Production method of anti-falling combined type double-layer circuit board

Abstract

The invention discloses a production method of an anti-falling combined type double-layer circuit board, and relates to the technical field of production of combined type double-layer circuit boards, and the production method comprises the following steps: S1, milling an annular groove I in the bottom surface of a first circuit board; s2, an annular groove II is milled in the top surface of the second circuit board; s3, embedding the frame-shaped curing adhesive into the annular groove II of the second circuit board from top to bottom; s4, buckling the annular groove I of the first circuit board outside the upper half part of the frame-shaped curing adhesive from top to bottom; s5, taking out one stent; s6, enabling the exposed part of the protection plate to be tightly attached to the bottom surface of the second circuit board; s7, the exposed part of the protection plate is tightly attached to the outer side wall of the strip-shaped through groove; s8, the two exposed parts of the support are supported on the table top of the machine table; and S9, after the pressure is maintained for a period of time, a first combined double-layer circuit board B can be finally produced. The method has the beneficial effect that the production quality of the combined double-layer circuit board is improved.

Description

Technical Field

[0001] This invention relates to the technical field of producing composite double-layer circuit boards, and in particular to a method for producing a composite double-layer circuit board that prevents it from falling off. Background Technology

[0002] The structure of a combined double-layer circuit board A produced in a certain workshop is as follows: Figure 1 As shown, it includes a first circuit board 1 and a second circuit board 2, with a connecting adhesive layer A3 formed between the first circuit board 1 and the second circuit board 2. A circuit layer is formed on the top surface of the first circuit board 1 and the bottom surface of the second circuit board 2. This combined double-layer circuit board A is mainly used for installation inside a control box. The circuit layer is electrically connected to the various actuators of the machine tool to control the operation of these actuators.

[0003] The method by which the workers in the workshop produce this type of combined double-layer circuit board A using the resources available in the workshop is as follows: S1. The worker takes out a second circuit board 2 and places it flat on the table surface of machine 4, as follows: Figure 2 As shown; S2. The worker takes out a curing film 5 and lays it flat on the top surface of the second circuit board 2, as shown. Figure 3 As shown; S3. The worker takes out a first circuit board 1 and places it on the top surface of the curing film 5, as shown. Figure 4 As shown, the first circuit board 1, the curing film 5, and the second circuit board 2 are stacked together; S4. The worker controls the hot press head 6 of the press to move downwards, so that the hot press head 6 presses against the top surface of the first circuit board 1, as shown. Figure 5 As shown, at this time, the heat from the hot press head 6 is transferred to the first circuit board 1, and the first circuit board 1 then transfers the heat to the curing film 5. When the curing film 5 is heated, it becomes a flowable connecting adhesive layer A6. The connecting adhesive layer A6 bonds and fixes the first circuit board 1 and the second circuit board 2 together. After holding the pressure for a period of time, the first combined double-layer circuit board A can be finally produced. The structure of the produced combined double-layer circuit board A is as follows: Figure 1 As shown; S5. Workers can continuously produce multiple combined double-layer circuit boards A by repeating steps S1 to S4 multiple times.

[0004] However, while the methods used in the workshop can produce usable combined double-layer circuit boards A, they still have the following technical shortcomings: I. The outer edge of the adhesive layer A3 of the combined double-layer circuit board A is exposed to the air. Therefore, after the combined double-layer circuit board A has been used for a long time, the adhesive layer A3 will fall off due to aging, which will cause the first circuit board 1 to fall off the second circuit board 2 naturally [while the process requires that the first circuit board 1 will not fall off the second circuit board 2 naturally after long-term use]. This undoubtedly reduces the production quality of the combined double-layer circuit board.

[0005] II. The operation of the machine tool will generate vibration. This vibration will cause the combined double-layer circuit board A installed in the control box to vibrate synchronously. The first circuit board 1 and the second circuit board 2 of the combined double-layer circuit board A can only be connected by a single connecting adhesive layer A3, which is not strong enough. Therefore, after the combined double-layer circuit board A has been used in a vibrating environment for a long time, the first circuit board 1 of the combined double-layer circuit board A will detach from the second circuit board 2, making the entire combined double-layer circuit board A unusable. Therefore, the combined double-layer circuit board A produced by the production method in the workshop has a technical defect of short service life.

