Waste gas treatment method and system

Abstract

The waste gas treatment method comprises the following steps: according to the concentration of target gas collected by a first collector and the concentrations of methane and hydrogen collected by a second collector, adjusting the concentrations of methane and air to a first target concentration, the first target concentration is matched with the concentration of the target gas; according to the concentration, collected by the fourth collector, of the target gas, whether the concentration meets a preset condition or not is judged, and the input air concentration is regulated and controlled according to the preset condition. The concentration of the nitrogen oxide is matched by dynamically adjusting the concentration of the methane and the air, and an efficient reaction system for reducing the nitrogen oxide by the methane can be constructed in a plasma reaction zone under the condition of no adsorbent, catalyst or reducing agent. Methane and nitric oxide are enabled to fully react in a plasma environment, and reduction removal of the nitric oxide is directly realized.

Description

Technical Field

[0001] This invention relates to the field of waste gas treatment, and more specifically, to a waste gas treatment method and system. Background Technology

[0002] Plasma equipment is widely used in the treatment of semiconductor fluoride waste gases (such as CF4 and SF6, which are difficult to remove by combustion; plasma technology is considered the preferred technology for future hazardous waste gas treatment). These waste gases also contain N2 and O2, and their high-temperature reactions generate NOx byproducts, leading to secondary pollution. Traditional NOx control requires the addition of alkaline reagents (such as alkaline scrubbing towers) or catalysts. However, semiconductor factories lack the facilities for storing or transporting alkaline reagents in their waste gas treatment spaces. Furthermore, plasma equipment used for waste gas treatment typically includes a high-temperature plasma reaction chamber and a high-humidity spray chamber, making it difficult to sustain catalyst use within the plasma equipment for extended periods.

[0003] Therefore, there is an urgent need for a high-efficiency, low-cost solution for reducing nitrogen oxide emissions from plasma equipment that does not rely on alkaline washing, does not require additional floor space, and is efficient. Summary of the Invention

[0004] The purpose of this invention is to provide a waste gas treatment method and system that can reduce nitrogen oxide emissions without relying on alkaline scrubbing.

[0005] The embodiments of the present invention are implemented as follows: In a first aspect, an embodiment of this application provides a waste gas treatment method applied to a control device of a waste gas treatment system. The waste gas treatment system further includes a treatment device and a collection component. A first collector of the collection component is used to collect the concentration of a target gas in the waste gas input to the treatment device. A second collector of the collection component is used to collect the concentrations of methane and hydrogen input to the treatment device. A third collector of the collection component is used to collect the concentration of air input to the treatment device. A fourth collector of the collection component is used to collect the concentration of the target gas in the waste gas output from the treatment device. The method includes: Based on the concentration of the target gas collected by the first collector and the concentrations of methane and hydrogen collected by the second collector, the concentrations of methane and air are adjusted to a first target concentration, wherein the first target concentration matches the concentration of the target gas. Based on the concentration of the target gas collected by the fourth collector, it is determined whether the concentration meets the preset conditions, and the input air concentration is adjusted according to the preset conditions.

[0006] In some possible implementations, determining whether the concentration of the target gas collected by the fourth collector meets a preset condition, and adjusting the input air concentration according to the preset condition, includes: Based on the concentration of the target gas collected by the fourth collector, it is determined whether the concentration exceeds the second target concentration; if it does, the increment of the input air is calculated based on the concentration of the air collected by the third collector and the target air concentration that matches the concentration; if it does not exceed the target concentration, the input air concentration is kept unchanged.

