Laser-induced surface metallization glass fiber reinforced polyether-ether-ketone modified material and preparation method thereof

Abstract

The invention provides a laser-induced surface metallized glass fiber reinforced polyether-ether-ketone modified material and a preparation method thereof. The laser-induced surface metallized glass fiber reinforced polyether-ether-ketone modified material is prepared from the following components in percentage by weight: 39%-69.5% of PEEK resin, 20%-40% of low-dielectric flat glass fiber, 5%-10% of low-dielectric filler, 5%-10% of Cu-Ni coordination compound and 0.5%-1% of antioxidant. According to the invention, the Cu-Ni coordination compound is added into the PEEK modified material, then the PEEK modified material is subjected to laser induction treatment with a specific wave band, reducing cuprous ions or nickel ions are obtained on the surface layer of the PEEK modified material, and then the reducing cuprous ions or nickel ions are catalytically reduced into metal atoms through an electroplating process, so that the metal layer is embedded into the PEEK base material, and the binding force between the metal coating and the PEEK base material is improved.

Description

Technical Field

[0001] This invention relates to the field of special engineering plastics, specifically to a laser-induced surface metallized glass fiber reinforced polyether ether ketone modified material and its preparation method. Background Technology

[0002] Traditional communication electronic equipment (devices) primarily use aluminum alloys, iron, and steel as structural components. While these materials are simple to manufacture and low in cost, their high density makes them unsuitable for the lightweight requirements of next-generation products. Polyetheretherketone (PEEK) is a semi-crystalline, thermoplastic aromatic polymer with a linear molecular backbone containing chain segments, making it the most important type of polyetheretherketone polymer. PEEK's lightweight, high strength, high temperature resistance (up to 260℃ for long-term use), and low dielectric loss properties have made it a viable alternative to traditional metal alloys like aluminum alloys. In electronic product applications, electromagnetic shielding is necessary to prevent electromagnetic interference between components and between products. PEEK itself has poor conductivity and lacks electromagnetic shielding capabilities or fails to achieve ideal shielding effects. Therefore, PEEK structural components require surface metallization. A continuous conductive layer is constructed using a metal layer, creating a synergistic attenuation path of electromagnetic wave reflection, absorption, and re-reflection, thus providing electromagnetic shielding capabilities.

[0003] Currently, the surface metallization coating technology for PEEK materials is developing rapidly, and various coating processes have been formed, including electroplating, vacuum evaporation, and magnetron sputtering. PEEK surface metallization technology mainly relies on physical modification or surface coating processes. For example, CN115368592A uses carbon-based fillers to improve conductivity, while CN118632478A constructs a three-dimensional metal-carbon network. However, these methods have drawbacks such as weak coating adhesion. Insufficient coating adhesion is actually a result of physical adsorption between the metal coating and the substrate material. For example, the carbon-based fillers used in the former (carbon fiber, graphene, etc.) only improve conductivity through physical dispersion and cannot form chemical bonds with the substrate, causing the metal coating to easily peel off under thermal stress. The process is complex and damages the substrate. The latter requires multiple steps of chemical nickel plating, which easily corrodes the PEEK substrate in strong acid / alkali environments, and the three-dimensional network structure is easily destroyed during high-temperature pressing. The carbon fillers used need to be added at a high amount of 10-20wt%, which leads to increased material density and decreased impact strength. It is impossible to achieve both lightweight and electromagnetic shielding effects because the interface between the metal coating and the substrate is mainly based on physical adsorption, which is prone to blistering and failure in extreme environments such as space. Summary of the Invention

[0004] The purpose of this invention is to address the weak adhesion of metallized coatings on PEEK materials by providing a laser-induced surface metallized glass fiber reinforced polyether ether ketone (PEEK) modified material and its preparation method. This involves adding a Cu-Ni coordination compound to the PEEK modified material, then using a laser of a specific wavelength to induce the PEEK modified material to obtain reduced monovalent copper or nickel ions on its surface. These ions are then catalytically reduced to metal atoms through an electroplating process, allowing the metal layer to embed into the PEEK substrate, thereby improving the bonding strength between the metal coating and the PEEK substrate.

