Wafer carrying device for vertical furnace

Abstract

The invention provides a wafer carrying device for a vertical furnace, and belongs to the technical field of wafer carrying. In order to solve the problem that an existing wafer carrying device is low in carrying efficiency, the wafer carrying device for the vertical furnace comprises a box opening platform, a first carrying mechanism, a transfer platform and a second carrying mechanism which are connected in sequence. Rapid box opening operation of wafer boxes is achieved through the box opening platform, and the first carrying mechanism can carry the wafer boxes to at least one transmission channel and a plurality of storage stations of the transfer platform firstly, so that the same batch of wafer boxes can rapidly flow between the box opening platform and the transfer platform; and at least one transmission channel can continuously transmit the wafer boxes, so that the second carrying mechanism can rapidly carry the wafers between the transmission channel and the vertical furnace, redundant wafer boxes can be directly stored on the multiple storage stations, the carrying process is simplified, and the carrying efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer conveying, in particular to a wafer conveying device for a vertical furnace. BACKGROUND

[0002] The existing vertical furnace is an important process equipment for the front process of a semiconductor production line. With the continuous improvement of the process, the pollution control requirements for the wafer processing process are higher and higher, and higher requirements are also put forward for the cleanliness of the internal part of the vertical furnace. During the loading and unloading of the wafer box, air is easily mixed, which affects the micro environment and low-oxygen content atmosphere in the internal part of the equipment, and causes the wafer to be contaminated, naturally oxidized, and the like.

[0003] Therefore, before the wafer is conveyed to the vertical furnace for processing, the wafer box is often first opened, the wafer cassette carrying the wafer in the wafer box is taken out, and then conveyed to the interface of the vertical furnace. Finally, the wafer in the wafer cassette is conveyed to the vertical furnace for processing by the mechanical arm. Since the wafer has very high requirements for the cleanliness of the internal part of the vertical furnace, the environment exposed to the wafer needs to be cleaned in each conveying environment, which leads to low overall transmission efficiency of the transmission device and is difficult to reduce the wafer conveying cost. SUMMARY

[0004] The purpose of the present application is to solve the problem in the prior art that the wafer conveying device for the vertical furnace leads to low transmission efficiency in order to ensure the cleanliness of the transmission process. Therefore, the present application provides a wafer conveying device for a vertical furnace, which realizes rapid opening of the wafer box by the opening platform, and the first conveying mechanism can first convey the wafer cassette to at least one transmission channel and a plurality of storage stations of the transfer platform, so that the same batch of wafer boxes can be quickly circulated between the opening platform and the transfer platform. And at least one transmission channel can continuously convey the wafer cassette, so as to facilitate the second conveying mechanism to quickly convey the wafer in the transmission channel and the vertical furnace, and the excess wafer cassette can be directly stored in the plurality of storage stations, which simplifies the conveying process and improves the conveying efficiency.

[0005] The present application provides a wafer conveying device for a vertical furnace, which is used for conveying a wafer box, the wafer box carries a wafer cassette, the wafer cassette carries a wafer, and the wafer conveying device comprises:

[0006] The opening platform, the first conveying mechanism, the transfer platform and the second conveying mechanism are sequentially connected;

[0007] The opening platform is used for carrying the wafer box and performing the opening operation;

[0008] The first conveying mechanism is used for conveying the wafer cassette between the opening platform and the transfer platform;

[0009] The second carrying mechanism is used for carrying the wafer on the wafer cassette on the transfer platform to the vertical furnace for processing.

[0010] The transfer platform is provided with at least one transmission channel penetrating through, and first and second door opening mechanisms are arranged on both sides of the transmission channel respectively; the transmission channel is used for placing the wafer cassette, and the first and second door opening mechanisms are used for sealing the transmission channel.

[0011] The side of the transfer platform facing the box opening platform is provided with a plurality of storage stations for storing the wafer cassette.

[0012] By using the above technical scheme, the wafer box can be quickly opened on the box opening platform, and the first carrying mechanism can carry the wafer cassette to at least one transmission channel and a plurality of storage stations of the transfer platform, so that the same batch of wafer boxes can be quickly transferred between the box opening platform and the transfer platform; at least one transmission channel can continuously transmit the wafer cassette, so that the second carrying mechanism can quickly carry the wafer between the transmission channel and the vertical furnace, and the excess wafer cassette can be directly stored in the plurality of storage stations, thereby simplifying the carrying process and improving the carrying efficiency.