[0007] Secondly, an exhaust gas treatment system according to an embodiment of this application includes: The processing device includes an input of waste gas, methane and hydrogen, and air, and an output of processed waste gas. A first collector of the acquisition component is used to collect the concentration of the target gas in the waste gas input to the processing device; a second collector of the acquisition component is used to collect the concentration of methane and hydrogen input to the processing device; a third collector of the acquisition component is used to collect the concentration of air input to the processing device; and a fourth collector of the acquisition component is used to collect the concentration of the target gas in the waste gas output from the processing device. The acquisition component includes a first collector, a second collector, a third collector, and a fourth collector; the first collector is used to acquire the concentration of the target gas in the input exhaust gas, the second collector is used to acquire the concentration of methane and hydrogen, the third collector is used to acquire the concentration of air, and the fourth collector is used to acquire the concentration of the target gas in the output exhaust gas. A control device is configured to: adjust the concentration of methane and air to a first target concentration based on the concentration of the target gas collected by the first collector and the concentrations of methane and hydrogen collected by the second collector, wherein the first target concentration matches the concentration of the target gas; and determine whether the concentration of the target gas collected by the fourth collector meets a preset condition, and adjust the input air concentration according to the preset condition.

[0008] In some possible implementations, the exhaust gas treatment system further includes a piping assembly; the first, second, and third pipes of the piping assembly are respectively used to input exhaust gas, methane and hydrogen, and air into the treatment device; the fourth pipe of the piping assembly is used to output the treated exhaust gas; the first, second, third, and fourth pipes are respectively provided with a first valve body, a second valve body, a third valve body, and a fourth valve body.

[0009] In some possible implementations, the processing apparatus includes a plasma reactor, the piping assembly further includes a fifth piping, and the collection assembly further includes a fifth collector; A plasma torch is installed on one side of the plasma reactor, the second pipe is used to input nitrogen gas into the plasma torch, and the fifth collector is used to collect the concentration of the nitrogen gas. In some possible implementations, a cold wall structure is provided on the outer wall of the top of the plasma reactor, and the third pipe is connected to the outer wall of the bottom of the plasma reactor. In some possible implementations, the processing apparatus further includes a gas mixing container connected to the top of the plasma reactor, and the first pipe and the second pipe are respectively connected to the gas mixing container.

[0010] In some possible implementations, the processing apparatus further includes a water tank, the bottom of which is in communication with the plasma reactor, and the water tank is also connected to the fourth pipe.

[0011] In some possible implementations, a spray device is provided at at least two locations of the water tank; wherein, the first location is the connection between the water tank and the plasma reactor, and the second location is the connection between the water tank and the fourth pipe.

[0012] In some possible implementations, a temperature sensor is also provided on the fourth pipe for collecting the temperature of the output gas, and the control device is used to adjust the flow rate of the cold wall structure based on the temperature information.

[0013] The beneficial effects of this invention are as follows: By dynamically adjusting the concentrations of methane and air to match the concentration of nitrogen oxides, a highly efficient reaction system for the reduction of nitrogen oxides by methane can be constructed in the plasma reaction zone without adsorbents, catalysts, or reducing agents. Through closed-loop control at the input and output ends, the reaction between methane and nitrogen oxides is ensured to be fully realized in the plasma environment, directly achieving the reduction and removal of nitrogen oxides. This overcomes the technical bottleneck of existing technologies where direct reduction is difficult without additional additives, thus improving the economic and environmental benefits of nitrogen oxide treatment. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall waste gas treatment system according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the treatment device of the waste gas treatment system according to an embodiment of the present invention; Figure 3 This is an overall flowchart of the waste gas treatment method according to an embodiment of the present invention; Figure 4 This is a control logic diagram of the waste gas treatment method according to an embodiment of the present invention; Figure 5 This is a flowchart of one embodiment of the waste gas treatment method of the present invention.

[0016] Icons: 11. First pipe; 12. Second pipe; 13. Third pipe; 14. Fourth pipe; 15. Fifth pipe; 21. First collector; 22. Second collector; 23. Third collector; 24. Fourth collector; 25. Fifth collector; 26. Temperature collector; 3. Plasma reactor; 31. Plasma torch; 4. Water tank; 5. Spray device; 6. Mixing container. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0018] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0019] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0020] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but can be slightly tilted.