[0005] To achieve the above objectives, the present invention proposes the following technical solution:

[0006] A laser-induced surface metallized glass fiber reinforced polyetheretherketone modified material, comprising the following components in weight percent:

[0007]

[0008] The Cu-Ni coordination compound is laser-induced to generate Cu. + with Ni + Ions are used to be reduced to metal atoms in the electroplating process and embedded in the matrix formed by the PEEK resin to form an embedded conductive layer.

[0009] As a preferred embodiment of the present invention, the PEEK resin has a melt index ≥5g / 10min at 400℃ and 2.16Kg.

[0010] As a preferred embodiment of the present invention, the low-dielectric flat glass fiber has an aspect ratio ≥3 and a dielectric constant ≤4.51GHz.

[0011] As a preferred embodiment of the present invention, the low dielectric filler is one or more composites of hollow glass microspheres, cage-shaped polysilsesquioxane and porous silica, and its dielectric constant is ≤21GHz.

[0012] As a preferred embodiment of the present invention, the Cu-Ni coordination compound is a Cu-Ni complex assembled from Schiff base ligands. 2 + -Ni 2+ Binuclear complex.

[0013] As a preferred embodiment of the present invention, the antioxidant is a compound of high-temperature resistant antioxidant GA-80 and TP-D, wherein the ratio of GA-80 to TP-D is 1:1 to 1:2.

[0014] This invention also provides a method for preparing a laser-induced surface-metallized glass fiber reinforced polyether ether ketone modified material, comprising the following steps:

[0015] First, a high-filler PEEK masterbatch with a content of 60% to 80% is prepared from a portion of the PEEK resin, all of the low dielectric filler and all of the Cu-Ni coordination compound;

[0016] Then, the high-filled PEEK masterbatch is added to the extruder through the first side feed port, all of the low-dielectric flat glass fibers are added to the extruder through the second side feed port, and the remaining PEEK resin and all of the antioxidants are added to the extruder through the main feed port.

[0017] Finally, the material is plasticized, extruded, and pelletized using an extruder to obtain the modified material.

[0018] As a preferred embodiment of the present invention, the temperatures of each zone of the extruder are set as follows: Zone 1 temperature 200-220℃; Zones 2 to 5 temperature 350-400℃; Zones 6 to 10 temperature 360-390℃; and Die head temperature 380-400℃.

[0019] As can be seen from the above technical solutions, the technical solution of the present invention provides a laser-induced surface metallized glass fiber reinforced polyether ether ketone modified material and its preparation method, which has the following advantages compared with the prior art:

[0020] (1) In this invention, Cu(II)-Ni(II) coordination compounds are incorporated into PEEK materials. Under the induction of laser light at a specific wavelength (e.g., around 980-1064 nm), the Cu-Ni bonds in the surface layer of the PEEK material break, and Cu... 2+ and Ni 2+ Reduced to Cu + with Ni + It also possesses a certain degree of reducing properties; then, it undergoes an electroplating process in an electroplating solution containing copper or nickel ions to modify the Cu on the surface of the PEEK material. + with Ni + The atoms are further reduced to Cu or Ni atoms to form a bottom copper or nickel layer. Finally, other metal layers are electroplated onto this bottom copper or nickel layer. This process, through ion reduction, allows metal atoms to embed into the gaps between PEEK molecular chains, forming a riveted interface structure. This allows the metal coating to adhere tightly to the PEEK substrate surface, significantly improving the surface adhesion of the metal coating. Laser-induced plating is a dry process, avoiding corrosion of PEEK by strong acids / bases. Furthermore, the relatively small amount of Cu(II)-Ni(II) coordination compound incorporated maintains a low dielectric constant while avoiding the toughness loss caused by high filler content.

[0021] (2) The flat glass fiber reinforced PEEK material prepared by the present invention has better impact strength and can also reduce warping deformation in thin-wall forming, and can be used to prepare communication components with high precision dimensional requirements.

[0022] (3) Low dielectric materials replace conductive functions with dielectric functions. Their insulation provides a pure carrier for Cu-Ni metallization layers, their wave transmission preserves the channel for signal transmission, and their thermal stability protects laser activation, enabling materials to overcome the technical contradiction of being unable to achieve both lightweight and high performance.