[0006] Therefore, there is an urgent need for a production method for anti-detachment composite double-layer circuit boards that can greatly improve the production quality and extend the service life of composite double-layer circuit boards. Summary of the Invention

[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide a production method for an anti-detachment composite double-layer circuit board that greatly improves the production quality of composite double-layer circuit boards and extends their service life.

[0008] The objective of this invention is achieved through the following technical solution: a method for producing an anti-detachment composite double-layer circuit board, comprising the following steps: S1. The worker takes out a first circuit board and uses the milling cutter of the milling machine to mill a ring-shaped groove I on the bottom surface of the first circuit board and along its outer edge. S2. The worker takes out a second circuit board and uses a milling cutter on a milling machine to mill an annular groove II on the top surface of the second circuit board along its outer edge; then, a strip-shaped through groove is milled on the bottom surface of the second circuit board at both its left and right ends, wherein the strip-shaped through groove runs through the front and rear end faces of the second circuit board. S3. The worker takes out a frame-shaped curing adhesive and embeds it into the annular groove II of the second circuit board from top to bottom. At this time, the upper part of the frame-shaped curing adhesive is exposed on the outside of the second circuit board. S4. The worker places the annular groove I of the first circuit board onto the outside of the upper half of the frame-shaped curing adhesive from top to bottom. Then the worker presses the first circuit board down by hand so that the bottom surface of the first circuit board contacts the top surface of the second circuit board, thereby pre-assembling the first circuit board, the second circuit board and the frame-shaped curing adhesive together. S5. The worker takes out a bracket, which includes a top plate and protective plates fixed on the left and right edges of the top plate. A central groove is opened in the top plate, and the horizontal distance between the inner end faces of the two protective plates is equal to the horizontal width of the first circuit board. S6. The worker presses the top plate of the bracket down onto the top surface of the first circuit board. At this time, the two protective plates of the bracket are located on the outside of the second circuit board, and the lower ends of the two protective plates are just exposed below the second circuit board. The worker uses the rollers of the roller press to horizontally roll the exposed parts of the two protective plates so that the exposed parts of the protective plates are close to the bottom surface of the second circuit board, thereby initially fixing the first circuit board and the second circuit board between the top plate of the bracket and the exposed parts. At this time, the two exposed parts are directly below the two strip grooves. S7. The worker uses the rollers of the roller press to press the two exposed parts from bottom to top, so that the exposed parts of the guard plate are tightly attached to the outer wall of the strip groove, thereby fixing the first circuit board and the second circuit board between the top plate of the bracket and the exposed parts. S8. The worker supports the two exposed parts of the bracket on the machine table. S9. The worker controls the hot press head of the press to move downwards. After the hot press head passes through the central groove of the top plate of the support, it presses on the top surface of the first circuit board. At this time, the heat on the hot press head is transferred to the first circuit board, and the first circuit board then transfers the heat to the curing film. When the frame-shaped curing adhesive is heated, it becomes a flowable connecting adhesive layer B. The connecting adhesive layer B bonds and fixes the first circuit board and the second circuit board together. After holding the pressure for a period of time, the first combined double-layer circuit board B can be finally produced. S10. Workers can continuously produce multiple combined double-layer circuit boards B by repeating steps S1 to S9 multiple times.

[0009] The groove depth of the annular groove II in step S2 is equal to the groove depth of the annular groove I.

[0010] In step S5, the two protective plates of the bracket are symmetrical about the top plate.

[0011] In step S4, after the first circuit board, the second circuit board, and the frame-shaped curing adhesive are initially assembled together, the four side faces of the first circuit board are flush with the four end faces of the second circuit board.

