Heterogeneous integrated liquid electrolyte power supply processor

Abstract

The processing unit includes a substrate, an electrical load, and a microfluidic volume. An electrical load is supported by the first surface of the substrate, and a microfluidic volume is located in the second surface of the substrate. The processing unit includes a first electrode located in the microfluidic volume and a second electrode located in the microfluidic volume. A first TSV connects the first electrode to an electrical load and a second TSV connects the second electrode to the electrical load. An electrochemical fluid is located in the microfluidic volume to provide electrical power to and receive heat from the electrical load.

Description

BACKGROUND

[0001] Conventional processing units are supplied with power and cooling by separate power supply devices and cooling systems. As the density of computing resources, such as in server configurations and / or in data centers, increases, the available space for power delivery and heat removal decreases. SUMMARY

[0002] In some embodiments, a processing unit includes a substrate, an electrical load, and a microfluidic volume. The electrical load is supported by a first surface of the substrate, and the microfluidic volume is in a second surface of the substrate. The processing unit includes a first electrode in the microfluidic volume and a second electrode in the microfluidic volume. A first TSV connects the first electrode to the electrical load, and a second TSV connects the second electrode to the electrical load. An electrochemical fluid is in the microfluidic volume to provide electrical power to the electrical load and receive heat from the electrical load.

[0003] [B1] In some embodiments, a processing unit includes a substrate, an electrical load, and an electrochemical chamber. The electrical load is supported by a first surface of the substrate, and the electrochemical chamber is in the substrate. The electrochemical chamber includes an ion transfer membrane that separates the electrochemical chamber into a first portion and a second portion. The electrochemical chamber includes a first electrode in the first portion and a second electrode in the second portion. A pin fin is in the electrochemical chamber and is configured to support the ion transfer membrane relative to the substrate. A TSV in the pin fin connects one of the first electrode and the second electrode to the electrical load. A first electrochemical fluid is in a first volume, and a second electrochemical fluid is in a second volume to provide electrical power to the electrical load and receive heat from the electrical load.

[0004] In some embodiments, a system for electrochemical generation includes a processing unit, a first electrochemical storage tank, a second electrochemical storage tank, and a heat exchanger. The processing unit includes a substrate, an electrical load, and an electrochemical chamber. The electrical load is supported by a first surface of the substrate, and the electrochemical chamber is in a second surface of the substrate. The electrochemical chamber includes an ion transfer membrane that separates the electrochemical chamber into a first portion and a second portion. The electrochemical chamber includes a first electrode in the first portion and a second electrode in the second portion. A first TSV connects the first electrode to the electrical load, and a second TSV connects the second electrode to the electrical load. A first electrochemical fluid is in a first volume, and a second electrochemical fluid is in a second volume to provide electrical power to the electrical load and receive heat from the electrical load. The first electrochemical storage tank is in fluid communication with the first portion, and the second electrochemical fluid storage tank is in fluid communication with the second portion. The heat exchanger is in fluid communication with at least one of the first electrochemical fluid and the second electrochemical fluid and is configured to reject heat from the at least one of the first electrochemical fluid and the second electrochemical fluid.

[0005] This summary is provided to introduce some concepts of the present disclosure in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter.

[0006] Additional features and advantages will be set forth in the description that follows, and in part will be apparent from the description, or can be learned by practice of the disclosure herein. The features and advantages of the present disclosure will be realized and attained by the means and combinations particularly pointed out in the appended claims. According to the following description and the appended claims, the features of the present disclosure will become more fully apparent, or can be better understood, through the practice of the present disclosure as hereinafter described. BRIEF DESCRIPTION OF DRAWINGS

[0007] In order to describe the manner in which the above-recited and other features of the present disclosure can be obtained, a more particular description will be rendered by reference to specific embodiments thereof, which are illustrated in the appended drawings. For better understanding, the like elements have been designated by like reference numbers throughout the various accompanying drawings, wherein:

[0008] Figure 1-1 is a schematic illustration of an electrochemical system according to at least some embodiments of the present disclosure;

[0009] Figure 1-2 is a schematic illustration of an electrochemical system according to at least some embodiments of the present disclosure having a charging device; Figure 1-1 is a schematic illustration of an electrochemical system according to at least some embodiments of the present disclosure;

[0010] Figure 2 is a perspective cross-sectional view of a processing unit having electrochemically generated according to at least some embodiments of the present disclosure;

[0011] Figure 3 is a perspective cross-sectional view of a processing unit having multiple electrochemical chambers according to at least some embodiments of the present disclosure;

[0012] Figure 4 is a perspective cross-sectional view of a processing unit having a membraneless electrochemical chamber according to at least some embodiments of the present disclosure;

[0013] Figure 5 is a bottom view of a substrate having an electrochemical chamber therein according to at least some embodiments of the present disclosure;

[0014] Figure 6 is a bottom view of a substrate having an electrochemical chamber exhibiting counterflow according to at least some embodiments of the present disclosure;

[0015] Figure 7 is a bottom view of a substrate with non-parallel electrochemical chambers according to at least some embodiments of the present disclosure;

[0016] Figure 8 is a perspective partial cutaway view of a processing unit with layered electrochemical chambers according to at least some embodiments of the present disclosure;

[0017] Figure 9 is a schematic representation of an electrochemical power generation system with heat exchangers according to at least some embodiments of the present disclosure;

[0018] Figure 10 is a perspective partial cutaway view of a plurality of processing units with layered electrochemical chambers in fluid communication with heat exchangers according to at least some embodiments of the present disclosure; and

[0019] Figure 11 is a perspective partial cutaway view of a plurality of processing units with layered electrochemical chambers in fluid communication with a plurality of heat exchangers according to at least some embodiments of the present disclosure. DETAILED DESCRIPTION

[0020] The present invention generally relates to systems and methods for providing power and thermal management to a processor. More specifically, the present disclosure relates to power generation using electrochemical fluids in a microfluidic volume of a processor or other heat-generating electronic component, where heat is removed from the microfluidic volume by the electrochemical fluids. In some embodiments, at least a portion of an electrochemical flow battery and / or generator is located in a microfluidic volume of a non-active silicon or other substrate wafer of a processor or other heat-generating electronic component. For example, an electrochemical fluid, such as an anolyte or a catholyte, flows into the microfluidic volume, such that a voltage and current are generated from the electrochemical fluid in the microfluidic volume to provide power to the processor. The electrical power is provided to the processor by electrical communication from the microfluidic volume through through-silicon vias (TSVs) located in the wafer. The electrochemical fluid receives heat from the processor or other heat-generating electronic component, and the electrochemical fluid flows out of the microfluidic volume to remove heat from the processor or other heat-generating electronic component.

[0021] In some embodiments, the heat-generating component according to the present invention comprises a processor or processing unit. In some embodiments, the heat-generating component is a general-purpose processing unit, such as a central processing unit (CPU) or a graphics processing unit (GPU); an application-specific device application-specific integrated circuit (ASIC); a memory module (such as a cache memory, a volatile memory, or a non-volatile memory); or other electronic or processing component. The heat-generating component generates heat during use.

[0022] In conventional processors, a die is connected to a printed circuit board (PCB) that delivers electrical power to the die via one or more traces. Delivering electrical power through traces can be inefficient from an electrical and / or design space perspective. Additionally, heat generated by a processor is traditionally transferred through a thermal interface material (TIM) to a heat spreader in contact with a heat sink or other interface to dissipate heat to a liquid coolant or ambient atmosphere. In some cases, heat management components and interfaces can limit the heat dissipated. In the case of multi-die processors, conventional heat management can not cool all of the dies in the processor.

[0023] In some embodiments, an electrochemical fluid (e.g., a vanadium salt) located in a microfluidic volume allows a processor or other heat-generating component to receive power directly from the electrochemical fluid. Local power generation by the electrochemical fluid can limit and / or eliminate the need for electrical power delivery from a power supply unit through traces. Additionally, direct power delivery and / or heat management by the electrochemical fluid can allow for more efficient power delivery and / or heat management. For example, the electrochemical fluid can generate a voltage on the order of the voltage used by a processor or other heat-generating component without the need to convert electrical power obtained from a power grid or on-site power generation (e.g., 120 volt power).

[0024] In some embodiments, the electrochemical fluid is pushed through the first and second microfluidic volumes at the same flow rate. For example, a manifold forming at least a portion of the sidewalls of the microfluidic volumes can be connected to an inlet conduit that can provide equal flow rates and / or equal fluid pressures to both the first and second microfluidic volumes. In some embodiments, the flow rates are different, for example when different portions of a processor or other heat-generating component require different heat management or power delivery. For example, a first inlet conduit can provide a first flow rate and / or fluid pressure to the first microfluidic volume and a second inlet conduit can provide a second flow rate and / or fluid pressure to the second microfluidic volume.

[0025] In some embodiments, a first electrochemical fluid (e.g., an anolyte) and a second electrochemical fluid (e.g., a catholyte) flow into a shared microfluidic volume having an inlet and an outlet. The first and second electrochemical fluids flow in parallel through the shared microfluidic volume with limited mixing or no mixing. A boundary between the first and second electrochemical fluids is substantially maintained by the first and second electrochemical fluids flowing through the microfluidic volume with limited turbulent flow.

[0026] In some embodiments, the combination power delivery and thermal management of electrochemical fluids in microfluidic volumes according to the present disclosure allows for increased density of processors in computing devices, server blades, server racks, or data centers. For example, local power delivery and cooling can allow for dense stacking of wafers and / or stacked die processors, which would not be possible with conventional PCB power delivery and separate thermal management.

[0027] Figure 1-1 is a schematic diagram of an electrochemical generation system 100 that provides electrical power to or from an electrical load 102 (e.g., a processor). In some embodiments, the electrochemical generation system 100 includes an electrochemical chamber 104 having an ion transfer membrane 106 that separates the electrochemical chamber 104. The electrochemical chamber 104 includes a first electrochemical fluid 108 and a second electrochemical fluid 110 separated by the ion transfer membrane 106. In some embodiments, ion transfer across the ion transfer membrane 106 between the first electrochemical fluid 108 and the second electrochemical fluid 110 generates voltage and current to the processor or other electrical load 102 and discharges the first electrochemical fluid 108. In some embodiments, an applied voltage from a power source (instead of an electrical load) causes a reverse transfer of ions across the ion transfer membrane 106 that charges the first electrochemical fluid 108.

[0028] In some embodiments, the electrochemical chamber 104 is in fluid communication with a first reservoir 112 and a second reservoir 114. For example, the first electrochemical fluid 108 is stored in the first reservoir 112 and can flow into the electrochemical chamber 104, and the second electrochemical fluid 110 is stored in the second reservoir 114 and can flow into the electrochemical chamber 104. A first pump 116 and a second pump 118 can control the flow of the first electrochemical fluid 108 and the second electrochemical fluid 110, respectively, to the electrochemical chamber 104. In some embodiments, the rate of ion transfer across the ion transfer membrane 106 is at least partially related to the flow rate of the first electrochemical fluid 108 and the second electrochemical fluid 110 into the electrochemical chamber 104 (and into contact with the ion transfer membrane 106).

[0029] The charge generated by the ion transfer across the ion transfer membrane 106 can be collected at first and second electrodes 120, 122 located in or on the electrochemical chamber 104, on opposite sides of the ion transfer membrane 106. For example, the first electrode 120 is in contact with the first electrochemical fluid 108, and the second electrode 122 is in contact with the second electrochemical fluid 110. The electrodes 120, 122 collect charge from the first and second electrochemical fluids 108, 110. In some embodiments, the first electrochemical fluid 108 is an anolyte fluid, and the second electrochemical fluid 110 is a catholyte fluid. In some embodiments, the anolyte fluid and the catholyte fluid are the same fluid or compound in different charge states. In at least one embodiment, the anolyte fluid and the catholyte fluid are or include vanadium salts.