[0013] In some embodiments, the side wall of the transmission channel is provided with an air exchange hole, and the outer wall of the transmission channel is provided with an air exchange mechanism corresponding to the air exchange hole, and the air exchange mechanism is used for purifying the gas environment in the transmission channel.

[0014] The transmission channel includes a first opening and a second opening at both ends of the transmission direction; the first door opening mechanism is arranged corresponding to the first opening and is used for sealing the first opening, and the second door opening mechanism is arranged corresponding to the second opening and is used for sealing the second opening.

[0015] The inner bottom surface of the transmission channel is provided with a positioning mechanism for limiting the wafer cassette.

[0016] The at least one transmission channel includes a first transmission channel and a second transmission channel arranged side by side along the height direction, and the first transmission channel and the second transmission channel alternately transmit the wafer cassette.

[0017] By using the above technical scheme, the air exchange mechanism can ensure that the gas environment in the transmission channel maintains high cleanliness, and the first opening and the second opening at both ends of the transmission channel can be opened in turn, avoiding direct communication between both ends of the transmission channel, thereby causing additional pollution. Further, the first transmission channel and the second transmission channel arranged side by side along the height direction can alternately transmit the wafer cassette, further improving the overall carrying efficiency, and avoiding too many transmission channels occupying too much space and reducing the setting of the storage station.

[0018] In some embodiments, the first door opening mechanism comprises a first guide rail arranged on one side of the first opening, a positioning plate arranged on the first guide rail through a first driving member, and a cover plate arranged on the positioning plate;

[0019] The cover plate is movably arranged on the positioning plate through a first telescopic mechanism;

[0020] The driving member drives the positioning plate to slide to the first opening of the transmission channel, and the cover plate moves towards the first opening and seals the first opening under the action of the first telescopic mechanism.

[0021] In some embodiments, the positioning plate is arranged in a frame shape and can cover the outer edge of the first opening of the transmission channel;

[0022] The first telescopic mechanism comprises two first driving motors and two first limiting rods arranged symmetrically on the positioning plate;

[0023] The cover plate is movably arranged on the positioning plate through the first driving motor and the first limiting rod, and is provided with a sealing ring matched with the first opening of the transmission channel, and the first driving motor drives the cover plate to move towards or away from the first opening of the transmission channel relative to the positioning plate;

[0024] The cover plate can close the first opening of the transmission channel through the sealing ring;

[0025] The first limiting rod guides the movement of the cover plate.

[0026] In some embodiments, the second door opening mechanism comprises a second guide rail arranged on one side of the second opening of the transmission channel, and a first sealing plate and a second sealing plate arranged in layers;

[0027] The second sealing plate is slidably arranged on the second guide rail through a second driving member;

[0028] The first sealing plate is movably arranged on the second sealing plate through a second telescopic mechanism;

[0029] The second telescopic mechanism comprises a plurality of driving motors and a plurality of limiting rods arranged on the side of the second sealing plate away from the first sealing plate;

[0030] The second telescopic mechanism drives the first sealing plate to move towards or away from the opening of the transmission channel through the plurality of driving motors; and the plurality of limiting rods are used for guiding the movement of the first sealing plate;

[0031] The second sealing plate is provided with a sealing cover for covering the second telescopic mechanism.

[0032] By adopting the technical scheme, on one hand, the sealing property of the second opening mechanism when sealing the second opening can be ensured, and on the other hand, the setting of the sealing cover can reduce the particulate pollution gas environment generated in the movement of the second telescopic mechanism, thereby affecting the cleanliness of the wafer transmission process.

[0033] In some embodiments, the wafer box comprises a bottom plate and a wafer box cover arranged on the bottom plate;

[0034] The box opening platform comprises a first platform for carrying the wafer box cover, and a lifting table for carrying the bottom plate;

[0035] The first platform is provided with a first channel for accommodating the lifting table, and the first platform is provided with a first sliding rail at the bottom corresponding to the first channel;

[0036] The lifting table is slidably arranged on the first sliding rail through a driving mechanism, and the driving mechanism is used to drive the lifting table to move in the height direction relative to the first channel.