[0012] This greatly improves the production quality of combined double-layer circuit boards and extends their service life. Attached Figure Description

[0013] Figure 1 A schematic diagram of the structure of a combined double-layer circuit board A produced in a certain workshop; Figure 2 This is a schematic diagram showing the second circuit board being placed flat on the machine table. Figure 3 This is a schematic diagram showing the curing film being laid flat on the top surface of the second circuit board; Figure 4 This is a schematic diagram showing the first circuit board being placed on the top surface of the cured film. Figure 5 This is a schematic diagram showing how the hot press head is pressed against the top surface of the first circuit board; Figure 6 A schematic diagram of milling an annular groove I on the bottom surface of the first circuit board; Figure 7 for Figure 6 A schematic diagram of direction C; Figure 8 for Figure 6 Main section diagram; Figure 9 A schematic diagram of milling an annular groove II on the top surface of a second circuit board; Figure 10 for Figure 9 Main section diagram; Figure 11 A schematic diagram showing how a strip-shaped through groove is milled on the bottom surface of the second circuit board at both its left and right ends. Figure 12 for Figure 11 Main section diagram; Figure 13 This is a schematic diagram of the frame-shaped curing adhesive; Figure 14 for Figure 13 Main section diagram; Figure 15 This is a schematic diagram showing the frame-shaped adhesive being embedded from top to bottom into the annular groove II of the second circuit board; Figure 16 This is a schematic diagram showing the annular groove I of the first circuit board being fastened from top to bottom onto the outside of the upper half of the frame-shaped curing adhesive. Figure 17 This is a schematic diagram of the support structure; Figure 18 for Figure 17 Main section diagram; Figure 19This is a schematic diagram showing the top plate of the bracket being pressed down onto the top surface of the first circuit board. Figure 20 A schematic diagram showing how to ensure the exposed portion of the protective plate adheres tightly to the bottom surface of the second circuit board; Figure 21 A schematic diagram showing how to ensure the exposed part of the protective plate fits snugly against the outer wall of the strip groove; Figure 22 This is a schematic diagram showing how the two exposed parts of the bracket are supported on the machine table. Figure 23 This is a schematic diagram of a hot press head pressing against the top surface of the first circuit board; Figure 24 This is a schematic diagram of the structure of the combined double-layer circuit board B produced by the present invention; In the picture: 1-First circuit board, 2-Second circuit board, 3-Connecting adhesive layer A, 4-Machinery, 5-Curing film, 6-Hot press head; 7-Annular groove I, 8-Annular groove II, 9-Strip groove, 10-Frame-shaped curing adhesive, 11-Top plate, 12-Guard plate, 13-Central groove, 14-Exposed part, 15-Connecting adhesive layer B. Detailed Implementation