[0030] Figure 1-2 is Figure 1-1 A schematic diagram of an electrochemical generator system 100 with a processor 124 as an electrical load and a separate power source 126 connected to a second electrochemical chamber 128. In some embodiments, the electrochemical generator system 100 includes a first electrochemical chamber 104 configured to discharge electrochemical fluids and provide electrical power to an electrical load (e.g., the processor 124), and the electrochemical generator system 100 includes a second electrochemical chamber 128 configured to receive electrical power from a power source 126 (e.g., a power grid or other power source) to recharge the electrochemical fluids 108, 110.

[0031] In some embodiments, the electrochemical fluids 108, 110 are circulated through the electrochemical generator system 100 substantially continuously, receiving electrical power from the power source 126 and delivering the electrical power to the electrical load. In some embodiments, as the pumps 116, 118 flow the electrochemical fluids 108, 110, the electrochemical fluids 108, 110 are stored in the storage tanks 112, 114 until battery-like electrical power is needed. As described with respect to Figure 1-1 The first and second electrochemical fluids 108, 110 exchange ions through the first ion transfer membrane 106 in the first electrochemical chamber 104 to discharge the first electrochemical fluid 108 and generate electrical power. The first and second electrochemical fluids 108, 110 exchange ions through the second ion transfer membrane 130 in the second electrochemical chamber 128 to charge the first electrochemical fluid 108 and store electrical power.

[0032] In some embodiments, at least a portion of the electrochemical chamber configured to provide power is located in a microfluidic volume of a silicon substrate or other inactive portion of a computing package. For example, a first electrochemical fluid can be located in the microfluidic volume. In another example, a second electrochemical fluid can be located in the microfluidic volume. In yet another example, both the first electrochemical fluid and the second electrochemical fluid can be located in the microfluidic volume.

[0033] Figure 2 is a cross-sectional perspective view of a processing unit having a processor 224 located on a first surface 232 of a silicon substrate 234 or other wafer. In some embodiments, the silicon substrate 234 has an electrochemical chamber 204 located on a second surface 236 of the silicon substrate 234 opposite the processor 224. While a heat-generating component is described with respect to a processor 224 located on a silicon substrate 234, it should be understood that at least some of the structures, features, and elements described herein relate to any heat-generating component having an active silicon or circuitry device secured to a silicon substrate 234 or other wafer.

[0034] In some embodiments, the electrochemical chamber 204 includes an ion transfer membrane 206 that separates the electrochemical chamber 204. The electrochemical chamber 204 includes a first electrochemical fluid 208 and a second electrochemical fluid 210 separated by the ion transfer membrane 206. In some embodiments, ion transfer through the ion transfer membrane 206 between the first electrochemical fluid 208 and the second electrochemical fluid 210 generates a voltage and current to the processor 224 or other electrical load and discharges the first electrochemical fluid 208.

[0035] In some embodiments, voltage and current are provided to the processor 224, active silicon, or other electrical load on the first surface 232 of the substrate 234 through a TSV 238. The TSV 238 provides electrical communication with an electrode 220, electrode 222 located in or near the electrochemical chamber 204. For example, a first electrode 220 is located in or near the electrochemical chamber 204 and is configured to physically contact the first electrochemical fluid 208, and a second electrode 222 is located in or near the electrochemical chamber 204 and is configured to physically contact the second electrochemical fluid 210.

[0036] In some embodiments, the electrochemical chamber 204 is configured as an elongated channel in the second surface 236 of the substrate 234. In such embodiments, the first electrochemical fluid 208 and the second electrochemical fluid 210 flow through the electrochemical chamber 204 to transfer ions therebetween and provide electrical power via the electrodes 220, 222 and absorb heat from the processor 224, active silicon, or other heat-generating component on the first surface 232 through the substrate 234.

[0037] InFigure 2 In the illustrated embodiment, the electrochemical chamber 204 is substantially rectangular in cross-section. The electrochemical chamber 204 can have a uniform cross-section along at least a portion of the longitudinal length of the electrochemical chamber 204, which will be described in greater detail herein. In some embodiments, the electrochemical chamber 204 has a non-uniform cross-section that varies in at least one dimension along at least a portion of the longitudinal length of the electrochemical chamber 204. In some embodiments, at least a portion of the electrochemical chamber 204 has a cross-section that is rectangular, square, triangular, hexagonal, other regular polygon, irregular polygon, circular, oval, elliptical, other regular curved shape, irregular curved shape, or a combination thereof, or a portion thereof.

[0038] In the examples described above, the electrochemical chamber 204 locally provides power and cooling to the processor 224. In some embodiments, local power generation includes any generation of voltage or current in or near a substrate that supports the processor 224, active silicon, or other electrical load. For example, a power supply unit (PSU) that is electrically connected to a processor by one or more wires or cables does not locally generate electrical power to the processor, whereas an electrochemical chamber in a substrate with ion migration to generate current is local to any processor, active silicon, or other electrical load located on the substrate.

[0039] In some embodiments, a processor, active silicon, or other electrical load requires multiple electrochemical chambers to flow electrochemical fluids through to provide sufficient amounts of electrical power and / or cooling through the substrate. Figure 3 is a cross-sectional view of an embodiment of a processing unit that includes a processor 324 that is powered by a plurality of electrochemical chambers 304-1, 304-2 located on a substrate 334.

[0040] In some embodiments, each electrochemical chamber 304-1, 304-2 includes an ion transfer membrane 306 that separates the electrochemical chamber 304-1, 304-2. Each electrochemical chamber 304-1, 304-2 includes a first electrochemical fluid 308 and a second electrochemical fluid 310 that are separated by the ion transfer membrane 306. In some embodiments, ion transfer through the ion transfer membrane 306 between the first electrochemical fluid 308 and the second electrochemical fluid 310 generates a voltage and current to the processor 324 or other electrical load and discharges the first electrochemical fluid 308.

[0041] In some embodiments, voltage and current are provided to the processor 324, other electrical loads on the first surface 332 of the active silicon or substrate 334 through the TSV 338. The TSV 338 provides electrical communication with the electrodes 320, 322 located in or near each electrochemical chamber 304-1, 304-2. For example, a first electrode 320 is located in or near the first electrochemical chamber 304-1 and is configured to physically contact the first electrochemical fluid 308, and a second electrode 322 is located in or near the first electrochemical chamber 304-1 and is configured to physically contact the second electrochemical fluid 310.

[0042] In some embodiments, each electrochemical chamber 304-1, 304-2 is configured as an elongated channel in the second surface 336 of the substrate 334. In such embodiments, the first electrochemical fluid 308 and the second electrochemical fluid 310 flow through the electrochemical chambers 304 to transfer ions between them, and electrical power is provided via the electrodes 320, 322 in each electrochemical chamber 304-1, 304-2, and heat is absorbed by the processor 324, active silicon, or other heat-generating components on the first surface 332 through the substrate 334.

[0043] Figure 4 is a cross-sectional view of an embodiment including a processing unit of a processor 424 powered by an electrochemical chamber 404 without an ion transfer membrane. While embodiments of electrochemical chambers herein have been described with an ion transfer membrane separating the electrochemical chamber into a first portion and a second portion configured to include a first electrochemical fluid and a second electrochemical fluid, respectively, in some embodiments, a narrower electrochemical chamber or channel allows the first electrochemical fluid 408 and the second electrochemical fluid 410 to flow through the electrochemical chamber 404 adjacent to and in contact with each other with limited mixing therebetween.

[0044] The first electrochemical fluid 408 and the second electrochemical fluid 410 in contact with each other at the boundary 440 freely transfer ions therebetween, creating an electrical current. The first electrode 420 and the second electrode 422 located in or near the electrochemical chamber 404 provide electrical power from the electrochemical fluid 408, 410 to the TSV 438.

[0045] In some embodiments, the electrochemical chamber 404 has a chamber width 442 that is no greater than 100 micrometers (pm). In some embodiments, the chamber width 442 is in a range having an upper value, a lower value, or both an upper value and a lower value, including any of 5 pm, 6 pm, 7 pm, 8 pm, 9 pm, 10 pm, 15 pm, 20 pm, 30 pm, 50 pm, 75 pm, 100 pm, 500 pm, or any value therebetween. For example, the chamber width 442 can be greater than 5 pm. In some examples, the chamber width 442 is less than 500 pm. In some examples, the chamber width 442 is between 5 pm and 100 pm. In some examples, the chamber width 442 is between 5 pm and 50 pm. In some examples, the chamber width 442 is between 10 pm and 40 pm.

[0046] In some embodiments, when the membrane is not present, the first electrochemical fluid 408 and the second electrochemical fluid 410 flowing through the electrochemical chamber 404 define first and second portions, respectively. When the membrane is present, the first portion including the first electrochemical fluid and the second portion including the second electrochemical fluid are defined by the membrane. In some embodiments, the first portions have first portion widths 444 that are equal to one another, and the second portions have second portion widths 446 that are equal to one another. In some examples, the first and second portions have equal cross-sectional areas.

[0047] In some embodiments, the first portion widths 444 and the second portion widths 446 are different from one another. For example, the first portion widths 444 can be greater than the second portion widths 446, or the second portion widths 446 can be greater than the first portion widths 444. In some embodiments, the first portion widths 444 are in a range having an upper value, a lower value, or both an upper value and a lower value, including any of 1 pm, 2 pm, 3 pm, 4 pm, 5 pm, 6 pm, 7 pm, 8 pm, 9 pm, 10 pm, 15 pm, 20 pm, 30 pm, 50 pm, or any value therebetween. For example, the first portion widths 444 can be greater than 1 pm. In some examples, the first portion widths 444 are less than 50 pm. In some examples, the first portion widths 444 are between 1 pm and 50 pm. In some examples, the first portion widths 444 are between 1 pm and 25 pm. In some examples, the first portion widths 444 are between 2.5 pm and 20 pm.

[0048] In some embodiments, the second portion width 446 is in a range having an upper value, a lower value, or an upper value and a lower value, including any of 1 pm, 2 pm, 3 pm, 4 pm, 5 pm, 6 pm, 7 pm, 8 pm, 9 pm, 10 pm, 15 pm, 20 pm, 30 pm, 50 pm, or any value therebetween. For example, the second portion width 446 can be greater than 1 pm. In some examples, the second portion width 446 is less than 50 pm. In some examples, the second portion width 446 is between 1 pm and 50 pm. In some examples, the second portion width 446 is between 1 pm and 25 pm. In some examples, the second portion width 446 is between 2.5 pm and 20 pm.

[0049] As described herein, in some embodiments, the electrochemical chamber is an elongated channel through which an electrochemical fluid flows to provide a substantially continuous supply of cooled and charged electrochemical fluid. Figure 5 is a bottom view of an embodiment of a silicon substrate 534 having an electrochemical chamber 504 located in a second surface 536 (e.g., a bottom surface) thereof. The electrochemical chamber 504 is an elongated channel separated by an ion transfer membrane 506. A first portion of the electrochemical chamber 504 contains a first electrochemical fluid 508, and a second portion of the electrochemical chamber 504 contains a second electrochemical fluid 510.

[0050] In some embodiments, a first electrode 520 and a second electrode 522 are located in the first portion and the second portion proximate to the electrochemical chamber 504 to receive electrical charges from the first electrochemical fluid 508 and the second electrochemical fluid 510, respectively. In some embodiments, the first electrode 520 and the second electrode 522 are in electrical communication with a TSV 538 (oriented vertically into the substrate 534), respectively. In some embodiments, the electrochemical chamber 504 includes one electrode 520, electrode 522 for each of the first electrochemical fluid 508 and the second electrochemical fluid 510. In some embodiments, the electrochemical chamber 504 includes multiple electrodes 520, electrode 522 for each of the first electrochemical fluid 508 and the second electrochemical fluid 510.

[0051] In some embodiments, the electrochemical chamber 504 has the same amount of first electrodes 520 and second electrodes 522 to provide equal contact area for charge collection. In some embodiments, the electrochemical chamber 504 has different amounts of first electrodes 520 and second electrodes 522 based on the shape or surface area of the electrochemical chamber 504. For example, an asymmetric electrochemical chamber 504 and / or an electrochemical chamber including different volumes of the first electrochemical fluid 508 and the second electrochemical fluid 510 can have different numbers or sizes of electrodes.