[0037] By adopting the technical scheme, on one hand, the lifting table can realize efficient opening and transmission of the wafer box, and on the other hand, the lifting table can ensure the stability and safety of the opening process.

[0038] In some embodiments, the center of the lifting table is provided with an unlocking mechanism, and one side of the unlocking mechanism is provided with an air exchange hole;

[0039] A positioning protrusion and a presence sensor in a triangular distribution are arranged around the unlocking mechanism;

[0040] The air exchange hole is used to purify the gas environment in the wafer box;

[0041] The unlocking mechanism is used to unlock the wafer box cover and the bottom plate;

[0042] The positioning protrusion is used to position and fix the bottom plate;

[0043] The presence sensor is used to detect whether the bottom plate is placed on the lifting table.

[0044] In some embodiments, the first platform is provided with a plurality of limiting blocks and a locking module arranged opposite to the first channel around the first channel, and the limiting blocks are provided with a guide surface guiding the first channel;

[0045] The locking module is used to tighten the wafer box cover on the first platform.

[0046] In some embodiments, the first carrying mechanism comprises a vertical guide rail, a horizontal guide rail, a telescopic mechanical arm, a turnover mechanism and a grabbing claw;

[0047] The horizontal guide rail is slidably arranged in the vertical guide rail in a vertical direction;

[0048] The telescopic mechanical arm is slidably arranged in the horizontal guide rail in a horizontal direction, and the telescopic mechanical arm is rotated and telescoped in a horizontal plane;

[0049] A turnover mechanism is fixedly arranged at the end of the telescopic mechanical arm, and the turnover mechanism comprises a fixed plate and a turnover plate vertically arranged on one side of the fixed plate;

[0050] One side of the grabbing claw is connected with the turnover plate through a transmission mechanism, and a driving motor is arranged in the turnover plate, and the driving motor in the turnover plate drives the transmission mechanism, so that the grabbing claw is turned over.

[0051] By using the above technical scheme, after the first carrying mechanism grabs the wafer box, the wafer box can be turned over so that the opening of the wafer box faces upward, thereby avoiding the position dislocation or falling of the wafer during the carrying process. Further, after being turned over, it is also beneficial to store the wafer box. When the wafer box is sent to the transmission channel, the wafer box can be turned over again so that the opening of the wafer box faces the transmission channel, which is beneficial to the grabbing of the wafer in the wafer box by the second carrying mechanism at the other end of the transmission channel.

[0052] In some embodiments, the wafer box comprises an outer wafer box and an inner wafer box arranged in the outer wafer box;

[0053] The storage station comprises a plurality of first positioning blocks, a plurality of second positioning blocks, a wafer box detection sensor and a wafer detection sensor;

[0054] The plurality of first positioning blocks are movably arranged in the storage station and have a pre-tightening force in a locking direction, and the first positioning blocks are provided with a guide surface for fixing and locking the outer wafer box of the wafer box;

[0055] The wafer box detection sensor is used to detect the outer wafer box of the wafer box to determine whether the wafer box is stored;

[0056] The plurality of second positioning blocks comprise a plurality of second positioning blocks oppositely arranged in a first direction and a plurality of second positioning blocks oppositely arranged in a second direction, and the first direction and the second direction are perpendicular to each other;

[0057] The wafer detection sensor is used to detect whether the inner wafer box of the wafer box is placed with a wafer.

[0058] Other features and corresponding beneficial effects of the present application are described in the latter part of the specification, and it should be understood that at least part of the beneficial effects become apparent from the description in the specification. BRIEF DESCRIPTION OF DRAWINGS

[0059] Figure 1 A structure schematic diagram of a wafer carrying device for a vertical furnace provided by an embodiment of the present application;

[0060] Figure 2 A structure schematic diagram of an opening box platform and a first carrying mechanism of a wafer carrying device provided by an embodiment of the present application;

[0061] Figure 3 A structure schematic diagram of an opening box platform of a wafer carrying device provided by an embodiment of the present application;

[0062] Figure 4 A structure schematic diagram of an opening box platform of a wafer carrying device provided by an embodiment of the present application;

[0063] Figure 5 A structure top view of a lifting table of an opening box platform of a wafer carrying device provided by an embodiment of the present application;

[0064] Figure 6 A structure schematic diagram of a first carrying mechanism of a wafer carrying device provided by an embodiment of the present application;