[0022] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] First Embodiment refer to Figures 1 to 5 This embodiment provides a waste gas treatment method applied to a control device of a waste gas treatment system. The waste gas treatment system further includes a treatment device and a collection component. A first collector 21 of the collection component is used to collect the concentration of the target gas (taking nitrogen oxides as an example) in the waste gas input to the treatment device. A second collector 22 of the collection component is used to collect the concentrations of methane and hydrogen input to the treatment device. A third collector 23 of the collection component is used to collect the concentration of air input to the treatment device. A fourth collector 24 of the collection component is used to collect the concentration of the target gas in the waste gas output to the treatment device. The method includes: Step S10: Based on the concentration of the target gas collected by the first collector 21 and the concentrations of methane and hydrogen collected by the second collector 22, adjust the concentrations of methane and air to the first target concentration, wherein the first target concentration matches the concentration of the target gas. Step S20: Based on the concentration of the target gas collected by the fourth collector 24, determine whether the concentration meets the preset conditions, and adjust the input air concentration according to the preset conditions.

[0024] In conjunction with the above embodiments, each collector in the acquisition component accurately collects data on gases such as nitrogen oxides, methane, and air. The nitrogen oxide concentration data of the first collector 21 is directly correlated with the methane concentration data of the second collector 22. By adjusting the methane and air concentrations to a first target concentration that matches the nitrogen oxide concentration, a suitable reaction environment (such as a reasonable carbon-nitrogen ratio and oxygen content) can be created within the plasma reaction zone for the reduction of nitrogen oxides by methane. The fourth collector 24 monitors the output nitrogen oxides and can provide real-time feedback on the reduction effect. The control device adjusts the air concentration accordingly to optimize the reaction conditions, solving the efficiency and stability problem of direct reduction of nitrogen oxides by methane without additional additives.

[0025] By dynamically adjusting the concentrations of methane and air to match the concentration of nitrogen oxides, a highly efficient reaction system for the reduction of nitrogen oxides by methane can be constructed in the plasma reaction zone without adsorbents, catalysts, or reducing agents. Closed-loop control at both the input and output ends ensures that methane and nitrogen oxides react fully in the plasma environment, directly achieving the reduction and removal of nitrogen oxides. This overcomes the technical bottleneck of existing technologies that struggle to directly reduce nitrogen oxides without additional additives, thus improving the economic and environmental benefits of nitrogen oxide treatment.

[0026] Furthermore, based on the concentration of the target gas collected by the fourth collector 24, it is determined whether the concentration meets the preset conditions, and the input air concentration is adjusted according to the preset conditions, including: Step S201: Based on the concentration of the target gas collected by the fourth collector 24, determine whether the concentration exceeds the second target concentration (50 mg / m³). Step S202: If the concentration exceeds the limit, calculate the increment of the input air based on the air concentration collected by the third collector 23 and the target air concentration that matches the concentration; if the concentration does not exceed the limit, keep the input air concentration unchanged.

[0027] Based on the above embodiments, the output nitrogen oxide concentration collected by the fourth collector 24 reflects the degree of combustion of the exhaust gas. The second target concentration is the critical value for nitrogen oxide emissions to meet standards (generally 50 mg / m³). When the concentration exceeds the limit, the increment is calculated by combining the current air concentration from the third collector 23. The oxygen content in the plasma reaction zone can be optimized by adjusting the air volume (avoiding excessive oxygen inhibiting the reduction of nitrogen oxides by methane or insufficient oxygen leading to incomplete methane reaction), ensuring the continuous and efficient reduction reaction without additional additives. Maintaining a stable air concentration when the limit is not exceeded avoids the direct reaction between methane and nitrogen oxides caused by fluctuations in reaction conditions. By precisely controlling the air concentration, the problem of the sensitivity of the reaction environment to the reduction of nitrogen oxides by methane without additives is solved, ensuring that the oxygen content in the plasma reaction zone is always adapted to the reaction requirements of nitrogen oxides and methane, achieving efficient and direct reduction of nitrogen oxides, and ensuring that the nitrogen oxide concentration in the output gas remains stable and meets the standards.