[0052] In some embodiments, the first electrode 520 (or multiple first electrodes 520) has an equal length to the second electrode 522 (or multiple second electrodes 522) in a direction of flow of the electrochemical fluid 508, 510. In some embodiments, the electrochemical chamber 504 has first electrodes 520 (or multiple first electrodes 520) and second electrodes 522 (or multiple second electrodes 522) of different lengths based on a shape or surface area of the electrochemical chamber 504. For example, asymmetric electrochemical chambers 504 and / or electrochemical chambers including different volumes of the first electrochemical fluid 508 and the second electrochemical fluid 510 can have electrodes of different lengths.

[0053] In some embodiments, the first electrode 520 (or multiple first electrodes 520) has an equal area to the second electrode 522 (or multiple second electrodes 522). In some embodiments, the electrochemical chamber 504 has first electrodes 520 (or multiple first electrodes 520) and second electrodes 522 (or multiple second electrodes 522) of different areas based on a shape or surface area of the electrochemical chamber 504. For example, asymmetric electrochemical chambers 504 and / or electrochemical chambers including different volumes of the first electrochemical fluid 508 and the second electrochemical fluid 510 can have electrodes of different areas.

[0054] The amount of power generated by the electrochemical fluid 508, 510 at the electrodes 520, 522 can depend at least in part on the amount of charge of the electrochemical fluid 508, 510. An increase in the flow rate through the channel of the electrochemical chamber 504 can affect the available ions that can be transferred between the electrochemical fluid 508, 510 and increase the available electrical power in the electrochemical chamber 504. In some embodiments, the first electrochemical fluid 508 and the second electrochemical fluid 510 have similar or substantially equal flow rates through the electrochemical chamber 504. For example, the flow rate in volume per second (e.g., milliliters per second) through the electrochemical chamber 504 can be substantially equal between the first electrochemical fluid 508 and the second electrochemical fluid 510. In some embodiments, the first electrochemical fluid 508 and the second electrochemical fluid 510 have different flow rates through the electrochemical chamber 504. In at least one embodiment, a pump (as described with respect to Figure 1-1 and 1-2 the first flow rate of the first electrochemical fluid 508 and / or the second flow rate of the second electrochemical fluid 510 can be changed independently of one another.

[0055] In some embodiments, the total thermal management capacity of the electrochemical fluid 508, the electrochemical fluid 510 in the electrochemical chamber 504 is at least partially related to the flow rate of the electrochemical fluid 508, the electrochemical fluid 510 through the electrochemical chamber 504. An increase in the flow rate through the channel of the electrochemical chamber 504 can affect the temperature difference between the electrochemical fluid 508, the electrochemical fluid 510 and the surface of the electrochemical chamber 504 from which the electrochemical fluid 508, the electrochemical fluid 510 receives heat from the substrate 534. In some examples, an increase in the flow rate through the channel of the electrochemical chamber 504 can increase the mass of the electrochemical fluid 508, the electrochemical fluid 510 flowing through the electrochemical chamber 504, thereby allowing the electrochemical fluid 508, the electrochemical fluid 510 to reject more heat from the substrate 534.

[0056] As described above, in some embodiments, the first electrochemical fluid 508 and the second electrochemical fluid 510 have similar or substantially equal flow rates through the electrochemical chamber 504. For example, the flow rate in volume per second (e.g., milliliters per second) through the electrochemical chamber 504 can be substantially equal between the first electrochemical fluid 508 and the second electrochemical fluid 510. In some embodiments, the first electrochemical fluid 508 and the second electrochemical fluid 510 have different flow rates through the electrochemical chamber 504. In at least one embodiment, the pumps (as described with respect to Figure 1-1 and Figure 1-2 the first flow rate of the first electrochemical fluid 508 and / or the second flow rate of the second electrochemical fluid 510 can be changed independently of one another.

[0057] The electrochemical fluid 508, the electrochemical fluid 510 can be directed into or towards the electrochemical chamber 504 through one or more inlets 548-1, 548-2 of the substrate 534. In some embodiments, the first electrochemical fluid 508 is directed into or towards the electrochemical chamber 504 through a first inlet 548-1. In some embodiments, the second electrochemical fluid 508 is directed into or towards the electrochemical chamber 504 through a second inlet 548-1. In some embodiments, both the first electrochemical fluid 508 and the second electrochemical fluid 510 are directed into or towards the electrochemical chamber 504 at a shared inlet.

[0058] The electrochemical fluid 508, the electrochemical fluid 510 can be directed out of or away from the electrochemical chamber 504 through one or more outlets 550-1, 550-2 of the substrate 534. In some embodiments, the first electrochemical fluid 508 is directed out of or away from the electrochemical chamber 504 through the first outlet 550-1. In some embodiments, the second electrochemical fluid 508 is directed out of or away from the electrochemical chamber 504 through the second outlet 550-1. In some embodiments, both the first electrochemical fluid 508 and the second electrochemical fluid 510 are directed out of or away from the electrochemical chamber 504 at a shared outlet.

[0059] In Figure 5 In the illustrated embodiment, the first electrochemical fluid 508 and the second electrochemical fluid 510 enter the channels of the substrate 534 at first and second inlets 548-1, 548-2, respectively, which are on the same edge of the substrate 534. The first and second electrochemical fluids 508, 510 flow co-currently through the electrochemical chamber 504. Co-current flow can allow the electrochemical fluids 508, 510 to transfer charge between them and / or receive heat from the substrate 534 with the greatest charge and / or temperature difference near the inlets 548-1, 548-2 and a smaller charge and / or temperature difference near the outlets 550-1, 550-2.

[0060] In some embodiments, the first and second inlets 548-1, 548-2 are on opposite edges of the substrate and / or the first and second electrochemical fluids 508, 510 flow through the electrochemical chamber 504 in a counter-current fashion. Counter-current flow can allow the electrochemical fluids 508, 510 to transfer charge between them and / or receive heat from the substrate 534 at a substantially uniform transfer rate and / or a more uniform transfer rate than co-current flow.

[0061] Figure 6is a bottom view of an embodiment of a silicon base 634 having multiple branched channels forming multiple electrochemical chambers with counter-current flow. It should be appreciated that in other embodiments having multiple electrochemical chambers and / or branched channels, the electrochemical fluids flow in co-current flow. In some embodiments, the processor 624 or other electrical load and heat generating component has a footprint larger than a single electrochemical chamber can supply electrical power to and remove heat from. In some embodiments, the base 634 has multiple electrochemical chambers 604-1, electrochemical chamber 604-2, electrochemical chamber 604-3, electrochemical chamber 604-4 to provide electrical power to the processor 624 through multiple electrodes 620, electrode 622 and to the TSV 638 through the base 634. In some embodiments, the base 634 includes a first inlet 648-1 for the first electrochemical fluid 608 and a second inlet 648-2 for the second electrochemical fluid 610 located at opposite edges of the second surface 636 of the base 634. In other embodiments, the inlets 648-1, 648-2 are positioned and / or oriented relative to each other in other locations to facilitate counter-current flow and / or the multiple electrochemical chambers 604-1, electrochemical chamber 604-2, electrochemical chamber 604-3, electrochemical chamber 604-4.

[0062] In some embodiments, each of the electrochemical chambers 604-1, electrochemical chamber 604-2, electrochemical chamber 604-3, electrochemical chamber 604-4 including the first electrochemical fluid 608 and the second electrochemical fluid 610 has a first electrode 620 and a second electrode 622 to receive electrical charge from ion transfer between the electrochemical fluids 608, 610. In some embodiments, the electrochemical chambers 604-1, electrochemical chamber 604-2, electrochemical chamber 604-3, electrochemical chamber 604-4 are separated by an ion transfer membrane 606. Embodiments utilizing counter-current flow can exhibit too much turbulence for membraneless boundaries.

[0063] In some embodiments, each of the first electrochemical fluid 608 and the second electrochemical fluid 610 enters the substrate 634 through inlet 648-1 and inlet 648-2, respectively. In some embodiments, the first electrochemical fluid 608 exits the substrate 634 through outlet 650-1(1), outlet 650-1(2), outlet 650-1(3), and outlet 650-1(4) associated with each of the electrochemical chambers 604-1, 604-2, 604-3, and 604-4, respectively. In some embodiments, the second electrochemical fluid 610 exits the substrate 634 through outlet 650-2(1), outlet 650-2(2), outlet 650-2(3), and outlet 650-2(4) associated with each of the electrochemical chambers 604-1, 604-2, 604-3, and 604-4, respectively. In some embodiments, at least one of the first electrochemical fluid 608 and the second electrochemical fluid 610 flows into the combined channel from electrochemical chambers 604-1, 604-2, 604-3, and 604-4 before exiting the substrate 634. By branching the flow of the first electrochemical fluid 608 and the second electrochemical fluid 610 into multiple electrochemical chambers 604, in some embodiments, electrical power and thermal management can be better distributed over the coverage area of ​​the processor 624 than a single electrochemical chamber.

[0064] Although about Figure 6 A substrate having parallel electrochemical chambers 604-1, 604-2, 604-3, and 604-4 is described, but in other embodiments, the electrochemical chambers are oriented at angles that diverge from or converge to each other (e.g., non-parallel). Figure 7 This is a bottom view of an embodiment of a silicon substrate 734 having multiple divergent electrochemical chambers 704-1, 704-2, and 704-3. In some embodiments, the substrate 734 has multiple electrochemical chambers 704-1, 704-2, and 704-3 located in a second surface 736 opposite to the processor 724 or other electrical load / heat generation components. Depending on the structure of the processor 724 or other electrical load / heat generation components, different regions of the processor 724 or other electrical load / heat generation components require different amounts of electrical power and / or thermal management via the substrate 734.

[0065] In some embodiments, the electrochemical chambers 704-1, 704-2, 704-3 are located in the base 734 to position the electrodes 720, 722, and TSVs 738 where the processor 724 or other electrical load / heat generating component architecture requires electrical power. In some embodiments, the electrochemical chambers 704-1, 704-2, 704-3 are located in the base 734 to position the electrodes 720, 722, and TSVs 738 where the processor 724 or other electrical load / heat generating component architecture requires electrical power.

[0066] In some embodiments, at least one of the electrochemical chambers 704-1, 704-2, 704-3 includes a plurality of electrode sets 720-1, 722-1, 720-2, 722-2, 720-3, 722-3. Each electrode set is in electrical communication with a TSV 738 to deliver electrical power to a portion of the processor 724 or other electrical load / heat generating component. In some embodiments, the first electrode set 720-1, 722-1 of the electrochemical chamber 704-1 is located proximate to a higher power consumption area of the processor 724 or other electrical load / heat generating component. For example, the available electrical charge in the electrochemical fluid 708, 710 can decrease in the direction of flow through the electrochemical chamber 704-1, and positioning the first electrode set 720-1, 722-1 of the electrochemical chamber 704-1 proximate to the inlet 748-1 can allow for greater power generation at the first electrode set 720-1, 722-1, and allow for greater thermal management of the high power consumption area of the processor 724 or other electrical load / heat generating component, as the electrochemical fluid 708, 710 is cooler proximate to the inlet 748-1 relative to the outlet 750-1.

[0067] In some embodiments, the base 734 includes a plurality of inlets 748-1, 748-2, 748-3, and a plurality of outlets 750-1, 750-2, 750-3. In at least one embodiment, the base 734 includes at least one inlet and at least one outlet for each of the electrochemical chambers 704-1, 704-2, 704-3.

[0068] Figure 8is a bottom perspective cross-sectional view of an embodiment of a silicon substrate 834 having a large area electrochemical chamber 804. Embodiments of electrochemical chambers have been described herein with respect to a first electrochemical fluid and a second electrochemical fluid, the first electrochemical fluid and the second electrochemical fluid being located in first and second portions of the electrochemical chamber that are laterally adjacent to one another. In some embodiments, the first portion of the electrochemical chamber 804 (including the first electrochemical fluid 808) and the second portion of the electrochemical chamber 804 (including the second electrochemical fluid 810) are layered in substantially planar layers separated by an ion transfer membrane 806 therebetween. For example, the first and second portions are layered in a direction perpendicular to the first surface 832 and / or the second surface 836 of the substrate 834. In at least one example, the plane of the ion transfer membrane 806 is substantially parallel to the first surface 832 and / or the second surface 836 of the substrate 834.