[0065] Figure 7 A partial structure schematic diagram of a first carrying mechanism of a wafer carrying device provided by an embodiment of the present application;

[0066] Figure 8 A structure schematic diagram of a transfer platform of a wafer carrying device provided by an embodiment of the present application;

[0067] Figure 9 A structure schematic diagram of a first door opening mechanism and a transmission channel of a wafer carrying device provided by an embodiment of the present application;

[0068] Figure 10 A structure schematic diagram of a second door opening mechanism and a transmission channel of a wafer carrying device provided by an embodiment of the present application;

[0069] Figure 11 A structure schematic diagram of a storage station of a wafer carrying device provided by an embodiment of the present application.

[0070] Explanation of reference signs:

[0071] 100, opening box platform;

[0072] 110, first platform;

[0073] 111, first channel; 112, limiting block; 113, locking module;

[0074] 120, lifting table;

[0075] 121, unlocking mechanism; 122, air vent; 123, positioning protrusion; 124, presence sensor;

[0076] 130, sliding rail; 140, driving mechanism;

[0077] 200, first conveying mechanism;

[0078] 210, vertical guide rail; 220, horizontal guide rail; 230, telescopic mechanical arm;

[0079] 240, overturning mechanism;

[0080] 241, fixing plate; 242, overturning plate;

[0081] 250, grabbing claw;

[0082] 300, transfer platform;

[0083] 310, transmission channel;

[0084] 311, first opening; 312, second opening; 313, air exchange mechanism; 314, positioning mechanism;

[0085] 320, first door opening mechanism;

[0086] 321, first guide rail; 322, positioning plate; 323, cover plate; 324, first telescopic mechanism;

[0087] 330, second door opening mechanism;

[0088] 331, second guide rail; 332, sealing cover;

[0089] 340, storage station;

[0090] 341, first positioning block; 342, second positioning block; 343, wafer cassette detection sensor; 344, wafer detection sensor;

[0091] 400, wafer cassette. DETAILED DESCRIPTION

[0092] The following will describe the embodiments of the present application by specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification. Although the description of the present application will be introduced in combination with the preferred embodiments, it does not mean that the features of the present application are limited to the embodiments. On the contrary, the purpose of introducing the present application in combination with the embodiments is to cover other alternatives or modifications which can be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or obscure the present application, some specific details will be omitted in the description. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other without conflict.

[0093] It should be noted that in the specification, similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0094] The technical solutions of the present application will be described in detail below in combination with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0095] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more features. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0096] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be internal communication of two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0097] In order to make the purpose, technical scheme and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0098] Please refer to Figures 1-11 The wafer carrying device for the vertical furnace provided by the embodiments of the present application is used for carrying a wafer box, the wafer box carries a wafer box 400, the wafer box 400 carries a wafer sheet, and the wafer carrying device comprises:

[0099] The opening box platform 100, the first carrying mechanism 200, the transfer platform 300 and the second carrying mechanism are sequentially connected;

[0100] The opening box platform 100 is used for carrying the wafer box and performing the opening box operation;

[0101] The first carrying mechanism 200 is used for carrying the wafer box 400 between the opening box platform 100 and the transfer platform 300;

[0102] The second carrying mechanism is used for carrying the wafer sheet on the wafer box 400 in the transfer platform 300 to the vertical furnace for processing;

[0103] The transfer platform 300 is provided with at least one transmission channel 310 penetrating through, and the first door opening mechanism 320 and the second door opening mechanism 330 are arranged on both sides of the transmission channel 310 respectively; the transmission channel 310 is used for placing the wafer box 400, and the first door opening mechanism 320 and the second door opening mechanism 330 are used for sealing the transmission channel 310;

[0104] The side of the transfer platform 300 facing the opening box platform 100 is provided with a plurality of storage stations 340, and the storage stations 340 are used for storing the wafer box 400.

[0105] The wafer box is quickly opened by the opening box platform 100, and the first carrying mechanism 200 can first carry the wafer box 400 to at least one transmission channel 310 and a plurality of storage stations 340 of the transfer platform 300, so that the same batch of wafer boxes can be quickly transferred between the opening box platform 100 and the transfer platform 300; and the at least one transmission channel 310 can continuously transmit the wafer box 400, so that the second carrying mechanism can quickly carry the wafer sheet between the transmission channel 310 and the vertical furnace, and the excess wafer box 400 can be directly stored in the plurality of storage stations 340, thereby simplifying the carrying process and improving the carrying efficiency.