[0023] (4) Using a mixer to prepare high-filled PEEK masterbatch can achieve uniform distribution and dispersion of powder additives, effectively solving the problems of low dielectric powder fillers such as glass microspheres and mesoporous silica being difficult to disperse, easy to separate and generate dust during extrusion and injection molding, ensuring that the effects of additives in the product can be fully utilized, and improving the quality stability and durability of the product.

[0024] It should be understood that all combinations of the foregoing concepts and the additional concepts described in more detail below can be considered part of the inventive subject matter of this disclosure, provided that such concepts do not contradict each other. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this invention pertains.

[0026] The terms "first," "second," and similar words used in the specification and claims of this patent application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, unless the context clearly indicates otherwise, the singular forms of "an," "a," or "the," etc., do not indicate a quantity limitation, but rather indicate the presence of at least one. Terms such as "comprising" or "including" mean that the element or object preceding "comprising" encompasses the features, integrals, steps, operations, elements, and / or components listed following "comprising" or "including," and do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof.

[0027] To address the shortcomings of current PEEK material surface metallization coating technology, such as weak coating adhesion, which is particularly problematic in harsh environments like space where blistering and coating detachment can easily occur, affecting signal transmission and reducing communication efficiency, this invention discloses a laser-induced surface metallization glass fiber reinforced polyether ether ketone modified material and its preparation method.

[0028] The modified material of the present invention is composed of the following components:

[0029]

[0030] The percentage of each component is calculated as follows: the minimum proportion of low-dielectric flat glass fiber, low-dielectric filler, Cu-Ni coordination compound, and antioxidant plus the maximum proportion of PEEK resin equals 100%, and the maximum proportion of the above fillers plus the minimum proportion of PEEK resin equals 100%.

[0031] The Cu-Ni coordination compound is laser-induced to generate Cu + with Ni + Ions are used to be reduced to metal atoms in the electroplating process and embedded in the matrix formed by the PEEK resin to form an embedded conductive layer.

[0032] The PEEK resin used is a resin with a melt index ≥ 5 g / 10 min at 400℃ and 2.16 kg.

[0033] Among them, the low-dielectric flat glass fiber has an aspect ratio ≥3 and a dielectric constant ≤4.5 (1GHz).

[0034] The low dielectric filler is one or more composites of hollow glass microspheres, cage-shaped polysilsesquioxane and porous silica, with a dielectric constant ≤2 (1GHz).

[0035] Low-dielectric materials (dielectric constant ≤ 4.5) possess electromagnetic wave penetrability close to that of air, allowing laser energy to penetrate glass fibers and fillers with an efficiency > 95%, precisely focusing on Cu-Ni coordination compounds. If carbon-based materials (e.g., dielectric constant > 10) are used, their conductive networks absorb more than 50% of the laser energy, causing the Cu-Ni coordination compounds to activate and fail due to insufficient energy. The low-dielectric filler exhibits signal loss < 0.1 dB / cm in the 1-10 GHz frequency band, only one-tenth that of carbon fibers. This characteristic provides a "transparent channel" for communication equipment, while the strong reflective properties of carbon-based materials interfere with high-frequency signal transmission, causing signal distortion.

[0036] Furthermore, the insulating properties of low-dielectric materials block the current path, preventing laser energy from being consumed by non-target components; simultaneously, their high-temperature resistance protects the structural integrity of the Cu-Ni coordination compound during processing. If carbon-based materials are used, their conductivity will trigger a local arcing effect, not only ablating the PEEK matrix but also causing the Cu-Ni coordination compound to decompose prematurely and become inactive.

[0037] Among them, the Cu-Ni coordination compound is a Cu(II)-Ni(II) binuclear complex assembled from Schiff base ligands. This Schiff base ligand structure contains N and O electron-donating groups, assembling Cu... 2+ -Ni 2+ With a dual-core center, laser energy is targeted at the metal-coordination bonds (non-PEEK main chain), Cu 2+ →Cu + (Laser-induced) → Cu 0 (Electroplation reduction), Ni 2+ Simultaneous reduction and bimetallic synergy lower the reduction potential; atomic Cu / Ni with a diameter of <0.3nm are embedded in the amorphous region of PEEK and form COM covalent bonds with the matrix formed by PEEK, thereby significantly improving the peel strength of the material.