[0069] In some embodiments, a first inlet 848-1 provides fluid flow of the first electrochemical fluid 808 into the first portion of the electrochemical chamber 804. In some embodiments, a second inlet 848-2 provides fluid flow of the second electrochemical fluid 810 into the second portion of the electrochemical chamber 804. The first electrochemical fluid 808 and the second electrochemical fluid 810 exchange ions across the ion transfer membrane 806, and the resulting electrical charge is collected at the electrodes 820, 822.

[0070] In some embodiments, the electrodes 820, 822 are electrically connected to a TSV 838. The TSV 838 provides electrical power to a processor 824 or other electrical load / heat generating component. In some embodiments, the TSV 838 is located in and / or supported by a spike fin 852. In some embodiments, the spike fin 852 is continuous across an entire height of the electrochemical chamber 804 (e.g., continuous between the first surface 832 of the substrate and the second surface 836 of the substrate 834), and provides support to the substrate 834 and / or the ion transfer membrane 806 in the electrochemical chamber 804. In some embodiments, the spike fin 852 is positioned through less than an entire height of the electrochemical chamber 804 to provide support to the TSV 838 while reducing fluidic resistance on the electrochemical fluid 808, 810.

[0071] The first electrochemical fluid 808 and the second electrochemical fluid 810 exit the electrochemical chamber 804 (first and second portions, respectively) through the outlet 850-1, 850-2. In some embodiments, the inlet 848-1, 848-2, and the outlet 850-1, 850-2 are positioned relative to one another in the electrochemical chamber 804 to direct and control the flow of the first electrochemical fluid 808 and the second electrochemical fluid 810. For example, the inlet 848-1, 848-2, and the outlet 850-1, 850-2 can be positioned to control the electrochemical fluid flow through the electrochemical chamber 804 as needed for power generation and / or thermal management.

[0072] While the inlet 848-1, 848-2, and the outlet 850-1, 850-2 are shown on the second surface 836 of the substrate 834, in some embodiments, the inlet 848-1, 848-2, and / or the outlet 850-1, 850-2 are located on the side surface 854 of the substrate 834.

[0073] Figure 9 is a schematic diagram of an embodiment of an electrochemical system that includes a heat exchanger that expels heat from electrochemical fluids and cools an electrochemical chamber. In some embodiments, the electrochemical generator system 900 includes a first electrochemical chamber 904 configured to discharge electrochemical fluids 908, 910 and provide electrical power to an electrical load (e.g., a processor 924 or other electrical load and / or heat-generating component) and a second electrochemical chamber 928 configured to receive electrical power from a power source 926 (e.g., a power grid or other power source) to recharge the electrochemical fluids 908, 910.

[0074] In some embodiments, the electrochemical fluids 908, 910 are circulated through the electrochemical generator system 900 substantially continuously, receiving electrical power from the power source 926 and delivering the electrical power to the electrical load. In some embodiments, as the pumps 916, 918 flow the electrochemical fluids 908, 910, the electrochemical fluids are stored in the storage tanks 912, 914 until battery-like electrical power is needed. The first electrochemical fluid 908 and the second electrochemical fluid 910 exchange ions through the first ion transfer membrane 906 in the first electrochemical chamber 904 to discharge the first electrochemical fluid 908 and generate electrical power. The first electrochemical fluid 908 and the second electrochemical fluid 910 exchange ions through the second ion transfer membrane 930 in the second electrochemical chamber 928 to charge the first electrochemical fluid 908 and store electrical power.

[0075] In some embodiments, at least a portion of the electrochemical chamber configured to provide power is located in the microfluidic volume substrate 934 as shown and described with respect to any one of FIGS. 1-3. Figures 2 to 8 For example, the first electrochemical fluid can be located in the microfluidic volume. In another example, the second electrochemical fluid can be located in the microfluidic volume. In yet another example, both the first electrochemical fluid and the second electrochemical fluid can be located in the microfluidic volume.

[0076] The first electrochemical fluid 908 and the second electrochemical fluid 910 can receive heat from the processor 924 or other electrical loads and / or heat-generating components of the electrochemical power generation system 900. The first electrochemical fluid 908 and the second electrochemical fluid 910 can flow from the processor 924 or other electrical loads and / or heat-generating components to the heat exchanger 956 and expel at least a portion of the heat from the first electrochemical fluid 908 and the second electrochemical fluid 910. Thus, the first electrochemical fluid 908 and the second electrochemical fluid 910 can provide electrical power directly to the processor 924 and remove heat from the processor 924 in a single medium of microfluidic volume through the processor 924.

[0077] Figure 10 is a side view of a processor 1024-1 or other electrical load and / or heat-generating component with a heat exchanger 1056 for a first electrochemical fluid 1008 and a second electrochemical fluid 1010 before the first electrochemical fluid 1008 and the second electrochemical fluid 1010 are directed to a low-power processor 1024-2 or other electrical load and / or heat-generating component.

[0078] In some embodiments, the first electrochemical fluid 1008 is received through a first inlet 1048-1 of a first substrate 1034-1 supporting the first processor 1024-1 or other electrical load and / or heat-generating component and the second electrochemical fluid 1010 is received through a second inlet 1048-2 of the first substrate 1034-1. The first electrochemical fluid 1008 and the second electrochemical fluid 1010 flow through the electrochemical chamber 1004 as described herein with respect to any one of FIGS. 1-3. In some embodiments, the first electrochemical fluid 1008 and the second electrochemical fluid 1010 receive heat from the processor 1024-1 or other electrical load and / or heat-generating component through the substrate 1034. The first electrochemical fluid 1008 and the second electrochemical fluid 1010 have higher temperatures at a first outlet 1050-1 and a second outlet 1050-2, respectively, compared to temperatures at the first inlet 1048-1 and the second inlet 1048-2. Figures 2 to 8

[0079] ​In some embodiments, the first electrochemical fluid 1008 and the second electrochemical fluid 1010 are directed from the first outlet 1050-1 and the second outlet 1050-2 to the second substrate 1034-2 supporting the second processor 1024-2 or other electrical load and / or heat generating component to provide power and / or cooling to the second processor 1024-2 or other electrical load and / or heat generating component.

[0080] In some embodiments, the second processor 1024-2 or other electrical load and / or heat generating component is a lower power component compared to the first processor 1024-1 or other electrical load and / or heat generating component, and the remaining charge in the first electrochemical fluid 1008 and the second electrochemical fluid 1010 is used to provide power to the second processor 1024-2 or other electrical load and / or heat generating component. However, the first electrochemical fluid 1008 and the second electrochemical fluid 1010 are at an elevated temperature after receiving heat from the first processor 1024-1 or other electrical load and / or heat generating component.

[0081] In at least one embodiment, the first electrochemical fluid 1008 and the second electrochemical fluid 1010 are cooled before entering the second substrate 1034-2 at the inlet 1048-1, the inlet 1048-2 of the second substrate 1034-2. The first electrochemical fluid 1008 and the second electrochemical fluid 1010 flow to and through a heat exchanger 1056. The heat exchanger 1056 discharges heat from the first electrochemical fluid 1008 and the second electrochemical fluid 1010 to ambient air or another fluid that discharges heat. The cooled first electrochemical fluid 1008 and the second electrochemical fluid 1010 flow from the heat exchanger 1056 to the electrochemical chamber 1004 of the second substrate 1034-2 to provide power and further cooling to the second processor 1024-2 or other electrical load and / or heat generating component before exiting the electrochemical chamber 1004 of the second substrate 1034-2 through the outlet 1050-1, the outlet 1050-2. In some embodiments, the first electrochemical fluid 1008 and the second electrochemical fluid 1010 are further cooled and recharged as described with respect to Figure 9 .

[0082] In some embodiments, particularly with respect to Figure 8 and Figure 10In the described layer embodiments of the electrochemical chamber, the first electrochemical fluid and the second electrochemical fluid receive different amounts of heat and / or change different amounts of temperature through the base. For example, the first electrochemical fluid 1008 is positioned closer to the processor 1024-1, the processor 1024-2, or other electrical loads and / or heat-generating components, and can receive more heat. In some examples, such as when the first electrochemical fluid 1008 and the second electrochemical fluid 1010 are laterally adjacent to each other in the electrochemical chamber, as described with respect to Figures 2 to 7 As described, the first electrochemical fluid 1008 and the second electrochemical fluid 1010 can receive the same amount of heat, but change different amounts of temperature due to different heat capacities of the first electrochemical fluid 1008 and the second electrochemical fluid 1010.

[0083] Figure 11 is a schematic side view of a portion of a system with separate heat exchangers 1156-1, 1156-2 for the first electrochemical fluid 1108 and the second electrochemical fluid 1110, respectively. In some embodiments, the first electrochemical fluid 1108 is received through a first inlet 1148-1 of a first base 1134-1 supporting a first processor 1124-1 or other electrical loads and / or heat-generating components, and the second electrochemical fluid 1110 is received through a second inlet 1148-2 of the first base 1134-1. The first electrochemical fluid 1108 and the second electrochemical fluid 1110 flow through the electrochemical chamber 1104, as described herein with respect to Figures 2 to 8 In some embodiments, the first electrochemical fluid 1008 and the second electrochemical fluid 1110 receive different amounts of heat from the processor 1124-1 or other electrical loads and / or heat-generating components through the base 1134. The first electrochemical fluid 1108 and the second electrochemical fluid 1110 have higher temperatures at the first outlet 1150-1 and the second outlet 1150-2, respectively, compared to the temperatures at the first inlet 1148-1 and the second inlet 1148-2, with the temperature of the first electrochemical fluid 1108 increasing more than the temperature of the second electrochemical fluid 1110.

[0084] In some embodiments, the first electrochemical fluid 1108 and the second electrochemical fluid 1110 are directed from the first outlet 1150-1 and the second outlet 1150-2 to a second base 1134-2 supporting a second processor 1124-2 or other electrical loads and / or heat-generating components to provide power and / or cooling to the second processor 1124-2 or other electrical loads and / or heat-generating components.

[0085] In some embodiments, the second processor 1124-2 or other electrical load and / or heat generating component is a lower power consumption component compared to the first processor 1124-1 or other electrical load and / or heat generating component, and the remaining electrical charge in the first electrochemical fluid 1108 and the second electrochemical fluid 1110 is used to provide power to the second processor 1124-2 or other electrical load and / or heat generating component. However, the first electrochemical fluid 1108 and the second electrochemical fluid 1110 are at an elevated temperature after receiving heat from the first processor 1124-1 or other electrical load and / or heat generating component.

[0086] In at least one embodiment, the first electrochemical fluid 1108 and the second electrochemical fluid 1110 are cooled prior to entering the second substrate 1134-2 at the inlet 1148-1, inlet 1148-2 of the second substrate 1134-2. The first electrochemical fluid 1108 flows to and through the first heat exchanger 1156-1, and the second electrochemical fluid 1110 flows to and through the second heat exchanger 1156-2. The heat exchangers 1156-1, 1156-2 expel heat from the first electrochemical fluid 1108 and the second electrochemical fluid 1110 to ambient air or another fluid that expels heat. In some embodiments, the heat exchangers 1156-1, 1156-2 cool the first electrochemical fluid 1108 and the second electrochemical fluid 1110 by different amounts. In some embodiments, the heat exchangers 1156-1, 1156-2 cool the first electrochemical fluid 1108 and the second electrochemical fluid 1110 to the same temperature.