[0106] In one embodiment, the side wall of the transmission channel 310 is provided with an air exchange hole 122, and the outer wall of the transmission channel 310 is provided with an air exchange mechanism 313 corresponding to the air exchange hole 122, and the air exchange mechanism 313 is used for purifying the gas environment in the transmission channel 310;

[0107] The transmission channel 310 includes a first opening 311 and a second opening 312 at both ends of the transmission direction; the first door opening mechanism 320 is arranged corresponding to the first opening 311 and is used for sealing the first opening 311, and the second door opening mechanism 330 is arranged corresponding to the second opening 312 and is used for sealing the second opening 312;

[0108] The inner bottom surface of the transmission channel 310 is provided with a positioning mechanism 314 for limiting the wafer box 400;

[0109] The at least one transmission channel 310 includes a first transmission channel 310 and a second transmission channel 310 arranged side by side along the height direction, and the first transmission channel 310 and the second transmission channel 310 alternately transmit the wafer box 400.

[0110] The air exchange mechanism 313 can ensure that the gas environment in the transmission channel 310 maintains a high degree of cleanliness, and the first opening 311 and the second opening 312 at both ends of the transmission channel 310 can be opened in turn, avoiding direct flow between both ends of the transmission channel 310, thereby causing additional pollution. Further, the first transmission channel 310 and the second transmission channel 310 arranged side by side along the height direction can alternately transmit the wafer box 400, further improving the overall carrying efficiency, and avoiding too many transmission channels 310 occupying too much space and reducing the number of storage stations 340.

[0111] In one embodiment, the first door opening mechanism 320 includes a first guide rail 321 arranged on one side of the first opening 311, a positioning plate 322 arranged on the first guide rail 321 by a first driving member, and a cover plate 323 arranged on the positioning plate 322;

[0112] The cover plate 323 is movably arranged on the positioning plate 322 through a first telescopic mechanism 324;

[0113] The driving member drives the positioning plate 322 to slide to the first opening 311 of the transmission channel 310, and the cover plate 323 moves towards the first opening 311 and seals the first opening 311 under the action of the first telescopic mechanism 324.

[0114] In an embodiment, the positioning plate 322 is arranged in a frame shape and can cover the outer edge of the first opening 311 of the transmission channel 310;

[0115] The first telescopic mechanism 324 includes two first driving motors and two first limiting rods arranged symmetrically on the positioning plate 322;

[0116] The cover plate 323 is movably arranged on the positioning plate 322 through the first driving motor and the first limiting rod, and is provided with a sealing ring matched with the first opening 311 of the transmission channel 310, and the first driving motor drives the cover plate 323 to move towards or away from the first opening 311 of the transmission channel 310 relative to the positioning plate 322;

[0117] The cover plate 323 can close the first opening 311 of the transmission channel 310 through the sealing ring;

[0118] The first limiting rod plays a guiding role in the movement of the cover plate 323.

[0119] In an embodiment, the second door opening mechanism 330 includes a second guide rail 331 arranged on one side of the second opening 312 of the transmission channel 310, and a first sealing plate and a second sealing plate arranged in layers;

[0120] The second sealing plate is movably arranged on the second guide rail 331 through a second driving member;

[0121] The first sealing plate is movably arranged on the second sealing plate through a second telescopic mechanism;

[0122] The second telescopic mechanism includes a plurality of driving motors and a plurality of limiting rods arranged on the side of the second sealing plate away from the first sealing plate;

[0123] The second telescopic mechanism drives the first sealing plate to move towards or away from the opening of the transmission channel 310 through the plurality of driving motors; and the plurality of limiting rods are used for guiding the movement of the first sealing plate;

[0124] The second sealing plate is provided with a sealing cover 335 for covering the second telescopic mechanism.

[0125] On the one hand, the sealing property of the second opening mechanism 330 when sealing the second opening 312 can be ensured, and on the other hand, the setting of the sealing cover 335 can reduce the particle pollution gas environment generated during the movement of the second telescopic mechanism, thereby affecting the cleanliness of the wafer transmission process.