[0038] This invention utilizes low-dielectric-constant fillers (such as porous silica) and low-dielectric-constant flat glass fibers to form a signal transparency window, significantly reducing transmission loss of 1-10GHz high-frequency communication signals. A Cu-Ni coordination compound is laser-induced to generate a nano-copper-nickel metal layer, producing broadband (>35dB) shielding effectiveness in the same frequency band. The low-dielectric component allows useful signals to penetrate without loss, while the Cu-Ni metal layer selectively shields interfering electromagnetic waves, achieving both penetration and effective frequency domain zoning management.

[0039] The antioxidant is a blend of high-temperature resistant antioxidant GA-80 and TP-D, with a ratio of 1:1 to 1:2. In the laser-induced metallization PEEK system, the blend of antioxidant GA-80 and TP-D ensures the long-term stability of electromagnetic shielding effectiveness through a triple protection path, mainly as follows:

[0040] First, it blocks free radical chain reactions, ensuring the activity of Cu-Ni complexes. During high-temperature processing, PEEK resin generates alkyl radicals (R·), which attack the N=C bonds of the Cu-Ni Schiff base ligands. Hindered phenolic GA-80 provides hydrogen atoms to annihilate these radicals (R· + ArOH → RH + ArO·), while phosphite-type TP-D decomposes hydroperoxides (ROOH + P(OR')3 → ROH + O = P(OR')3), thus ensuring the activity of Cu-Ni complexes. + with Ni + The reducing properties of Cu. Without the addition of antioxidants, Cu... + with Ni + It is easily oxidized during processing or laser induction, which reduces the activity of Cu-Ni coordination compounds.

[0041] Second, it inhibits the degradation of dielectric properties and maintains the signal transmission channel. PEEK oxidation produces quinone structures and carboxylic acid groups, which increases the dielectric constant. At this time, antioxidants in the material can play a repair role. For example, phosphate esters from TP-O decomposition coat the oxidation sites, forming POC bonds, which block polar groups from water molecules.

[0042] Third, it enhances the stability of the interface structure and prevents stress cracking. Oxidation of the traditional PEEK substrate can generate microcracks, which become the starting point for coating peeling. Antioxidants can improve the toughness of the substrate; for example, the flexible long chains of GA-80 intercalate into the PEEK molecular chains, increasing the elongation at break and improving the heat resistance of the coating-substrate interface, ensuring the integrity of the coating interface.

[0043] The preparation method of the laser-induced surface metallized glass fiber reinforced polyether ether ketone modified material of the present invention is carried out according to the following steps:

[0044] (1) Raw material preparation: Weigh each raw material according to its weight fraction;

[0045] (2) Preparation of high-filled PEEK masterbatch: After mixing a portion of PEEK resin, all low dielectric filler and all Cu-Ni coordination compound evenly, the mixture is put into an internal mixer for internal mixing. The internal mixer temperature is 360~400℃ and the mixing time is 5±2 minutes.

[0046] (3) Masterbatch drying: The obtained high-filled PEEK masterbatch is dried at 140℃ for 3 to 5 hours;

[0047] (4) Extrusion granulation: The remaining PEEK resin and all antioxidants are added to the twin-screw extruder through the main feed port, all high-filled PEEK masterbatch is added to the twin-screw extruder through the first side feed port, and all low-dielectric flat glass fibers are added to the twin-screw extruder through the second side feed port. After plasticization, the materials are extruded and pulverized to obtain the laser-induced surface metallized glass fiber reinforced polyether ether ketone modified material disclosed in this invention.

[0048] The temperature settings for each zone of the twin-screw extruder are as follows: Zone 1: 200-220℃; Zones 2 to 5: 350-400℃; Zones 6 to 10: 360-390℃; Die head: 380-400℃.

[0049] In preparing the modified material, this invention first prepares a highly filled PEEK masterbatch. A Cu-Ni coordination compound and a low-dielectric filler are then pre-blended and encapsulated in PEEK resin to form a core-shell structure. The core layer of the Cu-Ni coordination compound is physically confined by the low-dielectric filler, while the shell layer is covered by the PEEK melt, isolating it from screw shearing. This solves the problem of ligand structure crushing and metal ion agglomeration that occurs when Cu-Ni coordination compounds are directly blended with glass fibers under screw shearing force.