[0087] The cooled first electrochemical fluid 1108 and second electrochemical fluid 1110 flow from the heat exchangers 1156-1, 1156-2 to the electrochemical chambers 1104 of the second substrate 1134-2 to provide power and further cooling to the second processor 1124-2 or other electrical load and / or heat generating component prior to exiting the electrochemical chambers 1104 of the second substrate 1134-2 through the outlets 1150-1, 1150-2. In some embodiments, the first electrochemical fluid 1108 and the second electrochemical fluid 1110 are further cooled and recharged, as described with respect to Figure 9

[0088] Recirculating recharged and cooled electrochemical fluids can allow the electrochemical fluids to provide electrical power and thermal management directly to the dies of a processor substantially continuously. In at least one embodiment, the delivery of electrochemical fluids to microfluidic volumes of a processor can allow for combined power delivery and thermal management, and allow for smaller, more powerful, more efficient, and more reliable processors.

[0089] Industrial applicability ​

[0090] The present disclosure generally relates to systems and methods for providing power and thermal management to a processor. More specifically, the present disclosure relates to power generation using electrochemical fluids in a microfluidic volume of a processor or other heat-generating electronic component, where heat is removed from the microfluidic volume by the electrochemical fluids. In some embodiments, at least part of an electrochemical flow battery and / or generator is located in a microfluidic volume of a non-active silicon or other base wafer of a processor or other heat-generating electronic component. For example, an electrochemical fluid, such as an anolyte or catholyte, flows into the microfluidic volume such that a voltage and current are generated from the electrochemical fluid in the microfluidic volume to provide power to the processor. The electrical power is provided to the processor by electrical communication from the microfluidic volume through through-silicon vias (TSVs) located in the wafer. The electrochemical fluid receives heat from the processor or other heat-generating electronic component, and the electrochemical fluid flows out of the microfluidic volume to remove heat from the processor or other heat-generating electronic component.

[0091] In some embodiments, the heat-generating component according to the present disclosure comprises a processor or processing unit. In some embodiments, the heat-generating component is a general-purpose processing unit, such as a central processing unit (CPU) or a graphics processing unit (GPU); an application-specific device application-specific integrated circuit (ASIC); a memory module, such as a cache memory, volatile memory, or non-volatile memory; or other electronic or processing component. The heat-generating component generates heat during use.

[0092] In conventional processors, a die is connected to a printed circuit board (PCB), which delivers electrical power to the die via one or more traces. Delivering electrical power through traces can be inefficient from an electrical and / or design space perspective. Additionally, heat generated by the processor is traditionally transferred through a thermal interface material (TIM) to a heat sink or other interface in contact with a heat sink to dissipate heat to a liquid coolant or ambient atmosphere. In some cases, the heat management components and interfaces can limit the heat removed. In the case of multi-die processors, conventional heat management can not cool all of the dies in the processor.

[0093] In some embodiments, the electrochemical fluid (e.g., vanadium salt) located in the microfluidic volume allows the processor or other heat-generating component to receive power directly from the electrochemical fluid. The local power generation of the electrochemical fluid can limit and / or eliminate the need for electrical power delivery from a power supply unit through traces. Additionally, the direct power delivery and / or thermal management of the electrochemical fluid can allow for more efficient power delivery and / or thermal management. For example, the electrochemical fluid can generate a voltage on the order of the voltage used by the processor or other heat-generating component without the need to convert electrical power obtained from a power grid or on-site power generation (e.g., 120-volt power).

[0094] In some embodiments, the electrochemical fluid is pushed through the first and second microfluidic volumes at the same flow rate. For example, the manifold forming at least part of the sidewalls of the microfluidic volumes can be connected to an inlet conduit that can provide equal flow rates and / or equal fluid pressures to both the first and second microfluidic volumes. In some embodiments, the flow rates are different, for example when different portions of a processor or other heat generating component require different thermal management or power delivery. For example, a first inlet conduit can provide a first flow rate and / or fluid pressure to the first microfluidic volume, and a second inlet conduit can provide a second flow rate and / or fluid pressure to the second microfluidic volume.

[0095] In some embodiments, a first electrochemical fluid (e.g., an anolyte) and a second electrochemical fluid (e.g., a catholyte) flow into a shared microfluidic volume having an inlet and an outlet. The first and second electrochemical fluids flow in parallel through the shared microfluidic volume with limited mixing or no mixing. The boundary between the first and second electrochemical fluids is substantially maintained by the first and second electrochemical fluids flowing through the microfluidic volume with limited turbulent flow.

[0096] In some embodiments, the combined power delivery and thermal management of electrochemical fluids in microfluidic volumes according to the present disclosure allows for increased density of processors in computing devices, server blades, server racks, or data centers. For example, local power delivery and cooling can allow for dense stacking of dies and / or stacked die processors that would not be possible with conventional PCB power delivery and separate thermal management.

[0097] In some embodiments, an electrochemical generation system includes an electrochemical chamber having an ion transfer membrane separating the electrochemical chamber. The electrochemical chamber includes a first electrochemical fluid and a second electrochemical fluid separated by the ion transfer membrane. In some embodiments, ion transfer across the ion transfer membrane between the first and second electrochemical fluids generates a voltage and current to a processor or other electrical load and discharges the first electrochemical fluid. In some embodiments, an applied voltage from a power source (instead of an electrical load) causes a reverse transfer of ions across the ion transfer membrane that charges the first electrochemical fluid.

[0098] In some embodiments, the electrochemical chamber is in fluid communication with a first reservoir and a second reservoir. For example, a first electrochemical fluid is stored in the first reservoir and can flow into the electrochemical chamber, and a second electrochemical fluid is stored in the second reservoir and can flow into the electrochemical chamber. A first pump and a second pump can control the flow of the first electrochemical fluid and the second electrochemical fluid to the electrochemical chamber, respectively. In some embodiments, the rate of ion transfer across the ion transfer membrane is at least partially related to the flow rate of the first electrochemical fluid and the second electrochemical fluid into the electrochemical chamber (and into contact with the ion transfer membrane).

[0099] The charge generated by the ion transfer across the ion transfer membrane can be collected at first and second electrodes located in or on the electrochemical chamber, the first and second electrodes being located on opposite sides of the ion transfer membrane. For example, the first electrode is in contact with the first electrochemical fluid, and the second electrode is in contact with the second electrochemical fluid. The electrodes collect charge from the first and second electrochemical fluids. In some embodiments, the first electrochemical fluid is an anolyte fluid, and the second electrochemical fluid is a catholyte fluid. In some embodiments, the anolyte fluid and the catholyte fluid are the same fluid or compound in different charge states. In at least one embodiment, the anolyte fluid and the catholyte fluid are or include vanadium salts.

[0100] In some embodiments, the electrochemical generator system has a processor as an electrical load and a separate power source connected to the second electrochemical chamber. In some embodiments, the electrochemical generator system includes a first electrochemical chamber configured to discharge an electrochemical fluid and provide electrical power to an electrical load (e.g., a processor), and the electrochemical generator system includes a second electrochemical chamber configured to receive electrical power from a power source (e.g., a power grid or other power source) to recharge the electrochemical fluid.

[0101] In some embodiments, the electrochemical fluid is circulated through the electrochemical generator system substantially continuously, receiving electrical power from a power source and delivering the electrical power to an electrical load. In some embodiments, the electrochemical fluid is stored in a reservoir until power similar to a battery is needed, while the pump flows the electrochemical fluid. As described above, the first electrochemical fluid and the second electrochemical fluid exchange ions through a first ion transfer membrane in a first electrochemical chamber to discharge the first electrochemical fluid and generate electrical power. The first electrochemical fluid and the second electrochemical fluid exchange ions through a second ion transfer membrane in a second electrochemical chamber to charge the first electrochemical fluid and store electrical power.

[0102] In some embodiments, at least part of the electrochemical chamber configured to provide power is located in a microfluidic volume of a silicon substrate or other inactive portion of a computing package. For example, a first electrochemical fluid can be located in the microfluidic volume. In another example, a second electrochemical fluid can be located in the microfluidic volume. In yet another example, both the first electrochemical fluid and the second electrochemical fluid can be located in the microfluidic volume.

[0103] In some embodiments, the processing unit has a processor located on a first surface of a silicon substrate or other wafer. In some embodiments, the silicon substrate has an electrochemical chamber located on a second surface of the silicon substrate opposite the processor. While heat generating components are described with respect to a processor located on a silicon substrate, it should be understood that at least some of the structures, features, and elements described herein relate to any heat generating component having active silicon or circuitry devices secured to a silicon substrate or other wafer.

[0104] In some embodiments, the electrochemical chamber includes an ion transfer membrane that separates the electrochemical chamber. The electrochemical chamber includes a first electrochemical fluid and a second electrochemical fluid separated by the ion transfer membrane. In some embodiments, ion transfer through the ion transfer membrane between the first electrochemical fluid and the second electrochemical fluid generates a voltage and current to the processor or other electrical load and discharges the first electrochemical fluid.

[0105] In some embodiments, voltage and current are provided to the processor, active silicon, or other electrical load on the first surface of the substrate through a TSV. The TSV provides electrical communication with an electrode located in or near the electrochemical chamber. For example, a first electrode is located in or near the electrochemical chamber and is configured to physically contact the first electrochemical fluid, and a second electrode is located in or near the electrochemical chamber and is configured to physically contact the second electrochemical fluid.

[0106] In some embodiments, the electrochemical chamber is configured as an elongated channel in the second surface of the substrate. In such embodiments, the first electrochemical fluid and the second electrochemical fluid flow through the electrochemical chamber to transport ions therebetween and provide electrical power via the electrodes, and heat is absorbed from the processor, active silicon, or other heat generating component on the first surface through the substrate.

[0107] In some embodiments, the cross-section of the electrochemical chamber is substantially rectangular. The electrochemical chamber can have a uniform cross-section along at least a portion of the longitudinal length of the electrochemical chamber, which will be described in more detail herein. In some embodiments, the electrochemical chamber has a non-uniform cross-section that varies in at least one dimension along at least a portion of the longitudinal length of the electrochemical chamber. In some embodiments, at least a portion of the electrochemical chamber has a cross-section that is rectangular, square, triangular, hexagonal, other regular polygon, irregular polygon, circular, oval, other regular curved shape, irregular curved shape, or a combination thereof, or a portion thereof.

[0108] In the examples described above, the electrochemical chamber locally provides power and cooling to the processor. In some embodiments, local power generation includes any generation of voltage or current in the vicinity of or among the processor, active silicon, other electrical loads, or a substrate that supports the processor, active silicon, or other electrical loads. For example, a power supply unit (PSU) that is electrically connected to the processor by one or more wires or cables does not locally generate electrical power to the processor, whereas an electrochemical chamber located in a substrate with ion migration to generate current is local to any processor, active silicon, or other electrical loads located on the substrate.

[0109] In some embodiments, the processor, active silicon, or other electrical loads require multiple electrochemical chambers to flow electrochemical fluids through to provide sufficient amounts of electrical power and / or cooling through the substrate. In some embodiments, the processing unit includes a processor that is powered by multiple electrochemical chambers located on the substrate.

[0110] In some embodiments, each electrochemical chamber includes an ion transfer membrane that separates the electrochemical chamber. Each electrochemical chamber includes a first electrochemical fluid and a second electrochemical fluid that are separated by the ion transfer membrane. In some embodiments, ion transfer through the ion transfer membrane between the first electrochemical fluid and the second electrochemical fluid generates voltage and current to the processor or other electrical loads and discharges the first electrochemical fluid.

[0111] In some embodiments, voltage and current are provided to the processor, active silicon, or other electrical loads on the first surface of the substrate through a TSV. The TSV provides electrical communication with an electrode located in or in the vicinity of each electrochemical chamber. For example, a first electrode is located in or in the vicinity of the first electrochemical chamber and is configured to physically contact the first electrochemical fluid, and a second electrode is located in or in the vicinity of the first electrochemical chamber and is configured to physically contact the second electrochemical fluid.

[0112] In some embodiments, each electrochemical chamber is configured as an elongated channel in the second surface of the substrate. In such embodiments, the first electrochemical fluid and the second electrochemical fluid flow through the electrochemical chambers to transfer ions therebetween, and electrical power is provided via the electrodes in each electrochemical chamber, and heat is absorbed by the substrate from the processor, active silicon, or other heat-generating component on the first surface.