[0126] In one embodiment, the wafer box comprises a bottom plate and a wafer box cover arranged on the bottom plate;

[0127] The box opening platform 100 comprises a first platform 110 for carrying the wafer box cover, and a lifting table 120 for carrying the bottom plate;

[0128] The first platform 110 is provided with a first channel 111 for accommodating the lifting table 120, and the bottom of the first platform 110 is provided with a first sliding rail 130 corresponding to the first channel 111;

[0129] The lifting table 120 is slidably arranged on the first sliding rail 130 by a driving mechanism 140, and the driving mechanism 140 is used to drive the lifting table 120 to move in the height direction relative to the first channel 111.

[0130] On the one hand, the lifting table 120 can realize efficient opening and transmission of the wafer box, and on the other hand, the lifting table 120 can ensure the stability and safety of the opening process.

[0131] In one embodiment, the center of the lifting table 120 is provided with an unlocking mechanism 121, and one side of the unlocking mechanism 121 is provided with an air exchange hole 122;

[0132] A positioning protrusion 123 and a presence sensor 124 are arranged around the unlocking mechanism 121 in a triangular distribution;

[0133] The air exchange hole 122 is used to purify the gas environment in the wafer box;

[0134] The unlocking mechanism 121 is used to unlock the wafer box cover and the bottom plate;

[0135] The positioning protrusion 123 is used to position and fix the bottom plate;

[0136] The presence sensor 124 is used to detect whether the bottom plate is placed on the lifting table 120.

[0137] In one embodiment, the first platform 110 is provided with a plurality of limiting blocks 112 and oppositely arranged locking modules 113 around the first channel 111, and the limiting blocks 112 are provided with a guide surface guiding the first channel 111;

[0138] The locking module 113 is used to tighten the wafer box cover on the first platform 110.

[0139] In one embodiment, the first conveying mechanism 200 comprises a vertical guide rail 210, a horizontal guide rail 220, a telescopic mechanical arm 230, a turnover mechanism 240 and a grabbing claw 250;

[0140] The horizontal guide rail 220 is slidably arranged on the vertical guide rail 210 in the vertical direction;

[0141] The telescopic mechanical arm 230 is slidably arranged on the horizontal guide rail 220 in the horizontal direction, and the telescopic mechanical arm 230 rotates and telescopes in the horizontal plane;

[0142] The end of the telescopic mechanical arm 230 is fixedly provided with the turnover mechanism 240, and the turnover mechanism 240 comprises a fixed plate 241 and a turnover plate 242 vertically arranged on one side of the fixed plate 241;

[0143] One side of the grabbing claw 250 is connected with the turnover plate 242 through a transmission mechanism, and a driving motor is arranged in the turnover plate 242, and the driving motor in the turnover plate 242 drives the transmission mechanism, so as to drive the turnover of the grabbing claw 250.

[0144] Wherein, after the first conveying mechanism 200 grabs the wafer box 400, it can be turned over so that the opening of the wafer box 400 faces upward, thereby avoiding the dislocation or falling of the wafer during the conveying process; further, after the turnover, it is also beneficial to store the wafer box 400, and when the wafer box 400 is sent to the transmission channel 310, the wafer box 400 can be turned over again, so that the opening of the wafer box 400 faces the transmission channel 310, which is beneficial to the second conveying mechanism at the other end of the transmission channel 310 to grab the wafers in the wafer box 400.

[0145] In one embodiment, the wafer box 400 comprises an outer wafer box and an inner wafer box arranged in the outer wafer box;

[0146] The storage station 340 comprises a plurality of first positioning blocks 341, a plurality of second positioning blocks 342, a wafer box 400 detection sensor 343 and a wafer detection sensor;

[0147] The plurality of first positioning blocks 341 are movably arranged on the storage station 340 and have a pre-tightening force in the locking direction, and the first positioning block 341 is provided with a guide surface for fixing and locking the outer wafer box of the wafer box 400;

[0148] The wafer box 400 detection sensor 343 is used to detect the outer wafer box of the wafer box 400 to determine whether the wafer box 400 is stored;

[0149] The plurality of second positioning blocks 342 comprise a plurality of second positioning blocks 342 arranged opposite to each other in a first direction, and a plurality of second positioning blocks 342 arranged opposite to each other in a second direction, and the first direction and the second direction are perpendicular to each other;

[0150] The wafer detection sensor 344 is used to detect whether the inner wafer cassette of the wafer cassette 400 is placed with a wafer.