[0050] The present invention uses low dielectric flat glass fiber, which will break into short fibers if added directly to the high shear zone of the screw. By introducing it independently from the second side feed port, avoiding the high shear zone, it can retain its length and maintain a stable dielectric constant.

[0051] Example 1

[0052] This Example 1 consists of the following raw materials and their weight proportions:

[0053] 58.5 parts of PEEK resin, 30 parts of low dielectric flat glass fiber (flatness ratio = 3), 5 parts of low dielectric filler (hollow glass microspheres, particle size 50μm), 6 parts of Cu-Ni coordination compound, and 0.5 parts of antioxidant (GA-80:TP-D = 1:1).

[0054] Its preparation method is as follows:

[0055] (1) Raw material preparation: Weigh out each type of raw material according to the weight proportions;

[0056] (2) Preparation of high-filled PEEK masterbatch: A portion of PEEK resin, low dielectric filler and Cu-Ni coordination compound are mixed and then fed into an internal mixer for internal mixing. The internal mixer temperature is 380℃ and the mixing time is 5 minutes.

[0057] (3) Masterbatch drying: Dry the high-filled PEEK masterbatch at 140℃ for 3 hours;

[0058] (4) Extrusion Granulation: The remaining PEEK resin and all antioxidants are added to the twin-screw extruder through the main feed port. The high-filled PEEK masterbatch is added to the twin-screw extruder through the first side feed port. All low-dielectric flat glass fibers are added to the twin-screw extruder through the second side feed port. After plasticization, the extruder is traction-cut into pellets to obtain the modified material. The temperature settings for each zone of the twin-screw extruder are as follows: Zone 1: 200℃; Zones 2 to 5: 350–400℃; Zones 6 to 10: 360–390℃; Die temperature: 380℃.

[0059] Example 2

[0060] This embodiment 2 consists of the following raw materials and their weight proportions:

[0061] 53.3 parts of PEEK resin, 30 parts of low dielectric flat glass fiber (flatness ratio = 5), 8 parts of low dielectric filler (porous silica, particle size 5μm), 8 parts of Cu-Ni coordination compound, and 0.7 parts of antioxidant (GA-80:TP-D = 1:1.2).

[0062] The preparation method is the same as in Example 1.

[0063] Example 3

[0064] This embodiment 3 consists of the following raw materials and their weight proportions:

[0065] 46.3 parts of PEEK resin, 40 parts of low dielectric flat glass fiber (flatness ratio = 4), 5 parts of low dielectric filler (hollow glass microspheres, particle size 50μm), 8 parts of Cu-Ni coordination compound, and 0.8 parts of antioxidant (GA-80:TP-D = 1:1.5).

[0066] The preparation of its low-dielectric PEEK masterbatch is the same as that in Example 1.

[0067] The temperature settings for each zone of the twin-screw extruder are as follows: Zone 1 temperature 210℃; Zones 2 to 5 temperatures 350–400℃; Zones 6 to 10 temperatures 360–390℃; Die temperature 400℃; the rest are the same as in Example 1.

[0068] Comparative Example 1

[0069] Comparative Example 1 uses ordinary glass fiber, and the composition / amount of other raw materials is the same as that of Example 1, and the same preparation method is used as that of Example 1.

[0070] Comparative Example 2

[0071] In Comparative Example 2, except for the absence of Cu(II)-Ni(II) coordination compound, the composition / amount of the other raw materials were the same as in Example 1, and the same preparation method was used as in Example 1.

[0072] Comparative Example 3

[0073] The formulation composition is the same as in Example 1, except that in Comparative Example 3, each raw material was first weighed according to its weight percentage. Then, PEEK resin, low-dielectric filler, Cu-Ni coordination compound, and antioxidant were mixed at high speed and added to a twin-screw extruder through the main feed port. Low-dielectric flat glass fiber was added to the twin-screw extruder through the second side feed port. After plasticization, the mixture was extruded and pulverized to obtain the modified material. The temperatures of each zone of the twin-screw extruder were set as follows: Zone 1: 200–220°C; Zones 2 to 5: 350–400°C; Zones 6 to 10: 360–390°C; and the die head temperature: 380–400°C.

[0074] The relevant properties of the materials prepared in each embodiment and comparative example of the present invention are shown in Table 1.