[0113] In some embodiments, the processing unit includes a processor that is powered by electrochemical chambers that do not have an ion transfer membrane. While embodiments of electrochemical chambers herein have been described with ion transfer membranes that separate the electrochemical chambers into first and second portions configured to include first and second electrochemical fluids, respectively, in some embodiments, narrower electrochemical chambers or channels allow the first and second electrochemical fluids to flow through the electrochemical chambers adjacent to and in contact with one another with limited mixing therebetween.

[0114] The first and second electrochemical fluids in contact with one another at the boundary freely transfer ions therebetween, creating an electrical current. The first and second electrodes located in or near the electrochemical chambers provide electrical power from the electrochemical fluids to the TSV.

[0115] In some embodiments, the electrochemical chambers have a chamber width of no more than 100 micrometers (pm). In some embodiments, the chamber width is in a range having an upper value, a lower value, or an upper value and a lower value, including 5 pm, 6 pm, 7 pm, 8 pm, 9 pm, 10 pm, 15 pm, 20 pm, 30 pm, 50 pm, 75 pm, 100 pm, 500 pm, or any value therebetween. For example, the chamber width can be greater than 5 pm. In some examples, the chamber width is less than 500 pm. In some examples, the chamber width is between 5 pm and 100 pm. In some examples, the chamber width is between 5 pm and 50 pm. In some examples, the chamber width is between 10 pm and 40 pm.

[0116] In some embodiments, the first and second electrochemical fluids flowing through the electrochemical chambers define first and second portions, respectively, when there is no membrane. When there is a membrane, the first portion including the first electrochemical fluid and the second portion including the second electrochemical fluid are defined by the membrane. In some embodiments, the first portions have first portion widths equal to one another and the second portions have second portion widths equal to one another. In some examples, the first and second portions have equal cross-sectional areas.

[0117] In some embodiments, the first portion width and the second portion width are different from each other. For example, the first portion width can be greater than the second portion width, or the second portion width can be greater than the first portion width. In some embodiments, the first portion width is in a range having an upper limit value, a lower limit value, or an upper limit value and a lower limit value, including any of 1 pm, 2 pm, 3 pm, 4 pm, 5 pm, 6 pm, 7 pm, 8 pm, 9 pm, 10 pm, 15 pm, 20 pm, 30 pm, 50 pm, or any value therebetween. For example, the first portion width can be greater than 1 pm. In some examples, the first portion width is less than 50 pm. In some examples, the first portion width is between 1 pm and 50 pm. In some examples, the first portion width is between 1 pm and 25 pm. In some examples, the first portion width is between 2.5 pm and 20 pm.

[0118] In some embodiments, the second portion width is in a range having an upper limit value, a lower limit value, or an upper limit value and a lower limit value, including any of 1 pm, 2 pm, 3 pm, 4 pm, 5 pm, 6 pm, 7 pm, 8 pm, 9 pm, 10 pm, 15 pm, 20 pm, 30 pm, 50 pm, or any value therebetween. For example, the second portion width can be greater than 1 pm. In some examples, the second portion width is less than 50 pm. In some examples, the second portion width is between 1 pm and 50 pm. In some examples, the second portion width is between 1 pm and 25 pm. In some examples, the second portion width is between 2.5 pm and 20 pm.

[0119] As described herein, in some embodiments, the electrochemical chamber is an elongated channel through which an electrochemical fluid flows to provide a substantially continuous supply of cooled and charged electrochemical fluid. In some embodiments, the silicon substrate has an electrochemical chamber located in its second surface (e.g., a bottom surface). The electrochemical chamber is an elongated channel separated by an ion transfer membrane. A first portion of the electrochemical chamber contains a first electrochemical fluid, and a second portion of the electrochemical chamber contains a second electrochemical fluid.

[0120] In some embodiments, a first electrode and a second electrode are located in the first portion and the second portion proximate to the electrochemical chamber to receive a charge from the first electrochemical fluid and the second electrochemical fluid, respectively. In some embodiments, the first electrode and the second electrode are in electrical communication with a TSV (oriented vertically into the substrate), respectively. In some embodiments, the electrochemical chamber includes one electrode for each of the first electrochemical fluid and the second electrochemical fluid. In some embodiments, the electrochemical chamber includes multiple electrodes for each of the first electrochemical fluid and the second electrochemical fluid.

[0121] In some embodiments, the electrochemical chamber has the same amount of first and second electrodes to provide equal contact area for charge collection. In some embodiments, the electrochemical chamber has different amounts of first and second electrodes based on the shape or surface area of the electrochemical chamber. For example, asymmetric electrochemical chambers and / or electrochemical chambers that include different volumes of first and second electrochemical fluids can have different numbers or sizes of electrodes.

[0122] In some embodiments, the first electrode (or multiple first electrodes) has an equal length to the second electrode (or multiple second electrodes) in the flow direction of the electrochemical fluid. In some embodiments, the electrochemical chamber has different lengths of first and second electrodes (or multiple first and second electrodes) based on the shape or surface area of the electrochemical chamber. For example, asymmetric electrochemical chambers and / or electrochemical chambers that include different volumes of first and second electrochemical fluids can have different lengths of electrodes.

[0123] In some embodiments, the first electrode (or multiple first electrodes) has an equal area to the second electrode (or multiple second electrodes). In some embodiments, the electrochemical chamber has different areas of first and second electrodes (or multiple first and second electrodes) based on the shape or surface area of the electrochemical chamber. For example, asymmetric electrochemical chambers and / or electrochemical chambers that include different volumes of first and second electrochemical fluids can have different electrode areas.

[0124] The amount of power generated by the electrochemical fluid at the electrodes can depend, at least in part, on the amount of charge of the electrochemical fluid. An increase in the flow rate through the channel of the electrochemical chamber can affect the available ions that can be transferred between the electrochemical fluids and increase the available electrical power in the electrochemical chamber. In some embodiments, the first and second electrochemical fluids have similar or substantially equal flow rates through the electrochemical chamber. For example, the flow rate in volume per second (e.g., milliliters per second) through the electrochemical chamber can be substantially equal between the first and second electrochemical fluids. In some embodiments, the first and second electrochemical fluids have different flow rates through the electrochemical chamber. In at least one embodiment, a pump (as described herein) can vary a first flow rate of the first electrochemical fluid and / or a second flow rate of the second electrochemical fluid independently of one another.

[0125] In some embodiments, the total thermal management capacity of the electrochemical fluid in the electrochemical chamber is at least partially related to the flow rate of the electrochemical fluid through the electrochemical chamber. An increase in the flow rate through the channels of the electrochemical chamber can affect the temperature difference between the electrochemical fluid and the surface of the electrochemical chamber from which the electrochemical fluid receives heat from the substrate. In some examples, an increase in the flow rate through the channels of the electrochemical chamber can increase the mass of the electrochemical fluid flowing through the electrochemical chamber, allowing the electrochemical fluid to reject more heat from the substrate.

[0126] As described above, in some embodiments, the first electrochemical fluid and the second electrochemical fluid have similar or substantially equal flow rates through the electrochemical chamber. For example, the flow rate through the electrochemical chamber in volume per second (e.g., milliliters per second) can be substantially equal between the first electrochemical fluid and the second electrochemical fluid. In some embodiments, the first electrochemical fluid and the second electrochemical fluid have different flow rates through the electrochemical chamber. In at least one embodiment, the pumps (as described herein) can independently vary the first flow rate of the first electrochemical fluid and / or the second flow rate of the second electrochemical fluid from one another.

[0127] The electrochemical fluid can be directed into or towards the electrochemical chamber through one or more inlets of the substrate. In some embodiments, the first electrochemical fluid is directed into or towards the electrochemical chamber through a first inlet. In some embodiments, the second electrochemical fluid is introduced or directed to the electrochemical chamber through a second inlet. In some embodiments, both the first electrochemical fluid and the second electrochemical fluid are directed into or towards the electrochemical chamber at a shared inlet.

[0128] The electrochemical fluid can be directed away or out of the electrochemical chamber through one or more outlets of the substrate. In some embodiments, the first electrochemical fluid is directed away or out of the electrochemical chamber through a first outlet. In some embodiments, the second electrochemical fluid is directed away or out of the electrochemical chamber through a second outlet. In some embodiments, both the first electrochemical fluid and the second electrochemical fluid are directed away or out of the electrochemical chamber at a shared outlet.

[0129] In some embodiments, the first electrochemical fluid and the second electrochemical fluid enter the channels of the substrate at a first inlet and a second inlet, respectively, located on the same edge of the substrate. The first electrochemical fluid and the second electrochemical fluid pass through the electrochemical chamber in co-current flow. Co-current flow can allow the electrochemical fluids to transfer charge between them and / or receive heat from the substrate, with the greatest charge and / or temperature difference near the inlets and a smaller temperature difference near the outlets.

[0130] In some embodiments, the first and second inlets are located on opposite edges of the substrate and / or the first electrochemical fluid, and the second electrochemical fluid flows through the electrochemical chambers in a counter-current fashion. Counter-current flow can allow the electrochemical fluids to transfer charge between them and / or receive heat from the substrate at a substantially uniform transfer rate and / or a more uniform transfer rate than co-current flow.

[0131] In some embodiments, the silicon substrate has a plurality of branched channels forming a plurality of electrochemical chambers with counter-current flow. It should be appreciated that in other embodiments having a plurality of electrochemical chambers and / or branched channels, the electrochemical fluids flow in a co-current fashion. In some embodiments, the processor or other electrical load and heat generating component has a footprint greater than a single electrochemical chamber can supply electrical power to and remove heat from. In some embodiments, the substrate has a plurality of electrochemical chambers to provide electrical power to the processor through a plurality of electrodes and through TSVs of the substrate. In some embodiments, the substrate includes a first inlet for a first electrochemical fluid and a second inlet for a second electrochemical fluid located at opposite edges of a second surface of the substrate. In other embodiments, the inlets are positioned and / or oriented relative to each other in other locations to facilitate counter-current flow and / or a plurality of electrochemical chambers.

[0132] In some embodiments, each of the electrochemical chambers including the first electrochemical fluid and the second electrochemical fluid has a first electrode and a second electrode to receive charge from ion transfer between the electrochemical fluids. In some embodiments, the electrochemical chambers are separated by an ion transfer membrane. Embodiments utilizing counter-current flow can exhibit too much turbulence for a membraneless boundary.

[0133] In some embodiments, each of the first and second electrochemical fluids enters the substrate through an inlet. In some embodiments, the first electrochemical fluid exits the substrate through an outlet associated with each electrochemical chamber, respectively. In some embodiments, the second electrochemical fluid exits the substrate through an outlet associated with each electrochemical chamber, respectively. In some embodiments, at least one of the first and second electrochemical fluids flows from the electrochemical chambers into a combined channel prior to exiting the substrate. By branching the flow of the first and second electrochemical fluids into a plurality of electrochemical chambers, in some embodiments, electrical power and thermal management can be better distributed across the footprint of the processor than with a single electrochemical chamber alone.

[0134] While the substrate with parallel electrochemical cells is described herein, in other embodiments, the electrochemical cells are oriented at diverging or converging (e.g., non-parallel) angles to each other. In some embodiments, the silicon substrate has multiple diverging electrochemical chambers. In some embodiments, the substrate has multiple electrochemical chambers located in a second surface opposite the processor or other electrical load / heat generating component. Depending on the structure of the processor or other electrical load / heat generating component, different areas of the processor or other electrical load / heat generating component require different amounts of electrical power and / or heat management through the substrate.

[0135] In some embodiments, the electrochemical chambers are located in the substrate to position the electrodes and TSVs where electrical power is needed by the processor or other electrical load / heat generating component architecture. In some embodiments, the electrochemical chambers are located in the substrate to position the electrodes and TSVs where electrical power is needed by the processor or other electrical load / heat generating component architecture.