[0151] In one use scenario, the wafer box is carried to the box opening platform 100 by a wafer box handling crane, manual handling or automatic handling device. The guide surface of the plurality of limiting blocks 112 of the first platform 110 guides the wafer box, so that the wafer box is accurately placed on the first platform 110. After the presence sensor 124 on the lifting platform 120 senses that the base plate is placed on the lifting platform 120, the locking module 113 of the first platform 110 clamps and fixes the wafer box cover, and the air exchange hole 122 of the lifting platform 120 purifies the gas environment in the wafer box.

[0152] Then, the unlocking mechanism 121 of the lifting platform 120 unlocks the wafer box cover and the base plate, and the lifting platform 120 drives the base plate to descend, so that the first handling mechanism 200 can handle the wafer cassette 400.

[0153] At this time, the first opening 311 of the transmission channel 310 is opened by the first door opening mechanism 320, the first handling mechanism 200 carries the wafer cassette 400 into the transmission channel 310, the first door opening mechanism 320 is closed, and the air exchange mechanism 313 of the side wall of the transmission channel 310 purifies the gas environment in the transmission channel 310; in this process, the first handling mechanism 200 can carry the excess wafer cassette 400 to the storage station 340. After the gas environment in the transmission channel 310 is purified, the second opening 312 of the transmission channel 310 is opened by the second door opening mechanism 330, the second handling mechanism carries the wafer in the wafer cassette 400 to the vertical furnace, and after the carrying is completed, the second door opening mechanism 330 is closed, so as to complete one wafer transmission.

[0154] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer handling device for a vertical furnace for handling a wafer cassette, said wafer cassette having a wafer boat carried therein, said wafer boat having wafer pieces carried thereon, characterized by, The device comprises: a box opening platform, a first conveying mechanism, a transfer platform and a second conveying mechanism connected in sequence; the box opening platform is used for carrying a wafer box and performing a box opening operation; the first conveying mechanism is used for conveying a wafer cassette between the box opening platform and the transfer platform; the second conveying mechanism is used for conveying a wafer on the wafer cassette in the transfer platform to the vertical furnace for processing; the transfer platform is provided with at least one transmission channel penetrating through, and first and second door opening mechanisms are arranged on both sides of the transmission channel; the transmission channel is used for placing the wafer cassette, and the first and second door opening mechanisms are used for sealing the transmission channel; a plurality of storage stations are arranged on the side of the transfer platform facing the box opening platform, and the storage stations are used for storing the wafer cassette.

2. The wafer conveying device for a vertical furnace according to claim 1, wherein air exchange holes are arranged on the side wall of the transmission channel, and an air exchange mechanism is arranged on the outer wall surface of the transmission channel corresponding to the air exchange holes, and the air exchange mechanism is used for purifying the gas environment in the transmission channel; the transmission channel comprises first and second openings at both ends in the transmission direction; the first door opening mechanism is arranged corresponding to the first opening and is used for sealing the first opening, and the second door opening mechanism is arranged corresponding to the second opening and is used for sealing the second opening; a positioning mechanism is arranged on the inner bottom surface of the transmission channel, and the positioning mechanism is used for limiting the wafer cassette; the at least one transmission channel comprises first and second transmission channels arranged in parallel along the height direction, and the first and second transmission channels alternately convey the wafer cassette.

3. The wafer handling device for a vertical furnace according to claim 2, wherein the first door opening mechanism comprises a first guide rail arranged on one side of the first opening, a positioning plate slidably arranged on the first guide rail by a first driving member, and a cover plate arranged on the positioning plate; the cover plate is movably arranged on the positioning plate by a first telescopic mechanism; the driving member drives the positioning plate to slide to the first opening of the transmission channel, and the cover plate moves towards the first opening and seals the first opening under the action of the first telescopic mechanism.

4. The wafer conveying device for a vertical furnace according to claim 3, wherein the positioning plate is arranged in a frame shape and can cover the outer edge of the first opening of the transmission channel; the first telescopic mechanism comprises two first driving motors and two first limiting rods arranged symmetrically on the positioning plate; the cover plate is movably arranged on the positioning plate by the first driving motor and the first limiting rod, and is provided with a sealing ring matched with the first opening of the transmission channel, and the first driving motor drives the cover plate to move towards or away from the first opening of the transmission channel relative to the positioning plate; the cover plate can close the first opening of the transmission channel through the sealing ring; the first limiting rod plays a guiding role in the movement of the cover plate.