[0075] Table 1 Performance Test Results

[0076]

[0077] Note: The dielectric constant of the embodiments and comparative examples of this invention is tested at a frequency of 1MHz.

[0078] The testing method for coating adhesion in the embodiments and comparative examples of the present invention is as follows: The materials prepared in each embodiment and comparative example are injection molded into standard samples with specifications of 100*100*3mm. The surface of the sample is treated with a laser with a wavelength of about 1μm, and then a copper layer or nickel layer is plated on its surface using electroplating technology, with a coating thickness of 10μm.

[0079] Comparing the test results of Example 1 and Comparative Example 1, it can be seen that the mechanical properties and dielectric constant of the low-dielectric flat glass fiber reinforced PEEK material are superior to those of ordinary glass fiber reinforced PEEK. Furthermore, the flat glass fiber reinforced PEEK material exhibits lower warpage and better dimensional stability, making it suitable for molding parts with high precision dimensional requirements. Comparing the test results of Example 1 and Comparative Example 3, it can be seen that the mechanical and dielectric properties of the modified material produced using the side-feeding method with flat glass fiber and low-dielectric PEEK masterbatch are also superior to those of ordinary processing methods. Comparing the test results of Example 1 and Comparative Example 2, it can be seen that the addition of Cu-Ni coordination compounds significantly improves the adhesion of the coating. Therefore, the flat glass fiber reinforced PEEK material prepared by the method of this invention not only has good mechanical properties, low dielectric constant and dielectric loss, but also high adhesion of the metallized coating, making it a viable alternative to metal-based communication products to meet the demand for lightweight development.

[0080] While the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A laser-induced surface-metallized glass fiber reinforced polyetheretherketone modified material, characterized in that, The following components are expressed in weight fractions. composition: The Cu-Ni coordination compound is laser-induced to generate Cu. + with Ni + Ions are used to be reduced to metal atoms in the electroplating process and embedded in the matrix formed by the PEEK resin to form an embedded conductive layer.

2. The laser-induced surface metallized glass fiber reinforced polyetheretherketone modified material as described in claim 1, characterized in that, The PEEK resin has a melt flow index ≥5 g / 10 min at 400℃ and 2.16 kg.

3. The laser-induced surface metallized glass fiber reinforced polyetheretherketone modified material as described in claim 1, characterized in that, The low-dielectric flat glass fiber has an aspect ratio ≥3 and a dielectric constant ≤4.51GHz.

4. The laser-induced surface metallized glass fiber reinforced polyetheretherketone modified material as described in claim 1, characterized in that, The low dielectric filler is one or more composites of hollow glass microspheres, cage-shaped polysilsesquioxane and porous silica, with a dielectric constant ≤21GHz.

5. The laser-induced surface metallized glass fiber reinforced polyetheretherketone modified material as described in claim 1, characterized in that, The Cu-Ni coordination compound is a Cu assembled from Schiff base ligands. 2+ -Ni 2+ Binuclear complex.

6. The laser-induced surface metallized glass fiber reinforced polyetheretherketone modified material as described in claim 1, characterized in that, The antioxidant is a compound of high-temperature resistant antioxidant GA-80 and TP-D, and the ratio of GA-80 to TP-D is 1:1 to 1:

2.

7. A method for preparing a laser-induced surface metallized glass fiber reinforced polyetheretherketone modified material as described in any one of claims 1 to 6, characterized in that, Includes the following steps: First, a high-filler PEEK masterbatch with a content of 60% to 80% is prepared from a portion of the PEEK resin, all of the low dielectric filler and all of the Cu-Ni coordination compound; Then, the high-filled PEEK masterbatch is added to the extruder through the first side feed port, all of the low-dielectric flat glass fibers are added to the extruder through the second side feed port, and the remaining PEEK resin and all of the antioxidants are added to the extruder through the main feed port. Finally, the material is plasticized, extruded, and pelletized using an extruder to obtain the modified material.

8. The method for preparing the laser-induced surface metallized glass fiber reinforced polyetheretherketone modified material as described in claim 7, characterized in that, The temperature settings for each zone of the extruder are as follows: Zone 1 temperature 200-220℃; Zones 2 to 5 temperature 350-400℃; Zones 6 to 10 temperature 360-390℃; Die head temperature 380-400℃.

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