[0136] In some embodiments, at least one of the electrochemical chambers includes multiple sets of electrodes. Each set of electrodes is in electrical communication with a TSV to deliver electrical power to a portion of the processor or other electrical load / heat generating component. In some embodiments, a first set of electrodes of the electrochemical chamber is located proximate to a higher power consumption area of the processor or other electrical load / heat generating component. For example, available electrical charge in the electrochemical fluid can decrease in a direction of flow through the electrochemical chamber, and locating a first set of electrodes of the electrochemical chamber proximate to the inlet can allow for greater power generation at the first set of electrodes and allow for greater heat management of the high power consumption area of the processor or other electrical load / heat generating component because the electrochemical fluid is cooler proximate to the inlet relative to the outlet.

[0137] In some embodiments, the substrate includes multiple inlets and multiple outlets. In at least one embodiment, the substrate includes at least one inlet and at least one outlet for each electrochemical chamber.

[0138] In some embodiments, the silicon substrate has a large area electrochemical chamber. Embodiments of the electrochemical chamber have been described herein with respect to a first electrochemical fluid and a second electrochemical fluid located in first and second portions of the electrochemical chamber laterally adjacent to each other. In some embodiments, the first portion of the electrochemical chamber (including the first electrochemical fluid) and the second portion of the electrochemical chamber (including the second electrochemical fluid) are layered in substantially planar layers separated by an ion transfer membrane therebetween. For example, the first and second portions are layered in a direction perpendicular to the first and / or second surfaces of the substrate. In at least one example, the plane of the ion transfer membrane is substantially parallel to the first and / or second surfaces of the substrate.

[0139] In some embodiments, the first inlet provides a fluid flow of a first electrochemical fluid into a first portion of the electrochemical chamber. In some embodiments, the second inlet provides a fluid flow of a second electrochemical fluid into a second portion of the electrochemical chamber. The first and second electrochemical fluids exchange ions across the ion transfer membrane and the resulting electrical charge is collected at the electrode.

[0140] In some embodiments, the electrode is electrically connected to a TSV. The TSV provides electrical power to a processor or other electrical load / heat generating component. In some embodiments, the TSV is located in and / or supported by a spike fin. In some embodiments, the spike fin is continuous across the entire height of the electrochemical chamber (e.g., continuous between the first surface of the substrate and the second surface of the substrate) and provides support to the substrate and / or ion transfer membrane in the electrochemical chamber. In some embodiments, the spike fin is located through a portion of the electrochemical chamber that is less than the entire height of the electrochemical chamber to provide support to the TSV while reducing fluidic resistance on the electrochemical fluid.

[0141] The first and second electrochemical fluids flow out of the electrochemical chamber (first and second portions, respectively) through an outlet. In some embodiments, the inlets and outlets are positioned relative to each other in the electrochemical chamber to direct and control the flow of the first and second electrochemical fluids therethrough. For example, the inlets and outlets are positioned to control the electrochemical fluid flow through the electrochemical chamber as needed for power generation and / or thermal management. While the inlets and outlets described herein are on the second surface of the substrate, in some embodiments, the inlets and / or outlets are on a side surface of the substrate.

[0142] In some embodiments, the electrochemical generator system includes a first electrochemical chamber configured to discharge an electrochemical fluid and provide electrical power to an electrical load (e.g., a processor or other electrical load and / or heat generating component) and a second electrochemical chamber configured to receive electrical power from a power source (e.g., a power grid or other power source) to recharge the electrochemical fluid.

[0143] In some embodiments, the electrochemical fluid is substantially continuously circulated through the electrochemical generator system to receive electrical power from a power source and deliver the electrical power to an electrical load. In some embodiments, the electrochemical fluid is stored in a storage tank while the pump flows the electrochemical fluid until battery-like electrical power is needed. The first and second electrochemical fluids exchange ions through a first ion transfer membrane in the first electrochemical chamber to discharge the first electrochemical fluid and generate electrical power. The first and second electrochemical fluids exchange ions through a second ion transfer membrane in the second electrochemical chamber to charge the first electrochemical fluid and store electrical power.

[0144] In some embodiments, as shown and described herein, at least a portion of the electrochemical chamber configured to provide electrical power is located in a microfluidic volume substrate. For example, a first electrochemical fluid can be located in the microfluidic volume. In another example, a second electrochemical fluid can be located in the microfluidic volume. In yet another example, both the first electrochemical fluid and the second electrochemical fluid can be located in the microfluidic volume.

[0145] The first electrochemical fluid and the second electrochemical fluid can receive heat from the processor or other electrical loads and / or heat-generating components of the electrochemical power generation system. The first electrochemical fluid and the second electrochemical fluid can flow from the processor or other electrical loads and / or heat-generating components to a heat exchanger and expel at least a portion of the heat from the first electrochemical fluid and the second electrochemical fluid. Thus, the first electrochemical fluid and the second electrochemical fluid can provide electrical power directly to the processor and remove heat from the processor in a single medium through the microfluidic volume of the processor.

[0146] In some embodiments, the first electrochemical fluid is received through a first inlet of a first substrate supporting the first processor or other electrical loads and / or heat-generating components, and the second electrochemical fluid is received through a second inlet of the first substrate. As described herein, the first electrochemical fluid and the second electrochemical fluid flow through the electrochemical chamber. In some embodiments, the first electrochemical fluid and the second electrochemical fluid receive heat from the processor or other electrical loads and / or heat-generating components through the substrate. The first electrochemical fluid and the second electrochemical fluid have higher temperatures at a first outlet and a second outlet, respectively, compared to the temperatures of the first inlet and the second inlet.

[0147] In some embodiments, the first electrochemical fluid and the second electrochemical fluid are directed from the first outlet and the second outlet to a second substrate supporting a second processor or other electrical loads and / or heat-generating components to provide power and / or cooling to the second processor or other electrical loads and / or heat-generating components.

[0148] In some embodiments, the second processor or other electrical loads and / or heat-generating components are lower power components compared to the first processor or other electrical loads and / or heat-generating components, and the remaining charge in the first electrochemical fluid and the second electrochemical fluid is used to provide power to the second processor or other electrical loads and / or heat-generating components. However, the first electrochemical fluid and the second electrochemical fluid are at an elevated temperature after receiving heat from the first processor or another electrical load and / or heat-generating component.

[0149] In at least one embodiment, the first and second electrochemical fluids are cooled prior to entering the second substrate at an inlet of the second substrate. The first and second electrochemical fluids flow to and through a heat exchanger. The heat exchanger discharges heat from the first and second electrochemical fluids to ambient air or another fluid that discharges heat. The cooled first and second electrochemical fluids flow from the heat exchanger to the electrochemical chambers of the second substrate to provide power and further cooling to the second processor or other electrical load and / or heat-generating component prior to exiting the electrochemical chambers of the second substrate through an outlet. In some embodiments, the first and second electrochemical fluids are further cooled and recharged as described herein.

[0150] In some embodiments, particularly in the layered embodiment of the electrochemical chamber described herein, the first and second electrochemical fluids receive different amounts of heat and / or change different amounts of temperature through the substrate. For example, the first electrochemical fluid is positioned closer to the processor or other electrical load and / or heat-generating component and can receive more heat. In some examples, such as when the first and second electrochemical fluids are laterally adjacent to each other in the electrochemical chamber, the first and second electrochemical fluids can receive the same amount of heat, but change temperature by different amounts due to different heat capacities of the first and second electrochemical fluids, as described herein.

[0151] In some embodiments, the first electrochemical fluid is received through a first inlet of a first substrate supporting the first processor or other electrical load and / or heat-generating component, and the second electrochemical fluid is received through a second inlet of the first substrate. The first and second electrochemical fluids flow through the electrochemical chamber as described herein. In some embodiments, the first and second electrochemical fluids receive different amounts of heat from the processor or other electrical load and / or heat-generating component through the substrate. The first and second electrochemical fluids have higher temperatures at a first outlet and a second outlet, respectively, compared to temperatures of the first and second inlets, with the temperature of the first electrochemical fluid increasing more than the second electrochemical fluid.

[0152] In some embodiments, the first and second electrochemical fluids are directed from the first and second outlets to a second substrate supporting the second processor or other electrical load and / or heat-generating component to provide power and / or cooling to the second processor or other electrical load and / or heat-generating component.

[0153] In some embodiments, the second processor or other electrical load and / or heat-generating component is a lower power component compared to the first processor or other electrical load and / or heat-generating component, and the residual charge in the first and second electrochemical fluids is used to provide power to the second processor or other electrical load and / or heat-generating component. However, the first and second electrochemical fluids are at an elevated temperature after receiving heat from the first processor or another electrical load and / or heat-generating component.

[0154] In at least one embodiment, the first and second electrochemical fluids are cooled before entering the second substrate at an inlet of the second substrate. The first electrochemical fluid flows to and through a first heat exchanger, and the second electrochemical fluid flows to and through a second heat exchanger. The heat exchangers expel heat from the first and second electrochemical fluids to ambient air or another fluid that expels heat. In some embodiments, the heat exchangers cool the first and second electrochemical fluids by different amounts. In some embodiments, the heat exchangers cool the first and second electrochemical fluids to the same temperature.

[0155] The cooled first and second electrochemical fluids flow from the heat exchangers to the electrochemical chambers of the second substrate to provide power and further cooling to the second processor or other electrical load and / or heat-generating component before exiting the electrochemical chambers of the second substrate through an outlet. In some embodiments, the first and second electrochemical fluids are further cooled and recharged as described herein.

[0156] Recirculating recharged and cooled electrochemical fluids can allow the electrochemical fluids to provide electrical power and thermal management to the die of a processor substantially continuously and directly. In at least one embodiment, the delivery of electrochemical fluids to a microfluidic volume of a processor can allow for combined power delivery and thermal management, and allow for smaller, more powerful, more efficient, and more reliable processors.

[0157] The present disclosure relates to systems and methods for combined power delivery and cooling to a processor according to at least the examples provided in the following sections:

[0158] [A1] In some embodiments, a processing unit includes a substrate, an electrical load, and a microfluidic volume. The electrical load is supported by a first surface of the substrate, and the microfluidic volume is located in a second surface of the substrate. The processing unit includes a first electrode located in the microfluidic volume and a second electrode located in the microfluidic volume. A first TSV connects the first electrode to the electrical load, and a second TSV connects the second electrode to the electrical load. An electrochemical fluid is located in the microfluidic volume to provide electrical power to the electrical load and receive heat from the electrical load.

[0159] [A2] In some embodiments, the electrochemical fluid of [Al] is a first electrochemical fluid, and a second electrochemical fluid is located in the microfluidic volume.

[0160] [A3] In some embodiments, an ion transfer membrane is located between the first electrochemical fluid and the second electrochemical fluid of [A2].

[0161] [A4] In some embodiments, the first electrochemical fluid of [A2] or [A3] is an anolyte, and the second electrochemical fluid of [A2] or [A3] is a catholyte.

[0162] [A5] In some embodiments, the first electrochemical fluid and the second electrochemical fluid of any one of [A2] to [A4] are configured to flow in a counter-current flow.

[0163] [A6] In some embodiments, the microfluidic volume of any one of [Al] to [A5] has a chamber width of less than 500 microns.

[0164] [A7] In some embodiments, the electrochemical fluid of [Al] is a first electrochemical fluid, the microfluidic volume includes a first portion containing the first electrochemical fluid and a second portion containing a second electrochemical fluid, and the first portion width is different than the second portion width.

[0165] [A8] In some embodiments, the cross-sectional area of the microfluidic volume of any one of [Al] to [A7] changes in a flow direction of the electrochemical fluid.

[0166] [A9] In some embodiments, the cross-sectional shape of the microfluidic volume of any one of [Al] to [A8] changes in a flow direction of the electrochemical fluid.

[0167] [A10] In some embodiments, the substrate of any one of [Al] to [A9] is a silicon wafer.

[0168] [A11] In some embodiments, the first electrode and the second electrode of any one of [Al] to [A10] are a first set of electrodes located in the microfluidic volume, and the device further comprises a second set of electrodes located in the microfluidic volume.

[0169] [A12] In some embodiments, the microfluidic volume of any one of [Al] to [Al l] includes a first electrochemical chamber and a second electrochemical chamber, and the first electrode and the second electrode are a first set of electrodes located in the first electrochemical chamber, and a second set of electrodes is located in the second electrochemical chamber.