[0014] The present invention will be further described below with reference to the accompanying drawings. The scope of protection of the present invention is not limited to the following description: A method for producing an anti-detachment composite double-layer circuit board includes the following steps: S1. A worker takes out a first circuit board 1 and, using a milling cutter on a milling machine, mills a ring-shaped groove I7 on the bottom surface of the first circuit board 1 along its outer edge, as shown below. Figures 6-8 As shown; S2. The worker takes out a second circuit board 2 and, using a milling cutter on a milling machine, mills a ring-shaped groove II8 on the top surface of the second circuit board 2 and along its outer edge, as shown. Figures 9-10 As shown; then, a strip-shaped through groove 9 is milled on the bottom surface of the second circuit board 2 at both its left and right ends, as shown. Figures 11-12 As shown, the strip groove 9 penetrates the front and rear end faces of the second circuit board 2; the groove depth of the annular groove II8 is equal to the groove depth of the annular groove I7; S3, The worker takes out a... Figures 13-14 The frame-shaped curing adhesive 10 shown is inserted from top to bottom into the annular groove II8 of the second circuit board 2, as shown. Figure 15 As shown, at this time, the upper half of the frame-shaped curing adhesive 10 is exposed outside the second circuit board 2; S4. The worker places the annular groove I7 of the first circuit board 1 onto the outside of the upper half of the frame-shaped curing adhesive 10 from top to bottom, as follows: Figure 16 As shown, the worker then presses the first circuit board 1 down with his hand so that the bottom surface of the first circuit board 1 contacts the top surface of the second circuit board 2, thereby pre-assembling the first circuit board 1, the second circuit board 2 and the frame-shaped curing adhesive 10 together. After the first circuit board 1, the second circuit board 2 and the frame-shaped curing adhesive 10 are preliminarily assembled together, the four side end faces of the first circuit board 1 are flush with the four end faces of the second circuit board 2 respectively. S5, the worker takes out one like... Figures 17-18 The bracket shown includes a top plate 11 and guard plates 12 respectively fixed on the left and right edges of the top plate 11. A central groove 13 is opened in the top plate 11. The horizontal distance between the inner end faces of the two guard plates 12 is equal to the horizontal width of the first circuit board 1. The two guard plates 12 of the bracket are symmetrical about the top plate 11. S6. The worker presses the top plate 11 of the bracket down onto the top surface of the first circuit board 1, as follows: Figure 19 As shown, at this time, the two protective plates 12 of the bracket are respectively located on the outer side of the second circuit board 2, and the lower ends of the two protective plates 12 are just exposed below the second circuit board 2; the worker uses the rollers of the roller press to horizontally roll the exposed parts 14 of the two protective plates 12 so that the exposed parts 14 of the protective plates 12 are pressed tightly against the bottom surface of the second circuit board 2, as shown. Figure 20 As shown, this achieves the initial fixing of the first circuit board 1 and the second circuit board 2 between the top plate 11 of the bracket and the exposed part 14. At this time, the two exposed parts 14 are respectively located directly below the two strip-shaped through slots 9. S7. The worker uses the rollers of the roller press to roll the two exposed parts 14 from bottom to top, so that the exposed parts 14 of the guard plate 12 are tightly attached to the outer wall of the strip groove 9, such as... Figure 21 As shown, this achieves the fixing of the first circuit board 1 and the second circuit board 2 between the top plate 11 of the bracket and the exposed part 14. S8. The worker supports the two exposed parts 14 of the bracket on the table surface of the machine tool 4, as follows: Figure 22 As shown; S9. The worker controls the hot press head 6 of the press to move downwards. After the hot press head 6 passes through the central groove 13 of the top plate 11 of the support, the hot press head 6 presses against the top surface of the first circuit board 1, as shown. Figure 23 As shown, at this time, the heat from the hot press head 6 is transferred to the first circuit board 1, and the first circuit board 1 then transfers the heat to the curing film 5. When the frame-shaped curing adhesive 10 is heated, it becomes a flowable connecting adhesive layer B15. The connecting adhesive layer B15 bonds and fixes the first circuit board 1 and the second circuit board 2 together. After holding the pressure for a period of time, the first combined double-layer circuit board B can be finally produced. The structure of the produced combined double-layer circuit board B is as follows. Figure 24 As shown; In step S9, since the adhesive layer B15 in the produced combined double-layer circuit board B is always confined between the annular groove I7 of the first circuit board 1 and the annular groove II8 of the second circuit board 2, the adhesive layer B15 is not exposed to the air. Therefore, even after the combined double-layer circuit board B has been used for a long period of time, the adhesive layer B15 will not fall off due to aging, thus effectively preventing the first circuit board 1 from falling off the second circuit board 2. It can be seen that this production method, compared to in-workshop methods, is significantly more efficient. Figures 1-5 The production method shown greatly improves the production quality of combined double-layer circuit boards.

[0015] S10. Workers can continuously produce multiple combined double-layer circuit boards B by repeating steps S1 to S9 multiple times.

[0016] Furthermore, in step S7, since the first circuit board 1 and the second circuit board 2 are fixed between the top plate 11 and the exposed portion 14 of the bracket, and in step S9, the connecting adhesive layer B15 further bonds the first circuit board 1 and the second circuit board 2 together, the first circuit board 1 and the second circuit board 2 are tightly fixed together under the combined force of the two forces. Therefore, it can be seen that even after the combined double-layer circuit board B has been used for a long time in a vibrating environment, the first circuit board 1 of the combined double-layer circuit board B will not detach from the second circuit board 2, resulting in a longer service life compared to the combined double-layer circuit board A produced in the workshop.