[0028] Second Embodiment refer to Figures 1 to 5 An exhaust gas treatment system according to this embodiment includes: The processing device includes inputs of waste gas, methane and hydrogen, and air, and outputs processed waste gas. The first collector 21 of the collection component is used to collect the concentration of the target gas in the waste gas input to the processing device, the second collector 22 of the collection component is used to collect the concentration of methane and hydrogen input to the processing device, the third collector 23 of the collection component is used to collect the concentration of air input to the processing device, and the fourth collector 24 of the collection component is used to collect the concentration of the target gas in the waste gas output to the processing device. The acquisition component includes a first collector 21, a second collector, a third collector 23, and a fourth collector 24; the first collector 21 is used to acquire the concentration of the target gas in the input exhaust gas, the second collector 22 is used to acquire the concentration of methane and hydrogen, the third collector 23 is used to acquire the concentration of air, and the fourth collector 24 is used to acquire the concentration of the target gas in the output exhaust gas. The control device is used to adjust the concentration of methane and air to a first target concentration based on the concentration of the target gas collected by the first collector 21 and the concentrations of methane and hydrogen collected by the second collector 22, wherein the first target concentration matches the concentration of the target gas; and to determine whether the concentration of the target gas collected by the fourth collector 24 meets a preset condition, and to adjust the input air concentration according to the preset condition.

[0029] In conjunction with the above embodiments, each collector in the acquisition component accurately collects data on gases such as nitrogen oxides, methane, and air. The nitrogen oxide concentration data of the first collector 21 is directly correlated with the methane concentration data of the second collector 22. By adjusting the methane and air concentrations to a first target concentration that matches the nitrogen oxide concentration, a suitable reaction environment (such as a reasonable carbon-nitrogen ratio and oxygen content) can be created within the plasma reaction zone for the reduction of nitrogen oxides by methane. The fourth collector 24 monitors the output nitrogen oxides and can provide real-time feedback on the reduction effect. The control device adjusts the air concentration accordingly to optimize the reaction conditions, solving the efficiency and stability problem of direct reduction of nitrogen oxides by methane without additional additives.

[0030] By dynamically adjusting the concentrations of methane and air to match the concentration of nitrogen oxides, a highly efficient reaction system for the reduction of nitrogen oxides by methane can be constructed in the plasma reaction zone without adsorbents, catalysts, or reducing agents. Closed-loop control at both the input and output ends ensures that methane and nitrogen oxides react fully in the plasma environment, directly achieving the reduction and removal of nitrogen oxides. This overcomes the technical bottleneck of existing technologies that struggle to directly reduce nitrogen oxides without additional additives, thus improving the economic and environmental benefits of nitrogen oxide treatment.

[0031] In some embodiments, the exhaust gas treatment system further includes a piping assembly; the first pipe 11, the second pipe, and the third pipe 13 of the piping assembly are respectively used to input exhaust gas, methane and hydrogen, and air into the treatment device; the fourth pipe 14 of the piping assembly is used to output the treated exhaust gas; the first pipe 11, the second pipe, the third pipe 13, and the fourth pipe 14 are respectively provided with a first valve body, a second valve body, a third valve body, and a fourth valve body.

[0032] In conjunction with the above embodiments, the first pipeline 11 delivers nitrogen oxides in a directional manner, the second pipeline delivers methane and hydrogen, the third pipeline 13 delivers air, and the fourth pipeline 14 outputs the treated gas. The input amounts of methane and air can be dynamically adjusted according to the nitrogen oxide concentration (e.g., by controlling the flow rate through the valve opening), thereby precisely maintaining the ratio of methane to nitrogen oxides and the oxygen content in the reaction zone.

[0033] In some embodiments, the processing apparatus includes a plasma reactor 3, the piping assembly further includes a fifth pipe 15, and the collection assembly further includes a fifth collector 25; a plasma torch 31 is provided on one side of the plasma reactor 3, the second pipe is used to input nitrogen gas into the plasma torch 31, and the fifth collector 25 is used to collect the concentration of nitrogen gas.