5. The wafer conveying device for a vertical furnace according to claim 1, wherein The second door opening mechanism comprises a second guide rail arranged on one side of the second opening of the transmission channel, and a first sealing plate and a second sealing plate arranged in layers; The second sealing plate is slidably arranged on the second guide rail by a second driving member; The first sealing plate is movably arranged on the second sealing plate by a second telescopic mechanism; The second telescopic mechanism comprises a plurality of driving motors and a plurality of limiting rods arranged on the side of the second sealing plate away from the first sealing plate; The second telescopic mechanism drives the first sealing plate to move towards or away from the opening of the transmission channel by the plurality of driving motors; The plurality of limiting rods are used to guide the movement of the first sealing plate; The second sealing plate is provided with a sealing cover for covering the second telescopic mechanism.

6. The wafer carrying device for a vertical furnace according to claim 1, wherein The wafer box comprises a bottom plate and a wafer box cover arranged on the bottom plate; The box opening platform comprises a first platform for carrying the wafer box cover, and a lifting table for carrying the bottom plate; The first platform is provided with a first channel for accommodating the lifting table, and the bottom of the first platform is provided with a first sliding rail corresponding to the first channel; The lifting table is slidably arranged on the first sliding rail by a driving mechanism, and the driving mechanism is used to drive the lifting table to move in the height direction relative to the first channel.

7. The wafer carrying device for a vertical furnace according to claim 6, wherein The center of the lifting table is provided with an unlocking mechanism, one side of the unlocking mechanism is provided with an air exchange hole; A positioning protrusion and a presence sensor are arranged around the unlocking mechanism in a triangular distribution; The air exchange hole is used to purify the gas environment in the wafer box; The unlocking mechanism is used to unlock the wafer box cover and the bottom plate; The positioning protrusion is used to position and fix the bottom plate; The presence sensor is used to detect whether the bottom plate is placed on the lifting table.

8. The wafer carrying device for a vertical furnace according to claim 6, wherein The first platform is provided with a plurality of limiting blocks and oppositely arranged locking modules around the first channel, and the limiting blocks are provided with a guide surface guiding the first channel; The locking module is used to tighten the wafer box cover on the first platform.

9. The wafer carrying device for a vertical furnace according to claim 1, wherein The first carrying mechanism comprises a vertical guide rail, a horizontal guide rail, a telescopic mechanical arm, a turnover mechanism and a grabbing claw; The horizontal guide rail is slidably arranged on the vertical guide rail in the vertical direction; The telescopic mechanical arm is slidably arranged on the horizontal guide rail in the horizontal direction, and the telescopic mechanical arm is rotatably telescopic in the horizontal plane; The end of the telescopic mechanical arm is fixedly provided with a turnover mechanism, and the turnover mechanism comprises a fixed plate and a turnover plate vertically arranged on one side of the fixed plate; One side of the grabbing claw is connected with the turnover plate by a transmission mechanism, and the turnover plate is internally provided with a driving motor, and the driving motor in the turnover plate drives the transmission mechanism, thereby driving the grabbing claw to turn over. 10.The wafer carrier for a vertical furnace according to claim 1, wherein, the wafer carrier comprises an outer wafer carrier and an inner wafer carrier arranged in the outer wafer carrier; the storage station comprises a plurality of first positioning blocks, a plurality of second positioning blocks, a wafer carrier detection sensor and a wafer detection sensor; the plurality of first positioning blocks are movably arranged in the storage station and have a pre-tightening force in a locking direction, and the first positioning blocks are provided with a guide surface for fixing and locking the outer wafer carrier of the wafer carrier; the wafer carrier detection sensor is used for detecting the outer wafer carrier of the wafer carrier to determine whether the wafer carrier is stored; the plurality of second positioning blocks comprise a plurality of second positioning blocks arranged opposite to each other in a first direction and a plurality of second positioning blocks arranged opposite to each other in a second direction, and the first direction and the second direction are perpendicular to each other; the wafer detection sensor is used for detecting whether the inner wafer carrier of the wafer carrier is placed with a wafer.

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