Claims

1. A method for producing an anti-detachment composite double-layer circuit board, characterized in that: It includes the following steps: S1. The worker takes out a first circuit board (1) and mills an annular groove I (7) on the bottom surface of the first circuit board (1) and along its outer edge using the milling cutter of the milling machine. S2. The worker takes out a second circuit board (2) and uses the milling cutter of the milling machine to mill a ring groove II (8) on the top surface of the second circuit board (2) and along its outer edge; then a strip-shaped through groove (9) is milled on the bottom surface of the second circuit board (2) and at its left and right ends, wherein the strip-shaped through groove (9) penetrates the front and rear end faces of the second circuit board (2). S3. The worker takes out a frame-shaped curing adhesive (10) and embeds the frame-shaped curing adhesive (10) into the annular groove II (8) of the second circuit board (2) from top to bottom. At this time, the upper part of the frame-shaped curing adhesive (10) is exposed outside the second circuit board (2). S4. The worker places the annular groove I (7) of the first circuit board (1) on the outside of the upper half of the frame-shaped curing adhesive (10) from top to bottom. Then the worker presses the first circuit board (1) down with his hand so that the bottom surface of the first circuit board (1) contacts the top surface of the second circuit board (2), thereby pre-assembling the first circuit board (1), the second circuit board (2) and the frame-shaped curing adhesive (10) together. S5. The worker takes out a bracket, which includes a top plate (11) and guard plates (12) fixed on the left and right edges of the top plate (11). A central groove (13) is opened in the top plate (11). The horizontal distance between the inner end faces of the two guard plates (12) is equal to the horizontal width of the first circuit board (1). S6. The worker presses the top plate (11) of the bracket down onto the top surface of the first circuit board (1). At this time, the two guard plates (12) of the bracket are located on the outside of the second circuit board (2), and the lower ends of the two guard plates (12) are just exposed below the second circuit board (2). The worker uses the roller of the roller press to perform horizontal roller pressing on the exposed part (14) of the two guard plates (12) so that the exposed part (14) of the guard plates (12) is close to the bottom surface of the second circuit board (2), thereby initially fixing the first circuit board (1) and the second circuit board (2) between the top plate (11) and the exposed part (14) of the bracket. At this time, the two exposed parts (14) are located directly below the two strip grooves (9). S7. The worker uses the roller of the roller press to press the two exposed parts (14) from bottom to top, so that the exposed part (14) of the guard plate (12) is tightly attached to the outer wall of the strip groove (9), thereby fixing the first circuit board (1) and the second circuit board (2) between the top plate (11) of the bracket and the exposed part (14). S8. The worker supports the two exposed parts (14) of the bracket on the table of the machine tool (4); S9. The worker controls the hot press head (6) of the press machine to move downward. When the hot press head (6) passes through the central groove (13) of the top plate (11) of the support, the hot press head (6) presses on the top surface of the first circuit board (1). At this time, the heat on the hot press head (6) is transferred to the first circuit board (1), and the first circuit board (1) then transfers the heat to the curing film (5). When the frame-shaped curing adhesive (10) is heated, it becomes a flowable connecting adhesive layer B (15). The connecting adhesive layer B (15) bonds and fixes the first circuit board (1) and the second circuit board (2) together. After holding the pressure for a period of time, the first combined double-layer circuit board B can be finally produced. S10. Workers can continuously produce multiple combined double-layer circuit boards B by repeating steps S1 to S9 multiple times.

2. The method for producing an anti-detachment combined double-layer circuit board according to claim 1, characterized in that: The groove depth of the annular groove II (8) in step S2 is equal to the groove depth of the annular groove I (7).

3. The method for producing an anti-detachment combined double-layer circuit board according to claim 1, characterized in that: The two guard plates (12) of the bracket in step S5 are symmetrical about the top plate (11).

4. The method for producing an anti-detachment combined double-layer circuit board according to claim 1, characterized in that: In step S4, after the first circuit board (1), the second circuit board (2) and the frame-shaped curing adhesive (10) are initially assembled together, the four side faces of the first circuit board (1) are flush with the four end faces of the second circuit board (2).

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