[0034] In conjunction with the above embodiments, the plasma reactor 3 provides a plasma reaction field for the reduction of nitrogen oxides by methane, and the high-energy environment generated by the plasma torch 31 activates the reactivity of methane and nitrogen oxides (achieving chemical bond breaking and recombination without a catalyst). Nitrogen gas is supplied through a second pipeline to stabilize the combustion state of the plasma torch 31, ensuring the stability of the plasma environment; the fifth collector 25 monitors the nitrogen concentration to ensure the normal operation of the torch, indirectly maintaining the high-energy environment of the reaction zone and providing continuous energy support for the direct reduction of nitrogen oxides by methane without additives. Through the configuration of the plasma reactor 3 and the torch, the high-energy characteristics of plasma are utilized to activate the reaction, solving the problem of insufficient reactivity of methane and nitrogen oxides without a catalyst. The stable supply and monitoring of nitrogen gas ensure the continuity of the plasma environment, ensuring efficient reduction of nitrogen oxides by methane under high-energy conditions and improving the reaction efficiency of the additive-free system.

[0035] In some embodiments, a cold wall structure is provided on the outer wall of the top of the plasma reactor 3, and the third pipe 13 is connected to the outer wall of the bottom of the plasma reactor 3. The cold wall structure (which can be an air-cooled or water-cooled jacket) is provided on the outer wall of the bottom of the reactor, which can reduce the temperature at the bottom of the reactor and cool the reaction chamber. Therefore, the temperature in the lower part of the reaction chamber is reduced. Air is introduced into the low-temperature zone (since air contains a large amount of nitrogen and oxygen, the temperature at which thermal nitrogen oxides are formed is >1000°C, i.e., the high-temperature zone) to prevent the formation of more nitrogen oxides and to oxidize CH4 and CO, etc., which are involved. It can also play a dilution role and further dilute the waste gas. The waste gas after complete reaction is further cooled and absorbed by spray water, and then discharged from the tail of the equipment to meet the emission requirements. A temperature sensor 26 is also provided on the fourth pipe 14. The temperature sensor 26 is used to collect the temperature of the output gas. The control device is used to adjust the flow rate of the cold wall structure according to the temperature information, thereby adjusting the temperature of the discharged gas.

[0036] In some embodiments, the processing apparatus further includes a gas mixing container 6, which is connected to the top of the plasma reactor 3, and a first pipe 11 and a second pipe are respectively connected to the gas mixing container 6. Premixing ensures that methane and nitrogen oxides are evenly distributed before entering the reaction zone, allowing for rapid reduction under plasma conditions, thus improving the nitrogen oxide removal rate.

[0037] In some embodiments, the treatment apparatus further includes a water tank 4, with the bottom of the plasma reactor 3 connected to the water tank 4, and the water tank 4 also connected to a fourth pipe 14. A spray device 5 is installed at at least two locations on the water tank 4; the first location is the connection point between the water tank 4 and the plasma reactor 3, and the second location is the connection point between the water tank 4 and the fourth pipe 14. The spray device 5 enhances the purification capacity of the water tank 4 through physical washing, ensuring that the treated gas meets emission standards without the addition of chemical adsorbents, supplementing the treatment effect of the plasma reaction zone, and improving the environmental friendliness of the additive-free system.

[0038] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for treating waste gas, characterized in that, A control device for an exhaust gas treatment system, the exhaust gas treatment system further comprising a treatment device and a collection component, wherein a first collector of the collection component is used to collect the concentration of a target gas in the exhaust gas input to the treatment device, a second collector of the collection component is used to collect the concentrations of methane and hydrogen input to the treatment device, a third collector of the collection component is used to collect the concentration of air input to the treatment device, and a fourth collector of the collection component is used to collect the concentration of the target gas in the exhaust gas output to the treatment device; the method includes: Based on the concentration of the target gas collected by the first collector and the concentrations of methane and hydrogen collected by the second collector, the concentrations of methane and air are adjusted to a first target concentration, wherein the first target concentration matches the concentration of the target gas. Based on the concentration of the target gas collected by the fourth collector, it is determined whether the concentration meets the preset conditions, and the input air concentration is adjusted according to the preset conditions.

