 23 and affect the connection effect.
[0055] The first housing 11 and the second housing 12 are provided with pins 3, and the end face of the third housing 13 is provided with a positioning pin 4.
[0056] In this embodiment, the pin 3 and the positioning pin 4 are provided to facilitate rapid positioning during plug-in interconnection.
[0057] Reference Figure 8 The present invention also provides an assembly method for multi-dimensional system integration interconnection components, comprising:
[0058] S1. Place the conductor and elastomer into the through hole of the first insulator or the second insulator;
[0059] S2. Place a connector and a pressure block on one side of the second insulating component, and then connect the first insulating component and the second insulating component through an elastic body and a through hole to form a connecting unit.
[0060] S3. Connect the first housing and the second housing, and place the connecting unit between the first housing and the second housing;
[0061] S4. Install locating pins on the third housing and connect the third housing with the first housing and the second housing to form an interconnecting assembly.
[0062] It is understood that the assembly method provided in the embodiments of the present invention corresponds to the above-described interconnecting components, and the explanations, examples, and beneficial effects of the relevant content can be referred to the corresponding content in the interconnecting components, which will not be repeated here.
[0063] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A multi-dimension system integrated interconnect assembly, comprising: The interconnection assembly is arranged between the printed boards, The interconnection assembly comprises: a protection unit; a receiving cavity is formed inside the protection unit, and a connecting unit is arranged inside the receiving cavity; the connecting unit extends to the direction of the end faces of the protection unit and penetrates to the outside of the protection unit, and the printed boards at different end faces of the interconnection assembly are connected through the connecting unit; the protection unit comprises a first shell, a second shell and a third shell, notches are formed at the end faces of the first shell, the second shell and the third shell, the first shell and the second shell are arranged oppositely, and the third shell is arranged above the first shell and the second shell to splice to form the receiving cavity; the connecting unit comprises a first insulating member and a second insulating member which are perpendicular to each other; one side of each of the first insulating members is coplanar with the end face of the first shell and the second shell through the notch, and one side of the second insulating member is coplanar with the end face of the third shell; a plurality of through holes are arranged on the first insulating member or the second insulating member, an elastic body and a conductor connected to one side of the elastic body are arranged inside the through holes, and one side of the conductor extends to the outside of the first insulating member or the second insulating member; the other side of the elastic body extends into the second insulating member, a cavity is formed in the second insulating member, a connecting body is arranged inside the cavity, and the connecting body is connected to the elastic body.
2. The interconnect assembly of claim 1, wherein: The notch makes the connecting unit extend to the outside, and the third shell limits the connecting unit.
3. The interconnect assembly of claim 1, wherein: The first insulating member is provided in two, and the second insulating member is arranged perpendicularly between the two first insulating members.
4. The interconnect assembly of claim 1, wherein: The through holes make the first insulating member and the second insulating member communicate.
5. The interconnect assembly of claim 1, wherein: The second insulating member is provided with a pressing block for limiting the connecting body.
6. A method of assembling a multi-dimension system integrated interconnect assembly, comprising: The method is suitable for the interconnection assembly of any one of claims 1-5, comprising: S1, placing the conductor and the elastic body into the through hole of the first insulating member or the second insulating member; S2, placing the connecting body and the pressing block on one side of the second insulating member, and then inserting and fitting the first insulating member and the second insulating member through the elastic body and the through hole to form the connecting unit; S3, connecting the first shell and the second shell, and placing the connecting unit between the first shell and the second shell; S4, installing a positioning pin on the third shell, and connecting the third shell with the first shell and the second shell to form the interconnection assembly.
Citation Information
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