[0170] [A13] In some embodiments, the first and second electrochemical chambers of [A12] are parallel to each other.

[0171] [A14] In some embodiments, the first and second electrochemical chambers of [A12] are branches of a microfluidic volume.

[0172] [B1] In some embodiments, a processing unit includes a substrate, an electrical load, and an electrochemical chamber. The electrical load is supported by a first surface of the substrate, and the electrochemical chamber is located in the substrate. The electrochemical chamber includes an ion transfer membrane that separates the electrochemical chamber into a first portion and a second portion. The electrochemical chamber includes a first electrode located in the first portion and a second electrode located in the second portion. A spike fin is located in the electrochemical chamber and is configured to support the ion transfer membrane relative to the substrate. A TSV in the spike fin connects one of the first and second electrodes to the electrical load. A first electrochemical fluid is located in a first volume, and a second electrochemical fluid is located in a second volume to provide electrical power to and receive heat from the electrical load.

[0173] [B2] In some embodiments, the ion transfer membrane of [B1] has a plane that is parallel to a second surface of the substrate.

[0174] [B3] In some embodiments, the first portion, ion transfer membrane, and second portion of [B2] are layered in a direction perpendicular to the second surface.

[0175] [C1] In some embodiments, a system for electrochemical generation includes a processing unit, a first electrochemical storage tank, a second electrochemical storage tank, and a heat exchanger. The processing unit includes a substrate, an electrical load, and an electrochemical chamber. The electrical load is supported by a first surface of the substrate, and the electrochemical chamber is located in a second surface of the substrate. The electrochemical chamber includes an ion transfer membrane that separates the electrochemical chamber into a first portion and a second portion. The electrochemical chamber includes a first electrode located in the first portion and a second electrode located in the second portion. A first TSV connects the first electrode to the electrical load, and a second TSV connects the second electrode to the electrical load. A first electrochemical fluid is located in a first volume, and a second electrochemical fluid is located in a second volume to provide electrical power to and receive heat from the electrical load. The first electrochemical storage tank is in fluid communication with the first portion, and the second electrochemical fluid storage tank is in fluid communication with the second portion. The heat exchanger is in fluid communication with at least one of the first and second electrochemical fluids and is configured to reject heat from the at least one of the first and second electrochemical fluids.

[0176] [C2] In some embodiments, the heat exchanger of [Cl] is a first heat exchanger in fluid communication with the first electrochemical fluid and configured to reject heat from the first electrochemical fluid, and the system further comprises a second heat exchanger in fluid communication with the second electrochemical fluid and configured to reject heat from the second electrochemical fluid.

[0177] [C3] In some embodiments, the processing unit of [Cl] is a first processing unit, and the system further comprises a second processing unit comprising a substrate, an electrical load, and an electrochemical chamber. The electrical load is supported by a first surface of the substrate, and the electrochemical chamber is located in a second surface of the substrate. The electrochemical chamber comprises an ion transfer membrane separating the electrochemical chamber into a first portion and a second portion. The electrochemical chamber comprises a first electrode located in the first portion and a second electrode located in the second portion. A first TSV connects the first electrode to the electrical load, and a second TSV connects the second electrode to the electrical load. A first electrochemical fluid is located in a first volume, and a second electrochemical fluid is located in a second volume to provide electrical power to and receive heat from the electrical load. At least the first electrochemical fluid is configured to flow from an outlet of the substrate of the first processing unit to the heat exchanger, and from the heat exchanger to an inlet of the substrate of the second processing unit.

[0178] The articles "a", "an", and "the" are intended to mean that there are one or more of the elements in the preceding descriptions. The terms "comprising", "including", and "having" are intended to be inclusive and allow for additional elements not listed. Furthermore, it is understood that the reference to "one embodiment" or "an embodiment" of the present disclosure is not a reference to the same embodiment; and that a description of "one embodiment" or "an embodiment" encompasses multiple embodiments. For example, any element described with respect to an embodiment can be combined with any other element described with respect to any other embodiment. The numbers, percentages, ratios, or other values described herein are intended to include the stated value, and other values that are "about" or "approximately" the stated value, as would be understood by one of ordinary skill in the art in light of the disclosure. Thus, the stated values are intended to be sufficiently broad to encompass at least values that are close enough to the stated value to perform a desired function or achieve a desired result. The stated values include at least variations that would be expected in a suitable manufacturing or production process, and can include values that are within 5%, 1%, 0.1%, or 0.01% of the stated value.

[0179] Those of ordinary skill in the art will appreciate that, in light of the present disclosure, equivalent constructions do not depart from the scope of the present disclosure and that various changes, substitutions, and alterations can be made to the embodiments disclosed herein without departing from the scope of the present disclosure. Equivalent constructions, including functional "means-plus-function" clauses are intended to cover structures as well as equivalents thereof that perform the same function without departing from the scope of the present disclosure. It is the applicant's intent that any reference to a patent, patent application, or patent publication by the applicant, inventor, assignee, or any combination thereof, is to be construed as a reference to a structure described in that patent, patent application, or patent publication. Applicant expressly disclaims any other subject matter as appended to or in combination with the claims. Each addition, deletion, and modification of an embodiment falling within the meaning and range of equivalents of the claims is to be embraced by such claims.

[0180] It is to be understood that any direction or reference frame in the preceding description is merely a relative direction or movement. For example, any reference to "front" and "back," or "top" and "bottom," or "left" and "right" merely describes the relative position or movement of the relevant elements.

[0181] The present disclosure can be implemented in other specific forms without departing from the characteristics thereof. The described embodiments are to be considered in all respects only as illustrative and not restrictive. The scope of the present disclosure is therefore indicated by the appended claims rather than by the foregoing description. Changes within the meaning and range of equivalents of the claims are to be included within the scope thereof.

Claims

1. A processing unit, comprising: A substrate (234) having a first surface (232) and an opposing second surface (236); An electrical load (224) is supported by the first surface of the substrate; Microfluidic volume (204) located in the second surface of the substrate; A first electrode (220) is located in the microfluidic volume; The second electrode (222) is located in the microfluidic volume; A first through-silicon via (TSV) (238) connects the first electrode to the electrical load; A second TSV (238) connects the second electrode to the electrical load; and An electrochemical fluid (208) is located in the microfluidic volume to provide electrical power to the electrical load and receive heat from the electrical load.

2. The processing unit according to claim 1, wherein the electrochemical fluid is a first electrochemical fluid, and the second electrochemical fluid (210) is located in the microfluidic volume.

3. The processing unit according to claim 2 further includes: An ion transfer membrane (206) is placed between the first electrochemical fluid and the second electrochemical fluid.

4. The processing unit according to claim 2 or 3, wherein the first electrochemical fluid is an anolyte and the second electrochemical fluid is a cathodic electrolyte.

5. The processing unit according to any one of claims 2 to 4, wherein the first electrochemical fluid and the second electrochemical fluid are configured to flow in countercurrent.

6. The processing unit according to any of the preceding claims, wherein the microfluidic volume has a chamber width of less than 500 micrometers.

7. The processing unit according to any of the preceding claims, wherein the electrochemical fluid is a first electrochemical fluid. The microfluidic volume comprises a first portion containing the first electrochemical fluid and a second portion containing the second electrochemical fluid, and The width of the first part (444) is different from the width of the second part (446).

8. The processing unit according to any of the preceding claims, wherein the cross-sectional area of ​​the microfluidic volume changes in the flow direction of the electrochemical fluid.

9. The processing unit according to any of the preceding claims, wherein the cross-sectional shape of the microfluidic volume changes in the flow direction of the electrochemical fluid.

10. The processing unit according to any of the preceding claims, wherein the substrate is a silicon wafer.

11. The processing unit according to any of the preceding claims, wherein the first electrode and the second electrode are a set of first electrodes located in the microfluidic volume, and It also includes a set of second electrodes (720-2, 722-2) located in the microfluidic volume.

12. The processing unit according to any of the preceding claims, wherein the microfluidic volume comprises a first electrochemical chamber (704-1) and a second electrochemical chamber (704-2), and the first electrode and the second electrode are a first electrode set located in the first electrochemical chamber, and the second electrode set is located in the second electrochemical chamber.

13. The processing unit according to claim 12, wherein the first electrochemical chamber (604-1) and the second electrochemical chamber (604-2) are parallel to each other.

14. The processing unit of claim 12, wherein the first electrochemical chamber and the second electrochemical chamber are branches of the microfluidic volume.

15. A processing unit, comprising: A substrate (834) having a first surface (832) and an opposing second surface (836); An electrical load (824) is supported by a first surface of the substrate; as well as An electrochemical chamber (804) is located in the substrate, wherein the electrochemical chamber comprises: An ion transfer membrane (806) separates the electrochemical chamber, comprising a first portion and a second portion. The first electrode (820) is located in the first part of the electrochemical chamber. The second electrode (822) is located in the second part of the electrochemical chamber. A spiked fin (852) is located in the electrochemical chamber and configured to support the ion transfer membrane relative to the substrate, and at least one electrode is supported by the spiked fin in the electrochemical chamber. A through-silicon via (TSV) (838) is provided in the stud fin, and the at least one electrode is connected to the electrical load. A first electrochemical fluid (808), the first electrochemical fluid (808) being located in the first portion, and The second electrochemical fluid (810) is located in the second part.

16. The processing unit of claim 15, wherein the ion transfer membrane has a plane parallel to the second surface of the substrate.

17. The processing unit of claim 16, wherein the first portion, the ion transfer membrane, and the second portion are layered in a direction perpendicular to the second surface.

18. A system for electrochemical generation, the system comprising: Processing unit, the processing unit comprising: A substrate (234) having a first surface (232) and an opposing second surface (236), An electrical load (224), said electrical load (224) being supported by a first surface of the substrate, and An electrochemical chamber (204) is located in the substrate, wherein the electrochemical chamber comprises: An ion transfer membrane (206) divides the electrochemical chamber into a first part and a second part. The first electrode (220) is located in the first part of the electrochemical chamber. The second electrode (222) is located in the second part of the electrochemical chamber. A through-silicon via (TSV) (238) passes through at least a portion of the substrate and connects the first electrode to the electrical load. A first electrochemical fluid (208), the first electrochemical fluid (208) being located in the first portion, and A second electrochemical fluid (210) is located in the second part; A first electrochemical fluid storage tank (912) is in communication with the first part of the fluid. A second electrochemical fluid storage tank (914), the second electrochemical fluid storage tank (914) being in fluid communication with the second portion; and A heat exchanger (956) is in fluid communication with at least one of the first electrochemical fluid and the second electrochemical fluid and is configured to discharge heat from at least one of the first electrochemical fluid and the second electrochemical fluid.

19. The system of claim 18, wherein the heat exchanger is a first heat exchanger, the first heat exchanger being in fluid communication with the first electrochemical fluid and configured to discharge heat from the first electrochemical fluid, and It also includes a second heat exchanger, which is in fluid communication with the second electrochemical fluid and is configured to discharge heat from the second electrochemical fluid.

20. The system of claim 18 or 19, wherein the processing unit is a first processing unit, and the system further comprises a second processing unit, the second processing unit comprising: The substrate has a first surface and an opposing second surface. An electrical load, said electrical load being supported by a first surface of the substrate, and An electrochemical chamber, located within the substrate, wherein the electrochemical chamber comprises: An ion transfer membrane, the ion transfer membrane separating the electrochemical chamber comprising a first portion and a second portion, The first electrode is located in the first part of the electrochemical chamber. The second electrode is located in the second part of the electrochemical chamber. A through-silicon via (TSV) that penetrates at least a portion of the substrate and connects the first electrode to the electrical load. A first electrochemical fluid, the first electrochemical fluid being located in the first portion, and The second electrochemical fluid is located in the second part. At least the first electrochemical fluid is configured to flow from the outlet of the substrate of the first processing unit to the heat exchanger, and from the heat exchanger to the inlet of the substrate of the second processing unit.

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