2. The waste gas treatment method according to claim 1, characterized in that, The step of determining whether the concentration of the target gas collected by the fourth collector meets a preset condition, and adjusting the input air concentration according to the preset condition, includes: Based on the concentration of the target gas collected by the fourth collector, it is determined whether the concentration exceeds the second target concentration; if it does, the increment of the input air is calculated based on the concentration of the air collected by the third collector and the target air concentration that matches the concentration; if it does not exceed the target concentration, the input air concentration is kept unchanged.

3. A waste gas treatment system, characterized in that, include: The processing device includes an input of waste gas, methane and hydrogen, and air, and an output of processed waste gas. A first collector of the acquisition component is used to collect the concentration of the target gas in the waste gas input to the processing device; a second collector of the acquisition component is used to collect the concentration of methane and hydrogen input to the processing device; a third collector of the acquisition component is used to collect the concentration of air input to the processing device; and a fourth collector of the acquisition component is used to collect the concentration of the target gas in the waste gas output from the processing device. The acquisition component includes a first collector, a second collector, a third collector, and a fourth collector; the first collector is used to acquire the concentration of the target gas in the input exhaust gas, the second collector is used to acquire the concentration of methane and hydrogen, the third collector is used to acquire the concentration of air, and the fourth collector is used to acquire the concentration of the target gas in the output exhaust gas. A control device is configured to: adjust the concentration of methane and air to a first target concentration based on the concentration of the target gas collected by the first collector and the concentrations of methane and hydrogen collected by the second collector, wherein the first target concentration matches the concentration of the target gas; and determine whether the concentration of the target gas collected by the fourth collector meets a preset condition, and adjust the input air concentration according to the preset condition.

4. The waste gas treatment system according to claim 3, characterized in that, The exhaust gas treatment system further includes a pipeline assembly; the first, second, and third pipelines of the pipeline assembly are used to input exhaust gas, methane and hydrogen, and air into the treatment device, respectively; the fourth pipeline of the pipeline assembly is used to output the treated exhaust gas; the first, second, third, and fourth pipelines are respectively equipped with a first valve body, a second valve body, a third valve body, and a fourth valve body.

5. The waste gas treatment system according to claim 4, characterized in that, The processing device includes a plasma reactor, the pipeline assembly further includes a fifth pipeline, and the collection assembly further includes a fifth collector. A plasma torch is installed on one side of the plasma reactor, the second pipe is used to input nitrogen gas into the plasma torch, and the fifth collector is used to collect the concentration of the nitrogen gas.

6. The waste gas treatment system according to claim 4, characterized in that, A cold wall structure is provided on the outer wall of the top of the plasma reactor, and the third pipe is connected to the outer wall of the bottom of the plasma reactor.

7. The waste gas treatment system according to claim 4, characterized in that, The processing apparatus further includes a gas mixing container, which is connected to the top of the plasma reactor, and the first pipe and the second pipe are respectively connected to the gas mixing container.

8. The waste gas treatment system according to claim 4, characterized in that, The processing device also includes a water tank, the bottom of the plasma reactor is connected to the water tank, and the water tank is also connected to the fourth pipe.

9. The waste gas treatment system according to claim 8, characterized in that, The water tank is equipped with a spray device at at least two locations; the first location is the connection between the water tank and the plasma reactor, and the second location is the connection between the water tank and the fourth pipe.

10. The waste gas treatment system according to claim 6, characterized in that, A temperature sensor is also installed on the fourth pipe. The temperature sensor is used to collect the temperature of the output gas, and the control device is used to adjust the flow rate of the cold wall structure according to the temperature information.

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